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JP3461546B2 - Electronic component mounting device - Google Patents
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JP3461546B2 - Electronic component mounting device - Google Patents

Electronic component mounting device

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Publication number
JP3461546B2
JP3461546B2 JP32558793A JP32558793A JP3461546B2 JP 3461546 B2 JP3461546 B2 JP 3461546B2 JP 32558793 A JP32558793 A JP 32558793A JP 32558793 A JP32558793 A JP 32558793A JP 3461546 B2 JP3461546 B2 JP 3461546B2
Authority
JP
Japan
Prior art keywords
electronic component
recognition
transmission
reflection
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP32558793A
Other languages
Japanese (ja)
Other versions
JPH07183696A (en
Inventor
英樹 内田
誠 末木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP32558793A priority Critical patent/JP3461546B2/en
Publication of JPH07183696A publication Critical patent/JPH07183696A/en
Application granted granted Critical
Publication of JP3461546B2 publication Critical patent/JP3461546B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Manipulator (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Description

【発明の詳細な説明】 【0001】 【産業上の利用分野】本発明は、電子部品装着装置に
するものである。 【0002】 【従来の技術】近年、電子部品実装分野の拡大とともに
様々な電子部品が利用されはじめ、その認識のためのノ
ズルも反射と透過用のノズルが必要となってきている。
そのため、その品種の削減と、電子部品装着装置での認
識ノズルの切り替え時間の削減手段が望まれている。 【0003】以下に従来の反射と透過認識ノズルを用い
た電子部品装着方法について説明する。図4は、従来の
電子部品装着装置の電子部品認識方法を示すものであ
る。図4において、1は電子部品装着装置、2は電子部
品認識装置、3は電子部品供給装置、4はプリント基
板、5は反射認識可能電子部品、6は透過認識可能電子
部品、7は反射認識ノズル、8は透過認識ノズル、9は
ノズル待機ステーション、10は空きステーション、1
1は電子部品認識装置2の上方に設置された反射認識用
照明器、12は反射認識ノズル7に設置された光吸収用
の黒板、13は透過認識ノズル8に設置された透過認識
用照明器、14は水平ロボット、15は水平ロボット1
4に取り付けてあり水平方向に移動可能でさらに反射認
識ノズル8、透過認識ノズル9を着脱自在でかつ電圧を
供給でき上下運動および水平方向に回転可能な機構を持
った装着ヘッドである。 【0004】以上のように構成された電子部品装着装置
について、電子部品の認識および装着動作について説明
する。電子部品装着装置1において、まず、電子部品供
給装置3によって反射認識可能電子部品5が供給された
場合は、装着ヘッド15が反射認識可能電子部品5の上
方まで移動する。装着ヘッド15にセットされた反射認
識ノズル7が下降し、反射認識可能電子部品5を吸着し
て上昇する。反射認識可能電子部品5を保持した装着ヘ
ッド15は、電子部品認識装置2の上方まで移動する。
ここで反射認識用照明器11を電子部品装着装置1から
供給された電圧で発光させて反射認識可能電子部品5と
黒板12に照射し、その反射光を電子部品認識装置2が
認識し、装着ヘッド15で反射認識ノズル7を回転させ
て反射認識可能電子部品5の姿勢を補正する。姿勢補正
を完了した反射認識可能電子部品5は、装着ヘッド15
によってプリント基板4の所定の装着位置の上方まで移
動され、反射認識ノズル8が下降し吸着オフし上昇する
ことで装着される。 【0005】引続き、電子部品供給装置3によって透過
認識可能電子部品6が供給された場合は、一旦装着ヘッ
ド15は空きステーション10があるノズル待機ステー
ション9まで移動する。その位置で装着ヘッド15は、
空きステーション10に反射認識ノズル7を置く。空き
ができた装着ヘッド15にノズル待機ステーション9に
準備してある透過認識ノズル8をセットする。透過認識
ノズル8がセットできた装着ヘッド15は、透過認識可
能電子部品6の上方まで移動する。そして装着ヘッド1
5によって透過認識ノズル8が下降し、透過認識可能電
子部品6を吸着して上昇する。透過認識可能電子部品6
を保持した装着ヘッド15は電子部品認識装置2の上方
まで移動する。ここで透過認識用照明器13を装着ヘッ
ド15から供給された電圧で発光させ、その透過光を電
子部品認識装置2が認識し、装着ヘッド15で透過認識
ノズル8を回転させて透過認識可能電子部品6の姿勢を
補正する。姿勢補正を完了した透過認識可能電子部品5
は、装着ヘッド15によってプリント基板4の所定の装
着位置の上方まで移動され、透過認識ノズル8が下降し
吸着オフし上昇することで装着される。 【0006】電子部品装着装置は、以上の動作を電子部
品が変わる度に、適切な認識ノズルを選択して行い、電
子部品の吸着、認識、装着の一連の動作を繰り返し実行
する。 【0007】ここで、従来の認識方法の違いによる反射
認識と透過認識ノズルの使い分けの必要性を図5、図6
を用いて説明する。図5において、16は電子部品吸着
面、17は電子部品装着装置1から反射認識照明器11
への電源供給用の配線、図6において、18は装着ヘッ
ド15から透過認識照明器13への電源供給用の配線で
ある。 【0008】図5は反射認識方法を示すものである。反
射認識用照明器11は、電子部品認識装置2と反射認識
ノズル7の電子部品吸着面16との間に設けられてお
り、黒板12は反射認識ノズル7の電子部品吸着面16
より上方に設けられている。ここで黒板12の役割は反
射認識可能電子部品5にて反射される光とその背後と明
確に区分するために電子部品の背後を暗くしておく必要
があることから設けられたものである。反射認識可能電
子部品5は装着ヘッド15に装着された反射認識ノズル
7によって吸着されており、その反射認識可能電子部品
5に向けて、電子部品装着装置1から配線17を通して
供給された電圧で反射認識用照明器11が光を照射し、
反射認識可能電子部品5と黒板12から反射される光を
電子部品認識装置2で認識している。 【0009】図6は透過認識方法を示すものである。透
過認識用照明器13は、電子部品吸着面16より上方位
置で透過認識ノズル8に設けられている。透過認識可能
電子部品6は装着ヘッド15に装着された透過認識ノズ
ル8によって吸着されておりその透過認識可能電子部品
6に向けて、装着ヘッド15から配線18を通して供給
された電圧で透過認識用照明器13が光を照射し、透過
認識可能電子部品6を透過した光を電子部品認識装置2
で認識している。 【0010】 【発明が解決しようとする課題】しかしながら上記従来
の構成では、電子部品を認識する際に、電子部品認識用
に照明器を備えた電子部品認識装置以外に、反射認識で
は反射認識ノズルとして電子部品吸着面の上方に光を反
射しない黒板、透過認識では透過認識ノズルとして電子
部品吸着面の上方に透過認識用照明器をそれぞれを固有
に備えた専用ノズルを必要とし、さらには電子部品装着
装置側においてその専用ノズルの交換時間を必要とする
という問題点を有していた。 【0011】本発明は上記問題点に鑑み、反射認識ノズ
ルと透過認識ノズルを兼用できる認識ノズルを提供する
ことで、電子部品装着装置においてその専用ノズルの交
換時間を解消することができる電子部品装着装置を提供
することを目的とするものである。 【0012】 【課題を解決するための手段】上記課題を解決するため
に本発明の電子部品装着装置は、子部品を吸着可能に
する電子部品吸着面を有するノズルと、前記電子部品吸
着面より上方位置に設置された透過認識照明器と、前記
電子部品吸着面と前記透過認識照明器の間の位置に設置
され直流電圧を供給すると無色透明となり直流電圧を供
給していないときは黒色となる液晶板と、前記電子部品
吸着面より下方位置に設置された電子部品認識装置と、
前記電子部品吸着面と前記電子部品認識装置の間の位置
に設置された反射認識用照明器と、を備え、電子部品を
反射認識する場合は透過認識照明器は消灯し液晶板は黒
色で光を反射せず反射認識用照明器を発光させ電子部品
から反射された光を電子部品認識装置で認識し、電子部
品を透過認識する場合は透過認識照明器を発光させ液晶
板は無色透明となり前記発光を通過させ電子部品の上方
から照射させ光を電子部品認識装置で認識するものであ
る。 【0013】 【作用】本発明は上記した構成によって、反射認識を行
うときは、ノズルに吸着してある電子部品に向けて、
過認識照明器は消灯し液晶板は黒色で光を反射せず反射
認識用照明器を発光させ電子部品から反射された光を電
子部品認識装置で認識する。また、透過認識を行うとき
は、透過認識照明器を発光させ液晶板は無色透明となり
前記発光を通過させ電子部品の上方から照射させ光を電
子部品認識装置で認識する。 【0014】 【実施例】以下、本発明の一実施例について、図面を参
照しながら説明する。図1は本発明の一実施例における
反射および透過認識兼用ノズルの構造を示した構成図で
ある。図1において、19は反射および透過認識兼用ノ
ズル、20は透過認識照明器13の下方に設置され、直
流電圧を供給すると透明無色で供給していないときは黒
色の液晶板、21は透過認識照明器13と液晶板20を
並列につなぐ配線である。 【0015】以上のように構成された反射および透過認
識ノズルについて、以下図2および図3を用いてその動
作を説明する。まず図2は反射認識方法を示すものであ
って、反射認識可能電子部品5は電子部品認識装置2の
上方で反射および透過認識兼用ノズル19の電子部品吸
着面16で装着ヘッド15から供給される真空圧によっ
て保持される。反射および透過認識兼用ノズル19には
装着ヘッド15からは電圧が供給されず、透過認識用照
明器13は消灯していて液晶板20は黒色のままであ
り、光を反射しない。反射認識用照明器11を電子部品
装着装置1から配線17を通して供給された電圧で発光
させ、反射認識可能部品5から反射された光を電子部品
認識装置2で認識する。 【0016】図3は透過認識方法を示すものであって、
透過認識可能電子部品6は同様に電子部品認識装置2の
上方で反射および透過認識兼用ノズル19の電子部品吸
着面16で装着ヘッド15から供給される真空圧によっ
て保持される。反射および透過認識兼用ノズル19には
装着ヘッド15から配線21を通し電圧が供給され、透
過認識照明器13は発光しなおかつ液晶板21は無色透
明になる。したがって、透過認識可能電子部品5の上方
から照射された光を電子部品認識装置2で認識する。 【0017】以上のように本実施例によれば、従来の透
過認識ノズルの照明手段と電子部品吸着面との間に、上
方からの光は通過でき、下方からの光は反射しない手段
を設けることにより、透過認識と反射認識ノズルを兼用
できる。 【0018】 【発明の効果】以上のように本発明によれば、透過認識
照明器と電子部品吸着面との間に上方からの光は通過で
き下方からの光を反射しない液晶板を設けることによ
り、透過認識と反射認識との両方の場合に対応してノズ
ルの共用化ができるものである。これにともない電子部
品装着装置においてノズルの切り替え時間を削減でき、
生産性を向上させることができる。
BACKGROUND OF THE INVENTION [0001] FIELD OF THE INVENTION The present invention relating <br/> the electronic component mounting equipment. 2. Description of the Related Art In recent years, various electronic components have begun to be used with the expansion of the electronic component mounting field, and a nozzle for reflection and transmission has been required as a nozzle for its recognition.
Therefore, there is a demand for means for reducing the number of products and for reducing the switching time of the recognition nozzle in the electronic component mounting apparatus. [0003] A conventional method for mounting an electronic component using a reflection and transmission recognition nozzle will be described below. FIG. 4 shows an electronic component recognition method of a conventional electronic component mounting apparatus. In FIG. 4, 1 is an electronic component mounting device, 2 is an electronic component recognition device, 3 is an electronic component supply device, 4 is a printed circuit board, 5 is an electronic component that can recognize reflection, 6 is an electronic component that can recognize transmission, and 7 is reflection recognition. Nozzle, 8 is a transmission recognition nozzle, 9 is a nozzle standby station, 10 is an empty station, 1
1 is a illuminator for reflection recognition installed above the electronic component recognition device 2, 12 is a blackboard for light absorption installed on the reflection recognition nozzle 7, and 13 is a illuminator for transmission recognition installed on the transmission recognition nozzle 8. , 14 is a horizontal robot, 15 is a horizontal robot 1
4 is a mounting head having a mechanism capable of moving in the horizontal direction, detachably attaching the reflection recognition nozzle 8 and the transmission recognition nozzle 9, supplying a voltage, and having a mechanism capable of vertical movement and horizontal rotation. The recognition and mounting operations of the electronic component mounting apparatus configured as described above will be described. In the electronic component mounting apparatus 1, first, when the electronic component 5 capable of recognizing reflection is supplied by the electronic component supply device 3, the mounting head 15 moves above the electronic component 5 capable of recognizing reflection. The reflection recognizing nozzle 7 set on the mounting head 15 descends, attracts the reflection recognizable electronic component 5, and rises. The mounting head 15 holding the reflection-recognizable electronic component 5 moves to a position above the electronic component recognition device 2.
Here, the reflection recognition illuminator 11 emits light at the voltage supplied from the electronic component mounting device 1 to irradiate the reflection-recognizable electronic component 5 and the blackboard 12, and the electronic component recognition device 2 recognizes the reflected light and mounts it. The attitude of the reflection-recognizable electronic component 5 is corrected by rotating the reflection recognition nozzle 7 with the head 15. The reflection-recognizable electronic component 5 having completed the posture correction is mounted on the mounting head 15.
As a result, the printed circuit board 4 is moved to a position above a predetermined mounting position, and the reflection recognition nozzle 8 is lowered, sucked off, and raised to be mounted. Subsequently, when the electronic component 6 that can be recognized by transmission is supplied by the electronic component supply device 3, the mounting head 15 once moves to the nozzle standby station 9 where the empty station 10 is located. At that position, the mounting head 15
The reflection recognition nozzle 7 is placed in the empty station 10. The transmission recognition nozzle 8 prepared in the nozzle standby station 9 is set to the empty mounting head 15. The mounting head 15 on which the transmission recognition nozzle 8 can be set moves to a position above the transmission-recognizable electronic component 6. And the mounting head 1
5, the transmission recognition nozzle 8 is lowered, and the transmission-recognizable electronic component 6 is sucked and raised. Electronic component 6 capable of transparent recognition
Is moved to a position above the electronic component recognition device 2. Here, the transmission recognition illuminator 13 is caused to emit light at the voltage supplied from the mounting head 15, the transmitted light is recognized by the electronic component recognition device 2, and the transmission recognition nozzle 8 is rotated by the mounting head 15 so that the transmission-recognizable electron is emitted. The posture of the component 6 is corrected. Transparent recognizable electronic component 5 whose posture has been corrected
Is mounted above the predetermined mounting position of the printed circuit board 4 by the mounting head 15, and the transmission recognition nozzle 8 is lowered, sucked off, and raised to mount. The electronic component mounting apparatus performs the above operation by selecting an appropriate recognition nozzle each time the electronic component changes, and repeatedly executes a series of operations of sucking, recognizing, and mounting the electronic component. Here, the necessity of selectively using the reflection recognition nozzle and the transmission recognition nozzle depending on the difference in the conventional recognition method is shown in FIGS.
This will be described with reference to FIG. In FIG. 5, reference numeral 16 denotes an electronic component suction surface, and 17 denotes a reflection recognition illuminator 11 from the electronic component mounting apparatus 1.
In FIG. 6, reference numeral 18 denotes a wiring for supplying power from the mounting head 15 to the transmission recognition illuminator 13. FIG. 5 shows a reflection recognition method. The reflection recognition illuminator 11 is provided between the electronic component recognition device 2 and the electronic component suction surface 16 of the reflection recognition nozzle 7, and the blackboard 12 is mounted on the electronic component suction surface 16 of the reflection recognition nozzle 7.
It is provided above. Here, the role of the blackboard 12 is provided because it is necessary to darken the back of the electronic component in order to clearly distinguish the light reflected by the reflection-recognizable electronic component 5 from the back thereof. The reflection-recognizable electronic component 5 is sucked by the reflection-recognition nozzle 7 mounted on the mounting head 15, and is reflected toward the reflection-recognizable electronic component 5 by the voltage supplied from the electronic component mounting apparatus 1 through the wiring 17. The recognition illuminator 11 emits light,
The light reflected from the reflection-recognizable electronic component 5 and the blackboard 12 is recognized by the electronic component recognition device 2. FIG. 6 shows a transmission recognition method. The transmission recognition illuminator 13 is provided in the transmission recognition nozzle 8 at a position above the electronic component suction surface 16. The transmission-recognizable electronic component 6 is sucked by the transmission recognition nozzle 8 mounted on the mounting head 15, and is directed toward the transmission-recognizable electronic component 6 by a voltage supplied from the mounting head 15 through the wiring 18 for transmission recognition illumination. The device 13 irradiates light and transmits the light transmitted through the transmission-recognizable electronic component 6 to the electronic component recognition device 2.
Recognize in. [0010] However, in the above conventional configuration, when recognizing an electronic component, in addition to an electronic component recognizing device having an illuminator for recognizing the electronic component, a reflection recognizing nozzle is used for reflection recognition. As a blackboard that does not reflect light above the electronic component adsorption surface, transmission recognition requires a dedicated nozzle with a transmission recognition illuminator uniquely above the electronic component adsorption surface as a transmission recognition nozzle, and furthermore, electronic components There has been a problem that the mounting device requires time to replace the dedicated nozzle. SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a recognition nozzle that can serve both as a reflection recognition nozzle and a transmission recognition nozzle, so that an electronic component mounting apparatus can eliminate the time for replacing the dedicated nozzle. It is intended to provide a device. [0012] SUMMARY OF THE INVENTION The electronic component mounting apparatus of the present invention in order to solve the above problems, a nozzle having an electronic component suction surface that allows adsorption of electronic components, the electronic component suction surface A transmission recognition illuminator installed at a higher position, and a colorless and transparent when supplied with a DC voltage and installed at a position between the electronic component suction surface and the transmission recognition illuminator , providing a DC voltage.
A liquid crystal plate that is black when not supplied, and the electronic component
An electronic component recognition device installed below the suction surface,
Position between the electronic component suction surface and the electronic component recognition device
Illuminator for reflection recognition installed in
For reflection recognition, the transmission recognition illuminator is turned off and the liquid crystal panel is black.
An electronic component that emits light from a reflection recognition illuminator without reflecting light in color
The light reflected from the
When transmissive recognition of the product
The board becomes colorless and transparent, allowing the light to pass through and above the electronic components.
Irradiates light from the electronic component recognition device . [0013] by [action] The present invention is configured as described above, when performing reflection recognition toward the electronic component that is adsorbed to the nozzle, Toru
The over-recognition illuminator is turned off and the liquid crystal panel is black and reflects without reflecting light
The recognition illuminator emits light and reflects the light reflected from the electronic components.
To recognize the child component recognition apparatus. Further, when performing transparently recognition, the liquid crystal panel to emit the transmitted recognition illuminator becomes colorless and transparent
The light is allowed to pass and emitted from above the electronic component, and the light is recognized by the electronic component recognition device. An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram showing a structure of a nozzle for both reflection and transmission recognition according to an embodiment of the present invention. In FIG. 1, 19 is a nozzle for both reflection and transmission recognition, 20 is installed below the transmission recognition illuminator 13, is transparent and colorless when a DC voltage is supplied, and is black when not supplied, and 21 is transmission recognition illumination. This is a wiring connecting the device 13 and the liquid crystal plate 20 in parallel. The operation of the reflection and transmission recognition nozzle configured as described above will be described below with reference to FIGS. FIG. 2 shows a reflection recognition method. The reflection-recognizable electronic component 5 is supplied from the mounting head 15 on the electronic component suction surface 16 of the reflection / transmission recognition nozzle 19 above the electronic component recognition device 2. It is held by vacuum pressure. No voltage is supplied from the mounting head 15 to the reflection / transmission recognition nozzle 19, the transmission recognition illuminator 13 is turned off, the liquid crystal plate 20 remains black, and does not reflect light. The reflection recognition illuminator 11 is illuminated by the voltage supplied from the electronic component mounting device 1 through the wiring 17, and the light reflected from the reflection recognizable component 5 is recognized by the electronic component recognition device 2. FIG. 3 shows a transmission recognition method.
The transmission-recognizable electronic component 6 is similarly held above the electronic component recognition device 2 by the vacuum pressure supplied from the mounting head 15 on the electronic component suction surface 16 of the nozzle 19 for both reflection and transmission recognition. A voltage is supplied to the reflection / transmission recognition nozzle 19 from the mounting head 15 through the wiring 21, the transmission recognition illuminator 13 emits light, and the liquid crystal plate 21 becomes colorless and transparent. Therefore, the light irradiated from above the transmission-recognizable electronic component 5 is recognized by the electronic component recognition device 2. As described above, according to the present embodiment, between the illuminating means of the conventional transmission recognition nozzle and the suction surface of the electronic component, means for passing light from above and not reflecting light from below is provided. Thus, the transmission recognition nozzle and the reflection recognition nozzle can be shared. As described above, according to the present invention, transmission recognition is performed.
By providing a liquid crystal panel between the illuminator and the suction surface of the electronic components that allows light from above to pass through and does not reflect light from below, the nozzles are compatible with both transmission recognition and reflection recognition. >it's also Ru can be shared by Le. Along with this Te electronic component mounting apparatus smell can reduce the switching time of Roh nozzle,
Productivity can be improved.

【図面の簡単な説明】 【図1】本発明の一実施例における反射および透過認識
兼用ノズルの一部断面側面図 【図2】同実施例における反射認識の動作説明のための
説明図 【図3】同実施例における透過認識の動作説明のための
説明図 【図4】従来の電子部品認識機能付き電子部品装着装置
の斜視図 【図5】従来の反射認識ノズルの説明図 【図6】従来の透過認識ノズルの説明図 【符号の説明】 1 電子部品装着装置 2 電子部品認識装置 3 電子部品供給装置 4 プリント基板 5 反射認識可能電子部品 6 透過認識可能電子部品 7 反射認識ノズル 8 透過認識ノズル 9 ノズル待機ステーション 10 空きステーション 11 反射認識用照明器 12 黒板 13 透過認識用照明器 14 水平ロボット 15 装着ヘッド 16 電子部品吸着面 19 反射および透過認識兼用ノズル 20 液晶板
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partial cross-sectional side view of a nozzle for both reflection and transmission recognition in one embodiment of the present invention. FIG. 2 is an explanatory diagram for explaining the operation of reflection recognition in the embodiment. 3 is an explanatory view for explaining the operation of transmission recognition in the embodiment. FIG. 4 is a perspective view of a conventional electronic component mounting apparatus with an electronic component recognition function. FIG. 5 is an explanatory view of a conventional reflection recognition nozzle. Description of conventional transmission recognition nozzles [Description of reference numerals] 1 Electronic component mounting device 2 Electronic component recognition device 3 Electronic component supply device 4 Printed circuit board 5 Reflection-recognizable electronic component 6 Transmission-recognizable electronic component 7 Reflection recognition nozzle 8 Transmission recognition Nozzle 9 Nozzle waiting station 10 Empty station 11 Reflection recognition illuminator 12 Blackboard 13 Transmission recognition illuminator 14 Horizontal robot 15 Mounting head 16 Electronic component suction surface 19 Reflection and transmission Recognition / Combined Nozzle 20 Liquid Crystal Board

フロントページの続き (58)調査した分野(Int.Cl.7,DB名) H05K 13/04 Continuation of front page (58) Fields surveyed (Int.Cl. 7 , DB name) H05K 13/04

Claims (1)

(57)【特許請求の範囲】 【請求項1】子部品を吸着可能にする電子部品吸着面
を有するノズルと、 前記電子部品吸着面より上方位置に設置された透過認識
照明器と、 前記電子部品吸着面と前記透過認識照明器の間の位置に
設置され直流電圧を供給すると無色透明となり直流電圧
を供給していないときは黒色となる液晶板と、 前記電子部品吸着面より下方位置に設置された電子部品
認識装置と、 前記電子部品吸着面と前記電子部品認識装置の間の位置
に設置された反射認識用照明器と、を備え、 電子部品を反射認識する場合は透過認識照明器は消灯し
液晶板は黒色で光を反射せず反射認識用照明器を発光さ
せ電子部品から反射された光を電子部品認識装置で認識
し、 電子部品を透過認識する場合は透過認識照明器を発光さ
せ液晶板は無色透明となり前記発光を通過させ電子部品
の上方から照射させ光を電子部品認識装置で認識する電
子部品装着装置。
(57) Patent Claims 1. A electronic electronic component suction surface that allows adsorption of components
Nozzle having an aperture and transmission recognition installed above the electronic component suction surface
An illuminator , installed at a position between the electronic component suction surface and the transmission recognition illuminator, becomes colorless and transparent when a DC voltage is supplied, and becomes a DC voltage.
A liquid crystal plate that is black when the electronic component is not supplied, and an electronic component installed below the electronic component suction surface.
A recognition device, and a position between the electronic component suction surface and the electronic component recognition device.
And a reflection recognition illuminator installed in the transmission recognition illuminator if reflects recognizing an electronic component is turned off
The liquid crystal panel is black and does not reflect light and emits a reflection recognition illuminator.
Recognize light reflected from electronic components with an electronic component recognition device
When the electronic component is recognized through transmission, the transmission recognition illuminator is emitted.
The liquid crystal panel becomes colorless and transparent, allowing the light emission to pass
Irradiates light from above and recognizes light with the electronic component recognition device.
Child component mounting device.
JP32558793A 1993-12-24 1993-12-24 Electronic component mounting device Expired - Fee Related JP3461546B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32558793A JP3461546B2 (en) 1993-12-24 1993-12-24 Electronic component mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32558793A JP3461546B2 (en) 1993-12-24 1993-12-24 Electronic component mounting device

Publications (2)

Publication Number Publication Date
JPH07183696A JPH07183696A (en) 1995-07-21
JP3461546B2 true JP3461546B2 (en) 2003-10-27

Family

ID=18178550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32558793A Expired - Fee Related JP3461546B2 (en) 1993-12-24 1993-12-24 Electronic component mounting device

Country Status (1)

Country Link
JP (1) JP3461546B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107148213A (en) * 2017-07-17 2017-09-08 哈尔滨工业大学 A kind of chip mounter suction nozzle head with light source

Also Published As

Publication number Publication date
JPH07183696A (en) 1995-07-21

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