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JP3446288B2 - Ultrasonic method for detecting defects inside metal sheets - Google Patents
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JP3446288B2 - Ultrasonic method for detecting defects inside metal sheets - Google Patents

Ultrasonic method for detecting defects inside metal sheets

Info

Publication number
JP3446288B2
JP3446288B2 JP05009694A JP5009694A JP3446288B2 JP 3446288 B2 JP3446288 B2 JP 3446288B2 JP 05009694 A JP05009694 A JP 05009694A JP 5009694 A JP5009694 A JP 5009694A JP 3446288 B2 JP3446288 B2 JP 3446288B2
Authority
JP
Japan
Prior art keywords
signal
ultrasonic
defect
transmitted
ultrasonic wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP05009694A
Other languages
Japanese (ja)
Other versions
JPH07260748A (en
Inventor
一 高田
文彦 市川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JFE Steel Corp
Original Assignee
JFE Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JFE Steel Corp filed Critical JFE Steel Corp
Priority to JP05009694A priority Critical patent/JP3446288B2/en
Publication of JPH07260748A publication Critical patent/JPH07260748A/en
Application granted granted Critical
Publication of JP3446288B2 publication Critical patent/JP3446288B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04Analysing solids
    • G01N29/11Analysing solids by measuring attenuation of acoustic waves
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/02Indexing codes associated with the analysed material
    • G01N2291/023Solids
    • G01N2291/0234Metals, e.g. steel
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/04Wave modes and trajectories
    • G01N2291/042Wave modes
    • G01N2291/0427Flexural waves, plate waves, e.g. Lamb waves, tuning fork, cantilever
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/04Wave modes and trajectories
    • G01N2291/048Transmission, i.e. analysed material between transmitter and receiver

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、超音波による金属薄板
の内部欠陥の検出方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for detecting internal defects in a thin metal plate by ultrasonic waves.

【0002】[0002]

【従来の技術】通常、金属薄板の内部のきずなどの欠陥
の検出には、超音波探傷法を用いることが最も適してい
る。これは、材料内部に超音波を伝播させ、きずによる
超音波伝播の乱れを検出するものであり、たとえば図6
に示すように、超音波の送信子11と受信子12を金属薄板
1を挟んで対向配置し、送信子11から受信子12に向けて
超音波51を垂直に送信し、この超音波51が金属薄板1内
部の欠陥によって反射および散乱されて生ずる透過超音
波52の弱まりを検出する方法(以下、透過型超音波探傷
法という)である。なお、送信子11と金属薄板1との間
および金属薄板1と受信子12との間には水2を介在させ
ている。
2. Description of the Related Art Generally, the ultrasonic flaw detection method is most suitable for detecting defects such as flaws inside a thin metal plate. In this method, ultrasonic waves are propagated inside the material and disturbances in ultrasonic wave propagation due to flaws are detected. For example, FIG.
As shown in, the ultrasonic transmitter 11 and the ultrasonic receiver 12 are arranged so as to face each other with the metal thin plate 1 interposed therebetween, and the ultrasonic wave 51 is vertically transmitted from the transmitter 11 to the receiver 12, and the ultrasonic wave 51 is transmitted. This is a method of detecting weakening of transmitted ultrasonic waves 52 that is caused by reflection and scattering due to defects inside the thin metal plate 1 (hereinafter referred to as a transmission type ultrasonic flaw detection method). Water 2 is interposed between the transmitter 11 and the metal thin plate 1 and between the metal thin plate 1 and the receiver 12.

【0003】また、他の方法としては、図7に示すよう
に、超音波の送受信を兼用した送受信子13から超音波51
を金属薄板1に向けて垂直に送信し、金属薄板1の底面
にて反射した底面反射超音波53を受信し、この底面反射
超音波53の欠陥による弱まりを検出して、きずを検出す
る方法(以下、底面エコーロス型超音波探傷法という)
がある(たとえば、入江ら著「超音波集束探触子法によ
る微細介在物の連続検査基礎実験(CAMP-ISIJ Vol.2,(1
989)-1452)」参照)。
As another method, as shown in FIG. 7, an ultrasonic wave 51 is transmitted from a transmitter / receiver 13 which also serves to transmit and receive ultrasonic waves.
Is transmitted vertically to the metal thin plate 1, the bottom surface reflected ultrasonic wave 53 reflected by the bottom surface of the metal thin plate 1 is received, and weakness due to a defect of the bottom surface reflected ultrasonic wave 53 is detected to detect a flaw. (Hereinafter referred to as bottom surface echo loss type ultrasonic flaw detection method)
(For example, Irie et al. “Basic Experiment for Continuous Inspection of Fine Inclusions by Ultrasonic Focusing Probe Method (CAMP-ISIJ Vol.2, (1
989) -1452) ").

【0004】さらに、この反射型超音波法の応用例とし
て、図8に示すように、送信子11と受信子12を金属薄板
1に対して同一の面側に配置し、送信子11から所定の傾
斜角度θで送信した超音波51が金属薄板1の底面で反射
し、この底面反射超音波53を受信子12により受信するよ
うにし、金属薄板1内部の欠陥によって反射および散乱
されて生ずる底面反射超音波53の弱まりを検出する方法
(以下、V透過型超音波探傷法という)がある。
Further, as an application example of this reflection type ultrasonic method, as shown in FIG. 8, a transmitter 11 and a receiver 12 are arranged on the same surface side with respect to the thin metal plate 1, and the transmitter 11 is predetermined. The ultrasonic wave 51 transmitted at the inclination angle θ of is reflected by the bottom surface of the metal thin plate 1, and the bottom surface reflected ultrasonic wave 53 is received by the receiver 12, and the bottom surface is generated by being reflected and scattered by the defect inside the metal thin plate 1. There is a method of detecting weakening of the reflected ultrasonic wave 53 (hereinafter referred to as a V transmission type ultrasonic flaw detection method).

【0005】[0005]

【発明が解決しようとする課題】しかしながら、上記し
た従来の超音波探傷法ではいずれも、超音波ビームの径
の大きさによってその検出能が決まるから、欠陥の大き
さが超音波ビーム径よりも小さくなると、極端に検出能
が低下するという欠点がある。すなわち、いま、送信子
11として、周波数25MHz 、振動子径6mm、水中焦点距離
24mmの超音波探触子を用いたとすると、金属薄板1が鋼
板の場合は、鋼板中での超音波ビーム径は約1mmとなっ
て、これより大きな欠陥に対しては十分な検出能が得ら
れるが、たとえば径0.5 mmの欠陥の場合はこの欠陥が超
音波をまったく透過しないと仮定したとしても、この欠
陥による透過超音波の振幅の落ち込みは約2.5dB と小さ
くなってしまうのである。
However, in any of the above-mentioned conventional ultrasonic flaw detection methods, the detectability is determined by the size of the ultrasonic beam diameter, so that the defect size is smaller than the ultrasonic beam diameter. When it becomes smaller, there is a drawback that the detectability is extremely lowered. That is, now the sender
11, frequency 25MHz, transducer diameter 6mm, underwater focal length
If a 24 mm ultrasonic probe is used, if the thin metal plate 1 is a steel plate, the ultrasonic beam diameter in the steel plate is about 1 mm, and sufficient detectability is obtained for defects larger than this. However, for example, in the case of a defect with a diameter of 0.5 mm, even if it is assumed that this defect does not transmit ultrasonic waves at all, the drop in the amplitude of transmitted ultrasonic waves due to this defect will be as small as about 2.5 dB.

【0006】本発明は、上記した従来技術の有する課題
を解消すべくなされたもので、小さな欠陥の検出能を高
めた超音波による金属薄板内部欠陥検出方法を提供する
ことを目的とする。
The present invention has been made to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide a method for detecting defects inside a metal thin plate by ultrasonic waves, which enhances the detectability of small defects.

【0007】[0007]

【課題を解決するための手段】本発明は、超音波を用い
て金属薄板の内部欠陥を検出する方法において、金属薄
板に対して超音波を送受信し、受信超音波を超音波送信
時点から所定時間 D1 の経過後に所定の時間 M1 開く第
1のゲート手段により抽出し、抽出された超音波の振幅
が所定のレベル 1 を下回るときは欠陥があると判定
し、前記第1のゲート手段により抽出された超音波の振
幅が所定のレベル 1 を超えたと判定したときには、1
次判定信号を発生するようにし、該1次判定信号の発生
から所定時間 D2 の経過後に所定の時間 M2 開く第2の
ゲート手段により超音波の一部の信号を抽出し、前記の
抽出された信号の振幅が所定のレベル 2 を下回るとき
は欠陥があると判定することを特徴とする超音波による
金属薄板内部欠陥検出方法である。
The present invention is a method for detecting an internal defect in a thin metal plate using ultrasonic waves, in which ultrasonic waves are transmitted to and received from the thin metal plate, and the received ultrasonic waves are transmitted at a predetermined time from the time of ultrasonic wave transmission. Extraction is performed by the first gate means that opens for a predetermined time t M1 after the time t D1 , and it is determined that there is a defect when the amplitude of the extracted ultrasonic wave is below a predetermined level L 1 , and the first gate is used. When it is determined that the amplitude of the ultrasonic wave extracted by the means exceeds a predetermined level L 1 , 1
A second gate signal is generated by the second gate means for generating the next determination signal, and opening the predetermined time t M2 after the predetermined time t D2 has elapsed from the generation of the primary determination signal .
A method of detecting defects inside a metal thin plate by ultrasonic waves, characterized in that it is judged that there is a defect when the amplitude of the extracted signal is below a predetermined level L 2 .

【0008】[0008]

【作 用】本発明者らは、上記課題を解消すべく鋭意実
験・研究を行ったところ、下記のような知見を得たの
で、それに基づいて本発明を完成させるにいたったもの
である。すなわち、図9は、前記した透過型超音波探傷
法、底面エコーロス型超音波探傷法またはV透過型超音
波探傷法を用いて金属薄板を探傷したときの透過超音波
または底面反射超音波の信号波形を示したもので、(a)
は欠陥の無い部分の波形を、また(b) は超音波ビーム径
よりも小さい欠陥のある部分の波形をそれぞれ示したも
のである。
[Operation] The inventors of the present invention have conducted the following experiments and researches to solve the above-mentioned problems, and have obtained the following findings, and have completed the present invention based on the findings. That is, FIG. 9 shows signals of transmitted ultrasonic waves or bottom surface reflected ultrasonic waves when a thin metal plate is flaw-detected by the above-mentioned transmission type ultrasonic flaw detection method, bottom echo loss type ultrasonic flaw detection method or V transmission type ultrasonic flaw detection method. The waveform is shown in (a)
Shows the waveform of the defect-free portion, and (b) shows the waveform of the defective portion smaller than the ultrasonic beam diameter.

【0009】両者を比較観察した結果、欠陥の面積
(S)が超音波ビーム径(d)よりも小さいものである
場合は、透過超音波または底面反射超音波の波形は、そ
の立ち上がりから時間t1 の経過までは、その振幅がS
/dの分、すなわちA%だけ低下する。ところが、時間
1 の経過後においては振幅の低下の幅B%はA%より
も大きくなり、場合によってはAの大きさの約3倍にも
達することがわかった。
As a result of comparing and observing the two, when the area (S) of the defect is smaller than the ultrasonic beam diameter (d), the waveform of the transmitted ultrasonic wave or the bottom surface reflected ultrasonic wave starts from its rising time t. Until the passage of 1 , its amplitude is S
/ D, that is, by A%. However, it was found that the width B% of the decrease in amplitude becomes larger than A% after the lapse of time t 1 , and reaches about 3 times the size of A in some cases.

【0010】これは、欠陥によって遮られなかった透過
超音波または底面反射超音波に、欠陥の端を回り込んだ
透過超音波あるいは底面反射超音波が重なり、両者の位
相が異なるために振幅の打ち消し合いが発生するためで
あると考えられる。したがって、時間t1 の経過以降の
みの透過超音波あるいは底面反射超音波の振幅の大きさ
を検出して、無欠陥のときの振幅の大きさと比較するこ
とによって、そのレベルが低いときは“欠陥あり”と判
定することができるから、超音波ビーム径よりも小さい
欠陥の検出能を高めることが可能となる。
This is because the transmitted ultrasonic wave or bottom surface reflected ultrasonic wave which is not blocked by the defect is overlapped with the transmitted ultrasonic wave or the bottom surface reflected ultrasonic wave which wraps around the edge of the defect, and the phases of the two are different, so that the amplitude is canceled. It is considered that this is due to the occurrence of a match. Therefore, by detecting the amplitude of the transmitted ultrasonic wave or the bottom surface reflected ultrasonic wave only after the lapse of time t 1 and comparing the amplitude with the amplitude of the defect-free ultrasonic wave, when the level is low, “defect” is detected. Since it can be determined that there is a defect, the detectability of a defect smaller than the ultrasonic beam diameter can be enhanced.

【0011】[0011]

【実施例】以下に、本発明の実施例について図面を用い
て詳細に説明する。図1は、本発明法を透過超音波探傷
装置に適用した場合の実施例を示すブロック図である。
なお、図中、従来例と同一要素は同一符号を付して説明
を省略する。
Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a block diagram showing an embodiment in which the method of the present invention is applied to a transmission ultrasonic flaw detector.
In the figure, the same elements as those of the conventional example are designated by the same reference numerals and the description thereof will be omitted.

【0012】図に示すように、送信子11と受信子12とは
金属薄板1を挟んで対向して配置される。送信子11の超
音波振動子(図示せず)には電気パルス送信器14によっ
て電気パルスが印加され、超音波51が送信される。一
方、受信子12で受信された透過超音波52は受信増幅器15
で増幅され、欠陥判定装置20に出力される。なお、16は
超音波51を周期的に送受信するための同期パルス60を発
生する同期信号発生器で、同期パルス60を電気パルス送
信器14および欠陥判定装置20に出力する。
As shown in the figure, the transmitter 11 and the receiver 12 are arranged so as to face each other with the metal thin plate 1 interposed therebetween. An electric pulse is applied by an electric pulse transmitter 14 to an ultrasonic transducer (not shown) of the transmitter 11, and an ultrasonic wave 51 is transmitted. On the other hand, the transmitted ultrasonic wave 52 received by the receiver 12 is received by the receiving amplifier 15.
Is amplified by and output to the defect determination device 20. Reference numeral 16 is a synchronization signal generator that generates a synchronization pulse 60 for periodically transmitting and receiving the ultrasonic waves 51, and outputs the synchronization pulse 60 to the electric pulse transmitter 14 and the defect determination device 20.

【0013】ここで、欠陥判定装置20の構成について図
2を用いて詳しく説明する。この欠陥判定装置20は図示
のように、受信増幅器15から出力される透過超音波52の
1次信号61のみを通過させる第1のゲート回路21、この
第1のゲート回路21により抽出された透過超音波52の1
次信号61の振幅を所定のレベル 1 と比較して判定する
第1のレベル判定器22、第1のレベル判定器22からの1
次判定信号62を受けて第1のゲート回路21により抽出さ
れた透過超音波52の1次信号61の一部である2次信号63
を通過させる第2のゲート回路23、第2のゲート回路23
から出力される透過超音波52の2次信号63の振幅を所定
のレベル 2 と比較し判定する第2のレベル判定器24、
第1のレベル判定器22および第2のレベル判定器24の出
力のAND信号65をつくる第1のAND回路25、第1の
AND回路25の出力パルスから遅延信号66をつくる遅延
パルス発生回路26、遅延パルス発生回路26の出力を反転
させるインバータ27、インバータ27から出力される反転
信号67と同期信号60のANDによって形成される欠陥検
出信号68をつくる第2のAND回路28、とからなる。
Here, the structure of the defect determining device 20 will be described in detail with reference to FIG. As shown in the figure, the defect determining device 20 includes a first gate circuit 21 that passes only the primary signal 61 of the transmitted ultrasonic wave 52 output from the reception amplifier 15, and the transmission extracted by the first gate circuit 21. Ultrasonic 52 of 1
The first level discriminator 22 for judging by comparing the amplitude of the next signal 61 with a predetermined level L 1 and 1 from the first level discriminator 22
A secondary signal 63 which is a part of the primary signal 61 of the transmitted ultrasonic wave 52 extracted by the first gate circuit 21 in response to the next determination signal 62.
Second gate circuit 23 for passing through the second gate circuit 23
A second level determiner 24 that compares the amplitude of the secondary signal 63 of the transmitted ultrasonic wave 52 from a predetermined level L 2 to make a determination;
A first AND circuit 25 that produces an AND signal 65 of the outputs of the first level determiner 22 and the second level determiner 24, and a delay pulse generation circuit 26 that produces a delay signal 66 from the output pulses of the first AND circuit 25. An inverter 27 that inverts the output of the delay pulse generation circuit 26, and a second AND circuit 28 that produces a defect detection signal 68 formed by ANDing the inversion signal 67 output from the inverter 27 and the synchronization signal 60.

【0014】以下、図3および図4,図5のタイムチャ
ートをもとにして、本発明の透過超音波探傷装置の動作
について説明する。なお、図3は欠陥のない場合、図4
は超音波ビームの径よりも小さい欠陥がある場合、図5
は超音波ビームの径よりも大きい欠陥がある場合を示し
ている。また、いずれの場合においても直前の超音波送
受信では欠陥がなかったものとする。 (1) 電気パルス送信器14は、同期信号発生器16からの周
期的な同期パルス60を受けてパルス状の高圧電気信号を
送信子11に出力する。 (2) 送信子11は、その内蔵された超音波振動子に高圧電
気信号が印加されると、被検査材である金属薄板1に超
音波51を送信する。 (3) 金属薄板1を透過した透過超音波52は受信子12に受
信され、受信増幅器15によって適当に増幅されて第1の
ゲート回路21に出力される。 (4) 動作タイミングがコントロールされる第1のゲート
回路21は受信増幅器15から出力される透過超音波52を、
同期信号発生器16からの同期パルス60を受けてから、所
定時間tD1の経過後の所定の時間tM1だけ通過させて、
透過超音波52の1次信号61のみを抽出する。 (5) 第1のレベル判定器22は、入力された透過超音波52
の1次信号61があらかじめ設定された所定のレベルL1
を超えたと判定したとき、1次判定信号62を出力する。
この判定信号62は、欠陥なしの場合(図3)および超音
波ビーム径よりも小さい場合(図4)に部分的にハイレ
ベルHLとなり、超音波ビーム径よりも大きな欠陥の場
合(図5)にはローレベルLLのままである。 (6) 第1のゲート回路21により抽出された透過超音波52
の1次信号61は第2のゲート回路23にも導入され、第2
のゲート回路23は1次判定信号62を受けてから、所定時
間tD2後の所定の時間tM2、第1のゲート回路21により
抽出された透過超音波52の1次信号61を通過させて、こ
の透過超音波52の1次信号61のうち小さい欠陥による振
幅の変化の大きな部分の2次信号63のみを抽出する。 (7) 第2のレベル判定器24は、抽出された2次信号63の
振幅が所定のレベルL2を超えたと判定したとき、2次
判定信号64を出力する。この2次判定信号64は、欠陥な
しの場合は部分的にハイレベルHLとなる信号であり、
その他の場合、すなわち欠陥ありの場合はローレベルL
Lの状態である。 (8) 1次判定信号62および2次判定信号64は第1のAN
D回路25に入力され、両信号のAND信号65がつくられ
る。このAND信号65は、欠陥なしの場合のみハイレベ
ルHLとなるパルス信号である。 (9) AND信号65は遅延パルス発生回路26に導かれ、単
安定マルチバイブレータなどを用いて遅延信号66がつく
られる。この遅延信号66が実際にパルス信号となるのは
欠陥なしの場合のみであり、欠陥がある場合にはローレ
ベルLLの状態である。 (10)遅延信号66はさらにインバータ27により反転され、
この反転信号67はつぎの第2のAND回路28において同
期信号発生器16からの同期パルス60とANDがとられ
る。そして欠陥がある場合のみ、この反転信号67が同期
パルス60と同じタイミングでハイレベルHLとなる欠陥
検出信号68として出力される。
The operation of the transmission ultrasonic flaw detector of the present invention will be described below with reference to the time charts of FIGS. 3 and 4 and 5. Note that FIG. 3 shows the case of FIG.
If there is a defect smaller than the diameter of the ultrasonic beam,
Shows the case where there is a defect larger than the diameter of the ultrasonic beam. In any case, it is assumed that there was no defect in the immediately preceding ultrasonic wave transmission / reception. (1) The electric pulse transmitter 14 receives the periodic synchronizing pulse 60 from the synchronizing signal generator 16 and outputs a pulsed high voltage electric signal to the transmitter 11. (2) When a high-voltage electric signal is applied to the built-in ultrasonic transducer, the transmitter 11 transmits an ultrasonic wave 51 to the thin metal plate 1 which is the material to be inspected. (3) The transmitted ultrasonic wave 52 transmitted through the thin metal plate 1 is received by the receiver 12, appropriately amplified by the receiving amplifier 15, and output to the first gate circuit 21. (4) The first gate circuit 21, whose operation timing is controlled, transmits the transmitted ultrasonic wave 52 output from the reception amplifier 15,
After receiving the synchronization pulse 60 from the synchronization signal generator 16, allow a predetermined time t M1 after a predetermined time t D1 has passed,
Only the primary signal 61 of the transmitted ultrasonic wave 52 is extracted. (5) The first level determiner 22 receives the transmitted transmitted ultrasonic wave 52.
Of the primary signal 61 of the predetermined level L 1
When it is determined that the value exceeds, the primary determination signal 62 is output.
This determination signal 62 partially becomes high level HL when there is no defect (FIG. 3) and when it is smaller than the ultrasonic beam diameter (FIG. 4), and when there is a defect larger than the ultrasonic beam diameter (FIG. 5). Remains at the low level LL. (6) Transmitted ultrasonic wave 52 extracted by the first gate circuit 21
The primary signal 61 of is also introduced to the second gate circuit 23,
After receiving the primary determination signal 62, the gate circuit 23 of FIG. 1 passes the primary signal 61 of the transmitted ultrasonic wave 52 extracted by the first gate circuit 21 for a predetermined time t M2 after the predetermined time t D2. Of the primary signal 61 of the transmitted ultrasonic wave 52, only the secondary signal 63 of a portion having a large amplitude change due to a small defect is extracted. (7) The second level determiner 24 outputs the secondary determination signal 64 when determining that the amplitude of the extracted secondary signal 63 exceeds the predetermined level L 2 . The secondary determination signal 64 is a signal that partially becomes high level HL when there is no defect,
In other cases, that is, when there is a defect, low level L
It is in the L state. (8) The primary judgment signal 62 and the secondary judgment signal 64 are the first AN
It is input to the D circuit 25 and an AND signal 65 of both signals is produced. The AND signal 65 is a pulse signal which becomes the high level HL only when there is no defect. (9) The AND signal 65 is guided to the delay pulse generation circuit 26, and the delay signal 66 is created using a monostable multivibrator or the like. The delay signal 66 actually becomes a pulse signal only when there is no defect, and when there is a defect, it is in the low level LL state. (10) The delayed signal 66 is further inverted by the inverter 27,
This inversion signal 67 is ANDed with the synchronization pulse 60 from the synchronization signal generator 16 in the next second AND circuit 28. Only when there is a defect, the inversion signal 67 is output as the defect detection signal 68 which becomes the high level HL at the same timing as the synchronizing pulse 60.

【0015】本発明の透過超音波探傷装置を用いて、厚
さ0.8mm の金属薄板の探傷を行ったところ、面積5×10
-2mm2 の欠陥を検出することが可能となり、従来の透過
超音波探傷装置での欠陥面積5×10-1mm2 の検出限界に
比して、その検出能が向上していることが判明した。な
お、上記した実施例では、透過型超音波探傷法に適用し
た場合について説明したが、本発明はこれに限るもので
はなく、底面エコーロス型超音波探傷法やV透過型超音
波探傷法にも適用し得ることはいうまでもない。
Using a transmission ultrasonic flaw detector of the present invention, flaw detection of a thin metal plate having a thickness of 0.8 mm was performed.
It becomes possible to detect defects of -2 mm 2 , and the detectability is improved compared to the detection limit of the defect area of 5 × 10 -1 mm 2 in the conventional transmission ultrasonic flaw detector. found. In addition, in the above-described embodiment, the case where the invention is applied to the transmission type ultrasonic flaw detection method has been described, but the present invention is not limited to this, and is applicable to the bottom surface echo loss type ultrasonic flaw detection method and the V transmission type ultrasonic flaw detection method. It goes without saying that it can be applied.

【0016】[0016]

【発明の効果】以上説明したように、本発明によれば、
金属薄板の内部欠陥を高い検出能で検出することができ
るので、金属薄板製造における品質管理およびその保証
に有効に利用することができ、その工業的価値は大なる
ものがある。
As described above, according to the present invention,
Since the internal defect of the thin metal plate can be detected with high detectability, it can be effectively used for quality control and its guarantee in the production of the thin metal plate, and its industrial value is enormous.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明法を透過超音波探傷装置に適用した場合
の実施例を示すブロック図である。
FIG. 1 is a block diagram showing an embodiment in which the method of the present invention is applied to a transmission ultrasonic flaw detector.

【図2】本発明に用いられる欠陥判定装置の構成を示す
ブロック図である。
FIG. 2 is a block diagram showing a configuration of a defect determination device used in the present invention.

【図3】欠陥なしの場合の各信号レベルを示す特性図で
ある。
FIG. 3 is a characteristic diagram showing each signal level when there is no defect.

【図4】欠陥の大きさが超音波ビームの径よりも小さい
場合の各信号レベルを示す特性図である。
FIG. 4 is a characteristic diagram showing each signal level when the size of a defect is smaller than the diameter of an ultrasonic beam.

【図5】欠陥の大きさが超音波ビームの径よりも大きい
場合の各信号レベルを示す特性図である。
FIG. 5 is a characteristic diagram showing each signal level when the size of the defect is larger than the diameter of the ultrasonic beam.

【図6】透過型超音波探傷法の説明図である。FIG. 6 is an explanatory diagram of a transmission type ultrasonic flaw detection method.

【図7】底面エコーロス型超音波探傷法の説明図であ
る。
FIG. 7 is an explanatory diagram of a bottom surface echo loss type ultrasonic flaw detection method.

【図8】V透過型超音波探傷法の説明図である。FIG. 8 is an explanatory diagram of a V transmission type ultrasonic flaw detection method.

【図9】(a) は欠陥の無い部分の透過超音波または底面
反射超音波の波形を、(b) は超音波ビーム径よりも小さ
い欠陥のある部分の透過超音波または底面反射超音波の
波形を示す特性図である。
9A is a waveform of a transmitted ultrasonic wave or a bottom surface reflected ultrasonic wave in a defect-free portion, and FIG. 9B is a waveform of a transmitted ultrasonic wave or a bottom surface reflected ultrasonic wave in a defective portion smaller than an ultrasonic beam diameter. It is a characteristic view which shows a waveform.

【符号の説明】[Explanation of symbols]

1 金属薄板 2 水 11 送信子 12 受信子 13 送受信子 14 電気パルス送信器 15 受信増幅器 16 同期信号発生器 20 欠陥判定装置 21 第1のゲート回路 22 第1のレベル判定器 23 第2のゲート回路 24 第2のレベル判定器 25 第1のAND回路 26 遅延パルス発生回路 27 インバータ 28 第2のAND回路 51 超音波 52 透過超音波 53 底面反射超音波 60 同期パルス 61 1次信号 62 1次判定信号 63 2次信号 64 2次判定信号 65 AND信号 66 遅延信号 67 反転信号 68 欠陥検出信号 1 thin metal plate 2 water 11 sender 12 receiver 13 transceiver 14 Electric pulse transmitter 15 Receiver amplifier 16 Sync signal generator 20 Defect determination device 21 First gate circuit 22 First level judge 23 Second gate circuit 24 Second level determiner 25 First AND circuit 26 Delay pulse generator 27 Inverter 28 Second AND circuit 51 ultrasound 52 transmitted ultrasound 53 Bottom reflected ultrasound 60 sync pulses 61 Primary signal 62 Primary judgment signal 63 Secondary signal 64 Secondary judgment signal 65 AND signal 66 delayed signal 67 Inverted signal 68 Defect detection signal

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭61−97565(JP,A) 特開 昭60−249052(JP,A) 特開 昭52−17879(JP,A) 特開 平3−125961(JP,A) 実開 昭59−23661(JP,U) (58)調査した分野(Int.Cl.7,DB名) G01N 29/00 - 29/28 ─────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-61-97565 (JP, A) JP-A-60-249052 (JP, A) JP-A-52-17879 (JP, A) JP-A-3- 125961 (JP, A) Actual development Sho 59-23661 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) G01N 29/00-29/28

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 超音波を用いて金属薄板の内部欠陥を
検出する方法において、金属薄板に対して超音波を送受
信し、受信超音波を超音波送信時点から所定時間 D1
経過後に所定の時間 M1 開く第1のゲート手段により抽
出し、抽出された超音波の振幅が所定のレベル 1 を下
回るときは欠陥があると判定し、前記第1のゲート手段
により抽出された超音波の振幅が所定のレベル 1 を超
えたと判定したときには、1次判定信号を発生するよう
にし、該1次判定信号の発生から所定時間 D2 の経過後
に所定の時間 M2 開く第2のゲート手段により超音波の
一部の信号を抽出し、前記の抽出された信号の振幅が所
定のレベル 2 を下回るときは欠陥があると判定するこ
とを特徴とする超音波による金属薄板内部欠陥検出方
法。
1. A method of detecting an internal defect of a metal thin plate using ultrasonic waves, wherein ultrasonic waves are transmitted / received to / from the metal thin plate, and a predetermined time t D1 has elapsed from a time point at which the received ultrasonic waves are transmitted, extracted by the first gate means for opening time t M1, extracted amplitude of the ultrasonic are determined to be defective when below a predetermined level L 1, ultrasound extraction by the first gate means ultra predetermined level L 1 amplitude
When it is determined that the signal has been obtained, the primary determination signal is generated.
Then, after a lapse of a predetermined time t D2 from the generation of the primary determination signal, a part of the ultrasonic signal is extracted by the second gate means which opens for a predetermined time t M2 , and the amplitude of the extracted signal is predetermined. The method for detecting an internal defect of a metal thin plate by ultrasonic waves is characterized in that it is determined that there is a defect when the level is lower than the level L 2 .
【請求項2】 前記受信に用いられる超音波は金属薄
板を透過した透過超音波であることを特徴とする請求項
1記載の超音波による金属薄板内部欠陥検出方法。
2. The method according to claim 1, wherein the ultrasonic waves used for the reception are transmitted ultrasonic waves transmitted through the metal thin plate.
【請求項3】 前記受信に用いられる超音波は金属薄
板から反射した反射超音波であることを特徴とする請求
項1記載の超音波による金属薄板内部欠陥検出方法。
3. The method according to claim 1, wherein the ultrasonic wave used for the reception is a reflected ultrasonic wave reflected from a thin metal plate.
JP05009694A 1994-03-22 1994-03-22 Ultrasonic method for detecting defects inside metal sheets Expired - Fee Related JP3446288B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP05009694A JP3446288B2 (en) 1994-03-22 1994-03-22 Ultrasonic method for detecting defects inside metal sheets

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05009694A JP3446288B2 (en) 1994-03-22 1994-03-22 Ultrasonic method for detecting defects inside metal sheets

Publications (2)

Publication Number Publication Date
JPH07260748A JPH07260748A (en) 1995-10-13
JP3446288B2 true JP3446288B2 (en) 2003-09-16

Family

ID=12849541

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP3446288B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006220488A (en) * 2005-02-09 2006-08-24 Nippon Steel Corp Ultrasonic flaw detection method and ultrasonic flaw detection apparatus

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010019787A (en) * 2008-07-14 2010-01-28 Nippon Telegr & Teleph Corp <Ntt> Apparatus and method of determining contact
JP6421632B2 (en) * 2015-02-13 2018-11-14 新日鐵住金株式会社 Ultrasonic flaw detection method and system for continuous casting nozzle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006220488A (en) * 2005-02-09 2006-08-24 Nippon Steel Corp Ultrasonic flaw detection method and ultrasonic flaw detection apparatus

Also Published As

Publication number Publication date
JPH07260748A (en) 1995-10-13

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