JP3485328B2 - Manufacturing method of laminated parts - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a laminated component having a built-in capacitor and the like, and more particularly to a method of manufacturing a laminated component having a through hole. It is about. 2. Description of the Related Art Conventionally, a laminated component having a built-in capacitor is formed by laminating dielectric green sheets as disclosed in, for example, Japanese Utility Model Application Laid-Open No. 56-70634. FIG. 5 shows such a chip-type laminated component, in which reference numeral 11 indicates a component main body. A capacitor portion 13 is formed in the component body 11. These capacitor portions 13 are composed of a plurality of electrodes 15 and through holes 17 for connecting these electrodes 15, and these through holes 17 are filled with metal. Condenser part 13
The electrode 15 is drawn out through the through hole 17 and connected to, for example, a thick film resistor formed on the surface of the component body 11. [0004] The capacitor portion 1 of such a laminated component
3 shows a BaTi having a through hole formed therein as shown in FIG.
A ceramic green sheet 19 containing O ₃ as a main component,
Electrode layers 21 forming the electrodes 15 are alternately laminated, and a through-hole 17 formed by a through hole is filled with a paste 23 for electrically conducting the electrodes 15, followed by firing. [0005] Paste 2 filling through hole 17
No. 3 is formed of silver or a metal composed of silver and palladium, and a solvent and a binder that are scattered during firing. However, in the conventional laminated parts, the solvent and the binder in the paste 23 are scattered during the firing and cause the volume of the paste 23 to shrink. If the amount of solvent and binder is large and the amount of metal is small,
7 is not sufficiently filled, and the connection with the electrode layer 21 is poor. Further, there is a possibility that cracks may occur in the green sheet 19 during firing. The present inventors have analyzed the cause of the crack in detail, and found that the shrinkage of the metal in the paste 23 during the sintering from the sintering start temperature to the sintering end temperature of the green sheet 19 is large. It was found that stress was generated in the sheet 19. That is, the green sheet 19 during the firing process
The binder added to maintain the shape of the green sheet 19 scatters at around 300 ° C., and the green sheet 19
The sintering starts at about 1000 ° C. and ends at about 1000 ° C.
9 becomes rigid, and the integration of the electrode layer 21 of the capacitor with the metal in the through hole starts. Therefore, the sintering start temperature, for example, 800 ° C. to the sintering end temperature,
For example, at 1000 ° C., it is better that no force acts on the green sheet 19 itself. However, when the baking shrinkage of the metal in the paste 23 is large, as shown in FIG. 7, the metal in the through-hole tries to shrink in the direction of the arrow to move the electrode layer 21. A force is applied to bend the green sheet 19 sandwiched between the green sheets 19 in one direction, a tensile stress is applied to one side (A) of the green sheet 19, and cracks occur in the green sheet 19 near the through holes during firing. I found out. SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide a method of manufacturing a laminated component which can reliably prevent the occurrence of electrical connection failures and cracks. I do. According to the method of manufacturing a laminated component of the present invention, a through hole in a green sheet laminate is filled with a paste containing a metal and a solvent and a binder scattered during firing. Then, in the method of manufacturing a laminated component to be fired, the firing temperature in the firing step is 800 ° C. to 1 ° C.
The method is such that the firing shrinkage of the metal in the paste at 000 ° C. is within 4% and the metal content in the paste is 82% or more. In the method of manufacturing a laminated component according to the present invention, the binder is scattered during the firing process, and the green sheet starts sintering at about 800 ° C., which is the sintering start temperature. However, at a firing temperature of 800 ° C. to 1000 ° C. in the firing step, the shrinkage ratio of the metal in the paste is as small as 4% or less. There is no deformation. Further, since the metal content in the paste is set to 82% or more, even if the solvent and binder in the paste are scattered during firing, the change in the volume of the paste is small, and the metal is sufficiently contained in the through holes. As a result, the electrical connection between the electrodes and the like is completed. Here, when the sintering shrinkage of the metal in the paste is set to be within 4% from 800 ° C. to 1000 ° C., which is the sintering start temperature to the sintering end temperature of the green sheet, when the sintering shrinkage ratio is larger than 4%. This is because a force that deforms the green sheet due to shrinkage of the metal in the paste or the like is applied. Further, the reason why the metal content in the paste is set to 82% or more is that if the solvent content and the binder in the paste are scattered during firing, the metal is sufficiently filled in the through holes if the metal content is less than 82%. This is because the electrical connection between the electrodes and the like becomes incomplete. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for manufacturing a laminated component according to the present invention will be described in detail with reference to the drawings. FIGS. 1 and 2 show a chip-shaped laminated component manufactured by the manufacturing method of the present invention. In the figures, reference numeral 31 denotes a component main body. This component body 31
Inside, a capacitor part 33 is formed. These capacitor portions 33 are composed of a plurality of electrodes 35 and through holes 37 for connecting these electrodes 35, and the through holes 37 are filled with metal. The electrode 35 of the capacitor part 33 is drawn out to the lower surface through the through hole 37 and is connected to a thick film resistor 39 formed on the lower surface of the component body 31. These thick film resistors 39 are coated with, for example, glass or the like. The wiring pattern 41 formed on the component body 31 is connected to a thick film resistor 39 or a capacitor section 33 (not shown). A through hole 42 is also connected to the wiring pattern 41, and is drawn out to the upper surface by the through hole 42. An active component 43 such as an IC disposed on the upper surface of the component body 31 is connected to the through hole 42 and the through hole 37 having one end connected to the capacitor portion 33. The capacitor part 3 of such a laminated component
Reference numeral 3 denotes a ceramic green sheet mainly composed of BaTiO ₃ having through holes formed therein and electrode layers forming the electrodes 35 alternately laminated, and the electrode layers are electrically connected to the through holes 37 formed by the through holes. It is formed by filling a paste for conduction to the substrate and baking. The ceramic green sheets include, for example, 18.0 to 27.0% by weight of BaTiO ₃ and Nd ₂
31.6 to 36.3% by weight of O _{3 and} 27.6 to TiO ₂
35.6 wt% and, Bi ₂ O ₃ 2.5~8.1 wt%
When, it contains the Pb ₃ O ₄ 5.6~9.0 wt% as a main component. In the sintering process of this kind of ceramic green sheet, the sintering start temperature to the sintering end temperature 8
The firing shrinkage at 00 ° C to 1000 ° C is about 15 to 21%
It is. The paste filled in the through holes 37 and 42 is formed of a metal such as silver or silver and palladium, and a solvent and a binder that are scattered during firing, and the firing shrinkage of the metal in the paste is a green sheet. 800 ° C to 1000 ° C which is the sintering end temperature from the sintering start temperature of
, Is set within 4%, and the paste contains 82% or more metal. The firing shrinkage of the metal is adjusted according to the particle size and shape of the metal. here,
The firing shrinkage of the metal in the paste is from 800 ° C. to 1000 ° C.
The term “within 4% in ° C.” means that when the temperature is increased from 800 ° C. to 1000 ° C., shrinkage of up to 4% based on 800 ° C. is permitted. In the method for manufacturing a laminated component as described above, the binder is scattered at a firing temperature of about 300 ° C.
Since the green sheet starts sintering at around 0 ° C., the green sheet becomes rigid at 800 ° C., which is the sintering start temperature, and the integration between the metal of the electrode and the through hole starts. At a firing temperature of 800 ° C. to 1000 ° C., since the shrinkage ratio of the metal in the paste is within 4%, almost no force for moving the electrode layer due to the shrinkage of the paste acts, and the firing from the sintering start temperature. At the sintering end temperature, a force that deforms the green sheet does not act, thereby making it possible to reliably prevent the occurrence of cracks during firing. Further, since the metal content in the paste is set to 82% or more, the volume change of the paste is small even if the solvent and the binder in the paste are scattered during firing, so that the through holes 37 and 42 are provided. The inside can be sufficiently filled with metal, and the electrical connection between the electrodes 35 and the like is completed. Accordingly, it is possible to reliably prevent electrical connection failure and cracks in the laminated component. By the way, in order to demonstrate the present invention, the present inventors use metals having different firing shrinkage rates at a firing temperature of 800 ° C. to 1000 ° C. in the sintering process of the ceramic green sheet, and reduce the metal content. Experiments were carried out to produce laminated components with various changes. This experiment is
First, laminated parts were manufactured using metals M-1 to M-6 having different firing shrinkage rates from 800 ° C. to 1000 ° C. (pastes No. p-1 to p-6). On the other hand, 800 ° C
From 1000 to 1000 ° C, the firing shrinkage of which is within 4%
-4 was used to produce a laminated component by changing its metal content (paste Nos. P-7 to p-10). As a result, the presence or absence of cracks in the laminated component and the quality of the electrical connection were determined. Hereinafter, the experimental results are shown in Table 1. Table 2 shows the particle shapes, particle diameters, and the like of the metals M-1 to M-6. Here, Ag / Pd in the paste is 70/30 in weight ratio. The firing shrinkage rates with respect to temperature for M-2 and M-4 among the metals M-1 to M-6 are shown in FIG. 3 and FIG. In FIG. 3, the dashed line indicates the firing shrinkage of the green sheet. [Table 1] [Table 2] According to Table 1, when the metal content is 82% or more and the firing shrinkage of the metal in the paste is 4% or less, no cracks or the like are observed in the laminated component. The electrical connection was also good. When the metal content was 82% or more and the firing shrinkage of the metal was more than 4%, the electrical connection was good, but cracks and the like were observed in the laminated parts. Furthermore, when the metal content was less than 82% and the shrinkage ratio of the metal was 4% or less, no cracks or the like were observed in the laminated component, but the electrical connection was poor. . Although the above embodiment has been described with respect to an example in which the capacitor portion 33 is formed in the laminated component and an IC or a thick film resistor is arranged on the surface, the present invention is limited to the above embodiment. For example, it is needless to say that the present invention may be applied to this laminated component without forming a capacitor as long as a through hole is formed inside. Further, in the above-described embodiment, an example was described in which a green sheet laminate was manufactured using ceramic green sheets containing BaTiO ₃ as a main component. However, the present invention is not limited to the above-described embodiment, and other embodiments are applicable. Even if a green sheet laminate is manufactured from ceramic green sheets containing components as main components and the present invention is applied, substantially the same effects as those of the above embodiment can be obtained. According to the method for manufacturing a laminated component of the present invention, the firing temperature of the green sheet in the firing step is 800 ° C. to 1000 ° C.
Since the shrinkage ratio of the metal in the paste at 4 ° C. is within 4%, a force for deforming the green sheet is not applied between 800 ° C. and 1000 ° C., and the generation of cracks can be reliably prevented. . Further, since the metal content in the paste is set to 82% or more, even if the solvent and binder in the paste are scattered during firing, the change in the volume of the paste is small, and the metal is sufficiently filled in the through holes. Therefore, the electrical connection between the electrodes and the like can be completed.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a longitudinal sectional view showing a laminated component using the manufacturing method of the present invention. FIG. 2 is a perspective view of FIG. FIG. 3 is a graph showing a coefficient of thermal expansion with respect to temperature for metal M-2. FIG. 4 is a graph showing a coefficient of thermal expansion with respect to temperature for metal M-4. FIG. 5 is a longitudinal sectional view showing a laminated component using a conventional manufacturing method. FIG. 6 is an enlarged longitudinal sectional view showing the vicinity of a through hole in FIG. 5; FIG. 7 is a vertical cross-sectional view for explaining the principle of cracking in a green sheet near a through hole. [Description of Signs] 33 Capacitor 35 Electrode 37 Through-hole

Claims (1)

(57) [Claim 1] Manufacture of a laminated component in which a through hole in a green sheet laminate is filled with a paste containing a metal and a solvent and a binder that scatters during baking, and then calcined. The method, wherein the sintering temperature in the sintering process is 800 ° C to 1 ° C.
A method for manufacturing a laminated component, wherein the shrinkage ratio of the metal in the paste at 000 ° C. is 4% or less and the metal content in the paste is 82% or more.