JP3464438B2 - Waveguide optical components - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a waveguide type optical component in which an optical fiber is connected to an optical waveguide circuit module used in the field of optical communication and the like, and more specifically, to an optical waveguide incorporated in a holder. The present invention relates to a waveguide type optical component that can exhibit excellent characteristics of an optical waveguide circuit on a wave circuit board and that has a small average value and variation in connection loss between the optical waveguide circuit and an optical fiber.

[0002]

2. Description of the Related Art With the advancement of optical communication technology, various optical waveguide circuits such as an optical branching device, an optical multiplexer / demultiplexer, and an optical switch are required in addition to the conventional light source, optical fiber, and light receiver. . Moreover, these optical waveguide circuits are beginning to be required to be large-scale and highly functional in addition to the requirements for reduction of insertion loss, reduction of reflection amount at the waveguide-fiber connection interface, and improvement of temperature stability. For this reason, the optical waveguide circuit needs to have a size of about 3 inches to 5 inches over the entire surface of the substrate and to precisely control the phase of the propagating light.

In order to satisfy these requirements, not only the characteristics of the optical waveguide circuit chip itself are improved, but also the structure of the optical waveguide circuit module for holding the chip and performing fiber connection is optimized,
Furthermore, it is important to optimize the structure of a waveguide type optical component in which an optical fiber is connected to this optical waveguide circuit module.
That is, 1) realization of precise alignment between fiber waveguides, 2) realization of precision polishing of the end face of the waveguide and the end face of the fiber, 3) attachment of the optical waveguide circuit board to a holder without stress, and 4) height. There is a need for a waveguide-type optical component having a structure that satisfies all four conditions of achieving mechanical strength. In particular, when the optical waveguide circuit module has the above-mentioned large-sized substrate, the existence of the warp of the substrate cannot be ignored,
It is a particularly important requirement that the substrate be held by the holder in a stress-free state even when warped.

Further, an optical waveguide circuit having an active function such as an optical waveguide circuit utilizing a change in refractive index of the optical waveguide circuit due to temperature, that is, a thermo-optical effect, or a hybrid optical waveguide circuit having a semiconductor element mounted on a substrate. In this case, in addition to the above four requirements, it is required that the optical waveguide circuit board can radiate heat.

Below, an example of the structure of a conventional optical waveguide circuit module is shown to clarify the problems of the prior art.

FIG. 1 shows an example of a conventional typical optical waveguide circuit module [E. J. Murphy et a
l, "Permanent attachment o
f single-mode fiber array
s to waveguide ", IEEE J. Li
ghtwave Tech. , LT-3, pp. 795
-799, 1985]. This module has a structure in which pressing plates 3 for connecting optical fibers 2 are provided on the upper surfaces of both ends of an optical waveguide circuit board 1, and optical fiber arrays 4 for fixing the optical fibers 2 are connected to the end surfaces of the pressing plates 3. .

[0007] This fiber connecting method has been conventionally well used because of its simple structure. According to this method, precise alignment between the optical waveguide circuit (optical circuit section) 5 provided in the central portion of the substrate 1 and the optical fiber 2 is possible, and the warp of the substrate 1 can be ignored. For such a small optical waveguide circuit, it is possible to easily realize mounting on the optical waveguide circuit board without applying stress.

However, in this structure, since the optical waveguide circuit board 1 is exposed, there is a problem that the mechanical strength is weak. In particular, in the case of an optical waveguide circuit formed on a silicon (Si) substrate, there is an extremely high risk of damaging the optical waveguide circuit board, and the reliability of the optical waveguide circuit module is significantly reduced. Furthermore, in a large-sized optical waveguide circuit board having a warp of the board, not only the warp in the longitudinal direction but also in the lateral direction cannot be ignored. When this method is applied to such a large-sized substrate, in order to provide the pressing plate 3, there is no choice but to eliminate the lateral warp. For this reason, a large stress due to mounting is applied to the optical circuit unit 5, and as a result, there arises a problem that the characteristics of the optical waveguide circuit are impaired.

On the other hand, a conventional optical waveguide circuit module having a structure in which the optical waveguide circuit board is not exposed is disclosed in Japanese Patent Laid-Open No. 62-73208. As shown in FIG. 2, this module comprises an optical waveguide circuit board unit 9 in which the optical waveguide circuit board 1 is sandwiched between two flat bases 6 and 7 and fixed by an adhesive 8 so that the substrate surface is not exposed. And then Figure 3
As shown in FIG. 3, the optical fiber array 4 for fixing the optical fiber 2 is connected to both ends of the unit 9. With such a structure, since the optical waveguide circuit board 1 is not exposed, the risk of damage to the optical waveguide circuit board, which was a problem in the module shown in FIG. 1, is greatly reduced.

However, in this structure, when the optical waveguide circuit board 1 is fixed to the flat bases 6 and 7, since the adhesive 8 is applied to the entire surface of the substrate, the stress due to the curing shrinkage of the adhesive is applied to the optical waveguide circuit. In addition, as a result, there arises a problem that the characteristics of the optical waveguide circuit change at the chip stage and after mounting. In particular, when the optical waveguide circuit board 1 has a finite curvature radius of curvature, when the optical waveguide circuit board 1 is sandwiched between the flat bases 6 and 7, it is necessary to eliminate the warp of the substrate.
As a result, an extremely large stress is applied to the optical waveguide circuit board 1. Furthermore, when there is a mismatch in the linear expansion coefficient between the flat bases 6 and 7 and the optical waveguide circuit board 1, when the environmental temperature changes, stress is applied to the optical waveguide circuit board 1 and its characteristics are changed. It could fluctuate.

A structure similar to the module having the structure shown in FIG. Presby, Chris
topher A Edwards, “Package
ngof glass waveguide sili
con devices "Optical Engineering"
eering 31 (1), 141-143 (Janu
ary, 1922), and U.S.P. S. Pat. No.
5, o76,654 "Packing of si
licon opticalo component
s "Herman M. presby, Filed O
ct. 29, 1990. In these documents, UV adhesive is applied to the entire upper surface of the waveguide circuit board,
A mounting structure in which a quartz cover is bonded to the upper surface via this adhesive is described. The module of this structure also has the same problem as the module of FIG.

FIG. 4 shows an optical fiber 2 and an optical waveguide circuit board 1.
"Japanese Patent Application Laid-Open No. 1-234806", which is an example of a module structure directed to non-centering connection with. In this module,
First, the positioning step 1a is formed on both ends of the optical waveguide circuit board 1 on the circuit surface side, and the optical waveguide circuit 5 is formed on the convex portion (central portion) 1b sandwiched by the step 1a. On the other hand, the base 10
A concave portion 10b having a size corresponding to the convex portion 1b of the optical waveguide circuit board 1 is formed on the side, and the convex portion 1b is fitted into the concave portion 10b. As a result, this module is intended to realize the coupling of the optical fiber 2 and the optical waveguide circuit 5 of the optical waveguide circuit board 1 without alignment. In this module structure, when fixing the optical waveguide circuit board 1 to the base 10, the step 1a portion where the optical waveguide circuit 5 is not formed and the base 10 are brought into contact and fixed. It is possible to prevent the curing shrinkage stress of the fixing agent such as solder from being directly applied to the optical waveguide circuit 5.

However, in this mounting structure, although the labor of aligning the optical fiber 2 and the optical waveguide circuit board 1 is certainly saved, the positioning accuracy of the optical fiber 2 and the optical waveguide circuit 5 is determined by the step 1a of the substrate 1. Processing accuracy, that is, the processing accuracy of the convex portion 1b of the substrate 1 and the processing accuracy of the concave portion 10b of the base 10, and considering the manufacturing yield, the accuracy is at most about 3 to 5 μm, and the connection loss is 0. .5-1
It is as large as dB. Further, when mounting an optical waveguide circuit board having a finite curvature radius of curvature, the substrate must be fixed to the housing after the warpage of the optical waveguide circuit board is eliminated. This is because if the substrate is mounted on the housing with the warp left, the positions of the optical waveguide circuit and the fiber do not match at the end of the optical waveguide circuit. With this structure, it is possible to prevent the curing shrinkage stress of the curing agent from being directly applied to the optical waveguide circuit 5, but a large stress due to the elimination of the warp of the substrate is applied to the optical waveguide circuit board 1, and a large variation in the characteristics of the optical waveguide circuit 5 is caused. The problem arises of bringing.

As described above, in the structure of the conventional optical waveguide circuit module which constitutes the conventional waveguide type optical component, it is not possible to mount a large optical waveguide circuit board in which the warp of the board cannot be ignored without stress load. It was difficult. Therefore, in the prior art, it is not possible to meet all the requirements of optical waveguide circuit modules for optical components: precise alignment between the fiber and the waveguide, holding the substrate without stress loading, and achieving high mechanical strength. could not.

Further, as a problem common to these conventional techniques, the problem of end face precision polishing can be pointed out. That is, the Young's modulus of glass, silicon, or metal, which is the main material used in the optical waveguide circuit module and the optical fiber array, is on the order of 10 ³ to 10 ⁶ kg / mm ² , which is used for fixing the optical waveguide circuit and the base. It is 1 to 5 orders of magnitude higher than the typical fixative used, the adhesive. The optical waveguide circuit module is composed of such composite materials having different Young's moduli. In the conventional optical waveguide circuit module and optical fiber array using a typical fixative (adhesive), when the end face is polished, first, the fixative layer having a low Young's modulus is selectively removed by polishing. The waveguide substrate having a high Young's modulus, the optical fiber and its terminal holder are exposed. Further, if polishing is continued, the probability that the end face of the optical waveguide circuit or the end face of the fiber will be damaged due to the polishing agent accumulated in the recess of the removed fixative layer trace. Therefore, when the optical waveguide circuit end face or the optical fiber end face of the conventional structure is polished, the waveguide circuit substrate is damaged or scratches are left on the polished face of the optical waveguide circuit substrate or the optical fiber end face, resulting in a good connection end face. As a result, there is a problem that the connection loss increases and the return loss deteriorates.

Further, as another problem common to the prior arts, the heat radiation of the optical waveguide circuit board is not taken into consideration at all, and it is difficult to apply it to a component utilizing the thermo-optic effect or a hybrid optical waveguide circuit. There was also a problem.

[0017]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a large-sized optical waveguide circuit board in which the warp of the board is not neglected without stress load. Low loss, which can be implemented
An object is to provide a waveguide type optical component having high return loss and high mechanical strength.

[0018]

A waveguide type optical component of the present invention comprises an optical waveguide circuit module in which an optical waveguide circuit board is held by a substrate holder, and an input / output optical fiber at a terminal holder. an optical fiber module consisting held by the can be coupled, the optical waveguide circuit module, optical output waveguide portion of the optical waveguide circuit board 15
Via a fixative having a Young's modulus of 0 kg / mm ² or more
Composed of glass material with sufficient hardness to be polished
It is held by the spacer (part) of the board holder
Alternatively, the optical input / output waveguide section of the optical waveguide circuit board is
Via a fixing agent having a Young's modulus of 150 kg / mm2 or more
Made of a glass material with sufficient hardness to be polished
Is held by a protective plate and is fixed between the optical waveguide circuit board and the substrate holder by an elastic adhesive , and the optical fiber module is attached to a polished optical waveguide circuit end surface of the optical waveguide circuit module. It is characterized in that the end faces of the optical fibers are connected.

Here, one mode of the waveguide type optical component is as follows.
The glass material having sufficient hardness is borosilicate glass.
On the polished optical waveguide end face of the optical waveguide circuit module
The optical fiber has a Young's modulus of 150 kg / mm ² or more.
Formed by borosilicate glass through a fixative having
Of the optical fiber module fixed to the terminal holder
The polished optical fiber end surface is bonded via UV curable adhesive.
Connected .

Further, the optical waveguide circuit board has a linear optical input waveguide portion and an optical output waveguide portion, and has a predetermined function between the optical input waveguide portion and the optical output waveguide portion. An optical circuit section, wherein the optical circuit section and the substrate holder are placed in a non-contact state, and each of the linear optical input waveguide section and optical output waveguide section is provided.
At least a part of them may be fixed to the substrate holder by the fixing agent.

In the present invention, as the fixing agent for fixing the optical waveguide circuit board to the holder, various adhesives of thermosetting type and room temperature curing type, solder, or the like may be used in addition to the ultraviolet curing adhesive. it can.

[0022]

According to the present invention having the above-described structure, it is possible to mount a large-sized optical waveguide circuit board in which the warp of the board is not neglected, without load of stress, low loss, high return loss, and high mechanical strength. It is possible to provide a waveguide type optical component having strength.

[0023]

EXAMPLES The present invention will now be described in more detail with reference to examples.

Reference Example 1 FIG. 5 shows a first reference example, and is a cross-sectional view of an optical waveguide circuit module constituting a waveguide type optical component . Reference numeral 1 is an optical waveguide circuit substrate in which a quartz single mode optical waveguide circuit 5 is formed on a silicon substrate, and 20 is a substrate holder. The substrate 1 is held by the holder 20 with its both ends fixed, and a gap g is formed between the substrate 1 and the holder 20 at the intermediate portion.

As shown in FIG. 6, the substrate 1 has a light input waveguide portion 5a and a light output waveguide portion 5b which are linear optical waveguides at both ends thereof, and a curved optical waveguide which becomes a 1 × 4 optical branch circuit at an intermediate portion thereof. A wave circuit (optical circuit section) 5 is formed. As shown in FIG. 5, the optical waveguide circuit board 1 is bonded to the holder 20 at the optical input waveguide portion 5a and the optical output waveguide portion 5b, and the optical circuit portion 5 having a branching function is attached to the holder 20. No contact with 20.

The holder 20 is, as shown in FIG.
Lower frame 21, spacers 22a, 22b, 22c,
22d and the pressing plate 23 are composed of 6 parts of 3 types. In order to hold the substrate 1 in such a holder 20, spacers 2 are attached to both ends of the lower frame 21 by an adhesive.
2a and 22b are bonded together, and then the spacers 22a and 22b
An adhesive is applied to the surface of b, and the substrate 1 is placed on and adhered to this. Furthermore, an adhesive is applied to both ends of the substrate 1,
The spacers 22c and 22d are adhered, and finally the pressing plate 2
The optical waveguide circuit module is completed by mounting and bonding 3.

Next, the optical passage loss of the optical waveguide circuit board is 6.
A 4 ± 0.1 dB 1 × 4 splitter was modularized with the above structure to measure the light passage loss. As a result, the light transmission loss is also 6.4 ±
It was 0.1 dB, and it was found that the characteristics of the optical waveguide circuit board were completely maintained even after being modularized. Also, when the heat cycle test of this module was performed, −
Loss change in the temperature range of 20 ℃ to 70 ℃ is ± 0.1dB
It was below.

In this reference example , the spacer 22 is provided in order to make the optical circuit portion 5 of the optical waveguide circuit board 1 non-contact.
Although a to 22d are used, when the pressing plate 23 and the lower frame 21 are processed, the spacers may be integrally processed without any problem. Although the Y-branch type branch circuit has been described as the curved optical waveguide circuit 5, it is needless to say that the present invention can be applied to an optical waveguide circuit board having a curved optical waveguide circuit such as a directional coupling group. Furthermore, in this reference example , the case of a silica-based optical waveguide circuit has been described, but in addition to this, it can be applied to various waveguide circuits such as a multi-component glass-based optical waveguide circuit and a plastic optical waveguide circuit. Needless to say.

Reference Example 2 FIG. 8 shows a second reference example and is a perspective view of an optical waveguide circuit module constituting a waveguide type optical component . Reference numeral 1 is an optical waveguide circuit board on which an optical waveguide circuit 5 is formed, 2 is an optical fiber connected to the optical waveguide circuit 5, and 30 is a box-shaped holder for holding the optical waveguide circuit board 1. Further, 31 is a heating element formed on the optical waveguide circuit 5, 32 is a pad for supplying electric power to the heating element 6, 33 is an ointment-like thermally conductive resin , 3
Reference numeral 4 denotes an elastic adhesive for fixing the substrate 1 to the holder 30.

As a specific example of the mounting structure shown in FIG.
Assuming that the box-shaped holder 30 is made of silicon and the box-shaped holder 30 is made of copper, the linear expansion coefficient a1 of silicon is 2.3 ppm, and the linear expansion coefficient a2 of copper is 16.5 ppm. The length in the plane parallel to the substrate surface of the optical waveguide circuit board 1 is L
And the environmental temperature changes by ΔT, the stress S acting on the silicon substrate is

[0031]

[Expression 1] S = k · L · Δa · ΔT (I) However, k is a proportional coefficient, and Δa = a2-a
It is 1.

From the equation (I), it can be seen that the stress S increases as the dimension L increases, the linear expansion coefficient difference Δa increases, and the temperature change ΔT increases. However, the stress S also changes depending on the coefficient k. That is, k can be made as small as possible (ideally zero), and the stress S can be minimized if possible.

Conventionally, since the silicon substrate 1 is fixed to the holder 30 using a thermosetting type heat conductive adhesive, the proportional coefficient k is considerably large, and the stress S causes the optical waveguide circuit 5 to move. The characteristic deterioration was remarkable. On the contrary,
In this reference example , the silicon substrate 1 is adhered to the holder 30 with an ointment-like thermally conductive resin 33, and after heat dissipation treatment, a predetermined portion around the silicon substrate 1 is fixed to the holder 30 with an elastic adhesive 34. Therefore, the elastic adhesive 34 absorbs the displacement between the two substrates, despite the large difference in the coefficient of linear expansion. Almost no stress S was generated in the silicon substrate 1. Therefore, even if the characteristics of the optical waveguide circuit 5 are deteriorated,
It was hardly seen.

In FIG. 8, the four corners of the silicon substrate 1 are fixed to the holder 30 with the elastic adhesives 34, but in the present reference example , the fixing positions are the mounting form of the optical waveguide circuit board and the optical circuit. You can freely select the position.

As described above, in the mounting structure of the optical waveguide circuit board of the optical component of the present reference example , the optical waveguide circuit board 1 is adhered to the box-shaped holder 30 with the ointment-like heat conductive resin 33, and the heat radiation processing is performed. Since a predetermined portion around the optical waveguide circuit board 1 is fixed to the holder 30 with the elastic adhesive 34, elastic adhesion is achieved despite the large linear expansion coefficient difference between the optical waveguide circuit board 1 and the holder 30. The agent 34 has an advantage of absorbing the displacement between the substrate 1 and the holder 30 and almost eliminating the generation of stress.

(Embodiment 3) FIGS. 9 to 21 show one mode of an embodiment of the present invention, and are explanatory views of an optical waveguide module structure constituting a waveguide type optical component of the present invention. First, the configuration of this embodiment will be described.

FIG. 9 is an exploded perspective view for explaining the structure of the optical waveguide circuit module which constitutes the waveguide type optical component of the present invention. In the figure, 1 is an optical waveguide circuit board, and this optical waveguide circuit board 1 is formed by forming an optical waveguide circuit layer 1B having an optical waveguide circuit on a substrate 1A. The dimensions of the substrate are 4 mm width and 20 mm length. Reference numeral 40 is a gutter-shaped lower holder having a side wall for holding the optical waveguide circuit board 1, and 41 is an upper holder. The upper holder 41 is composed of a spacer 41a and an upper plate 41b.

Here, the optical waveguide circuit board 1 is formed by forming a silica glass optical waveguide circuit layer 1B on a silicon substrate 1A. The optical circuit portion 5 formed on the optical waveguide circuit layer 1B of the substrate 1 is, as shown in FIG. 10, a Mach-shaped structure in which two directional coupling portions are connected by two optical waveguide circuits having mutually different lengths. Four Zender (Mach-Zehnder) interference circuits 42 are integrated in parallel. Further, on both sides of the optical circuit section (interference circuit section) 5, an optical input section 5a and an optical output section 5b, which are linear waveguides, are provided. The interference circuit 42 is a coupler that splits the signal light incident from one input waveguide into two waveguide output sections. The optical path length difference between the two optical paths is controlled with a wavelength-order accuracy, and the branching characteristics have no wavelength dependence over the wavelength range of 1.3 μm to 1.6 μm, that is, the cross port light intensity Icr and the through port A ratio (Icr / Ith) = 20% to the light intensity Ith is realized.

As described above, the optical waveguide circuit of the substrate 1 of this embodiment controls the optical path length on the order of wavelength. Therefore, when stress is applied from the outside when mounting the optical waveguide circuit substrate 1, a large amount of stress is exerted. Characteristic variation is caused.
That is, when stress is applied to the optical waveguide circuit, the refractive index of the optical waveguide circuit changes due to the photoelastic effect, and as a result, the optical path length difference in the interference circuit 42 changes, causing branching variation.
When mounting a substrate having an optical waveguide circuit that performs such precise optical path length control, it is essential to adopt a module structure that does not apply stress to the substrate.

In this embodiment, for this purpose, a module structure as shown in FIGS. 9 and 11 and 12 is used. FIG. 11 shows the substrate 1 and the holders 40 and 4 shown in FIG.
FIG. 2 is a side sectional view of the optical waveguide circuit module in which 1 and 2 are assembled, viewed in the longitudinal direction. The optical waveguide circuit substrate 1 has a warp due to a difference in linear expansion coefficient between silicon that constitutes the substrate 1A and quartz glass that constitutes the circuit layer 1B.
The radius of curvature of this warp is about 10 to 50 m. Since the length of this substrate in the lateral direction is as short as 4 mm, in this substrate 1, even if all sides are fixed to the holder in the direction along the surface of the light input / output end face (the lateral direction of the substrate). There is no significant warpage that causes distortion that affects optical characteristics. In FIG. 11, only the vicinity of the optical input / output waveguide portions 5a and 5b of the optical waveguide circuit board 1 is fixed to the lower holder 40 by the adhesive 14 so that the warp curvature does not change. Further, the upper holder 41 is provided with a spacer 41a only near the optical input / output waveguide portions 5a and 5b of the optical waveguide circuit board 1.
Is fixed, and the upper plate 41b is fixed therethrough. All of these are fixed by the adhesive 14. In this embodiment, the holders 40 and 41 are made of borosilicate glass material. This material has a coefficient of linear expansion almost equal to that of the silicon substrate, and has a light transmittance up to the ultraviolet range. Since the holders 40 and 41 are made of an ultraviolet ray transmitting material, an ultraviolet ray curing adhesive agent is used as the adhesive agent 14. Further, this adhesive is a hard material having a Young's modulus of 150 kg / mm ² in consideration of polishing of the end face of the optical waveguide circuit.

FIG. 12 is a view showing the end face of the optical waveguide circuit module 43. The periphery of the optical waveguide circuit board 1 is filled with an ultraviolet curing adhesive 14 which is a fixing agent without a gap. Both end faces of the optical waveguide circuit module 43 are precisely polished before fiber connection.

Next, the effect of the optical waveguide circuit module forming the optical component of the third embodiment will be described.

The first effect is that the mounting of the substrate can be realized without applying stress to the substrate. In the third embodiment, as described above, when the optical waveguide circuit board 1 is held in the holders 40 and 41, only the vicinity of the optical input / output waveguides 5a and 5b is fixed to the holders 40 and 41 by the fixing agent 14 to prevent stress. The sensitive interference circuit unit 5 is attached to the casings 40 and 41 and the fixing agent 14.
And not in contact with. As a result of such a structure, even an optical waveguide circuit board having a warp can be held in a holder without changing the original curvature of the warp. The optical waveguide circuit characteristics after mounting are shown in FIG. As a result of adopting such a structure, it is possible to prevent stress associated with mounting from being applied to the optical waveguide circuit board, so that 1.3 to 1.6 as shown in FIG.
A wavelength-independent characteristic of a branching ratio of 20% was realized in the wavelength range of μm.

In the third embodiment, borosilicate glass having a linear expansion coefficient similar to that of the silicon substrate is used as the holder material for holding the optical waveguide circuit board 1. Therefore, the optical circuit characteristics with respect to the environmental temperature fluctuations are used. Fluctuation can be prevented. FIG. 14 shows the result of a heat cycle test conducted to confirm this effect. The measurement is 1.
It was carried out at a wavelength of 3 μm. It was confirmed that the loss variation of the optical waveguide circuit was within ± 0.1 dB with respect to the temperature variation of −40 to 85 ° C., and the temperature characteristic was good.

Next, in order to confirm the effect of the third embodiment, as a comparative example, this optical waveguide circuit board 1 made of borosilicate glass was prepared by the conventional method shown in FIGS. Mounting was carried out by a method in which a fixing agent was applied to the entire surface of the optical waveguide circuit board and sandwiched between two flat bases. As for the characteristics of the optical waveguide circuit after mounting at this time, as shown in FIG. 15, the wavelength independence that was initially present was lost, and the branching ratio was wavelength dependent. Further, when a heat cycle test similar to the above was conducted, loss fluctuation was ± 0.5 dB, which was a large temperature characteristic.

The second effect of the third embodiment is the realization of precision polishing of the end face of the optical waveguide circuit. In this embodiment, the periphery of the end of the optical waveguide circuit board 1 is completely filled with a hard adhesive 14 having a Young's modulus of 150 kg / mm ² or more, as shown in FIG. As a result, it becomes possible to prevent damage to the end portion of the waveguide and occurrence of scratches on the end surface when polishing the end surface of the waveguide. In fact, the connection loss between the fiber and the waveguide at the total of 400 points of 25 modules manufactured according to this example is 0.09 dB / point as the average connection loss and 0.03d as the best value.
B, the worst value was 0.25 dB. Further, the return loss was 46 dB on average, the best value was 48 dB, and the worst value was 45 dB, and fiber connection with low loss and high return loss was realized.

In order to confirm the effect of the third embodiment, FIG. 16 shows variations in connection loss when an optical waveguide circuit module is manufactured using an adhesive having various Young's moduli. In the figure, the average value (▲), the best value (●), and the worst value (◯) of the connection loss measured for 3 modules, that is, 48 connection points, for each adhesive are shown.
If the adhesive is not filled, the probability that the waveguide end will be damaged becomes extremely high. Reflecting this result, the worst value of splice loss reaches almost 3 dB. Once filled with adhesive,
The average value of the connection loss and the loss variation are significantly reduced, and when an adhesive having a Young's modulus of 80 kg / mm ² is used, the average value is 0.3 dB and the worst value is 0.6 dB. This connection loss decreases as the Young's modulus increases, and at the Young's modulus of 130 kg / mm ² , the worst value of the connection loss is 0.4 dB, but the best value is 0.1 dB / point or less. When the Young's modulus is 150 kg / mm ² or more, the worst value is about 0.25 dB. The loss characteristic does not change even if the Young's modulus becomes higher. The return loss also has the same tendency, and the Young's modulus is 80 kg /
When mm ² , the best value is 47 dB and the worst value is 35 d
As for B, the Young's modulus is increased and the worst value is improved. When the Young's modulus is 150 kg / mm ² or more,
The dependency of splice loss on Young's modulus disappeared.

As described above, in the third embodiment, since the end portion of the optical waveguide circuit board is filled with the adhesive having high hardness, damage to the end face during polishing of the end face of the waveguide can be greatly reduced. . In particular, this adhesive has a Young's modulus of 150 k
If a hard material of g / mm ² is used, a precision polished surface can be obtained and an optical waveguide circuit module with good connection characteristics can be realized.

Embodiments 4 and 5 FIGS. 17 and 18 show another embodiment of the present invention.
Shows the embodiment is an exploded perspective view illustrating a structure of an optical waveguide circuit module constituting the waveguide type optical component of the present invention. The difference between the modules of Examples 4 and 5 and the module of Example 3 is that the structures of the lower holder and the upper holder are different.

That is, in the module of the fourth embodiment shown in FIG. 17, the gutter-shaped lower holder 50 is provided with the spacer portions 50a in which both ends of the upper surface are raised, and the upper holder 51 has a spacer. Is integrated as the spacer portion 51a.

Next, in the module of the fifth embodiment shown in FIG. 18, based on the structure of FIG.
The lower holder 60 has a structure in which the side wall of the lower holder 50 is removed. All other constituent elements of the modules of the fourth and fifth embodiments are the same as those of the third embodiment.

In these Embodiments 4 and 5, the purpose of integrating the spacers in each holder is to improve the manufacturing yield of the optical waveguide circuit module of the present invention. That is, in Example 3, since the bottom surface of the lower holder 40 was flush, if the amount of the adhesive dropped on the end portion of the optical waveguide circuit was too large, the adhesive flowed out to the optical interference circuit portion,
There is a case where stress is applied to this portion, and in order to prevent this, it was necessary to accurately control the amount of adhesive dropped. On the other hand, in Examples 4 and 5, as shown in FIG. 19, the upper bottom surface of the lower holder 50 (60) is located at the spacer portion 50a (60).
Since it is concave due to the formation of a), the adhesive 14
It is possible to prevent the liquid from flowing into the concave upper bottom portion of the housing 50 (60) and reaching the optical interference circuit portion 5 which is sensitive to the stress of the substrate 1 even if the dropping amount is large.

In the fifth embodiment (FIG. 18), the lower holder 60 has a side wall-less structure.
This is to reduce the cost of forming. The features described for the fourth embodiment (FIG. 17) also apply for the holder 60 in the fifth embodiment.

The other optical module characteristics were the same as those in Example 3 in both Examples 4 and 5.

(Embodiment 6) FIG. 20 shows another embodiment of the present invention. The difference between the module of the optical component of this embodiment and the module of Embodiments 3 to 5 is as follows. In the holder 70 and the upper holder 71, at least the non-contact portions 70b and 71b with the optical waveguide circuit board 1 are made of an elastic material. 20, holders 70 and 71 have spacer portions 70a and 71a made of a glass material, and non-contact portions 70b and 71 with the substrate 1.
b is made of rubber-like resin. Other components are the same as those in the third to fifth embodiments.

In this embodiment, since the central portion of the holder is made of an elastic material, the linear expansion coefficient between the holders 70 and 71 and the optical waveguide circuit board 1 does not change even if the environmental temperature of the optical waveguide circuit module varies greatly. Even if stress occurs due to alignment,
This stress is not applied to the optical waveguide circuit board 1, and an optical waveguide circuit module that is stable against temperature changes can be realized. Further, since the waveguide end face portion that needs to be polished is made of a glass material having a sufficient hardness, the end face can be polished with high precision as in the third to fifth embodiments. The characteristics realized by the optical waveguide circuit module of the sixth embodiment are similar to those of the third to fifth embodiments.

The optical waveguide circuit module having this structure is effective in the case of an optical waveguide circuit module made of a material in which a holder material matching the linear expansion coefficient of the optical waveguide circuit substrate cannot be found.

(Embodiment 7) FIGS. 21 to 24 show another embodiment of the present invention, and are explanatory views of an optical waveguide circuit module structure which constitutes the waveguide type optical component of the present invention. . First, the configuration of this embodiment will be described.

FIG. 21 is an explanatory diagram of an optical waveguide circuit board. An optical waveguide circuit (optical circuit portion) 5 is formed in the central portion 1b of the optical waveguide circuit substrate 1, and a phase control heater 75 is attached to the optical waveguide circuit 5. Further, an upper protective plate 80a and a lower protective plate 80b are attached to the optical input waveguide portion 5a and the optical output waveguide portion 5b of the substrate 1, respectively.

As the optical waveguide circuit board 1, a quartz glass optical waveguide circuit layer formed on a silicon substrate is used, and the size thereof is 5 cm × 5 cm. This substrate has a warp in both vertical and horizontal directions due to a linear expansion coefficient mismatch between silicon and quartz glass, and the radius of curvature thereof is about 10 to 50 m. In the central portion 1b of the substrate 1, two directional coupling portions (3 dB couplers) are connected by two optical waveguide circuits having different lengths from each other, and a Mach-Zender (Mach-Z).
3), and the optical input waveguide portion 5a and the optical output waveguide portion 5b, which are linear waveguides, are provided at the end portion of the substrate 1 as described above.

The optical waveguide circuit 5 of the substrate 1 has four optical frequency multiplexed signals (frequency f
1 to f4) are separated into four output waveguides for each optical frequency and output. The frequency of the light that can be extracted from each output waveguide is set to any one of the four frequencies by appropriately setting the value of the current that flows through the phase control heater 75.
You can choose one.

As described above, the substrate surface and the substrate bottom surface of the light input / output waveguide portions 5a and 5b are respectively as described above.
The protective plates 80a and 80b are attached by the adhesive 14. In this embodiment, the protective plates 80a and 80b are made of borosilicate glass having a linear expansion coefficient substantially equal to that of silicon, and the adhesive 14 has a Young's modulus of 150 kg / mm.
^Two UV curable adhesives were used.

In order to exert the function of the optical waveguide circuit 5, it is necessary to control the difference in length of two optical paths in each Mach-Zehnder interference circuit with a wavelength order of accuracy. Moreover, in the optical waveguide circuit 5, when stress is applied to the optical waveguide circuit board 1 from the outside, a large characteristic variation is caused. That is, when stress is applied to the optical waveguide circuit 5, the refractive index of the optical waveguide circuit 5 changes due to the photoelastic effect, and the coupling ratio and the optical path length difference of the directional coupling portion in the interference circuit change. As a result, the frequency selectivity of the signal light output from the output waveguide section 5b is significantly deteriorated. Therefore, the optical waveguide circuit 5 that performs such precise control of the optical path length
When mounting, it is essential to adopt a module structure that does not apply stress to the substrate 1. Especially, in the optical waveguide circuit board in which the warp of the substrate is not negligible as in this embodiment, it is important to mount the substrate without changing the curvature radius of the warp of the substrate.

In this embodiment, for this purpose, FIG.
A holder 90 as shown in FIG. 22 was used to form a module structure as shown in FIG. FIG. 22 shows a holder 90 for holding the optical waveguide circuit board 1, the surface of which is flat. Further, notches 90a are formed at a part of both ends of the holder 90 in consideration of convenience of optical fiber connection.

FIG. 23 shows an optical waveguide circuit module in which the optical waveguide circuit board 1 is mounted and fixed on the holder 90 and the optical fiber 2 is connected. The vicinity of the end of the optical waveguide circuit board 1 was fixed with an adhesive 34. In the optical circuit portion (circuit pattern not shown) 5 of the central portion 1b of the substrate 1, there is a gap between the substrate 1 and the holder 90 because the substrate 1 is warped. For this purpose, an ointment-like thermally conductive resin 33 was filled, and the optical circuit unit 5 and the holder 90 were brought into thermal contact with each other. The structure of the optical waveguide circuit module viewed from the light input end face at this time is shown in FIG. As shown in the figure, the substrate 1 is mounted so that the position of the notch 90a of the holder 90 and the lower protection plate 80b are aligned. As described above, in this optical waveguide circuit module, only the end portion of the optical waveguide circuit board 1 is attached to the holder 90 with the adhesive 34.
Since they are held in contact with each other, the substrate 1 can be mounted on the holder 90 without changing the curvature radius of the substrate warp originally possessed by the optical waveguide circuit substrate 1.

Finally, as shown in FIG. 23, the optical fiber array 100 is aligned and fixed to the end faces of the optical input / output waveguide portions 5a and 5b protected by the upper and lower protective plates 80a and 80b. The optical fiber array 100 is connected and fixed to the upper protection plate 80a and the lower protection plate 80b, and is not in contact with the holder 90.

Next, the effect of the optical waveguide circuit module of the present embodiment having the above-mentioned structure will be described.

The first effect is the realization of mounting without stress on the substrate. In the present embodiment, as described above, when the optical waveguide circuit board 1 is fixedly held by the holder 90,
Only the end portion of the optical waveguide circuit board 1 was fixed to the holder 90 with the adhesive 34, and the stress-sensitive optical waveguide circuit 5 was brought into a non-contact state with the holder 90 and the adhesive 34. Therefore, as shown in FIG. 24, it is possible to hold the substrate 90 in the holder 90 without changing the curvature of the warp that the substrate 1 originally has, and at the same time, the stress caused by the curing shrinkage of the adhesive 34 is not affected by the light. It is possible to prevent direct addition to the optical waveguide circuit 5 of the wave circuit board 1.

As a result, even if the substrate has an optical waveguide circuit that has a warpage that cannot be ignored and the characteristics of the optical waveguide circuit largely change due to stress application, the original optical waveguide circuit characteristics are not changed. It became possible to mount it on the holder.

If an adhesive having elasticity, such as an elastic adhesive, is used as the adhesive 34 for fixing the optical waveguide circuit board 1 and the holder 90, the line between the holder 90 and the optical waveguide circuit board 1 is reduced. Even if there is a large mismatch in the expansion coefficient, the elastic adhesive 34 absorbs the displacement of both, so that stress can be prevented from being applied to the optical waveguide circuit board 1. Therefore, by adopting the elastic adhesive, an optical waveguide circuit having higher temperature stability can be realized.

The second effect of the optical waveguide circuit module constituting the optical component of the present invention is the realization of precision polishing of the end face of the optical waveguide circuit.

In this embodiment, as shown in FIGS. 21 and 24, the optical input / output waveguide section 5 on the end face of the optical waveguide circuit board 1 is used.
Protective plates 80a and 80b are attached by adhesive 14 just above and just below a and 5b. As a result,
When polishing the end face of the waveguide, it is possible to prevent damage to the end portion of the waveguide and occurrence of scratches on the end face. in this case,
Particularly, as the adhesive 14 for fixing the optical waveguide circuit board 1 and the protection plates 80a and 80b, Young's modulus of 150 kg / mm ²
By using the above hard adhesive, it is possible to greatly improve the polishing accuracy of the end face of the waveguide. In fact, the excess loss due to the connection between the optical waveguide circuit module manufactured according to this example and the optical fiber (additional loss other than the connection loss due to the spot diameter mismatch between the optical waveguide circuit and the optical fiber) is
It was less than 0.05 dB / point, and the return loss was 47 dB, and a fiber connection with low loss and high return loss was realized.

In addition to this effect, the optical fiber array 10
When 0 is connected and fixed, the optical fiber 2 is in contact with only the end face of the optical waveguide circuit board 1 and the upper and lower protective plates 80a and 80b, and can be kept in a non-contact state with the holder 90. Therefore, even if there is a mismatch in the linear expansion coefficient between the optical waveguide circuit board 1 and the holder 90,
The optical fiber array 100 is not affected by this, and as a result, the temperature stability of the connection loss is extremely high.
The effect is obtained.

The third effect of the present embodiment is that the substrate 1 can be held without applying stress to the substrate 1, and the heat radiation processing of the substrate 1 is possible. That is, the optical waveguide circuit board 1 having a warp as in this embodiment
, With its end in contact with the holder 90,
As a result of mounting, a gap is formed between the central portion 1b of the optical waveguide circuit board 1 and the holder 90. By filling the space with an ointment-like thermally conductive resin 33, the entire bottom surface of the substrate 1 and the holder 90 can be brought into thermal contact without applying stress to the optical waveguide circuit substrate 1. It was Therefore, if the holder 90 is made of a material having high thermal conductivity such as a copper block, the optical waveguide circuit board 1
The heat radiation of can be efficiently realized.

As described above, in the optical waveguide circuit module which constitutes the waveguide type optical component of this embodiment, the stress generated by mounting the optical waveguide circuit board having a finite curvature radius and having a large area is caused by mounting. It can be fixedly held in the housing without applying. For this reason, it is possible to realize mounting having sufficient mechanical strength and not deteriorating the characteristics of the optical waveguide circuit.
At the same time, since the end faces of the optical input / output waveguides can be precisely polished, it is possible to connect fibers with extremely small connection loss and sufficiently high return loss. Furthermore, if necessary, even when the substrate is held without stressing it,
Efficient heat dissipation processing of the substrate can also be realized.

(Embodiment 8) FIGS. 25 to 27 are explanatory views of another mode of the embodiment of the optical waveguide circuit module constituting the waveguide type optical component of the present invention. The difference between this embodiment and the seventh embodiment is that the number of output waveguides of the optical waveguide circuit is remarkably large.

FIG. 25 is an explanatory diagram of the optical waveguide circuit substrate 1. In this explanatory diagram, the pattern of the optical waveguide circuit 5 formed on the substrate 1 is omitted in order to avoid complexity. There is. The optical waveguide circuit 5 of the substrate 1 is configured such that a 3 dB coupler is connected in multiple stages to branch a large number of light beams incident from one optical input waveguide portion 5a into, for example, 128 output waveguides. It is an example of composition of N splitter. The present embodiment is different from the seventh embodiment in that the number of output waveguides is remarkably increased and the light output portion extends over almost the entire area of the end portion of the substrate. As a result, the protective plate 80a is provided on the top surface and the bottom surface of the output waveguide portion 5b of the optical waveguide circuit board 1.
When 80b is installed, the presence of the warp of the substrate not only in the light propagation direction of the optical waveguide circuit but also in the direction orthogonal thereto cannot be ignored. Therefore, in the present embodiment, the output waveguide portion 5b
The protective plates 80a and 80b attached to the substrate are divided into sizes that allow the warp of the substrate to be ignored. For example, 1x128
In the case of a splitter, 16 output waveguides 5b were divided into eight groups, and each group was attached with a set of protective plates 80a and 80b using a fixing agent 14. When the waveguide spacing in one group is set to 250 μm, the width of one group is 4 mm, and the warp of the substrate is negligible within the area of one group.

FIG. 26 shows the structure of the holder 90, and the protective plates 80a, 80 attached to the optical waveguide circuit board 1 are shown in FIG.
A recessed step 90b is provided at a position corresponding to b.

In FIG. 27, the optical waveguide circuit board 1 is attached to the holder 9
When held at 0, the structure seen from the output waveguide side is shown. The substrate 1 and the holder 90 are fixed to each other by holding the end of the substrate in contact with the holder 90 with the adhesive 34 as in the seventh embodiment. In the present embodiment, as described above, since the protective plates 80a and 80b of the output waveguide portion 5b are divided into a size in which the warp of the substrate 1 can be ignored, the warp curvature originally possessed by the substrate is changed. It became possible to implement it without any need.

As a result of adopting such a structure, also in this embodiment, as in the case of Embodiment 7 , there is no need for precise alignment of the optical fiber and the waveguide, precision polishing of the end portion of the waveguide, and stress on the substrate. It is possible to realize an optical waveguide circuit module that satisfies all of the mounting and high mechanical strength, and that enables heat treatment without stressing the substrate.

(Embodiment 9) FIGS. 28 and 29 show another embodiment of the present invention.
And the like, the difference between Example 7 and 8, and it has the surface of the holder 110 to the curved surface to match the curvature radius of the optical waveguide substrate 1, and accordingly, an optical waveguide circuit of the optical waveguide substrate 1 (Pattern not shown) Central part 1b with 5
And the surface of the holder 110 are brought into direct contact with each other, and the end portion of the optical waveguide circuit board 1 is fixed to the holder 110 with the adhesive 34 thereon. With such a structure, it is possible to mount without applying stress to the substrate 1, and it is possible to further enhance the heat radiation effect as compared with the seventh and eighth embodiments.

Example 10 Example 10 shows an example of the mode of the waveguide type optical component of the present invention. As shown in FIG. 30, the waveguide type optical component of the present embodiment comprises an optical fiber array 130 connected to the input / output ends of an optical waveguide circuit module 120.

The optical waveguide circuit module 120 is, for example,
For example, as described in the third embodiment (FIGS. 9, 11, and 12).
An optical waveguide circuit module 43 is conceivable. This optical waveguide circuit
In the path module 43, as described above, the holder 4
0 and 41 are made of borosilicate glass material. This material
The linear expansion coefficient of the material is almost the same as that of the silicon substrate.
Also, it has a light-transmitting property up to the ultraviolet range. These holders
-Because 40 and 41 are made of UV transparent material, adhesive
An ultraviolet curable adhesive was used as 14. Furthermore, this
The adhesive has a Young's modulus in consideration of polishing of the end face of the optical waveguide circuit.
150 kg / mm ² Made of hard material. The optical waveguide circuit
As shown in FIG. 12, fixed around the substrate 1 without gaps
An ultraviolet curing adhesive 14 which is an agent is filled. this
Both end surfaces of the optical waveguide circuit module 43 are used for fiber connection.
Precisely polished before.

The optical waveguide circuit module 120 (43)
As shown in FIG. 31, the optical fiber array 130 connected to the optical fiber array 130 has an eight-core optical fiber 131 with a holding plate 132, a fixing plate 133, and a terminal frame 13 so that the ends thereof are exposed.
It is fixed to 4. The holding plate 132, the fixing plate 133 and the terminal frame 134 are the terminal holder 1
35 is composed. In this optical fiber array 130, the fiber 131 is sandwiched between a holding plate 132 having a fiber alignment groove and a fixing plate 133, and the adhesive 14
It is fixed by. And these fibers 131
An assembly composed of the holding plate 132 and the fixing plate 133 is fitted in the concave portion of the frame 134 and fixed by the adhesive 14. The holding plate 132, the fixing plate 133 and the frame 134 are all made of borosilicate glass,
These are fixed using an ultraviolet curing adhesive 14 having a Young's modulus of 150 kg / mm ² as in the case of the holders 40 and 41 for the optical waveguide circuit board. The end face of this optical fiber is also precisely polished before connection.

FIG. 30 shows the outer shape of a waveguide type optical component in which the optical fiber array 130 is connected to both ends of the optical waveguide circuit module 120 (43) through the ultraviolet curing adhesive 14. The alignment of the optical fiber array 130 and the optical waveguide circuit module 120 is completed in a short time by using the self-centering device after dropping the ultraviolet curing adhesive 14 on the connection interface. After alignment, the fiber connection can be easily realized by irradiating with ultraviolet light. The ultraviolet curing adhesive 14 used in this embodiment is not particularly limited, but an adhesive that is cured by heating or ultraviolet irradiation is generally used. However, from the viewpoint of the process, it is preferable to use an adhesive that is cured by ultraviolet irradiation, which has a high curing speed, that is, an ultraviolet curing adhesive.

The Young's modulus of the adhesive used in the present invention is
As mentioned above, 150 kg / mm ² That is all. this
Has a Young's modulus of 100 kg / mm² If lower,
Both the average value and the variation of the continuous loss are large, and 100
~ 150 kg / mm² When using the adhesive of
The average loss is relatively low, but the variation tends to be rather large.
Because it is in. And 150 kg / mm² More than
When adhesive is used, the average value and variation of splice loss
Both become smaller, and waveguide type optical components with desired characteristics are obtained.
Be done. The Young's modulus described here is
Storage elastic modulus measured at room temperature (JIS K719
8).

In the waveguide type optical component shown in FIG. 30, as described above, the optical waveguide circuit module 120 and the optical fiber array 130 after the polishing of the connection end face are of the ultraviolet curing type in which the refractive index is matched with that of silica glass. It was joined by the epoxy-based adhesive 14, and the increase in loss due to connection was small with an average value of 0.12 dB and a maximum value of 0.18 dB.

Although the embodiments of the present invention have been described above, the scope of application of the present invention is not limited to these embodiments. In the above-mentioned embodiment, the optical waveguide circuit substrate has been described by taking an example of a silica-based optical waveguide circuit on a silicon substrate, but it goes without saying that the optical waveguide circuit substrate is not limited to this. The present invention exerts a great effect on all optical waveguide circuits that affect the. Further, in each of the above examples, when fixing the optical waveguide circuit board to the holder, the ultraviolet curing adhesive was used as a fixing agent, but the present invention is not limited to this, and other thermosetting type, room temperature It is also possible to use various curable adhesives, solder, or the like. Further, in the above embodiment, the case where the holder made of borosilicate glass is used as the holder has been described as an example. However, in addition to this, an optical fiber array is made using a holder made of a metal material such as Kovar. It can be applied to various material systems such as connection by laser welding.

[0089]

As described above, according to the present invention,
In particular, it is possible to mount a large-sized optical waveguide circuit board in which the warp of the board cannot be ignored without stress load, and to provide a waveguide-type optical component having low loss, high return loss, and high mechanical strength. You can

[Brief description of drawings]

FIG. 1 is a perspective view showing a first example of an optical waveguide circuit module that constitutes a conventional waveguide type optical component.

FIG. 2 is a perspective view of an optical waveguide circuit board that constitutes a second example of an optical waveguide circuit module that constitutes a conventional waveguide type optical component.

FIG. 3 is a side view of a second example of an optical waveguide circuit module that constitutes a conventional waveguide type optical component.

FIG. 4 shows a third example of an optical waveguide circuit module which constitutes a conventional waveguide type optical component, and is an exploded perspective view of the module.

5 is a cross-sectional view of an optical waveguide circuit module that constitutes the waveguide type optical component of Reference Example 1. FIG.

6 is a plan view of an optical waveguide circuit board that constitutes an optical waveguide circuit module that constitutes the waveguide type optical component of Reference Example 1. FIG.

7 is an exploded perspective view of an optical waveguide circuit module that constitutes the waveguide type optical component of Reference Example 1. FIG.

FIG. 8 is a perspective view of an optical waveguide circuit module that constitutes a waveguide type optical component of Reference Example 2 ;

FIG. 9 is an exploded perspective view of an optical waveguide circuit module that constitutes a waveguide type optical component of Example 3 .

FIG. 10 is an optical waveguide circuit constituting the waveguide type optical component of Example 3 ;
It is a perspective view of the optical waveguide board used for the optical path module.

FIG. 11 is a side sectional view of an optical waveguide circuit module that constitutes the waveguide type optical component of the third embodiment .

FIG. 12 is an end view of an optical waveguide circuit module that constitutes a waveguide type optical component of Example 3 ;

FIG. 13 is a graph showing optical waveguide circuit characteristics in an optical waveguide circuit module that constitutes the waveguide type optical component of Example 3 ;

FIG. 14 is a graph showing heat cycle characteristics of the optical waveguide circuit in the optical waveguide circuit module that constitutes the waveguide type optical component of the third embodiment .

FIG. 15 is a graph showing optical waveguide circuit characteristics in an optical waveguide circuit module that constitutes a waveguide type optical component of a comparative example corresponding to Example 3 ;

16 is a graph showing the relationship between the Young's modulus of the adhesive and the connection loss in the optical waveguide circuit module that constitutes the waveguide type optical component of the comparative example corresponding to Example 3. FIG.

FIG. 17 is an exploded perspective view of an optical waveguide circuit module that constitutes the waveguide type optical component of the fourth embodiment .

FIG. 18 is an exploded perspective view of an optical waveguide circuit module that constitutes the waveguide type optical component of the fifth embodiment .

FIG. 19 is a side sectional view of an optical waveguide circuit module forming the waveguide type optical component of Example 4 or 5 .

FIG. 20 is an exploded perspective view of an optical waveguide circuit module that constitutes the waveguide type optical component of the sixth embodiment .

21 is a perspective view of an optical waveguide circuit board that constitutes an optical waveguide circuit module that constitutes the waveguide type optical component of Example 7. FIG.

FIG. 22 is a perspective view of a holder that constitutes an optical waveguide circuit module that constitutes a waveguide type optical component of Example 7 .

FIG. 23 is a perspective view of an optical waveguide circuit module that constitutes a waveguide type optical component of Example 7 .

FIG. 24 is a side view showing a part of an optical waveguide circuit module that constitutes the waveguide type optical component of Example 7 with a part thereof omitted.

FIG. 25 is a perspective view of an optical waveguide circuit board that constitutes an optical waveguide circuit module that constitutes the waveguide type optical component of the eighth embodiment .

FIG. 26 is a perspective view of a holder that constitutes an optical waveguide circuit module that constitutes the waveguide type optical component of the eighth embodiment .

FIG. 27 is a side view of an optical waveguide circuit module that constitutes the waveguide type optical component of the eighth embodiment .

FIG. 28 is an exploded perspective view of an optical waveguide circuit module that constitutes a waveguide type optical component of Example 9 .

FIG. 29 is a side view of an optical waveguide circuit module that constitutes a waveguide type optical component of Example 9 .

FIG. 30 is a perspective view of a waveguide type optical component of Example 10 .

FIG. 31 is a perspective view of an optical fiber array forming the waveguide type optical component of Example 10 .

[Explanation of symbols]

1 Optical Waveguide Circuit Board 1A Substrate 1B Optical Waveguide Circuit Layer 1b Central Part of Substrate 2 Optical Fiber 5 Curved Optical Waveguide Circuit (Optical Circuit Section) 5a Optical Input Waveguide Section 5b Optical Output Waveguide Section 14 Adhesive (Fixing Agent) 20 Substrate Holder 21 Lower Frames 22a, 22b, 22c, 22d Spacer 23 Holding Plate 30 Box Holder 31 Heating Element 32 Electrode Pad 33 Ointment-like Thermal Conductive Resin 34 Adhesive (Elastic Adhesive) 40 Gutter-shaped Lower Holder 41 Upper holder 41a Spacer 41b Upper plate 42 Mach-Zehnder interference circuit 43 Optical waveguide circuit module 50 Trough-shaped lower holder 50a Spacer section 60 Lower holder 70 Lower holders 70a, 71a Spacer sections 70b, 71b Non-contact section 71 Upper holder 75 Phase control Heater 80a Upper protection plate 80b Lower protection plate 90 Holder 90 Cut portion 90b stepped 100 optical fiber array 119 holder 120 lightwave circuit module 130 optical fiber array 131 8-core optical fiber 132 holding plate 133 fixed plate 134 terminal frame 135 pin holder g clearance

─────────────────────────────────────────────────── ─── Continuation of front page (31) Priority claim number Japanese Patent Application No. 4-155387 (32) Priority date June 15, 1992 (June 15, 1992) (33) Country of priority claim Japan (JP) (31) Priority claim number Japanese Patent Application No. 4-155388 (32) Priority date June 15, 1992 (June 15, 1992) (33) Country of priority claim Japan (JP) (72) Inventor Yasuyuki Inoue 1-1-6 Uchisaiwaicho, Chiyoda-ku, Tokyo Within Nippon Telegraph and Telephone Corporation (72) Inventor Masayuki Okuno 1-1-6, Uchisaiwaicho, Chiyoda-ku, Tokyo Inside of Nippon Telegraph and Telephone Corporation (72) Inventor Toru Maruno Tokyo 1-6, Uchisaiwaicho, Chiyoda-ku, Nippon Telegraph and Telephone Corporation (72) Inventor Tetsuo Yoshizawa 1-1-6, Uchisaiwaicho, Chiyoda-ku, Tokyo Within Nippon Telegraph and Telephone Corporation (72) Inventor Takao Kimura Chiyoda, Tokyo 1-6, 1-chome, Saiwaicho In Nippon Telegraph and Telephone Corporation (56) Reference Patent flat 6-67041 (JP, A) (58 ) investigated the field (Int.Cl. ^7, DB name) G02B 6/30 G02B 6/12

Claims (3)

(57) [Claims] 1. An optical waveguide circuit module in which an optical waveguide circuit board is held by a substrate holder and an optical fiber module in which an input / output optical fiber is held by a terminal holder at an end thereof are connected to each other. The optical waveguide circuit module is made of a glass material having a sufficient hardness that the optical input / output waveguide portion of the optical waveguide circuit board can be abraded through a fixing agent having a Young's modulus of 150 kg / mm ² or more. Held by the spacer (part) of the substrate holder
Or optical input / output of the optical waveguide circuit board
The waveguide has a Young's modulus of 150 kg / mm 2 or more
A glass material having sufficient hardness that it can be abraded through a fixative
Is held by a protective plate composed of a material, and an elastic adhesive is provided between the optical waveguide circuit board and the board holder.
A waveguide-type optical component, which is fixed and has an optical fiber end face of the optical fiber module connected to a polished optical waveguide circuit end face of the optical waveguide circuit module. 2. The glass material having sufficient hardness is
Polished optical waveguide module which is silicate glass
The optical fiber is 150 kg / mm ^{2 on the} end face of the optical waveguide.
Borosilicate glass through a fixing agent having the above Young's modulus
The optical fiber fixed to the terminal holder formed by
The polished end face of the IVA module is
The conductor according to claim 1, wherein the conductor is connected via a chemical adhesive.
Corrugated optical parts . 3. The optical waveguide circuit board has a linear optical input waveguide section and a linear output waveguide section, and has a predetermined function between the optical input waveguide section and the optical output waveguide section. An optical circuit part, wherein the optical circuit part and the substrate holder are placed in a non-contact state, and the linear optical input waveguide part and
The waveguide type optical component according to claim 1, wherein at least a part of each of the optical output waveguide portions is fixed to the substrate holder by the fixing agent.