JP3483624B2 - Device for removing moisture from gas - Google Patents
Device for removing moisture from gasInfo
- Publication number
- JP3483624B2 JP3483624B2 JP18770294A JP18770294A JP3483624B2 JP 3483624 B2 JP3483624 B2 JP 3483624B2 JP 18770294 A JP18770294 A JP 18770294A JP 18770294 A JP18770294 A JP 18770294A JP 3483624 B2 JP3483624 B2 JP 3483624B2
- Authority
- JP
- Japan
- Prior art keywords
- flow path
- partition wall
- gas
- process gas
- electrolyte partition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000007789 gas Substances 0.000 claims description 145
- 238000005192 partition Methods 0.000 claims description 93
- 239000003792 electrolyte Substances 0.000 claims description 91
- 238000000034 method Methods 0.000 claims description 83
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 43
- 239000000919 ceramic Substances 0.000 claims description 36
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 27
- 239000001257 hydrogen Substances 0.000 claims description 25
- 229910052739 hydrogen Inorganic materials 0.000 claims description 25
- 230000002093 peripheral effect Effects 0.000 claims description 24
- 239000007787 solid Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000007784 solid electrolyte Substances 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 10
- 238000007599 discharging Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 description 25
- 229910052760 oxygen Inorganic materials 0.000 description 25
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 20
- 238000006243 chemical reaction Methods 0.000 description 20
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- -1 oxygen ion Chemical class 0.000 description 7
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 5
- 229910001882 dioxygen Inorganic materials 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 239000012466 permeate Substances 0.000 description 3
- 229910002076 stabilized zirconia Inorganic materials 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 2
- 239000002274 desiccant Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000009193 crawling Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Drying Of Gases (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、気体中に存在する水分
を除去する装置に関し、特に固体電解質セラミックを使
用した乾式電気分解による水分除去装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for removing water present in a gas, and more particularly to a device for removing water by dry electrolysis using a solid electrolyte ceramic.
【０００２】[0002]
【従来の技術】従来において、気体から水分を除去する
場合、乾燥剤を充填したフィルターに気体を通し、水分
を乾燥剤に吸着させて除去する、いわゆる吸着装置、液
体窒素等を冷媒とするコールドトラップによる水分の吸
着装置や、ゲッター方式の装置、さらには活性金属触媒
を用いて水を還元分解させる、還元分解装置などが使用
されている。2. Description of the Related Art Conventionally, when water is removed from a gas, the gas is passed through a filter filled with a desiccant to adsorb the water to the desiccant, which is a so-called adsorbing device, and cold using liquid nitrogen as a refrigerant. A water adsorption device using a trap, a getter type device, and a reduction decomposition device that reductively decomposes water using an active metal catalyst are used.
【０００３】しかしながら、前記従来の装置において、
高い水分の除去効果を望むためには、安定した性能が得
られない。また、吸着剤やゲッター材の劣化やコールド
トラップの飽和等から、長期にわたって安定した水分除
去能力を維持することがきわめて困難である。これら従
来の装置では、液体窒素等の冷媒容器を設置する必要
や、装置全体が大型化し、或は維持管理の手数がかかる
等の課題があった。また、活性金属触媒による還元分解
装置も、水分の分解ガスとして発生する酸素の除去装置
も併用しなければならないため、同様の課題を有する。However, in the above conventional apparatus,
Stable performance cannot be obtained in order to obtain high water removal effect. In addition, it is extremely difficult to maintain a stable water removal capacity for a long period of time due to deterioration of the adsorbent or getter material, saturation of the cold trap, and the like. These conventional devices have the problems that a refrigerant container for liquid nitrogen or the like needs to be installed, the size of the entire device becomes large, and maintenance work is troublesome. Further, since a reduction decomposition apparatus using an active metal catalyst and a removal apparatus for oxygen generated as a decomposition gas of water must be used together, there is a similar problem.
【０００４】これに対して、固体電解質セラミックを利
用した水分及び酸素の除去装置が開発されている。この
装置は、固体電解質セラミックの対向する面に一対の電
極を設けた電解質隔壁を使用し、それに直流電圧を印加
しながら、負電極側の一次流路に水分を除去しようとす
るプロセスガスを流し、酸素イオン導電性を有する固体
電解質セラミックの電解作用によりその気体中の水分を
分解し、陽極側に発生する酸素を、二次流路に流すスイ
ープガスで取り出すものである。On the other hand, a device for removing moisture and oxygen using a solid electrolyte ceramic has been developed. This device uses an electrolyte partition wall in which a pair of electrodes are provided on opposite surfaces of a solid electrolyte ceramic, and while applying a DC voltage to the partition wall, a process gas for removing water is made to flow through the primary flow path on the negative electrode side. The moisture in the gas is decomposed by the electrolytic action of the solid electrolyte ceramic having oxygen ion conductivity, and oxygen generated on the anode side is taken out by the sweep gas flowing in the secondary flow path.
【０００５】[0005]
【発明が解決しようとしている課題】しかしながら、従
来の固体電解質セラミックを利用した水分及び酸素の除
去装置では、前記一次流路と二次流路に導入するプロセ
スガスとスイープガスとが、固体電解セラミックを加熱
するヒーターの熱の影響を受けないようにするために、
相当大がかりな反射板や断熱壁或は放熱手段等を必要と
する。このため、装置が全体として大型化するという欠
点があった。さらに、処理後のプロセスガス中に残留す
る水素ガスの処理も課題となっていた。本発明は、この
ような従来の課題に鑑み、小形化が可能で、水素の処理
も簡便に行える気体中の水分除去装置を提供することを
目的とする。However, in the conventional water and oxygen removing apparatus using the solid electrolyte ceramic, the process gas and the sweep gas introduced into the primary flow passage and the secondary flow passage are solid electrolytic ceramics. In order not to be affected by the heat of the heater
It requires a large-scale reflector, a heat insulating wall, or a heat radiating means. For this reason, there is a drawback that the device becomes large as a whole. Furthermore, the treatment of hydrogen gas remaining in the process gas after treatment has also been a problem. The present invention has been made in view of such conventional problems, and an object of the present invention is to provide a device for removing moisture in a gas, which can be miniaturized and can easily process hydrogen.
【０００６】[0006]
【課題を解決するための手段】すなわち、本発明による
気体中の水分除去装置は、上端が閉じられた円筒形の固
体電解質セラミック１６の内周外周に各々電極１７、１
８が形成された電解質隔壁２と、この電解質隔壁２の内
外周側に形成された一次流路３及び二次流路４と、電解
質隔壁２の周囲に設けられ、同電解質隔壁２を加熱する
ヒーター６と、前記一次流路３の下側から、同流路３に
水分を除去しようとするプロセスガスを導入するプロセ
スガス導入部１４と、前記一次流路３の下側からプロセ
スガスを排出するプロセスガス排出部１３と、前記二次
流路４の下側から、同流路４にスイープガスを導入する
スイープガス導入部１５と、前記二次流路４の下側から
スイープガスを排出するスイープガス排出部１２と、前
記電解質隔壁２の二次流路４側の電極１８が正となるよ
う、前記両電極１７、１８間に直流電圧を印加する直流
電源２０とを備えることを特徴とする。That is, in the apparatus for removing moisture in a gas according to the present invention, electrodes 17 and 1 are provided on the inner and outer circumferences of a cylindrical solid electrolyte ceramic 16 whose upper end is closed.
Electrolyte partition wall 2 in which 8 is formed, primary flow path 3 and secondary flow path 4 formed on the inner and outer peripheral sides of this electrolyte partition wall 2, and the electrolyte partition wall 2 are provided around the electrolyte partition wall 2 and heat the same. A heater 6, a process gas introduction part 14 for introducing a process gas from the lower side of the primary flow path 3 into which the moisture is to be removed, and a process gas exhausted from the lower side of the primary flow path 3. Process gas discharge part 13, a sweep gas introducing part 15 for introducing a sweep gas into the flow path 4 from the lower side of the secondary flow path 4, and a sweep gas discharge from the lower side of the secondary flow path 4. And a DC power source 20 for applying a DC voltage between the electrodes 17 and 18 so that the electrode 18 on the secondary flow path 4 side of the electrolyte partition wall 2 is positive. And
【０００７】なお、この装置において、プロセスガスが
導入される一次流路の排出部に、プロセスガス中に残留
する水素を、水素吸蔵金属からなる水素ゲッターで除去
する水素除去器２９を接続するとよい。また、電解質隔
壁２の固体電解セラミック１６の内外周の少なくとも長
手方向にわたって長尺な導体４１、４２を這わせ、この
部分に電極１７、１８が形成されるのが好ましい。さら
に、電解質隔壁２の内外周側に形成された一次流路３及
び二次流路４とが、電解質隔壁２の電極１７、１８が形
成されていない外周部分に嵌め込まれ、且つ同電解質隔
壁２の外周を保持する保持部材により挟持されたメタル
シールリング３６により気密にシールされている。In this apparatus, a hydrogen remover 29 for removing hydrogen remaining in the process gas with a hydrogen getter made of a hydrogen storage metal may be connected to the discharge portion of the primary flow path into which the process gas is introduced. . Further, it is preferable that long conductors 41 and 42 are laid along at least the longitudinal direction of the inner and outer circumferences of the solid electrolytic ceramic 16 of the electrolyte partition wall 2, and the electrodes 17 and 18 are formed in these portions. Further, the primary flow path 3 and the secondary flow path 4 formed on the inner and outer peripheral sides of the electrolyte partition wall 2 are fitted into the outer peripheral portion of the electrolyte partition wall 2 where the electrodes 17 and 18 are not formed, and the electrolyte partition wall 2 is formed. Is hermetically sealed by a metal seal ring 36 held by a holding member that holds the outer periphery of the.
【０００８】[0008]
【作用】本発明による気体中の水分除去装置では、電解
質隔壁２の両側の電極１７、１８に直流電源２０から直
流電圧を印加し、陰極である電極１７側の一次流路３に
水分を含むプロセスガスを流したとき、このプロセスガ
スが電解質隔壁２に接触すると、ガス中の水分が酸素と
水素に電気分解される。酸素イオンは陽極側に引かれて
電解質隔壁２を透過し、二次流路４側に入る、この酸素
イオンは、二次流路４側で酸素ガスとなって、そこに流
れるスイープガスにより排出される。また、水素イオン
は、水素ガスとなってプロセスガスと共に排出される。
同様にして、一次流路３側のプロセスガス中の酸素ガス
も、電解質隔壁２で電解され、それを透過して二次流路
４側に取り出される。従って、一次流路３側のプロセス
ガスからは、水分と酸素が除去される。In the apparatus for removing water in a gas according to the present invention, a DC voltage is applied from the DC power supply 20 to the electrodes 17 and 18 on both sides of the electrolyte partition wall 2, and the primary flow path 3 on the electrode 17 side, which is the cathode, contains water. When the process gas flows, when the process gas comes into contact with the electrolyte partition wall 2, the moisture in the gas is electrolyzed into oxygen and hydrogen. Oxygen ions are drawn to the anode side and permeate through the electrolyte partition wall 2 and enter the secondary flow path 4 side. The oxygen ions become oxygen gas on the secondary flow path 4 side and are discharged by the sweep gas flowing there. To be done. Further, hydrogen ions become hydrogen gas and are discharged together with the process gas.
Similarly, oxygen gas in the process gas on the side of the primary flow path 3 is also electrolyzed by the electrolyte partition wall 2, permeates it, and is taken out to the side of the secondary flow path 4. Therefore, water and oxygen are removed from the process gas on the primary flow path 3 side.
【０００９】そして、本発明による気体中の水分除去装
置では、上端が閉じられた円筒形の電解質隔壁２を用
い、この電解質隔壁２を、その周囲に設けられたヒータ
ー６で加熱し、この電解質隔壁２の内外周に形成された
一次流路３と二次流路４の下側に、各々それらにプロセ
スガスとスイープガスを導入するプロセスガス導入部１
４、プロセスガス排出部１３、スイープガス導入部１５
及びスイープガス排出部１２を設けることにより、これ
らの配管系はヒーター６の熱の影響を殆ど受けなくな
る。このため、ヒーター６の周囲の断熱構造を簡素化す
ることができ、装置を全体として小形化することが可能
となる。In the apparatus for removing moisture in a gas according to the present invention, a cylindrical electrolyte partition wall 2 having a closed upper end is used, and this electrolyte partition wall 2 is heated by a heater 6 provided around the electrolyte partition wall 2, and this electrolyte partition wall 2 is heated. A process gas introducing section 1 for introducing a process gas and a sweep gas into the primary flow path 3 and the secondary flow path 4 formed on the inner and outer circumferences of the partition wall 2, respectively.
4, process gas discharge unit 13, sweep gas introduction unit 15
Also, by providing the sweep gas discharge part 12, these piping systems are hardly affected by the heat of the heater 6. Therefore, the heat insulating structure around the heater 6 can be simplified, and the device can be downsized as a whole.
【００１０】なお、プロセスガスが導入される一次流路
の排出部に、プロセスガス中に残留する水素を、水素吸
蔵金属からなる水素ゲッターで除去する水素除去器２９
を接続すると、プロセスガスから水素を除去することが
できるので、水分と酸素に加え、水素をも除去すること
ができることになる。A hydrogen remover 29 for removing the hydrogen remaining in the process gas at the discharge part of the primary flow path into which the process gas is introduced by a hydrogen getter made of a hydrogen storage metal.
By connecting to, it is possible to remove hydrogen from the process gas, so that it is possible to remove hydrogen in addition to water and oxygen.
【００１１】前記の固体電解セラミック１６の内外周の
表面に導電ペーストを塗布し、焼き付けて電極１７、１
８を形成すると、その電極１７、１８は、その表面に微
細な細孔を有する。このため、電極１７、１８に均一に
電流が流れないために、そのシート抵抗が高くなってし
まう。これに対し、電解質隔壁２の内外周の電極１７、
１８が形成される部分に、少なくとも固体電解セラミッ
ク１６の長手方向にわたって長尺な導体４１、４２を這
わせ、この上から導電ペーストを塗布し、焼き付けて電
極１７、１８を形成すると、固体電解セラミック１６の
長手方向の電極１７、１８の抵抗を低く押さえることが
できる。A conductive paste is applied to the inner and outer surfaces of the solid electrolytic ceramic 16 and baked to form electrodes 17 and 1.
8 is formed, the electrodes 17 and 18 have fine pores on the surface. For this reason, since the current does not flow evenly through the electrodes 17 and 18, the sheet resistance increases. On the other hand, the electrodes 17 on the inner and outer circumferences of the electrolyte partition wall 2,
When long conductors 41 and 42 are made to crawl at least in the longitudinal direction of the solid electrolytic ceramic 16 at the portion where the electrode 18 is formed, and a conductive paste is applied and baked to form the electrodes 17 and 18, the solid electrolytic ceramic is formed. The resistance of the electrodes 17 and 18 in the longitudinal direction of 16 can be kept low.
【００１２】さらに、前記のような固体電解セラミック
１６は、その表面でのシールがしにくく、高い気密性が
得られにくい。これに対し、表面電解質隔壁２の内外周
側に形成された一次流路３及び二次流路４とが、電解質
隔壁２の電極１７、１８が形成されてない外周部分に嵌
め込まれ、且つ同電解質隔壁２の外周を保持する保持部
材により挟持されたメタルシールリング３６によりシー
ルされているものでは、固体電解セラミック１６に部分
的なメタライズ処理と溶接を行う必要がなく、同セラミ
ック１６に過度の負担をかけることなく、一次流路３及
び二次流路４とを高い気密性をもってシールすることが
できる。Further, in the solid electrolytic ceramic 16 as described above, it is difficult to seal the surface thereof, and it is difficult to obtain high airtightness. On the other hand, the primary flow path 3 and the secondary flow path 4 formed on the inner and outer peripheral sides of the surface electrolyte partition wall 2 are fitted into the outer peripheral portion of the electrolyte partition wall 2 where the electrodes 17 and 18 are not formed, and In the case where the solid electrolytic ceramic 16 is sealed by the metal seal ring 36 which is sandwiched by the holding members which hold the outer periphery of the electrolyte partition wall 2, it is not necessary to partially metallize and weld the solid electrolytic ceramic 16, and the ceramic 16 is excessively welded. The primary flow path 3 and the secondary flow path 4 can be sealed with high airtightness without burdening them.
【００１３】[0013]
【実施例】次に、図面を参照しながら、本発明の実施例
について、具体的且つ詳細に説明する。図１に本発明の
実施例による気体中の水分除去装置の全体概要を示す。
この図１に示されたように、フレーム１９上に、上端が
閉じられた円筒形の電解質隔壁２が立設されている。こ
の電解質隔壁２は、図２にその部分断面図が示されたよ
うに、上端が閉じられた固体電解質セラミック１６の内
外面に電極１７、１８を形成したものである。Embodiments of the present invention will now be described specifically and in detail with reference to the drawings. FIG. 1 shows an overall outline of an apparatus for removing water in gas according to an embodiment of the present invention.
As shown in FIG. 1, a cylindrical electrolyte partition wall 2 having a closed upper end is erected on a frame 19. As shown in the partial cross-sectional view of FIG. 2, the electrolyte partition wall 2 has electrodes 17 and 18 formed on the inner and outer surfaces of a solid electrolyte ceramic 16 whose upper end is closed.
【００１４】固体電解質セラミック１６としては、１１
％カルシア（ＣａＯ）安定化ジルコニア（ＺｒＯ2 、安
定度９８％）や８％イットリウム（Ｙ2Ｏ3）安定化ジル
コニア（安定度１００％）の焼結体（日本化学陶業製）
等が使用できる。この固体電解質セラミック１６の内外
周に貴金属ペースト、例えば白金ペーストを塗布し、大
気中で焼付け、電極１７、１８を形成することにより、
電解質隔壁２が作られる。この電解質隔壁２には、前記
電極１７、１８に各々貼り付けられた図示してない白金
メッシュ等の端子とその端子に接続されたリード線を介
して、電解質隔壁２の内側の電極１７が負に、外側の電
極１８が正になるよう直流電源２０が接続される。As the solid electrolyte ceramic 16, 11
% Calcia (CaO) stabilized zirconia (ZrO 2 , stability 98%) and 8% yttrium (Y 2 O 3 ) stabilized zirconia (stability 100%) sintered body (Nippon Kagaku Sangyo)
Etc. can be used. A noble metal paste, for example, a platinum paste is applied to the inner and outer circumferences of the solid electrolyte ceramic 16 and baked in the atmosphere to form the electrodes 17 and 18,
An electrolyte partition 2 is created. The electrode 17 on the inside of the electrolyte partition wall 2 is connected to the electrolyte partition wall 2 through a terminal such as a platinum mesh (not shown) attached to each of the electrodes 17 and 18 and a lead wire connected to the terminal. Further, a DC power supply 20 is connected so that the outer electrode 18 becomes positive.
【００１５】図１に示すように、前記電解質隔壁２の内
周側と外周側が各々一次流路３と二次流路４となってい
る。一次流路３には、フレーム１９の下部側に設けられ
た各々プロセスガス導入部１４とプロセスガス排出部１
３が接続されている。このうち、プロセスガス導入部１
４は、電解質隔壁２の中心線に沿って立設したプロセス
ガス導入管１に接続され、このプロセスガス導入管１の
上端は、電解質隔壁２の頂点付近、すなわち一次流路３
の最上部付近に達している。このプロセスガス導入管１
の外周には、フランジ状の邪魔板５が一定の間隔で複数
個所設けられている。これにより、ガスを一次流路３内
で乱流化させ、電極面へのガスの接触性を向上させてい
る。As shown in FIG. 1, an inner peripheral side and an outer peripheral side of the electrolyte partition wall 2 are a primary flow path 3 and a secondary flow path 4, respectively. In the primary flow path 3, the process gas introduction part 14 and the process gas discharge part 1 provided on the lower side of the frame 19 are provided.
3 is connected. Of these, the process gas introduction unit 1
4 is connected to a process gas introduction pipe 1 standing upright along the center line of the electrolyte partition wall 2, and the upper end of this process gas introduction pipe 1 is near the apex of the electrolyte partition wall 2, that is, the primary flow path 3
Has reached near the top. This process gas introduction pipe 1
A plurality of flange-shaped baffle plates 5 are provided at regular intervals on the outer circumference of. This makes the gas turbulent in the primary flow path 3 and improves the contact property of the gas to the electrode surface.
【００１６】また、二次流路４には、フレーム１９の下
部側に設けられた各々スイープガス導入部１５とスイー
プガス排出部１２が接続されている。このうち、スイー
プガス導入部１５は、フレーム１９上に立設したスイー
プガス導入管８に接続され、このスイープガス導入管８
の上端は、二次流路４の最上部付近に達している。な
お、図示の実施例では、円筒形の電解質隔壁２の内周側
に一次流路３が、外周側に二次流路４が各々形成されて
いるが、一次流路３と二次流路４とを逆にし、電解質隔
壁２の外周側に一次流路３を、内周側に二次流路４を各
々形成してもよい。Further, to the secondary flow path 4, a sweep gas introducing portion 15 and a sweep gas discharging portion 12 provided on the lower side of the frame 19 are connected. Of these, the sweep gas introducing portion 15 is connected to a sweep gas introducing pipe 8 erected on the frame 19, and the sweep gas introducing pipe 8 is provided.
Has reached the uppermost vicinity of the secondary flow path 4. In the illustrated embodiment, the primary flow path 3 and the secondary flow path 4 are formed on the inner peripheral side and the outer peripheral side of the cylindrical electrolyte partition wall 2, respectively. 4 may be reversed and the primary flow path 3 may be formed on the outer peripheral side of the electrolyte partition wall 2 and the secondary flow path 4 may be formed on the inner peripheral side.
【００１７】前記電解質隔壁２の外周側にヒーター６が
設けられ、これにより電解質隔壁２が外周側から加熱さ
れる。さらに、このヒーター６の外側は、断熱材７、１
１で囲まれると共に、フレーム１９上に立てた金属壁
９、１０により形成される真空容器により囲まれ、外部
に対して熱遮断されている。A heater 6 is provided on the outer peripheral side of the electrolyte partition 2, so that the electrolyte partition 2 is heated from the outer peripheral side. Further, the outside of the heater 6 is provided with heat insulating materials 7, 1
It is surrounded by 1 and is surrounded by a vacuum container formed by metal walls 9 and 10 standing on the frame 19, and is thermally shielded from the outside.
【００１８】この気体中の水分除去装置では、プロセス
ガス導入部１４とプロセスガス排出部１３に、水分や酸
素を除去しようとするプロセスガスの流路を接続するこ
とで、プロセスガスの流路の途中を一次流路３に接続す
る。また、スイープガス導入部１５とスイープガス排出
部１２に、二次流路４側に発生した酸素を取り出すため
のスイープガスの流路を接続する。In this apparatus for removing moisture in gas, the process gas introducing section 14 and the process gas discharging section 13 are connected to the process gas passages for removing water and oxygen, so that the process gas passages The middle is connected to the primary flow path 3. Further, a sweep gas flow path for taking out oxygen generated on the secondary flow path 4 side is connected to the sweep gas introduction section 15 and the sweep gas discharge section 12.
【００１９】このように接続した状態で、ヒーター６で
電解質隔壁２を加熱しながら、図２に示すように、電極
１７、１８に直流電圧を印加する。このとき、陰極であ
る電極１７側の一次流路３にある水分を含むプロセスガ
スが電解質隔壁２に接触すると、同ガス中の水分が酸素
と水素に電気分解される。酸素は電極１７の表面でイオ
ン化し、固体電解質セラミック１６の内部をイオン状態
で陽極である電極１８側に引かれて電解質隔壁２を透過
し、二次流路４側に入る。この酸素イオンは、二次流路
４側で酸素ガスとなって、そこに流れるスイープガスに
より排出される。また、水素イオンは、水素ガスとなっ
てプロセスガスと共に排出される。同様にして、一次流
路３側のプロセスガス中の酸素ガスも、電極１７の表面
でイオン化し、固体電解質セラミック１６の内部をイオ
ン状態で陽極である電極１８側に引かれて電解質隔壁２
を透過し、二次流路４側に取り出される。従って、一次
流路３側のプロセスガスからは、水分と酸素が除去され
る。With the connection made in this manner, a DC voltage is applied to the electrodes 17 and 18 as shown in FIG. 2 while heating the electrolyte partition wall 2 with the heater 6. At this time, when the process gas containing water in the primary flow path 3 on the electrode 17 side which is the cathode contacts the electrolyte partition wall 2, the water in the gas is electrolyzed into oxygen and hydrogen. Oxygen is ionized on the surface of the electrode 17, the inside of the solid electrolyte ceramic 16 is drawn in an ionic state to the side of the electrode 18 which is an anode, permeates the electrolyte partition wall 2 and enters the side of the secondary flow path 4. This oxygen ion becomes oxygen gas on the secondary flow path 4 side and is discharged by the sweep gas flowing there. Further, hydrogen ions become hydrogen gas and are discharged together with the process gas. Similarly, oxygen gas in the process gas on the primary flow path 3 side is also ionized on the surface of the electrode 17, and the inside of the solid electrolyte ceramic 16 is drawn in an ionic state toward the electrode 18 side, which is an anode, so that the electrolyte partition 2
And is taken out to the secondary flow path 4 side. Therefore, water and oxygen are removed from the process gas on the primary flow path 3 side.
【００２０】図３は、本発明による装置の性能試験を行
うための一次流路側の配管例である。キャリアガスタン
ク２２と酸素ガスタンク２３から酸素を含むガスを、水
分除去装置２１のプロセスガス導入部１４に送る。その
間に、水分発生器２４を挿入し、プロセスガス中に水分
を与える。また、水分濃度計２５及び酸素濃度計２６を
挿入し、一次流路３に導入されるプロセスガス中の水分
濃度と酸素濃度を各々測定する。FIG. 3 shows an example of piping on the primary flow path side for performing a performance test of the apparatus according to the present invention. A gas containing oxygen is sent from the carrier gas tank 22 and the oxygen gas tank 23 to the process gas introduction unit 14 of the water removing device 21. In the meantime, the moisture generator 24 is inserted to supply moisture to the process gas. Further, a moisture concentration meter 25 and an oxygen concentration meter 26 are inserted to measure the moisture concentration and the oxygen concentration in the process gas introduced into the primary flow path 3, respectively.
【００２１】他方、プロセスガス排出部１３に、水素ゲ
ッターを備える水素除去器２９が接続されている。水素
ゲッターは例えば、チタン、ジルコニウム或はこれらの
合金等の水素吸蔵金属からなり、その表面にプロセスガ
スを接触させ、それに含まれる水素ガスをプロセスガス
から除去する。さらに、この水素除去器２９に水分濃度
計２７及び酸素濃度計２８を接続し、一次流路３から排
出されるプロセスガス中の水分濃度と酸素濃度を各々測
定する。On the other hand, the process gas discharge section 13 is connected to a hydrogen remover 29 having a hydrogen getter. The hydrogen getter is made of, for example, a hydrogen storage metal such as titanium, zirconium, or an alloy thereof, and a process gas is brought into contact with the surface of the hydrogen storage metal to remove the hydrogen gas contained therein from the process gas. Further, a moisture concentration meter 27 and an oxygen concentration meter 28 are connected to the hydrogen remover 29 to measure the moisture concentration and the oxygen concentration in the process gas discharged from the primary flow path 3, respectively.
【００２２】図１２は、前記電解質隔壁２に形成された
電極１７、１８の例を示す。すなわち、上端を閉じた円
筒形の固体電解セラミック１６の内外周面に各々白金等
の貴金属ペーストを塗布し、焼き付けて、電極１７、１
８を形成する。この場合に、内周側の電極１７は、電源
との接続のため、その一部１７ａを固体電解セラミック
１６の縁を介して外周側に導出する。しかしながら、固
体電解セラミック１６の内外周の表面に導電ペーストを
塗布し、焼き付けて電極１７、１８を形成すると、その
電極１７、１８は、その表面に微細な細孔を有する。こ
のため、電極１７、１８に均一に電流が流れないため
に、電極１７、１８のシート抵抗は比較的高い。FIG. 12 shows an example of the electrodes 17 and 18 formed on the electrolyte partition wall 2. That is, the noble metal paste such as platinum is applied to the inner and outer peripheral surfaces of the cylindrical solid electrolytic ceramic 16 with the upper end closed and baked to form the electrodes 17, 1.
8 is formed. In this case, the electrode 17 on the inner peripheral side is led out to the outer peripheral side via the edge of the solid electrolytic ceramic 16 for the part 17a for connection with the power source. However, when the conductive paste is applied to the inner and outer surfaces of the solid electrolytic ceramic 16 and baked to form the electrodes 17 and 18, the electrodes 17 and 18 have fine pores on the surface. Therefore, the sheet resistance of the electrodes 17 and 18 is relatively high because the current does not flow evenly to the electrodes 17 and 18.
【００２３】そこで、図１２では、電解質隔壁２の内外
周の電極１７、１８が形成される部分に白金等の貴金属
からなる長尺な導体４１、４２を這わせる。この長尺な
導体４１、４２は、固体電解セラミック１６の長手方向
にわたって這わせるのがよく、図１２（ａ）では、長尺
な箔状の導体４１、４２を固体電解セラミック１６の内
外周面の長手方向にわたって這わせている。また、同図
（ｂ）では、長尺な線状の導体４１、４２を固体電解セ
ラミック１６の内外周面に螺旋状に這わせている。これ
らの導体４１、４２により、固体電解セラミック１６の
長手方向の電極１７、１８の抵抗を低く押さえることが
できる。Therefore, in FIG. 12, long conductors 41 and 42 made of a noble metal such as platinum are laid on the inner and outer circumferences of the electrolyte partition wall 2 where the electrodes 17 and 18 are formed. The elongated conductors 41, 42 are preferably made to crawl in the longitudinal direction of the solid electrolytic ceramic 16, and in FIG. 12A, the elongated foil-shaped conductors 41, 42 are formed on the inner and outer peripheral surfaces of the solid electrolytic ceramic 16. Crawling in the longitudinal direction. Further, in FIG. 2B, long linear conductors 41 and 42 are spirally laid on the inner and outer peripheral surfaces of the solid electrolytic ceramic 16. With these conductors 41 and 42, the resistance of the electrodes 17 and 18 in the longitudinal direction of the solid electrolytic ceramic 16 can be kept low.
【００２４】図１３及び図１４は、前記のような電解質
隔壁２の内外周側の一次流路３と二次流路４とのシール
構造とフレームへの取付構造を示している。上端側が細
くなった円筒状の取付金具３３がフレーム３７から立設
され、この取付金具３３の上端部に電解質隔壁２の電極
１７、１８の無い下端部分が嵌め込まれている。この取
付金具３３の上端部外周にネジが切られ、これに袋ナッ
ト状の固定金具３４がネジ込まれている。さらに、取付
金具３３と電解質隔壁２の外周面との間に、鉛等からな
るリング状のメタルシールリング３６が嵌め込まれ、こ
のメタルシールリング３６が前記固定金具３４により締
め付けられるスリーブ３５と取付金具３３との間で圧縮
され、その変形により電解質隔壁２の外周面に押し当て
られている。FIGS. 13 and 14 show a sealing structure for the primary flow path 3 and the secondary flow path 4 on the inner and outer peripheral sides of the electrolyte partition wall 2 as described above, and a mounting structure for the frame. A cylindrical mounting member 33 having a thin upper end side is provided upright from the frame 37, and the lower end portion of the electrolyte partition wall 2 without the electrodes 17 and 18 is fitted to the upper end portion of the mounting member 33. A screw is cut on the outer periphery of the upper end of the mounting member 33, and a cap nut-shaped fixing member 34 is screwed into the screw. Further, a ring-shaped metal seal ring 36 made of lead or the like is fitted between the fitting 33 and the outer peripheral surface of the electrolyte partition wall 2, and the metal seal ring 36 is fastened by the fixing fitting 34. It is compressed between 33 and 33 and is pressed against the outer peripheral surface of the electrolyte partition wall 2 by its deformation.
【００２５】取付金具３３の外側に円筒形の支持金具３
１が立設され、この支持金具３１の上端に電解質隔壁２
を囲むようにスリーブ３２が立設さている。このスリー
ブ３２は、電解質隔壁２の前記シール部分より上側の部
分から適当な距離をおいて同電解質隔壁２を囲んでい
る。前記のような固体電解セラミック１６は比較的脆弱
であり、しかもその表面が粗いため、気密シールがしに
くく、高い気密性が得られにくい。これに対し、図１３
及び図１４に示すように、電解質隔壁２の内外周側の一
次流路３及び二次流路４とをメタルシールリング３６に
よりシールしたものでは、電解質隔壁に過度の負担をか
けることなく、しかも耐熱性を維持した状態で、一次流
路３及び二次流路４とを高い気密性をもってシールする
ことができる。A cylindrical support fitting 3 is provided outside the mounting fitting 33.
1 is erected, and the electrolyte partition 2 is provided on the upper end of the support fitting 31.
A sleeve 32 is erected so as to surround the. The sleeve 32 surrounds the electrolyte partition wall 2 at an appropriate distance from the portion of the electrolyte partition wall 2 above the sealing portion. Since the solid electrolytic ceramic 16 as described above is relatively fragile and its surface is rough, it is difficult to hermetically seal and it is difficult to obtain high hermeticity. On the other hand, FIG.
And as shown in FIG. 14, in the case where the inner and outer peripheral side primary flow paths 3 and secondary flow paths 4 of the electrolyte partition wall 2 are sealed by a metal seal ring 36, an excessive burden is not applied to the electrolyte partition wall, and The primary flow path 3 and the secondary flow path 4 can be sealed with high airtightness while maintaining heat resistance.
【００２６】図４は、固体電解質セラミック１６として
８％イットリウム（Ｙ2Ｏ3）安定化ジルコニア（安定度
１００％）の焼結体（日本化学陶業製）を使用し、その
内外周に白金電極１７、１８を形成した電解質隔壁２を
使用し、電解質隔壁２の温度（セル温度）を４００、４
５０、５００及び６００℃と変えて、水分の変換率を測
定した結果である。水分の変換率は、水分濃度計２５と
水分濃度計２７とで測定した水分濃度を、各々一次流路
３の「入口濃度」及び「出口濃度」とし、（入口濃度−
出口濃度）／入口濃度の式で求めたものである。FIG. 4 shows that a solid electrolyte ceramic 16 is a sintered body of 8% yttrium (Y 2 O 3 ) stabilized zirconia (stability 100%) (manufactured by Nippon Kagaku Sangyo Co., Ltd.), and platinum electrodes are formed on the inner and outer circumferences thereof. By using the electrolyte partition wall 2 in which 17 and 18 are formed, the temperature (cell temperature) of the electrolyte partition wall 2 is set to 400, 4.
It is the result of measuring the conversion rate of water by changing to 50, 500 and 600 ° C. For the conversion rate of water, the water concentrations measured by the water concentration meter 25 and the water concentration meter 27 are defined as “inlet concentration” and “outlet concentration” of the primary flow path 3, respectively ((inlet concentration-
It is calculated by the formula of (outlet concentration) / inlet concentration.
【００２７】この図４から分かる通り、電解質隔壁２の
温度が高い程電極１７、１８に印加する電圧（セル電
圧）が低くても１００％の変換率が得られ、セル温度が
６００℃では、約１．０Ｖで１００％の変換率が得られ
る。他方、電解質隔壁２の温度が４００度と低いと、
２．０Ｖのセル電圧でも１００％の変換率が得られな
い。セル電圧が高いと、固体電解セラミックが還元さ
れ、その寿命が短くなるので、セル電圧は低いのがよ
い。また固体電解セラミックに過度の熱負荷をかけるこ
と避ける必要もある。このことから、セル温度は５００
℃〜６００℃として、且つセル電圧を１．２Ｖ〜１．８
Ｖとするのが望ましい。なお、酸素も水分と全く同じで
ある。As can be seen from FIG. 4, the higher the temperature of the electrolyte partition wall 2 is, the lower the voltage (cell voltage) applied to the electrodes 17 and 18 is, the higher the conversion rate of 100% is obtained. A conversion rate of 100% is obtained at about 1.0V. On the other hand, if the temperature of the electrolyte partition wall 2 is as low as 400 degrees,
A conversion rate of 100% cannot be obtained even with a cell voltage of 2.0V. A high cell voltage reduces the solid electrolytic ceramic and shortens its life. Therefore, a low cell voltage is preferable. It is also necessary to avoid applying an excessive heat load to the solid electrolytic ceramic. From this, the cell temperature is 500
C.-600.degree. C., and cell voltage 1.2V-1.8.
It is desirable to set to V. Note that oxygen is exactly the same as water.
【００２８】図５は、前記水分除去装置において、電解
質隔壁２の温度を５００℃、一次流路３におけるプロセ
スガスの流量を６Ｎｌ／ｈとし、プロセスガス導入部１
４側の導入プロセスガスの水分濃度を５６ｐｐｍとした
ときの、電解質隔壁２に印加した電圧と変換率との関係
及び電解電流との関係を示している。さらに、図６〜図
８は、同じ条件で水分濃度を１００ｐｐｍ、１０７９ｐ
ｐｍ及び３００２ｐｐｍと各々変えたときの、電解質隔
壁２に印加した電圧と変換率との関係及び電解電流との
関係を示している。In FIG. 5, in the water removing apparatus, the temperature of the electrolyte partition wall 2 is 500 ° C., the flow rate of the process gas in the primary flow path 3 is 6 Nl / h, and the process gas introducing section 1 is used.
4 shows the relationship between the voltage applied to the electrolyte partition wall 2 and the conversion rate, and the relationship between the electrolytic current and the water concentration of the introduced process gas on the side 4 at 56 ppm. Further, FIGS. 6 to 8 show that the water concentration is 100 ppm, 1079 p under the same conditions.
The relationship between the voltage applied to the electrolyte partition wall 2 and the conversion rate, and the relationship with the electrolytic current when pm and 3002 ppm are changed are shown.
【００２９】このように、水分濃度が高くなると、変換
効率が低下すると共に、電解電流が増えるが、試験され
た装置の場合、プロセスガスの流量を６Ｎｌ／ｈ程度の
条件では、水分濃度１０００ｐｐｍ或は３０００ｐｐｍ
程度まで、充分高い変換率が得られることが分かる。As described above, when the water concentration increases, the conversion efficiency decreases and the electrolysis current increases, but in the case of the tested device, the water concentration is 1000 ppm or more under the condition that the process gas flow rate is about 6 Nl / h. Is 3000 ppm
It can be seen that up to a degree, a sufficiently high conversion rate can be obtained.
【００３０】図９は、前記水分除去装置において、電解
質隔壁２の温度を５００℃、プロセスガス導入部１４側
の導入プロセスガスの水分濃度を約５５ｐｐｍとし、一
次流路３におけるプロセスガスの流量を３Ｎｌ／ｈとし
たときの、電解質隔壁２に印加した電圧と変換率との関
係及び電解電流との関係を示している。さらに、図１
０、図１１は、同じ条件で、一次流路３におけるプロセ
スガスの流量を６Ｎｌ／ｈ及び１２Ｎｌ／ｈと各々変え
たときの、電解質隔壁２に印加した電圧と変換率との関
係及び電解電流との関係を示している。FIG. 9 shows that in the water removing apparatus, the temperature of the electrolyte partition wall 2 is 500 ° C., the water concentration of the introduced process gas on the side of the process gas introducing section 14 is about 55 ppm, and the flow rate of the process gas in the primary flow path 3 is changed. It shows the relationship between the voltage applied to the electrolyte partition 2 and the conversion rate and the relationship with the electrolytic current when 3 Nl / h. Furthermore, FIG.
0 and FIG. 11 show the relationship between the voltage applied to the electrolyte partition wall 2 and the conversion rate and the electrolysis current when the flow rate of the process gas in the primary flow path 3 was changed to 6 Nl / h and 12 Nl / h under the same conditions. Shows the relationship with.
【００３１】前記装置では、導入プロセスガスの水分濃
度が約５５ｐｐｍ程度の場合、一次流路３におけるプロ
セスガスの流量が３Ｎｌ／ｈ〜１２Ｎｌ／ｈまで変化し
ても、充分高い変換率が安定して得られることが分か
る。なお、以上の図４〜図１１の結果は、酸素も全く同
様である。In the above apparatus, when the water concentration of the introduced process gas is about 55 ppm, a sufficiently high conversion rate is stable even if the flow rate of the process gas in the primary flow path 3 changes from 3 Nl / h to 12 Nl / h. You can see that you can get it. Note that the results of FIGS. 4 to 11 described above are exactly the same for oxygen.
【００３２】[0032]
【発明の効果】以上説明した通り、本発明による気体中
の水分除去装置は、酸素イオン導電性を有する固体電解
質セラミックを使用した乾式電気分解により気体中の水
分を除去するため、高い水分除去機能が長期的且つ連続
的に得られ、しかも維持が簡便で、酸素の除去も同時に
行える。As described above, the apparatus for removing moisture in a gas according to the present invention removes moisture in a gas by dry electrolysis using a solid electrolyte ceramic having oxygen ion conductivity, and thus has a high moisture removal function. Can be obtained continuously over a long period of time, is easy to maintain, and can simultaneously remove oxygen.
【００３３】さらに、上端が閉じられた円筒形の電解質
隔壁２を用い、この電解質隔壁２を、その周囲に設けら
れたヒーター６で加熱し、この電解質隔壁２の内外周に
形成された一次流路３と二次流路４の下側に、各々それ
らにプロセスガスとスイープガスを導入するプロセスガ
ス導入部１４、プロセスガス排出部１３、スイープガス
導入部１５及びスイープガス排出部１２を設けることに
より、ヒーター６の周囲の断熱構造を簡素化することが
でき、装置を全体として小形化することが可能となる。Further, a cylindrical electrolyte partition wall 2 having a closed upper end is used, and the electrolyte partition wall 2 is heated by a heater 6 provided around the electrolyte partition wall 2, and the primary flow formed on the inner and outer circumferences of the electrolyte partition wall 2. Provided below the passage 3 and the secondary passage 4 are a process gas introduction unit 14, a process gas discharge unit 13, a sweep gas introduction unit 15, and a sweep gas discharge unit 12, which introduce a process gas and a sweep gas into them, respectively. As a result, the heat insulating structure around the heater 6 can be simplified and the device can be downsized as a whole.
【図１】本発明の実施例による気体中の水分除去装置の
全体を示す略示縦断側面図である。FIG. 1 is a schematic vertical cross-sectional side view showing an entire apparatus for removing moisture in a gas according to an embodiment of the present invention.
【図２】同実施例による気体中の水分除去装置の電解質
隔壁の一部を示す要部拡大断面図である。FIG. 2 is an enlarged cross-sectional view of an essential part showing a part of an electrolyte partition wall of the apparatus for removing water in gas according to the embodiment.
【図３】前記実施例による気体中の水分除去装置の試験
を行うための配管例を示す配管図である。FIG. 3 is a piping diagram showing an example of piping for carrying out a test of the apparatus for removing water in gas according to the embodiment.
【図４】前記実施例による気体中の水分除去装置につい
て、電解質隔壁の温度を４００、４５０、５００及び６
００℃と変えて、水分の変換率を測定した結果のグラフ
である。FIG. 4 is a schematic diagram of a device for removing moisture in a gas according to the embodiment, in which the temperature of the electrolyte partition is 400, 450, 500 and 6;
It is a graph of the result of having changed the conversion rate of water and changing it to 00 degreeC.
【図５】前記実施例による気体中の水分除去装置につい
て、電解質隔壁の温度を５００℃、一次流路におけるプ
ロセスガスの流量を６Ｎｌ／ｈとし、プロセスガス導入
部側の導入プロセスガスの水分濃度を５６ｐｐｍとした
ときの、電解質隔壁に印加した電圧と変換率との関係及
び電解電流との関係を示すグラフである。FIG. 5 is a diagram showing an apparatus for removing moisture in a gas according to the above embodiment, the temperature of the electrolyte partition wall is 500 ° C., the flow rate of the process gas in the primary flow path is 6 Nl / h, and the moisture concentration of the introduced process gas on the process gas introduction unit side is 5 is a graph showing the relationship between the voltage applied to the electrolyte partition wall and the conversion rate, and the relationship with the electrolytic current when is set to 56 ppm.
【図６】前記実施例による気体中の水分除去装置につい
て、電解質隔壁の温度を５００℃、一次流路におけるプ
ロセスガスの流量を６Ｎｌ／ｈとし、プロセスガス導入
部側の導入プロセスガスの水分濃度を１００ｐｐｍとし
たときの、電解質隔壁に印加した電圧と変換率との関係
及び電解電流との関係を示すグラフである。FIG. 6 is a diagram showing an apparatus for removing moisture in a gas according to the above embodiment, the temperature of the electrolyte partition wall is 500 ° C., the flow rate of the process gas in the primary flow path is 6 Nl / h, and the moisture concentration of the introduced process gas on the process gas introduction unit side is 3 is a graph showing the relationship between the voltage applied to the electrolyte partition wall and the conversion rate, and the relationship between the electrolytic current and the value when 100 is 100 ppm.
【図７】前記実施例による気体中の水分除去装置につい
て、電解質隔壁の温度を５００℃、一次流路におけるプ
ロセスガスの流量を６Ｎｌ／ｈとし、プロセスガス導入
部側の導入プロセスガスの水分濃度を１０７９ｐｐｍと
したときの、電解質隔壁に印加した電圧と変換率との関
係及び電解電流との関係を示すグラフである。FIG. 7 is a diagram showing an apparatus for removing moisture in a gas according to the above embodiment, the temperature of the electrolyte partition wall is 500 ° C., the flow rate of the process gas in the primary flow path is 6 Nl / h, and the moisture concentration of the introduced process gas on the process gas introduction part side is 2 is a graph showing the relationship between the voltage applied to the electrolyte partition wall and the conversion rate, and the relationship with the electrolytic current, when is set to 1079 ppm.
【図８】前記実施例による気体中の水分除去装置につい
て、電解質隔壁の温度を５００℃、一次流路におけるプ
ロセスガスの流量を６Ｎｌ／ｈとし、プロセスガス導入
部側の導入プロセスガスの水分濃度を３００２ｐｐｍと
したときの、電解質隔壁に印加した電圧と変換率との関
係及び電解電流との関係を示すグラフである。FIG. 8 is a diagram showing the apparatus for removing moisture in a gas according to the above-mentioned embodiment, the temperature of the electrolyte partition wall is 500 ° C., the flow rate of the process gas in the primary flow path is 6 Nl / h, and the moisture concentration of the introduced process gas on the process gas introduction part side is 2 is a graph showing the relationship between the voltage applied to the electrolyte partition wall and the conversion rate, and the relationship with the electrolytic current, when is set to 3002 ppm.
【図９】前記実施例による気体中の水分除去装置につい
て、電解質隔壁の温度を５００℃、プロセスガス導入部
側の導入プロセスガスの水分濃度を約５５ｐｐｍとし、
一次流路におけるプロセスガスの流量を３Ｎｌ／ｈとし
たときの、電解質隔壁２に印加した電圧と変換率との関
係及び電解電流との関係を示すグラフである。FIG. 9 is a diagram showing the apparatus for removing moisture in gas according to the above-mentioned embodiment, in which the temperature of the electrolyte partition wall is 500 ° C. and the moisture concentration of the introduced process gas on the process gas introduction part side is about 55 ppm;
6 is a graph showing the relationship between the voltage applied to the electrolyte partition wall 2 and the conversion rate, and the relationship between the electrolytic current and the flow rate of the process gas in the primary flow path of 3 Nl / h.
【図１０】前記実施例による気体中の水分除去装置につ
いて、電解質隔壁の温度を５００℃、プロセスガス導入
部側の導入プロセスガスの水分濃度を約５５ｐｐｍと
し、一次流路におけるプロセスガスの流量を６Ｎｌ／ｈ
としたときの、電解質隔壁２に印加した電圧と変換率と
の関係及び電解電流との関係を示すグラフである。FIG. 10 shows a device for removing moisture in a gas according to the above embodiment, the temperature of the electrolyte partition wall is 500 ° C., the moisture concentration of the introduced process gas on the process gas introduction part side is about 55 ppm, and the flow rate of the process gas in the primary flow path is 6 Nl / h
3 is a graph showing the relationship between the voltage applied to the electrolyte partition wall 2 and the conversion rate, and the relationship with the electrolytic current.
【図１１】前記実施例による気体中の水分除去装置につ
いて、電解質隔壁の温度を５００℃、プロセスガス導入
部側の導入プロセスガスの水分濃度を約５５ｐｐｍと
し、一次流路におけるプロセスガスの流量を１２Ｎｌ／
ｈとしたときの、電解質隔壁２に印加した電圧と変換率
との関係及び電解電流との関係を示すグラフである。FIG. 11 is a diagram showing the apparatus for removing moisture in a gas according to the above-mentioned embodiment, wherein the temperature of the electrolyte partition wall is 500 ° C., the moisture concentration of the introduced process gas on the process gas introduction part side is about 55 ppm, and the flow rate of the process gas in the primary flow path is 12 Nl /
6 is a graph showing the relationship between the voltage applied to the electrolyte partition wall 2 and the conversion rate, and the relationship with the electrolytic current when h is set.
【図１２】本発明の実施例による気体中の水分除去装置
に使用される電解質隔壁を示す半縦断側面図である。FIG. 12 is a semi-longitudinal side view showing an electrolyte partition used in a device for removing water in gas according to an embodiment of the present invention.
【図１３】本発明の実施例による気体中の水分除去装置
における電解質隔壁のシール及び取付部分を示す要部縦
断側面図である。FIG. 13 is a vertical cross-sectional side view of essential parts showing a seal and a mounting portion of an electrolyte partition wall in a device for removing moisture in a gas according to an embodiment of the present invention.
【図１４】図３の要部拡大図である。FIG. 14 is an enlarged view of a main part of FIG.
２ 電解質隔壁 ３ 一次流路 ４ 二次流路 ６ ヒーター １２ スイープガス排出部 １３ プロセスガス排出部 １４ プロセスガス導入部 １５ スイープガス導入部 １６ 固体電解質セラミック １７ 電極 １８ 電極 ２０ 直流電源 ３６ メタルシールリング ４１ 導体 ４２ 導体 2 electrolyte partition 3 primary flow path 4 Secondary flow path 6 heater 12 Sweep gas discharge part 13 Process gas outlet 14 Process gas inlet 15 Sweep gas introduction section 16 Solid electrolyte ceramic 17 electrodes 18 electrodes 20 DC power supply 36 metal seal ring 41 conductor 42 conductor
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭49−111807（ＪＰ，Ａ) 特開 昭61−78421（ＪＰ，Ａ) 特開 平２−131117（ＪＰ，Ａ) 特開 昭63−279162（ＪＰ，Ａ) 実開 平２−95533（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) B01D 53/26,53/32 B01D 53/34 - 53/90 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-49-111807 (JP, A) JP-A-61-78421 (JP, A) JP-A-2-131117 (JP, A) JP-A 63- 279162 (JP, A) Actual development 2-95533 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) B01D 53/26, 53/32 B01D 53/34-53/90
Claims (4)
上端が閉じられた円筒形の固体電解質セラミック（１
６）の内周外周に各々電極（１７）、（１８）が形成さ
れた電解質隔壁（２）と、この電解質隔壁（２）の内外
周側に形成された一次流路（３）及び二次流路（４）
と、電解質隔壁（２）の周囲に設けられ、同電解質隔壁
（２）を加熱するヒーター（６）と、前記一次流路
（３）の下側から、同流路（３）に水分を除去しようと
するプロセスガスを導入するプロセスガス導入部（１
４）と、前記一次流路（３）の下側からプロセスガスを
排出するプロセスガス排出部（１３）と、前記二次流路
（４）の下側から、同流路（４）にスイープガスを導入
するスイープガス導入部（１５）と、前記二次流路
（４）の下側からスイープガスを排出するスイープガス
排出部（１２）と、前記電解質隔壁（２）の二次流路
（４）側の電極（１８）が正となるよう、前記両電極
（１７）、（１８）間に直流電圧を印加する直流電源
（２０）とを備えることを特徴とする気体中の水分除去
装置。1. An apparatus for removing water in a gas,
Cylindrical solid electrolyte ceramic (1
Electrolyte partition wall (2) having electrodes (17) and (18) formed on the inner and outer circumferences of 6), and a primary flow path (3) and a secondary flow path formed on the inner and outer circumference sides of this electrolyte partition wall (2). Channel (4)
And a heater (6) provided around the electrolyte partition wall (2) for heating the electrolyte partition wall (2), and moisture is removed from the lower side of the primary flow path (3) into the flow path (3). Process gas introduction part (1
4), a process gas discharge part (13) for discharging a process gas from the lower side of the primary flow path (3), and a sweep to the same flow path (4) from the lower side of the secondary flow path (4). Sweep gas introduction part (15) for introducing gas, sweep gas discharge part (12) for discharging sweep gas from the lower side of the secondary flow path (4), and secondary flow path of the electrolyte partition wall (2) Removal of water in a gas, comprising a DC power supply (20) for applying a DC voltage between the electrodes (17) and (18) so that the electrode (18) on the (4) side becomes positive. apparatus.
ック（１６）の内外周の少なくとも長手方向にわたって
長尺な導体（４１）、（４２）が這わせてあり、この部
分に電極（１７）、（１８）が形成さていることを特徴
とする前記請求項１に記載の気体中の水分除去装置。2. The solid electrolytic ceramic (16) of the electrolyte partition wall (2) has elongated conductors (41), (42) extending along at least the longitudinal direction of the inner and outer circumferences of the solid electrolytic ceramic (16), and an electrode (17) is laid on this portion. , (18) are formed, The apparatus for removing water in gas according to claim 1, wherein
た一次流路（３）及び二次流路（４）とが、電解質隔壁
（２）の電極（１７）、（１８）が形成されていない外
周部分に嵌め込まれ、且つ同電解質隔壁（２）の外周を
保持する取付部材により挟持されたメタルシールリング
（３６）により気密にシールされていることを特徴とす
る前記請求項１に記載の気体中の水分除去装置。3. The primary flow path (3) and the secondary flow path (4) formed on the inner and outer peripheral sides of the electrolyte partition wall (2) are the electrodes (17) and (18) of the electrolyte partition wall (2). The metal seal ring (36) fitted in an outer peripheral portion that is not formed and sandwiched by a mounting member that holds the outer periphery of the electrolyte partition wall (2) is hermetically sealed. A device for removing water in a gas according to item 1.
の排出部に、プロセスガス中に残留する水素を、水素吸
蔵金属からなる水素ゲッターで除去する水素除去器（２
９）を接続した請求項１に記載の気体中の水分除去装
置。4. A hydrogen remover (2) for removing hydrogen remaining in the process gas at a discharge part of a primary flow path into which the process gas is introduced by a hydrogen getter made of a hydrogen storage metal.
9. The apparatus for removing moisture in a gas according to claim 1, wherein 9) is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18770294A JP3483624B2 (en) | 1994-07-18 | 1994-07-18 | Device for removing moisture from gas |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18770294A JP3483624B2 (en) | 1994-07-18 | 1994-07-18 | Device for removing moisture from gas |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0824555A JPH0824555A (en) | 1996-01-30 |
| JP3483624B2 true JP3483624B2 (en) | 2004-01-06 |
Family
ID=16210670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18770294A Expired - Fee Related JP3483624B2 (en) | 1994-07-18 | 1994-07-18 | Device for removing moisture from gas |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3483624B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5545227B2 (en) * | 2011-01-11 | 2014-07-09 | 住友電気工業株式会社 | Gas decomposition apparatus and power generation apparatus |
| CN102603030B (en) * | 2012-04-10 | 2013-07-03 | 中国水产科学研究院黑龙江水产研究所 | Ultraviolet disinfection device with brushing cleaner for industrial aquaculture of cold water fish in saline and alkaline water area |
| JP5946027B2 (en) * | 2014-03-20 | 2016-07-05 | 住友電気工業株式会社 | Gas decomposition apparatus and power generation apparatus |
-
1994
- 1994-07-18 JP JP18770294A patent/JP3483624B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0824555A (en) | 1996-01-30 |
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