JP3474543B2 - Method for manufacturing resin bonded superabrasive wheel - Google Patents
Method for manufacturing resin bonded superabrasive wheelInfo
- Publication number
- JP3474543B2 JP3474543B2 JP2001026792A JP2001026792A JP3474543B2 JP 3474543 B2 JP3474543 B2 JP 3474543B2 JP 2001026792 A JP2001026792 A JP 2001026792A JP 2001026792 A JP2001026792 A JP 2001026792A JP 3474543 B2 JP3474543 B2 JP 3474543B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- superabrasive
- wheel
- mixture
- liquid thermosetting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920005989 resin Polymers 0.000 title claims description 79
- 239000011347 resin Substances 0.000 title claims description 79
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 238000000034 method Methods 0.000 title description 23
- 239000000203 mixture Substances 0.000 claims description 51
- 239000007788 liquid Substances 0.000 claims description 34
- 229920001187 thermosetting polymer Polymers 0.000 claims description 28
- 230000033001 locomotion Effects 0.000 claims description 21
- 239000003795 chemical substances by application Substances 0.000 claims description 19
- 239000000945 filler Substances 0.000 claims description 18
- 229920001567 vinyl ester resin Polymers 0.000 claims description 11
- 229920006305 unsaturated polyester Polymers 0.000 claims 1
- 238000000227 grinding Methods 0.000 description 25
- 239000006061 abrasive grain Substances 0.000 description 19
- 238000005498 polishing Methods 0.000 description 19
- 238000003756 stirring Methods 0.000 description 14
- 229920006337 unsaturated polyester resin Polymers 0.000 description 14
- 229910003460 diamond Inorganic materials 0.000 description 10
- 239000010432 diamond Substances 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 239000010953 base metal Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 238000007731 hot pressing Methods 0.000 description 7
- 238000000465 moulding Methods 0.000 description 7
- 239000005011 phenolic resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 239000004575 stone Substances 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 238000005266 casting Methods 0.000 description 5
- -1 etc. Chemical compound 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 3
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Natural products CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 3
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 3
- 150000007519 polyprotic acids Polymers 0.000 description 3
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N Methyl ethyl ketone Natural products CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000010438 granite Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- JCTXKRPTIMZBJT-UHFFFAOYSA-N 2,2,4-trimethylpentane-1,3-diol Chemical compound CC(C)C(O)C(C)(C)CO JCTXKRPTIMZBJT-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- OSWDNIFICGLKEE-UHFFFAOYSA-N 2-acetylcyclopentan-1-one Chemical compound CC(=O)C1CCCC1=O OSWDNIFICGLKEE-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- WTDLXTHCSXDOLV-UHFFFAOYSA-N 3-(4-propylphenoxy)propan-1-ol Chemical compound CCCC1=CC=C(OCCCO)C=C1 WTDLXTHCSXDOLV-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 1
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- VUQMHVFWBWRJSH-UHFFFAOYSA-N [2,3,5,6-tetrachloro-4-(hydroxymethyl)phenyl]methanol Chemical compound OCC1=C(Cl)C(Cl)=C(CO)C(Cl)=C1Cl VUQMHVFWBWRJSH-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- NZZIMKJIVMHWJC-UHFFFAOYSA-N dibenzoylmethane Chemical compound C=1C=CC=CC=1C(=O)CC(=O)C1=CC=CC=C1 NZZIMKJIVMHWJC-UHFFFAOYSA-N 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- BADXJIPKFRBFOT-UHFFFAOYSA-N dimedone Chemical compound CC1(C)CC(=O)CC(=O)C1 BADXJIPKFRBFOT-UHFFFAOYSA-N 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- FLBJFXNAEMSXGL-UHFFFAOYSA-N het anhydride Chemical compound O=C1OC(=O)C2C1C1(Cl)C(Cl)=C(Cl)C2(Cl)C1(Cl)Cl FLBJFXNAEMSXGL-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- QQVIHTHCMHWDBS-UHFFFAOYSA-L isophthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC(C([O-])=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-L 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- JDEJGVSZUIJWBM-UHFFFAOYSA-N n,n,2-trimethylaniline Chemical compound CN(C)C1=CC=CC=C1C JDEJGVSZUIJWBM-UHFFFAOYSA-N 0.000 description 1
- YPEWWOUWRRQBAX-UHFFFAOYSA-N n,n-dimethyl-3-oxobutanamide Chemical compound CN(C)C(=O)CC(C)=O YPEWWOUWRRQBAX-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005596 polymer binder Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000003678 scratch resistant effect Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- AUHHYELHRWCWEZ-UHFFFAOYSA-N tetrachlorophthalic anhydride Chemical compound ClC1=C(Cl)C(Cl)=C2C(=O)OC(=O)C2=C1Cl AUHHYELHRWCWEZ-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
【0001】[0001]
【発明の属する技術分野】本発明は、レジンボンド超砥
粒ホイール及びその製造方法に関する。さらに詳しく
は、本発明は、レジンボンド部に気泡を含まず密度が高
く、切れ味に優れ、寿命が長いレジンボンド超砥粒ホイ
ール、及び、高価な金型や成形機を必要とせず、形状の
自由度の大きいレジンボンド超砥粒ホイールの製造方法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-bonded superabrasive wheel and a method for manufacturing the same. More specifically, the present invention does not include bubbles in the resin bond portion, has a high density, is excellent in sharpness, has a long life, and does not require a resin bond superabrasive wheel, and an expensive die or molding machine, The present invention relates to a method for manufacturing a resin bond superabrasive wheel having a high degree of freedom.
【0002】[0002]
【従来の技術】超砥粒ホイールにおける超砥粒の固定方
法として、レジンボンド、ビトリファイドボンド、メタ
ルボンド、電着などが行われている。レジンボンドは、
切れ味は良好であるが、耐久性が低い。ビトリファイド
ボンドは、切れ味がよく、耐摩耗性も良好であるが、脆
く欠けやすい。メタルボンドは、砥粒保持力と耐摩耗性
に優れているが、超砥粒に内部応力が発生し、砥粒が割
れたり、欠けやすくなる。電着は、形状の自由度が大き
く、切れ味も良好であるが、超砥粒はメッキにより機械
的に保持されるのみである。このために、超砥粒ホイー
ルにおいては、その用途に応じて、超砥粒の固定方法が
選択されている。例えば、石材研磨盤用の超砥粒ホイー
ルでは、粗仕上げ及び中仕上げ用のホイールとして、粒
度#50〜400程度の超砥粒を用いたメタルボンド超
砥粒ホイールが使用され、細仕上げ用のホイールとし
て、粒度#400〜3,000程度の超砥粒を用いたレ
ジンボンド超砥粒ホイールが使用されている。一般に、
超砥粒の粒度が細かいほど面粗さは良好となるが、切れ
味と寿命は粒度の粗い方が長い。レジンボンド超砥粒ホ
イールは、フェノール樹脂、ポリイミド樹脂などの結合
剤の粉末と超砥粒を混合し、又は、結合剤を超砥粒にコ
ーティングし、金型に充填してプレス成形する方法、あ
るいは、エポキシ樹脂、不飽和ポリエステル樹脂などの
液状の結合剤と超砥粒を混合し、型に流し込んで硬化さ
せる方法により製造されている。例えば、特公平2−5
3196号公報には、重研削や難削材の加工に好適な砥
石の製造法として、導電金属で被覆した砥粒を高分子結
合剤と混合して成形型に充填し、加熱により一定温度に
制御しながら、加圧状態と加圧解放状態とを複数回繰り
返し、含有ガスを放出させるとともに、砥粒の被覆金属
を塑性変形させて密着させ、砥石本体を成形する方法が
提案されている。しかし、ホットプレス法は、高価な金
型と成型機が必要であり、また、形状的な自由度に乏し
く、複雑な形状を作りにくいという問題がある。特公平
7−47267号公報には、研削砥石及び研磨布紙の両
特性を兼備した発泡研磨体の製造方法として、不飽和ポ
リエステル樹脂、架橋剤、硬化剤、砥粒、発泡剤ととも
に、さらに熱硬化性樹脂を含有する混合物を発泡硬化さ
せる方法が提案されている。また、特開平11−156
725号公報には、低弾性率と砥粒保持力を維持しつ
つ、研削抵抗が低く、研削焼けが発生しないレジノイド
研削砥石として、アルミナ系砥粒25容量部と、平均粒
径80μmの有機質中空体20容量部と、径1mmの気孔
10容量部を、エポキシ硬化樹脂結合剤40容量部に分
散してなるレジノイド研削砥石が提案されている。しか
し、液状結合剤を用いる方法は、設備が安価で形状の自
由度も大きいが、超砥粒の結合剤としては十分な硬度が
得られない。また、気泡が入るために密度も十分ではな
く、上記の公報のように、発泡研磨体、中空体含有砥石
などの気泡の混入が問題にならない研削工具の製造に用
いられる場合が多かった。2. Description of the Related Art Resin bonding, vitrified bonding, metal bonding, electrodeposition and the like are used as a method for fixing superabrasive particles in a superabrasive wheel. Resin bond is
Good sharpness but low durability. Vitrified bonds have good sharpness and good wear resistance, but are brittle and easily chipped. The metal bond is excellent in abrasive grain retention and wear resistance, but internal stress is generated in the superabrasive grains, and the abrasive grains are likely to break or chip. Electrodeposition has a large degree of freedom in shape and good sharpness, but superabrasive grains are only mechanically retained by plating. Therefore, in the superabrasive grain wheel, a method of fixing the superabrasive grains is selected according to the application. For example, in a superabrasive grain wheel for a stone polishing machine, a metal bond superabrasive grain wheel using superabrasive grains having a grain size of about 50 to 400 is used as a wheel for rough finishing and intermediate finishing, and for a fine finishing. As a wheel, a resin bond superabrasive grain wheel using superabrasive grains having a grain size of about 400 to 3,000 is used. In general,
The finer the grain size of the superabrasive grains, the better the surface roughness, but the sharper and longer the life, the longer the grain size. Resin bond superabrasive wheel is a method of mixing powder of binder such as phenol resin, polyimide resin and superabrasive, or coating the superabrasive with a binder and filling the die with a press molding. Alternatively, it is manufactured by a method in which a liquid binder such as an epoxy resin or an unsaturated polyester resin is mixed with superabrasive grains, and the mixture is poured into a mold and cured. For example, Japanese Patent Publication No. 2-5
As a method for manufacturing a grindstone suitable for heavy grinding and processing of difficult-to-cut materials, 3196 discloses that abrasive grains coated with a conductive metal are mixed with a polymer binder and filled in a mold, and heated to a constant temperature. A method of forming a grindstone body by repeating a pressurized state and a pressure released state a plurality of times while controlling the gas content to release the contained gas and plastically deforming and adhering the coating metal of the abrasive grains has been proposed. However, the hot pressing method has a problem that an expensive die and a molding machine are required, the degree of freedom in shape is low, and it is difficult to form a complicated shape. Japanese Examined Patent Publication No. 7-47267 discloses a method for producing a foamed abrasive having both the properties of a grinding wheel and a polishing cloth paper, together with an unsaturated polyester resin, a cross-linking agent, a curing agent, abrasive grains, a foaming agent, and a heat treatment. A method of foam-curing a mixture containing a curable resin has been proposed. In addition, JP-A-11-156
Japanese Patent No. 725 discloses, as a resinoid grinding wheel with low grinding resistance and low grinding resistance while maintaining a low elastic modulus and abrasive grain holding force, 25 volume parts of alumina abrasive grains and an organic hollow having an average particle diameter of 80 μm. A resinoid grinding wheel has been proposed in which 20 parts by volume of a body and 10 parts by volume of pores having a diameter of 1 mm are dispersed in 40 parts by volume of an epoxy curable resin binder. However, although the method using a liquid binder is inexpensive in equipment and has a high degree of freedom in shape, sufficient hardness cannot be obtained as a binder for superabrasive grains. In addition, the density is not sufficient for the inclusion of air bubbles, and as in the above-mentioned publication, it is often used for manufacturing a grinding tool in which the inclusion of air bubbles such as a foamed abrasive body and a grindstone containing a hollow body does not pose a problem.
【0003】[0003]
【発明が解決しようとする課題】本発明は、レジンボン
ド部に気泡を含まず密度が高く、切れ味に優れ、寿命が
長いレジンボンド超砥粒ホイール、及び、高価な金型や
成形機を必要とせず、形状の自由度の大きいレジンボン
ド超砥粒ホイールの製造方法を提供することを目的とし
てなされたものである。DISCLOSURE OF THE INVENTION The present invention requires a resin bond superabrasive grain wheel which does not contain bubbles in the resin bond portion, has a high density, is excellent in sharpness, and has a long life, and an expensive die or molding machine. In other words, the object is to provide a method for manufacturing a resin-bonded superabrasive wheel having a large degree of freedom in shape.
【0004】[0004]
【課題を解決するための手段】本発明者らは、上記の課
題を解決すべく鋭意研究を重ねた結果、液状熱硬化性樹
脂、硬化剤、超砥粒及び充填剤を含有する混合物に、公
転運動及び自転運動を付与することにより撹拌及び脱泡
処理したのち、該混合物を注型して室温で硬化させ、好
ましくはさらに加熱して二次硬化処理することにより、
注型法と同等の簡便さで、ホットプレス法と同等以上の
性能を有するレジンボンド超砥粒ホイールを製造し得る
ことを見いだし、この知見に基づいて本発明を完成する
に至った。すなわち、本発明は、
(1)液状熱硬化性樹脂、硬化剤、超砥粒及び充填剤を
含有する混合物を容器に充填し、該容器を公転運動と自
転運動を付与することにより撹拌し、公転運動を付与す
ることにより脱泡したのち、該混合物を注型して室温で
硬化したのち、80〜200℃で二次硬化処理すること
を特徴とするレジンボンド超砥粒ホイールの製造方法、
及び、
(2)液状熱硬化性樹脂が、不飽和ポリエステル樹脂又
はビニルエステル樹脂である第1項記載のレジンボンド
超砥粒ホイールの製造方法、
を提供するものである。
さらに、本発明の好ましい態様として、
(3)液状熱硬化性樹脂、硬化剤、超砥粒及び充填剤を
含有する混合物が、促進剤を含有する第1項記載のレジ
ンボンド超砥粒ホイールの製造方法、
(4)液状熱硬化性樹脂の25℃における粘度が、0.
1〜10Pa・sである第1項記載のレジンボンド超砥
粒ホイールの製造方法、
(5)撹拌時の公転運動の回転速度が、1,000〜
4,000min―1であり、自転運動の回転速度が4
00〜1,600min―1である第1項記載のレジン
ボンド超砥粒ホイールの製造方法、及び、
(6)脱泡時の公転運動の回転速度が、1,000〜
4,500min―1である第1項記載のレジンボンド
超砥粒ホイールの製造方法、
を挙げることができる。As a result of intensive studies to solve the above problems, the present inventors have found that a mixture containing a liquid thermosetting resin, a curing agent, superabrasive grains and a filler, After stirring and defoaming treatment by imparting orbital motion and rotation motion, the mixture is cast and cured at room temperature, preferably by further heating for secondary curing treatment.
It was found that a resin-bonded superabrasive wheel having a performance equal to or higher than that of the hot pressing method can be manufactured with the same ease as the casting method, and the present invention has been completed based on this finding. That is, the present invention includes (1) filling a container with a mixture containing a liquid thermosetting resin, a curing agent, superabrasive grains and a filler, and stirring the container by imparting revolving motion and rotation motion , Give orbital motion
After defoaming by Rukoto, after curing at room temperature the mixture was cast, the method of manufacturing resin bonded superabrasive wheels, characterized in that the secondary curing treatment at 80 to 200 ° C.,
And (2) the liquid thermosetting resin is an unsaturated polyester resin or
The resin bond according to claim 1, wherein is a vinyl ester resin
A method of manufacturing a superabrasive wheel is provided. Furthermore, as a preferred aspect of the present invention, ( 3 ) the resin bond superabrasive wheel according to claim 1, wherein the mixture containing the liquid thermosetting resin, the curing agent, the superabrasive grains and the filler contains an accelerator. Manufacturing method, ( 4 ) The viscosity of the liquid thermosetting resin at 25 ° C. is 0.
1 to 10 Pa · s, the method for producing a resin-bonded superabrasive grain wheel according to item 1, ( 5 ) the rotational speed of the revolution motion during stirring is 1,000 to
4,000 min -1 , and the rotation speed of rotation is 4
The method for producing a resin-bonded superabrasive wheel according to item 1, which is from 0 to 1,600 min −1 , and ( 6 ) the rotational speed of the revolution motion during defoaming is from 1,000 to
The method for producing a resin-bonded superabrasive grain wheel according to the first aspect is 4,500 min −1 .
【0005】[0005]
【発明の実施の形態】本発明のレジンボンド超砥粒ホイ
ールは、液状熱硬化性樹脂、硬化剤、超砥粒及び充填剤
を含有する混合物に、公転運動と自転運動を付与するこ
とにより撹拌し、公転運動を付与することにより脱泡し
たのち、該混合物を注型して室温で硬化させてなる超砥
粒ホイールであり、室温硬化したのち、さらに80〜2
00℃で二次硬化処理された超砥粒ホイールであること
がより好ましい。本発明のレジンボンド超砥粒ホイール
においては、液状熱硬化性樹脂、硬化剤、超砥粒及び充
填剤の混合物を容器に充填し、該容器を公転及び自転さ
せて混合物を撹拌し、該容器を公転させて混合物を脱泡
したのち、該混合物を注型して室温で硬化させ、さらに
80〜200℃で二次硬化処理する。本発明に使用する
液状熱硬化性樹脂に特に制限はなく、例えば、ジアリル
フタレート樹脂、ビニルエステル樹脂、不飽和ポリエス
テル樹脂、エポキシ樹脂、キシレン樹脂、フェノール樹
脂、レゾルシノール樹脂、アクリル樹脂などを挙げるこ
とができる。これらの中で、不飽和ポリエステル樹脂及
びビニルエステル樹脂を特に好適に用いることができ
る。不飽和ポリエステル樹脂及びビニルエステル樹脂
は、それぞれを単独で用いることができ、あるいは、両
者を混合して用いることもできる。本発明に用いる硬化
剤は、使用する液状熱硬化性樹脂に応じて適宜選択する
ことができる。例えば、ジアリルフタレート樹脂、ビニ
ルエステル樹脂及び不飽和ポリエステル樹脂に対して
は、硬化剤として有機過酸化物などを用いることがで
き、エポキシ樹脂に対しては、硬化剤として、アミン、
ポリアミノアミド、酸無水物、ジシアンジアミドなどを
用いることができる。BEST MODE FOR CARRYING OUT THE INVENTION The resin-bonded superabrasive wheel of the present invention is agitated by imparting a revolution movement and a rotation movement to a mixture containing a liquid thermosetting resin, a hardening agent, superabrasive particles and a filler. Then, it is a superabrasive grain wheel obtained by defoaming by imparting orbital motion, then casting the mixture and curing at room temperature.
More preferably, it is a superabrasive wheel that has been secondarily hardened at 00 ° C. In the resin-bonded superabrasive wheel of the present invention, a liquid thermosetting resin, a curing agent, a mixture of superabrasive particles and a filler is filled in a container, and the container is revolved and rotated to stir the mixture, After orbiting the mixture to defoam the mixture, the mixture is cast, cured at room temperature, and secondarily cured at 80 to 200 ° C. The liquid thermosetting resin used in the present invention is not particularly limited, and examples thereof include diallyl phthalate resin, vinyl ester resin, unsaturated polyester resin, epoxy resin, xylene resin, phenol resin, resorcinol resin, and acrylic resin. it can. Among these, unsaturated polyester resin and vinyl ester resin can be used particularly preferably. The unsaturated polyester resin and the vinyl ester resin can be used alone or in a mixture of both. The curing agent used in the present invention can be appropriately selected according to the liquid thermosetting resin used. For example, for diallyl phthalate resin, vinyl ester resin and unsaturated polyester resin, organic peroxide or the like can be used as a curing agent, and for epoxy resin, amine, as a curing agent,
Polyaminoamide, acid anhydride, dicyandiamide and the like can be used.
【0006】不飽和ポリエステル樹脂は、グリコールと
不飽和多塩基酸、飽和多塩基酸を加熱エステル化するこ
とにより得られ、通常は不飽和結合と共重合し得るスチ
レンなどのモノマー類に溶解した状態で市販されてい
る。本発明に用いる不飽和ポリエステル樹脂に特に制限
はなく、例えば、エチレングリコール、プロピレングリ
コール、無水マレイン酸、無水フタル酸などから合成さ
れる一般用樹脂、プロピレングリコール、2,2−ビス
[4−(ヒドロキシプロポキシ)フェニル]プロパン、無水
フタル酸、イタコン酸などから合成される耐薬品性樹
脂、テトラクロロ−1,4−ビス(ヒドロキシメチル)ベ
ンゼン、テトラクロロ無水フタル酸、クロレンド酸無水
物などから合成される耐炎性樹脂、ジエチレングリコー
ル、アジピン酸、セバシン酸などから合成される可撓性
樹脂、プロピレングリコール、ネオペンチルグリコー
ル、2,2,4−トリメチル−1,3−ペンタンジオー
ル、イソフタル酸、無水フタル酸、無水マレイン酸など
から合成される高硬度、耐擦傷性樹脂などを挙げること
ができる。これらの中で、高硬度、耐擦傷性樹脂を特に
好適に用いることができる。ビニルエステル樹脂は、エ
ポキシ樹脂と(メタ)アクリル酸の反応、(メタ)アクリロ
イル基を有するモノアルコールと多塩基酸無水物とエポ
キシ樹脂の逐次反応、グリシジルメタクリレートとビス
フェノール類の反応などにより得られる樹脂であり、エ
ポキシアクリレートと呼ばれる場合もあり、通常は不飽
和結合と共重合し得るスチレンなどのモノマー類に溶解
した状態で市販されている。ビニルエステル樹脂の製造
に用いられるエポキシ樹脂は、通常は分子量350〜
1,000のビスフェノールA型エポキシ樹脂である。The unsaturated polyester resin is obtained by heating esterification of glycol with unsaturated polybasic acid or saturated polybasic acid, and is usually dissolved in monomers such as styrene which can be copolymerized with unsaturated bond. It is commercially available at. The unsaturated polyester resin used in the present invention is not particularly limited, and examples thereof include general-purpose resins synthesized from ethylene glycol, propylene glycol, maleic anhydride, phthalic anhydride, propylene glycol, 2,2-bis
Chemically resistant resin synthesized from [4- (hydroxypropoxy) phenyl] propane, phthalic anhydride, itaconic acid, etc., tetrachloro-1,4-bis (hydroxymethyl) benzene, tetrachlorophthalic anhydride, chlorendic anhydride Flame-resistant resin synthesized from materials, flexible resin synthesized from diethylene glycol, adipic acid, sebacic acid, propylene glycol, neopentyl glycol, 2,2,4-trimethyl-1,3-pentanediol, isophthalate Examples thereof include high hardness and scratch resistant resins synthesized from acids, phthalic anhydride, maleic anhydride and the like. Of these, a resin having high hardness and scratch resistance can be particularly preferably used. Vinyl ester resin is a resin obtained by reaction of epoxy resin and (meth) acrylic acid, sequential reaction of (meth) acryloyl group-containing monoalcohol and polybasic acid anhydride and epoxy resin, reaction of glycidyl methacrylate and bisphenols, etc. It is also referred to as an epoxy acrylate, and is usually commercially available in a state of being dissolved in a monomer such as styrene which can copolymerize with an unsaturated bond. Epoxy resins used in the production of vinyl ester resins usually have a molecular weight of 350-
It is 1,000 bisphenol A type epoxy resin.
【0007】本発明において、不飽和ポリエステル樹脂
又はビニルエステル樹脂の硬化剤としては、例えば、メ
チルエルチケトンパーオキシド、シクロヘキサノンパー
オキシド、メチルアセトアセテートパーオキシド、アセ
チルアセトンパーオキシド、クメンハイドロパーオキシ
ドなどを挙げることができる。これらの硬化剤は、1種
を単独で用いることができ、あるいは、2種以上を組み
合わせて用いることもできる。本発明において、これら
の硬化剤と併用する促進剤としては、例えば、ナフテン
酸コバルト、オクチル酸コバルトなどのコバルトの有機
酸塩を挙げることができる。本発明においては、さらに
必要に応じて助促進剤を使用することができる。助促進
剤としては、例えば、N,N−ジメチルアセトアセトア
ミド、アセチルアセトン、ジメドン、ジベンゾイルメタ
ン、2−アセチルシクロペンタノン、アセト酢酸メチル
などのβ−ジケトン類、ジメチルアニリン、ジメチルト
ルイジンなどの芳香族第三級アミンなどを挙げることが
できる。助促進剤を使用することにより、室温における
硬化速度をさらに速めることができる。本発明において
は、液状熱硬化性樹脂の25℃における粘度が、0.1
〜10Pa・sであることが好ましく、0.5〜5Pa・sで
あることがより好ましい。液状熱硬化性樹脂の25℃に
おける粘度が0.1Pa・s未満であると、室温硬化中に超
砥粒、充填剤などが沈降するおそれがある。液状熱硬化
性樹脂の25℃における粘度が10Pa・sを超えると、
液状熱硬化性樹脂、硬化剤、超砥粒、充填剤などの混合
物の撹拌による均一混合が困難になるおそれがある。本
発明に用いる超砥粒としては、天然ダイヤモンド砥粒、
人造ダイヤモンド砥粒、立方晶窒化ホウ素砥粒などを挙
げることができる。本発明に用いる超砥粒の粒度に特に
制限はなく、超砥粒ホイールの用途に応じて適宜選択す
ることができる。本発明に用いる充填剤に特に制限はな
く、例えば、炭酸カルシウム、クレー、アルミナ、タル
ク、マイカ、ガラスパウダー、タングステン、炭化タン
グステン、酸化クロム、酸化マグネシウムなどを挙げる
ことができる。In the present invention, examples of the curing agent for the unsaturated polyester resin or the vinyl ester resin include methyl ethyl ketone ketone, cyclohexanone peroxide, methyl acetoacetate peroxide, acetylacetone peroxide, cumene hydroperoxide and the like. be able to. These curing agents can be used alone or in combination of two or more. In the present invention, examples of the accelerator used in combination with these curing agents include organic acid salts of cobalt such as cobalt naphthenate and cobalt octylate. In the present invention, a co-promoter can be further used if necessary. Examples of the promoter include β-diketones such as N, N-dimethylacetoacetamide, acetylacetone, dimedone, dibenzoylmethane, 2-acetylcyclopentanone and methyl acetoacetate, and aromatic compounds such as dimethylaniline and dimethyltoluidine. A tertiary amine etc. can be mentioned. By using a co-promoter, the curing speed at room temperature can be further increased. In the present invention, the viscosity of the liquid thermosetting resin at 25 ° C. is 0.1.
It is preferably from 10 to 10 Pa · s, more preferably from 0.5 to 5 Pa · s. If the viscosity of the liquid thermosetting resin at 25 ° C. is less than 0.1 Pa · s, superabrasive grains, fillers, etc. may precipitate during room temperature curing. If the viscosity of the liquid thermosetting resin at 25 ° C. exceeds 10 Pa · s,
It may be difficult to uniformly mix the liquid thermosetting resin, the curing agent, the superabrasive grains, the filler, and the like with stirring. As the superabrasive grains used in the present invention, natural diamond abrasive grains,
Examples thereof include artificial diamond abrasive grains and cubic boron nitride abrasive grains. The grain size of the superabrasive grains used in the present invention is not particularly limited and can be appropriately selected depending on the application of the superabrasive grain wheel. The filler used in the present invention is not particularly limited, and examples thereof include calcium carbonate, clay, alumina, talc, mica, glass powder, tungsten, tungsten carbide, chromium oxide, and magnesium oxide.
【0008】本発明においては、液状熱硬化性樹脂、硬
化剤、超砥粒及び充填剤を含有する混合物に、公転運動
と自転運動を付与することにより撹拌し、公転運動を付
与することにより脱泡したのち、均一に混合され脱泡さ
れた混合物を注型して室温で硬化し、さらに好ましくは
80〜200℃で二次硬化処理する。液状熱硬化性樹脂
などを含有する混合物に公転運動と自転運動を付与する
方法に特に制限はないが、例えば、(株)キーエンスから
販売されているハイブリッドミキサーなどを用いて混合
物に公転運動と自転運動を付与することができる。混合
物を容器に充填し、容器を回転速度1,000〜4,00
0min-1で公転させるとともに、回転速度400〜1,6
00min-1で自転させることにより、容器内の混合物に
遠心力と向心力が同時にはたらいて、混合物が撹拌され
均一化される。公転運動と自転運動を付与して撹拌する
時間に特に制限はないが、通常は0.5〜5分で混合物
を均一化することができる。次いで、容器を回転速度
1,000〜4,500min-1で公転させることにより、
容器内の混合物に遠心力がはたらいて、混合物と気泡の
比重差により脱泡が行われる。脱泡時には、30〜10
0min-1のゆるやかな回転速度で自転させることが好ま
しい。公転運動を付与して脱泡する時間に特に制限はな
いが、通常は0.5〜5分で完全に脱泡することができ
る。In the present invention, a mixture containing a liquid thermosetting resin, a curing agent, superabrasive grains and a filler is stirred by imparting orbital motion and rotation motion, and demixed by imparting orbital motion. After foaming, the mixture that has been uniformly mixed and defoamed is cast, cured at room temperature, and more preferably subjected to a secondary curing treatment at 80 to 200 ° C. There is no particular limitation on the method of imparting orbital motion and rotation to a mixture containing a liquid thermosetting resin, but for example, a mixture such as a hybrid mixer sold by KEYENCE CO., LTD. Exercise can be applied. Fill the container with the mixture, and rotate the container at a rotation speed of 1,000 to 4,000.
Revolution at 0 min -1 and rotation speed 400 ~ 1.6
By causing the mixture to rotate at 00 min -1 , centrifugal force and centripetal force act simultaneously on the mixture in the container, and the mixture is agitated and homogenized. Although there is no particular limitation on the time for imparting orbital motion and rotation motion and stirring, the mixture can be homogenized usually in 0.5 to 5 minutes. Then, by orbiting the container at a rotation speed of 1,000 to 4,500 min -1 ,
Centrifugal force acts on the mixture in the container, and defoaming is performed due to the difference in specific gravity between the mixture and bubbles. 30 to 10 when defoaming
It is preferable to rotate at a slow rotation speed of 0 min -1 . There is no particular limitation on the time for defoaming by imparting revolution movement, but normally, defoaming can be completed within 0.5 to 5 minutes.
【0009】比較的高粘度の液状熱硬化性樹脂と充填剤
を含有する混合物は、従来はニーダーなどの混練機を用
いて撹拌、混合されていた。しかし、ニーダーなどの混
練機を用いると、混合後のブレードなどの清掃に手間が
かかるばかりでなく、ブレードや器壁などに付着して失
われる混合物の量も多かった。本発明においては、混合
物を容器に充填して、公転運動と自転運動を付与するこ
とにより撹拌するので、ブレードなどの清掃の必要はな
い。また、比較的高粘度の液状熱硬化性樹脂と充填剤を
含有する混合物は、従来は減圧により脱泡されていた。
しかし、混合物を減圧下におくと、含まれる気泡が膨張
して混合物の体積が増大するので、大容量の容器を必要
とし、その結果器壁に付着して失われる混合物の量も多
くなった。本発明においては、混合物に遠心力を作用さ
せて脱泡するので、混合物の体積の増大はなく、大容量
の容器を使用する必要はない。混練機による撹拌と真空
脱泡を組み合わせる従来の方法では、処理に時間がかか
るので、室温硬化型の液状熱硬化性樹脂組成物はその間
に増粘し、注型が困難となる場合も多かった。本発明に
おいては、撹拌と脱泡を1〜10分の短時間で終了する
ことができるので、室温硬化型の液状熱硬化性樹脂組成
物を容易に処理することができる。また、混練機による
撹拌と真空脱泡を組み合わせる従来の方法では、液状熱
硬化性樹脂の含有量の多い混合物しか処理できなかった
が、本発明においては、液状熱硬化性樹脂が50重量%
以下のような少ない樹脂量でも撹拌及び脱泡が可能であ
る。A mixture containing a liquid thermosetting resin having a relatively high viscosity and a filler has conventionally been stirred and mixed by using a kneader such as a kneader. However, when a kneader such as a kneader is used, it takes a lot of time and labor to clean the blades after mixing, and a large amount of the mixture is attached to the blades and vessel walls and lost. In the present invention, it is not necessary to clean the blade or the like, because the container is filled with the mixture and the mixture is stirred by imparting the orbital motion and the rotational motion. Further, a mixture containing a liquid thermosetting resin having a relatively high viscosity and a filler has been conventionally degassed by depressurization.
However, when the mixture is put under reduced pressure, the bubbles contained therein expand and the volume of the mixture increases, so a large-capacity container is required, and as a result, the amount of the mixture attached to the vessel wall and lost is also large. . In the present invention, the mixture is subjected to centrifugal force to be defoamed, so that the volume of the mixture does not increase and it is not necessary to use a large capacity container. In the conventional method of combining stirring by a kneading machine and vacuum defoaming, the treatment takes time, so that the room temperature curable liquid thermosetting resin composition thickens in the meantime and casting is often difficult. . In the present invention, since stirring and defoaming can be completed in a short time of 1 to 10 minutes, the room temperature curable liquid thermosetting resin composition can be easily treated. Further, in the conventional method in which stirring by a kneader and vacuum defoaming are combined, only a mixture having a high content of the liquid thermosetting resin can be processed, but in the present invention, the liquid thermosetting resin is 50% by weight.
Stirring and defoaming are possible even with a small amount of resin as described below.
【0010】本発明においては、撹拌、脱泡を終了した
混合物を所望の型に注型して室温で硬化させる。混合物
を注型する型の材質に特に制限はなく、例えば、金型、
樹脂型などを挙げることができる。型の内面には、必要
に応じて、離型剤を塗布することができる。混合物を注
型する型の形状に特に制限はなく、例えば、チップ型に
注型して研磨用チップとし、台金に接合することがで
き、円環状の型に注型して超砥粒層としたのち台金に接
合してストレートホイールとすることもでき、あるい
は、台金を装着した型に注型して硬化と同時に超砥粒ホ
イールを得ることもできる。本発明においては、液状熱
硬化性樹脂を型に注型するので、ホットプレス法に比べ
て形状の自由度が大きく、容易に複雑な形状を有するレ
ジンボンド超砥粒ホイールを得ることができる。本発明
において、室温とは、JIS K 0050に規定される
5〜35℃をいう。本発明において、室温で硬化させる
時間に特に制限はないが、硬化剤と促進剤を併用して常
温硬化型とした場合、1〜36時間、より好ましくは4
〜24時間室温に放置することにより、液状熱硬化性樹
脂を硬化させることができる。室温での硬化時間が1時
間未満であると、樹脂の硬化が不十分となるおそれがあ
る。室温での樹脂の硬化時間が36時間を超えても、悪
影響はないが、硬化時間を長くする効果は得られない。In the present invention, the mixture after stirring and defoaming is cast in a desired mold and cured at room temperature. There is no particular limitation on the material of the mold for casting the mixture, for example, a mold,
Resin type etc. can be mentioned. If necessary, a release agent can be applied to the inner surface of the mold. The shape of the mold for casting the mixture is not particularly limited, and for example, it can be cast into a tip mold to form a polishing tip, which can be bonded to a base metal, and cast into an annular mold to form a superabrasive layer. After that, it can be joined to the base metal to form a straight wheel, or it can be cast in a mold equipped with the base metal to obtain a superabrasive wheel simultaneously with curing. In the present invention, since the liquid thermosetting resin is cast into the mold, the degree of freedom of the shape is greater than that of the hot pressing method, and a resin-bonded superabrasive wheel having a complicated shape can be easily obtained. In the present invention, room temperature refers to 5 to 35 ° C. specified in JIS K 0050. In the present invention, the time for curing at room temperature is not particularly limited, but when the curing agent and the accelerator are used in combination to obtain a room temperature curing type, it is 1 to 36 hours, more preferably 4 hours.
The liquid thermosetting resin can be cured by leaving it at room temperature for -24 hours. If the curing time at room temperature is less than 1 hour, the curing of the resin may be insufficient. Even if the curing time of the resin at room temperature exceeds 36 hours, there is no adverse effect, but the effect of increasing the curing time cannot be obtained.
【0011】本発明においては、液状熱硬化性樹脂、硬
化剤、超砥粒及び充填剤を含有する混合物を注型して室
温で硬化させたのち、形成されたレジンボンド超砥粒ホ
イールを、さらに80〜200℃、より好ましくは10
0〜150℃で二次硬化処理することが好ましい。二次
硬化処理することにより、液状熱硬化性樹脂の重合と架
橋をさらに進めて、レジンボンド超砥粒ホイールの強
度、硬度、密度、耐熱性などの特性を高めることができ
る。室温硬化により形成されたレジンボンド超砥粒ホイ
ールは、すでに形態の安定性を有するので、空気中にお
いて恒温槽内などに静置することにより、二次硬化処理
することができる。二次硬化処理温度が80℃未満であ
ると、二次硬化処理の効果が十分に発現しないおそれが
ある。二次硬化処理温度が200℃を超えると、熱劣化
を生ずるおそれがある。二次硬化処理の時間に特に制限
はないが、4〜20時間であることが好ましい。二次硬
化処理時間が4時間未満であると、硬度などの物性値が
不安定となるおそれがある。二次硬化処理時間が20時
間を超えると、それ以上に二次硬化処理時間を延ばして
もレジンボンド超砥粒ホイールの特性は向上しない。本
発明のレジンボンド超砥粒ホイールは、液状熱硬化性樹
脂、硬化剤、超砥粒及び充填剤を含有する混合物を、撹
拌、脱泡処理後に硬化させるので、気泡のない密度の高
いレジンボンド部を有する。また、室温硬化後に二次硬
化処理すると、ボンド硬度の高い超砥粒ホイールとな
る。本発明の製造方法によれば、ホットプレス法のよう
な高価な金型や成型機を使用することなく、優れた性能
を有するレジンボンド超砥粒ホイールを製造することが
できる。In the present invention, a mixture containing a liquid thermosetting resin, a curing agent, superabrasive grains and a filler is cast and cured at room temperature, and then the formed resin bond superabrasive grain wheel is Further 80 to 200 ° C., more preferably 10
It is preferable to carry out the secondary curing treatment at 0 to 150 ° C. By the secondary hardening treatment, the polymerization and cross-linking of the liquid thermosetting resin can be further advanced, and the properties such as strength, hardness, density, and heat resistance of the resin-bonded superabrasive wheel can be enhanced. Since the resin-bonded superabrasive grain wheel formed by room temperature curing already has morphological stability, it can be subjected to a secondary curing treatment by allowing it to stand still in a constant temperature bath in the air. If the secondary curing treatment temperature is lower than 80 ° C., the effect of the secondary curing treatment may not be sufficiently exhibited. If the secondary curing temperature exceeds 200 ° C., thermal deterioration may occur. The time for the secondary curing treatment is not particularly limited, but is preferably 4 to 20 hours. If the secondary curing time is less than 4 hours, the physical properties such as hardness may become unstable. If the secondary hardening treatment time exceeds 20 hours, the characteristics of the resin-bonded superabrasive wheel will not be improved even if the secondary hardening treatment time is further extended. Since the resin bond superabrasive wheel of the present invention cures a mixture containing a liquid thermosetting resin, a curing agent, superabrasive particles and a filler after stirring and defoaming treatment, it is a resin bond having high density without bubbles. Parts. Further, when the secondary hardening treatment is carried out after room temperature hardening, a superabrasive wheel having a high bond hardness is obtained. According to the manufacturing method of the present invention, a resin-bonded superabrasive wheel having excellent performance can be manufactured without using an expensive mold or molding machine such as the hot press method.
【0012】[0012]
【実施例】以下に、実施例を挙げて本発明をさらに詳細
に説明するが、本発明はこれらの実施例によりなんら限
定されるものではない。
実施例1
石材研磨用レジンボンド超砥粒ホイールを製作した。不
飽和ポリエステル樹脂[イソ系不飽和ポリエステル樹脂
27.5重量%、ビニルエステル樹脂27.5重量%、ス
チレン45重量%、粘度2.0Pa・s]100重量部に、
メチルエチルケトンパーオキシド[日本油脂(株)、パー
メック]1重量部とナフテン酸コバルト[Co6重量
%]1重量部を添加し、基材となる液状樹脂を調製し
た。この液状樹脂30容量部と、充填剤としての#20
00WA砥粒70容量部を混合した。得られた混合物に
対して、粒度#400の人造ダイヤモンド砥粒を0.3c
t/cm3混合した。ハイブリッドミキサー[(株)キーエン
ス、HM−500]を用いて、混合物の撹拌1分と脱泡
1分を続けて行った。別途に準備した長径40mm、短径
20mmの小判形チップ形状のフッ素樹脂製型枠に、撹拌
と脱泡の終わった上記の混合物を深さ15mmまで流し込
み、室温で4時間放置し、硬化させて研磨用チップを得
た。この研磨用チップの表面硬度は、ロックウエルFス
ケール(HRF)50であった。室温硬化後の研磨用チ
ップを、110℃の恒温槽中で、18時間加熱処理して
二次硬化した。二次硬化処理した研磨用チップの表面硬
度は、HRF80であった。二次硬化処理した12個の
研磨用チップ1を、別途に準備したアルミニウム製の直
径200mmの円板状台金2にエポキシ系接着剤を用いて
固定し、図1に示す形状の石材研磨用レジンボンド超砥
粒ホイールを得た。この超砥粒ホイールを用いて、あら
かじめメタル研磨盤[旭ダイヤモンド工業(株)、みやび
シリーズ]により中仕上げを終えた研磨面寸法600mm
×600mmの御影石(中国産)の細仕上げ研磨試験を行
った。得られた超砥粒ホイールを石材用自動研磨機[大
和機械(株)]に取りつけ、回転数450min-1、送り3.
5m/min、圧力150kPa、水量12L/minの条件
で、73分間研磨した。研削速度は3.1cm3/minであ
り、研削比は38であった。
比較例1
実施例1と同一形状、同一寸法の石材研磨用レジンボン
ド超砥粒ホイールを、フェノール樹脂を用いてホットプ
レス法により製作した。フェノール樹脂60重量部と充
填剤#2000WA砥粒40重量部を混合し、さらに粒
度#400の人造ダイヤモンド砥粒を0.3ct/cm3混合
した。この混合物を用いて180℃で30分間ホットプ
レス成形し、実施例1と同じ形状の長径40mm、短径2
0mm、厚さ15mmの研磨チップを得た。得られた研磨用
チップ12個を、実施例1と同じ形状のアルミニウム製
の台金にエポキシ系接着剤を用いて固定し、石材研磨用
レジンボンド超砥粒ホイールを得た。得られた超砥粒ホ
イールを用いて、実施例1と同じ条件で、御影石の細仕
上げを行った。研削速度は2.1cm3/minであり、研削
比は20であった。実施例1及び比較例1の結果を、第
1表に示す。The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples. Example 1 A resin-bonded superabrasive wheel for stone polishing was manufactured. 100 parts by weight of unsaturated polyester resin [27.5% by weight of unsaturated unsaturated polyester resin, 27.5% by weight of vinyl ester resin, 45% by weight of styrene, viscosity of 2.0 Pa · s],
1 part by weight of methyl ethyl ketone peroxide [NOF CORPORATION, Permec] and 1 part by weight of cobalt naphthenate [Co 6% by weight] were added to prepare a liquid resin as a base material. 30 parts by volume of this liquid resin and # 20 as a filler
70 parts by volume of 00WA abrasive grains were mixed. Artificial diamond abrasive grains with a grain size of # 400 are added to the obtained mixture at 0.3c.
t / cm 3 was mixed. The mixture was continuously stirred for 1 minute and defoamed for 1 minute using a hybrid mixer [KEYENCE HM-500]. Pour the above mixture, which had been stirred and defoamed, to a depth of 15 mm in a separately prepared fluororesin frame with a long diameter of 40 mm and a short diameter of 20 mm and leave it at room temperature for 4 hours to cure. A polishing tip was obtained. The surface hardness of this polishing tip was Rockwell F scale (HRF) 50. The polishing tip after room temperature curing was subjected to heat treatment for 18 hours in a constant temperature bath at 110 ° C. to be secondarily cured. The surface hardness of the polishing tip subjected to the secondary curing treatment was HRF80. Twelve pieces of the secondary hardening treated polishing tips 1 were fixed to a separately prepared disc base metal 2 of 200 mm in diameter with an epoxy adhesive, and used for polishing stone materials in the shape shown in FIG. A resin bond superabrasive wheel was obtained. Using this super-abrasive wheel, the surface finish is 600 mm, which has been pre-finished with a metal polishing machine [Asahi Diamond Industrial Co., Ltd., Miyabi series].
A fine finishing polishing test was performed on a 600 mm granite stone (made in China). The resulting superabrasive wheel was attached to an automatic stone polishing machine [DAIWA MACHINE CO., LTD.], Rotation speed 450 min -1 , feed 3.
Polishing was performed for 73 minutes under the conditions of 5 m / min, pressure of 150 kPa, and water amount of 12 L / min. The grinding speed was 3.1 cm 3 / min and the grinding ratio was 38. Comparative Example 1 A resin-bonded superabrasive wheel for stone polishing having the same shape and size as in Example 1 was manufactured by a hot pressing method using a phenol resin. 60 parts by weight of phenolic resin and 40 parts by weight of filler # 2000WA abrasive grains were mixed, and artificial diamond abrasive grains of particle size # 400 were further mixed at 0.3 ct / cm 3 . Using this mixture, hot press molding was carried out at 180 ° C. for 30 minutes, and the same shape as in Example 1 was obtained with a major axis of 40 mm and a minor axis of 2.
A polishing tip having a thickness of 0 mm and a thickness of 15 mm was obtained. The obtained 12 polishing tips were fixed to an aluminum base metal having the same shape as in Example 1 using an epoxy adhesive to obtain a resin-bonded superabrasive wheel for stone polishing. The obtained superabrasive wheel was used to fine-finish granite under the same conditions as in Example 1. The grinding speed was 2.1 cm 3 / min and the grinding ratio was 20. The results of Example 1 and Comparative Example 1 are shown in Table 1.
【0013】[0013]
【表1】 [Table 1]
【0014】第1表に見られるように、研削速度は実施
例1の超砥粒ホイールの方が比較例1の超砥粒ホイール
より約50%大きく、また、研削比は実施例1の超砥粒
ホイールは比較例1の超砥粒ホイールのほぼ2倍であ
る。
実施例2
JIS B 4131に規定する形状が1A1で、寸法が
175D×6T×3X×50.8Hのストレートホイー
ルを製作した。不飽和ポリエステル樹脂[イソ系不飽和
ポリフェニレンエーテル樹脂27.5重量%、ビニルエ
ステル樹脂27.5樹脂、スチレン45樹脂、粘度2.0
Pa・s]100重量部に、メチルエチルケトンパーオキ
シド[日本油脂(株)、パーメック]1重量部とナフテン
酸コバルト[Co6重量%]1重量部を添加し、基材と
なる液状樹脂を調製した。この液状樹脂100重量部、
充填剤としての平均粒径11μmの炭化ケイ素50重量
部及び粒度230/270のニッケル被覆合成ダイヤモ
ンド砥粒(ニッケル被覆率55重量%)50重量部を混
合した。ハイブリッドミキサー[(株)キーエンス、HM
−500]を用いて、この混合物の撹拌1分と脱泡1分
を続けて行った。別途に準備した169D×6T×5
0.8Hのアルミニウム合金製の台金を、離型剤を塗布
した金型に装填し、台金と金型の間隙に上記の撹拌及び
脱泡処理した混合物を注型し、室温で24時間放置して
硬化させ、ダイヤモンド砥粒層が形成されたストレート
ホイールを金型から取り出した。次いで、取り出したス
トレートホイールを120℃の恒温槽中で、14時間加
熱して二次硬化処理した。処理後のダイヤモンド砥粒層
の外周及び両側面を研削し、ストレートホイールを得
た。このストレートホイールを用いて、研削試験を行っ
た。ストレートホイールを平面研削盤[(株)岡本工作機
械製作所、KSK−Z1]に取り付け、ドレッシング用
砥石GC180−Gを用い、加工方式を駆動方式20o
傾斜とし、ホイール回転数1,800min-1、砥石回転数
400min-1、送り速度1m/min、切り込み15μm/
passの条件で、得られたストレートホイールのドレッシ
ングを行った。次いで、湿式プランジ研削方式により、
超硬合金K−20種を、ホイール回転数1,800mi
n-1、テーブル送り2m/min、切り込み50μmの条件
で、総研削量が6.3cm3に達するまで研削を行った。こ
の間の法線研削抵抗は平均70Nであり、研削比は27
0であった。
比較例2
実施例2と同一形状、同一寸法のストレートホイール
を、フェノール樹脂を用いてホットプレス法により製作
した。フェノール樹脂100重量部、充填剤としての平
均粒径11μmの炭化ケイ素50重量部及び粒度230
/270のニッケル被覆合成ダイヤモンド砥粒(ニッケ
ル被覆率55重量%)50重量部を混合し、実施例2と
同じ台金の外周にホットプレス法によりダイヤモンド砥
粒層を形成した。このストレートホイールを、実施例2
と同じ条件でドレッシングし、実施例2と同じ条件で研
削試験を行った。試験中の法線研削抵抗は平均86Nで
あり、研削比は290であった。実施例2及び比較例2
の結果を、第2表に示す。As can be seen from Table 1, the grinding speed of the superabrasive wheel of Example 1 is about 50% higher than that of the superabrasive wheel of Comparative Example 1, and the grinding ratio is higher than that of Example 1. The abrasive wheel is about twice as large as the superabrasive wheel of Comparative Example 1. Example 2 A straight wheel having a shape defined by JIS B 4131 of 1A1 and dimensions of 175D × 6T × 3X × 50.8H was manufactured. Unsaturated polyester resin [iso-unsaturated polyphenylene ether resin 27.5% by weight, vinyl ester resin 27.5 resin, styrene 45 resin, viscosity 2.0
To 100 parts by weight of Pa · s, 1 part by weight of methyl ethyl ketone peroxide [NOF CORPORATION, Permec] and 1 part by weight of cobalt naphthenate [Co 6% by weight] were added to prepare a liquid resin as a base material. 100 parts by weight of this liquid resin,
50 parts by weight of silicon carbide having an average particle size of 11 μm as a filler and 50 parts by weight of nickel-coated synthetic diamond abrasive grains having a particle size of 230/270 (nickel coverage 55% by weight) were mixed. Hybrid mixer [Keyence Corporation, HM
-500] was used for 1 minute of continuous stirring and 1 minute of defoaming. 169D × 6T × 5 prepared separately
A 0.8H aluminum alloy base metal is loaded into a mold coated with a mold release agent, and the above stirring and defoaming mixture is cast into the gap between the base metal and the mold, and the mixture is left at room temperature for 24 hours. It was left standing to cure, and the straight wheel on which the diamond abrasive grain layer was formed was taken out from the mold. Next, the taken out straight wheel was heated for 14 hours in a constant temperature bath at 120 ° C. for secondary curing treatment. The outer periphery and both side surfaces of the treated diamond abrasive grain layer were ground to obtain a straight wheel. A grinding test was performed using this straight wheel. A straight wheel was attached to a surface grinder [Okamoto Machine Tool Mfg. Co., Ltd., KSK-Z1], and a grinding wheel GC180-G was used to drive the processing method 20 o.
Inclination, wheel speed 1,800 min -1 , grindstone speed 400 min -1 , feed rate 1 m / min, depth of cut 15 μm /
The obtained straight wheels were dressed under the conditions of pass. Then, by the wet plunge grinding method,
Cemented Carbide K-20, wheel speed 1,800mi
Grinding was performed under the conditions of n −1 , table feed of 2 m / min, and cut depth of 50 μm until the total grinding amount reached 6.3 cm 3 . The normal grinding resistance during this period was 70 N on average, and the grinding ratio was 27.
It was 0. Comparative Example 2 A straight wheel having the same shape and size as those of Example 2 was manufactured by hot pressing using phenol resin. 100 parts by weight of phenol resin, 50 parts by weight of silicon carbide having an average particle size of 11 μm as a filler, and a particle size of 230
50 parts by weight of nickel-coated synthetic diamond abrasive grain of / 270 (nickel coating rate 55% by weight) was mixed, and a diamond abrasive grain layer was formed on the outer periphery of the same base metal as in Example 2 by the hot pressing method. This straight wheel is used in Example 2
Dressing was carried out under the same conditions as above, and a grinding test was carried out under the same conditions as in Example 2. The normal grinding resistance during the test was 86 N on average and the grinding ratio was 290. Example 2 and Comparative Example 2
The results are shown in Table 2.
【0015】[0015]
【表2】 [Table 2]
【0016】第2表に見られるように、比較例2のフェ
ノール樹脂を用いてホットプレス法により製作したスト
レートホイールに比べて、実施例2の不飽和ポリエステ
ル樹脂を用いて製作したストレートホイールは、法線研
削抵抗が小さく、研削比は同等である。As can be seen from Table 2, the straight wheel manufactured by using the unsaturated polyester resin of Example 2 is more than the straight wheel manufactured by the hot pressing method by using the phenol resin of Comparative Example 2. The normal grinding resistance is small and the grinding ratio is the same.
【0017】[0017]
【発明の効果】本発明のレジンボンド超砥粒ホイール
は、レジンボンド部に気泡を含まず密度が高く、切れ味
に優れ、寿命が長い。本発明方法によれば、このような
レジンボンド超砥粒ホイールを、高価な金型や成形機を
使用することなく、簡便かつ容易に製造することができ
る。The resin-bonded superabrasive wheel of the present invention has a high density without bubbles in the resin-bonded portion, has excellent sharpness, and has a long life. According to the method of the present invention, such a resin-bonded superabrasive wheel can be simply and easily manufactured without using an expensive die or molding machine.
【図1】図1は、実施例において製作したレジンボンド
超砥粒ホイールの斜視図である。FIG. 1 is a perspective view of a resin bond superabrasive wheel manufactured in an example.
1 研磨用チップ 2 台金 1 Polishing tip 2 units
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) B24D 3/30 B24D 3/00 320 B24D 3/00 340 ─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields investigated (Int.Cl. 7 , DB name) B24D 3/30 B24D 3/00 320 B24D 3/00 340
Claims (2)
填剤を含有する混合物を容器に充填し、該容器を公転運
動と自転運動を付与することにより撹拌し、公転運動を
付与することにより脱泡したのち、該混合物を注型して
室温で硬化したのち、80〜200℃で二次硬化処理す
ることを特徴とするレジンボンド超砥粒ホイールの製造
方法。1. A container is filled with a mixture containing a liquid thermosetting resin, a curing agent, superabrasive grains and a filler, and the container is agitated by imparting orbital and rotational motions to the orbital motion.
After defoaming by applying , the mixture is cast and cured at room temperature, and then secondarily cured at 80 to 200 ° C.
Resin bond superabrasive wheel manufacturing method which is characterized in that that.
樹脂又はビニルエステル樹脂である請求項1記載のレジ
ンボンド超砥粒ホイールの製造方法。 2. A liquid thermosetting resin is an unsaturated polyester.
The cash register according to claim 1, which is a resin or a vinyl ester resin.
Bonded super abrasive wheel manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001026792A JP3474543B2 (en) | 2001-02-02 | 2001-02-02 | Method for manufacturing resin bonded superabrasive wheel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001026792A JP3474543B2 (en) | 2001-02-02 | 2001-02-02 | Method for manufacturing resin bonded superabrasive wheel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002233960A JP2002233960A (en) | 2002-08-20 |
| JP3474543B2 true JP3474543B2 (en) | 2003-12-08 |
Family
ID=18891551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001026792A Expired - Fee Related JP3474543B2 (en) | 2001-02-02 | 2001-02-02 | Method for manufacturing resin bonded superabrasive wheel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3474543B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111372726B (en) * | 2017-11-21 | 2022-06-07 | 3M创新有限公司 | Coated abrasive discs and methods of making and using the same |
| JP7621755B2 (en) | 2020-08-25 | 2025-01-27 | 株式会社ディスコ | Grinding wheel and method for grinding wafer |
-
2001
- 2001-02-02 JP JP2001026792A patent/JP3474543B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002233960A (en) | 2002-08-20 |
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