Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JP3469458B2 - Signal waveform shaping element - Google Patents
[go: Go Back, main page]

JP3469458B2 - Signal waveform shaping element - Google Patents

Signal waveform shaping element

Info

Publication number
JP3469458B2
JP3469458B2 JP08142698A JP8142698A JP3469458B2 JP 3469458 B2 JP3469458 B2 JP 3469458B2 JP 08142698 A JP08142698 A JP 08142698A JP 8142698 A JP8142698 A JP 8142698A JP 3469458 B2 JP3469458 B2 JP 3469458B2
Authority
JP
Japan
Prior art keywords
optical
waveform shaping
shaping element
signal waveform
active layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP08142698A
Other languages
Japanese (ja)
Other versions
JPH11282032A (en
Inventor
敏夫 伊藤
直人 吉本
克明 曲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
NTT Inc USA
Original Assignee
Nippon Telegraph and Telephone Corp
NTT Inc USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp, NTT Inc USA filed Critical Nippon Telegraph and Telephone Corp
Priority to JP08142698A priority Critical patent/JP3469458B2/en
Publication of JPH11282032A publication Critical patent/JPH11282032A/en
Application granted granted Critical
Publication of JP3469458B2 publication Critical patent/JP3469458B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)

Description

【発明の詳細な説明】 【0001】 【発明の属する技術分野】本発明は、光通信、光交換、
光情報処理等の光信号を伝達処理する光システムに適用
し、光信号の波形を整形するために有効な信号波形整形
素子に関する。 【0002】 【従来の技術】光通信、光交換、光情報処理といった光
を利用した光伝達処理システムの構築を考えると、光フ
ァイバや光スイッチでの光損失が大きな問題となり、減
衰した光信号を光増幅器によって補償することが必要不
可欠になる。しかし、以下のような問題が生ずる。 【0003】第一に、上記光増幅器を使用することで該
光増幅器より生じる雑音により、波形が劣化する。図4
は波形の変化を模式的に示したもので、(a)は劣化し
ていない波形、(b)は雑音によって変化した波形の一
例である。 【0004】第二に、光ファイバによる長距離光伝送で
は、光ファイバ内の分散によりやはり波形が劣化する。
図5は波形の変化を模式的に示したもので、(a)は劣
化していない波形、(b)は雑音によって変化した波形
の一例である。 【0005】このため、従来は光信号を受光素子によっ
て電気信号に変換し、電気的に波形を整形したのちに再
び光信号に変換していた。このような信号の変換に用い
られるシステムの構成例を図6に示す。図中、参照符号
61は光/電気変換素子、62は電気波形整形素子、お
よび63は電気/光変換素子である。 【0006】 【発明が解決しようとする課題】しかし、従来の信号波
形整形素子は光信号を電気信号に変換する必要があり、
回線の数が増えるに従ってシステム全体の中で光/電気
変換、電気/光変換の占める割合が大きくなり、消費電
力、コストの削減をはかる上で大きなネックとなってき
た。そのため光信号を光のまま波形整形するための手段
が求められていた。 【0007】したがって、本発明は上記課題を解決し、
光信号を光のまま波形整形する信号波形整形素子を提供
することを目的とする。 【0008】 【課題を解決するための手段】上記課題を解決するため
に、本発明にもとづく信号波形整形素子は、半導体基板
上に順に積層されたクラッド層、活性層、およびクラッ
ド層からなるダブルヘテロ構造と、活性層の両側に設け
られた電気絶縁層からなる埋め込み構造と、両端面に設
けられた反射防止膜とを備える半導体レーザ型の光増幅
素子であって、前記活性層は厚さが0.4μm未満、幅
が0.4μm未満であることを特徴とする。 【0009】 【発明の実施の形態】本発明にもとづく信号波形整形素
子は、半導体基板上に順に積層されたクラッド層、活性
層、およびクラッド層からなるダブルヘテロ構造と、活
性層の両側に設けられた電気絶縁層からなる埋め込み構
造と、両端面に設けられた反射防止膜とを備える半導体
レーザ型の光増幅素子であって、前記活性層は厚さが
0.4μm未満、幅が0.4μm未満である。また、本
発明にもとづく信号波形整形素子は少なくとも陽極また
は負極のいずれかからなる電極構造を有するが、本質的
に無バイアスで動作するので電極がなくともかまわな
い。 【0010】本発明にもとづく信号波形整形素子の作動
原理は以下の通りである。 【0011】半導体レーザ型の光増幅素子を無バイアス
もしくは微小バイアスもしくは逆バイアスで使用する
と、通常40dBを越えるような大きな損失を持つ。と
ころが、活性層を厚さが0.4ミクロン、幅が0.4ミ
クロンよりも小さくすると、−3dBm(0.5mW)
以下の弱い光入力に対しては大きな損失を持つが、それ
以上の強い光入力に対しては損失が飽和するいわゆる可
飽和吸収が生じて損失が減少し、7dBm(5mW)以
上の光入力に対してはほとんど無損失となる。この非線
形効果を利用して光信号を光のまま波形整形することが
可能になる。 【0012】以下、本発明にもとづく信号波形整形素子
の具体例を説明する。 【0013】(実施例1)図1は、本発明にもとづく信
号波形整形素子の一例を説明するための模式的斜視図で
ある。図中、参照符号101はn−InP基板、102
はn−InPクラッド層、103は厚さ0.3μm、幅
0.3μmバンドギャップ波長1.5μmのInGaA
sP活性層、104はp−InPクラッド層、105お
よび106はFe−InP絶縁層、107はp−InG
aAsPキャップ層、108はn側電極、さらに109
はp側電極である。信号波形整形素子は、全長が300
μmであり、両端面にはTiO2 /SiO2 からなる反
射防止膜(不図示)が施されている所謂半導体レーザ型
の光増幅素子である。 【0014】半導体レーザ型の光増幅素子を無バイアス
もしくは微小バイアス(通常5mA以下)もしくは逆バ
イアスで使用すると、通常40dBを越えるような大き
な損失を持つ。実際、活性層が厚さ0.4μm、幅0.
4μm以上の大きさを持つ場合、図2に示すように、光
入力強度に関わらず大きな光損失を持つ。 【0015】ところが、活性層を厚さ0.4μm、幅
0.4μmよりも小さくし、例えば厚さ0.3μm、幅
0.3μmとすると、−3dBm(0.5mW)以下の
弱い光入力に対しては大きな損失を持つが、それ以上の
強い光入力に対しては損失が飽和するいわゆる可飽和吸
収が生じて損失が減少し、7dBm(5mW)以上の光
入力に対してはほとんど無損失になる。この非線形効果
を利用すると、例えば図3(a)に示すような鈍った光
信号波形を図3(b)に示すように光のまま波形整形す
ることが可能になる。なお、活性層がほぼ正方形状の構
造を持つため、本デバイスは基本的に入力偏波に依存し
ない偏波無依存の特性を持つ。 【0016】(実施例2)本実施例にもとづく信号波形
整形素子は、実質的に実施例1と同様の構造を有する
が、電極108および109を持たない点が実施例1と
異なる。すなわち、上記実施例1の信号波形整形素子は
本質的に無バイアスで走査するので、参照符号108,
109の電極はなくても構わない。したがって、無バイ
アス動作によって消費電力の問題は根本的に解決する。 【0017】なお、本明細書においては、n型のInP
基板を例に説明を行ったが、p型の基板や他の半導体結
晶においても同様な効果を得ることができる。また、活
性層としてバルクのInGaAsPの例を挙げている
が、量子井戸構造や歪み量子井戸構造(圧縮歪み、伸張
歪み)を用いてもよい。また、InGaAlAs系、I
nAlAs系、AlGaAs系といった材料系でも同様
な効果を得ることができる。 【0018】また、埋め込み構造に関してFe−InP
による絶縁層を例に説明を行ったが、pn接合による埋
め込み構造でも、本発明の主旨を変えるものではない。 【0019】 【発明の効果】以上説明したように、本発明によれば、
光信号を光のまま波形整形する波形整形素子を提供する
ことができる。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to optical communication, optical switching,
The present invention relates to a signal waveform shaping element which is applied to an optical system for transmitting and processing an optical signal such as optical information processing and is effective for shaping a waveform of an optical signal. [0002] Considering the construction of an optical transmission processing system using light such as optical communication, optical switching, and optical information processing, optical loss in an optical fiber or an optical switch becomes a serious problem, and an attenuated optical signal is generated. Must be compensated by the optical amplifier. However, the following problem arises. First, the use of the optical amplifier degrades the waveform due to noise generated by the optical amplifier. FIG.
7A and 7B schematically show changes in waveform, where FIG. 7A is an example of a waveform that has not deteriorated, and FIG. 7B is an example of a waveform that has changed due to noise. Second, in long-distance optical transmission using an optical fiber, the waveform also deteriorates due to dispersion in the optical fiber.
FIGS. 5A and 5B schematically show changes in the waveform. FIG. 5A shows an example of a waveform that has not deteriorated, and FIG. 5B shows an example of a waveform that has changed due to noise. [0005] For this reason, conventionally, an optical signal is converted into an electric signal by a light receiving element, the waveform is electrically shaped, and then the optical signal is converted again into an optical signal. FIG. 6 shows a configuration example of a system used for such signal conversion. In the figure, reference numeral 61 denotes an optical / electrical conversion element, 62 denotes an electric waveform shaping element, and 63 denotes an electric / optical conversion element. [0006] However, the conventional signal waveform shaping element needs to convert an optical signal into an electric signal.
As the number of lines increases, the ratio of optical / electrical conversion and electrical / optical conversion in the entire system increases, and this has been a major bottleneck in reducing power consumption and cost. Therefore, there has been a demand for a means for waveform shaping of an optical signal as it is. Therefore, the present invention solves the above-mentioned problems,
It is an object of the present invention to provide a signal waveform shaping element for shaping an optical signal as it is. [0008] In order to solve the above problems, a signal waveform shaping element according to the present invention comprises a double layer comprising a clad layer, an active layer, and a clad layer sequentially laminated on a semiconductor substrate. A semiconductor laser type optical amplifying device comprising a hetero structure, a buried structure including an electric insulating layer provided on both sides of an active layer, and antireflection films provided on both end surfaces, wherein the active layer has a thickness of Is less than 0.4 μm and the width is less than 0.4 μm. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A signal waveform shaping element according to the present invention is provided on both sides of an active layer, a double hetero structure composed of a clad layer, an active layer, and a clad layer sequentially laminated on a semiconductor substrate. A semiconductor laser type optical amplifying device having a buried structure made of an electrically insulating layer provided on the substrate and antireflection films provided on both end faces, wherein the active layer has a thickness of less than 0.4 μm and a width of 0.4 μm. It is less than 4 μm. Further, the signal waveform shaping element according to the present invention has an electrode structure composed of at least one of an anode and a negative electrode. However, the signal waveform shaping element does not need to have an electrode because it operates essentially without a bias. The operation principle of the signal waveform shaping element according to the present invention is as follows. When a semiconductor laser type optical amplifying element is used with no bias, minute bias or reverse bias, a large loss exceeding 40 dB usually occurs. However, if the thickness of the active layer is smaller than 0.4 μm and the width is smaller than 0.4 μm, -3 dBm (0.5 mW)
It has a large loss for a weak optical input below, but a strong optical input more than that causes loss to be saturated, so-called saturable absorption occurs, and the loss is reduced, resulting in an optical input of 7 dBm (5 mW) or more. On the other hand, there is almost no loss. By utilizing this nonlinear effect, it is possible to shape the optical signal as it is. Hereinafter, a specific example of the signal waveform shaping element according to the present invention will be described. (Embodiment 1) FIG. 1 is a schematic perspective view for explaining an example of a signal waveform shaping element according to the present invention. In the figure, reference numeral 101 denotes an n-InP substrate, 102
Is an n-InP cladding layer, 103 is InGaAs having a thickness of 0.3 μm, a width of 0.3 μm, and a band gap wavelength of 1.5 μm.
sP active layer, 104 is a p-InP cladding layer, 105 and 106 are Fe-InP insulating layers, 107 is p-InG
aAsP cap layer, 108 is an n-side electrode,
Is a p-side electrode. The signal waveform shaping element has a total length of 300
This is a so-called semiconductor laser type optical amplifying element having an antireflection film (not shown) made of TiO 2 / SiO 2 on both end surfaces. When a semiconductor laser type optical amplifying element is used with no bias, a small bias (usually 5 mA or less) or a reverse bias, a large loss exceeding 40 dB usually occurs. In practice, the active layer has a thickness of 0.4 μm and a width of 0.4 μm.
When it has a size of 4 μm or more, as shown in FIG. 2, there is a large light loss regardless of the light input intensity. However, if the active layer is made smaller than 0.4 μm in thickness and 0.4 μm in width, for example, 0.3 μm in thickness and 0.3 μm in width, a weak light input of -3 dBm (0.5 mW) or less can be obtained. Although there is a large loss, the so-called saturable absorption occurs in which the loss is saturated for a strong optical input and the loss is reduced, and the loss is almost zero for an optical input of 7 dBm (5 mW) or more. become. If this nonlinear effect is used, for example, it is possible to shape a dull optical signal waveform as shown in FIG. 3A as it is, as shown in FIG. 3B. Since the active layer has a substantially square structure, the device basically has polarization-independent characteristics that do not depend on input polarization. (Embodiment 2) A signal waveform shaping element based on this embodiment has substantially the same structure as that of Embodiment 1, but differs from Embodiment 1 in that electrodes 108 and 109 are not provided. That is, since the signal waveform shaping element of the first embodiment scans essentially without bias, reference numeral 108,
The electrode 109 may be omitted. Therefore, the problem of power consumption is fundamentally solved by the biasless operation. In this specification, n-type InP
Although the description has been given by taking the substrate as an example, a similar effect can be obtained in a p-type substrate or another semiconductor crystal. Further, although the example of bulk InGaAsP is given as the active layer, a quantum well structure or a strained quantum well structure (compression strain, extension strain) may be used. InGaAlAs-based, I
Similar effects can be obtained with a material system such as an nAlAs system or an AlGaAs system. Further, regarding the buried structure, Fe-InP
Has been described as an example, but a buried structure by a pn junction does not change the gist of the present invention. As described above, according to the present invention,
It is possible to provide a waveform shaping element for shaping an optical signal as it is.

【図面の簡単な説明】 【図1】本発明にもとづく信号波形整形素子の一例を説
明するための模式的斜視図である。 【図2】図1に示す信号波形整形素子における光損失と
入力光強度との関係を説明するための図である。 【図3】図1に示す信号波形整形素子による信号波の整
形を説明する波形図であり、(a)は劣化した波形、
(b)は光のまま波形整形した場合の波形である。 【図4】従来技術による信号波形整形を説明するために
波形の変化を模式的に示した波形図であり、(a)は劣
化していない波形、(b)は雑音によって変化した波形
である。 【図5】従来技術による信号波形整形を説明するために
波形の変化を模式的に示した波形図であり、(a)は劣
化していない波形、(b)は雑音によって変化した波形
である。 【図6】従来の信号波形整形素子を説明するための回路
図である。 【符号の説明】 101 n−InP基板 102 n−InPクラッド層 103 InGaAsP活性層 104 p−InPクラッド層 105 Fe−InP絶縁層 106 Fe−InP絶縁層 107 p−InGaAsPキャップ層 108 n側電極 109 p側電極
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic perspective view for explaining an example of a signal waveform shaping element according to the present invention. FIG. 2 is a diagram for explaining the relationship between optical loss and input light intensity in the signal waveform shaping element shown in FIG. 3A and 3B are waveform diagrams for explaining signal waveform shaping by the signal waveform shaping element shown in FIG. 1, wherein FIG.
(B) shows the waveform when the waveform is shaped as it is. FIGS. 4A and 4B are waveform diagrams schematically showing waveform changes for explaining signal waveform shaping according to the related art, where FIG. 4A is a waveform that has not deteriorated, and FIG. 4B is a waveform that has changed due to noise. . FIGS. 5A and 5B are waveform diagrams schematically showing waveform changes for explaining signal waveform shaping according to the related art, where FIG. 5A is a waveform that has not deteriorated and FIG. 5B is a waveform that has changed due to noise. . FIG. 6 is a circuit diagram for explaining a conventional signal waveform shaping element. DESCRIPTION OF THE SYMBOLS 101 n-InP substrate 102 n-InP cladding layer 103 InGaAsP active layer 104 p-InP cladding layer 105 Fe-InP insulating layer 106 Fe-InP insulating layer 107 p-InGaAsP cap layer 108 n-side electrode 109 p Side electrode

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平5−75212(JP,A) 特開 平2−230221(JP,A) (58)調査した分野(Int.Cl.7,DB名) G02F 1/35 JICSTファイル(JOIS)────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-5-75212 (JP, A) JP-A-2-230221 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) G02F 1/35 JICST file (JOIS)

Claims (1)

(57)【特許請求の範囲】 【請求項1】 半導体基板上に順に積層されたクラッド
層、活性層、およびクラッド層からなるダブルヘテロ構
造と、活性層の両側に設けられた電気絶縁層からなる埋
め込み構造と、両端面に設けられた反射防止膜とを備え
る半導体レーザ型の光増幅素子であって、前記活性層は
厚さが0.4μm未満、幅が0.4μm未満であること
を特徴とする信号波形整形素子。
(57) [Claim 1] A double hetero structure comprising a clad layer, an active layer, and a clad layer sequentially laminated on a semiconductor substrate, and an electric insulating layer provided on both sides of the active layer. A semiconductor laser type optical amplifying device comprising a buried structure and antireflection films provided on both end surfaces, wherein the active layer has a thickness of less than 0.4 μm and a width of less than 0.4 μm. Characteristic signal waveform shaping element.
JP08142698A 1998-03-27 1998-03-27 Signal waveform shaping element Expired - Fee Related JP3469458B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP08142698A JP3469458B2 (en) 1998-03-27 1998-03-27 Signal waveform shaping element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08142698A JP3469458B2 (en) 1998-03-27 1998-03-27 Signal waveform shaping element

Publications (2)

Publication Number Publication Date
JPH11282032A JPH11282032A (en) 1999-10-15
JP3469458B2 true JP3469458B2 (en) 2003-11-25

Family

ID=13746049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP08142698A Expired - Fee Related JP3469458B2 (en) 1998-03-27 1998-03-27 Signal waveform shaping element

Country Status (1)

Country Link
JP (1) JP3469458B2 (en)

Also Published As

Publication number Publication date
JPH11282032A (en) 1999-10-15

Similar Documents

Publication Publication Date Title
US20030160292A1 (en) Semiconductor optical device
JP2606079B2 (en) Optical semiconductor device
JP2019008179A (en) Semiconductor optical device
JP3148169B2 (en) Optical semiconductor device
WO2020250291A1 (en) Semiconductor photonic integrated element and semiconductor photonic integrated element manufacturing method
JP2002151728A (en) Semiconductor light receiving element
JP3469458B2 (en) Signal waveform shaping element
US7130109B2 (en) Optical signal amplification device
JP2976001B2 (en) Optical semiconductor device
US20040075890A1 (en) Optical signal processing element using saturable absorber and optical amplifier
JP3708758B2 (en) Semiconductor photo detector
JP2012227330A (en) Photodiode
JP3345299B2 (en) Quantum well electro-optic modulator
JP3164063B2 (en) Semiconductor optical modulator and semiconductor optical device
JPH10135573A (en) Semiconductor laser, optical transmission module for parallel transmission, and application system using them
JPH10144950A (en) Semiconductor light receiving device
JP2605911B2 (en) Optical modulator and photodetector
JP3441385B2 (en) Optical coupling device
JPH11112013A (en) Semiconductor light receiving element
JPH07202316A (en) Selectively grown waveguide optical control element
WO2005124870A1 (en) Semiconductor quantum well devices
JP3025322B2 (en) Optical waveguide
JP2004253494A (en) Light control device for communication
JP2000082837A (en) Semiconductor light receiving element
JPH08122719A (en) Semiconductor optical phase modulator

Legal Events

Date Code Title Description
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080905

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080905

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090905

Year of fee payment: 6

LAPS Cancellation because of no payment of annual fees