JP3483865B2 - Connecting member attaching device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for mounting an electronic component such as a film-shaped electronic component on a substrate such as a glass substrate, and more particularly to a lead portion formed on a work such as the substrate and the electronic component. The present invention relates to a connecting member sticking device for sticking a connecting member such as an anisotropic conductive film to the.

[0002]

2. Description of the Related Art As a component mounting device for manufacturing a flat panel display such as a liquid crystal display device, a component mounting device for mounting a film-shaped electronic component on a glass substrate has been known.

In such a component mounting apparatus, generally, a connecting member such as an anisotropic conductive film is attached to the lead portion formed on the surface of the glass substrate by the connecting member attaching apparatus, and then the attached connection is made. The film-shaped electronic component is mounted on the glass substrate via the member. In the connection member sticking device, a thermocompression bonding device and a backup are provided on the upper surface side and the lower surface side of the glass substrate, respectively, and the lower surface of the glass substrate is supported by the backup and supplied to the upper surface of the glass substrate. The connecting member is attached to the lead portion of the glass substrate by thermocompressing the tape-like connecting member from above with a thermocompression bonding device.

By the way, the flat panel display manufactured by such a component mounting apparatus tends to have a large panel size, and as shown in FIG. Part 3
The type in which 2 is implemented is becoming more common.

In such a flat panel display, the lead portions 3 formed on both upper and lower surfaces of the glass substrate 31.
It is necessary to attach the connecting member 33 to 1a and 31b.
Therefore, in the conventional connecting member sticking device, in general,
After attaching the connecting member 33 to the lead portion 31a formed on one surface (for example, the upper surface) of the glass substrate 31, the glass substrate 31 is inverted by the reversing device to reverse its vertical direction, and again. The connecting member 33 is attached to the lead portion 31b formed on one surface (for example, the lower surface).

[0006]

However, in the above-mentioned conventional connecting member sticking apparatus, when the connecting member is stuck to the lead portions formed on the upper and lower surfaces of the glass substrate, a reversing device for reversing the glass substrate is used. You will need
There is a problem that the cost is increased and the takt time is lengthened due to the influence of the reversing operation and the device efficiency is lowered.

The present invention has been made in consideration of the above points, and an object thereof is to provide an inexpensive and simple connecting member sticking device which can shorten the tact time and improve the device efficiency. To do.

[0008]

SUMMARY OF THE INVENTION The present invention is a connecting member sticking device for sticking a connecting member to an upper surface side lead portion and a lower surface side lead portion formed on an upper surface and a lower surface of a work, respectively. A first attaching mechanism for attaching a connecting member from above to a lower part, and a second attaching mechanism for attaching a connecting member to a lower surface side lead portion of the work from below, the first attaching mechanism and the second attaching mechanism being provided. A connection member supply device that is provided in parallel in a direction along the attachment surface of the connection member in the work, and the second attachment mechanism supplies a tape-shaped connection member along the lower surface side lead portion of the work, and the connection member supply. A thermocompression bonding device for bonding the connection member to the lower surface side lead portion of the work by thermocompression bonding the tape-shaped connection member supplied from the device from below, and to the work. The Te connecting member provides a connection member attachment device and having a thermal isolation to block the influence of heat from the thermocompression bonding device in the standby state without thermocompression.

In the present invention, the connecting member is preferably made of an anisotropic conductive film.

According to the present invention, the first pasting mechanism and the second pasting mechanism are arranged side by side in the direction along the pasting surface of the connecting member in the work, and the first pasting mechanism connects the upper surface side lead portion of the work from above. Since the connecting member is attached to the lower surface side lead portion of the work from below while the member is attached, the work is inverted even when the connecting member is attached to the lead portions formed on the upper and lower surfaces of the work. Can be done without. Therefore, it is possible to reduce the cost by eliminating the need for a reversing device and the like, and prevent the takt time from becoming long due to the influence of the reversing operation, thereby improving the device efficiency.

Further, according to the present invention, the second attaching mechanism for attaching the connecting member to the lead portion on the lower surface side of the work is provided with the heat shield mechanism for cutting off the influence of heat from the thermocompression bonding device, so that the work is attached to the work. On the other hand, in the standby state in which the connection member is not thermocompression bonded, it is possible to effectively prevent the connection member from being hardened by the influence of heat from the thermocompression bonding device.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing an embodiment of a connecting member sticking apparatus according to the present invention. In the present embodiment, a case where a glass substrate generally used as a liquid crystal display device or a plasma display panel is used as the work to which the connecting member is attached will be described as an example.

As shown in FIG. 1, the connecting member sticking apparatus 1 according to the present embodiment has an upper surface side lead portion and a lower surface side lead portion (reference numeral 31a in FIG. 2) formed on the upper surface and the lower surface of the glass substrate 31, respectively. , 31b) to which a connecting member such as an anisotropic conductive film is attached, and is placed and transported on a transport stage (not shown) that can be driven in the X-axis, Y-axis, and θ-axis directions. Receiving the first attaching mechanism 10 for attaching the connecting member to the upper surface side lead portion of the glass substrate 31, and the glass substrate 31 with the connecting member attached to the upper surface side lead portion by the first attaching mechanism 10 while maintaining its posture. The second pasting mechanism 20 for pasting the connecting member to the lower surface side lead portion of the received glass substrate 31.

Here, the first attaching mechanism 10 includes a first connecting member supply device 11 for supplying the connecting member tape 41 along the lead portion on the upper surface side of the glass substrate 31, and an edge portion of the glass substrate 31 from the lower surface side. A first backup 12 that supports the first backup 12 and a first thermocompression bonding device 13 that is provided to face the first backup 12 with the glass substrate 31 interposed therebetween are provided. In addition,
The first connecting member supply device 11 includes a feeding reel 14 that feeds the connecting member tape 41, a take-up reel 15 that winds the connecting member tape 41 that is fed from the feeding reel 14,
It has a guide roller 16 provided in the conveyance path of the connecting member tape 41 and a cutting device (not shown) for cutting only the connecting member carried by the connecting member tape 41.
As a result, the connecting member carried on the connecting member tape 41 sent by the guide roller 16 is cut into predetermined lengths by the cutting device. In addition, the first thermocompression bonding apparatus 1
3 is a first heating tool 17 for pressing the connecting member tape 41 onto the glass substrate 31 and thermocompression-bonding a cutting piece cut into a predetermined length by a cutting device among the connecting members carried by the connecting member tape 41. And a first cylinder 18 that vertically moves the first heating tool 17 so that the first heating tool 17 contacts the connecting member tape 41, and the upper surface side of the glass substrate 31 supported by the first backup 12 Of the connecting members carried by the connecting member tape 41 supplied by the first connecting member supply device 11, the cut pieces cut into a predetermined length by the cutting device are attached to the lead portions.

On the other hand, the second attaching mechanism 20 is provided with the glass substrate 3
The second connecting member supplying device 21 for supplying the connecting tape 41 ′ along the lower surface side lead portion of No. 1, the second backup 22 for supporting the edge portion of the glass substrate 31 from the upper surface side, and the second substrate 22 sandwiching the glass substrate 31. The second thermocompression bonding device 23 is provided so as to face the second backup 22. The second
The connection member supply device 21 includes a feeding reel 24 that feeds a connection member tape 41 ′, a take-up reel 25 that winds the connection member tape 41 ′ that is fed from the feeding reel 24,
It has a guide roller 26 provided in the conveying path of the connecting member tape 41 'and a cutting device (not shown) for cutting only the connecting member carried by the connecting member tape 41' . As a result, the connecting member carried on the connecting member tape 41 ′ sent by the guide roller 26 is cut into predetermined lengths by the cutting device. In addition, the second thermocompression bonding device 23 includes the connecting member tape 41 ′ on the glass substrate 31.
A second heating tool 27 for pressing and pressing a cutting piece cut into a predetermined length by a cutting device among the connecting members carried by the connecting member tape 41 ′, and a second heating tool 27.
Has a second cylinder 28 for moving the second heating tool 27 in the vertical direction so that the second heating tool 27 comes into contact with the connection member tape 41 ′, and the second lower surface side lead portion of the glass substrate 31 supported by the second backup 22 has a second Of the connecting members carried on the connecting member tape 41 ′ supplied by the connecting member supply device 21, the cut pieces cut into a predetermined length by the cutting device are attached. The second heating tool 27 is provided with a movable heat shield plate (heat shield mechanism) 29, and a second heat tool 27 is provided in a standby state in which the connecting member is not thermocompression bonded to the glass substrate 31. The connection member carried on the connection member tape 41 'is prevented from being hardened by the influence of heat. As the material of the heat shield plate 29, a resin material or the like having a low thermal conductivity can be used.

Next, the operation of this embodiment having such a configuration will be described.

First, with the glass substrate 31 placed and fixed on a transfer stage (not shown) that can be driven in the X-axis, Y-axis, and θ-axis directions, the transfer stage (not shown) is moved. , The upper surface side lead portion formed on the upper surface of the glass substrate 31 and the first backup 12 of the first attaching mechanism 10
It is positioned between the thermocompression bonding device 13. At this time, the first backup 12 of the first attaching mechanism 10 and the first heating tool 17 are separated from each other as shown in FIG.

In this state, the connecting member tape 41 fed from the feeding reel 14 is fed on the guide roller 16,
Of the connecting members carried on the connecting member tape 41, the cutting pieces cut into a predetermined length by the cutting device are moved to below the first heating tool 17.

Then, the first heating tool 17 is moved downward by the first cylinder 18, and the first backup 12 is moved upward by a drive unit (not shown). As a result, with the lower surface of the glass substrate 31 supported by the first backup 12, the connecting member tape 41 supplied to the upper surface of the glass substrate 31 is transferred from above to the first tape.
The connecting member carried by the connecting member tape 41 is thermocompression bonded to the upper surface side lead portion formed on the upper surface of the glass substrate 31 by pressing with the heating tool 17.

Here, the second attaching mechanism 20 is in a standby state while the connecting member is attached to the lead portion on the upper surface side of the glass substrate 31 by the first attaching mechanism 10, and the second attaching mechanism 20 has the second attaching mechanism. Backup 22 and second heating tool 27
And are separated from each other as shown in FIG. Also, the connecting member tape 4 fed from the feeding reel 24
1'is sent on the guide roller 26, and the connecting member tape 4
Of the connecting members carried by 1 ', a cutting piece cut into a predetermined length by the cutting device is moved above the second heating tool 27. In such a standby state, the movable heat shield plate 29 is positioned between the second heating tool 27 and the connecting member tape 41 ′ so as to cover the heating surface of the second heating tool 27.

Thereafter, after the connecting member is attached to the lead portion on the upper surface side of the glass substrate 31, in the first attaching mechanism 10, the first heating tool 17 is moved upward by the first cylinder 18 and the driving portion ( The first backup 12 is moved downward by (not shown). Also, the X axis,
By moving a transport stage (not shown) that can be driven in the Y-axis and θ-axis directions, the lower surface side lead portion formed on the lower surface of the glass substrate 31 is attached to the second backup 22 of the second attaching mechanism 20 and the second thermocompression bonding. Positioned between device 23.

After the heat shield plate 29 is retracted from the space between the second heating tool 27 and the connecting member tape 41 ', the second
The cylinder 28 moves the second heating tool 27 upward, and the drive unit (not shown) moves the second backup 22 downward. As a result, with the upper surface of the glass substrate 31 supported by the second backup 22, the connecting member tape 41 ′ supplied to the lower surface of the glass substrate 31 is pressed from below by the second heating tool 27, and the glass substrate 31 is pressed. The connecting member carried on the connecting member tape 41 'is thermocompression bonded to the lower surface side lead portion formed on the lower surface of the.

Thereafter, in the second attaching mechanism 20, the second attaching mechanism 20
The cylinder 28 moves the second heating tool 27 downward, and the drive unit (not shown) moves the second backup 22 upward. In addition, the movable heat shield 2
9 is positioned between the second heating tool 27 and the connecting member tape 41 'so as to cover the heating surface of the second heating tool 27, and is in a standby state.

The above operation is continuously performed on all the glass substrates 31 to which the connecting members are to be attached.

As described above, according to this embodiment, the connecting member is attached to the upper surface side lead portion of the glass substrate 31 by the first attaching mechanism 10, and the connecting member is attached to the upper surface side lead portion by the first attaching mechanism 10. The attached glass substrate 31 is received by the second attaching mechanism 20, and the connecting member is attached to the lower surface side lead portion of the received glass substrate 31 by the second attaching mechanism 20.
Even when the connecting members are attached to the lead portions formed on both the upper and lower surfaces of the above, it can be performed without inverting the glass substrate 31. Therefore, it is possible to reduce the cost by eliminating the need for a reversing device and the like, and prevent the takt time from becoming long due to the influence of the reversing operation, thereby improving the device efficiency.

According to the present embodiment, the movable heat shield plate 29 of the second attaching mechanism 20 allows the connecting member tape 4 to be attached.
The second of the second thermocompression bonding device 23 located below 1 '
Since the heat from the heating tool 27 is cut off, the retracting distance of the second heating tool 27 of the second thermocompression bonding apparatus 23 is minimized in the standby state in which the connecting member is not thermocompression bonded to the glass substrate 31. Hold down the second heating tool 2
It is possible to effectively prevent the connection member carried on the connection member tape 41 ′ from being hardened by the influence of heat from 7.

In the above-described embodiment, the second thermocompression bonding device 23 is positioned below the connecting member tape 41 'so that the connecting member tape 41' is easily affected by heat.
Although the heat shield plate 29 is provided only on the second heating tool 27, the present invention is not limited to this, and the heat shield plate may be provided on the first heating tool 17 of the first thermocompression bonding apparatus 13.

Further, in the above-mentioned embodiment, the glass substrate 31 which is generally used as a liquid crystal display device or a plasma display panel is used as the work to which the connecting member is attached, but the invention is not limited to this. It is possible to apply to the substrate, electronic parts, etc. Also,
As the connecting member, any connecting member other than the anisotropic conductive film can be used.

Further, in the above-mentioned embodiment,
An example has been described in which the connecting member is attached to the upper surface side lead portion of the glass substrate 31 and then the connecting member is attached to the lower surface side lead portion. However, after the connecting member is attached to the lower surface side lead portion, the upper surface side lead portion is connected. You may make it attach a member.

Further, the example has been described in which the connecting member is thermocompression bonded to the glass substrate 31 using the heating tools 17 and 27. However, when the connecting member has sufficient viscosity even at room temperature, heating is not always performed. No need.

Further, the example in which the glass substrate 31 is moved between the first attaching mechanism 10 and the second attaching mechanism 20 using the transport stage has been described, but the position of the glass substrate is fixed and the first attaching mechanism is used. You may make it move 10 and the 2nd sticking mechanism 20.

[0032]

As described above, according to the present invention, it is possible to reduce the cost by eliminating the need for a reversing device or the like, and to prevent the takt time from becoming long due to the influence of the reversing operation and improve the device efficiency. it can.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of a connecting member sticking apparatus according to the present invention.

FIG. 2 is a diagram showing an example of a flat panel display manufactured by a component mounting apparatus.

[Explanation of symbols]

1 Connection member pasting device 10 First sticking mechanism 11 First connection member supply device 12 First backup 13 1st thermocompression bonding equipment 14 Feed reel 15 Take-up reel 16 Guide roller 17 First heating tool 18 1st cylinder 20 Second attachment mechanism 21 Second Connection Member Supply Device 22 Second backup 23 Second thermocompression bonding device 24 Delivery reel 25 take-up reel 26 Guide roller 27 Second heating tool 28 second cylinder 29 Shield plate (shield mechanism) 31 glass substrate (work) 41, 41 'Connection member tape

Claims (2)

(57) [Claims] 1. A connecting member sticking device for sticking a connecting member to an upper surface side lead portion and a lower surface side lead portion formed on an upper surface and a lower surface of a work, respectively, wherein the connecting member is stuck to the upper surface side lead portion of the work from above. A first pasting mechanism and a second pasting mechanism for pasting a connecting member onto the lower surface side lead portion of the workpiece from below are provided, and the first pasting mechanism and the second pasting mechanism are provided on the pasting surface of the connecting member in the workpiece. The second pasting mechanism is arranged side by side in the direction along the connecting member supplying device for supplying a tape-like connecting member along the lower surface side lead portion of the work, and a tape-like connecting member supplied by the connecting member supplying device. A thermocompression bonding device for bonding the connection member to the lower surface side lead portion of the work by thermocompression bonding the connection member from below, and a thermocompression bonding device for the work. And a heat shield mechanism that shuts off the influence of heat from the thermocompression bonding device in a standby state. 2. The connecting member sticking apparatus according to claim 1, wherein the connecting member is made of an anisotropic conductive film.