JP3457574B2 - Sealing type plunger head joining method - Google Patents
Sealing type plunger head joining methodInfo
- Publication number
- JP3457574B2 JP3457574B2 JP16787999A JP16787999A JP3457574B2 JP 3457574 B2 JP3457574 B2 JP 3457574B2 JP 16787999 A JP16787999 A JP 16787999A JP 16787999 A JP16787999 A JP 16787999A JP 3457574 B2 JP3457574 B2 JP 3457574B2
- Authority
- JP
- Japan
- Prior art keywords
- plunger head
- joining
- screw
- shank
- sealing type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/58—Details
- B29C45/586—Injection or transfer plungers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、封止型プランジャ
ーヘッドの接合方法に関し、特に、プランジャーヘッド
の接合部の抜け，割れを防ぎ、モールドプレスの安定稼
働を図った封止型プランジャーヘッド接合方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for joining a sealed plunger head, and more particularly to a sealed plunger that prevents the joint portion of the plunger head from slipping off and cracking and ensures stable operation of a mold press. The present invention relates to a head joining method.
【０００２】[0002]
【従来の技術】現在、半導体デバイスにおける、レジン
パッケージの低応力，高耐湿化のため無機質充填材が多
量に充填されたレジンが使用されている。射出成形時、
溶融したレジンの溶融粘度は、無機質充填材、すなわ
ち、フィラー等の増大によって高粘度となり、溶融レジ
ンを送り出すプランジャヘッドの摩耗が激しくなる。2. Description of the Related Art Currently, in semiconductor devices, a resin is used which is filled with a large amount of an inorganic filler in order to reduce the stress and moisture resistance of the resin package. During injection molding,
The melt viscosity of the melted resin becomes high due to the increase of the inorganic filler, that is, the filler and the like, and the plunger head for sending out the melted resin is abraded.
【０００３】この封止型の耐摩耗化のための技術の一つ
として、特開昭５９−９３３１５号公報に開示されてい
るように、封止型の少なくともレジンに接する部分が、
セラミックあるいは超硬材料で形成された構造が知られ
ている。As one of the techniques for improving the wear resistance of this sealing type, as disclosed in Japanese Patent Laid-Open No. 59-93315, at least the portion of the sealing type which is in contact with the resin is
Structures made of ceramics or superhard materials are known.
【０００４】従って、プランジャーヘッドピストン部は
耐摩耗性材料で形成されておりピストンの寿命は長い
が、ヘッドとシャンクの接合部分が破損（接合部の抜
け，接合部の割れ）してしまう問題があった。これは、
シャンクを油圧シリンダーで引き戻すときに、ポットと
ヘッドの摺動抵抗増大により発生する。Therefore, although the plunger head piston portion is formed of a wear resistant material and the piston has a long life, the joint portion between the head and the shank is damaged (the joint portion is dislodged or the joint portion is cracked). was there. this is,
It is caused by the increased sliding resistance between the pot and head when the shank is pulled back by the hydraulic cylinder.
【０００５】[0005]
【発明が解決しようとする課題】上述したように、従来
のプランジャーヘッド接合方法では、ヘッドとシャンク
の接合部分が破損（接合部の抜け，接合部の割れ）して
しまうという問題があった。As described above, in the conventional plunger head joining method, there is a problem that the joining portion between the head and the shank is damaged (the joining portion comes off, the joining portion is cracked). .
【０００６】また、プランジャーヘッドの破損による交
換頻度の増大は、モールドプレスの稼働率低下、結果的
には製品コストの増大を招きかねないという問題があっ
た。Further, there has been a problem that an increase in replacement frequency due to breakage of the plunger head may cause a decrease in operating rate of the mold press, resulting in an increase in product cost.
【０００７】そこで、本発明の目的は、上記問題を解決
すべく、プランジャーヘッドの接合部の抜け，割れを防
ぎ、モールドプレスの安定稼働を図ったプランジャーヘ
ッド接合方法を提供することにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method for joining a plunger head in which the joining portion of the plunger head is prevented from coming off and cracking and the mold press is stably operated in order to solve the above problems. .
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
に、本発明の封止型プランジャーヘッド接合方法は、半
導体デバイスにおけるレジンを送り出すプランジャーヘ
ッドの接合方法において、プランジャーヘッドの接合部
を、シャンク取り付けネジ部とピストン部とを、ネジ止
めと勘合とロー付けとにより接合することを特徴とす
る。In order to achieve the above object, a method of joining a sealed plunger head according to the present invention is a method of joining a plunger head for delivering a resin in a semiconductor device. Is characterized in that the shank mounting screw portion and the piston portion are joined by screwing, fitting and brazing.
【０００９】また、ネジ止めのためのネジ込み部を設け
るのが好ましい。Further, it is preferable to provide a threaded portion for screwing.
【００１０】さらに、ネジ止めに使用するネジは、シャ
ンク取り付けネジ部およびピストン部の引っ張り強さに
対し有効なＭ１２のネジであるのが好ましい。Further, the screw used for screwing is preferably an M12 screw effective for the tensile strength of the shank mounting screw portion and the piston portion.
【００１１】またさらに、勘合のための勘合部をネジ込
み部の先端に設けるのが好ましい。Furthermore, it is preferable that a fitting portion for fitting is provided at the tip of the threaded portion.
【００１２】また、勘合部は、シャンク取り付けネジ部
とピストン部のセンター出しに用いるのが好ましい。The mating portion is preferably used for centering the shank mounting screw portion and the piston portion.
【００１３】さらに、ロー付けは、接合強度を高くする
のに用いるのが好ましい。Further, brazing is preferably used to increase the bonding strength.
【００１４】[0014]
【発明の実施の形態】次に、図面を参照して、本発明の
実施の形態について説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings.
【００１５】図１は、本発明の封止型プランジャーヘッ
ドの実施の形態の構成を示す断面図である。この封止型
プランジャーヘッドの、従来のプランジャーヘッドと異
なる点は、接合部をＭ１２のネジと勘合部１とを使用
し、なおかつロー付けしたという構成にある。Ｍ１２の
ネジは、シャンク取り付けネジ部４およびピストン部２
の引っ張り強さに対し有効であり、勘合部１は、シャン
ク取り付けネジ部４とピストン部２のセンター出しに必
要である。ロー付けも、接合強度を高くする役目を果た
す。FIG. 1 is a sectional view showing the construction of an embodiment of a sealed plunger head of the present invention. This sealed plunger head is different from the conventional plunger head in that the joint portion uses the M12 screw and the fitting portion 1 and is brazed. The screw of M12 is the shank attachment screw part 4 and the piston part 2
Is effective for the tensile strength of No. 1, and the fitting portion 1 is necessary for centering the shank attachment screw portion 4 and the piston portion 2. Brazing also serves to increase the bonding strength.
【００１６】従って、シャンク取り付けネジ部４とピス
トン部２との接合は、特に、引っ張り強度に対して有効
な効果が得られる。Therefore, the joining of the shank mounting screw portion 4 and the piston portion 2 has a particularly effective effect on the tensile strength.
【００１７】このように、本発明の封止型プランジャー
ヘッド接合方法は、モールドプレス封止型に用いられ
る、プランジャーヘッド６においてプランジャーヘッド
６のシャンク取り付けネジ部４とピストン部２とを接合
部材を介して固定するに当たり、接合をネジとロー付け
の両方で行おうとしたことを特徴とする。As described above, according to the method of joining the sealed plunger head of the present invention, the shank mounting screw portion 4 of the plunger head 6 and the piston portion 2 in the plunger head 6 used in the mold press sealing type. It is characterized in that when fixing via the joining member, joining is attempted by both screws and brazing.
【００１８】[0018]
【実施例】次に、図面を参照して、本発明の実施例につ
いて説明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１９】図２は、本発明の封止型プランジャーヘッ
ドを用いたモールドプレス封止型の実施例の構成を示す
断面図である。このモールドプレス封止型は、製品を形
成するための上型チェイスブロック１０ａ，下型チェイ
スブロック１０ｂ，レジンタブレット８が投入されるポ
ット９，レジンタブレット８を押圧するシャンク５へ、
本発明の封止型プランジャーヘッド６が取付けられる構
成になっている。シャンク５は、油圧シリンダー７によ
り上下し、圧力性能は最大２．０ｔの能力がある。FIG. 2 is a sectional view showing the structure of an embodiment of the mold press sealing type using the sealing type plunger head of the present invention. This mold press-sealing mold has an upper chase block 10a for forming a product, a lower chase block 10b, a pot 9 into which a resin tablet 8 is put, and a shank 5 for pressing the resin tablet 8,
The structure is such that the sealed plunger head 6 of the present invention can be attached. The shank 5 moves up and down by the hydraulic cylinder 7, and has a pressure performance of 2.0t at maximum.
【００２０】次に、図２を参照して、本発明の実施例の
動作について説明する。Next, the operation of the embodiment of the present invention will be described with reference to FIG.
【００２１】まず、ワイヤーボンディングされたリード
フレーム１４およびレジンタブレット８は、射出成形に
よりシャンク５へ取付けられたプランジャーヘッド６
が、油圧シリンダー７によりレジンタブレット８を押圧
する。プランジャーヘッド６はポット９内で上昇し、レ
ジンタブレット８は、カル１１で加熱されて溶融し始め
たレジンを押圧し、溶けたレジンをランナー１２内に送
り込む。溶けたレジンはランナー１２内を流れ、ゲート
からキャビティ１３内に流入しリードフレーム１４の所
定の部分をレジンで覆う。ある一定の時間を経過すると
プランジャーヘッド６は、油圧シリンダー７，シャンク
５により引き戻される。カル１１，ランナー１２，キャ
ビティ１３，ゲートは、溶けたレジンが流れる様に窪み
（溝）で形成されている。First, the wire-bonded lead frame 14 and resin tablet 8 are attached to the shank 5 by injection molding, and the plunger head 6 is attached.
However, the resin cylinder 8 is pressed by the hydraulic cylinder 7. The plunger head 6 rises in the pot 9, and the resin tablet 8 presses the resin which is heated by the cull 11 and starts to melt, and sends the melted resin into the runner 12. The melted resin flows in the runner 12, flows from the gate into the cavity 13, and covers a predetermined portion of the lead frame 14 with the resin. After a certain period of time, the plunger head 6 is pulled back by the hydraulic cylinder 7 and the shank 5. The cull 11, the runner 12, the cavity 13, and the gate are formed as depressions (grooves) so that the melted resin flows.
【００２２】[0022]
【発明の効果】以上説明したように、本発明の封止型プ
ランジャーヘッド接合方法により、ヘッドとシャンクの
接合部分の破損（接合部の抜け，接合部の割れ）を防ぐ
ことができるという効果を奏する。As described above, according to the method of joining the sealed plunger head of the present invention, it is possible to prevent the joint portion between the head and the shank from being damaged (the joint portion coming off and the joint portion cracking). Play.
【００２３】また、モールドプレスの安定稼働を図るこ
とができるという効果を奏する。Further, there is an effect that the stable operation of the mold press can be achieved.
【図１】本発明の封止型プランジャーヘッドの実施の形
態の構成を示す断面図である。FIG. 1 is a sectional view showing a configuration of an embodiment of a sealed plunger head of the present invention.
【図２】本発明の封止型プランジャーヘッドを用いたモ
ールドプレス封止型の実施例の構成を示す断面図であ
る。FIG. 2 is a cross-sectional view showing a configuration of an embodiment of a mold press sealing type using the sealing type plunger head of the present invention.
【符号の説明】 １ 勘合部 ２ ピストン部 ３ Ｍ１２ネジ込み部 ４ シャンク取り付けネジ部 ５ シャンク ６ プランジャーヘッド ７ 油圧シリンダー ８ レジンタブレット ９ ポット １０ａ 上型チェイスブロック １０ｂ 下型チェイスブロック １１ カル １２ ランナー １３ キャビティ １４ リードフレーム[Explanation of symbols] 1 mating section 2 Piston part 3 M12 screwed part 4 Shank mounting screw 5 shank 6 Plunger head 7 hydraulic cylinder 8 resin tablets 9 pots 10a Upper chase block 10b Lower chase block 11 Cal 12 runners 13 cavities 14 Lead frame
Claims (6)
プランジャーヘッドの接合方法において、 前記プランジャーヘッドの接合部を、シャンク取り付け
ネジ部とピストン部とを、ネジ止めと勘合とロー付けと
により接合することを特徴とする封止型プランジャーヘ
ッドの接合方法。1. A method of joining a plunger head for delivering a resin in a semiconductor device, wherein a joining portion of the plunger head is attached to a shank.
A method of joining a sealed plunger head, characterized in that the screw portion and the piston portion are joined by screwing, fitting and brazing.
ことを特徴とする、請求項１に記載の封止型プランジャ
ーヘッドの接合方法。2. The method of joining a sealed plunger head according to claim 1, wherein a screw-in portion for fixing the screw is provided.
取り付けネジ部およびピストン部の引っ張り強さに対し
有効なＭ１２のネジであることを特徴とする、請求項２
に記載の封止型プランジャーヘッドの接合方法。3. The screw used for the screwing is an M12 screw effective for the tensile strength of the shank mounting screw portion and the piston portion.
Bonding method of the serial mounting of the sealed plunger head.
の先端に設けることを特徴とする、請求項２または３に
記載の封止型プランジャーヘッドの接合方法。4. The method of joining a sealed plunger head according to claim 2, wherein a fitting portion for fitting is provided at a tip of the screwed portion.
ピストン部のセンター出しに用いることを特徴とする、
請求項１〜４のいずれかに記載の封止型プランジャーヘ
ッドの接合方法。5. The fitting portion is used for centering the shank mounting screw portion and the piston portion,
The method for joining the sealed plunger head according to claim 1.
用いることを特徴とする、請求項１〜５のいずれかに記
載の封止型プランジャーヘッドの接合方法。6. The method of joining a sealed plunger head according to claim 1, wherein the brazing is used to increase the joining strength.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16787999A JP3457574B2 (en) | 1999-06-15 | 1999-06-15 | Sealing type plunger head joining method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16787999A JP3457574B2 (en) | 1999-06-15 | 1999-06-15 | Sealing type plunger head joining method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000355026A JP2000355026A (en) | 2000-12-26 |
| JP3457574B2 true JP3457574B2 (en) | 2003-10-20 |
Family
ID=15857786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16787999A Expired - Fee Related JP3457574B2 (en) | 1999-06-15 | 1999-06-15 | Sealing type plunger head joining method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3457574B2 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3061652B2 (en) * | 1991-03-01 | 2000-07-10 | 東芝タンガロイ株式会社 | Plunger for transfer mold equipment |
| JPH0670235U (en) * | 1993-03-01 | 1994-09-30 | 住友重機械工業株式会社 | Semiconductor encapsulation equipment |
| JPH09314623A (en) * | 1996-05-31 | 1997-12-09 | Mitsubishi Electric Corp | Injection molding equipment |
-
1999
- 1999-06-15 JP JP16787999A patent/JP3457574B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000355026A (en) | 2000-12-26 |
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