JP3490944B2 - IC card manufacturing equipment - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin non-contact IC.
IC card manufacturing apparatus suitable for use in manufacturing cards
About. 2. Description of the Related Art Generally, electronic parts such as IC chips are incorporated.
IC cards are known. IC card is a card
To accommodate electronic components inside the card, the card surface is
It must be manufactured so that there is no unevenness due to the product.
The manufacturing method and the apparatus for this are also disclosed in Japanese Patent Publication No. 2-16234.
JP, JP-A-6-176214, JP-A-9-27
No. 7766 and JP-A-11-48660.
Proposed. [0003] By the way, recently, the thickness is several hundred microns.
A flexible, thin contactless IC card of about
Has been used. FIG. 7 shows such a thin non-contact IC.
Representative IC card manufacturing apparatus 6 for manufacturing cards
Indicates 0. This IC card manufacturing apparatus 60 includes a lower press board.
61 and an upper press plate 62, and the lower press plate 61 is a heat insulating plate.
Attach to the base part 64 via 63
The board 62 is attached to the elevating body 66 via a heat insulating plate 65.
As a result, the lower press board 61 becomes the fixed side,
The board 62 is movable. Also, inside the lower press board 61
Is provided with a heater 67 for heating and a water passage 68 for cooling.
In addition, inside the upper press platen 62, heaters 69 for heating are provided.
Cooling channels 70 are provided. Further, the base portion 64 has
A cylindrical lower chamber 71 covering the periphery of the press board 61 is provided.
Around the upper press platen 62
An upper chamber section 72 is provided to cover the upper chamber. This lower chamber part 7
1 and the upper chamber part 72 lowered the upper press platen 62
At the same time, the chamber 73 is sealed inside.
You. On the other hand, 74 is an air vent provided in the upper chamber 72.
A deaerator (not shown) (vacuum pump)
, Etc.) to evacuate the interior of the chamber 73
can do. In addition, 75 is in the upper chamber section 72.
It is a sealing material provided. According to such an IC card manufacturing apparatus 60,
For example, the laminated base material M used when manufacturing an IC card is
It is set on the lesson board 61. In this case, the laminated substrate M
Is configured as shown in FIG. P is an IC chip
It is an electronic component consisting of Pi and antenna Pa.
Implemented on the gateway S. And base sheet S and electronic
Parts P are hot melt sheets Ta, Tb,
In addition, thermoplastic with adhesives Ba and Bb from outside
Resin sheet (polyethylene terephthalate etc.) La, L
b. On the other hand, when thermocompression bonding of the laminated substrate M is performed,
Lowers the elevating body 66 shown in FIG.
73 and the heaters 67 for heating
Lower press plate 61 and upper press plate 6 heated by energizing 9 ...
When the laminated base material M is pressurized by 2, the laminated base material M
The thermocompression bonding is performed in a state where the bubbles including the air are removed. After this,
The energization of the heat heaters 67 ... and 69 ... is stopped, and the cooling water
If cooling water is allowed to flow through 68 ... and 70 ..., the laminated base material M is cooled.
Be rejected. By the way, it has a thin and flexible property.
When manufacturing this type of IC card, the laminated base material M
Heating and pressing conditions during thermocompression give production quality
The effect is large, for example, if heating control must be performed properly
For example, if warpage or distortion occurs, the flatness of the product is impaired.
If the pressurization control is not performed properly,
Deterioration and unevenness such as easy peeling
G, and furthermore, the merchantability is reduced. For this reason, the above-mentioned conventional IC card manufacturing
In the device 60, the lower press platen 61 and the upper press platen 62
By controlling both the heating process and the cooling process,
Control and pressurization control continuity was ensured.
The production cycle time until the production of the base material M is long
Lower productivity and mass productivity, as well as energy
Due to the increase, there is a problem that energy saving and economic efficiency are inferior.
Was. The heating step and the cooling step are different steps.
Can solve such problems, but on the other hand,
As described above, when shifting from the heating process to the cooling process,
Since the heating state and the pressurized state are released, quality degradation and
This leads to variation and, furthermore, a drop in commercial value. Therefore, the present applicant has already prepared a laminated base material M.
Consists of an upper holding part and a lower holding part that sandwich and seal from both sides
Degas the laminated base material holding part and the inside of this laminated base material holding part
Between the deaeration section and the laminated substrate M
Section is heated by a preheating temperature lower than the normal heating temperature
The preheating press section and the laminated substrate sent from the preheating press section
Thermo-compression pre-press that thermo-compresses the material holding part at the regular heating temperature
And the laminated base material sent from the thermocompression press
Card manufacturing device provided with a cooling press unit for cooling the unit
(Basic device) (Japanese Patent Application No. 10-354966).
issue). According to this basic device, the laminated base material holding portion is
To provide, the laminated base material M is laminated in a sealed state and a degassed state.
It is housed inside the base material holding part, and
Continuity is ensured, that is, heat retention and pressure retention for the laminated substrate M
Is ensured. As a result, quality and homogeneity
Therefore, the merchantability can be significantly improved. [0010] By the way, the above-described base
In order to increase the productivity of this machine,
It needs to open and close quickly. However, in the basic device,
Upper holding portion and lower holding portion for sandwiching and sealing the base material M from both sides.
Each pressed part has a high
When opened at high speed, the upper
Each plate surface of the holding part and lower holding part is the pressing surface of each pressing part.
Sucked, the upper and lower clamps are momentarily separated
The phenomenon of displacement in the direction occurs. Especially in this case, the upper clamp
Thickness of several hundred micros even if the displacement between the lower part and the lower clamping part is slight
In the case of a laminated substrate M (IC card)
The influence cannot be ignored, resulting in defective manufacturing such as poor fusion.
Such as deterioration or variation in the quality of the IC card,
In addition to lowering product appeal and lowering yield,
Since there is a limit to the high-speed opening and closing of
There was a problem to be solved that led to a drop in productivity. The present invention has solved the above problems.
To improve the quality and homogeneity of IC cards
In addition, it is possible to dramatically improve product appeal and yield,
Moreover, production is achieved by realizing high-speed opening and closing of the press section.
Card Manufacturing Apparatus that Can Increase Productivity and Mass Production
The purpose is to provide. Means and Embodiments for Solving the Problems The present invention
Is applied to a sheet member including the thermoplastic resin sheets La and Lb.
Laminated base material M sandwiching electronic components P such as IC chips
To a pair of press plates 2u, 2u, having pressing surfaces 3u, 3d.
Equipped with a pressurizing press unit 2 for pressing from both sides by 2d
When configuring the IC card manufacturing apparatus 1, the laminated base material M
Holding portion 7u and lower holding portion 7 for sandwiching and sealing the
d and separate from the manufacturing apparatus body 1x.
And a laminated base material arranged between the pair of press boards 2u and 2d.
Formed inside the holding portion 1y and the press platens 2u and 2d,
And one or more air outlets 4u on the pressurizing surfaces 3u, 3d.
air passages 4u ..., 4d ... facing s ..., 4ds ...,
Air that supplies air A to the air passages 4u, 4d.
When the supply unit 5 and the pair of press plates 2u and 2d are opened,
The air supply unit 5 is controlled so that air A
Is provided with a control unit 6 that supplies ... for a set time.
And Thus, the pair of press plates 2u, 2
When opening d, the air supply unit controlled by the control unit 6
5 indicates that the air A has passed through the air passages 4u, 4d,
Air outlet 4 provided on the pressurizing surfaces 3u and 3d.
us…, 4ds… As a result,
The holding section 1y opens the pair of press boards 2u and 2d at the same time
, And quickly separate from the pressing surfaces 3u and 3d. in this case,
Air outlets 4us ..., 4ds ... are provided on the pressurizing surfaces 3u, 3d.
However, the laminated substrate M and the pressing surface
Since 3u and 3d do not come into direct contact with each other,
Defects that adversely affect quality are avoided. Preferred embodiments according to the present invention will be described below with reference to the accompanying drawings.
This will be described in detail based on the aspect. First, an IC card manufacturing apparatus according to this embodiment
1 will be described with reference to FIGS. The IC card manufacturing apparatus 1 includes a manufacturing apparatus main body 1
x and a laminated base formed separately from the manufacturing apparatus main body 1x.
A material holding section 1y is provided. As shown in FIG. 1 and FIG.
5 and an upper holding portion 7u and a lower holding portion 7d shown in FIG.
When the holding portion 7u overlaps the lower holding portion 7d,
Is a laminated base material holding portion 1y to be sealed. Upper holding part 7u
As shown in FIG. 3, the upper plate 11u and the upper plate 11u
The upper frame formed in a rectangular frame shape larger than the plate portion 11u.
It has a frame part 12u, and the upper plate part 11u is a laminated base material.
M overlaps the upper surface. Upper plate 11u has a certain thickness
Stainless steel having a thickness of 3 [m
m], preferably about 1 mm. Ma
The upper plate 11u is a pressing surface of the upper press platen 2u.
3u, or protrudes outward from the pressing surface 3u by a predetermined width.
It is formed to the size that it comes out. This predetermined width is 5 to 10 mm.
Below Further, the upper plate 11u and the upper frame
The portion 12u is deformed by heat in the upper plate portion 11u.
Are connected via a plurality of connecting pieces 13u.
As shown in FIG. 3, each connecting piece 13u is an upper plate.
11u and a rectangular shape.
From a pair of opposing edges in the rate portion 11u
Protruding, and provided at regular intervals along the edge
You. In this case, each connecting piece 13u is connected to the upper plate 1
Projection formation in a direction different from the deformation direction of 1u, that is,
As shown in FIG. 1, it is bent in a crank shape. Soshi
Of the connecting pieces 13u...
14 and screwed to the upper frame portion 12u. The lower holding portion 7d is basically also an upper holding portion.
The structure is the same as that of 7u. In the lower holding portion 7d, 11d
Is the lower plate, 12d is the lower frame, 13d ...
A number of connecting pieces are shown respectively. On the other hand, the lower plate 11
On the upper surface of d, a sealing material 15 along the periphery is fixed.
Further, a deaeration port 16 is provided in the upper plate 11u,
Deaeration port 16 is connected to a deaeration device (vacuum pump, etc.)
Continue. This deaerates the inside of the laminated base material holding portion 1y.
It is possible to switch between the deaeration port 16 and the laminated base material by switching.
Air can be supplied into the holding portion 1y. The upper frame
Part 12u and lower frame part 12d
A positioning unit (not shown) for positioning both
ing. On the other hand, the manufacturing apparatus main body 1x has three presses.
Section, ie, a preheating press section (not shown) (pressing press section), heat
Crimping press section (pressing press section) 2 and cooling press (not shown)
(Pressing press section). Figure 2 shows a thermocompression press
Only the part 2 is shown. The thermocompression bonding press section 2 is
The fixed press panel 2u and the movable press panel 2d arranged on the lower side
Prepare. As shown in FIG. 2, the movable press platen 2d
A press platen body 21 having a pressurizing surface 3d,
Equipped with a press platen base 22 that presses the press platen body 21
You. The press platen body 21 is heated by the heat whose tip is the pressing surface 3d.
The board part 23, the heat insulating part 24, and the support board 25 are sequentially stacked.
And are integrated by fixing bolts 26. And hot plate
The section 23 contains a plurality of heating rod heaters 27. The inside of the hot platen section 23 for heating
Four air passages 4d are located at positions avoiding the rod heaters 27.
... are formed. One ventilation passage 4d (same for the other)
As shown in FIG.
A ventilation path 28v and a vertical ventilation path 28
v has a horizontal air passage 28h formed therethrough in the middle of
The lower end of the direct ventilation path 28v is closed by a cap 28c.
You. Thereby, the horizontal ventilation path 2 facing the side surface of the hot platen 23
The opening 8h serves as the air supply port 4di, and is located above the hot platen 23.
The opening of the vertical ventilation path 28v facing the pressing surface 3d, which is the surface, is empty.
The air outlet is 4 ds. The diameter of this air outlet 4ds is
For example, it is selected to be about 1 [mm] and the pressing surface 3d (hot plate
Consideration is made so as not to affect the heating characteristics according to 23). So
Then, four air outlets 4ds... Are as shown in FIG.
Are arranged at four different positions on the pressing surface 3d. In addition, pressurization
Opening the air outlets 4ds on the surface 3d is originally
Although not preferable, in this embodiment, the laminated base material M is stacked.
The laminated base material M and the pressing surface 3d are housed in the layer base material holding portion 1y.
Since there is no direct contact, the air outlets 4ds
Does not affect the quality of the laminated base material M. On the other hand, the press platen body 21 and the press platen base
Four air cushions in different positions between 22
The parts 30a, 30b ... are interposed. Each air cushion
Are arranged symmetrically in pairs in front, rear, left and right. Each d
The cushion portions 30a are integrated with the press base 22.
.. Provided and the rectangular convex portions 31a, 31b,.
Concave portion 3 having a concave portion on the lower surface overlying portion 31a.
2a, 32b... Formed on the side surfaces of the rectangular projections 31a.
The seal rings 33a, 33b,.
Seal between the concave portions 32a and the rectangular convex portions 31a.
, And the upper surface of each recess 32a.
Bond to the surface. Thereby, the concave portions 32a and the rectangular convex portions
31a having air chambers Ra, Rb ... sealed between
The cushion portions 30a are configured, and the concave portions 32a are formed.
Move up and down with respect to the rectangular projections 31a. Furthermore, each concave part
32a are provided with air supply ports 34a, 34b.
Compressor and air control circuit
An air supply unit (not shown) including a path is connected. This air supply
The supply unit detects the pressure of each of the air chambers Ra.
Feedback so that the pressure in the air chambers Ra reaches the target value.
Pressure and individually control the pressure of each air cushion section 30a.
It has a function to set. On the other hand, reference numeral 35 denotes a machine section,
Toggle link mechanism installed between 5 and movable press board 2d
The movable press board 2d is supported by 36. Ma
Reference numeral 37 denotes a drive mechanism for driving the toggle link mechanism 36.
The drive mechanism 37 is attached to the machine base 35.
Servo motor 38 and driven by this servo motor 38
A ball screw mechanism 39 is provided. This
The ball screw 40 of the ball screw mechanism 39 is
And a ball screw mechanism 39
Nut portion 41 serves as an input portion of toggle link mechanism 36.
You. Further, the fixed press board 2u is provided with a pressing surface 3
and a press board main body 42 having u. This press machine
The main body 42 is different from the lower press board main body 21 in that
It is directly attached to a fixed press plate base (not shown). Step
The hot platen part 4 whose tip is the pressing surface 3u
3, the heat insulating part 44 and the support board 45 are sequentially stacked and
It is integrated by the constant bolts 46. And the hot platen part 44
Has a large number of built-in heating rod heaters 47 ...
, Four air passages 4u are formed. This air passage 4
u... are basically air vents provided on the hot platen 23 described above.
It is formed in the same manner as the path 4d. The air passages 4u ...
48v is a vertical ventilation path, 48h is a horizontal ventilation path,
c is a cap, 4ui ... is an air supply port and 4us ... is empty
Each of the air outlets is shown. On the other hand, an air supply unit 5 and a control unit 6 are provided.
You. The air supply unit 5 includes air supply ports 4ui, 4di,
(Air passages 4u ..., 4d ...) to supply air A ...
And the control unit (controller) 6 includes a pair
Control the air supply unit 5 when opening the press panels 2u and 2d
And air A in air passages 4u, 4d for a set time
Control supply. The air supply unit 5 is provided with an air conditioner.
An air supply source 51 using a presser or the like is provided.
The supply source 51 is provided via a flow control valve 52u and an electromagnetic valve 53u.
Connected to the air supply ports 4ui.
Reference numeral 1 denotes an air supply via a flow control valve 52d and a solenoid valve 53d.
Are connected to the supply ports 4di. Then, the solenoid valves 53u, 53
d is connected to the control unit 6. Next, an IC card manufacturing apparatus according to this embodiment
The operation (function) 1 will be described with reference to the drawings. First, the laminated base material M is placed on the laminated base material holding portion 1y.
To accommodate. That is, the laminated base material M is placed on the upper surface of the lower holding portion 7d.
Is placed, and the upper holding portion 7u is stacked from above to
The material M is sandwiched between the upper holding portion 7u and the lower holding portion 7d. this
Thereafter, the deaerator (not shown) is operated to hold the laminated base material holding portion 1y.
Degas the inside of the. As a result, the laminated base material M is held in the upper holding portion.
7u and the lower holding portion 7d.
Air bubbles contained in the material M are completely removed. Then, the laminated base material holding the laminated base material M
The holding section 1y is first preheated by a preheating press section (not shown).
It is processed. That is, the laminated base material holding portion 1y is a pair of presses.
The regular heating temperature when pressurized by the board and thermocompression bonding
Preheat temperature lower than the temperature, specifically hot melt sea
The temperature just before the plastic deformation or welding of Ta and Tb starts
(For example, around 70 ° C.). This allows the product
The layer substrate M is gradually heated by the preheating temperature while being pressurized.
And deaeration is promoted. Next, the pre-heat-treated laminated base material holding portion 1
y is supplied to the thermocompression pressing section 2. In this case, movable
Since the press platen 2 d is lowered, the laminated base material holding portion 1
y is placed on the movable press board 2d, and the servo motor 3
When the nut 8 is actuated, the nut 41 rises,
The movable press platen 2 d is raised by the locking mechanism 36. Soshi
Then, the laminated base material holding portion 1y is pressed against the upper pressing surface 3u,
Allowed once when extremely low pressure is applied to the laminated base material holding portion 1y
The raising of the dynamic press panel 2d is stopped. At this time, the laminated substrate
Even if the thickness of M differs depending on the position,
The pressures of the cushion sections 30a are individually set, that is,
If the pressure corresponding to the thick part of material M is set higher,
, The pressure corresponding to the thin part is set low,
So that a pair of pressing surfaces 3u and 3d for pressing
I do. In this case, the fixed press platen 2u and the
The dynamic press panel 2d has heating rod heaters 27,.
7 ... to the regular heating temperature (for example, around 120 ° C)
Heated. The laminated base material M is sandwiched on both sides.
Product in a sealed state sandwiched between the portion 7u and the lower holding portion 7d.
While being accommodated inside the layer base material holding portion 1y, this product
The inside of the layer base material holding portion 1y is deaerated by a deaerator (not shown).
The laminated base material M is thermocompressed from the preheating press section.
Even if moved to the press section 2, continuous heating and pressing
Properties, that is, the heat retention and pressure retention for the laminated substrate M
Secured. After the set time elapses, the laminated base material M
After softening (plasticizing), the servo motor 38 is made again.
The movable press platen 2d is raised by moving
The pressure surface 3d is stopped at the thickness position of the IC card. to this
Thus, the laminated base material holding portion 1y is movable with the fixed press platen portion 2u.
Heat and pressure are applied from above and below by the press
The layer base material M is thermocompression-bonded. At this time, the laminated base material holding portion 1y
Plate portions 11u and 11d in
Although it is more deformed (expanded), the deformation is caused by a plurality of connecting pieces 1.
3u... And 13d.
Is always a pair of plate portions 11u and 1
Thermocompression bonding is performed by 1d. Thereafter, the set pressurizing time (for example, 20 seconds before
After that, the movable press platen 2d is lowered.
You. At this time, the control unit 6 controls the solenoid valves 53u and 53d to open.
And the air passages 4u...
4d ... are supplied with air A ... Solenoid valves 53u and 53d
The opening and closing timing (set time) is determined by the movable press platen 2
The solenoid valves 53u and 53d are opened a few seconds before d starts to decrease.
A few seconds after the lowering of the movable press
The solenoid valves 53u and 53d are closed. In this case, the solenoid valve 53
If the time to open u, 53d is too long, hot platen parts 23, 44 and
And the laminated base material holding portion 1y is cooled (air-cooled).
Set it not too long. The opening and closing timing of the solenoid valves 53u, 53d
Arbitrarily according to the type of the laminated base material M to be thermocompression-bonded.
Can be set. In addition, the solenoid valves 53u and 53d open and close at the same time.
You can control, open one side early or long
The opening and closing conditions of each solenoid valve 53u, 53d
May be. Further, one of the hot platen portions 23 (the hot platen portion 44 side also
The same), the solenoid valve 53 is provided for each of the plurality of air passages 4d.
u ... are connected, and different supply conditions are set for each air passage 4d.
May be set. Thus, the opening and closing speed of the movable press platen 2d
Even if the opening speed is increased, in particular, the movable press platen 2
When d is opened, the pressing surfaces 3u and 3d hold the laminated base material holding portion.
The upper holding portion 7u and the lower holding portion 7d are sucked by 1y.
To be surely separated from the pressing surfaces 3u and 3d
Can be. Then, the movable press platen 2d is lowered.
The laminated substrate M which is thermocompression-bonded, that is, the manufactured IC card
The heat is transferred to a cooling press section for cooling. In the cooling process
Is cooled while the IC card is pressurized. one
On the other hand, after the cooling process, remove the IC card from the laminated base material holding portion 1y.
To take it out, the inside of the laminated base material holding portion 1y from the deaeration port 16
The air may be supplied to the air. Thereby, the laminated base material holding portion
1y, the degassed state is released, and the laminated base material M is a laminated base material.
It peels off from the holding part 1y. Therefore, the upper holding portion 7u is raised.
Then, the manufactured IC card can be taken out. In the above steps, the upper frame portion
12u and the lower frame 12d are connected to the plate 11u
(Approximately the center) between the heating temperature and the cooling temperature of 11d and 11d
Heat to For example, if the plate portions 11u and 11d are 1
After heating to 40 ° C, cool to 40 ° C
In this case, the upper frame portion 12u and the lower frame portion 12d
The temperature is controlled to be 90 [° C.]. This allows you to play
Parts 11u and 11d, upper frame part 12u and lower frame
Halving the relative change in temperature of the
it can. As described above, the IC card according to the present embodiment
When the molding apparatus 1 is used, the pair of press plates 2u and 2d are opened.
At this time, from the air supply unit 5 controlled by the control unit 6,
Air A is supplied to air passages 4u, 4d for a set time.
Air outlets 4us provided on the pressurizing surfaces 3u, 3d,
4ds..., The laminated base material holding portion 1y
At the same time as opening the pair of press plates 2u, 2d,
Leaves quickly from 3d. As a result, IC card products
Improve quality and homogeneity, as well as marketability and yield
The ball can be raised dramatically, and the press section
High-speed opening and closing can increase productivity and mass productivity.
Wear. The plate portions 11u and 11d are exposed to heat.
Even if it is further deformed, the deformation is caused by a plurality of connecting pieces 13u.
And 13d ..., the laminated substrate M
And a pair of plate portions 11u and 11d having high parallelism
More thermo-compression bonded, yield (productivity) during manufacturing
As well as the quality and average
Improve quality and further enhance product appeal
You. Further, the air cushion portions 30a, 30b
..., the thickness of the laminated base material M differs depending on the position.
Even in this case, a pair of pressing surfaces 3 for pressing the laminated substrate M
u, 3d can be made parallel, and the applied pressure can be from extremely low pressure to medium pressure (high
Pressure) can be applied accurately and stably.
It has a uniform thickness regardless of the thickness of M
A high quality IC card can be obtained. Moreover,
Movable press platen 2 pressurized by glue link mechanism 36
Since the air cushion portions 30a are provided on the d side,
Pressure control even for the toggle link mechanism 36 with a large ratio
Can perform accurate pressure control without disabling
Wear. The embodiment has been described in detail above.
However, the present invention is not limited to such an embodiment.
In the details, configuration, shape, quantity, material, numerical value, etc.
Any changes, additions, or deletions may be made without departing from the spirit of the present invention.
Can be removed. For example, the embodiment applies the present invention
The thermocompression press section 2 is exemplified as a possible press section.
However, the same applies to the preheating press section and the cooling press section.
Can be applied. Further, in the embodiment, the air passages 4u.
Although the case where four are provided is illustrated, one may be provided.
It can be implemented in any number of two or more, and it can be carried out
The form of formation is arbitrary. The laminated base material M
The configuration and material of the (IC card) are not
Applicable to IP. As described above, the IC card according to the present invention is manufactured as follows.
The manufacturing equipment is sandwiched on the upper side to seal the laminated base material from both sides.
Part and lower holding part, and separate from the manufacturing equipment body
By sandwiching the laminated base material arranged between a pair of press boards
Part, formed inside the press panel part, and one or
An air passage that faces two or more air outlets and this air passage
An air supply unit that supplies air to the road and a pair of press panels
When opening the air passage by controlling the air supply unit when opening
With a control unit that supplies only during
It works. (1) Quality and homogeneity of IC card
Improve and dramatically improve product appeal and yield
High-speed opening and closing of the press section
Can increase productivity and mass productivity.
You. (2) The laminated base material is densely sandwiched from both sides.
Use a laminated base material holding part having an upper holding part and a lower holding part to seal.
In particular, it is said that the advantage of (1) can be effectively enjoyed.
In addition, in addition, the laminated substrate and the pressing surface
Therefore, even if an air outlet is provided on the pressurized surface,
Problems that adversely affect quality can be avoided.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional front view showing a main part of a thermocompression press unit in an IC card manufacturing apparatus according to a preferred embodiment of the present invention; FIG. FIG. 3 is a partial cross-sectional front view showing a press unit, FIG. 3 is a plan view of a laminated base material holding unit in the IC card manufacturing apparatus, FIG. 4 is a cross-sectional view taken along line XX in FIG. 5, FIG. FIG. 6 is a partial cross-sectional front view showing a state in which a thermocompression pressing unit is opened in a manufacturing apparatus; FIG. 6 is an exploded cross-sectional front view of a laminated base material manufactured by an IC card manufacturing apparatus; FIG. Longitudinal cross-sectional view of the manufacturing apparatus, [Description of symbols] 1 IC card manufacturing apparatus 1x Manufacturing apparatus main body 1y Laminated base material holding section 2 Pressing press section (thermocompression pressing section) 2u Press board section 2d Press board section 3u Pressing surface 3d Pressurizing surface 4u Air passage 4d Air Road 4us air outlet 4ds air outlet 5 air supply unit 6 control unit 7u upper sandwiching portion 7d under clamping portion La ... thermoplastic resin sheet P electronic component M layered base A ... air

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-62-109693 (JP, A) JP-A-53-43772 (JP, A) JP-A-10-217658 (JP, A) 208577 (JP, A) Jinsho 62-13774 (JP, Y2) Patent 3381 027 (JP, B2) Utility model registration 2559499 (JP, Y2) (58) Fields investigated (Int. Cl. ⁷ , DB name) B29C 65/00-65/82 B42D 15/10 521 G06K 19/00-19/077

Claims (1)

(57) [Claim 1] A laminated base material in which an electronic component such as an IC chip is sandwiched between sheet members including a thermoplastic resin sheet,
In an IC card manufacturing apparatus including a pressurizing press unit that presses from both sides by a pair of press platens having a pressurizing surface, the IC card manufacturing apparatus includes an upper holding unit and a lower holding unit that sandwich and seal the laminated base material from both sides, And by forming the manufacturing apparatus main body separately, the laminated base material holding portion disposed between the pair of press plates, and formed inside the press plate portion, and one or two or more air An air passage facing the outlet,
An air supply unit that supplies air to the air passage, and a control unit that controls the air supply unit and supplies air to the air passage for a set time when the pair of press platens are opened. IC card manufacturing equipment.