JP3469365B2 - Lead terminal forming device for packaged electronic components - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention As shown in FIG. 1, according to the present invention, a semiconductor element is formed by a synthetic resin mold portion A1 and a plurality of lead terminals A2 for the semiconductor element are provided in all four portions of the mold portion A1. A quad-type electronic component A packaged so as to project outward from the side surface, or, as shown in FIG. 2, a semiconductor element portion is molded with a synthetic resin mold portion B1 to form a plurality of lead terminals for the semiconductor element. Electronic component B packaged so that B2 projects outward from the left and right side surfaces of the mold part B1
In order to mount the lead terminals A2 and B2 protruding outward from the mold parts A1 and B1 on the
The present invention relates to a forming device for bending into a letter shape.

[0002]

2. Description of the Related Art A conventional forming apparatus is shown in FIG.
As shown in FIG. 6, the forming die 2 is fixed to the upper surface of the fixed die holder 1 which does not move up and down, and the forming punch 4 is attached to the lower surface of the punch holder 3 which moves up and down toward the die holder 1. The electronic component A is placed on the upper surface of the die holder 1 so that the mold portion A1 of the electronic component A fits into the recess provided on the upper surface of the die holder 1, and the lead terminals A2 of the electronic component A are When the punch holder 3 is moved downward, it is sandwiched between the forming die 2 and the forming punch 4 so as to be bent into an L shape.

[0003]

However, the conventional forming apparatus has the following problems because the forming die 2 is fixed to the die holder 1. That is, the axis 2a of the forming die 2 attached to the fixed die holder 1
And the axis 4a of the forming punch 4 attached to the vertically moving punch holder 3 have a lateral shift due to an error between the die holder 1 and the punch holder 3.

Therefore, in the structure in which the forming die 2 is fixed to the die holder 1, the forming die 2 and the forming punch 4 are not properly meshed with each other due to the displacement between the two axes 2a and 4a. Since the engagement is strong on one side and weak on the other side, the shape of each lead terminal A2 bent by sandwiching the forming die 2 and the forming punch 4 is uneven on the right side and the left side. As described above, the bending shape of each lead terminal A2 varies, and the variation of the bending shape increases in proportion to the deviation of the axis.

Therefore, when attaching the forming die 2 and the forming punch 4, it is necessary to make the axes 2a and 4a of the two dies exactly coincide with each other, which requires a great deal of trouble and skill. Not only is the workability quite low, but due to repeated forming,
The axes 2a and 4a are misaligned. The present invention has a technical object to provide a forming apparatus capable of avoiding this problem.

[0006]

In order to achieve this technical object, the first aspect of the present invention is that "each lead terminal protruding outward from both left and right side surfaces or all side surfaces of a mold portion of an electronic component is sandwiched. and a forming die and a forming punch so as to bent into an L-shape in further provide a forming device including a holder for supporting each of the forming die and the forming punch, the forming die or the forming path
To the holder of the forming die.
Or the forming punch shifts in the direction perpendicular to its axis.
It is mounted so that it can move. I made a structure to say. Further, a second aspect of the present invention, mode in the "electronic component
Protruding outward from both left and right sides or all sides of the shield
Bend each lead terminal into an L shape by sandwiching it
Forming die and forming punch
Well, in addition, this forming die and forming pan
Forming comprising holders for supporting each of the
In the device, the forming die is held in its holder.
The forming die is aligned with its axis in the recess provided in
One that is movably mounted so that it shifts in the direction of the right angle
The outer surface of this forming die and the inside of the recess
A soft elastic body is inserted between the surface and the surface. To say
It was

[0007]

[Operation] With this configuration , when each lead terminal is sandwiched between the forming die and the forming punch, the meshing between the forming die and the forming punch causes a deviation of the axis line between them, If it becomes stronger on one side and weaker on the other side, the forming die or forming punch will
With respect to the holder, the forming die and the forming punch are automatically displaced laterally so that the engagement on one side is weak and the engagement on the other side is strong. Even if there is, it will always mesh in the correct state.

[0008]

Therefore, according to the present invention, when the lead terminals protruding outward from the left and right side surfaces or all side surfaces of the molded portion of the electronic component are bent into an L shape, the bent shape of each lead terminal is obtained. It is possible to reliably reduce the occurrence of unevenness, and it is possible to accurately bend each lead terminal into the correct shape, and it is possible to greatly reduce the number of steps required to attach the forming die and forming punch, thus improving workability. Has the effect that can.

Further, the structure is as described in "Claim 2".
The forming die in the lateral direction.
Since the movement can be restricted within a certain range, there is an advantage that the stability of bending can be improved.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings of FIGS. In this figure, reference numeral 11 indicates a forming die, and reference numeral 12 indicates a forming punch. The forming die 11 is inserted into a recess 14 provided on the upper surface of a die holder 13 mounted on the upper surface of a fixed base (not shown). On the other hand, the forming punch 12 is immovably fixedly attached to the lower surface of a punch holder 15 which is attached to the lower surface of a head (not shown) that moves up and down with respect to the fixed base.

[0011] Then, a forming die 11 inserted into the recess 14 in the die holder 13, with respect to die holder 13, when attached at the fastening bolts 16 that penetrate the forming die 11 in the vertical direction, before
The bolt 16 blocks the tightening of the forming die 11.
By fitting the sleeve 17 adapted to stop,
This forming die 11 is perpendicular to its axis 11a
It is configured to be movable so as to shift in the direction.

In this structure, by the downward movement of the forming punch 12 toward the forming die 11,
As shown in FIG. 1, each lead terminal A protruding outward from all side surfaces of the mold part A1 in the quad type electronic component A.
2 is sandwiched between the forming die 11 and the forming punch 12 so that as shown in FIG.
Bend into a letter shape.

At the time of the above-mentioned bending, each lead terminal A2 is formed by the forming die 11 and the forming punch 12.
When the meshing between the forming die 11 and the forming punch 12 becomes stronger on one side and weaker on the other side due to the displacement between the axes 11a and 12a of the two, the forming die 11 is With respect to the die holder 13, the forming die 11 and the forming punch 12 are automatically displaced laterally so that the meshing on one side is weak and the meshing on the other side is strong. Even if there is a deviation between the axes 11a and 12a, they will always engage in a correct state.
It is possible to reliably reduce the occurrence of variations due to the displacement between the a and the 12a.

By inserting a soft elastic body 18 such as rubber into the gap between the outer peripheral surface of the forming die 11 and the inner surface of the recess 14 in the die holder 13, The displacement of the forming die 11 can be restricted within a certain range by the soft elastic body 18. The forming punch 12 is used in the above embodiment.
Is fixedly attached to the punch holder 15 immovably, while the forming die 11 is displaced relative to the die holder 13 in a direction perpendicular to the axis.
Although the configuration is shown so that the forming die can be moved , the present invention is not limited to this, and the forming die 11 is fixedly attached to the die holder 13 immovably, while the forming punch is formed. 12 is displaced with respect to the punch holder 15 in the direction perpendicular to the axis.
It may be configured to be attached so as to be movable , and this configuration can achieve the same purpose.

Further, although the above-mentioned embodiment is applied to the quad type electronic component A shown in FIG. 1, the present invention is
Not limited to this, it goes without saying that the same can be applied to the electronic component B in which the lead terminals B2 are projected from the left and right side surfaces of the mold B1 as shown in FIG.

[Brief description of drawings]

FIG. 1 is a perspective view showing one electronic component.

FIG. 2 is a perspective view showing another electronic component.

FIG. 3 is a vertical sectional front view showing an embodiment of the present invention.

FIG. 4 is a sectional view taken along line IV-IV in FIG.

FIG. 5 is a vertical sectional front view of a conventional forming device.

FIG. 6 is a diagram showing a working state of a conventional forming device.

[Explanation of symbols]

11 Forming die 11a Forming die axis 12 Forming punch 12a Forming punch axis 13 die holder 14 recess 15 punch holder 16 volts 18 Soft elastic body A electronic parts A1 mold part A2 lead terminal

Claims (2)

(57) [Claims] 1. A forming die and a forming punch each of which is formed by bending each of the lead terminals protruding outward from both right and left side surfaces or all side surfaces of a mold portion of an electronic component to be bent into an L-shape by sandwiching the lead die. Furthermore, in a forming apparatus including a holder for supporting each of the forming die and the forming punch, the forming die or the forming punch is
The forming die or fo
A forming device for a lead terminal in a package type electronic component, wherein the forming punch is mounted so as to be displaced so as to shift in a direction perpendicular to its axis . 2. A forming die and a forming punch each of which is formed by bending each of the lead terminals projecting outward from both left and right side surfaces or all side surfaces of a mold portion of an electronic component by sandwiching the lead terminals, and a forming punch. Further, in a forming apparatus including a holder for supporting each of the forming die and the forming punch, in the recess provided in the holder, the forming die is provided.
The forming die in the direction perpendicular to its axis.
It is attached so that it can be moved
A forming device for a lead terminal in a package type electronic component , wherein a soft elastic body is inserted between an outer side surface of the forming die and an inner side surface of the recess .