JP3474495B2 - Substrate cleaning method and cleaning apparatus - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning method and a cleaning apparatus applied to a cleaning process of a substrate made of glass or the like in a manufacturing process of a liquid crystal display or the like.

[0002]

2. Description of the Related Art For example, a TFT (Thin Film Transistor)
r) A color liquid crystal panel is one in which a thin film transistor is provided for each pixel on a glass substrate. In the photolithography process in the manufacturing process, 3 μm to 10 μm
The fine processing of the pattern is performed.

Therefore, foreign matter such as dust adhering to the glass substrate greatly affects the yield. Therefore, for example, before the resist is applied in the photolithography process, the glass substrate is washed to remove the dust and the like as much as possible.

In the cleaning apparatus for cleaning such a glass substrate, a batch process has been hitherto predominantly performed by immersing the glass substrate in a liquid bath of acid or alkali in cassette units for cleaning. However, in recent years, a single-wafer method has become mainstream in which glass substrates can be cleaned one by one and can be inlined.

The reason for this is that the size of the substrate is significantly larger than that of a semiconductor wafer, and the cleaning performance required is mainly for removing particles of micron order and organic contaminants. It is considered that it is more effective to wash the glass substrates one by one.

The single-wafer cleaning apparatus is roughly classified into a roller-conveying type and a spin-type.

As shown in FIG. 7, the roller transfer type cleaning device 50 normally transfers the glass substrate 51 by the transfer rollers 52 provided at the lower part with the treated surface of the glass substrate 51 facing upward. It is something to wash. In this roller transport type cleaning device 50, the glass substrate 51 is transported by the transport rollers 52 and the glass substrate 51 is held. Then, with respect to the warp and the bending of the glass substrate 51, the gravity correction is naturally performed and the transport roller 52 ...
It is carried out by methods such as increasing the number of.

On the other hand, in the spin type, for example, Japanese Patent Laid-Open No. 6-
There is a cleaning device disclosed in Japanese Patent No. 273919. In this spin type cleaning device 60, as shown in FIGS. 8 and 9, the processing surface of the glass substrate 61 is faced up, and the processing back surface is fixed by a vacuum suction plate 62, and the glass substrate 61 is rotated during cleaning and drying. It has a structure that allows it. For fixing the outer peripheral portion of the glass substrate 61, the glass substrate 61 is held in a fitted state as shown in FIG.
There are those that are fixed by a circular frame plate 63 that rotates integrally with the above, and those that fix the four corners of the glass substrate 61 by mechanical chuck mechanisms.

[0009]

However, the above conventional cleaning apparatus has the following problems.

First, in both the roller transfer type cleaning device 50 and the spin type cleaning device 60, the size of the cleaning device becomes larger as the size of the substrate to be cleaned becomes larger. Therefore, cleaning and drying while moving and rotating the substrate tends to cause damage to the substrate.

Further, with respect to each individual method, the roller transfer type cleaning device 50 shown in FIG. 7 has the following problems.

As the glass substrate 51 becomes thinner and larger, the amount of warpage and bending of the glass substrate 51 also increases, and the problem of substrate cracking due to conveyance failure cannot be solved simply by increasing the number of conveyance rollers 52. Since it is transported horizontally basically, the cleaning liquid after cleaning stays on the glass substrate 51,
Recontaminate.

Further, since the glass substrate 51 has a large amount of warpage and bending, as shown in the figure, the ultrasonic vibration element 55 is used for showering with the brush 53 or cleaning water, or with the ultrasonic vibration element 55 in the megahertz range. It is difficult to adjust the distance to the glass substrate 51 of various cleaning tools such as MS (Mega Sonic) showers that add sonic vibrations, and the optimum value is provided between the glass substrate 51 and various cleaning tools over the entire surface of the glass substrate 51. It is virtually impossible to control.

Further, in the air knife method which is generally used as a drying tool, as shown in the figure, the accuracy of the distance between the glass substrate 51 and the blade edge of the air knife 56 is important, and the warp and bending are large. In some cases it cannot be dried cleanly.

Next, the spin type cleaning device 60 has the following problems.

In the case of the spin type, when the glass substrate 61 is fixed in size by a mechanical chuck mechanism as the size of the glass substrate 61 is increased, the glass substrate 61 is impacted by acceleration and deceleration during rotation.
There is a crack on the end surface of the substrate, or in the worst case, a crack occurs.

Also, due to the problem of motor capacity,
Even at the time of drying, only a rotation speed of about 1500 rpm was obtained,
It is difficult to dry cleanly.

The rotation motor becomes huge, and not only the power consumption thereof, but also the development period of a large motor and the cost increase due to the size increase of the motor become a problem at the time of development in the next-generation cleaning apparatus.

The present invention has been made in view of the above conventional problems, and an object thereof is to perform cleaning and drying even for a large-sized substrate without worrying about damage, warpage or bending of the substrate. Another object of the present invention is to provide a substrate cleaning method and a cleaning apparatus capable of preventing the cleaning liquid from staying and increasing the cost.

[0020]

In order to solve the above problems, the substrate cleaning method of the present invention uses a substrate to be cleaned as a lid of a cleaning chamber, and the substrate is cleaned and dried in the cleaning chamber. A method of cleaning a substrate, comprising:
When the substrate to be cleaned is mounted in the cleaning chamber, a reinforcing plate is brought into contact with the back surface of the substrate to be cleaned to reinforce the substrate to be cleaned.

According to the above invention, the substrate to be cleaned is used as the lid of the cleaning chamber, and the substrate to be cleaned is cleaned and dried in the cleaning chamber.

Therefore, since the substrate to be cleaned is fixed as a lid of the cleaning chamber, the substrate to be cleaned does not move during cleaning and drying. Therefore, it is possible to prevent the substrate from being damaged during cleaning and drying.

The substrate to be cleaned is used as a lid of the cleaning chamber, and the substrate to be cleaned is cleaned and dried in the cleaning chamber. This indicates that the wash chamber can be a closed system. Therefore, it is possible to prevent the cleaning liquid from splashing on the back surface of the substrate to be cleaned and staying on the back surface during cleaning.

Since the substrate to be cleaned is not rotated at the time of drying, no motor for rotating the substrate is required. Therefore, the cost associated with the motor can be reduced.

Further, since the substrate to be cleaned is used as the lid of the cleaning chamber, the cleaning device can be made compact.

As a result, even a large-sized substrate can be cleaned and dried without worrying about damage, warpage and bending of the substrate, and the cleaning liquid can be prevented from accumulating and the cost can be prevented from increasing. A method can be provided.

Further, according to the above invention, when the substrate to be cleaned is mounted in the cleaning chamber, the reinforcing plate is brought into contact with the back surface of the substrate to be cleaned to reinforce the substrate to be cleaned.

Therefore, since the substrate to be cleaned is reinforced by the reinforcing plate, the substrate to be cleaned does not warp even if the surface of the substrate to be cleaned is cleaned with a brush or the like inside the cleaning chamber or is dried by blowing air. It does not bend or bend.

Further, since there is no warpage or bending, the substrate to be cleaned maintains a flat state, so that, for example, even in the drying process with an air knife, the blade tip and the substrate to be cleaned are moved along with the movement of the blade edge of the air knife. The distance to the surface is constantly constant. Therefore, it is possible to easily control the distance between the blade edge and the surface of the substrate to be cleaned to an optimum value, which allows the drying to be performed accurately and efficiently.

Therefore, it is possible to provide a substrate cleaning method capable of cleaning and drying a large-sized substrate without worrying about damage and warpage or bending of the substrate.

In order to solve the above problems, the substrate cleaning method of the present invention is the same as the substrate cleaning method, in which the substrate to be cleaned is fixed by the reinforcing plate, and the substrate to be cleaned is reinforced before and after cleaning. It is characterized in that it is conveyed in a state of being fixed by a plate.

According to the above invention, the substrate to be cleaned is fixed by the reinforcing plate. Therefore, during cleaning and drying, the substrate to be cleaned can be fixed by the reinforcing plate so as not to move, and damage to the substrate to be cleaned such as cracks caused by moving the substrate to be cleaned during cleaning or drying. Can be prevented.

Before or after cleaning, the reinforcing plate conveys the substrate to be cleaned in a fixed state. That is,
For example, by providing a vacuum suction mechanism on the reinforcing plate,
The substrate to be cleaned can be transported in a fixed state. As a result, the transportation can be automated, and the cleaning process as a whole can be automated.

In order to solve the above-mentioned problems, the substrate cleaning method of the present invention cleans the substrate to be cleaned by moving a cleaning tool and a drying tool provided in the cleaning chamber in the substrate cleaning method. And is characterized by being dried.

According to the above invention, the substrate to be cleaned is cleaned and dried by moving the cleaning tool and the drying tool provided in the cleaning chamber.

Therefore, for example, in a drying tool, drying is performed while moving with an air knife. Therefore, unlike the conventional spin-type cleaning device, the substrate to be cleaned is not rotated and dried, so that damage such as cracking of the substrate to be cleaned due to rotation is prevented. Moreover, since a large capacity motor is not used, cost reduction can be achieved.

Further, since the substrate to be cleaned is also stationary in the cleaning step, damage to the substrate to be cleaned can be prevented.

As a result, it is possible to provide a method of cleaning a large-sized substrate, which can be cleaned and dried without worrying about damage, warpage or bending of the substrate, and which can prevent an increase in cost.

The substrate cleaning method of the present invention solves the above problems.
In order to determine, in the method of cleaning the substrate, the cleaning
Chamber upright or upside down or tilt
It is characterized by being washed and dried.

According to the above invention, the cleaning chamber is
Stand up or turn upside down or tilt to clean and
dry.

Therefore, the object in the cleaning chamber is
The position of the substrate to be cleaned is not only horizontal as in the conventional
Can be stood, inverted, tilted
It In addition, these actions apply to the entire cleaning chamber.
Can be done by

Therefore, the cleaning liquid can be easily removed after cleaning.
It can be carried out. Also, liquid flow occurs during cleaning
Therefore, the cleaning liquid can be saved.

As a result, cleaning and drying can be performed efficiently.
You can

The substrate cleaning method of the present invention, in order to solve the above problems, using a substrate to be cleaned as a lid of the cleaning chamber, in that the cleaning chamber, the cleaning tool and drying tools provided in the cleaning chamber the method of cleaning a substrate for cleaning and drying of the cleaned substrate by moving the
Where the cleaning chamber is stood or turned upside down.
It is characterized in that it is rolled or tilted to be washed and dried .

According to the above invention, the substrate to be cleaned is used as the lid of the cleaning chamber, and the substrate to be cleaned is cleaned and dried in the cleaning chamber.

Therefore, since the substrate to be cleaned is fixed as a lid of the cleaning chamber, the substrate to be cleaned does not move during cleaning and drying. Therefore, it is possible to prevent the substrate from being damaged during cleaning and drying.

Further, the substrate to be cleaned is used as a lid of the cleaning chamber, and the substrate to be cleaned is cleaned and dried in the cleaning chamber. This indicates that the wash chamber can be a closed system. Therefore, it is possible to prevent the cleaning liquid from splashing on the back surface of the substrate to be cleaned and staying on the back surface during cleaning.

Further, since the substrate to be cleaned is not rotated during drying, a motor for driving the substrate to rotate is not required. Therefore, the cost associated with the motor can be reduced.

Further, since the substrate to be cleaned is used as the lid of the cleaning chamber, the cleaning device can be made compact.

As a result, even a large-sized substrate can be cleaned and dried without worrying about damage, warpage or bending of the substrate, and the cleaning liquid can be prevented from accumulating and the cost can be prevented from increasing. A method can be provided.

Further, according to the above invention, the substrate to be cleaned is cleaned and dried by moving the cleaning tool and the drying tool provided in the cleaning chamber.

Therefore, for example, in a drying tool, drying is performed while moving with an air knife. Therefore, unlike the conventional spin-type cleaning device, the substrate to be cleaned is not rotated and dried, so that damage such as cracking of the substrate to be cleaned due to rotation is prevented. Moreover, since a large capacity motor is not used, cost reduction can be achieved.

Further, since the substrate to be cleaned is also stationary in the cleaning step, damage to the substrate to be cleaned can be prevented.

As a result, it is possible to provide a method of cleaning a large-sized substrate, which can be cleaned and dried without worrying about damage, warpage and bending of the substrate, and which can prevent an increase in cost.

Further, according to the above invention, the cleaning chamber is erected, turned upside down, or tilted to clean and dry.

Therefore, the position of the substrate to be cleaned in the cleaning chamber can be set not only horizontally as in the conventional case, but also the substrate to be cleaned can be erected, turned upside down, or tilted. Furthermore, these operations can be performed on the entire cleaning chamber.

Therefore, the cleaning liquid can be easily removed after cleaning. In addition, since a liquid flow is generated during cleaning, it is possible to save the cleaning liquid.

As a result, cleaning and drying can be performed efficiently.

In order to solve the above problems, the substrate cleaning method of the present invention uses a substrate to be cleaned as a lid of a cleaning chamber, and cleans and dries the substrate to be cleaned in the cleaning chamber. The cleaning chamber is characterized by standing, upside down, or tilting for cleaning and drying.

According to the above invention, the substrate to be cleaned is used as the lid of the cleaning chamber, and the substrate to be cleaned is cleaned and dried in the cleaning chamber.

Therefore, since the substrate to be cleaned is fixed as the lid of the cleaning chamber, the substrate to be cleaned does not move during cleaning and drying. Therefore, it is possible to prevent the substrate from being damaged during cleaning and drying.

The substrate to be cleaned is used as a lid of the cleaning chamber, and the substrate to be cleaned is cleaned and dried in the cleaning chamber. This indicates that the wash chamber can be a closed system. Therefore, it is possible to prevent the cleaning liquid from splashing on the back surface of the substrate to be cleaned and staying on the back surface during cleaning.

Moreover, since the substrate to be cleaned is not rotated during drying, a motor for rotationally driving is not required. Therefore, the cost associated with the motor can be reduced.

Furthermore, since the substrate to be cleaned is used as the lid of the cleaning chamber, the cleaning device can be made compact.

As a result, even a large-sized substrate can be cleaned and dried without worrying about damage, warpage or bending of the substrate, and the cleaning liquid can be prevented from accumulating and the cost can be prevented from increasing. A method can be provided.

Further, according to the above invention, the washing chamber is stood upside down, turned upside down, or tilted for washing and drying.

Therefore, the position of the substrate to be cleaned in the cleaning chamber can be set not only horizontally as in the conventional case, but also the substrate to be cleaned can be erected, turned upside down, or tilted. Furthermore, these operations can be performed on the entire cleaning chamber.

Therefore, the cleaning liquid after cleaning can be easily removed. In addition, since a liquid flow is generated during cleaning, it is possible to save the cleaning liquid.

As a result, cleaning and drying can be performed efficiently.

In order to solve the above-mentioned problems, the substrate cleaning apparatus of the present invention uses the substrate to be cleaned as a lid for the cleaning chamber, and the cleaning means and the drying means are provided inside the cleaning chamber. The substrate cleaning apparatus is characterized in that it is provided with a reinforcing means for abutting the back surface of the substrate to be cleaned mounted in the cleaning chamber to reinforce the substrate to be cleaned.

According to the above invention, the substrate to be cleaned is used as the lid of the cleaning chamber, and the cleaning means and the drying means are provided inside the cleaning chamber.

Therefore, since the substrate to be cleaned is fixed as the lid of the cleaning chamber, the substrate to be cleaned does not move during cleaning and drying. Therefore, it is possible to prevent the substrate from being damaged during cleaning and drying.

The substrate to be cleaned is used as a lid of the cleaning chamber, and the substrate to be cleaned is cleaned and dried by the cleaning means and the drying means in the cleaning chamber. This indicates that the wash chamber can be a closed system.
Therefore, it is possible to prevent the cleaning liquid from splashing on the back surface of the substrate to be cleaned and staying on the back surface during cleaning or the like.

Further, since the substrate to be cleaned is not rotated during drying, a motor for rotationally driving is not required. Therefore, the cost associated with the motor can be reduced.

Further, since the substrate to be cleaned is used as the cover of the cleaning chamber, the cleaning device can be made compact.

As a result, even a large-sized substrate can be cleaned and dried without worrying about damage, warpage or bending of the substrate, and the cleaning liquid can be prevented from staying and the cost can be prevented from increasing. A device can be provided.

Further, according to the above invention, the reinforcing means for contacting the rear surface of the substrate to be cleaned mounted in the cleaning chamber to reinforce the substrate to be cleaned is provided.

Therefore, since the substrate to be cleaned is reinforced by the reinforcing means, the substrate to be cleaned does not warp even if the surface of the substrate to be cleaned is cleaned with a brush or the like in the cleaning chamber or dried by blowing air. It does not bend or bend.

Further, since there is no warpage or bending, the substrate to be cleaned maintains a flat state, so that, for example, even in the drying process with an air knife, the blade tip and the substrate to be cleaned are moved along with the movement of the blade edge of the air knife. The distance to the surface is constantly constant. Therefore, it is possible to easily control the distance between the blade edge and the surface of the substrate to be cleaned to an optimum value, which allows the drying to be performed accurately and efficiently.

Therefore, it is possible to provide a substrate cleaning apparatus capable of cleaning and drying a large-sized substrate without worrying about damage, warpage or bending of the substrate.

In order to solve the above-mentioned problems, the substrate cleaning apparatus of the present invention is such that, in the substrate cleaning apparatus, the substrate to be cleaned mounted on the cleaning chamber is fixed and the substrate to be cleaned is transported before and after cleaning. It is characterized in that a fixing and conveying means that enables the fixing is provided.

According to the above-mentioned invention, the fixing and conveying means for fixing the substrate to be cleaned mounted in the cleaning chamber and capable of conveying the substrate to be cleaned before and after cleaning is provided.

Therefore, the substrate to be cleaned is fixed by the fixing and conveying means. Therefore, at the time of cleaning and drying, the substrate to be cleaned can be fixed by the fixing and conveying means so as not to move, so that the substrate to be cleaned may be cracked by moving the substrate to be cleaned at the time of cleaning or drying. Damage can be prevented.

Further, before or after cleaning, the substrate to be cleaned is conveyed in a fixed state by the fixing and conveying means. That is, for example, by providing a vacuum suction mechanism as the fixed transfer means, the substrate to be cleaned can be transferred in a fixed state. As a result, the transportation can be automated, and the cleaning process as a whole can be automated.

In order to solve the above problems, the substrate cleaning apparatus of the present invention uses the substrate to be cleaned as the lid of the cleaning chamber, and the cleaning means and the drying means are provided inside the cleaning chamber. A substrate cleaning apparatus is characterized in that it is provided with a fixing and conveying means for fixing the substrate to be cleaned mounted in the cleaning chamber and for conveying the substrate to be cleaned before and after cleaning.

According to the above invention, the substrate to be cleaned is used as the lid of the cleaning chamber, and the cleaning means and the drying means are provided inside the cleaning chamber.

Therefore, since the substrate to be cleaned is fixed as the lid of the cleaning chamber, the substrate to be cleaned does not move during cleaning and drying. Therefore, it is possible to prevent the substrate from being damaged during cleaning and drying.

The substrate to be cleaned is used as a lid of the cleaning chamber, and the substrate to be cleaned is cleaned and dried by the cleaning means and the drying means in the cleaning chamber. This indicates that the wash chamber can be a closed system.
Therefore, it is possible to prevent the cleaning liquid from splashing on the back surface of the substrate to be cleaned and staying on the back surface during cleaning or the like.

Since the substrate to be cleaned is not rotated at the time of drying, a motor for rotationally driving it is not necessary. Therefore, the cost associated with the motor can be reduced.

Further, since the substrate to be cleaned is used as the lid of the cleaning chamber, the cleaning device can be made compact.

As a result, even a large-sized substrate can be cleaned and dried without worrying about damage, warpage and bending of the substrate, and the cleaning liquid can be prevented from staying and the cost can be prevented from increasing. A device can be provided.

Further, according to the above invention, the fixing and conveying means for fixing the substrate to be cleaned mounted in the cleaning chamber and capable of conveying the substrate to be cleaned before and after cleaning is provided.

Therefore, the substrate to be cleaned is fixed by the fixing and conveying means. Therefore, at the time of cleaning and drying, the substrate to be cleaned can be fixed by the fixing and conveying means so as not to move, so that the substrate to be cleaned may be cracked by moving the substrate to be cleaned at the time of cleaning or drying. Damage can be prevented.

Before or after cleaning, the substrate to be cleaned is conveyed in a fixed state by the fixing and conveying means. That is, for example, by providing a vacuum suction mechanism as the fixed transfer means, the substrate to be cleaned can be transferred in a fixed state. As a result, the transportation can be automated, and the cleaning process as a whole can be automated.

In order to solve the above-mentioned problems, the substrate cleaning apparatus of the present invention is characterized in that the substrate cleaning apparatus is provided with angle adjusting means for standing, vertically inverting and tilting the cleaning chamber. I am trying.

According to the above invention, there is provided the angle adjusting means for vertically setting, inverting and tilting the cleaning chamber.

Therefore, the cleaning chamber can be cleaned and dried by the angle adjusting means while standing, inverting or tilting the cleaning chamber.

As a result, the position of the substrate to be cleaned in the cleaning chamber can be set not only horizontally as in the conventional case, but also the substrate to be cleaned can be erected, turned upside down, or tilted.
Furthermore, these operations can be performed on the entire cleaning chamber.

Therefore, the cleaning liquid can be easily removed after cleaning. In addition, since a liquid flow is generated during cleaning, it is possible to save the cleaning liquid.

As a result, cleaning and drying can be performed efficiently.

In order to solve the above-mentioned problems, the substrate cleaning apparatus of the present invention uses the substrate to be cleaned as a lid of the cleaning chamber, and the cleaning chamber and the drying means are provided inside the cleaning chamber. An apparatus for cleaning a substrate is characterized in that it is provided with an angle adjusting means for vertically setting, vertically inverting and inclining the cleaning chamber.

According to the above invention, the substrate to be cleaned is used as the lid of the cleaning chamber, and the cleaning means and the drying means are provided inside the cleaning chamber.

For this reason, since the substrate to be cleaned is fixed as the lid of the cleaning chamber, the substrate to be cleaned does not move during cleaning and drying. Therefore, it is possible to prevent the substrate from being damaged during cleaning and drying.

Further, the substrate to be cleaned is used as a lid of the cleaning chamber, and the substrate to be cleaned is cleaned and dried by the cleaning means and the drying means in the cleaning chamber. This indicates that the wash chamber can be a closed system.
Therefore, it is possible to prevent the cleaning liquid from splashing on the back surface of the substrate to be cleaned and staying on the back surface during cleaning or the like.

Further, since the substrate to be cleaned is not rotated during the drying, a motor for rotating the substrate is not required. Therefore, the cost associated with the motor can be reduced.

Further, since the substrate to be cleaned is used as the lid of the cleaning chamber, the cleaning device can be made compact.

As a result, even a large-sized substrate can be cleaned and dried without worrying about damage, warpage or bending of the substrate, and cleaning liquid can be prevented from staying and cost can be prevented from increasing. A device can be provided.

Further, according to the above-mentioned invention, the angle adjusting means for vertically setting, vertically inverting and inclining the cleaning chamber is provided.

Therefore, the cleaning chamber can be cleaned up and down, upside down, or inclined for cleaning and drying by the angle adjusting means.

As a result, the position of the substrate to be cleaned in the cleaning chamber is not only horizontal as in the conventional case, but also the substrate to be cleaned can be erected, turned upside down, or tilted.
Furthermore, these operations can be performed on the entire cleaning chamber.

Therefore, the cleaning liquid after cleaning can be easily removed. In addition, since a liquid flow is generated during cleaning, it is possible to save the cleaning liquid.

As a result, cleaning and drying can be performed efficiently.

In order to solve the above-mentioned problems, the substrate cleaning apparatus of the present invention is, in the substrate cleaning apparatus, provided with an internal pressure adjusting means and / or a cleaning chamber for adjusting the internal pressure of the cleaning chamber. It is characterized in that an internal temperature adjusting means for adjusting the internal temperature of the is provided.

According to the above invention, the cleaning chamber is provided with the internal pressure adjusting means for adjusting the internal pressure of the cleaning chamber and / or the internal temperature adjusting means for adjusting the internal temperature of the cleaning chamber.

Therefore, during cleaning and drying, the internal pressure of the cleaning chamber is adjusted by the internal pressure adjusting means,
The internal temperature of the cleaning chamber can be adjusted by the internal temperature adjusting means.

Therefore, since a reactive gas or the like can be used as the cleaning agent, dry cleaning can be performed. Also,
Since the internal temperature of the cleaning chamber can be adjusted, not only at room temperature but also the cleaning chamber can be heated to improve the activity of reactive gas, solvent, etc. It is also possible to cool the chamber for cleaning and drying.

Therefore, it is possible to provide a cleaning apparatus capable of cleaning and drying a large-sized substrate without worrying about damage, warpage and bending of the substrate, and various cleaning and drying.

In the present invention, both the internal pressure adjusting means and the internal temperature adjusting means may be provided, or only one of them may be provided.

In order to solve the above-mentioned problems, the substrate cleaning apparatus of the present invention uses the substrate to be cleaned as a lid of the cleaning chamber, and the cleaning chamber and the drying means are provided inside the cleaning chamber. A substrate cleaning apparatus, wherein the cleaning chamber is provided with an internal pressure adjusting unit for adjusting an internal pressure of the cleaning chamber and / or an internal temperature adjusting unit for adjusting an internal temperature of the cleaning chamber. There is.

According to the above invention, the substrate to be cleaned is used as the lid of the cleaning chamber, and the cleaning means and the drying means are provided inside the cleaning chamber.

Therefore, since the substrate to be cleaned is fixed as the lid of the cleaning chamber, the substrate to be cleaned does not move during cleaning and drying. Therefore, it is possible to prevent the substrate from being damaged during cleaning and drying.

Further, the substrate to be cleaned is used as a lid of the cleaning chamber, and the substrate to be cleaned is cleaned and dried by the cleaning means and the drying means in the cleaning chamber. This indicates that the wash chamber can be a closed system.
Therefore, it is possible to prevent the cleaning liquid from splashing on the back surface of the substrate to be cleaned and staying on the back surface during cleaning or the like.

Further, since the substrate to be cleaned is not rotated during drying, a motor for rotationally driving is not required. Therefore, the cost associated with the motor can be reduced.

Furthermore, since the substrate to be cleaned is used as the lid of the cleaning chamber, the cleaning device can be made compact.

As a result, even a large-sized substrate can be cleaned and dried without worrying about damage, warpage or bending of the substrate, and the cleaning liquid can be prevented from staying and the cost can be prevented from increasing. A device can be provided.

Further, according to the above invention, the cleaning chamber is provided with the internal pressure adjusting means for adjusting the internal pressure of the cleaning chamber and / or the internal temperature adjusting means for adjusting the internal temperature of the cleaning chamber.

Therefore, at the time of cleaning and drying, the internal pressure of the cleaning chamber is adjusted by the internal pressure adjusting means,
The internal temperature of the cleaning chamber can be adjusted by the internal temperature adjusting means.

Therefore, since a reactive gas or the like can be used as the cleaning agent, dry cleaning can be performed. Also,
Since the internal temperature of the cleaning chamber can be adjusted, not only at room temperature but also the cleaning chamber can be heated to improve the activity of reactive gas, solvent, etc. It is also possible to cool the chamber for cleaning and drying.

Therefore, it is possible to provide a cleaning apparatus capable of cleaning and drying a large-sized substrate without worrying about damage, warpage and bending of the substrate, and various cleaning and drying.

In the present invention, both the internal pressure adjusting means and the internal temperature adjusting means may be provided, or only one of them may be provided.

[0131]

DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] The following will describe one embodiment of the present invention with reference to FIG.

The substrate cleaned by the cleaning apparatus of this embodiment is, for example, a glass substrate used for a TFT (Thin Film Transistor) color liquid crystal panel. That is,
This glass substrate is provided with a thin film transistor for each pixel. For example, in a photolithography process in the manufacturing process, fine processing of a 3 μm to 10 μm pattern is performed. Therefore, foreign matter such as dust attached to the glass substrate greatly affects the yield. For this reason, for example, before the resist is applied in the photolithography process, the glass substrate is cleaned by the cleaning device to remove the dust and the like as much as possible.

The above glass substrate is, for example, 600 × 7.
The size is 00 mm, but the size is not limited to this, and may be smaller or larger than this size.

The glass substrate may be a substrate such as another semiconductor wafer, or may be another type of substrate. Furthermore, the glass substrate is not necessarily rectangular, but may be circular, elliptical, or another polygon.

As shown in FIG. 1, the cleaning device 1 described above is
The cleaning chamber 2 is adapted to be closed.

That is, the cleaning chamber 2 of the present embodiment is formed in a box shape of a substantially thin rectangular parallelepiped, and the opening 4 is provided at the central position of the upper part thereof. The opening 4
Is not necessarily in the center, but may be provided at the end. Further, although the opening 4 is provided above the cleaning chamber 2 in the present embodiment, the opening 4 is not necessarily limited to this, and may be provided below the cleaning chamber 2, for example. However, when the opening 4 is provided below, in order to improve the flow of the cleaning liquid, for example, the cleaning chamber 2 is tilted, or the substrate 3 to be cleaned, which will be described later, slightly protrudes from the bottom surface of the cleaning chamber 2. It is preferable to devise such as making it.

At the edge of the opening 4, a rectangular frame-shaped substrate receiving frame 5 is provided along the edge of the opening 4. Therefore, by placing the substrate 3 to be cleaned on the substrate receiving frame 5, the substrate 3 to be cleaned is supported and fixed so that the substrate 3 to be cleaned is fitted around the substrate 3 and does not move back and forth and left and right.

The board receiving frame 5 has, for example, the opening 4
It is formed so as to project inward from the inner peripheral portion thereof with a width of about 5 mm, and thereby receives the substrate 3 to be cleaned. Here, about 5 mm inward from the periphery of the substrate to be cleaned 3 is outside the effective range of the glass substrate, and thus cleaning is not necessary. Therefore, there is no effect of not cleaning this part.

The substrate receiving frame 5 does not necessarily have to be formed in the shape of a rectangular frame. For example, as shown in FIG.
The substrate 3 to be cleaned may be fixed only at the left and right ends, or the four corners of the substrate 3 to be cleaned may be fixed.

On the back surface of the substrate 3 to be cleaned, a contact plate 6 as a reinforcing means and a reinforcing plate is provided in a contact state.

The abutting plate 6 is formed to have substantially the same size as the substrate 3 to be cleaned, and substantially the entire back surface of the substrate 3 to be cleaned is in close contact. As a result, the contact plate 6 prevents the substrate 3 to be cleaned from bending or warping.

Although the contact plate 6 is formed to be slightly smaller than the substrate 3 to be cleaned in the same drawing, the contact plate 6 is not necessarily limited to this and may be slightly larger than the substrate 3 to be cleaned. good. However, even at that time, the contact plate 6 needs to be in close contact with and integrated with the back surface of the substrate 3 to be cleaned.

The contact plate 6 does not have to be entirely flat, and may have a lattice shape, a mesh shape, or the like.

On the other hand, inside the cleaning chamber 2, a cleaning tool, a rotary cleaning brush 7 as a cleaning means, and an MS.
(Mega Sonic) A shower nozzle 8 and an air knife 9 as a drying tool and a drying means are provided.

The rotary cleaning brush 7, MS shower nozzle 8 and air knife 9 are all movable in the directions of arrows AB. Further, the rotary cleaning brush 7, the MS shower nozzle 8 and the air knife 9 can be integrally moved in the directions of arrows AB, but can also be moved independently.

The rotary cleaning brush 7 has a rotary shaft 7a and can be rotated by a driving device (not shown). The rotary cleaning brush 7 has an arrow A-
When moving in the B direction, the brush comes into contact with the surface of the substrate 3 to be cleaned and brushes. Also, at this time, it is possible to use detergent or the like.

The MS shower nozzle 8 is for spraying cleaning water to which ultrasonic vibration in the megahertz region is added by an ultrasonic vibration element (not shown) while moving in the direction of arrow A-B to shower. In the MS shower nozzle 8, pure water is used as the cleaning water, and it is also possible to spray another cleaning liquid such as a peeling liquid or an etching liquid. As a result, it becomes possible to remove even foreign matter on the surface of the substrate to be cleaned 3 in the submicron order.

When the ultrasonic vibration element is not driven, it can be used as a mere shower. Therefore, the MS shower nozzle 8 is not necessarily provided with the MS, but can be simply a shower nozzle.

The air knife 9 is a device for ejecting air, and when moving in the direction of the arrow AB, the blade edge approaches the substrate 3 to be cleaned so as to dry the surface of the substrate 3 to be cleaned. It has become.

Further, the MS shower nozzle 8 and the air knife 9 are adapted to jet the cleaning liquid and air obliquely. As a result, it is possible to prevent the cleaning liquid or the like from covering the MS shower nozzle 8 or the like.

On the other hand, the cleaning chamber 2 is further provided with a drainage drain 10 on the bottom surface and an exhaust port 11 on the wall surface thereof.

Therefore, the cleaning liquid or the like can be discharged from the drainage drain 10 and the hot air blown from the air knife 9 or the like inside the cleaning chamber 2 can be discharged from the exhaust port 11.

A cleaning method by the cleaning apparatus 1 having the above structure will be described.

First, the opening 4 in the cleaning chamber 2
The substrate 3 to be cleaned is placed on the substrate receiving frame 5 with the surface of the substrate 3 to be cleaned facing the inside of the cleaning chamber 2. This restricts the front-back, left-right movement of the substrate 3 to be cleaned. Next, the contact plate 6 is placed on this. This contact plate 6 is
It is fixed so as not to move by a fixing device (not shown). Therefore, the substrate 3 to be cleaned is fixed so as not to move up and down. As a result, it is possible to correct the warpage and bending of the substrate 3 to be cleaned during cleaning.

Next, in the cleaning step, first, the rotating cleaning brush 7 moves in the direction of arrow A while rotating. At this time, for example, the detergent is jetted from the detergent nozzle (not shown) onto the surface of the substrate 3 to be cleaned, and the rotary cleaning brush 7 brushes the surface of the substrate 3 to be cleaned. The movement of the rotary cleaning brush 7 in the direction of arrow AB may be performed once or a plurality of times. As a result, it is possible to remove large dust and dust that is buried in the film generated during film formation.

Then, while the rotary cleaning brush 7 is moved to the end portion in the direction of the arrow A, MS shower of pure water, for example, is supplied from the MS shower nozzle 8, and the dirt attached to the surface of the substrate 3 to be cleaned is in the order of micron. To be washed.

Next, with this MS shower nozzle 8 also moving to the end portion in the direction of arrow A, the air knife 9 moves in the direction of arrow A, at which time the blade edge of the air knife 9 is brought to the surface of the substrate 3 to be cleaned. Spray air in close proximity. At this time, since the substrate 3 to be cleaned is kept flat by the contact plate 6, air can be blown onto the surface with the same pressure as a whole.

At this time, since the substrate 3 to be cleaned is mounted on the cleaning chamber 2, the substrate 3 to be cleaned is
All the droplets adhering to are dropped or blown off and do not remain on the surface of the substrate 3 to be cleaned.

On the other hand, the cleaning liquid being cleaned is the drainage drain 1
At the same time as being discharged from 0, the moist air and hot air inside the cleaning chamber 2 are exhausted from the exhaust port 11.

When the cleaning and drying are completed, the contact plate 6 is removed and the substrate 3 to be cleaned is removed from the cleaning chamber 2 and moved to the next step (not shown).

In the above cleaning and drying steps, the substrate 3 to be cleaned is stationary, and the cleaning tools such as the rotary cleaning brush 7 and the MS shower nozzle 8 and the drying tools such as the air knife 9 move. There is. Therefore, the substrate to be cleaned 3 does not move, and the possibility of damage is small.

In this way, the substrate to be cleaned 3 of this embodiment is
In the cleaning method and the cleaning apparatus 1, the substrate 3 to be cleaned is used as a lid of the cleaning chamber 2, and the cleaning chamber 2 is provided with a rotary cleaning brush 7, an MS shower nozzle 8 and an air knife 9. .

Therefore, since the substrate 3 to be cleaned is fixed as the lid of the cleaning chamber 2, the substrate 3 to be cleaned does not move during cleaning and drying. Therefore,
It is possible to prevent the substrate to be cleaned 3 from being damaged during cleaning and drying.

Further, the substrate 3 to be cleaned is used as a lid of the cleaning chamber 2, and the substrate 3 to be cleaned is dried and dried by the rotating cleaning brush 7, the MS shower nozzle 8 and the air knife 9 in the cleaning chamber 2. Be seen. This indicates that the cleaning chamber 2 can be a closed system.
Therefore, at the time of cleaning or the like, the cleaning liquid is used as the substrate 3 to be cleaned.
It is possible to prevent the cleaning liquid from scattering on the back surface of the cleaning solution and staying on the back surface of the cleaning solution.

Further, since the substrate 3 to be cleaned is not rotated during drying, a motor for rotationally driving is not required. Therefore, the cost associated with the motor can be reduced.

Further, the substrate 3 to be cleaned is the cleaning chamber 2
Since it is used as a lid of the cleaning device 1, the cleaning device 1 can be made compact.

As a result, even a large substrate 3 to be cleaned can be cleaned and dried without worrying about damage, warpage or bending of the substrate 3, and the cleaning liquid can be prevented from staying and the cost can be increased. It is possible to provide the cleaning method and the cleaning apparatus 1 for the substrate 3 to be cleaned which can be prevented.

In the cleaning method for the substrate 3 to be cleaned and the cleaning apparatus 1 of this embodiment, the rotary cleaning brush 7, the MS shower nozzle 8 and the air knife 9 provided in the cleaning chamber 2 are moved to clean the substrate. The substrate 3 is washed and dried.

Therefore, for example, in the drying tool, drying is performed while moving by the air knife 9.
Therefore, unlike the conventional spin-type cleaning device, the substrate to be cleaned 3 is not rotated and dried, so that the substrate 3 to be cleaned is prevented from being damaged due to the rotation or the like. Moreover, since a large capacity motor is not used, cost reduction can be achieved.

Further, the substrate 3 to be cleaned is also cleaned in the cleaning process.
Since the cleaning is performed in a stationary state, the substrate 3 to be cleaned can be prevented from being damaged.

As a result, the large substrate 3 to be cleaned can be cleaned and dried without worrying about damage, warpage or bending of the substrate 3, and the cost of the substrate 3 can be prevented from increasing. The cleaning method and the cleaning apparatus 1 can be provided.

[Embodiment 2] The following will describe another embodiment of the present invention in reference to FIG. 2 to FIG. For convenience of explanation, members having the same functions as those shown in the drawings of the first embodiment will be designated by the same reference numerals, and the description thereof will be omitted.

In the cleaning apparatus 20 of this embodiment, as shown in FIG. 2, the substrate 3 to be cleaned can be vacuum-sucked and conveyed.

That is, as shown in the figure, the cleaning chamber 22 has a circular opening 24 at the center of the upper portion thereof, and a step 24a around the periphery of the opening 24. The step portion 24a is formed by projecting the lower portion of the edge portion of the opening 24 inward.

An O-ring 25 is formed on the step portion 24a.
Is provided, and the cleaning chamber 22 is sealed by abutting the outer peripheral portion of the bottom surface of the adsorption / transport arm 26, which will be described later, thereby preventing the cleaning liquid and the like from leaking from this portion. The O-ring 25 may be a square ring when the opening 24 has a rectangular cross section.

On the other hand, in the present embodiment, the suction transfer arm 26 is provided as a reinforcing means for reinforcing the substrate 3 to be cleaned and a fixed transfer means.

The suction transfer arm 26 is provided with a mesh-shaped suction port 27 on its lower surface so that the substrate 3 to be cleaned can be sucked by a suction device (not shown). In the state where the substrate to be cleaned 3 is adsorbed, since the adsorption port 27 is formed in a mesh shape,
The substrate 3 to be cleaned is maintained in a horizontal state, and is in a state in which it does not warp or bend.

The size of the suction port 27 depends on the substrate 3 to be cleaned.
It is preferable that the size is approximately the same as the size. However, it is not necessary that all of the suction ports 27 have the suction function, and the suction ports 27 may partially suction. This is because it is sufficient if the substrate to be cleaned 3 can be adsorbed to the extent that it can be transported without being partially warped or bent.

Further, the suction / transport arm 26 is configured to be freely movable, so that after suctioning the substrate 3 to be cleaned at another location, it is moved to above the opening 24 of the cleaning chamber 22. To be cleaned substrate 3
And then the suction transfer arm 26 moves downward, whereby the suction transfer arm 26 is placed on the O-ring 25 in the step portion 24 a of the opening 24. At this time, as shown in FIG.
4, the substrate 3 to be cleaned is also fitted into the side surface of the step portion 4a. As a result, the cleaning chamber 22 becomes a closed system.

Here, in the present embodiment, the bottom surface of the suction transfer arm 26 is, for example, about 10 with respect to the substrate 3 to be cleaned.
It is formed to be large by about mm. However, the present invention is not limited to this, and as shown in the first embodiment, the bottom surface of the suction transfer arm 26 is formed smaller than the substrate to be cleaned 3,
The outer peripheral portion of the substrate to be cleaned 3 is about 5 mm, and the step portion 24 is
It may be formed so as to be mounted on a.

After the suction / transport arm 26 is thus attached to the cleaning chamber 22, the suction / transport arm 26 is locked by the lock mechanism (not shown) so as not to come off from the cleaning chamber 22.

Further, in the present embodiment, the exhaust port 11 is provided at the same place as the cleaning chamber 2 shown in the first embodiment, but the drain drain 28 has the cleaning chamber 22 as shown in FIG. Is provided on the bottom surface of the right end of the. This is because the cleaning chamber 22 is rotatable as will be described later. This is because the drainage drain 28 at the end improves the flow of the liquid.

On the other hand, as described above, the cleaning device 20 of the present embodiment is, as shown in FIGS. 4 (a) (b) (c),
The cleaning chamber 22 itself is rotated by an angle adjusting mechanism (not shown) as an angle adjusting means so that its inclination angle can be adjusted.

That is, when it is desired to set the cleaning chamber 22 upright, as shown in FIG. 4A, the cleaning chamber 22 is approximately 90 degrees centered on a rotation shaft (not shown) provided in the approximate center of the cleaning chamber 22. Will be erected on.
Further, as shown in FIG. 4B, the state shown in FIG.
As shown in (c), it is also possible to invert and tilt so that the top and bottom are reversed.

That is, the cleaning chamber 22 can rotate 360 degrees about a rotation shaft (not shown).
This facilitates removal of the cleaning liquid after cleaning.

In the above description, the suction transfer arm 26 with the substrate 3 to be cleaned is rotated while the cleaning chamber 22 is covered, but the invention is not limited to this. In the rotated state,
It is also possible to attach the suction transfer arm 26 that has sucked the substrate 3 to be cleaned to the cleaning chamber 22.

The cleaning operation of the cleaning device 20 having the above structure will be described.

First, as shown in FIG. 2, the substrate to be cleaned 3 prepared in another place is sucked by the suction transfer arm 26. The suction is performed by sucking with a vacuum pump (not shown).

Next, the suction transfer arm 26 that has sucked the substrate 3 to be cleaned is moved to above the cleaning chamber 22, and the suction transfer arm 26 is fitted into the opening 24 of the cleaning chamber 22. As a result, as shown in FIG. 3, the cleaning chamber 22 is in a sealed state. At this time, the suction transfer arm 26 is locked by a lock mechanism (not shown) so that the suction transfer arm 26 does not come off from the cleaning chamber 22 during cleaning.

In this state, cleaning and drying are performed by the rotary cleaning brush 7, the MS shower nozzle 8, and a simple shower using the MS shower nozzle 8. At this time, as shown in FIGS. 4A, 4B, and 4C, the cleaning chamber 2
2 is tilted at any angle such as vertical, tilted, upside down and the like.
The cleaning liquid used for cleaning and drying is drainage drain 2
Air such as hot air is exhausted from the exhaust port 11 while being discharged from the exhaust port 8.

As described above, in the present embodiment, since the cleaning chamber 22 is inclined, the drainage from the drainage drain 28 and the exhaust from the exhaust port 11 are efficiently performed.

During this period in which the substrate 3 to be cleaned is being cleaned and dried, the substrate 3 to be cleaned is almost entirely adsorbed by the mesh-shaped adsorption port 27, so that the substrate 3 to be cleaned 3 is cleaned.
Does not warp or bend.

Further, the cleaning chamber 22 is a closed system due to the adsorption transfer arm 26 coming into contact with the O-ring 25, so that the cleaning liquid is transferred to the back surface of the substrate 3 to be cleaned during cleaning, that is, outside the cleaning chamber 22. It does not scatter and stain the back surface of the substrate 3 to be cleaned.

Further, in this cleaning and drying process, the substrate 3 to be cleaned is stationary, and the cleaning tool such as the rotating cleaning brush 7 and the MS shower nozzle 8 and the drying tool such as the air knife 9 are moved. ing.

Then, when the cleaning and drying of the substrate 3 to be cleaned is completed, the inclined cleaning chamber 22 is returned to its original horizontal state, and the lock mechanism (not shown) is released.
The suction transfer arm 26 is removed from the cleaning chamber 22,
The substrate is moved to another place (not shown), the suction mechanism of the suction transfer arm 26 is released at a predetermined place, and the substrate 3 to be cleaned is placed. Then, the substrate 3 to be cleaned is moved to the next step (not shown).

As a result, in the present embodiment, the movable suction transfer arm 26 sucks the whole or a part of the back surface of the substrate to be cleaned 3 and the suction transfer arm 26 and the substrate 3 to be cleaned are integrated. The suction transfer arm 26 and the substrate 3 to be cleaned, which are corrected for warpage and flexure of the substrate 3 to be cleaned, are provided in a part of the cleaning chamber 2 with an opening 24 having substantially the same size as the substrate 3 to be cleaned. The closed type cleaning device for cleaning and drying the substrate 3 to be cleaned is used as it is as the lid of the cleaning device 20 provided with.

Therefore, due to the suction effect of the suction / transport arm 26, the weaknesses of the thin and large substrate, such as warpage and bending, can be corrected, and uniform cleaning and drying can be performed on the entire substrate. Also,
Since it is the single-chamber cleaning device 20, the movement of the substrate 3 to be cleaned is extremely small, which is very advantageous for substrate cracking.

Further, since the warp and the bending are corrected, it is possible to easily control the distance between the substrate 3 to be cleaned and the cleaning tool to an optimum value.

Since the air knife 9 is used, it can be dried cleanly.

Further, the substrate 3 to be cleaned is also cleaned and dried.
Is stationary, and the cleaning tools and the drying tools such as the air knife 9 are moved, so that a rotating operation is not necessary in the cleaning and drying processes. Therefore, the substrate 3 to be cleaned can be prevented from cracking.

Another advantage is that since it is a closed type, the cleaning liquid does not flow around to the back surface of the substrate during cleaning or drying by the air knife 9. In addition, the position for cleaning can be set not only horizontally with the conventional cleaning surface facing upward, but also upside down, vertical, tilt, etc., so cleaning liquid can be easily removed after cleaning and the liquid flow is Since it is generated, it is possible to save the cleaning liquid. Further, since a plurality of cleaning tools can be used continuously, space can be saved.

The cleaning chamber 22 has a thin rectangular shape, and spaces are provided at both ends of the substrate 3 to be cleaned. For this reason, the rotary cleaning brush 7 is attached to either end side.
And the MS shower nozzle 8 and the air knife 9 can be accommodated, and these cleaning and drying tools can be used continuously. This means that the cleaning chamber 22 can be saved in space.

Thus, the substrate to be cleaned 3 of this embodiment is
In the cleaning method and the cleaning apparatus 20 of FIG.
The suction transfer arm 26 that reinforces the substrate to be cleaned 3 by contacting the back surface of the substrate to be cleaned 3 mounted thereon is provided.

Therefore, since the substrate 3 to be cleaned is reinforced by the suction transfer arm 26, the surface of the substrate 3 to be cleaned is cleaned by the rotary cleaning brush 7 or the like inside the cleaning chamber 22 or dried by blowing air. However, the substrate 3 to be cleaned does not warp or bend.

Further, since there is no warp or flexure, the substrate 3 to be cleaned maintains a flat state, so that, for example, even in the drying process with the air knife 9, the blade edge and the object to be coated are moved by the movement of the blade edge of the air knife 9. The distance from the surface of the cleaning substrate 3 is constantly constant. Therefore, the blade edge and the substrate 3 to be cleaned are
You can easily control the distance to the surface of the
As a result, the drying can be performed accurately and efficiently.

Therefore, there is provided a cleaning method and a cleaning apparatus 20 for a substrate 3 to be cleaned, which is capable of cleaning and drying a large substrate 3 without worrying about damage, warpage or bending of the substrate 3. You can

In addition, in the cleaning apparatus 20 for cleaning a substrate 3 to be cleaned of the present embodiment, the substrate 3 to be cleaned mounted on the cleaning chamber 22 is fixed, and the substrate 3 to be cleaned can be conveyed before and after cleaning. A transfer arm 26 is provided.

Therefore, the substrate 3 to be cleaned is fixed by the suction transfer arm 26. Therefore, at the time of cleaning and drying, the substrate 3 to be cleaned can be fixed by the suction transfer arm 26 so as not to move. Therefore, the substrate 3 to be cleaned by moving the substrate 3 to be cleaned at the time of cleaning or drying. It is possible to prevent damage such as cracking.

Before or after cleaning, the substrate 3 to be cleaned is transferred by the suction transfer arm 26 in a fixed state. That is, for example, by providing a vacuum suction mechanism such as a suction transport arm 26 as the fixed transport means, the substrate 3 to be cleaned can be transported in a fixed state. As a result, the transportation can be automated, and the cleaning process as a whole can be automated.

Further, the cleaning apparatus 20 for cleaning the substrate 3 according to the present embodiment is provided with an angle adjusting mechanism for vertically setting the cleaning chamber 22, inverting it and tilting it.

Therefore, the angle adjusting mechanism allows the cleaning chamber 22 to stand, be turned upside down, or be tilted for cleaning and drying.

As a result, the position of the substrate 3 to be cleaned in the cleaning chamber 22 can be set not only horizontally as in the conventional case, but also the substrate 3 to be cleaned can be erected, turned upside down, or tilted. Further, these operations can be performed on the entire cleaning chamber 22.

Therefore, the cleaning liquid can be easily removed after cleaning. In addition, since a liquid flow is generated during cleaning, it is possible to save the cleaning liquid.

As a result, cleaning and drying can be performed efficiently.

In the present embodiment, vacuum suction is used as the suction mechanism, but the suction mechanism is not limited to this. For example, when the substrate 3 to be cleaned is a magnetic substance such as iron, suction by a magnet is also applicable. is there.

[Embodiment 3] The following will describe another embodiment of the present invention in reference to FIG. For convenience of explanation, members having the same functions as the members shown in the drawings of the first and second embodiments are given the same reference numerals,
The description is omitted.

As shown in FIG. 5, the cleaning apparatus 30 of the present embodiment is capable of adjusting the internal temperature of the cleaning chamber 32 and performing dry cleaning with a reactive gas.

That is, as shown in the figure, the cleaning device 30 is provided with a heater 31 as an internal temperature adjusting means on the bottom surface and both side surfaces of the cleaning chamber 32. By turning on / off the heater 31, The internal temperature of the cleaning chamber 32 can be adjusted.

Although the heater 31 is provided as the temperature adjusting mechanism in the present embodiment, the present invention is not limited to this. For example, when cooling, cooling water can be circulated around the cleaning chamber 32 or a chiller. You may install a unit. In addition, the cleaning device 30 has a heater 31
Both the cooling water pipe and the cooling water pipe may be provided.

Further, the cleaning chamber 32 is provided with a reactive gas suction port 33 at the right end portion in FIG.
Gases such as ₄ , SF ₆ , HCl, SO ₃ , BCl ₃ , and O ₂ can flow in as a single substance or in a mixed state.

Further, the cleaning chamber 32 is provided with a pressurizing / depressurizing port 34 near the left end in FIG.
Pump 3 as internal pressure adjusting means for pressurization or depressurization
5, the inside of the cleaning chamber 32 can be pressurized or depressurized.

By cleaning the substrate 3 to be cleaned while adjusting the temperature and the pressure using this reactive gas, it is possible to remove organic residues, reaction products, resist residues, etc. on the substrate surface.

Of course, the combination with the cleaning and drying tools and the angle adjusting device described in the second and third embodiments is possible, and the dry cleaning, the wet cleaning and the drying are performed by a single device. It is possible to reduce the floor area of the device and the carrying capacity.

As described above, in the cleaning apparatus 30 of this embodiment, the cleaning chamber 32 is provided with the pump 35 for adjusting the internal pressure of the cleaning chamber 32 and the heater 31 for adjusting the internal temperature of the cleaning chamber 32. .

Therefore, at the time of cleaning and drying, the internal pressure of the cleaning chamber 32 can be adjusted by the pump 35 and the internal temperature of the cleaning chamber 32 can be adjusted by the heater 31.

Therefore, since it is possible to use a reactive gas or the like as the cleaning agent, dry cleaning can be performed. Also,
Since the internal temperature of the cleaning chamber 32 can be adjusted, not only room temperature but also the heating of the cleaning chamber 32 can be performed to improve the activity of reactive gas, solvent, etc., while cooling is preferable. Is the cleaning chamber 32
It is also possible to cool, wash and dry.

Therefore, a cleaning method and a cleaning apparatus 30 which can perform a variety of cleaning and drying can be performed on a large-sized substrate without worrying about damage, warpage or bending of the substrate 3 to be cleaned, and various cleaning and drying. Can be provided.

[Embodiment 4] The following will describe another embodiment of the present invention in reference to FIG. For convenience of explanation, members having the same functions as those shown in the drawings of the first to third embodiments are designated by the same reference numerals and the description thereof will be omitted.

The cleaning apparatus 40 of this embodiment can be applied as a resist stripping apparatus by supplying a resist stripping solution as shown in FIG.

That is, in the cleaning device 40, as shown in the figure, a movable peeling nozzle 41 is provided inside a cleaning chamber 42, and the peeling nozzle 41 stores in a solvent tank 42. A solvent such as the peeled liquid is supplied by the supply pump 43.

The solvent tank 42 is provided with a tank heater 44, and the tank heater 44 raises the temperature of the solvent to promote the activation of the solvent.

Therefore, in order to inject the solvent from the peeling nozzle 41 in a state where the activity of the solvent is increased, the peripheral portion of the cleaning chamber 42 is the same as the cleaning chamber 32 shown in the third embodiment. , A heater 31 is provided.

As shown in the figure, a drain 45 is provided at the right end of the cleaning chamber 42 so that the solvent after cleaning can be discharged.

The substrate 3 to be cleaned is cleaned by the cleaning device 40 having the above structure.
When the cleaning is performed, first, the heated solvent is supplied from the solvent tank 42 to the peeling nozzle 41 by the supply pump 43 and sprayed onto the substrate 3 to be cleaned.

As a result, the resist attached to the substrate 3 to be cleaned is peeled off. At this time, the peeling nozzle 41 is movable, so that the solvent can be sprayed onto the entire surface of the substrate 3 to be cleaned.

Then, it is washed with MS shower nozzle 8 and dried with air knife 9. Note that the MS shower nozzle 8 does not necessarily need to add ultrasonic waves. Therefore, unlike the MS shower nozzle 8, it is not always necessary to have an ultrasonic mechanism.

Further, while the main cleaning device 40 functions only as a resist stripping device, it can also be conveyed to the above-mentioned cleaning devices 1, 20, 30 and the like for cleaning for subsequent cleaning processing.

Further, in the cleaning process by the cleaning device 40, the solvent is discharged from the drain 45, but the drain 45 is branched depending on the time of supplying the stripping solution and the time of washing with water, and a separate mechanism is provided to discharge the solvent separately. It is also possible.

Further, in the case where the substrate 3 to be cleaned contains a metal material such as aluminum which is easily corroded, a rinse treatment with a suitable rinse liquid, that is, a treatment between the stripping treatment and the water washing treatment, It is also possible to add a replacement process.

As described above, in the substrate cleaning method and the cleaning apparatus 40 of this embodiment, not only pure water but also a stripping solution and an etching solution can be used as the cleaning solution.
Therefore, by supplying the resist stripping solution, it can be used as a resist stripping apparatus.

Further, since it is a closed type, it is possible to carry out a gas system treatment, and in that case, a continuous process with a wet process is also possible.

[0242]

As described above, the substrate cleaning method of the present invention uses the substrate to be cleaned as the lid of the cleaning chamber, and the substrate is cleaned and dried in the cleaning chamber. Thus, when the substrate to be cleaned is mounted in the cleaning chamber, a reinforcing plate is brought into contact with the back surface of the substrate to be cleaned to reinforce the substrate to be cleaned.

Therefore, since the substrate to be cleaned is fixed as the lid of the cleaning chamber, the substrate to be cleaned does not move during cleaning and drying. Therefore, it is possible to prevent the substrate from being damaged during cleaning and drying.

Further, since the cleaning chamber can be a closed system, it is possible to prevent the cleaning liquid from splashing on the back surface of the substrate to be cleaned and staying on the back surface of the substrate to be cleaned during cleaning or the like.

Further, since a motor for rotating and driving the substrate to be cleaned at the time of drying is not required, the cost associated with the motor can be reduced.

Further, since the substrate to be cleaned is used as the cover of the cleaning chamber, the cleaning device can be made compact.

As a result, even a large-sized substrate can be cleaned and dried without worrying about damage, warpage or bending of the substrate, and the cleaning liquid can be prevented from staying and the cost can be prevented from increasing. There is an effect that a method can be provided.

Further, according to the above invention, when the substrate to be cleaned is mounted in the cleaning chamber, the reinforcing plate is brought into contact with the back surface of the substrate to be cleaned to reinforce the substrate to be cleaned.

Therefore, even if the surface of the substrate to be cleaned is cleaned with a brush or the like inside the cleaning chamber, or is blown with air to dry, the substrate to be cleaned does not warp or bend.

Further, since there is no warpage or bending, the substrate to be cleaned maintains a flat state, which allows the blade tip and the substrate to be cleaned along with the movement of the blade tip of the air knife, for example, even in the drying step with an air knife. The distance to the surface is constantly constant. Therefore, the distance between the blade edge and the surface of the substrate to be cleaned can be easily controlled to an optimum value, and the drying can be performed accurately and efficiently.

Therefore, it is possible to provide the effect of providing a method of cleaning a substrate, which is capable of cleaning and drying a large-sized substrate without worrying about damage, warpage or bending of the substrate.

As described above, the method of cleaning a substrate of the present invention is the same as the method of cleaning a substrate described above, in which the substrate to be cleaned is fixed by the reinforcing plate, and the substrate to be cleaned is cleaned by the reinforcing plate before and after cleaning. This is a method of transporting in a fixed state.

Therefore, during cleaning and drying, the substrate to be cleaned can be fixed by the reinforcing plate so as not to move, so that the substrate to be cleaned is cracked by moving the substrate to be cleaned during cleaning or drying. It is possible to prevent damage such as.

Further, before or after cleaning, the substrate to be cleaned is conveyed while being fixed by the reinforcing plate, so that the conveyance can be automated, and as a result, the cleaning process as a whole can be automated. Play.

As described above, in the substrate cleaning method of the present invention, in the substrate cleaning method, the cleaning tool and the drying tool provided in the cleaning chamber are moved to clean and dry the substrate to be cleaned. Is the way.

Therefore, unlike the conventional spin type cleaning apparatus, the substrate to be cleaned is not rotated and dried, so that damage such as cracking of the substrate to be cleaned due to rotation can be prevented. Moreover, since a large capacity motor is not used, cost reduction can be achieved.

Furthermore, since the substrate to be cleaned is also stationary in the cleaning step, damage to the substrate to be cleaned can be prevented.

As a result, it is possible to provide a method of cleaning a large-sized substrate, which can be cleaned and dried without worrying about damage, warpage and bending of the substrate, and which can prevent an increase in cost. Produce an effect.

The substrate cleaning method of the present invention is as described above.
In the method for cleaning a substrate, the cleaning chamber
Stand upright, upside down or tilted for cleaning
And a method of drying.

Therefore, the cleaning in the cleaning chamber is performed.
The position of the substrate to be cleaned is not only horizontal as in the past
It can be tilted, turned upside down, or tilted.
Furthermore, these operations are performed on the entire cleaning chamber
I can.

Therefore, the cleaning liquid can be easily removed after cleaning.
It can be carried out. Also, liquid flow occurs during cleaning
Therefore, the cleaning liquid can be saved.

As a result, cleaning and drying can be performed efficiently.
The effect that can be achieved.

In the substrate cleaning method of the present invention, the substrate to be cleaned is used as the lid of the cleaning chamber as described above, and the cleaning tool and the drying tool provided in the cleaning chamber are moved in the cleaning chamber. A method of cleaning a substrate for cleaning and drying a substrate to be cleaned by :
Whether the cleaning chamber is upright or upside down
Alternatively, it is a method of inclining and washing and drying .

Therefore, since the substrate to be cleaned is fixed as the lid of the cleaning chamber, the substrate to be cleaned does not move during cleaning and drying. Therefore, it is possible to prevent the substrate from being damaged during cleaning and drying.

Further, since the cleaning chamber can be a closed system, it is possible to prevent the cleaning liquid from splashing on the back surface of the substrate to be cleaned and staying on the back surface during cleaning.

Further, since a motor for rotating and driving the substrate to be cleaned at the time of drying is not required, the cost associated with the motor can be reduced.

Furthermore, since the substrate to be cleaned is used as the lid of the cleaning chamber, the cleaning device can be made compact.

As a result, even a large-sized substrate can be cleaned and dried without worrying about damage, warpage or bending of the substrate, and the cleaning liquid can be prevented from staying and the cost can be prevented from increasing. There is an effect that a method can be provided.

Further, according to the above invention, the substrate to be cleaned is cleaned and dried by moving the cleaning tool and the drying tool provided in the cleaning chamber.

Therefore, unlike the conventional spin type cleaning apparatus, the substrate to be cleaned is not rotated and dried, so that damage such as cracking of the substrate to be cleaned due to rotation can be prevented. Moreover, since a large capacity motor is not used, cost reduction can be achieved.

Further, since the substrate to be cleaned is also stationary in the cleaning step, damage to the substrate to be cleaned can be prevented.

As a result, it is possible to provide a method for cleaning a large-sized substrate which can be cleaned and dried without worrying about damage, warpage or bending of the substrate, and which can prevent an increase in cost. Play an effect together.

Further, according to the above invention, the position of the substrate to be cleaned in the cleaning chamber can be set not only horizontally as in the conventional case, but also the substrate to be cleaned can be erected, turned upside down, or tilted. Furthermore, these operations can be performed on the entire cleaning chamber.

Therefore, the cleaning liquid can be easily removed after cleaning. In addition, since a liquid flow is generated during cleaning, it is possible to save the cleaning liquid.

As a result, there is an effect that cleaning and drying can be efficiently performed.

As described above, the substrate cleaning method of the present invention uses the substrate to be cleaned as the lid of the cleaning chamber, and the substrate is cleaned and dried in the cleaning chamber. A method of cleaning and drying the cleaning chamber by standing it upside down, turning it upside down, or tilting it.

Therefore, since the substrate to be cleaned is fixed as the lid of the cleaning chamber, the substrate to be cleaned does not move during cleaning and drying. Therefore, it is possible to prevent the substrate from being damaged during cleaning and drying.

Further, since the cleaning chamber can be a closed system, it is possible to prevent the cleaning liquid from splashing on the back surface of the substrate to be cleaned and staying on the back surface during cleaning.

Further, since a motor for rotating and driving the substrate to be cleaned at the time of drying is not required, the cost associated with the motor can be reduced.

Further, since the substrate to be cleaned is used as the lid of the cleaning chamber, the cleaning device can be made compact.

As a result, even a large-sized substrate can be cleaned and dried without worrying about damage, warpage or bending of the substrate, and cleaning liquid can be prevented from staying and cost can be prevented from increasing. There is an effect that a method can be provided.

Further, according to the above invention, the cleaning chamber is stood upside down, turned upside down, or inclined to clean and dry.

Therefore, the position of the substrate to be cleaned in the cleaning chamber can be set not only horizontally as in the conventional case, but also the substrate to be cleaned can be erected, turned upside down, or tilted.
Furthermore, these operations can be performed on the entire cleaning chamber.

Therefore, the cleaning liquid can be easily removed after cleaning. In addition, since a liquid flow is generated during cleaning, it is possible to save the cleaning liquid.

As a result, there is an effect that cleaning and drying can be efficiently performed.

In the substrate cleaning apparatus of the present invention, as described above, the substrate to be cleaned is used as the lid of the cleaning chamber, and the cleaning means and the drying means are provided inside the cleaning chamber. The apparatus is provided with a reinforcing means for abutting a back surface of a substrate to be cleaned mounted in the cleaning chamber to reinforce the substrate to be cleaned.

Therefore, since the substrate to be cleaned is fixed as the lid of the cleaning chamber, the substrate to be cleaned does not move during cleaning and drying. Therefore, it is possible to prevent the substrate from being damaged during cleaning and drying.

Further, since the cleaning chamber can be a closed system, it is possible to prevent the cleaning liquid from splashing on the back surface of the substrate to be cleaned and staying on the back surface during cleaning.

Since the substrate to be cleaned is not rotated at the time of drying, a motor for rotating it is not necessary. Therefore, the cost associated with the motor can be reduced.

Furthermore, since the substrate to be cleaned is used as the lid of the cleaning chamber, the cleaning device can be made compact.

As a result, even a large-sized substrate can be cleaned and dried without worrying about damage, warpage and bending of the substrate, and cleaning liquid can be prevented from staying and cost can be prevented from increasing. A device can be provided.

Further, in the substrate cleaning apparatus of the present invention, the reinforcing means for contacting the rear surface of the substrate to be cleaned mounted in the cleaning chamber to reinforce the substrate to be cleaned is provided.

Therefore, since the substrate to be cleaned is reinforced by the reinforcing means, even if the surface of the substrate to be cleaned is cleaned with a brush or the like in the cleaning chamber, or even if air is blown to dry the substrate, the substrate to be cleaned still remains. Does not warp or bend.

Further, since there is no warpage or bending, the substrate to be cleaned maintains a flat state, so that even in the drying process by the air knife, the blade tip of the air knife and the surface of the substrate to be cleaned are moved along with the movement of the blade tip of the air knife. The distance is constantly constant. Therefore, it is possible to easily control the distance between the blade edge and the surface of the substrate to be cleaned to an optimum value, which allows the drying to be performed accurately and efficiently.

Therefore, there is an effect that it is possible to provide a substrate cleaning apparatus capable of cleaning and drying a large-sized substrate without worrying about damage, warpage or bending of the substrate.

As described above, the substrate cleaning apparatus of the present invention enables the substrate to be cleaned before and after cleaning to be fixed while the substrate to be cleaned mounted in the cleaning chamber is fixed in the apparatus for cleaning a substrate. A fixed transfer means is provided.

Therefore, the substrate to be cleaned is fixed by the fixing and conveying means. Therefore, at the time of cleaning and drying, the substrate to be cleaned can be fixed by the fixing and conveying means so as not to move, so that the substrate to be cleaned may be cracked by moving the substrate to be cleaned at the time of cleaning or drying. Damage can be prevented.

Before or after cleaning, the substrate to be cleaned is transferred in a fixed state by the fixing transfer means. As a result, there is an effect that the transportation can be automated and the cleaning process as a whole can be automated.

As described above, in the substrate cleaning apparatus of the present invention, the substrate to be cleaned is used as the lid of the cleaning chamber, and the cleaning means and the drying means are provided inside the cleaning chamber. The apparatus is provided with a fixing / conveying means for fixing the substrate to be cleaned mounted in the cleaning chamber and capable of conveying the substrate to be cleaned before and after cleaning.

Therefore, since the substrate to be cleaned is fixed as the lid of the cleaning chamber, the substrate to be cleaned does not move during cleaning and drying. Therefore, it is possible to prevent the substrate from being damaged during cleaning and drying.

Further, since the cleaning chamber can be a closed system, it is possible to prevent the cleaning liquid from scattering on the back surface of the substrate to be cleaned and staying on the back surface during cleaning.

Since the substrate to be cleaned is not rotated at the time of drying, a motor for rotating the substrate is not required. Therefore, the cost associated with the motor can be reduced.

Furthermore, since the substrate to be cleaned is used as the lid of the cleaning chamber, the cleaning device can be made compact.

As a result, even a large-sized substrate can be cleaned and dried without worrying about damage, warpage and bending of the substrate, and the cleaning liquid can be prevented from staying and the cost can be prevented from increasing. A device can be provided.

Further, in the substrate cleaning apparatus of the present invention, the fixing and conveying means for fixing the substrate to be cleaned mounted in the cleaning chamber, and capable of conveying the substrate to be cleaned before and after cleaning is provided.

Therefore, the substrate to be cleaned is fixed by the fixing and conveying means. Therefore, at the time of cleaning and drying, the substrate to be cleaned can be fixed by the fixing and conveying means so as not to move, so that the substrate to be cleaned may be cracked by moving the substrate to be cleaned at the time of cleaning or drying. Damage can be prevented.

Further, before or after cleaning, the substrate to be cleaned is transferred in a fixed state by the fixed transfer means. As a result, there is an effect that the transportation can be automated and the cleaning process as a whole can be automated.

As described above, the apparatus for cleaning a substrate of the present invention is the apparatus for cleaning a substrate, which is provided with angle adjusting means for vertically setting, vertically inverting and inclining the cleaning chamber.

Therefore, by the angle adjusting means, the cleaning chamber can be cleaned upright or upside down or tilted for cleaning and drying.

As a result, the position of the substrate to be cleaned in the cleaning chamber can be set not only horizontally as in the conventional case, but also the substrate to be cleaned can be erected, turned upside down, or tilted.
Furthermore, these operations can be performed on the entire cleaning chamber.

Therefore, the cleaning liquid can be easily removed after cleaning. In addition, since a liquid flow is generated during cleaning, it is possible to save the cleaning liquid.

As a result, there is an effect that cleaning and drying can be efficiently performed.

As described above, in the substrate cleaning apparatus of the present invention, in the substrate cleaning apparatus, the substrate to be cleaned is used as the lid of the cleaning chamber, and the cleaning means and the drying means are provided inside the cleaning chamber. An apparatus for cleaning a substrate is provided, which is provided with an angle adjusting unit for vertically setting, vertically inverting and inclining the cleaning chamber.

Therefore, since the substrate to be cleaned is fixed as the lid of the cleaning chamber, the substrate to be cleaned does not move during cleaning and drying. Therefore, it is possible to prevent the substrate from being damaged during cleaning and drying.

Further, since the cleaning chamber can be a closed system, it is possible to prevent the cleaning liquid from splashing on the back surface of the substrate to be cleaned and staying on the back surface during cleaning.

Since the substrate to be cleaned is not rotated at the time of drying, no motor for rotating the substrate is required. Therefore, the cost associated with the motor can be reduced.

Further, since the substrate to be cleaned is used as the cover of the cleaning chamber, the cleaning device can be made compact.

As a result, even a large-sized substrate can be cleaned and dried without worrying about damage, warpage or bending of the substrate, and the cleaning liquid can be prevented from staying and the cost can be prevented from increasing. A device can be provided.

Further, in the substrate cleaning apparatus of the present invention, an angle adjusting means for vertically setting, vertically inverting and inclining the cleaning chamber is provided.

Therefore, by the angle adjusting means, the cleaning chamber can be cleaned upright, upside down, or inclined for cleaning and drying.

As a result, the position of the substrate to be cleaned in the cleaning chamber can be set not only horizontally as in the conventional case, but also the substrate to be cleaned can be erected, turned upside down, or tilted.
Furthermore, these operations can be performed on the entire cleaning chamber.

Therefore, the cleaning liquid can be easily removed after cleaning. In addition, since a liquid flow is generated during cleaning, it is possible to save the cleaning liquid.

As a result, there is an effect that cleaning and drying can be efficiently performed.

As described above, in the substrate cleaning apparatus of the present invention, in the substrate cleaning apparatus, the cleaning chamber has an internal pressure adjusting means for adjusting the internal pressure of the cleaning chamber and / or an internal temperature of the cleaning chamber. An internal temperature adjusting means for adjusting the temperature is provided.

Therefore, during cleaning and drying, the internal pressure of the cleaning chamber can be adjusted by the internal pressure adjusting means, and the internal temperature of the cleaning chamber can be adjusted by the internal temperature adjusting means.

For this reason, since a reactive gas or the like can be used as the cleaning agent, dry cleaning can be performed. Also,
Since the internal temperature of the cleaning chamber can be adjusted, not only at room temperature but also the cleaning chamber can be heated to improve the activity of reactive gas, solvent, etc. It is also possible to cool the chamber for cleaning and drying.

Therefore, it is possible to provide a cleaning apparatus that can perform cleaning and drying on a large-sized substrate without worrying about damage and warpage or bending of the substrate, and can perform various cleaning and drying. Play.

As described above, in the substrate cleaning apparatus of the present invention, in the substrate cleaning apparatus, in the substrate cleaning apparatus, the substrate to be cleaned is used as the lid of the cleaning chamber and is placed inside the cleaning chamber. Is a substrate cleaning apparatus provided with cleaning means and drying means, wherein the cleaning chamber has an internal pressure adjusting means for adjusting an internal pressure of the cleaning chamber and / or an internal temperature for adjusting an internal temperature of the cleaning chamber. Adjustment means is provided.

Therefore, since the substrate to be cleaned is fixed as the lid of the cleaning chamber, the substrate to be cleaned does not move during cleaning and drying. Therefore, it is possible to prevent the substrate from being damaged during cleaning and drying.

Further, since the cleaning chamber can be a closed system, it is possible to prevent the cleaning liquid from scattering on the back surface of the substrate to be cleaned and staying on the back surface during cleaning.

Further, since the substrate to be cleaned is not rotated during drying, a motor for rotationally driving is not required. Therefore, the cost associated with the motor can be reduced.

Further, since the substrate to be cleaned is used as the cover of the cleaning chamber, the cleaning device can be made compact.

As a result, even a large-sized substrate can be cleaned and dried without worrying about damage, warpage or bending of the substrate, and cleaning liquid can be prevented from staying and cost can be prevented from increasing. A device can be provided.

Further, in the substrate cleaning apparatus of the present invention, the cleaning chamber is provided with internal pressure adjusting means for adjusting the internal pressure of the cleaning chamber and / or internal temperature adjusting means for adjusting the internal temperature of the cleaning chamber. Therefore, during cleaning and drying, the internal pressure of the cleaning chamber can be adjusted by the internal pressure adjusting means, and the internal temperature of the cleaning chamber can be adjusted by the internal temperature adjusting means.

Therefore, the reactive gas or the like can be used as the cleaning agent, and the dry cleaning can be performed. Also,
Since the internal temperature of the cleaning chamber can be adjusted, not only at room temperature but also the cleaning chamber can be heated to improve the activity of reactive gas, solvent, etc. It is also possible to cool the chamber for cleaning and drying.

Therefore, it is possible to provide a cleaning device capable of performing a variety of cleaning and drying, as well as a large-sized substrate, which can be cleaned and dried without worrying about damage, warpage and bending of the substrate. Play.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an embodiment of a substrate cleaning apparatus according to the present invention.

FIG. 2 shows another embodiment of the substrate cleaning apparatus of the present invention, and is a cross-sectional view showing a cleaning chamber provided with an adsorption mechanism for a substrate to be cleaned.

FIG. 3 is a cross-sectional view showing a state in which a suction conveyance arm is fitted into the cleaning chamber and is hermetically sealed in the cleaning chamber having the substrate to be cleaned suction mechanism.

FIG. 4 is a view showing that a cleaning chamber provided with a suction mechanism for a substrate to be cleaned is provided with an adjustable angle, and FIG. 4A is an explanatory view showing a state in which the cleaning chamber is erected. FIG. 6B is an explanatory view showing a state in which the cleaning chamber is tilted, and FIG. 7C is an explanatory view showing a state in which the cleaning chamber is turned upside down.

FIG. 5 shows still another embodiment of the substrate cleaning apparatus according to the present invention, and is a cross-sectional view showing a cleaning chamber provided so that temperature and pressure can be adjusted.

FIG. 6 shows still another embodiment of the substrate cleaning apparatus according to the present invention, and is a cross-sectional view showing a cleaning chamber capable of cleaning with a solvent.

FIG. 7 is a schematic view showing a roller type in a conventional substrate cleaning apparatus.

FIG. 8 shows another conventional substrate cleaning apparatus,
It is a perspective view showing a spin type.

FIG. 9 is a cross-sectional view showing the structure of the spin cleaning apparatus.

[Explanation of symbols]

1 cleaning device 2 cleaning chamber 3 Substrate to be cleaned 4 openings 6 Contact plate (reinforcing plate, reinforcing means) 7 Rotating cleaning brush (cleaning tool, cleaning means) 8 MS shower nozzle (cleaning tool, cleaning means) 9 Air knife (drying tool, drying means) 20 Cleaning device 24 opening 26 Adsorption transfer arm (reinforcing means, fixed transfer means) 27 Adsorption port 30 cleaning equipment 31 Heater (internal temperature adjusting means) 32 washing chamber 35 Pump (Internal pressure adjusting means) 40 cleaning equipment 42 Washing chamber

─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-54-120867 (JP, A) JP-A-1-238122 (JP, A) JP-A-11-16876 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) B08B 1/04 B08B 3/02 G02F 1/13 101

Claims (13)

(57) [Claims] 1. A method of cleaning a substrate, wherein the substrate to be cleaned is used as a lid of a cleaning chamber, and the substrate to be cleaned and dried in the cleaning chamber, wherein the substrate to be cleaned is mounted in the cleaning chamber. In addition, a method for cleaning a substrate is characterized in that a reinforcing plate is brought into contact with the back surface of the substrate to be cleaned to reinforce the substrate to be cleaned. 2. The cleaning of a substrate according to claim 1, wherein the substrate to be cleaned is fixed by the reinforcing plate, and the substrate to be cleaned is conveyed before and after cleaning while being fixed by the reinforcing plate. Method. 3. The substrate cleaning method according to claim 1, wherein the substrate to be cleaned is cleaned and dried by moving a cleaning tool and a drying tool provided in the cleaning chamber. 4. The cleaning chamber is set upright or upside down.
Special feature is to invert or tilt and wash and dry.
Cleaning the substrate according to any one of claims 1 to 3,
Purification method. 5. The substrate to be cleaned is used as a lid of a cleaning chamber.
In the cleaning chamber,
For moving the cleaning and drying tools provided
With the method of cleaning the substrate, the substrate to be cleaned is cleaned and dried
A method of cleaning a substrate, characterized in that the cleaning chamber is stood upside down, turned upside down, or tilted for cleaning and drying. 6. A method of cleaning a substrate, wherein the substrate to be cleaned is used as a lid of a cleaning chamber, and the substrate to be cleaned and dried in the cleaning chamber, wherein the cleaning chamber is set up or turned upside down. A method for cleaning a substrate, which comprises cleaning and drying while tilting or tilting. 7. A substrate cleaning apparatus in which a substrate to be cleaned is used as a lid of a cleaning chamber, and a cleaning means and a drying means are provided inside the cleaning chamber, which is mounted in the cleaning chamber. An apparatus for cleaning a substrate, comprising: a reinforcing unit that abuts a back surface of the substrate to be cleaned to reinforce the substrate to be cleaned. 8. The substrate according to claim 7, further comprising a fixing and conveying means for fixing the substrate to be cleaned mounted in the cleaning chamber and transporting the substrate to be cleaned before and after cleaning. Cleaning equipment. 9. A substrate cleaning apparatus in which a substrate to be cleaned is used as a lid of a cleaning chamber, and a cleaning means and a drying means are provided inside the cleaning chamber, which is mounted in the cleaning chamber. An apparatus for cleaning a substrate, characterized in that a fixing and conveying means for fixing the substrate to be cleaned and for conveying the substrate to be cleaned before and after cleaning is provided. 10. The apparatus for cleaning a substrate according to claim 7, further comprising angle adjusting means for vertically setting, vertically inverting and inclining the cleaning chamber. 11. A substrate cleaning apparatus, wherein a substrate to be cleaned is used as a lid of a cleaning chamber, and a cleaning means and a drying means are provided inside the cleaning chamber, the cleaning chamber being provided upright. An apparatus for cleaning a substrate, which is provided with an angle adjusting means for vertically inverting and inclining. 12. The cleaning chamber is provided with internal pressure adjusting means for adjusting the internal pressure of the cleaning chamber and / or internal temperature adjusting means for adjusting the internal temperature of the cleaning chamber. The substrate cleaning apparatus according to any one of 7 to 11. 13. A substrate cleaning apparatus in which a substrate to be cleaned is used as a lid of a cleaning chamber, and a cleaning unit and a drying unit are provided inside the cleaning chamber. An apparatus for cleaning a substrate, comprising: an internal pressure adjusting means for adjusting the internal pressure of the chamber and / or an internal temperature adjusting means for adjusting the internal temperature of the cleaning chamber.