JP3491813B2 - Carrier tape for electronic components - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier tape for electronic components used for packaging and transporting components, particularly for packaging and transporting electronic components such as ICs.

[0002]

2. Description of the Related Art Conventionally, as this type of carrier tape,
The one shown in FIG. 9 is known. This carrier tape 1
Is made of a flexible resin material, and the concave portion 2 (hereinafter referred to as the embossed portion 2
2) and the flange portion 3. Here, the embossed portions 2 are arranged at equal intervals along the longitudinal direction of the carrier tape 1 and are used to house one electronic component at a time. The flange portion 3 is used for adhering a tape-shaped lid body (hereinafter referred to as a cover tape) so that the stored electronic components do not fall out of the opening portion during transportation, and both sides in the longitudinal direction thereof are
Alternatively, a large number of feed holes 4 are arranged on one side at equal intervals.

By the way, the carrier tape 1 used for packaging and transporting the electronic component has an embossed portion 2 of the electronic component.
During insertion into the device, inspection of electronic components, and adhesion of the cover tape, the embossed portions 2 are intermittently fed at a distance of the gap as shown in FIGS. During this intermittent feeding, the embossed part 2
When the electronic component inserted in the unit moves horizontally with the carrier tape 1 and stops at the electronic component inspection position, the position is not fixed at each feed, and the erroneous recognition of the inspection device
This is one of the causes of malfunction. Also, carrier tape 1
When the electronic parts are stopped, the electronic parts may be stopped in a state where the lead parts of the electronic parts are in contact with the wall surface while being pressed against the wall surface in the traveling direction by the inertial action due to its own weight. In this state, in the inspection device that uses the reflected light from the optical illumination device, the reflected light from the lead and the reflected light from the wall surface are mixed together, which causes a large malfunction and misrecognition. .

Further, the carrier tape 1 is wound around a reel 5 after insertion of electronic components, inspection, and adhesion of a cover tape.
It reaches the process of transportation. The reel 5 accommodating the electronic components during the transportation may receive various unexpected external forces such as an impact due to an unexpected drop and a vibration / impact due to movement. Due to this vibration / shock, electronic parts are used as carrier tape 1
There is a possibility that the lead portion may be contaminated or deformed by coming into contact with the wall surface or the bottom surface within the embossed portion 2. Further, in the conventional embossed portion 2 having the shape shown in FIG. 9, the embossed portion 2 is deformed due to an unexpected impact, which may lead to deformation or damage of the lead portion of the electronic component.

Further, as for the carrier tape 1, a method of forming the embossed portion 2 on a flexible resin material (sheet-like material) later is generally used. In the molding of the embossed portion 2, the molding residual stress generated at the time of molding is concentrated on the corners of the embossed portion, which causes a phenomenon that the flange portion 3 is deformed into a convex shape. This convex deformation is the carrier tape 1
When the cover tape is peeled off to take out the electronic component from the device, the peel strength of the cover tape is increased, and the peeling speed of the cover tape cannot be increased to cause breakage of the cover tape. It is not preferable because it swings on the mounting machine and improves the mounting efficiency of electronic components.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in consideration of the above points, and reduces the vibration and swing in the embossed portion of the inserted electronic component, and also varies the peel strength of the cover tape. It is an object of the present invention to provide a carrier tape for electronic parts which is reduced.

[0007]

According to the present invention, there is provided a carrier tape for electronic parts, which has embossed parts for storing electronic parts arranged at regular intervals in a longitudinal direction of a flexible tape-like object. Of the side walls to be formed, each of the first and third side walls located on both sides in the longitudinal direction has a pair of projections A for preventing the rolling of the electronic component body facing inward of the embossed portion. The protrusion A is a carrier tape for electronic components, which has a plurality of second protrusions B for preventing vertical pitching of a plurality of electronic component bodies having different shapes. In a preferred embodiment of the present invention, the distance between the pair of protrusions A (AA in FIG. 4) is 1 from the center of the embossed portion in the direction perpendicular to the longitudinal direction of the electronic component carrier tape of the electronic component to be inserted. At a distance of / 2 (e in FIG. 4), the protrusion A having a dimension larger by 0.05 mm to 0.5 mm than the longitudinal dimension of the electronic component carrier tape of the electronic component and preventing the electronic component from rolling. The wall surface to be formed has an angle of 3 to 45 ° with respect to the direction orthogonal to the longitudinal direction, and the distance between the vertices of the protrusion A in the direction orthogonal to the longitudinal direction (At-At in FIG. 4) is the electronic component lead portion. The outer distance (Y in FIG. 4) is 0.05 mm to 2 mm larger. As a further preferred embodiment of the present invention, the shortest distance dimension between the two protrusions B in the direction orthogonal to the longitudinal direction of the electronic component carrier tape, and the dimension of the inserted electronic component in the direction orthogonal to the longitudinal direction. Difference (B- in FIG. 8)
E) is 0.1 mm to 1 mm, and the difference between the distance between the vertices (At-At in FIG. 4) of the protrusion A in the direction orthogonal to the longitudinal direction and the outer distance (Y in FIG. 4) of the electronic component lead portion ( It has a size smaller than (At-At) -Y) in FIG. Still another preferred embodiment of the present invention is the carrier tape for electronic parts, further having two or more central ridges in a direction orthogonal to the longitudinal direction on the bottom surface forming the embossed portion.

[0008]

According to the present invention, the protrusions A arranged at intervals corresponding to the size of the electronic component housed in the embossed portion prevent the body of the electronic component from rolling laterally, so that it can be transported. It is possible to prevent the electronic parts from moving in the longitudinal direction at the time, prevent the contact between the lead portion and the side wall, and prevent the lead portion from being soiled or damaged, and erroneous recognition and malfunction of the inspection device at the time of inspection. In addition, a plurality of protrusions B arranged between the protrusions A prevent vertical movement of the body of the electronic component, so
It is possible to prevent the electronic component from moving in a direction perpendicular to the longitudinal direction during transportation, prevent contact with the side wall of the lead portion, and prevent contamination and damage of the lead portion. Also, the protrusion A and the protrusion B
By forming, it is possible to disperse and reduce the molding residual stress generated when the embossed portion is formed on the flexible resin material sheet. In addition, the bottom of the embossed portion is supported on the bottom of the main body of the electronic component by two or more central ridges provided in the direction orthogonal to the longitudinal direction to prevent the electronic component from shaking during transportation. It is possible to prevent the lead part from becoming dirty and damaged. Furthermore, this central ridge receives the external force at the bottom of the electronic component when an unexpected external force is applied from above the electronic component, and reduces the force applied to the lead portion to minimize damage and deformation of the lead portion. Can be done.

Embodiments of the present invention will be described in detail below with reference to the drawings. (1) First Embodiment A carrier tape 1 is shown in FIGS.
(Small Outline Package), SSOP (Shrink Small Outl
ine Package), TSOP (Thin SmallOutline Packag
e), TSSOP (Thin Shrink Small Outline Package)
Alternatively, the embossed portion 2 is formed so as to accommodate a plurality of IC packages such as PLCC (Plastic Leaded Chip Carrier). This carrier tape 1 has an embossed portion 2
Of the side walls of the, the first and third side walls located in the longitudinal direction each have two protrusions A: 6 formed, and the bottom of the embossed portion 2 has two central portions in the direction orthogonal to the longitudinal direction. The ridge 8 is formed.

As shown in FIG. 4, the interval AA between the pair of projections A: 6 is 1/2 of the dimension from the center of the embossed portion in the direction orthogonal to the longitudinal direction of the electronic component carrier tape of the electronic component to be inserted. From the longitudinal dimension of the electronic component carrier tape of the electronic component at the position of the distance e of
It is preferable to have a size larger by 0.5 mm. 0.05m
If it is less than m, there is a possibility that the electronic component cannot be inserted due to dimensional variation, and if it exceeds 0.5 mm, the electronic component tends to move due to vibration. The projection A: 6 is shown in FIG.
As shown in, the distance between the vertices in the direction orthogonal to the longitudinal direction At
-At is 0.05 than the outer distance Y of the electronic component lead portion.
It is preferable to have a size larger by mm to 2 mm. 0.
If it is less than 05 mm, it may not be possible to insert the electronic component due to dimensional variation, and if it exceeds 2 mm, the electronic component may be easily moved due to vibration. Further, it is preferable that the wall surface of the protrusion A: 6 that prevents the electronic component from rolling laterally has an angle of 3 to 45 ° with respect to the direction orthogonal to the longitudinal direction.
If it is less than 3 °, it becomes difficult to insert the electronic component because the wall surface of the projection A: 6 and the body of the electronic component come into contact with each other face-to-face, and if it exceeds 45 °, it is difficult to prevent the electronic component from rolling laterally. Moreover, the dispersion of the molding residual stress at the time of forming the embossed portion becomes insufficient.

In the above structure, as shown in FIGS. 1 to 3, the electronic component 9 housed in the embossed portion 2 has a projection A: 6.
The four corners are prevented from rolling laterally, and the lead portion 10 is separated from the second and fourth side walls of the embossed portion 2 by a predetermined distance even when the carrier tape 1 is vibrated by transportation or transportation. To be kept. Further, due to the uneven thickness of the bottom portion that the central portion becomes thicker when the embossed portion 2 is formed and processed, the bottom portion of the electronic component 9 has a shape close to a one-point support, and occurrence of wobbling has been observed. By providing the central ridges 8 at the two places, the bottom of the electronic component 9 is supported at these two places, so that the shaking of the carrier tape 1 due to the vibration is reduced, and the collision between the lead portion 10 and the bottom portion of the embossed portion 2 is reduced. Further, even when an unexpected external force acts from above the electronic component 9, the external force does not directly act on the lead portion 10 but acts on the electronic component 9 main body.

Further, among the side walls of the embossed portion 2, a pair of protrusions A: 6 are formed on the first and third side walls in the longitudinal direction of the carrier tape.
As shown in Fig. 13, when the embossed portion 2 was formed, the molding residual stress was concentrated on the corners of the embossed portion 2, and the flange portion 3 was corrugated greatly at the intervals of the embossed portion 2, but as shown in Fig. 13, Molding residual stress is distributed to the protrusion A: 6 part,
The amount of waviness of the flange portion 3 is reduced.

(2) Second Embodiment As shown in FIGS. 5 to 7, a pair of side walls of the embossed portion 2 are provided on each of the first and third side walls located in the longitudinal direction of the carrier tape. It is the same as the first embodiment except that two protrusions B: 7 are formed between the protrusions A: 6. The protrusion B: 7 does not protrude from the protrusion A: 6 in the direction orthogonal to the longitudinal direction of the carrier tape, and is formed so as to prevent the end face of the electronic component 9 from vertically swinging.

The shortest distance dimension (B) in the direction orthogonal to the longitudinal direction of the carrier tape between the two protrusions B: 7 is 0 from the dimension (E) in the direction orthogonal to the longitudinal direction of the electronic component to be inserted. It is preferably larger by 1 mm to 1 mm.
If it is less than 0.1 mm, there is a possibility that the electronic component cannot be inserted due to dimensional variation, and if it exceeds 1 mm, the electronic component tends to move due to vibration, and the electronic component within the embossed portion tends to rotate. As for the protrusion B: 7, as shown in FIG. 8, the difference between the dimension B and the dimension E is the distance between the vertices (At-At in FIG. 4) in the direction orthogonal to the longitudinal direction of the protrusion A: 6 and the electron. It is preferable to have a size smaller than the difference ((At-At) -Y in FIG. 8) from the outer distance (Y in FIG. 4) of the component lead portion. When the former (BE) exceeds the latter ((At-At) -Y), the lead portion comes into contact with the protrusion A and is easily contaminated.

In the above structure, as shown in FIG. 5, the electronic component 9 housed in the embossed portion 2 is prevented from rolling at four positions by the projection A: 6, and the electronic component 9 is further protected by the projection B: 7. The vertical vibration of the body itself is prevented.
As a result, when the carrier tape 1 is vibrated by transportation / transportation, the rotational force of the electronic component 9 attempting to rotate in the horizontal direction is suppressed as compared with the case where the projection B: 7 is not provided, and the electronic component 9 is prevented. The retentivity is improved. Further, since the additional protrusion B: 7 is formed on the first and third side walls in the longitudinal direction of the carrier tape among the side walls of the embossed portion 2, when the embossed portion 2 is formed as shown in FIG. The molding residual stress generated is further dispersed by the portion of the protrusion B: 7, and the corrugation of the flange portion 3 is reduced as compared with the first embodiment.

[0016]

According to the present invention, the lead portion of an electronic component can be prevented from being soiled, deformed or damaged, and the electronic component inspection device can be erroneously recognized or
Carrier for electronic parts that prevents malfunctions, reduces peeling strength fluctuations when peeling covers and tapes, and has excellent holding and protection functions for electronic parts, optical inspection properties when inserting electronic parts, and mounting workability during surface mounting. The tape can be realized.

[Brief description of drawings]

FIG. 1 is a plan view showing a carrier tape according to a first embodiment of the present invention.

FIG. 2 is a longitudinal sectional view of a carrier tape according to a first embodiment of the present invention.

FIG. 3 is a cross-sectional view of the carrier tape of the first embodiment of the present invention in a direction orthogonal to the longitudinal direction.

FIG. 4 is a partially enlarged view of FIG.

FIG. 5 is a plan view showing a carrier tape according to a second embodiment of the present invention.

FIG. 6 is a longitudinal sectional view of a carrier tape according to a second embodiment of the present invention.

FIG. 7 is a sectional view of a carrier tape according to a second embodiment of the present invention in a direction orthogonal to the longitudinal direction.

FIG. 8 is a partially enlarged view of FIG.

FIG. 9 is a perspective view of a conventional carrier tape for electronic parts.

FIG. 10: Electronic component insertion of carrier tape for electronic components,
Schematic of electronic parts optical inspection and cover tape bonding process

FIG. 11 is a schematic view of intermittent feeding of a carrier tape for electronic parts.

FIG. 12 is a schematic view of a molding residual stress and a waving phenomenon of a flange portion in a conventional carrier tape for electronic parts.

FIG. 13 is a schematic view of the molding residual stress and the corrugation phenomenon of the flange portion in the carrier tape according to the first embodiment of the present invention.

FIG. 14 is a schematic view of a molding residual stress and a waving phenomenon of a flange portion in the carrier tape according to the second embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Carrier tape 2 Recessed part (embossed part) 3 Flange part 4 Feed hole 5 Reel 6 Protrusion A 7 Protrusion B 8 Central protrusion 9 Electronic component body 10 Lead part 11 Residual stress line 12 Flange portion 13 Wavy flange 13 Cover tape 14 Electronic component insertion part 15 Electronic component optical inspection section 16 Cover tape adhesive section S At the start of electronic component insertion i First feed ii Second feed iii Third feed iv Fourth feed v Fifth feed IP: Electronic component insertion position x: Electronic Longitudinal direction e of the component carrier tape: 1 in the dimension of the electronic component in the direction orthogonal to the x direction
/ 2 distance A-A: distance between the pair of protrusions A at a position away from the center of the embossed portion by a distance e (x direction)) At-At: distance Y between the vertices of the protrusions A in a direction orthogonal to the x direction: Outer distance BE of the electronic component lead portion: difference between the shortest distance dimension between the two protrusions B in the direction orthogonal to the x direction and the dimension of the inserted electronic component in the direction orthogonal to the x direction (At-At). ) -Y: Difference between At-At and Y

Claims (2)

(57) [Claims] 1. A carrier tape for an electronic component having an embossed portion for storing an electronic component arranged at a constant interval in a longitudinal direction of a flexible tape-like object, wherein the long side is formed in a side wall forming the embossed portion. have a pair of collision force a directed to each of the first and third side walls positioned on opposite sides in the embossed portions inwardly, the distance between the pair of protrusions a (in FIG. 4 a
-A) is the voltage of the electronic component to be inserted from the center of the embossed part.
Dimension in the direction orthogonal to the longitudinal direction of the carrier tape for child parts
At the position of 1/2 distance (e in FIG. 4) in the method, the electronic part
From the longitudinal dimension of the carrier tape for electronic parts of the product.
It has a large size of 05 mm to 0.5 mm, and is next to electronic parts.
The wall surface forming the protrusion A for preventing shaking is in the above-mentioned longitudinal direction.
Has an angle of 3 to 45 ° with respect to the orthogonal direction, and
Distance between the vertices of the protrusion A in the direction orthogonal to the longitudinal direction (in FIG. 4)
At-At is the outer distance of the electronic component lead portion (in FIG. 4).
A carrier tape for electronic parts, which has a size larger than Y) by 0.05 mm to 2 mm . 2. A carrier tape for electronic parts, which has embossed parts for storing electronic parts arranged at regular intervals in a longitudinal direction of a flexible tape-like object, wherein the long side is formed in a side wall forming the embossed part. To the inner side of the embossed portion on each of the first and third side walls located on both sides in the direction.
Insert the space (A-A in Fig. 4) from the center of the embossed part.
Direction of carrier tape for electronic parts of electronic parts
1/2 the distance in the direction perpendicular to
At the position of e), the electronic component carrier tape
0.05 mm to 0.5 mm larger than the longitudinal dimension
And the wall surface forming the projection A is orthogonal to the longitudinal direction.
Has an angle of 3 to 45 ° with respect to
The distance between the vertices of the protrusion A in the direction orthogonal to the direction (At- in FIG.
At) is from the outer distance of the electronic component lead portion (Y in FIG. 4)
Also has a protrusion A with a size larger by 0.05 mm to 2 mm.
And, and a plurality of impact force B that different from the protrusions A therebetween
It has a longitudinal electronic component carrier tape of the projection B
The shortest distance dimension in the direction orthogonal to the direction and the inserted electron
Difference between the dimension of the component in the direction orthogonal to the longitudinal direction (see FIG. 8).
Medium B-E) is 0.1 mm to 1 mm, and the above-mentioned protrusion A is
Distance between vertices in a direction orthogonal to the longitudinal direction (At-A in FIG. 4)
difference between t) and the outer distance (Y in FIG. 4) between the electronic component lead part
(In FIG. 8 (At-At) -Y) electronic component carrier tape, wherein the this <br/> with smaller dimensions.