JP3483191B2 - Non-reciprocal circuit element - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a compact, surface-mounting, lumped-constant nonreciprocal circuit device which is a component of a mobile communication device using microwaves.

[0002]

2. Description of the Related Art Non-reciprocal circuit elements such as isolators and circulators are used in mobile communication devices, that is, PHS (Personal Handy Phone) base stations, mobile phone terminals and the like, which utilize a frequency band of several hundred MHz to ten and several GHz. There are many examples of using. This element has a function of passing microwaves in the forward direction with low loss and blocking microwaves in the backward direction.

This non-reciprocal circuit device is required to be small and have high reliability, especially in a portable device. That is, there is a demand for a structure that is less likely to malfunction due to noise from the outside and that can withstand severe vibration. In order to meet the demand, conventionally, the yoke of the magnetic circuit has a function of an electric field shield, or the inside of the component is fixed with a filler or the like after the component is assembled and completed. Also,
Accurate soldering was required, and skilled workers were needed to meet this demand. However, even then, it was difficult to completely prevent accidents such as short circuits and poor connections.

Further, in the case of a non-reciprocal circuit device used for high-frequency applications in a narrow frequency band such as a mobile phone, it has been an unsatisfactory reality even though it requires particularly high-precision frequency characteristics. The description of this point is as follows. Small lumped-constant nonreciprocal circuit devices have been
A ferrite, a central conductor, a laminated capacitive element, a resistive element and other members are provided in an iron case that also serves as a yoke. This non-reciprocal circuit device is usually finely adjusted to meet the target characteristic standard at a specific frequency after completing the assembly work.

That is, the magnetic field generated by the permanent magnet is adjusted by magnetizing and demagnetizing operations, or the capacitance is adjusted by trimming the electrode pattern of the capacitor, or the wire ring spacing of the air-core coil used together is adjusted. The standard method was to match the target characteristics with a method. Whether this magnetic field adjustment or capacity adjustment, disassemble the non-reciprocal circuit element once, make adjustments,
The method of reassembling, confirming the characteristics, and disassembling and adjusting was adopted.

However, as long as such adjusting means is adopted, the variation caused by the assembling work must be excluded from the object of the adjustment, so that the precise adjustment must be abandoned. Incidentally, the non-reciprocal circuit element in which the wire ring spacing of the air-core coil was adjusted after the assembly work was liable to change in characteristics due to vibration, and was not practical in a portable device for mobile communication.

For the purpose of improving the efficiency of adjustment work and the improvement of adjustment accuracy, a hole is temporarily provided in the upper part of the metal case of the nonreciprocal circuit device, and the electrode pattern of the horizontally fixed semi-fixed capacitor is provided in the above hole. If the capacitor is to be trimmed via, the pattern of the capacitor should not be at least shaded by the permanent magnet or the like, and therefore it is necessary to dispose it outside the permanent magnet. In other words, the size of the parts will increase and it will be far from the market demand. Further, the chips generated as a result of trimming scatter in the parts and cause a short circuit accident, which is a fatal defect in terms of reliability. As a result, the above adjustment method is not practical at all.

Therefore, in order to match this variation in performance with the target performance in the characteristic adjustment work, it is necessary to make an adjustment at the time of arranging parts using a great deal of time and labor, and moreover, insufficient adjustment of accuracy is required. This has been a major cause of hindering the development of this product field by causing delays in automation of production in the product field, ensuring of reliability, performance of parts, accuracy, price, and the like.

[0009]

In view of the above situation, the problems to be solved by the present invention for a small lumped constant type non-reciprocal circuit device are as follows.

That is, it is to provide a non-reciprocal circuit device for a mobile communication device which meets the following requirements. The structure contributes to the miniaturization of parts, the number of parts is reduced, the solder work can be performed accurately, and the position shift is less likely to occur due to the solder work. That is, the capacity adjustment is easy and precise. In addition, it has excellent performance and little variation, a structure that contributes to automation of the manufacturing process, a structure that contributes to improved productivity and production efficiency, and a finished product that is resistant to noise.

[0011]

As a result of intensive research to solve the above-mentioned problems, the inventors of the present invention have conceived a non-reciprocal circuit device having a significantly improved structure. That is, according to the present invention, a plurality of central conductors are arranged in an electrically insulated state and crossed with each other in a ferrite to which a DC magnetic field is applied, and a resistance element and / or a resistor is provided between one port of the central conductor and ground.
Alternatively, in the non-reciprocal circuit element in which the laminated capacitive element is connected, the laminated capacitive element is connected between each of the other ports and the ground, and the ferrite is arranged in the central hole of the substantially rectangular resin body, The element has a laminated surface of the opposite side electrode and the earth side electrode, and the laminated surface of the laminated capacitive element is arranged so that the opposite side electrode and the earth side electrode of at least one laminated capacitive element are parallel to the rotation axis of the ferrite. Stand up,
The laminated capacitive element is arranged vertically so that the opposite side electrode faces the center conductor side which is the inside of the non-reciprocal circuit element, and the ground side electrode faces the outside of the non-reciprocal circuit element. The non-reciprocal circuit device is arranged along the outer surface of the substantially rectangular resin body.

In the present invention, the resistance element or the laminated capacitive element is an isolator if it is a resistive element and a circulator if it is a laminated capacitive element.
It is not necessary to distinguish between these two. The essential point of the configuration of the present invention is that the laminated surface of the laminated capacitive element is used upright. The term “parallel” means substantially parallel, that is, it has an inclination within 30 degrees with respect to the direction of the axis of rotation of the ferrite. Hereinafter, this expression has the same meaning throughout the specification unless otherwise defined.

In the nonreciprocal circuit device of the present invention, the first electrode electrically connects the opposite side electrode of the multilayer capacitor to the port.
And a second conductor plate for electrically connecting the earth side electrode of the laminated capacitive element to the earth, the first and second conductor plates being in an insulated state, and the first, The laminated capacitive element is arranged between the second conductor plates. In the non-reciprocal circuit device according to the present invention, the laminated capacitive element is electrically connected to the port or the ground through first and second copper plates that are in an insulated state, and the first copper plate is A first portion that is surface-connected to the opposing electrode of the outermost layer of the multilayer capacitive element with solder, a second portion that is connected to the port, and a third portion integrally formed with resin, The copper plate 2 has a first portion surface-connected to the earth-side electrode of the outermost layer of the multilayer capacitive element with solder, a second portion earth-connected, and a third portion integrally formed with resin. It may be configured to.

The copper plate may be any conductor as long as it is a conductor, such as a copper plate having a surface plated with another metal, Al or F.
Other metals such as e, Sn, and Ti, light metals, and compounds thereof may be used. However, if it is copper, especially workability of solder,
Excellent economy, processability, conductivity, and electromagnetic wave shielding.

Further, in the present invention, a fourth portion having external input / output electrodes may be added to the first copper plate.
Alternatively, the second copper plate may be provided with a fourth portion having an external ground electrode. Also the second part and the third
May be duplicated.

In the above invention, the first portion of the first copper plate is arranged closer to the center conductor, and the first portion of the second copper plate is arranged on the outer side surface of the nonreciprocal circuit device. It may be a non-reciprocal circuit element.

To explain the present invention in another way, a copper plate having the center conductor and the opposite side electrode of the laminated capacitive element connected at the shortest distance is arranged on the inner side, and is connected to the ground plate at the shortest distance on the outer side. The grounded copper plate is placed, and the laminated capacitive element is sandwiched between them. By adopting this structure, the noise component generated from the non-reciprocal circuit element or entering the non-reciprocal circuit element is blocked and blocked, that is, the surface of the laminated capacitive element or copper plate is parallel to the central axis of the ferrite. The surface is arranged.

In the nonreciprocal circuit device of the above invention, the resin integrally formed with the respective third parts of the first and second copper plates has a heat resistance of 250 ° C. or higher. Is desirable.

The point here is that the resin integrally formed with the copper plate has heat resistance to withstand the temperature of molten solder or the temperature of a reflow furnace. More preferably, the resin has water repellency with respect to the molten solder, that is, one that repels the molten solder. Examples of such resin include liquid crystal aromatic polyester, epoxy resin, Teflon,
Examples include peak resins and urea resins.

In the nonreciprocal circuit device described above,
It is desirable to form the resin integrally formed with the respective third portions of the first and second copper plates by one body.

Further, in the above-mentioned non-reciprocal circuit device, the resin integrally formed with the respective third portions of the respective first and second copper plates connected to the respective ports of the center conductor or the ground is formed by one body. You may.

In the present invention, the resin may contact the outer peripheral side of the ferrite directly or through the center conductor to correct the arrangement of the ferrite. For this purpose, it is better to provide an appropriate concave portion in the resin molded product.

Alternatively, the integrally molded product of the copper plate and the resin may be arranged at a position corresponding to each port of the center conductor of the nonreciprocal circuit device, or the resin portion may be integrally formed. Alternatively, a ground plate or a ground-side external electrode may be integrally formed.

Further, according to another invention, the laminated capacitive element is a semi-fixed capacitive element, and the capacitance adjusting portion is a trimming pattern of the ground side electrode on the outermost layer of the laminated capacitive element and the non-reciprocal circuit element. It is a non-reciprocal circuit element formed by being exposed on the side surface.

That is, the laminated capacitive element can be trimmed, and the trimming work can be easily performed from the side surface after the nonreciprocal circuit element is assembled and fixed. The metal yoke that interferes with the trimming work is provided at a position excluding the working portion. Therefore, as a matter of course, only the copper plate is locally provided outside the earth side electrode of the multilayer capacitor, and the metal yoke should not be covered.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION In the nonreciprocal circuit device of the present invention, the laminated capacitive device is used in a so-called vertical arrangement, that is, in an upright position. First and second copper plates are electrically connected to the facing electrode and the earth electrode of the laminated capacitive element by soldering, respectively. Naturally, these copper plates are vertically arranged at the above-mentioned connecting portions.

These two copper plates are fixed with a resin in such a position that the laminated capacitive element is just fitted between them and that they are never short-circuited. Normally, this resin is not a separate component for each port but a single resin. This is because the overall arrangement is more accurate, the number of parts is reduced, and the number of assembly steps is reduced.

Further, the laminated capacitive element is arranged such that the opposite electrode of the laminated capacitive element faces the central conductor side which is the inside of the non-reciprocal circuit element (the laminated capacitive element is located outside the non-reciprocal circuit element). Arrange so that the earth side electrode of the device faces. That is, the copper plate, which is a conductor plate, and the internal electrodes of the laminated capacitive element are arranged so as to block the arrival direction of noise and the emission direction of noise.

With this arrangement, the connection between the laminated capacitive element and the central conductor becomes the shortest distance. Moreover, since there is no extra wiring, it can be said that the number of parts can be reduced and miniaturization can be economically realized, and the antenna action of the wiring can be suppressed to the minimum. The antenna action of this wiring is a disadvantageous phenomenon in terms of transmission and reception of noise.

When the laminated capacitive element is a semi-fixed capacitive element, the trimming pattern is exposed on the outer surface of the nonreciprocal circuit element. As a matter of course, the trimming pattern is formed on the ground-side electrode, and the shape of the metal case is determined so that the metal case does not cover the trimming work area.

The structure of the first and second copper plates other than the first part will be described. The first copper plate is a portion (that is, a second portion) that is folded back so as to sandwich the extending portion of the center conductor in a portion other than the portion (that is, the first portion) where the electrodes on the opposite side of the laminated capacitive element are solder-connected. The central conductor is temporarily fixed at this portion, and then the extending portion of the central conductor and the copper plate are fixed by soldering and electrically connected. It is more convenient to keep the portion of the conductor facing the folded-back portion (that is, the second portion) substantially horizontal.

The first copper plate has a different portion (that is, the fourth portion).
The outer electrode of the non-reciprocal circuit device is formed in the part (1). This external electrode portion is substantially horizontal, but it is convenient to provide it on a plane different from the portion facing the folded portion (that is, the second portion). Ie during this time
For example, it will be folded about twice.

The second copper plate has a part (third part) of the part other than the part (that is, the first part) other than the part to which the ground-side electrode of the laminated capacitive element is solder-connected, which is integrally formed in the resin. The part (second part) is electrically connected to the ground plate or forms a ground plate, and a part (fourth part) is connected to the ground side external electrode of the non-reciprocal circuit device or the ground side external electrode. Form.

[0034]

EXAMPLES The details of the present invention will be described below based on examples. FIG. 1 is an exploded perspective view of a non-reciprocal circuit device for explaining an embodiment of the present invention. 2 is an enlarged perspective view of the copper plate (10) shown in FIG.

First, an integrally molded product of the first and second copper plates (11, 12) and the resin (7) was separately prepared and fitted into the lower metal case (1). The earth plate (9) integrally formed with the resin (7) is exposed at the bottom of the central hole of the integrally formed product. The grounding portion of the central conductor (6) was placed in this central hole and soldered to the grounding plate (9) below.

On the grounded portion of the central conductor (6), a disk-shaped garnet (5) made of ferrite is placed in the central hole of the integrally molded product, and one terminal of the central conductor (6) is placed. Was bent so as to wrap the garnet (5) (the terminal of the central conductor (6) referred to here includes a mesh portion). Subsequently, another terminal of the center conductor (6) was bent in the same manner, a polyimide insulating film was sandwiched between the terminal and the previous terminal, and the same procedure was repeated to fold the remaining terminal.

The extending portion of one terminal of the central conductor (6) is the second portion provided on the first copper plate (11) of the integrally molded product.
After being temporarily fixed by being sandwiched between the folded-back portions which are a part of the portion (14), they were electrically connected with solder. Similarly, the other terminals were also connected to the folded portions of the other first copper plate (11).

Subsequently, the first and second copper plates (11, 12)
Paste solder was applied to the facing portion of each of the first portions (13), and the laminated capacitive element (8) was stood up and fitted, and heated in a reflow furnace to be fixed by soldering.

At this time, since the laminated capacitive element (8) is in a so-called vertical arrangement, the wraparound of the solder is limited to the lower surface of the laminated capacitive element (8), and the lower surface of the laminated capacitive element (8) is melted. Since it was in contact with the resin (7) having water repellency to the solder, the solder did not wrap around to the lower surface of the laminated capacitive element (8). A vibration test, which will be described later, was conducted and evaluated, and no short circuit accident was found.

A trimming pattern (18), which is also an earth side electrode (20), is provided on the surface of the outermost layer of the laminated capacitive element (8), and this surface is the second copper plate (1).
The laminated capacitive element (8) was arranged so that the opposite side electrode (19), which is the outermost layer surface on the opposite side, is on the first copper plate (11) side. It goes without saying that this second copper plate (12) has the same potential as the lower metal case (1).

A barium ferrite disk (3), which is a permanent magnet, is adhered to the upper metal case (1), and the magnetism is adjusted by an electromagnet, and then the lower metal case (1) is fitted and irreversible. The circuit element.

On the other hand, a method for preparing an integrally formed product of the first and second copper plates (11, 12) and the resin (7) separately prepared will be described in detail. Using a continuous press machine, one copper plate having a thickness of 0.1 mm was punched and bent so as to have a developed surface in FIG. 2, and the first to fourth portions (13 to
16) was formed to prepare first and second copper plates (11, 12). Further, in the same manner, symmetrical first and second copper plates, first and second copper plates for ports connected to the resistance element, etc. were prepared.

These first and second copper plates (11, 12)
Was integrally molded with the resin (7) using a transfer molding machine. The shape of this resin (7) is such that a hole portion for inserting the garnet (5) and the central conductor (6) is provided in the central portion, and the outer shape is a size that fits inside the lower metal case (1). A recess was provided on the lower surface so as to straddle the lower portion of the lower metal case (1) except around the periphery of (23).

Regarding the non-reciprocal circuit element having the trimming adjustment function of the present invention, the laminated capacitive element (8) is provided with the trimming pattern (18) on the surface thereof, and the second copper plate (12) is the above-mentioned. It was made small so as not to come into contact with the trimming pattern (18). The trimming work was performed by observing with a microscope while pressing a resin-bonded grindstone with a sharp tip at high speed against the portion to be removed.

For the upper and lower metal cases (1), a continuous press was used to punch and bend an iron plate having a thickness of 0.2 mm.
It was created by applying high conductivity treatment to the surface. The shape of the lower metal case (1) was formed by two parts, a narrow bottom plate and two relatively wide side plates connected to each other and facing each other. In short, the upper surface and the two surfaces facing each other are open.

The nonreciprocal circuit device assembled as described above was measured for basic performance and noise resistance using a network analyzer. When measuring noise resistance, the internal dimensions are approximately 800 mm x 600 mm x 600 m.
This was done by installing a mobile phone equipped with the nonreciprocal circuit device of the present invention and a transmitting / receiving antenna in an electromagnetic wave shielded anechoic box of m. In the vibration resistance evaluation test, after a predetermined vibration was applied using a vibration tester, a change in basic performance was confirmed.

(Confirmation of Results) The outer shape of the prepared non-reciprocal circuit element is the same as the conventional one in height, and the width is about 1 m on each side.
It was a little over m, that is, about 25% smaller. This is the effect of using the thin laminated capacitive element (8) upright and the effect of partially omitting the metal case in the trimming work area and the like.

The number of parts was greatly reduced and a great economic effect was obtained. With the first and second copper plates (11, 12) for one port, the external electrode, the lead wire to the external electrode, the central conductor extension portion and the relay wire to the lead wire, and the laminated capacitive element (8) The opposite side electrode (19) and the relay wire to the lead-out wiring on the left are not required, and the corresponding ground side has the same effect such as connection to the ground plate (9), and the first and second ports connected to other ports. This is because the same effect was obtained for the copper plate (10). Due to such a reduction in the number of parts, the number of man-hours for soldering work is reduced by 10 to 20% and the quality variation is also reduced.

With regard to trimming, the adjustment man-hour is drastically reduced to about 1/3 of the conventional one. Moreover, the average value of the insertion loss is improved by 0.23 dB as compared with the conventional one. This is because the trimming position is on the outer surface of the element, so that the adjustment is easy and the adjustment accuracy is high, the number of relay parts that are likely to cause loss has decreased, and the soldering work that is likely to cause loss is This is due to the fact that the number of garnets (5) is reduced and the garnet (5) can be arranged easily and accurately.

Even in the vibration test for 24 hours using the vibration tester, various characteristics were not deteriorated, and a great improvement was obtained.
By integrally molding the above-mentioned first and second copper plates (11, 12) and the resin (7), even if strong vibration is applied, it is unlikely that the wiring or the like is displaced, and the stability of the component placement is dramatically improved. It is because of the improvement.

When the isolator according to the present invention was mounted on a mobile telephone mobile station (terminal device) and a noise-related evaluation was performed, it was found that there was no malfunction with respect to external noise and the noise resistance was excellent. Furthermore, it was found that the amount of noise generated was small. This seems to be due to the fact that the conductors such as the laminated capacitive element and the copper plate are arranged perpendicularly to the electromagnetic wave propagation direction.

[0052]

The lumped-constant nonreciprocal circuit device for mobile communication equipment obtains the following effects by applying the present invention. The product has become smaller. The number of parts has decreased significantly.
Positional displacement due to soldering work has been reduced. It became strong against vibration. Short circuit can be prevented and reliability is improved. Easy and precise volume adjustment is now possible. A product with excellent performance and little variation was obtained.

As a result, the manufacturing process can be automated and mechanized. The significant improvement in productivity and production efficiency contributed significantly to the reduction of manufacturing costs.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a non-reciprocal circuit device according to an embodiment of the present invention.

FIG. 2 is a perspective view of a main part of a non-reciprocal circuit device according to an embodiment of the present invention.

FIG. 3 is a perspective view of a semi-fixed capacitive element according to an embodiment of the present invention.

[Explanation of symbols]

1 Metal Case, 3 Permanent Magnet, 5 Garnet (Ferrite), 6 Center Conductor, 7 Resin, 8 Laminated Capacitance Element, 11 First Copper Plate, 12 Second Copper Plate, 18 Trimming Pattern

Front page continuation (72) Inventor Akinori Misawa 70-2 Minamieicho, Tottori-shi, Tottori Hitachi Metals Co., Ltd. Tottori Plant (72) Inventor Koji Ichikawa 5200 Mikkajiri, Kumagaya, Saitama Hitachi Metals Research Co., Ltd. In-house (72) Inventor Shiro Murakami 5200 Mikkajiri, Kumagaya-shi, Saitama, Institute for Magnetic Materials, Hitachi Metals, Ltd. (56) Reference JP-A-7-263917 (JP, A) JP-A-9-148806 (JP, A) JP-A-7-273507 (JP, A) JP-A-8-46409 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01P 1/36-1/383 H01G 4/40

Claims (4)

(57) [Claims] 1. A ferrite to which a direct current magnetic field is applied, a plurality of central conductors are arranged in an electrically insulated state and crossed with each other, and a resistance element and / or a laminated capacitance is provided between one port of the central conductor and ground. connect the device, connect the laminated capacitive element between respective and ground the other ports, substantially square
In the non-reciprocal circuit element in which the ferrite is arranged in the central hole of a resin body, the laminated capacitive element has a laminated surface of an opposite side electrode and an earth side electrode, and at least one opposed side electrode of the laminated capacitive element. And the ground side electrode is parallel to the rotation axis of the ferrite,
Make a, are arranged vertically, so that the opposite electrode to face the central conductor side is an inner non-reciprocal circuit device, and faces the outside of the ground-side electrode is non-reciprocal circuit element, said laminate The capacitive element is outside the substantially rectangular resin body.
A non-reciprocal circuit device characterized by being arranged along a plane . 2. A first conductor plate for electrically connecting an opposite side electrode of the laminated capacitive element to the port, and a second conductor for electrically connecting an earth side electrode of the laminated capacitive element to the ground. 2. A nonreciprocal circuit according to claim 1, further comprising a plate, the first and second conductor plates are in an insulating state, and the laminated capacitive element is arranged between the first and second conductor plates. element. 3. The laminated capacitive element is electrically connected to the port or the ground through first and second copper plates that are insulative to each other, and the first copper plate is the laminated capacitive element of the laminated capacitive element. The second copper plate has a first portion that is surface-connected to the opposite-side electrode of the outermost layer with solder, a second portion that is connected to the port, and a third portion that is integrally formed with resin. 7. A multilayer capacitor having a first portion that is surface-connected to the earth-side electrode of the outermost layer of the multilayer capacitive element with solder, a second portion that is connected to the ground, and a third portion integrally formed with a resin. The nonreciprocal circuit device according to 1 or 2. 4. The laminated capacitive element is a semi-fixed capacitive element, and the capacitance adjusting portion is a trimming pattern of a ground side electrode on the outermost layer of the laminated capacitive element and is exposed on the outer surface of the nonreciprocal circuit element. The nonreciprocal circuit device according to any one of claims 1 to 3, wherein the nonreciprocal circuit device is provided.