JP3465329B2 - Manufacturing method of dielectric filter - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a dielectric filter in which a plurality of individual dielectric resonators are fired with a silver paste or a copper paste.

[0002]

2. Description of the Related Art Conventionally, as a method of manufacturing a dielectric filter, a plurality of dielectric resonators having solder cream applied to their bonding surfaces are bonded together and bonded by reflow.

[0003]

However, according to the conventional method of manufacturing a dielectric filter, in the reflow step, the adjacent dielectric resonators are displaced due to the condensing force after the melting of the solder cream. The window electrode and the outer conductor (which becomes the ground) approach each other, increasing the capacitance between the coupling window electrode and the outer conductor, and the signal output leaks to the outer conductor (earth) through this capacitance, adversely affecting the output characteristics. I was giving.

Therefore, it is an object of the present invention to provide a method of manufacturing a dielectric filter in which adjacent dielectric resonators to be joined do not cause a positional deviation and therefore do not change the output characteristics. To do.

[0005]

The invention described in the claims of the present application is as follows. 1. A resonator hole is formed in the dielectric, an inner conductor is formed in the resonator hole, and an outer conductor is formed on the outer surface of the dielectric by silver electrodes. The inner conductor and the outer conductor are divided to adjust the frequency. A dielectric ground is formed by cutting in the vicinity of the opening on one side of the resonator hole, and the outer conductor of at least one outer surface of the dielectric is cut and removed in a frame shape to reveal the ground of the dielectric. Forming a coupling window electrode in the frame-like background, applying a silver paste to the coupling window electrode and the outer conductor of at least the bonding surface of the dielectric resonator, and the dielectric material coated with the silver paste. A step of stacking a plurality of resonators, bonding window electrode comrades and outer conductor comrades, and firing them;
Of a dielectric filter comprising

2. A resonator hole is formed in the dielectric, an inner conductor is formed in the resonator hole, and an outer conductor is formed on the outer surface of the dielectric by copper electrodes, and the inner conductor and the outer conductor are partitioned to adjust the frequency. A dielectric ground is formed by cutting in the vicinity of the opening on one side of the resonator hole, and the outer conductor of at least one outer surface of the dielectric is cut and removed in a frame shape to reveal the ground of the dielectric. Forming a coupling window electrode in the frame-like background, applying a copper paste to the coupling window electrode and the outer conductor of at least the bonding surface of the dielectric resonator, and a dielectric material coated with the copper paste. A method of manufacturing a dielectric filter, comprising a step of stacking a plurality of resonators, a coupling window electrode and an outer conductor, and laminating them together, followed by baking.

[0007]

According to the present invention, since the composite dielectric resonator in which the silver paste or the copper paste is applied and adhered to at least the bonding surface of the dielectric resonator is bonded by firing or baking, the adjacent dielectrics are bonded together. Since the resonators do not displace each other, and therefore the coupling window electrode and the outer conductor (earth) do not come close to each other, the stray capacitance between them becomes large, and the coupling window electrode and the outer conductor (earth) become larger.
The output will not leak and will not affect the characteristics.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment FIG. 1 shows a manufacturing process of a first embodiment of the present invention. FIG. 1A is a first process drawing for manufacturing an individual dielectric resonator 1, and FIG. 2nd process drawing of applying paste, and FIG.
[FIG. 8] shows a third step diagram of firing the composite dielectric resonator.

In FIG. 1A, a resonator hole 2 is formed in a prismatic dielectric. An inner conductor 3 is formed in the resonator hole 2 and an outer conductor 4 is formed on the outer surface of the dielectric body by silver electrodes.
Next, a ground surface 5 of a dielectric that divides the inner conductor 3 and the outer conductor 4 to adjust the frequency is formed by cutting or the like near the opening on one side of the resonator hole 2. The outer conductor 4 on at least one outer surface of the dielectric is cut and removed in a frame shape to reveal the background of the dielectric, and the coupling window electrode 6 is formed in the frame-like background of the dielectric. The dielectric resonator 1 is manufactured through such a first step.

Next, the second step will be described. First above
Silver paste is applied to at least the bonding window electrode 6 and the outer conductor 4 of the bonding surface of the dielectric resonator 1 processed and manufactured in the process.

Next, the third step will be described. Second above
In the process, a plurality of dielectric resonators 1 coated with silver paste, a plurality of coupling window electrodes 6 and a plurality of outer conductors 4 are laminated and fired, so that a plurality of dielectric resonators are joined together. Body filters are manufactured.

Second Embodiment FIG. 2 shows a manufacturing process of a second embodiment of the present invention. FIG. 2A is a first process drawing for manufacturing an individual dielectric resonator 1, and FIG. 2B is a copper paste. 2nd process drawing of applying and C in the same drawing
[FIG. 8] shows a third step diagram of baking and hardening the composite dielectric resonator.

In FIG. 2A, a resonator hole 2 is formed in a prismatic dielectric. The inner conductor 3 is formed in the resonator hole 2 and the outer conductor 4 is formed on the outer surface of the dielectric body by copper electrodes.
Next, a ground surface 5 of a dielectric that divides the inner conductor 3 and the outer conductor 4 to adjust the frequency is formed by cutting or the like near the opening on one side of the resonator hole 2. The outer conductor 4 on at least one outer surface of the dielectric is cut and removed in a frame shape to reveal the background of the dielectric, and the coupling window electrode 6 is formed in the frame-like background of the dielectric. The dielectric resonator 1 is manufactured through such a first step.

Next, the second step will be described. First above
Copper paste is applied to at least the coupling window electrode 6 and the outer conductor 4 on the bonding surface of the dielectric resonator 1 processed and manufactured in the process.

Next, the third step will be described. Second above
In the process, a plurality of dielectric resonators 1 coated with copper paste, a plurality of coupling window electrodes 6 and a plurality of outer conductors 4 are laminated and bonded to each other, and then baked. Body filters are manufactured.

In the above embodiment, the resonator hole 2
The dielectric ground 5 provided in the vicinity of the opening on one side is formed only at a portion slightly inside the opening of the resonator hole 2. However, the dielectric ground 5 has a frequency depending on its position and width. Since the adjustment is performed, the resonator hole 2 may be formed at one open end. Further, the dielectric background 5 provided in the resonator hole 2 may be provided near the openings on both sides of the resonator hole 2.

[0017]

The present invention provides a composite dielectric resonator in which silver paste or copper paste is applied to at least the bonding surface of the dielectric resonator, and the bonding window electrodes and the outer conductors are laminated and bonded together. Bonding is done by firing or baking, and the silver paste or copper paste does not melt, so the condensation force after melting does not act as in the case of using solder paste, so there is no misalignment between adjacent dielectric resonators. It never happens. Therefore, since the coupling window electrode and the outer conductor (earth) do not come close to each other, the stray capacitance between them becomes large, and the coupling window electrode and the outer conductor (earth) are connected.
The output will not leak and will not affect the characteristics.

Further, in the dielectric filter manufactured by this manufacturing method, since a plurality of individual dielectric resonators whose outer surfaces are covered with outer conductors are bonded together, the outer conductors of the individual dielectric resonators are The shielding effect is exerted, the leakage of the electromagnetic field outside the coupling window electrode is reduced, and the frequency can be adjusted without being affected by the adjacent dielectric resonator. Further, the frequency of the individual dielectric resonator can be tuned by changing the position and width of the background of the dielectric provided near one side opening of the resonator hole of the individual dielectric resonator.

[Brief description of drawings]

1A and 1B show a manufacturing process of a first embodiment of the present invention, in which A is a manufacturing process diagram of an individual dielectric resonator, B is a process diagram of applying a silver paste to a bonding surface of the individual dielectric resonator, C is a process diagram of firing the composite dielectric resonator

2A and 2B show a manufacturing process of a second embodiment of the present invention, wherein A is a manufacturing process drawing of an individual dielectric resonator, B is a process drawing of applying a copper paste to a bonding surface of the individual dielectric resonator, C is a process diagram of baking the composite dielectric resonator

[Explanation of symbols]

1 Dielectric resonator 2 resonator holes 3 Inner conductor 4 outer conductor 5 background 6 coupling window electrode

─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-6-112704 (JP, A) JP-A-5-175704 (JP, A) Actual development 5-31303 (JP, U) (58) Field (Int.Cl. ⁷ , DB name) H01P 11/00 H01P 1/205

Claims (2)

(57) [Claims] 1. A resonator hole is formed in a dielectric body, an inner conductor is formed in the resonator hole, and an outer conductor is formed on the outer surface of the dielectric body by silver electrodes. The inner conductor and the outer conductor are divided. A dielectric surface for adjusting the frequency is formed by cutting in the vicinity of the opening on one side of the resonator hole, and the outer conductor on at least one outer surface of the dielectric is cut and removed in a frame shape to reveal the dielectric surface. A step of forming a coupling window electrode in the frame-like background of this dielectric, a step of applying silver paste to the coupling window electrode and the outer conductor of at least the bonding surface of the dielectric resonator, and the silver paste A method of manufacturing a dielectric filter, comprising a step of laminating a plurality of coated dielectric resonators, stacking a plurality of coupling window electrodes and a plurality of outer conductors on top of each other, and firing them. 2. A resonator hole is formed in a dielectric body, an inner conductor is formed in the resonator hole, and an outer conductor is formed in an outer side surface of the dielectric body by copper electrodes, respectively, to divide the inner conductor and the outer conductor. A dielectric surface for adjusting the frequency is formed by cutting in the vicinity of the opening on one side of the resonator hole, and the outer conductor on at least one outer surface of the dielectric is cut and removed in a frame shape to reveal the dielectric surface. A step of forming a coupling window electrode in the frame-like ground of this dielectric, a step of applying a copper paste to the coupling window electrode and the outer conductor of at least the bonding surface of the dielectric resonator, and the copper paste being A method of manufacturing a dielectric filter, comprising a step of stacking a plurality of coated dielectric resonators, bonding window electrode members and outer conductor members together, followed by baking and hardening.