JP3445697B2 - Electronic components - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, especially an aluminum electrolytic capacitor, having a terminal which comes into contact with a conductor on a surface of a printed circuit board when mounted on the printed circuit board.

[0002]

There is a chip type capacitor as a type of capacitor which is mounted on a printed circuit board and soldered, and it has plate-shaped terminals provided at both ends of the lower surface of the main body. . In recent years, a cylindrical aluminum electrolytic capacitor having a lead wire has been mounted on a substrate by a method similar to that of a chip type capacitor.
No. 211214 discloses an aluminum electrolytic capacitor as shown in FIGS. 7 and 8.

7 and 8, a capacitor element 1 in which an electrode foil and a separator are wound and impregnated with an electrolytic solution
Are housed in a cylindrical aluminum case 2, and the aluminum case 2 is sealed by an elastic sealing body 3. The electrode leads 4 and 4 extending from the element 1 penetrate the elastic sealing body 3 in an airtight manner and lead to the outside. Has been done. Reference numeral 5 is an annular groove formed in the aluminum case 2 to which the sealing body 3 is tightened in order to enhance airtightness.

An insulating plate 6 is brought into contact with the end surface 9 of the capacitor in order to facilitate mounting on a substrate. The insulating plate 6 has small holes 7, 7 and recessed grooves 8, 8 extending from this to the outer peripheral direction of the insulating plate 6, and the lead wire 4 connected to the electrode leads 4, 4.
The holes a and 4a are inserted into the small holes 7 and 7 and are bent and placed in the grooves 8 and 8 to hold the insulating plate 6.

In the above-mentioned capacitor, the lead wires 4a, 4
Even if "a" is bent so as to be in close contact with the bottoms of the recessed grooves 8,8, it slightly returns due to elasticity, so that the tips of the lead wires 4a, 4a rise and protrude from the surface of the insulating plate 6 to stabilize the mounting. Impair sex. Further, when bent, a force may be applied to the electrode leads 4 and 4 in the direction of pulling them out of the element 1, which may damage the capacitors. To prevent such damage,
There may be a case where a notch is provided at a position where the lead wires 4a, 4a are to be bent, but this significantly weakens the strength of the lead wires 4a, 4a, which causes breakage due to vibration during use.
The present invention intends to solve these problems all at once.

[0006]

A main body of an electronic component according to the present invention has an aluminum case, one end surface of which is sealed by a sealing body, and a plurality of lead wires are led out through the sealing body. . The sealing body is composed of an elastic body located on the inner surface side of the case and a non-elastic body located on the outer surface side of the case. An insulating plate having a protrusion extending into the elastic body through a through hole formed in the non-elastic body is in contact with the end face, and the insulating plate has a groove shape for accommodating the bent lead wire. With windows or slits. The lead wire is bent in the window or slit, and the outer surface of the lead wire is substantially flush with the outer surface of the insulating plate.

In the above-mentioned electronic component, each lead wire is clamped and bent by a tool having a predetermined thickness and one surface of which is in contact with the end face of the electronic component body. Then, the insulating plate is brought into contact with and fixed to the end face, and the bent lead wire is placed in a window or slit provided in the insulating plate. Will be located substantially flush with the outer surface of the.

Therefore, since each lead wire is bent while being clamped by a tool, no force in the direction of pulling out the lead wire from the element is generated and the lead wire is bent at a predetermined position without a cut or the like. The bent portion can be located flush with the outer surface of the insulating plate. In addition, since the insulating plate is supported not by the lead wires but by the electronic component body, when connecting it to the substrate, even if vibration or shock is applied, the effect is not transmitted to the lead wires, so high vibration resistance, Impact resistance can be obtained.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION The lead wire led out from the electronic component body may have a circular cross section or may be flatly crushed. The window or slit of the insulating plate is selected to have a width that allows the lead wires to pass therethrough in accordance with the cross-sectional shape of these lead wires. The length of each lead wire may be longer than the length of the slit.

As a method of fixing the insulating plate to the electronic component body, a method of inserting a projection extending from the insulating plate into a hole formed in the non-elastic body portion of the sealing body and engaging the back surface thereof, Appropriate methods can be adopted, such as a method in which a protrusion extending from the insulating plate is connected to the elastic body portion through a hole formed in the non-elastic body portion.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In FIG. 1, a capacitor element 1 is housed in a cylindrical aluminum case 2 and is sealed by a sealing body 13 composed of an elastic body portion 11 and a non-elastic body portion 12.
The lead wires 14, 14 extending further penetrate the sealing body 13 in an airtight manner to form the capacitor body 10. Lead wires 14, 14 extending from the end surface 15 of the capacitor body 10.
2 is sandwiched between the tools 16 and 17 whose one surface is in contact with the end surface 15 of the capacitor body as shown in FIG.
Is folded in the direction until it abuts the tool 17. Tool 16,
The thickness of the sandwiching portion 17 is g, and the tool 17 placed on the peripheral side of the end face 15 becomes slightly thinner toward the peripheral direction of the end face 15. When this processing is finished, the lead wires 14 and 14 are slightly returned due to the elastic force, and the intervals between the respective lead wire portions and the end surface 15 become equal to g. Note that d is the diameter of the lead wires 14, 14.

Next, the insulating plate 30 shown in FIG. 3 is attached to the end surface 15 of the capacitor body 10. The insulating plate 30 is made of an elastic body that can be compressed and deformed, and has a thickness corresponding to the sum of the gap width g between the lead wire 14 and the end surface 15 and the lead wire diameter d. And the width thereof is appropriately wider than the lead wire diameter d. In the center of the upper surface of the insulating plate 30, a projection 34 composed of an enormous head 32 and a neck 33 slightly narrower than the head 34 is projected, and the length of the neck 33 is the same as that of the non-elastic body 12 of the sealing body 13. It is almost equal to the thickness.

At the center of the end surface 15 side of the sealing body 13,
A hole 35 is formed over both the elastic body portion 11 and the non-elastic body portion 12, and the width of the hole 35 in the non-elastic body portion 12 is equal to the width of the neck portion 33 of the protrusion 34. Therefore, when pushing the protrusion 34 into the hole 35, the protrusion head 32
Swells in the hole 35, catches on the back surface of the non-elastic body 12, and does not come out unintentionally. Therefore, the insulating plate 30 is held in contact with the end face 15 of the capacitor body 10, and the lead wires 14 and 14 are slit 3 as shown in FIG.
It is located on the same plane as the lower surface of the insulating plate 30, that is, the outer surface, within the first and the third parts.

In the embodiment shown in FIG. 4, a protrusion 43 having a hook 42 on one side of a head 41 is provided at the center of the upper surface of an insulating plate 40 made of an inelastic material, and the elastic material portion 1 of the sealing body 13 is provided.
1 and the non-elastic body portion 12 have slightly eccentric holes 44, 4
5 is drilled. As a result, the protrusion 43 is replaced with the holes 44,
5, when one side of the hole wall of the elastic body hole 44 is compressed by the projection head portion 41 and is completely pressed, the projection head is restored by the restoring force of the elastic body portion 11 as shown in FIG. The part 41 moves laterally and the hook 42 catches on the back surface of the inelastic body 12 to couple the insulating plate 40 to the capacitor body 10.

In the embodiment shown in FIG. 5, the non-elastic insulating plate 5 is used.
An enlarged head portion 51 and a protrusion 53 having a narrow neck portion 52 are thereby provided in the center of 0, and a cut groove 5 is formed in the center thereof.
4 are formed. Holes 55 and 56 are coaxially formed in the elastic body portion 11 and the non-elastic body portion 12 of the sealing body 13, and the width of the hole 56 of the non-elastic body portion 12 is the protrusion head 5
Narrower than 1 width. Therefore, when the protrusion 53 is pushed into the holes 55 and 56, the protrusion 53 passes through the hole 56 while being deformed by the cut groove 54, and when the pushing is completed, the protrusion head 51 is snapped as shown in FIG. The insulating plate 50 is hooked on the back surface of the non-elastic body 12 and is coupled to the capacitor body 10.

In the embodiment shown in FIG. 6, a spike-like projection 61 is provided at the center of an inelastic insulating plate 60,
On the peripheral surface of the tip portion, minute irregularities 62 having a sawtooth cross section are formed.
Are formed. Hole 63 drilled on the sealing body 13 side
Has a width that allows the tip portion of the protrusion 61 to pass through in the non-elastic body portion 12, and is slightly narrower than the tip portion of the protrusion 61 in the elastic body portion 11. Therefore, when the protrusion 61 is pushed into the hole 63, the unevenness 62 at the tip portion thereof digs into the elastic body of the hole wall to couple the insulating plate 60 to the capacitor body 10.

In the above-mentioned embodiments, the protrusion of the insulating plate is shown in FIG.
The elongated shape has been described as shown in (a), but the shape and the number of installations are arbitrary.

[0018]

As described above, according to the present invention, since the lead wire can be surely bent into a predetermined shape, the lead wire does not protrude from the surface of the insulating plate, and the lead wire is undesired during bending. There is no possibility of causing stress to damage the capacitor, and since it is not necessary to provide a notch for facilitating bending of the lead wire, the effect of not lowering the strength of the lead wire can be achieved at the same time.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of an embodiment of the present invention.

FIG. 2 is an explanatory diagram of a lead wire bending unit in the above embodiment.

3A and 3B show an insulating plate used in the above embodiment, FIG. 3A being a plan view and FIG. 3B being a front view.

FIG. 4 is a vertical cross-sectional view of a joined portion of a sealing body and an insulating plate according to another embodiment of the present invention, (a) showing a state before joining and (b) showing a state after joining.

5A and 5B are cross-sectional views of a joined portion of a sealing body and an insulating plate according to another embodiment of the present invention, FIG. 5A showing a state before joining and FIG. 5B showing a state after joining.

FIG. 6 is a vertical cross-sectional view of a connecting portion between a sealing body and an insulating plate according to another embodiment of the present invention.

FIG. 7 is a vertical sectional view showing an example of a conventional cylindrical aluminum electrolytic capacitor.

FIG. 8 is a bottom view of the above conventional example.

[Explanation of symbols]

1 Capacitor element 2 Aluminum case 10 Capacitor body 11 Elastic part of sealing body 12 Non-elastic body part of sealing body 13 Sealed body 14 lead wire 15 Capacitor body end face 30 insulating plate 31 slits 32 protrusion head 33 Projection neck 34 Protrusion 35 holes 40 insulating plate 41 Protrusion head 42 hook 43 protrusions 44, 45 holes 50 insulating plate 51 protrusion head 52 Projection neck 53 protrusions 54 Cutting 55, 56 holes

─────────────────────────────────────────────────── ─── Continuation of the front page (56) References Japanese Patent Laid-Open No. 3-225912 (JP, A) Actual Development No. 1-107123 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01G 9/10 H01G 9/008 H01G 2/06 H05K 1/18

Claims (5)

(57) [Claims] 1. An aluminum case accommodating an electronic component element is sealed with a sealing body inserted into an opening end of the aluminum case, and a plurality of lead wires extending from the element are led to the outside by hermetically penetrating the sealing body. Then, an insulating plate having a slit or groove-shaped through hole extending from the lead-out position of the lead wire toward the periphery of the sealing body is brought into contact with the sealing end face, and the lead wires are folded in the slit or through hole. Bending and arranging along the outer surface of the insulating plate, the sealing body is composed of a portion made of a non-elastic body exposed to the outside and a portion made of an elastic body laminated inward, An electronic component in which a protrusion protruding from a plate is extended into the elastic body portion through a through hole formed in the non-elastic body portion of the sealing body. 2. The projection is integrally formed with the insulating plate by an elastic body having appropriate elasticity, and has a head portion having a size larger than a through hole of a non-elastic body portion of the sealing body. The electronic component according to claim 1, wherein: 3. The projection is integrally formed with the insulating plate by a non-elastic body and has a neck and a head having a hook portion on one side, and the elastic body portion of the sealing body is the non-elastic body. The protrusion has a continuous hole eccentrically with respect to the through hole, and the head portion of the protrusion has a direction in which the hook portion is caught on the back surface of the non-elastic body portion by the restoring force in the hole of the elastic body portion. The electronic component according to claim 1, wherein the electronic component is pressed against. 4. The protrusion is integrally formed with the insulating plate by a non-elastic body, has a neck and a head having hooks projecting to both sides, and is cut in the center from the head to the neck. The electronic component according to claim 1, wherein a groove is formed, and the width of the head is larger than the width of the through hole of the non-elastic body portion of the sealing body. 5. The electronic component according to claim 1, wherein a tip portion of the projection, which is located in the elastic body portion of the sealing body, has a minute projection on the surface that bites into the surrounding elastic body. .