JP3454079B2 - Die bonding method - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding method for bonding a chip to a substrate. 2. Description of the Related Art In a die bonding step of bonding a chip cut out of a wafer to a substrate such as a lead frame, in order to harden a bond used for bonding by heat, the bonded substrate is put into a cure furnace. The substrate is heated while being continuously transported. The cured substrate is sent to the next step, a wire bonding step. When the die bonding apparatus is operated, the cured substrate is once collected into a magazine by an unloader, and then transferred to the next process depending on the mode of delivery of the substrate to the next process. There is a batch processing mode in which the whole magazine is transferred to the next step, and an in-line mode in which the bonding apparatus and the next step are connected by a transport means and the cured substrate is directly transferred to the next step. In some cases, the same die bonding apparatus is used by switching between a batch processing mode and an in-line mode. However, in the conventional die bonding apparatus, a transfer means for connecting the die bonding apparatus and the next process is provided at the same position as the position where the unloader is installed. In the case of switching, it is necessary to remove and reattach the unloader, which requires a great deal of labor and time. Accordingly, an object of the present invention is to provide a die bonding method which does not require removal of an unloader when switching between a batch processing mode and an in-line mode. [0006] A die bonding method according to the present invention comprises a bonding means for bonding a chip to a substrate, a chip supply unit for supplying the chip to the bonding means, and a first means for transporting the substrate during bonding. Transport means, a second transport means for receiving the substrate from the first transport means and transporting the substrate to a curing furnace, a curing furnace for heating while transporting the substrate to which the chips are bonded, and a substrate carried out of the curing furnace. A third transporting means for transporting, an unloader disposed on a common base with the bonding means and receiving the substrate from the third transporting means and collecting it in a magazine, and a fourth transporter for transporting the substrate to the next step Die bonding method using a die bonding device equipped with a transfer means
A law, in-line form or is a batch processing mode
A batch processing mode for collecting the substrates in the magazine of the unloader by setting the setting as to whether or not the transfer direction of the third transfer means is normal or reverse according to the setting, and a fourth transfer method from the third transfer means to the fourth transfer means The switching of the in-line mode in which the substrate is transferred to the means and the substrate is directly transported to the next step is performed. According to the present invention having the above structure, an unloader is provided on a base common to the bonding means, and the transfer direction of the third transfer means for transferring the substrate unloaded from the cure furnace. It is necessary to remove the unloader to switch between the batch processing mode where the substrates are collected in the magazine of the unloader and the in-line mode where the substrates are transferred directly from the third transfer means to the transfer means to the next process by switching between the forward and reverse. And can be done without. Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of a die bonding apparatus according to an embodiment of the present invention, and FIGS. 2, 3, and 4 are partial cross-sectional views of the die bonding apparatus. First, the overall structure of the die bonding apparatus will be described with reference to FIG. In FIG. 1, the die bonding apparatus includes a die bonding section A and a cure section B. On the base 1 of the die bonding section A, a pair of right and left transfer rails 2 is provided. The two moving means 4 of the substrate 3 are provided on the side of the rail 2.
a and 4b are provided. The moving means 4a and 4b hold the side end of the board 3 and move along the rail 2 to convey the board 3 on the rail 2 to the right. The rail 2 and the moving means 4a, 4b constitute a first conveying means. The first transport unit transports the substrate 3 during bonding. A bond applying means 5 is provided beside the rail 2. The bond applicator 5 has a bond applicator 6 such as a dispenser, and the bond applicator 6 applies a bond 7 at a pitch onto the substrate 3 conveyed thereunder. On the downstream side of the bond applying means 5, a bonding means 8 is provided. The bonding means 8 includes a Y table 9 and a bonding head 10. On the opposite side of the bonding means 8 from the rail 2, a chip supply unit 11 made of a wafer is provided. Chip supply unit 11
Is mounted on a movable table 14 composed of an X table 12 and a Y table 13, and supplies chips 15 to the bonding means. The bonding head 10 vacuum-adsorbs and picks up the chip 15 of the chip supply unit 11 and bonds the chip 15 on the bond 7 applied to the substrate 3. [0010] A base 20 of the cure portion B is disposed adjacent to the base 1. On the base 20, a second transfer means 21 is provided. The second transfer unit 21 receives the substrate 3 from the first transfer unit and transfers the substrate 3 to a cure furnace. Second
A curing furnace 40 is disposed on the side of the conveying means 21. The substrate 3 on the second conveying means 21 is conveyed in the width direction (downward in FIG. 1) and carried into the curing furnace 40. A third transfer means 61 is provided on the unloading side of the cure furnace 40. The third transport unit 61 switches the transport direction between forward and reverse, and transports the substrate 3 unloaded from the cure furnace 40 in the longitudinal direction (the left-right direction in FIG. 1). An unloader 76 is provided on the base 1 beside the third transfer means 61. The unloader 76
The magazine 79 receives the substrate 3 from the third transport unit 61.
Collect within. An operation panel 80 is provided beside the unloader 76.
Is provided. The operation panel 80 includes a third transport unit 61.
Various operations such as forward / reverse switching of the transport direction are performed. Next, referring to FIG.
1 will be described. FIG. 2 is a sectional view taken along line CC of FIG. In FIG. 2, reference numeral 22 denotes a side plate, and a pair of left and right sides is erected on a base 20 (FIG. 1). Three cuts 23 are provided in the upper edge of the side plate 22. A plurality of guide pulleys 24 and one drive pulley 25 are disposed on the side plate 22, and a belt 29 is tuned to these pulleys.
A plurality of guide pulleys 24 are arranged around the notch 23, and the belt 29 tuned to these is connected to the notch 2.
Bypass 3 A motor 26 is provided on the side of the side plate 22.
Are provided, and a pulley 28 is provided on the rotation shaft of the motor 26.
Is installed. A belt 27 is tuned to the pulley 28 and the driving pulley 25. Therefore, when the motor 26 is driven, the driving pulley 25 rotates, and the belt 29
Runs. As the belt 29 travels, the substrate 3 placed on the belt 29 is transported in the direction of arrow a. 3
Reference numeral 1 denotes a stopper that stops the substrate 3 on the belt 29. In addition, rods 45 penetrate the notches 23, respectively. Next, the curing furnace 40 will be described with reference to FIG. FIG. 3 is a sectional view taken along the line DD of FIG. FIG.
, The cure furnace 40 is provided with a carry-in port 41 and a carry-out port 42. 3 for the entrance 41 and the exit 42
Two rods 45 (see also FIG. 2) and three wires 43
(See also FIG. 1). On the wire 43,
The substrate 3 is placed. Inside the curing furnace 40, a heater 44 is disposed below the wire 43. Heater 4
4 heats the substrate 3 after bonding. Both ends of the rod 45 are supported by a support member 46 outside the curing furnace 40. Support member 46
Are connected to a frame 47. The frame 47 is connected to a rod 48 of a cylinder 49. Cylinder 4
9 is mounted on a plate 50, and the plate 50 is slidable by a guide rail 51a and a slider 51b. The plate 50 is connected to a rod 52 of a cylinder 53. By combining the movement of the rod 52 of the cylinder 53 with the movement of the rod 48 of the cylinder 49, the rod 45 performs the pitch feed operation described below. First, in a state where the substrate 3 is placed on the wires 43,
The rod 48 of the cylinder 49 projects to connect the substrate 3 to the wire 4
3 (arrow b), and then the rod 52 of the cylinder 53 is retracted to move the substrate 3 in the transport direction (FIG. 3).
(Left side in FIG. 2) by one pitch p (arrow c), and the rod 48 of the cylinder 49 is lowered so that the substrate 3 is lowered (arrow d). The rod 45 returns to its original position by the projection of 52 (arrow e). That is, the substrate 3 on the second transfer means 21 is fed by one pitch p in the width direction each time the above-described operation is performed once, and by repeating this pitch feed, the lower heater 4
It is conveyed while being heated by 4 and passed to the third conveying means 61. Next, referring to FIG.
Will be described. FIG. 4 is a sectional view taken along line EE of FIG. In FIG. 4, reference numeral 62 denotes a side plate, which is erected on the base 20 in a pair on the left and right. Side plate 6
The upper edge portion 2 is provided with three cut portions 65. The side plate 62 has a plurality of guide pulleys 66.
And one drive pulley 67 is arranged, and a belt 63 is tuned to these pulleys. A plurality of guide pulleys 66 are arranged around the cut portion 65, and the belt 63 adjusted by these guides bypasses the cut portion 65. A motor 68 is provided on the side of the side plate 62.
Is provided, and a pulley 69 is provided on the rotation shaft of the motor 68.
Is installed. The rotation direction of the motor 68 can be switched between forward and reverse, and the rotation direction can be switched by an instruction from the operation panel 80. A belt 64 is tuned to the pulley 69 and the driving pulley 67. Therefore, when the motor 68 is driven, the driving pulley 67 rotates, and the belt 63 runs. As the belt 63 travels, the substrate 3 placed on the belt 63
Is transported. The rods 45 penetrate the cut portions 65, respectively, and the rods 45 perform the above-described pitch feed operation, so that the substrate 3 carried out of the cure furnace 40 is placed on the belt 63. In FIG. 1, an unloader 76 is provided on the base 1 beside the third transfer means 61. The unloader 76 includes a lifting platform 77, a Z table 78 for moving the lifting platform 77 up and down, and a substrate pushing unit 75 for pushing the substrate 3 on the third transport unit into the magazine 79. A magazine 79 is mounted on the elevating table 77. In FIG. 4, a pair of left and right brackets 70 is fixed to the upper side surface of the side plate 62.
A shaft 71 is connected to the upper part of the zero. A cylinder 72 is mounted on the shaft 71. Cylinder 72
Moves horizontally along the shaft 71 by air pressure. A cylinder 73 is vertically mounted on the cylinder 72.
A pusher 74 is connected to the rod 73a of the cylinder 73. With the rod 73a of the cylinder 73 protruding (see arrow f), the cylinder 72 moves to the right (arrow g).
Then, the pusher 74 pushes the substrate 3 on the belt 63 into the magazine 79. In the present embodiment, the bracket 70, the shaft 71, the cylinders 72 and 73, and the pusher 74 constitute a substrate pushing section 75. In FIG. 4, the substrate 3 indicated by a chain line in the fifth slit from the top of the magazine 79 indicates a state where the substrate 3 on the belt 63 is pushed into the magazine 79 by the pusher 74. Further, 90 shown in dashed line at the left end on the side plate 62 in FIG. 4, the transport from the third transfer means 61 in the case of an in-line form of the fourth to convey directly to the substrate 3 in the next step Means. By reversing the running direction of the belt 63, the substrate 3 placed on the belt 63 is transported in the direction of the arrow h, and is transferred to the fourth transport unit 90. Thus, the cured substrate 3 is directly transported to the next step. Incidentally, in the conventional die bonding apparatus,
An unloader is provided at a position where the transfer means 90 is connected. Therefore, an additional space for installing the unloader is required outside the die bonding apparatus. When the unloader is used in an in-line mode, the unloader needs to be removed from this position in order to connect the transfer means 90. In the present embodiment, since the unloader 76 is provided on the base 1, no additional space is required for the unloader, and when switching between the inline mode and the batch mode, the mounting and dismounting of the transfer means 90 is performed. There is no need to do it each time. This die bonding apparatus has the above-described configuration, and its operation will be described below with reference to the drawings. First, before starting the work, a setting is made as to the batch processing mode or the in-line mode in relation to the next process. According to the setting, the third transport unit 6
1 is determined and the operation panel 80 instructs the transport direction. When the operation is started, first, the substrate 3 is placed on the transport rail 2 shown in FIG. The substrate 3 is transported by the moving means 4a, and the bond 6 is applied onto the substrate 3 by the bond applicator 6. Next, the substrate 3 is transported by the moving unit 4b, and the chip 15 is bonded onto the bond 6 by the bonding unit 8. Next, the substrate 3 is transported further downstream by the moving means 4b and passed to the second transport means 21.
As shown in FIG.
The substrate 3 is stopped in a position where the leading end surface of the substrate 3 contacts the stopper 31. Next, the substrate 3 is carried into the cure furnace 40 by the rod 45 performing a pitch feed operation, and is mounted on the wire 43 (FIG. 3). Here, the substrate 3 is fed by a predetermined number of pitches, so that the substrate 3 is heated for a predetermined time, and then carried out of the cure furnace 40 and transferred to the third transfer means 61. Thereafter, the transport mode of the substrate 3 differs depending on whether the mode is a batch processing mode or an in-line mode.
In the case of the batch processing mode, as shown in FIG. 4, the transport direction of the third transport unit 61 is set to the right in FIG. 4, and the substrate 3 is collected in the magazine 79. On the other hand, in the case of the in-line mode, the transport direction of the third transport unit 61 is set to the left (see arrow h) in FIG. Conveyed. By arranging the unloader 76 on the base 1 of the die bonding section A in this manner, switching between the batch processing mode and the in-line mode does not require the removal of the unloader 76, and the third transfer means 61 Can be performed simply by switching the transport direction between the forward and reverse directions. Also,
Conventionally, the space for the unloader, which is separately provided outside the die bonding apparatus, can be saved. According to the present invention, the unloader is provided on a base common to the bonding means, and the third transport means for transporting the substrate carried out of the curing furnace is switched between forward and reverse, thereby providing the substrate. Between the batch processing mode for collecting the substrate in the magazine of the unloader and the in-line mode for transferring the substrate directly from the third transport means to the transport means for the next process can be performed without removing the unloader. Further, since the unloader is provided on the same base as the bonding means, the space for the unloader conventionally installed outside the die bonding apparatus can be saved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of a die bonding apparatus according to one embodiment of the present invention. FIG. 2 is a partial cross-sectional view of the die bonding apparatus according to one embodiment of the present invention. FIG. 4 is a partial cross-sectional view of a die bonding apparatus according to one embodiment of the present invention. FIG. 4 is a partial cross-sectional view of a die bonding apparatus according to one embodiment of the present invention. [Description of References] 1 Base 2 Rail 3 Substrate 7 Bond 6 Bond applicator 8 bonding means 14 chip supply unit 15 chip 21 second transfer means 40 cure furnace 44 heater 61 third transfer means 76 unloader 80 operation panel 90 transfer means

Continuation of the front page (56) References JP-A-1-123425 (JP, A) JP-A-64-44025 (JP, A) JP-A-57-39542 (JP, A) JP-A-62-104042 (JP, A) , A) (58) Field surveyed (Int. Cl. ⁷ , DB name) H01L 21/50 H01L 21/52

Claims (1)

(57) [Claim 1] A bonding means for bonding a chip to a substrate, a chip supply unit for supplying a chip to the bonding means, a first transportation means for transporting the substrate during bonding, A second transfer unit that receives the substrate from the first transfer unit and transfers the substrate to the cure furnace, a cure furnace that heats while transferring the substrate to which the chip is bonded, and a third transfer that transfers the substrate unloaded from the cure furnace Means and a third means provided on a common base with the bonding means.
Bonding by a die bonding apparatus , comprising: an unloader that receives a substrate from a transport unit and collects the substrate in a magazine; and a fourth transport unit that transports the substrate to the next process.
The method is in batch processing or in-line
A batch processing mode of recovering the substrate in the magazine of the unloader by performing forward / reverse switching of the transport direction of the third transport unit in accordance with the setting ;
A die bonding method characterized by performing in-line switching in which a substrate is transferred from a third transfer means to a fourth transfer means and the substrate is transferred directly to the next step.