JP3472224B2 - Method for forming diamond-like carbon film - Google Patents
Method for forming diamond-like carbon filmInfo
- Publication number
- JP3472224B2 JP3472224B2 JP2000058562A JP2000058562A JP3472224B2 JP 3472224 B2 JP3472224 B2 JP 3472224B2 JP 2000058562 A JP2000058562 A JP 2000058562A JP 2000058562 A JP2000058562 A JP 2000058562A JP 3472224 B2 JP3472224 B2 JP 3472224B2
- Authority
- JP
- Japan
- Prior art keywords
- diamond
- carbon film
- high frequency
- electrode
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Plasma Technology (AREA)
- Carbon And Carbon Compounds (AREA)
- Chemical Vapour Deposition (AREA)
Description
【0001】[0001]
【発明の属する技術分野】本発明は、ダイヤモンド状炭
素薄膜形成装置に関するものである。特に基板に対する
優れた密着性を維持しつつ、高い耐摩耗性、高平滑性、
高絶縁性、及び高硬度等の諸物性を有するダイヤモンド
状炭素薄膜を効率よく高速で形成することのできる装置
に関するものである。TECHNICAL FIELD The present invention relates to a diamond-like carbon thin film forming apparatus. In particular, while maintaining excellent adhesion to the substrate, high wear resistance, high smoothness,
The present invention relates to an apparatus capable of efficiently and rapidly forming a diamond-like carbon thin film having various physical properties such as high insulation and high hardness.
【0002】[0002]
【従来の技術】PVD分野ではスパッタ法、イオン化蒸
着法等が、CVD分野ではプラズマCVD法がその代表
的な形成方法として市販の装置を用いて検討されてい
る。特にプラズマCVD装置に関しては、容量結合型の
高周波グロー放電を利用する場合、その電極間距離は多
少の差はあれ20〜60mm程度であった。市販の高周波
プラズマCVD装置の概略を図1に示す。2. Description of the Related Art In the PVD field, a sputtering method, an ionization vapor deposition method, etc., and in the CVD field, a plasma CVD method has been studied as a typical forming method using a commercially available apparatus. Particularly in the case of the plasma CVD apparatus, when the capacitively coupled high frequency glow discharge was used, the distance between the electrodes was about 20 to 60 mm, although there was some difference. A schematic of a commercially available high frequency plasma CVD apparatus is shown in FIG.
【0003】[0003]
【発明が解決しようとする課題】よって、上記の装置で
は応用する上で要求されるダイヤモンド状炭素薄膜の物
性を得る為に必要とする自己バイアスが低圧領域の動作
圧力もしくは、高電力領域の高周波給電電力等の条件制
限により、前述の基板に対する高い密着性、あるいは高
速で形成する等の実現を阻害するものであった。Therefore, in the above-mentioned device, the self-bias required for obtaining the physical properties of the diamond-like carbon thin film required for application is the operating pressure in the low pressure region or the high frequency in the high power region. Due to the limitation of the conditions such as the power supply power, it is difficult to realize the above-mentioned high adhesion to the substrate or high-speed formation.
【0004】[0004]
【課題を解決するための手段】本発明の着眼点は、まず
ダイヤモンド状炭素薄膜の物性において、形成過程で付
与しなければならない最小の自己バイアス値を市販の装
置により動作圧力、高周波電力、電極面積比等の依存性
から究明し、容量結合を構成する電極の寸法に対する電
極間の距離の最適化を計り、両者に普遍的な相関がある
ことを見いだしたものである。本発明のダイヤモンド状
炭素薄膜形成装置は、平行平板型高周波プラズマCVD
装置において、基板を配置した高周波給電電極と平行か
つ並行に対向する接地電極との電極間距離を9mm以下の
容量結合とし、グロー放電の動作圧力を50Paから10
0Paの範囲内の任意の値に数値限定したことを特徴とす
る。また、高周波給電電極と対向する電極との距離の間
には、角型電極では対角寸法の1/30の電極間距離又
は円型電極では直径寸法の1/20の電極間距離に数値
限定したことを特徴とする。また、被膜形成に投入する
高周波給電電力は、単位面積あたりの電力密度として2
W/cm2 から3W/cm2 の範囲内の任意の値に数値限定
したことを特徴とする。また、被膜形成の炭素源気体と
してエチレンガスを用い、膜中に取り込まれる水素原子
の脱水素化を目的に添加する水素ガスの添加量を炭素源
気体に対し、25モル%以下に数値限定したことを特徴
とする。In the physical properties of a diamond-like carbon thin film, the minimum self-bias value that must be imparted during the formation process is the operating pressure, high-frequency power, and electrode of a commercially available device. By investigating from the dependence of the area ratio, etc., we optimized the distance between electrodes with respect to the dimensions of the electrodes that make up the capacitive coupling, and found that there is a universal correlation between the two. The diamond-like carbon thin film forming apparatus of the present invention is a parallel plate type high frequency plasma CVD.
In the device, the inter-electrode distance between the high-frequency power supply electrode on which the substrate is arranged and the ground electrode facing in parallel and in parallel is 9 mm or less, and the working pressure of glow discharge is 10 Pa to 10 Pa.
It is characterized in that the numerical value is limited to an arbitrary value within the range of 0 Pa. In addition, the distance between the high-frequency power supply electrode and the opposing electrode is numerically limited to an inter-electrode distance of 1/30 of a diagonal dimension for a square electrode or 1/20 of a diameter dimension for a circular electrode. It is characterized by having done. In addition, the high frequency power supplied to the film formation is 2 as the power density per unit area.
Characterized in that the W / cm 2 was numerically limited to any value within the range of 3W / cm 2. Further, ethylene gas was used as a carbon source gas for forming the film, and the amount of hydrogen gas added for the purpose of dehydrogenating hydrogen atoms taken into the film was numerically limited to 25 mol% or less based on the carbon source gas. It is characterized by
【0005】本発明のダイヤモンド状炭素薄膜形成装置
では、通常低圧で高い高周波電力を給電した条件範囲で
しか得られない自己バイアスが、電極間距離を狭くする
ことにより、動作圧力及び高周波電力の単独制御もしく
は、両者の相互制御により容易に効率よく得られる。こ
の効果により、高圧領域での形成が実現でき、同一の自
己バイアスでありながら高速形成が可能となった。ま
た、低電力領域での形成においても、同一の自己バイア
スが得られる為、下地基板へのダメージの低減及び被膜
自体の残留内部応力の低減等被膜の高品質化を促進する
作用がある。In the diamond-like carbon thin film forming apparatus of the present invention, the self-bias, which is usually obtained only in the condition range in which a high frequency power is supplied at a low pressure, reduces the operating distance and the high frequency power by reducing the distance between the electrodes. It can be easily and efficiently obtained by control or mutual control of both. Due to this effect, formation in a high pressure region can be realized, and high-speed formation can be performed with the same self-bias. Further, even in the formation in the low power region, the same self-bias can be obtained, so that it has an effect of promoting damage to the underlying substrate and reduction of residual internal stress of the film itself to promote high quality of the film.
【0006】[0006]
【実施例】本発明の実施例を図2に基づいて説明する。
容量結合型で平行平板構成の高周波プラズマCVD装置
を使用して、真空容器1内に原料供給系6よりエチレン
ガス及び水素ガスを所定の混合比並びに流量導入し、並
行に配置された高周波給電電極2と対向接地電極3との
間に高周波電源系7より13.56MHzの高周波を印
加し、プラズマ領域10を生成し、下記の反応条件によ
って基板4である厚さ0.5mm、直径6インチのSi
ウェハー上にダイヤモンド状炭素薄膜を形成した。電極
の寸法は角型で相方共に180×180mmであった。
本実施例では、グロー放電の動作圧力が50Paから1
00Paの範囲内の任意の値である一例として、動作圧
力を75Paとしてダイヤモンド状炭素薄膜を形成し
た。この時、反応時間を2minとしたがSiウェハー
上には約3.4μmのダイヤモンド状炭素薄膜が形成さ
れた。このダイヤモンド状炭素薄膜には、ハクリは全く
認められず全面に均一に形成されており、ビッカース硬
度を測定したところ非常に明瞭な圧痕が生じ、算式によ
り3900kg/mm2の硬度を有するものであった。
また、水素ガスを200SCCM導入し、高周波電力を
2W/cm2の電力密度で印加したときの自己バイアス
特性を図3に示す。EXAMPLE An example of the present invention will be described with reference to FIG.
Using a capacitively coupled parallel plate high frequency plasma CVD apparatus, ethylene gas and hydrogen gas were introduced into the vacuum container 1 from the raw material supply system 6 at a predetermined mixing ratio and flow rate, and the high frequency power supply electrodes were arranged in parallel. 2. A high frequency power of 13.56 MHz is applied between the high frequency power supply system 7 and the counter ground electrode 3 to generate a plasma region 10, and the substrate 4 having a thickness of 0.5 mm and a diameter of 6 inches is generated according to the following reaction conditions. Si
A diamond-like carbon thin film was formed on the wafer. The dimensions of the electrodes were square and both sides were 180 × 180 mm.
In this embodiment, the operating pressure of glow discharge is 50 Pa to 1
As an example of an arbitrary value within the range of 00 Pa, the operating pressure
Forming a diamond-like carbon thin film with a force of 75 Pa
It was At this time, although the reaction time was set to 2 minutes, a diamond-like carbon thin film of about 3.4 μm was formed on the Si wafer. In this diamond-like carbon thin film, no peeling was observed and the film was uniformly formed on the entire surface, and when the Vickers hardness was measured, a very clear indentation was generated, and the hardness was 3900 kg / mm 2 according to the formula. It was
Further, FIG. 3 shows the self-bias characteristics when hydrogen gas was introduced at 200 SCCM and high frequency power was applied at a power density of 2 W / cm 2 .
【0007】
〔反応条件〕
反応ガス :エチレン 純度99.99% 200SCCM
水素 純度99.999% 50SCCM
高周波電力 :2.2W/cm2
動作圧力 :75Pa
電極間距離 :8.5mm
基板温度 :非加熱
反応時間 :2min
自己バイアス:−380V
形成速度 :1.7μm/min
本実施例においては、炭素源気体としてエチレンガスを
用いたが、他の炭化水素化合物であっても同様の効果が
気体できることは言うまでもない。[Reaction conditions] Reaction gas: Ethylene purity 99.99% 200SCCM Hydrogen purity 99.999% 50SCCM High frequency power: 2.2 W / cm 2 Operating pressure: 75 Pa Electrode distance: 8.5 mm Substrate temperature: Unheated reaction Time: 2 min Self-bias: -380 V Formation rate: 1.7 μm / min In this example, ethylene gas was used as the carbon source gas, but it goes without saying that the same effect can be obtained with other hydrocarbon compounds. Yes.
【0008】[比較例1]実施例の反応条件において、
電極間距離のみを30mmにしたところ自己バイアスが−
230Vに低下し、得られたダイヤモンド状炭素薄膜は
約0.6μmの膜厚を有していたが、ビッカース硬度は
2100kg/mm2 であった。形成速度、硬度等ともに満
足の得られる値ではなかった。[Comparative Example 1] Under the reaction conditions of Example,
When only the distance between the electrodes was set to 30 mm, the self-bias-
The resulting diamond-like carbon thin film had a thickness of about 0.6 μm, but the Vickers hardness was 2100 kg / mm 2 . The formation rate and hardness were not satisfactory values.
【0009】[比較例2]実施例の反応条件において、
動作圧力のみを20Paにしたところ自己バイアスが−5
20Vとなり、イオンシース内での電界強度が高くなり
デポジションモードよりエッチングモードが支配的とな
り、さらにダメージを誘発し被膜のハクリが顕著に見ら
れ、被膜自体の残留内部応力の増加により膜厚及び、ビ
ッカース硬度等の評価ができず、成膜条件許容範囲から
逸脱していることが判明した。[Comparative Example 2] Under the reaction conditions of Example,
Self-bias is -5 when operating pressure is 20Pa.
At 20 V, the electric field strength in the ion sheath becomes high, the etching mode becomes dominant over the deposition mode, damage is further induced, and the peeling of the film is noticeable. Due to the increase of the residual internal stress of the film itself, the film thickness and However, the Vickers hardness could not be evaluated, and it was found that the film forming conditions were out of the allowable range.
【0010】[0010]
【発明の効果】本発明は、高周波プラズマCVD装置に
おいて容量結合を具現化する電極間距離を9mm以下とし
たことによりダイヤモンド状炭素薄膜の形成過程で重要
となる因子である所望の自己バイアスが、グロー放電の
動作圧力が高圧領域あるいは、高周波給電電力が低電力
領域においても効率よく容易に得られるという効果を有
するものであり、高速で高品質のダイヤモンド状炭素薄
膜を簡便に得ることができた。According to the present invention, the desired self-bias, which is an important factor in the process of forming a diamond-like carbon thin film, can be achieved by setting the distance between the electrodes for realizing capacitive coupling in the high frequency plasma CVD apparatus to 9 mm or less. It has an effect that the operating pressure of the glow discharge can be efficiently and easily obtained even in the high pressure region or the high frequency feeding power in the low power region, and the high speed and high quality diamond-like carbon thin film can be easily obtained. .
【図1】従来より用いられている高周波プラズマCVD
装置の内部構造を示す断面図FIG. 1 Conventionally used high-frequency plasma CVD
Sectional view showing the internal structure of the device
【図2】本発明の実施例で用いたダイヤモンド状炭素薄
膜を形成する為の高周波プラズマCVD装置の内部構造
を示す断面図FIG. 2 is a sectional view showing the internal structure of a high-frequency plasma CVD apparatus for forming a diamond-like carbon thin film used in the examples of the present invention.
【図3】自己バイアスの電極間距離及び動作圧力依存性
を示すグラフであるFIG. 3 is a graph showing the inter-electrode distance and the operating pressure dependency of self-bias.
1 真空容器 2 高周波給電電極 3 対向接地電極 4 基板 5 圧力計測系 6 原料供給系 7 高周波電源系 8 排気系 9 電極間距離 10 プラズマ領域 11 ブロッキングコンデンサー 12 自己バイアスモニター端子 1 vacuum container 2 High frequency power supply electrode 3 Opposite ground electrode 4 substrates 5 Pressure measurement system 6 Raw material supply system 7 High frequency power supply system 8 exhaust system 9 Distance between electrodes 10 plasma region 11 Blocking condenser 12 Self-bias monitor terminal
Claims (3)
前記高周波供給手段より高周波電力を供給して、前記第
1の電極と、前記第1の電極と一定の間隔で配置され接
地電位に保たれた第2の電極との間にプラズマを発生さ
せ、前記第1の電極に配置された基板にダイヤモンド状
炭素膜を形成するダイヤモンド状炭素膜形成方法であっ
て、 ダイヤモンド状炭素膜を形成するガスとして炭化水素ガ
スと水素ガスとを用い、前記間隔を9mm以下にし、動
作圧力を50〜100Paとし、前記基板を加熱するこ
となく前記ダイヤモンド状炭素膜を形成することを特徴
とするダイヤモンド状炭素膜形成方法。1. A high frequency power is supplied from the high frequency supply means to a first electrode connected to the high frequency supply means, and the first electrode and the first electrode are arranged at a constant interval to a ground potential. A method for forming a diamond-like carbon film, wherein plasma is generated between the diamond-like carbon film and a second electrode held at A diamond characterized in that a hydrocarbon gas and a hydrogen gas are used as a forming gas, the gap is set to 9 mm or less, an operating pressure is set to 50 to 100 Pa, and the diamond-like carbon film is formed without heating the substrate. Carbon film forming method.
チレンガスであることを特徴とするダイヤモンド状炭素
膜形成方法。2. The method for forming a diamond-like carbon film according to claim 1, wherein the hydrocarbon gas is ethylene gas.
力は2W/cm2〜3W/cm2であることを特徴とす
るダイヤモンド状炭素膜形成方法。3. An apparatus according to claim 1 or 2, wherein the high frequency power is diamond-like carbon film forming method which is a 2W / cm 2 ~3W / cm 2 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000058562A JP3472224B2 (en) | 1993-03-04 | 2000-03-03 | Method for forming diamond-like carbon film |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06923093A JP3471841B2 (en) | 1993-03-04 | 1993-03-04 | Diamond-like carbon film forming equipment |
| JP2000058562A JP3472224B2 (en) | 1993-03-04 | 2000-03-03 | Method for forming diamond-like carbon film |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP06923093A Division JP3471841B2 (en) | 1993-03-04 | 1993-03-04 | Diamond-like carbon film forming equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000256852A JP2000256852A (en) | 2000-09-19 |
| JP3472224B2 true JP3472224B2 (en) | 2003-12-02 |
Family
ID=30002094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000058562A Expired - Fee Related JP3472224B2 (en) | 1993-03-04 | 2000-03-03 | Method for forming diamond-like carbon film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3472224B2 (en) |
-
2000
- 2000-03-03 JP JP2000058562A patent/JP3472224B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000256852A (en) | 2000-09-19 |
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