JP3460045B2 - Cleaning equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning processing apparatus for cleaning objects such as semiconductor wafers and LCD glass substrates.

[0002]

2. Description of the Related Art Generally, in a manufacturing process of a semiconductor manufacturing apparatus, an object to be processed (hereinafter referred to as a wafer) such as a semiconductor wafer or an LCD glass is sequentially transferred to a processing tank in which a cleaning liquid such as a chemical liquid or a rinse liquid is stored. 2. Description of the Related Art A cleaning processing device that performs processing such as cleaning is widely adopted.

A conventional cleaning apparatus of this type is shown in FIG.
A cleaning processing device as shown in 2 is known. This cleaning processing apparatus includes a processing tank a for storing a mixed liquid (processing liquid) of a chemical liquid for dipping an object to be processed such as a semiconductor wafer W (hereinafter referred to as a wafer) and a cleaning liquid such as pure water, and the inside of the processing tank a. Weighing tank d for storing and weighing pure water to be supplied to
And a pure water supply source e for supplying pure water to the weighing tank d. In the weighing tank d, the pure water stored in the weighing tank d is heated to a predetermined temperature, for example, a processing temperature. A heating means, such as a cartridge heater f, is provided. Also,
An opening / closing valve h is provided in a supply conduit g for supplying the pure water stored in the weighing tank d into the processing tank a.

Further, the processing tank a is an inner tank b for storing the processing liquid.
And an outer tank c that surrounds the upper opening of the inner tank b, and the processing liquid overflowed from the inner tank b to the outer tank c is circulated through a circulation pump i, a damper j, and a filter k. The liquid is circulated and supplied into the inner tank b through the pipe line m, and the drainage pipe line p is connected to the circulation pipe line m through the switching valve n to discharge the liquid to the drainage part q.

According to the conventional cleaning processing apparatus thus constructed, the pure water supplied from the pure water supply source e, stored in the weighing tank d, and weighed is measured at a predetermined temperature by the cartridge heater f. For example, after being heated to the processing temperature, it is supplied into the processing tank a through the supply pipe g, and a predetermined mixing ratio with a chemical solution such as ammonium hydroxide / hydrogen peroxide (NH4OH / H2O2) supplied into the processing tank a. The wafer W is immersed in the treatment liquid to be mixed with the treatment liquid, and the treatment liquid overflowing from the inner tank b is circulated and supplied to remove particles and organic substances adhering to the surface of the wafer W.

[0006]

By the way, as a recent tendency of the mixing ratio of the treatment liquid, the chemical liquid is being diluted, and accordingly, a large amount of pure water must be weighed and heated. Therefore, it takes a lot of time to heat the pure water, and there is a problem that the processing liquid in the processing tank a cannot be exchanged while the pure water stored in the weighing tank d is heated to a predetermined temperature. It was
Further, there is a problem that a new treatment liquid cannot be exchanged even during the drainage of the treatment liquid in the treatment tank a that has been used for cleaning.

The present invention has been made in view of the above circumstances, and the cleaning liquid supplied into the weighing tank is heated to a predetermined temperature in advance to be stored in the weighing tank and is kept at the processing temperature in the weighing tank. It is an object of the present invention to provide a cleaning treatment apparatus in which the cleaning liquid is set to a predetermined temperature in a short time so that the exchange time of the treatment liquid can be shortened and the throughput can be improved.

[0008]

In order to achieve the above object, the present invention is configured as follows.

(1) According to the first aspect of the present invention, a treatment tank for dipping an object to be treated, a weighing tank for storing and weighing a cleaning liquid to be supplied into the processing tank, and a cleaning liquid to be supplied to the weighing tank. In the cleaning treatment apparatus including a cleaning liquid supply source, the measuring tank is provided with a heat retaining means for keeping the cleaning liquid stored in the weighing tank at a predetermined temperature higher than the processing temperature. above the conduit, interposed heating means for heating the washing liquid to higher than the processing temperature a predetermined temperature, the washing liquid heated by the heating means for connecting the door
It is characterized in that it is formed so that it can be supplied into the weighing tank .

With this configuration, the cleaning liquid supplied from the cleaning liquid supply source into the weighing tank can be preheated to a predetermined temperature by the heating means, and the cleaning liquid stored in the weighing tank is kept at the processing temperature. can do. Well
In addition, the temperature of the cleaning liquid heated by the heating means
If the cleaning liquid is higher than the
The heating capacity can be reduced to allow the cleaning solution to stand by.
It Therefore, the waiting time of the cleaning solution can be shortened.
Therefore, it is possible to continuously wash the lot of the object to be treated.
Therefore, the throughput can be improved. Also, by any chance,
Even if a problem occurs in the weighing tank, it is heated by the heating means.
The cleaning solution is supplied directly to the processing tank for cleaning.
You can

(2) According to the second aspect of the invention, a treatment tank for dipping the object to be treated, a weighing tank for storing and weighing the cleaning liquid to be supplied into the processing tank, and a cleaning liquid to be supplied to the weighing tank. In the cleaning treatment apparatus including a cleaning liquid supply source, the measuring tank is provided with a heat retaining means for keeping the cleaning liquid stored in the weighing tank at a predetermined temperature higher than the processing temperature. above the conduit, interposed heating means for heating the washing liquid to higher than the processing temperature a predetermined temperature, the washing liquid heated by the heating means for connecting the door
It is characterized in that it is formed so as to be able to be supplied in the weighing tank, and a plurality of supply pipelines for supplying the cleaning liquid from the weighing tank to the processing tank are provided.

With this structure, the cleaning liquid supplied from the cleaning liquid supply source into the weighing tank can be preheated to a predetermined temperature by the heating means, as in the case of the above-described invention. The cleaning liquid stored therein can be kept warm at the processing temperature. Further, the cleaning liquid stored in the weighing tank can be supplied into the processing tank from the supply pipelines of a plurality of systems, and the cleaning liquid can be supplied to the processing tank in a short time. In addition, washing that is heated by heating means
By making the temperature of the purified liquid higher than the processing temperature, weigh tank
In the case, the heating capacity of the cleaning liquid is reduced and the cleaning liquid is on standby.
Can be made. Therefore, the waiting time of the cleaning liquid
Can be shortened and continuously cleans lots of objects to be processed
It can be processed to improve throughput.
It Also, in case of trouble with the weighing tank,
Also supplies the cleaning liquid heated by the heating means directly to the processing tank.
The cleaning process can be performed .

(3) The invention according to claim 3 is the cleaning processing apparatus according to claim 2, wherein each of the supply pipelines is provided with an opening / closing means, and at least one of the supply pipelines is provided with a switching means. It is characterized in that the discharge pipe line is connected.

With this construction, the opening / closing means can be selectively opened / closed as appropriate, and all or part of the supply pipeline can be used as required. Further, by switching the switching means to the discharge side, the cleaning liquid in the weighing tank can be supplied to other than the processing tank, and the cleaning liquid remaining in the weighing tank can be discharged to facilitate cleaning of the weighing tank. can do.

(4) The invention according to claim 4 is the cleaning processing apparatus according to any one of claims 1 to 3, wherein a chemical liquid supply source is connected to the processing tank to generate a processing liquid in the processing tank. In order to do so, the chemical liquid and the cleaning liquid are formed so that they can be mixed.

With this configuration, the cleaning solution weighed in the weighing tank and the chemical solution supplied from the chemical solution supply source can be simultaneously supplied to and mixed in the processing tank, and a predetermined dilution can be performed. A treatment liquid having a concentration can be generated.

(5) The invention according to claim 5 is the cleaning processing apparatus according to any one of claims 1 to 4, wherein a circulation pipeline for circulating the processing liquid in the processing tank is provided in the processing tank. In addition to connecting, the drainage conduit is connected to the circulation conduit via the opening / closing means, and the drainage conduit is connected to the bottom of the processing tank via the opening / closing means. To do.

With this configuration, the processing liquid in the processing tank can be drained from the drainage pipe within a short time. Therefore, a new processing liquid can be exchanged in the processing tank immediately after draining.

(6) According to the invention of claim 6, the object to be processed is
Immersion treatment tank and cleaning liquid supplied into this treatment tank
Weighing tank that stores and weighs, and wash in this weighing tank
A cleaning processing apparatus having a cleaning liquid supply source for supplying liquid
In the above-mentioned weighing tank, the washing water stored in this weighing tank is stored.
It is equipped with heat retention means to keep the purified liquid at a predetermined temperature,
Preheat the cleaning liquid to a specified temperature in the pipe connecting the tank and the cleaning liquid supply source.
The weighing tank is provided with a heating means for heating the cleaning liquid stored in the weighing tank and a heating means for keeping the cleaning liquid stored in the weighing tank at a predetermined temperature and a side wall in the weighing tank. a breakwater member communicating with the cleaning liquid of the inner, so as to detect the liquid level of the cleaning solution of the breakwater member, comprising a liquid level sensing means located in the vicinity outside of the breakwater members, the liquid face detecting means comprises weighing line of the cleaning liquid is stored in the weighing tank, the upper limit line, a boil-dry prevention line and lower line set
It is characterized by The invention according to claim 7 is the subject
A treatment tank for immersion treatment of the physical body, and supply into this treatment tank
A weighing tank that stores and weighs the cleaning liquid, and this weighing tank
Cleaning process including a cleaning liquid supply source for supplying a cleaning liquid to the
In the device, store in the weighing tank described above.
It is equipped with heat retention means to keep the cleaning solution
Put the cleaning liquid in the pipe connecting the weighing tank and the cleaning liquid supply source.
A heating means for heating to a predetermined temperature is installed,
The supply pipeline for supplying the cleaning liquid to the above treatment tank has multiple systems.
However, the above-mentioned weighing tank is the cleaning liquid stored in this weighing tank.
Is installed on the side wall in the weighing tank and the heat retention means to keep the
Wave preventive member that is installed and communicates with the cleaning liquid in the weighing tank at the top and bottom
And so that the level of the cleaning liquid in this breakwater can be detected.
And a liquid level detecting means arranged outside the vicinity of the wave preventing member.
And the liquid level detection means is stored in a weighing tank.
Cleaning liquid weighing line, upper limit line, emptying prevention line and
And a lower limit line are set. This place
In this case, it is preferable to dispose the wave preventing member on opposite side walls in the weighing tank (claim 8).

With such a structure, even if waving occurs in the weighing tank when the cleaning liquid is supplied to or drained from the weighing tank, for example, it is possible to prevent the waving in the wave preventing member. it can. Therefore, the amount of the cleaning liquid stored in the weighing tank can be accurately detected (weighed). in this case,
The liquid level detection means can safely monitor the cleaning liquid stored in the weighing tank by setting the weighing line, the upper limit line, the emptying prevention line and the lower limit line of the cleaning liquid stored in the weighing tank. ( Claims 6 and 7 ). Also, by disposing the wave preventing member on the opposite side walls in the weighing tank, the cleaning liquid in the weighing tank can be weighed from any of the left and right locations, and the liquid level detection by the location of the weighing tank can be performed. It is possible to eliminate the restriction of attachment of the means (claim 8).

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. In this embodiment, a case where the semiconductor wafer cleaning system is applied will be described.

FIG. 1 is a schematic plan view showing an example of a cleaning processing system to which the cleaning processing apparatus of the present invention is applied.

The cleaning system described above includes a loading / unloading section 2 for loading and unloading a container 1 for horizontally storing a semiconductor wafer W (hereinafter referred to as a wafer), which is an object to be processed, and a wafer W. A processing unit 3 that performs a liquid process such as a chemical liquid and a cleaning liquid and a drying process; and an interface unit 4 that is located between the loading / unloading unit 2 and the processing unit 3 and that transfers the wafer W, adjusts the position, and changes the attitude. It is mainly composed of.

The carrying-in / carrying-out section 2 has a carrier carrying-in section 5a and a carrier carrying-out section 5 at one end of the cleaning system.
b is provided side by side, and a wafer transfer section 6 is provided. In this case, a carrier mechanism (not shown) is provided between the carrier carry-in section 5a and the wafer transfer section 6,
The carrier 1 causes the carrier 1 to move into the carrier loading section 5a.
Is transferred to the wafer transfer section 6.

A carrier lifter (not shown) is provided in each of the carrier carry-out section 5b and the wafer transfer section 6, and an empty carrier 1 is provided above the carry-in / carry-out section 2 by this carrier lifter. It is configured so that it can be delivered to and received from a standby unit (not shown). In this case, a carrier transfer robot (not shown) that is movable in the horizontal direction (X, Y directions) and the vertical direction (Z direction) is arranged in the carrier standby unit, and the wafer transfer is performed by the carrier transfer robot. Empty carrier 1 transported from section 6
And can be carried out to the carrier carry-out section 5b. In addition to the empty carrier, the carrier standby unit also holds the carrier 1 in which the wafer W is stored.
It is also possible to wait for.

The wafer transfer section 6 is opened in the interface section 4, and a lid opening / closing device 7 is arranged in the opening. The lid opening / closing device 7 opens or closes the lid (not shown) of the carrier 1. Therefore, the lid opening / closing device 7 removes the lid of the carrier 1 that stores the unprocessed wafer W transferred to the wafer transfer unit 6 to remove the wafer W in the carrier 1.
Can be carried out, and after all the wafers W have been carried out, the lid can be closed again by the lid opening / closing device 7. Further, the lid body of the empty carrier 1 transported from the carrier standby portion to the wafer delivery portion 6 is removed by the lid opening / closing device 7 so that the wafer W can be loaded into the carrier 1, and after all the wafers W have been loaded. The lid can be closed again by the lid opening / closing device 7. A mapping sensor 8 for detecting the number of wafers W stored in the carrier 1 is arranged near the opening of the wafer transfer section 6.

The interface section 4 holds a plurality of wafers W, for example, 25 wafers W in a horizontal state, and a horizontal transfer means for transferring the wafers W to and from the carrier 1 of the wafer transfer section 6, for example, a wafer transfer arm 9. And a plurality of, for example, 50 wafers W, which are positioned between the wafer transfer arm 9 and the pitch changer, and a pitch changer (not shown) that holds the plurality of wafers W in a vertical state at a predetermined interval. Posture changing means for changing the posture to a horizontal state and a vertical state, for example, a posture changing device 10, and a notch (not shown) provided on the wafer W whose posture has been changed to the vertical state.
A position detecting means for detecting, for example, a notch aligner (not shown) is provided. Further, the interface section 4 is provided with a transfer path 16 which is continuous with the processing section 3, and a wafer transfer means, for example, a wafer transfer chuck 15 is movably disposed on the transfer path 1.

On the other hand, the processing section 3 includes a first processing unit 11 for removing particles and organic contaminants adhering to the wafer W, and a second processing unit 12 for removing metallic contaminants adhering to the wafer W. A cleaning / drying processing unit 13 and a chuck cleaning unit 14 for removing the chemical oxide film attached to the wafer W and performing a drying process are linearly arranged, and the first and second processing units 11 and 12 and the cleaning / drying unit are arranged. The cleaning processing apparatus of the present invention is used in the processing unit 13. The wafer transfer chuck 15 that can rotate (θ) in the X, Y directions (horizontal direction), Z direction (vertical direction) and is arranged on a transfer path 16 provided at a position facing each of the units 11 to 14. Has been done. In addition, at a position facing each of the units 11 to 14 on the side opposite to the transport path 16, a storage unit 17 that stores a chemical liquid tank and piping equipment.
Are formed.

Next, the cleaning processing apparatus according to the present invention will be described in detail.

As shown in FIG. 2, the cleaning processing apparatus is
A processing tank 20 for dipping the wafer W by storing a processing liquid L (for example, ammonium hydroxide / hydrogen peroxide (NH4OH / H2O2) and a cleaning liquid (for example, pure water))
A heat-retaining means such as a cartridge heater 31 arranged in the weighing tank 30 to keep the pure water stored in the weighing tank 30 at a predetermined temperature, for example, 62 ° C .; Weighing tank 3 for storing and weighing
0, a cleaning liquid supply source for supplying pure water to the weighing tank 30, for example, a pure water supply source 32, the pure water supply source 32, and the weighing tank 3
A heating means, for example, a water heater 34, which heats pure water supplied through a pipe 33 connecting 0 to a predetermined temperature, for example, 65 ° C., and a plurality of, for example, two systems connecting the processing tank 20 and the weighing tank 30. Cleaning liquid supply line, for example, pure water supply line 35a,
35b.

In this case, the processing tank 20 and the weighing tank 30 have two
Sets are provided adjacent to each other, and a pipe 33 is provided in each weighing tank 30.
And a pure water supply source 32 is connected via a branch pipe 36 branched from this pipe 33, and an opening / closing means such as an opening / closing valve 37 provided in the pipe 33 and the branch pipe 36 is opened / closed. By this, pure water is supplied from the pure water supply source 32 into the weighing tank 30.

Further, opening / closing means, for example, an opening / closing valve 38 is provided in each of the two systems of pure water supply pipelines 35a, 35b connecting the processing tank 20 and the weighing tank 30, and at least one of the pure water supplies is supplied. A discharge conduit 40 is connected to the conduit 35a via a switching means such as a drain valve 39. The pure water discharged to the discharge pipe 40 is secondary pure water.
It is used for another purpose other than the cleaning process of the wafer W. Further, one of the pure water supply pipes 35a is connected to a cleaning liquid supply source (not shown) for cleaning the processing tank 20, and a cleaning pipe 41 is connected to the cleaning liquid supply source.
Are connected.

Further, a chemical liquid supply source (not shown) is connected to the processing bath 20, and chemical liquids such as ammonium hydroxide (NH4OH) and hydrogen peroxide (H2O2) are supplied from the chemical liquid supply source, respectively. ing. Therefore, pure water, NH4OH, and H2O2 are simultaneously supplied into the processing tank 20, and the pure water and the chemical solution are mixed to generate a diluting liquid (processing liquid L) having a predetermined concentration.

In addition, as shown in FIGS. 3 to 6, the weighing tank 30 has a liquid level detecting means such as a capacitance type liquid for detecting the capacity of the pure water stored in the weighing tank 30. A surface sensor 42 is provided, and an overflow pipe 43 for discharging the amount of pure water in the weighing tank 30 that exceeds a predetermined amount to the outside is provided.

In this case, a substantially channel-shaped wave preventing member 44 having upper and lower portions communicating with pure water stored in the weighing tank 30 is arranged on the opposite side walls of the weighing tank 30. The liquid level sensor 42 is arranged outside the vicinity of the wave preventing member 44 so that the liquid level of the pure water in the wave member 44 can be detected. In this way, by detecting the liquid level of the pure water in the wave preventing member 44 arranged in the weighing tank 30 with the liquid level sensor 42, for example, when the pure water is supplied or drained, the waviness in the weighing tank 30 is corrugated. Even if this occurs, it is possible to prevent undulation in the wave preventing member 44, so that the amount of pure water stored in the weighing tank 30 can be accurately detected (weighed). Therefore, the weighing line 42 for the pure water stored in the weighing tank 30
a, the upper limit line 42b, the emptying prevention line 42c, and the lower limit line 42d can be set accurately, and the weighing tank 3
The pure water stored in 0 can be safely monitored.
In addition, by providing the wave preventing members 44 on the opposite side walls in the weighing tank 30, the weighing tank 3 can be installed from any of the left and right positions.
It is possible to weigh the pure water within 0, and it is possible to eliminate the restriction on the mounting of the liquid level sensor 42 depending on the location of the weighing tank 30.

The overflow pipe 43 is slidably and watertightly inserted into a joint 45 communicating with a through hole (not shown) formed in the bottom of the weighing tank 30, and the lower end is removed. The elbow joint 47 connected to the liquid pipe 46 is formed so as to be airtightly insertable. Therefore, the height of the overflow pipe 43 can be adjusted, and the gap between the upper end of the overflow pipe 43 and the ceiling portion 30a of the weighing tank 30 can be widened to some extent. It is possible to smoothly discharge the pure water stored in the tank 30 beyond the upper limit line 42b.
By thus separating the upper end of the overflow pipe 43 from the ceiling portion 30a of the weighing tank 30 to some extent, the ceiling portion of pure water due to the surface tension phenomenon that occurs when the distance between the overflow pipe 43 and the ceiling portion 30a of the weighing tank 30 is narrow. The attraction to 30a can be eliminated. That is, since the pure water is attracted to the ceiling portion 30a by the surface tension, the pure water can be smoothly discharged by eliminating the hollow portion formed in the central portion of the pure water discharged from the overflow pipe 43. The drain pipe 46, one end of which is connected to the elbow joint 47, is arranged so as to be inclined downward toward the other end, and the pure water discharged from the overflow pipe 43 is smoothly discharged without remaining in the middle. It is configured to be capable (see FIG. 5).

On the other hand, as shown in FIGS. 2, 7 and 8, the processing tank 20 is an inner tank 20a for storing the processing liquid L therein.
And an outer tank 20b that surrounds the upper end opening of the inner tank 20a and receives the processing liquid L overflowed from the inner tank. Further, a treatment liquid supply nozzle 21 is arranged below the inner tank 20a, and a circulation pipe line 22 connecting the treatment liquid supply nozzle 21 and the discharge port 20c provided at the bottom of the outer tank 20b, A circulation pump 23, a damper 24, and a filter 25 are provided in this order from the outlet side (see FIG. 2). A drainage pipe 26 connected to the drainage unit is connected to the circulation pump side and the filter side of the circulation pipe 22, and an opening / closing means such as an opening / closing valve 27 is interposed in each of the drainage pipes 26. It is set up. Furthermore, processing tank 2
A drain port 20d is provided at the bottom of the inner tank 20a of 0, and a drain pipe 26A is connected to the drain port 20d and the drain portion via an opening / closing means, for example, an open / close valve 27A. The drainage conduit 26A is formed with a larger diameter than the drainage conduit 26 so that a large amount of the processing liquid L can be discharged within a short time.

A wafer boat 28 that holds a plurality of wafers W, for example, 50 wafers W, in the inner tank 20a of the processing tank 20.
Is provided. A cleaning nozzle 29 for injecting a cleaning liquid toward the entire processing tank 20 is disposed above the processing tank 20, and one of the pure water supply pipes 35a and 35b is connected to the cleaning nozzle 29. 35a is connected.

In this embodiment, as shown in FIGS. 8 and 9, the processing liquid supply nozzle 21 has a plurality of upper nozzle holes 21b, which are arranged at appropriate intervals in the pipe-shaped body 21a.
The lower nozzle hole 21c and the intermediate nozzle hole 21d are formed by a pipe member made of synthetic resin, for example, polyvinyl chloride (PVC). Further, the processing liquid supply nozzle 21
Is rotatably formed in a direction orthogonal to the axial direction, and is particularly configured to adjust the injection angle of the upper nozzle hole 21b. In this case, the pipe-shaped main body 21a is rotatably pierced in a watertight manner in a mounting member 48 with a tapered hole that is screwed to the female screw portion 21f of the mounting hole 21e provided in the lower portion of the side wall of the inner tank 20a. In this case, the taper hole provided in the attachment member 48 with a taper hole is formed so as to expand outward. In addition, the pipe-shaped main body 21a
A fixing ring 21g having a substantially triangular cross section, which is sharpened toward the protruding side, is fitted to the end portion on the protruding side of the elbow joint 49 connected to the circulation line 22 via the fixing ring 21g. Is fixed to the male screw portion 49b of the elbow joint 49, which is inserted into the connecting portion 49a of the elbow joint 49 with the packing 21h interposed therebetween. There is. The tip of the pipe-shaped main body 21a inside the inner tank is rotatably supported by a flanged receiving ring 21i fixed to the side wall of the inner tank 20a.

The processing liquid supply nozzle 21 constructed as described above can rotate the pipe-shaped main body 21a by loosening the mounting member 48 with a tapered hole and the cap nut 49c, and the nozzle holes 21b, 21c and 21d can be rotated. After the injection angle is arbitrarily adjusted, the mounting member 48 is fastened to the mounting hole 21e, and the cap nut 49c is fastened to the connecting portion 49a of the elbow joint 49, whereby it can be fixed. Therefore, the processing liquid L jetted from the upper nozzle hole 21 b can be adjusted so as to hit the wafer W position deviated from the wafer boat 28. The lower nozzle hole 21c sprays the processing liquid L onto the bottom of the inner tank 20a, and the intermediate nozzle hole 2c
1d is configured to inject the processing liquid L into the discharge port 20d provided at the bottom of the inner tank 20a.

The processing tank 20 is disposed in a sink box 50 made of a synthetic resin having a rectangular tubular shape, for example, heat resistant vinyl chloride (PVC) or polypropylene (PP), and the processing tank 20 in the sink box is provided. A drain receiving pan 51 made of synthetic resin such as heat-resistant vinyl chloride (PVC) or polypropylene (PP) is welded to the sink box 50 on the lower side of the. In addition, a sink plate 50 and a receiving plate 52 made of the same material as the drain receiving pan 51 are disposed below the drain receiving pan 51 in a state of being welded to the sink box 50. It is possible to receive the droplets of the processing liquid L falling downward from.

In this case, the drainage receiving pan 51 is provided with an outward flange 51b which abuts against the inner wall surface of the sink box 50 at the opening end of the pan body 51a, and the pan body 5
The bottom part 51c of 1a is formed in a downward slope from one side to the other side. The side wall 51d on the lower side of the downward slope of the bread main body 51a is inclined inward, and the joint pipe 54 is inserted in a watertight manner through a through hole 53 provided on the bottom side of the side wall 51d. (See FIGS. 7 and 10). Drainage pipe (not shown) connected to this joint pipe 54
Is laid in a container 17 that faces the units 11 to 14 on the opposite side of the transport path 16 and stores chemical liquid tanks and piping equipment.

The volume of the drainage receiving pan 51 is larger than the volume of the processing bath 20, and even if all of the processing liquid L in the processing bath 20 flows downward, the drainage receiving pan may be used. You can take it at 51. Further, it is preferable that the width of the outward flange 51b be as narrow as possible. The reason for this is to prevent the liquid droplets of the waste liquid falling from the processing tank 20 side from remaining on the outward flange 51b.

Further, the receiving plate 52 is also arranged so as to have a downward slope from one side to the other side similarly to the bottom portion 51c of the drain receiving pan 51, and should the processing liquid be placed on the receiving plate 52. Even when L drops, the droplets flow downward. A discharge port 52a is provided at an appropriate position of the receiving plate 52, preferably at a lower position below the slope.
A drain pipe 56 having a drain valve 55 is connected to 2a.

In this case, as shown in FIG. 11, the receiving plate 52 has a plurality of adjacent, for example, two sink boxes 50.
You may make it arrange | position in common at the lower part of. By using the receiving plates 52 in common for a plurality of sink boxes 50 in this way, the processing liquid L received on the receiving plates 52 in both sink boxes 50 can be discharged from one place, and the piping can be provided. It is possible to reduce the number of components such as. Further, a liquid detection means, for example, a leak sensor 57 is arranged at an appropriate position on the receiving plate 52, and a detection signal from the leak sensor 57 is provided to a control means (not shown) such as a central processing unit (C).
It is possible to detect the liquid leakage of the processing liquid L onto the receiving plate 52 by transmitting it to the PU) and performing monitoring or alarm display by the output signal from the CPU.

Next, an operation mode of the cleaning processing apparatus of the present invention configured as described above will be described.

First, the pure water supplied from the pure water supply source 32 to the weighing tank 30 is heated in advance by the water heater 34 to a predetermined temperature higher than the processing temperature, for example, 65 ° C., and then supplied into the weighing tank 30. The pure water supplied and stored in the weighing tank 30 is stored in the weighing tank 30 in a state where a predetermined amount of pure water is measured by the liquid level sensor 42 and weighed. At this time, the cartridge heater 31 provided in the weighing tank 30 stands by while keeping the pure water in the weighing tank 30 at a temperature slightly higher than the processing temperature, for example, 62 ° C.

Next, when exchanging the treatment liquid L in the treatment tank 20, first, the drainage pipe 26 connected to the circulation pipe 22 is connected.
And the opening / closing valves 27, 27A provided in the drainage conduit 26A connected to the inner tank 20a are operated to the open side, that is, the side communicating with the drainage section, to specifically treat the processing tank 20 (specifically, the inner tank 20a and the outside The processing liquid L in the tank 20b) is discharged. After discharging the processing liquid L in the processing tank 20, the on-off valves 27 and 27A are closed.
Then, the on-off valve 38 provided in the pure water supply pipelines 35a and 35b is operated to the open side to supply pure water into the processing tank 20 (specifically, the inner tank 20a) and, at the same time, supply a chemical solution (not shown). A chemical solution such as NH4OH and H2O2 is supplied from a source and mixed in the processing tank 20 to generate a processing solution L {(NH4OH / H2O2) and a diluted solution of pure water} at a predetermined temperature, for example, 60 ° C.

After the processing liquid L is stored in the processing tank 20,
A plurality of, for example, 50 wafers W are immersed in the processing liquid L by the wafer boat 28, and the inner tank 20a to the outer tank 2
The processing liquid L overflowing to 0b is circulated and filtered while being circulated and supplied from the processing liquid supply nozzle 21 to remove particles and organic substances adhering to the surface of the wafer W. During this cleaning process, the pure water to be used next is stored in the weighing tank 30 and is kept in a state of being weighed and kept at a predetermined temperature.

The wafer W, which has been cleaned by being immersed in the processing tank 20 for a predetermined time, is taken out of the processing tank 20 by the ascent of the wafer boat 28 and then received by the wafer transfer chuck 15 to be adjacent to the processing tank 20 or another wafer. Is transferred to the processing tank of the processing unit or the interface unit 4.

The processing bath 20 used for cleaning the wafer W as described above discharges the used processing liquid L into the drainage section in the same manner as described above, and then places it in the weighing tank 30 in the same manner as described above. By supplying the measured amount of pure water and supplying the chemical liquid from the chemical liquid supply source at the same time, the next new processing liquid L is supplied into the processing tank 20 within a short time.

As described above, pure water is heated in advance to a temperature higher than the processing temperature by the water heater 34 and supplied into the weighing tank 30, and the cartridge heater 31 in the weighing tank 30 keeps the temperature slightly higher than the processing temperature. Therefore, in the weighing tank 30, the heating capacity of pure water can be reduced and the pure water can be made to stand by. Therefore, the standby time of pure water can be shortened, and the lot of wafers W to be subjected to the standby cleaning process can be continuously cleaned, so that the throughput can be improved. Further, even if a trouble occurs in the weighing tank 30, the cleaning treatment can be performed by directly supplying the pure water heated by the water heater 34 to the treatment tank 20.

Also, two systems of pure water supply pipes 35a, 35
In addition to being able to use b simultaneously, it is also possible to select and use only one pure water supply pipe if necessary. Further, when cleaning the inside of the weighing tank 30, the switching means, for example, the drain valve 39 can be switched to the discharge pipe 40 side to discharge the pure water in the weighing tank 30.
Washing of 0 can be easily performed.

In the above embodiment, the case where the treatment liquid L is the ammonia / hydrogen peroxide mixed liquid (APM) has been described, but other cleaning liquids such as dilute hydrogen fluoride liquid (DHF) or sulfuric acid / peroxidation. Hydrogen mixture (SP
Even in the case of M) or the like, the cleaning treatment can be similarly performed. It can also be applied to cleaning with pure water only (rinse cleaning).

Further, in the above embodiment, the case where the cleaning processing apparatus of the present invention is applied to the cleaning processing system for semiconductor wafers has been described, but it is needless to say that it can be applied to glass substrates for LCDs other than semiconductor wafers.

[0056]

As described above, according to the cleaning processing apparatus of the present invention, which is configured as described above,
The following excellent effects can be obtained.

(1) According to the invention described in claim 1, the cleaning liquid supplied from the cleaning liquid supply source into the weighing tank can be heated to a predetermined temperature in advance by the heating means, and the cleaning liquid stored in the weighing tank can be heated. Can be kept at the processing temperature .
Also, the temperature of the cleaning liquid heated by the heating means is processed.
By making the temperature higher than the temperature, the cleaning liquid is
The heating capacity of the
Therefore, the waiting time of the cleaning solution can be shortened.
In addition, the cleaning treatment of the object can be continuously performed.
Therefore, the throughput can be improved.
Also, if a problem occurs in the weighing tank, the
Cleaning by directly supplying the cleaning liquid heated by the heating means to the processing tank
Processing can be performed .

(2) According to the second aspect of the present invention, in addition to the above (1), the cleaning liquid stored in the weighing tank can be supplied into the processing tank from a plurality of supply pipelines. Since it can be supplied to the processing tank in a short time,
Further, the throughput can be improved.

(3) According to the third aspect of the invention, in addition to the above (1) and (2), the opening / closing means is appropriately selectively opened / closed, and if necessary, all or part of the supply pipeline. Can be used. Further, by switching the switching means to the discharge pipe side, the cleaning liquid in the weighing tank can be supplied to a place other than the processing tank, and the cleaning liquid remaining in the weighing tank can be discharged to facilitate cleaning of the weighing tank. can do.

(4) According to the invention described in claim 4, the cleaning liquid weighed in the weighing tank and the chemical liquid supplied from the chemical liquid supply source can be simultaneously supplied and mixed into the processing tank. At the same time, since the treatment liquid having a predetermined dilution concentration can be generated, the treatment tank can be replaced in a short time in addition to the above (1) and (2), and the throughput can be further improved.

(5) According to the invention described in claim 5, in addition to the above (1) and (2), the treatment liquid in the treatment tank can be drained from the drainage conduit within a short time. A new processing liquid can be exchanged in the processing tank immediately after draining, and the throughput can be further improved.

(6) According to the inventions of claims 6 and 7 ,
In addition to the above (1) and (2), even if waving occurs in the weighing tank, it is possible to prevent waving in the wave preventing member, so that the amount of cleaning liquid stored in the weighing tank can be accurately stored. It can be detected (weighed).

Further, the cleaning liquid stored in the weighing tank can be safely monitored.

(7) According to the invention described in claim 8, in addition to the above (6), the cleaning liquid in the weighing tank can be weighed from any place on the left and right, and the liquid surface depending on the location of the weighing tank. It is possible to eliminate the restriction on the attachment of the detection means.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing an example of a cleaning processing system to which a cleaning processing apparatus of the present invention is applied.

FIG. 2 is a schematic configuration diagram showing an example of a cleaning processing apparatus according to the present invention.

FIG. 3 is a schematic perspective view showing a part of the weighing tank according to the present invention by cutting out.

FIG. 4 is a schematic perspective view showing another part of the weighing tank by cutting out.

FIG. 5 is a schematic cross-sectional view of the weighing tank.

FIG. 6 is a side view showing a part of the weighing tank in section.

FIG. 7 is a cross-sectional view showing a processing tank and a sink box in which the processing tank is arranged according to the present invention.

FIG. 8 is a cross-sectional view of the processing tank.

FIG. 9 is a sectional view (a) showing a processing liquid supply nozzle arranged in the processing tank and an enlarged sectional view (b) showing a connecting portion between the processing liquid supply nozzle and a joint.

FIG. 10 is a perspective view showing a drainage receiving pan disposed below the sink box and a receiving plate disposed below the drainage pan.

FIG. 11 is a schematic cross-sectional view showing another embodiment of the drainage receiving pan and the receiving plate.

FIG. 12 is a schematic configuration diagram showing a conventional cleaning processing apparatus.

[Explanation of symbols]

W Semiconductor wafer (Processing object) L treatment liquid 20 treatment tanks 22 Circulation pipeline 26,26A drainage line 27,27A open / close valve (open / close means) 30 weighing tank 31 Cartridge heater (heat retention means) 32 Pure water supply source (cleaning liquid supply source) 33 pipelines 34 Water heater (heating means) 35a, 35b Pure water supply pipeline (cleaning liquid supply pipeline) 36 branch lines 38 Open / close valve (open / close means) 39 Drain valve (switching means) 40 discharge pipeline 42 Liquid level sensor (liquid level detection means) 44 Wave breaker

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yuji Tanaka 1375 Nishishinmachi 41, Tosu City, Saga 41 Tokyo Electron Kyushu Co., Ltd. Saga Works (72) Ryuichi Koga 4175 Nishishincho, Tosu City, Saga 41 Tokyo D Lectron Kyushu Co., Ltd.Saga Works (72) Inventor Norihiko Nishida 1375 Nishishinmachi 41, Tosu City, Saga Prefecture 41 Tokyo E Rectron Kyushu Co., Ltd. Saga Works (72) Inventor Takashi Morioka 1375 Nishishinmachi 41, Tosu City Saga Prefecture Tokyo Lectron Kyushu Co., Ltd. in the Saga Works (72) Inventor Shoji Terada 41375 Nishishinmachi, Tosu City, Saga Tokyo 41 Electron Kyushu Co., Ltd. in the Saga Works (56) Reference JP-A-61-272935 (JP, A) JP-A-9-38589 (JP, A) JP-A-6-204201 (JP, A) JP-A-6-151403 (J , A) JitsuHiraku flat 5-55547 (JP, U) (58 ) investigated the field (Int.Cl. ^7, DB name) B08B 3/04 H01L 21/304

Claims (8)

(57) [Claims] 1. A cleaning process comprising: a treatment tank for dipping an object to be treated; a weighing tank for storing and weighing the cleaning liquid supplied into the treatment tank; and a cleaning liquid supply source for supplying the cleaning liquid to the weighing tank. In the processing device, the cleaning liquid stored in the weighing tank is processed in the weighing tank.
The washing liquid is provided in a pipe line connecting the weighing tank and the washing liquid supply source with a warming means for keeping the temperature higher than a predetermined temperature.
A heating means for heating to a predetermined temperature higher than the processing temperature is provided, and the cleaning liquid heated by the heating means is placed in the weighing tank.
A cleaning processing apparatus, characterized in that the cleaning processing apparatus is formed so as to be able to be supplied to . 2. A cleaning comprising: a treatment tank for dipping an object to be treated; a weighing tank for storing and weighing the cleaning liquid supplied into the processing tank; and a cleaning liquid supply source for supplying the cleaning liquid to the weighing tank. In the processing device, the cleaning liquid stored in the weighing tank is processed in the weighing tank.
The washing liquid is provided in a pipe line connecting the weighing tank and the washing liquid supply source with a warming means for keeping the temperature higher than a predetermined temperature.
A heating means for heating to a predetermined temperature higher than the processing temperature is provided, and the cleaning liquid heated by the heating means is placed in the weighing tank.
Capable of supplying to form a supply conduit for supplying a cleaning liquid to the treatment tank from the weighing tank to a plurality of systems, cleaning apparatus according to claim to. 3. The cleaning processing apparatus according to claim 2, wherein an opening / closing means is provided in each of the supply pipelines,
A cleaning processing apparatus, characterized in that at least one supply pipeline is connected to a discharge pipeline via a switching means. 4. The cleaning treatment apparatus according to claim 1, wherein a chemical liquid supply source is connected to the treatment tank,
A cleaning processing apparatus, wherein a chemical liquid and a cleaning liquid are formed so as to be mixed so as to generate a processing liquid. 5. The cleaning treatment apparatus according to any one of claims 1 to 4, wherein a circulation pipe line for circulating the treatment liquid in the treatment bath is connected to the treatment bath, and the treatment pipe is connected to the circulation pipe line. A cleaning treatment apparatus characterized in that a drainage pipeline is connected via an opening / closing means, and the drainage pipeline is connected to the bottom of the processing tank via an opening / closing means. 6. A treatment tank for dipping a treatment object, and
Scale that stores and weighs the cleaning liquid supplied to the processing tank
A measuring tank and a cleaning liquid supply source for supplying the cleaning liquid to the weighing tank,
In a cleaning treatment apparatus equipped with , a predetermined amount of cleaning liquid stored in the weighing tank is stored in the weighing tank.
Equipped with heat retention means to keep temperature, the above-mentioned weighing tank and cleaning solution
Heat the cleaning liquid to a specified temperature in the conduit connecting to the supply source.
The weighing tank is provided with a heating means for keeping the cleaning liquid stored in the weighing tank at a predetermined temperature and a side wall in the weighing tank, and the upper and lower parts are the cleaning liquid in the weighing tank. A wave preventing member that communicates with
A liquid level detecting means is provided outside the vicinity of the wave preventing member so that the liquid level of the cleaning liquid in the wave preventing member can be detected.
Further, the liquid level detecting means is characterized by setting a weighing line of the cleaning liquid stored in the weighing tank, an upper limit line, an emptying prevention line and a lower limit line. 7. A treatment tank for dipping a treatment object, and
Scale that stores and weighs the cleaning liquid supplied to the processing tank
A measuring tank and a cleaning liquid supply source for supplying the cleaning liquid to the weighing tank,
In a cleaning treatment apparatus equipped with , a predetermined amount of cleaning liquid stored in the weighing tank is stored in the weighing tank.
Equipped with heat retention means to keep temperature, the above-mentioned weighing tank and cleaning solution
Heat the cleaning liquid to a specified temperature in the conduit connecting to the supply source.
Washing from the above weighing tank to the above processing tank through the heating means
The supply tank for supplying the liquid has a plurality of systems, and the weighing tank is provided with a heat retaining means for keeping the cleaning liquid stored in the weighing tank at a predetermined temperature and a side wall in the weighing tank, and the upper and lower parts are weighed. A wave preventing member that communicates with the cleaning liquid in the tank,
A liquid level detecting means is provided outside the vicinity of the wave preventing member so that the liquid level of the cleaning liquid in the wave preventing member can be detected.
Further, the liquid level detecting means is characterized by setting a weighing line of the cleaning liquid stored in the weighing tank, an upper limit line, an emptying prevention line and a lower limit line. 8. The cleaning treatment apparatus according to claim 6 or 7, wherein the wave preventing member is provided on opposite side walls of the weighing tank.