JP3482900B2 - Manufacturing method of BGA type semiconductor device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB (Tape Aut).
and a BGA type semiconductor device using the tape. 2. Description of the Related Art There is a semiconductor device of a BGA (Ball Grid Array) package for performing surface mounting on a printed circuit board using solder balls. The features of this BGA type semiconductor device are:
Since electrical bonding with the printed circuit board can be performed on the entire flat surface of the package, QFP (Qu
Compared to a device connected on each side of the package, such as an ad flat package, the number of pins (multi-terminals) can be increased without reducing the pitch between terminals (leads). In particular, those using a TAB tape as a package structural material are suitable for thinning and miniaturization.
CSP (Chip Size Pa) such as BGA (trademark of Tessera, USA)
ckage) is possible. The μBGA package is a tape BGA type CSP, and has a structure in which an elastomer (low elastic resin) is interposed between the chip and the TAB tape, and the chip and the TAB tape are connected by leads formed in an S shape. .
In the μBGA technology, since an elastomer is interposed between the chip and the TAB tape, thermal stress generated between the package and the printed board can be reduced, and the life of the solder ball joint can be improved. FIG. 4 shows an assembly process for manufacturing a semiconductor device having a μBGA structure using a TAB tape. A wiring pattern 1 including wiring leads 3 and lands 12 on one surface of a tape base 10 made of an insulating film.
The elastomer 20 is adhered to the TAB tape 1 provided with No. 1 to form a TAB tape 30 with an elastomer for BGA (FIG. 4A). [0006] This TAB tape with elastomer for BGA 3
The semiconductor chip 2 is mounted at 0 (FIG. 4B).
The semiconductor chip 2 is made of an elastomer 2 as a double-sided adhesive film.
No. 0 is adhered to the TAB tape 30. Next, the inner lead 3a of the TAB tape with elastomer for BGA 30 is formed in an S shape by a bonding tool, and connected to the electrode pad 7 as a terminal electrode of the semiconductor chip 2 (FIG. 4C). That is, the bonding tool 8 (FIG. 6) cuts the notch of the inner lead 3a, further forms the inner lead 3a in an S shape, and performs bonding on the electrode pad 7 of the semiconductor chip 2 by heat and ultrasonic waves. Next, the electrode pads 7 and the leads 3a of the bonded semiconductor chip 2 are sealed with a sealing resin 40 (FIG. 4D). Then, the solder balls 50 are mounted on the lands 12 of the TAB tape 1 (FIG. 4E), and laser marking or printing is performed on the chip surface (FIG. 4F). Finally, it is cut into individual pieces by punching from a TAB tape 30 with an elastomer for BGA to obtain a μBGA package. As described above, the μBG using the TAB tape
In the A package, as one means for achieving thinness and miniaturization, a general wire bonding method is not used for electrical connection between the wiring leads 3 of the TAB tape and the electrode pads 7 of the semiconductor chip 2, and FIG. As shown in FIG. 6, a bonding window (bonding window) 6 is provided in a portion of the TAB tape located immediately above the electrode pad 7 of the semiconductor chip 2, and the portion is bridged through the inner lead 3a of the wiring lead 3 in FIG. As described above, one side of the wiring lead 3 is cut by the bonding tool 8 and directly hit the electrode pad 7 of the semiconductor chip 2 (inner lead bonding). The wiring leads of the TAB tape are generally made of Cu foil, but Au is electroplated for the above connection method. In order to perform this plating, in the manufacturing process of the TAB tape, as shown in FIG. 5, each wiring lead 3 connected to the electrode pad 7 of the semiconductor chip is connected by the power supply line 4. Further, even after the package is cut off from the TAB tape, since the power supply line exists in the package in the prior art, when connecting the terminal electrode and the wiring lead (inner lead bonding), one side of the wiring lead is used. (The power supply line side) will be short-circuited between the terminal electrodes unless it is cut securely. In order to reliably cut one side (the power supply line side) of the wiring lead, it is necessary to fix the tape portion at the package end with a jig in the inner lead bonding step. However, the package size (tape size) tends to approach the size of the chip as much as possible, which reduces the amount of tape fixing allowance and makes it difficult to securely fix and thus cut the leads during bonding. Contact (short) of the cut inner lead may occur, which may be a fatal problem in the function of the product. An object of the present invention is to solve the above-mentioned disadvantages of the prior art and eliminate the necessity of cutting the wiring leads from the power supply line side in the inner lead bonding step. An object of the present invention is to provide a highly reliable TAB tape and a BGA type semiconductor device using the same, in which short-circuiting due to cutting cannot occur in principle in package manufacturing. [0015] To achieve the above object, a method of manufacturing a BGA type semiconductor device according to the present invention comprises:
A bonding window is formed at a predetermined position, and formed on the tape base so as to extend over the bonding window.
And a separate wiring leads including a plurality of inner leads which,
A TAB tape having a common power supply line for electroplating these wiring leads is formed, and the TAB tape is formed.
Paste the elastomer on the wiring lead side of the tape
The semiconductor chip is bonded via an elastomer, and the inner leads are connected to terminal electrodes of the semiconductor chip.
In the method for manufacturing a BGA type semiconductor device according to the above , after the electroplating, the a
Terminal of the semiconductor chip without cutting the inner leads.
Electrically connected to a pole and intersects the plurality of wiring leads between the bonding window and the common power supply line
By punching portions, said from the TAB tape
Outline line of semiconductor device for mounting semiconductor chip
At the same time separating the region surrounded by, city away off the wiring lead and the power supply line, in which electrically is independently a plurality of inner leads (claim 1). The gist of the present invention is that a slit formed to separate a wiring lead from a power supply line after electroplating is determined so as to come on a wiring lead between the wiring lead and the power supply line. That is, a plurality of inner leads are made independent. This eliminates the necessity of disconnecting the wiring lead from the power supply line when connecting the terminal electrode of the semiconductor chip and the wiring lead, and it is possible in principle to eliminate the occurrence of short-circuiting of the lead during package manufacturing. [0018] In the TAB tape or the BGA type semiconductor device of the present invention, it has good when the slit is provided so as to form a contour line of a semiconductor device. The feature of this mode is that the position of the power supply line for applying Au plating to the wiring lead of the TAB tape is arranged outside the package, whereby the connection between the terminal electrode of the semiconductor chip and the wiring lead is reduced. There is no need to cut the leads from the power supply line side, and the short circuit in package manufacturing can be eliminated in principle. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the illustrated embodiment. FIG. 1 shows a TAB according to an embodiment of the present invention.
4A is a top view showing a state in which the semiconductor chip 2 is mounted on the tape 1 by using an elastomer 20 as shown in FIG. 4A, and the wiring leads 3 and the power supply lines 4 are shown on the outermost surface for easy understanding. I have. The TAB tape 1 is provided on a tape base 10 made of an insulating film and provided on the tape base 10,
Individual wiring leads 3 including a plurality of inner leads 3a electrically connected to the electrode pads 7 as terminal electrodes of the semiconductor chip 2, and the wiring leads 3 provided on the tape base 10 and subjected to electroplating And a common power supply line 4. Further, the TAB tape 1 has a bonding window 6 formed in the tape base material 10 at a portion where the plurality of inner leads 3a exist. As described above, in the TAB tape 1, the bonding window 6 is formed in the tape base 10 at the portion where the plurality of inner leads 3a are present. As a result, the plurality of inner leads 3a Window 6
Existed. The plurality of inner leads 3a extend at the same width, and a notch serving as a cutting position is not provided in the middle of the inner leads 3a as in the related art. In FIG. 1, the wiring leads 3 and the power supply lines 4 are connected to the wiring patterns 1 in the TAB tape manufacturing process.
After the completion of the Au plating, the wiring is divided by the slits 5 provided so as to intersect the wiring leads 3. In other words, the outer shape line of the semiconductor device formed by the slit 5 for separating the wiring lead 3 and the power supply line 4 after the electroplating is determined so as to come on the wiring lead 3 between the wiring lead 3 and the power supply line 4. The plurality of inner leads 3a are separated by the slits 5 so as to be electrically independent from each other. That is, T
The wiring pattern 3 is formed such that the power supply line 4 does not exist on the side of the surface area of the tape base material 10 of the AB tape 1 where the semiconductor chip 2 is mounted (inside the package surrounded by the outline of the semiconductor device). Are located. FIG. 2 is a cross-sectional view of a bonding portion in the inner lead bonding step, showing a state in which the bonding tool 8 has just descended to the electrode pad 7 and bonding has been completed. As shown in FIG. 2, the inner lead 3a laid over the bonding window 6 is connected to the electrode pad 7 which is a terminal electrode of a semiconductor chip by crimping using a bonding tool 8. At this time, the inner lead 3a is conventionally cut, but in the present invention, the inner lead 3a is crimped to the electrode pad 7 without being cut. That is, in the related art, as shown in FIG. 5, the power supply line 4 exists in the surface area of the tape base material 10 of the TAB tape 1 on the mounting side of the semiconductor chip 2, that is, in the semiconductor package. As a result, conventionally, as shown in FIG. 6, when the bonding tool 8 just goes down to the electrode pad 7 and completes the bonding, the power supply line 4 is present in the semiconductor package. If the lead 3 is not surely cut off on the power supply line 4 side, an electrical short will occur,
It is completely defective as a product. Therefore, since it is necessary to cut the lead, it is necessary to make a notch on the lead in order to determine the cutting position. In order to provide this notch in the lead, it is necessary to increase the width of the base lead, which hinders the progress of narrowing the pitch. Conventionally, in order to reliably cut one side (the power supply line 4 side) of the wiring lead 3 in the inner lead bonding step, it is necessary to secure a tape fixing margin so that the tape portion at the package end is fixed with a jig. Yes,
This is an obstacle to reducing the package size. However, in this embodiment, the power supply line 4 does not exist in the package as shown in FIG.
Are electrically independent from each other, in the inner lead bonding step shown in FIG.
There is no need to cut on the side (outside the package). Further, since it is not necessary to form a notch on each wiring lead 3 for cutting, the pitch of the leads can be reduced. FIG. 3 shows that the semiconductor chip 2 is mounted on the TAB tape 1 by using the elastomer 20 in accordance with the manufacturing method already described with reference to FIGS. 4 shows a semiconductor device having a BGA structure in a state where an inner lead bonding step of electrically cutting the semiconductor chip 2 through the slits 5 and electrically connecting to the electrode pads 7 of the semiconductor chip 2 seen through the bonding window 6 is completed. It is. Since the inner leads 3a do not need to be cut in the inner lead bonding step,
Even if the fixing margin of the TAB tape 1 is reduced due to downsizing of the CSP or the like, there is essentially no danger of the inner leads 3a coming into contact. As described above, according to the present invention, the following excellent effects can be obtained. According to the invention, in the manufacturing method of the BGA type semiconductor device constituted using the TAB tape, a slit is formed to after electroplating disconnect the wiring lead and the power supply line, the wiring lead and the power supply line And the plurality of inner leads are independent of each other, so that when connecting the terminal electrodes of the semiconductor chip and the wiring leads, it is necessary to disconnect the wiring leads from the power supply line side. Is eliminated, and the occurrence of short-circuiting of the lead in package manufacturing can be eliminated in principle. Further, according to the present invention, have you <br/> the manufacturing method of the BGA type semiconductor device constituted using <br/> the TAB tape, the outer shape line of the slit semiconductor device formed Therefore, a common power supply line for applying Au plating to wiring leads in the TAB tape manufacturing process does not remain in the semiconductor device. Therefore, since the wiring leads are electrically independent, it is not necessary to cut the wiring leads during the inner lead bonding, and the lead disconnection defect (uncut) at the time of bonding, which has been a problem in the prior art.
In principle, short-circuit failure due to the above can be eliminated.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partial plan view showing a BGA type semiconductor device of the present invention with a semiconductor chip mounted on a TAB tape, and wiring leads and power supply lines for easy understanding. FIG. 2 is a view showing the top surface. FIG. 2 is a cross-sectional view showing an inner lead bonding step of the BGA type semiconductor device according to the present invention, showing a state where a bonding tool has just descended to an electrode pad portion and bonding has been completed. FIG. 3 is a partial plan view showing the BGA type semiconductor device of the present invention in a state where an inner lead bonding step is completed, and wiring leads and power supply lines are shown on the outermost surface for easy understanding. FIG. FIG. 4 is a diagram showing a part of the manufacturing process of the BGA type semiconductor device used in the present invention. FIG. 5 is a partial plan view showing a conventional BGA type semiconductor device with a semiconductor chip mounted on a TAB tape, in which wiring leads and power supply lines are shown on the outermost surface for easy understanding. FIG. FIG. 6 is a cross-sectional view showing an inner lead bonding step of a conventional BGA type semiconductor device, showing a state where a bonding tool has just descended to an electrode pad portion serving as a terminal electrode and bonding has been completed. FIG. 7 is a partial plan view showing a conventional BGA type semiconductor device in a state where an inner lead bonding step is completed, in which wiring leads and power supply lines are shown on the outermost surface for easy understanding. It is. [Description of Signs] 1 TAB tape 2 Semiconductor chip 3 Wiring lead 3a Inner lead 4 Power supply line 5 Slit 6 Bonding window 7 Electrode pad (terminal electrode) 8 Bonding tool 10 Tape base material 20 Elastomer 30 BTA-equipped TAB tape 40 for BGA Sealing resin 50 Solder ball

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-7-321157 (JP, A) JP-A-60-154536 (JP, A) JP-A 8-293529 (JP, A) JP-A 9-1997 22925 (JP, A) Hikaru 4-99542 (JP, U) WO 98/018162 (WO, A1) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/60

Claims (1)

(57) [Claims] [Claim 1] A bonding window is provided at a predetermined position on a tape base material.
Is formed on the tape substrate, and
Forming a TAB tape including individual wiring leads including a plurality of inner leads formed to extend over a window, and a common power supply line for performing electroplating on the wiring leads, and forming a wiring of the TAB tape. D on the lead side
Paste the elastomer and put the semiconductor chip through the elastomer.
Tsu bonding the flop, the BGA type semiconductor device of the inner lead was to be connected to the terminal electrodes of the semiconductor chip
In the manufacturing method , after the electroplating, the bonding may be performed.
Cutting the inner lead suspended over the window
Electrically connecting to the terminal electrodes of the semiconductor chip, and punching out portions intersecting the plurality of wiring leads between the bonding window and the common power supply line .
Mounting the semiconductor chip from the TAB tape
The area surrounded by the outline of the semiconductor device
And at the same time away, away City cut the wiring lead and the power supply line,
The plurality of inner leads are electrically independent from each other.
A method for manufacturing a BGA type semiconductor device .