JP3496007B2 - Polishing apparatus and method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus and method, and more particularly, to a polishing object such as a semiconductor wafer which is carried into a polishing section, polished, and then cleaned in a cleaning section to carry out a clean polishing object. An apparatus and a method.

[0002]

2. Description of the Related Art In recent years, as the degree of integration of semiconductor devices has increased, circuit wiring has become finer and the distance between wirings has become smaller. In particular, in the case of optical lithography of 0.5 μm or less, the depth of focus becomes shallow, so that the flatness of the image plane of the stepper is required. Therefore, it is necessary to flatten the surface of the semiconductor wafer. As one means of this flattening method, polishing is performed by a polishing device.

Most of conventional polishing apparatuses perform only polishing alone. Therefore, when cleaning is performed after polishing, it is necessary to transfer it from the polishing device to the cleaning device, and when polishing is performed again under different polishing conditions, it is necessary to transfer it from the polishing device to another polishing device. . These transportations have been performed manually by keeping them in water to prevent the wafers from being dried during the transportation.
However, in this way each device is provided independently,
Further, since the transportation during that time is carried out in water, there is a problem that it is difficult to install a polishing device, a cleaning device and the like in a clean room and to fully automate the process.

In order to solve these problems, a polishing apparatus has been developed in which the polishing section and the cleaning section are housed in the same package. In addition, there is a possibility that a plurality of polishing sections may be housed in the same package, if necessary.

[0005]

As described above, in the polishing apparatus in which the polishing section and the cleaning section are integrated, and the polishing apparatus in which a plurality of polishing sections are housed in the same package, the polishing apparatus is In order to increase the processing speed as a whole, as is conventionally adopted in semiconductor manufacturing processes other than polishing equipment, for example, etching and chemical vapor deposition (CVD) equipment,
It is conceivable to unitize each function and use a general-purpose transfer robot, that is, to adopt a so-called cluster structure.

However, when the cluster structure is adopted in the polishing apparatus as described above, that is, when each function is unitized and is transferred by a general-purpose transfer robot, the polishing apparatus uses the polished semiconductor wafer. Is in a dirty and wet state due to abrasive liquid or polishing debris, etc., while the loading section and the unloading section are in a clean and dry state, so it is necessary to transfer and handle semiconductor wafers in different states. Become. Therefore, a single robot and an arm like a robot in a cluster structure of another conventional semiconductor manufacturing process apparatus, or a robot in which there are only a plurality of robots and dirty and clean are not used properly because only the reach and arrangement are necessary. With the arm and arm, sufficient transport and handling in the polishing device cannot be performed, and if it is applied as it is, the cleaning and drying steps of the robot and arm must be added as necessary, and the processing capacity is increased. There is a possibility that problems such as decrease in

Further, when the robot or arm after handling a dirty semiconductor wafer in the polishing apparatus is left as it is for a long time, solid particles such as abrasive grains and polishing debris in the polishing slurry are dried and fixed, This may cause reverse contamination of the semiconductor wafer at the next polishing and contamination in the polishing apparatus.

The present invention has been made in view of the above circumstances, and it is possible to employ a cluster structure in which a plurality of functions are integrated, and a means for handling a polishing object such as a clean semiconductor wafer and a dirty polishing. It is an object of the present invention to provide a polishing apparatus and a method which individually have a means for handling an object.

[0009]

In order to achieve the above-mentioned object, one embodiment of a polishing apparatus of the present invention is a polishing apparatus for carrying in a polishing object, polishing it, and then cleaning it, and carrying out a clean polishing object. And a robot carrying a polishing object; a loading part for placing a polishing object to be polished, the loading part being located within the reach of the robot; the polishing carried from the loading part At least one polishing unit for polishing an object; at least one cleaning unit for cleaning a polishing target object after polishing; an unloading unit for mounting a clean polishing target object after cleaning, which is gripped by the robot And an unloading unit arranged in the reach of the arm; the polishing unit is configured to clean the pouring unit transferred from the loading unit. A turntable for polishing a load position for placing the ashing object, the polishing object located adjacent to said loading position,
A cleaning head supporting arm for transferring a polishing object from the load position onto the turntable; a cleaning unit for primary cleaning of a dirty polishing object; and a primary cleaning station for the cleaning unit. polishing the object with the a secondary cleaning station to the secondary wash; the wash
The cleaning unit is configured to be able to dry the polishing target after cleaning
The robot is capable of transporting a clean polishing object from the secondary cleaning station to the unloading unit .

According to another aspect of the polishing apparatus of the present invention,
A polishing apparatus for carrying in a polishing object, polishing it, and then cleaning it, and carrying out a clean polishing object; a robot having a gripping arm for transporting the polishing object in the polishing apparatus; At least one for polishing a polished object
And a gripping arm for carrying only a clean polishing object and a gripping arm for carrying a dirty polishing object. It is characterized by having. Here, a cleaning mechanism is provided for cleaning the gripping arm that conveys the dirty polishing object.

According to another aspect of the polishing apparatus of the present invention,
A polishing device that carries in a polishing object, polishes it, and then cleans it, and then carries out a clean polishing object; a dedicated arm for cleaning that carries only a clean polishing object and a dedicated dirt that carries a dirty polishing object A robot having an arm; at least one polishing section for polishing a polishing object conveyed from the load section; at least one cleaning section for cleaning the polishing object after polishing; the polishing section includes the robot And a turntable for adhering a clean polishing object conveyed through the clean dedicated arm to the polishing position, and a turntable installed adjacent to the load position for polishing the polishing object; Is a primary cleaning tool for dirty polishing objects. A cleaning station and a secondary cleaning station for secondary cleaning of the polishing object that has been primarily cleaned in the primary cleaning station are provided; the clean-dedicated arm of the robot cleans the clean polishing object cleaned in the cleaning unit. It is possible to convey from the cleaning unit, and the dirty dedicated arm can convey a dirty polishing object from the polishing unit to the cleaning unit.

Another aspect of the polishing apparatus of the present invention is
A polishing apparatus for carrying in a polishing object, polishing it, and then cleaning it, and carrying out a clean polishing object; a robot having a gripping arm for transporting the polishing object in the polishing apparatus; polishing to be polished A load unit for placing an object; at least one polishing unit for polishing the polishing target object conveyed from the load unit; at least one cleaning unit for cleaning the polishing target object after polishing; cleaning after cleaning And an unloading unit for placing a polishing object thereon; the two robots are installed, and the gripping arm of one robot can reach both the loading unit and the unloading unit. The arm conveys only the clean polishing object, while the gripping arm of the other robot is dirty. Characterized in that an object can be conveyed. Here, a cleaning mechanism for cleaning the robot carrying the dirty polishing target object is provided. Also, adjacent to the loading section and the unloading section,
A stocker for stocking a polishing object requiring polishing and a polishing object that has been polished is arranged.

One aspect of the polishing method of the present invention is a polishing method in which a polishing object is carried into a polishing apparatus, polished and then washed, and a clean polishing object is carried out from the polishing apparatus;
A transfer step of transferring the polishing object by a robot having a gripping arm and transferring the polishing object in the polishing apparatus; at least one polishing step of polishing the polishing object transferred by the robot; At least one cleaning step for cleaning a subsequent polishing object; the robot includes a clean-dedicated gripping arm that conveys only a clean polishing object and a dirty-dedicated gripping arm that conveys a dirty polishing object. It is characterized in that the polishing target to be polished in the polishing step is conveyed by the clean-dedicated gripping arm. Here, a cleaning mechanism for cleaning the dirty gripping arm that conveys the dirty polishing object is provided.

Another aspect of the polishing method of the present invention is
In a polishing method in which a polishing object is carried into a polishing device, polished and then washed, and a clean polishing object is carried out from the polishing device,
The polishing apparatus includes a first robot and a second robot, and the first robot mounts a loading unit on which a polishing target object to be polished is mounted and a clean polishing target object after cleaning. The second robot is provided with a clean gripping arm that conveys only a clean polishing object, and the second robot is equipped with a dirty gripping arm that conveys a dirty polishing object; A polishing step of polishing the polishing object conveyed from the section; a conveying step of conveying the dirty polishing object after polishing by the dirty gripping arm; and a polishing step of conveying the polishing object conveyed after polishing. A cleaning step for cleaning; a cleaning process after cleaning on the unloading part on which a clean polishing object after cleaning is placed. The a polishing object, characterized by comprising a conveying step of conveying by the clean gripping arm. Here, a step of cleaning the dirty gripping arm is provided.

One aspect of the method for manufacturing a semiconductor device of the present invention is to manufacture a semiconductor device by carrying in a semiconductor wafer into a polishing apparatus, polishing and then cleaning, and carrying out a clean semiconductor wafer from the polishing apparatus. A transporting step of transporting the semiconductor wafer by a robot having a gripping arm and transporting the semiconductor wafer in the polishing apparatus; and at least one polishing step of polishing the semiconductor wafer transported by the robot. At least one for cleaning the semiconductor wafer after polishing
The robot includes a clean-dedicated gripping arm that conveys only clean semiconductor wafers and a dirty-dedicated gripping arm that conveys dirty semiconductor wafers, and conveys the semiconductor wafer to be polished in the polishing step. Is performed by the clean-dedicated gripping arm.

In another aspect of the method for manufacturing a semiconductor device of the present invention, a semiconductor wafer is loaded into a polishing apparatus, polished, and then washed, and a clean semiconductor wafer is unloaded from the polishing apparatus to remove the semiconductor device. In the manufacturing method, the polishing apparatus includes a first robot and a second robot, and the first robot includes:
A clean gripping arm that conveys only a clean semiconductor wafer, which can reach both a load section for mounting a semiconductor wafer to be polished and an unload section for mounting a clean semiconductor wafer after cleaning, The second robot
A dirty gripping arm for transporting a dirty semiconductor wafer; a polishing step for polishing the semiconductor wafer transported from the load section; a transport for transporting the dirty semiconductor wafer by the dirty gripping arm to clean the dirty semiconductor wafer after polishing And a cleaning step for cleaning the semiconductor wafer conveyed after polishing; and a clean semiconductor wafer after cleaning is conveyed by the clean gripping arm to an unloading section for mounting a clean semiconductor wafer after cleaning. And a transfer step .

[0017]

[0018]

[0019]

[0020]

A preferred embodiment of the present invention is a polishing apparatus which carries in a polishing object, polishes it, and then cleans it out, and carries out a clean polishing object. A general-purpose transfer robot that conveys and transfers each part to each part, a load part that is arranged around the general-purpose transfer robot and that places a polishing object to be polished,
At least one polishing unit for polishing the polishing target carried in from the load unit, at least one cleaning unit for cleaning the polishing target after polishing, and unloading for mounting the clean polishing target after cleaning. And a dedicated transport mechanism for transporting and delivering a polishing object between two adjacent parts, the general-purpose transport robot transports a clean polishing object, and the dedicated transport mechanism is a dirty polishing object. It is characterized by conveying an object.

A preferred embodiment of the present invention is a polishing apparatus for carrying in a polishing object, polishing it, and then cleaning it, and carrying out a clean polishing object.
A general-purpose transport robot that has a gripping arm and transports a polishing object in the polishing apparatus and transfers it to each part.
A load unit disposed around the general-purpose transfer robot around which a polishing object to be polished is placed, at least one polishing unit that polishes the polishing object carried in from the load unit, and after polishing Of at least one cleaning unit for cleaning the polishing target object, and an unloading unit for mounting a clean polishing target object after cleaning, and the general-purpose transfer robot transfers a clean polishing target object only. And a gripping arm that conveys only a dirty polishing object.

Further, a preferred embodiment of the present invention is a polishing apparatus which carries in a polishing object, polishes it, and then cleans it out, and carries out a clean polishing object. A general-purpose transport robot that conveys an object and transfers it to each unit, a load unit that is arranged around the general-purpose transport robot and has a polishing object to be polished, and a polishing unit that is loaded from the load unit. At least one polishing section for polishing the object, and at least one cleaning section for cleaning the polishing object after polishing;
An unloading unit for mounting a clean polishing target after cleaning is provided, and two general-purpose transfer robots are installed, and one general-purpose transfer robot transfers only a clean polishing target and the other general-purpose transfer robot is used. The transfer robot is characterized in that it only transfers dirty polishing objects.

According to the present invention, the loading section, the unloading section, the polishing section and the cleaning section are arranged around the general-purpose transfer robot. The clean polishing object placed on the loading unit is picked by one general-purpose transfer robot, loaded into the polishing unit, and then polished by the polishing unit. The dirty object to be polished after polishing is transferred to the cleaning unit by a dedicated transport mechanism installed between the polishing unit and the cleaning unit, and is cleaned in the cleaning unit. The clean object to be cleaned and dried is placed on the unload section by the general-purpose transfer robot again.

Further, according to the present invention, the loading section, the unloading section, the polishing section and the cleaning section are arranged around the general-purpose transfer robot. The clean polishing object placed on the load unit is picked by the clean exclusive gripping arm of the general-purpose transfer robot, loaded into the polishing unit, and then polished by the polishing unit. The dirty object to be polished, which has been polished, is transferred to the cleaning section by the dirty dedicated gripping arm of the general-purpose transfer robot and is cleaned in the cleaning section. The clean object to be cleaned and dried is placed on the unloading section again by the clean exclusive gripping arm of the general-purpose transport robot.

According to the present invention, the loading section, the unloading section, the polishing section and the cleaning section are arranged around the general-purpose transfer robot. A clean polishing target object placed on the load unit is picked by a general-purpose transport robot dedicated to clean, loaded into the polishing unit, and then polished by the polishing unit. The dirty polishing target object that has been polished is transferred to a cleaning unit by a general-purpose transfer robot dedicated to dirtying, and is cleaned in the cleaning unit. The clean semiconductor wafer that has been washed and dried is placed on the unload section again by the general-purpose transfer robot dedicated to clean.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a polishing apparatus according to the present invention will be described below with reference to the drawings. In the following embodiments, a semiconductor wafer will be described as an example of an object to be polished. (First Embodiment) FIG. 1 shows a first polishing apparatus according to the present invention.
It is a figure which shows the structure of an Example. This polishing device is
A center robot 10 constituting a general-purpose transfer robot is provided in the central portion, and the arm 10 is provided around the center robot 10.
Within the reach range of -1, a loading unit 11 for mounting a semiconductor wafer S requiring polishing, an unloading unit 12 for mounting a semiconductor wafer that has been polished, polishing units 13, 14 for polishing the semiconductor wafer S, A cleaning unit 15 for cleaning the semiconductor wafer S is provided.

The polishing parts 13 and 14 have polishing head supporting arms 13-3 and 14-3 and turntables 13-4 and 14-4, respectively, and the polishing head supporting arms 13-3 and 14-3 are topped. A ring (described later) is rotatably provided. The polishing head supporting arms 13-3 and 14-3 respectively load the semiconductor wafer S onto the load positions 13-1 and 14-1 of the polishing sections.
To the turntables 13-4 and 14-4 are configured as a dedicated transport mechanism. Further, the polishing head support arms 13-3 and 14-3 respectively correspond to the semiconductor wafer S.
A dedicated transport mechanism for transporting from the polishing section 13, 14 to the cleaning section 15 is configured. In addition, 16 and 17 are polishing parts 13 and 14
Is a dressing tool mounting table on which a dressing tool (brush-shaped tool) for dressing (grinding) the polishing cloth (cloth) attached to the turntables 13-4 and 14-4 is mounted.

In the polishing apparatus arranged as described above, the semiconductor wafer S mounted on the load section 11 and requiring polishing is picked (vacuum suction) by the loading gripping arm 10-1 of the center robot 10.
Then, after the polishing surface is turned upside down, it is transferred to the load position 13-1 of the polishing section 13. The polishing head support arm 13-3 of the polishing section 13 chucks (sucks) the semiconductor wafer S with a top ring provided at its tip, and the polishing surface of the semiconductor wafer S is rotated on the upper surface of the table 13-4. And the surface of the semiconductor wafer S is polished. At this time, the top ring itself rotates around its axis and also swings on the turntable 13-4 by the polishing head support arm 13-3.

The semiconductor wafer S for which polishing has been completed is transferred to the loading position 15-1 of the cleaning section 15 by the polishing head support arm 13-3. The polishing head support arm 13-3 having released the semiconductor wafer S at the loading position 15-1 chucks the dressing tool 16-1 on the dressing tool mounting table 16 and pushes the dressing tool 16-1 on the turntable 13-4. Dress the pad polishing cloth (cloth). However, this dressing may be provided with a dedicated dressing mechanism as described later (see FIGS. 2 and 3).

The semiconductor wafer S transferred to the load position 14-1 of the polishing section 14 by the loading arm 10-1 of the center robot 10 is also chucked and rotated by the top ring of the polishing head support arm 14-3. It is pressed against the upper surface of the rotating turntable 14-4 and polished. The semiconductor wafer S after polishing is loaded at the loading position 15-2 of the cleaning unit 15.
Be transferred to. Further, the polishing head support arm 1 which has released the semiconductor wafer S at the loading position 15-2
4-3 chucks the dressing tool 17-1 on the dressing tool mounting table 17 and turns the turntable 1
The dressing tool 17-1 is pressed against 4-4 to dress the polishing cloth (cloth).

The loading position 15-1 of the cleaning unit 15,
The semiconductor wafer S transferred to 15-2 is subjected to primary cleaning and secondary cleaning in the cleaning unit 15, and then transferred to the unloading position 15-3. Unloading position 15-3
The semiconductor wafer S transferred to the
It is transferred to the unloading section 12 by the unloading dedicated gripping arm 10-2. All the above operations are performed automatically. Hereinafter, details of the polishing unit 14 and the cleaning unit 15 will be described.

FIG. 2 (a) is a partial plan view showing the structure of the polishing apparatus of the present invention, FIG. 2 (b) is a view showing the upper stage portion of the cleaning mechanism 15, and FIG. 3 is A1 of FIG. 2 (a). 2 is a view showing a cross section taken along line A2-A, FIG. 4 is a view showing a cross section taken along B1-B2 of FIG. 2 (a), FIG. 5 is a view showing a cross section taken along C1-C2-C3-D1 of FIG. 2 (a), and FIG. It is a figure which shows the D1-D2 cross section of (a). 2 to 6 are views for explaining the first embodiment similarly to FIG. 1, but in FIGS. 2 to 6, the dressing tool and the dressing tool mounting table are not provided, but the dressing mechanism 15-11 is separately provided. It shows the case. The semiconductor wafer S placed on the loading unit 11 is picked by the arm 10-1 of the center robot 10 and is inverted so that the polishing surface faces downward in the reversing mechanism 11-2. 14 load position 14-
Transferred to 1. As shown in FIG. 3, the semiconductor wafer S
Is chucked (vacuum suction) by a top ring 14-5 provided at the tip of the polishing head support arm 14-3, and is conveyed above the turntable 14-4.

Here, the top ring 14-5 descends and, as shown in FIG. 4, the turntable 14 is rotated by the motor 14-6 via the timing belt 14-7.
The semiconductor wafer S is pressed against the upper surface of -4 and polished. As shown in FIG. 5, the semiconductor wafer S for which polishing has been completed is loaded at the loading position 15-2 of the cleaning unit 15.
It is stored in the rinse cleaning container 15-4 which is waiting at the opening of, and rinsed with the rinse water. During this rinse cleaning, the opening of the loading position 15-2 is the lid 1
It will be closed at 5-5. Further, the top ring 14-5 having released the semiconductor wafer S is cleaned by a cleaning mechanism (not shown) at the loading position of the cleaning unit 15.

The rinse-cleaned semiconductor wafer S is transported as shown by the arrow a in FIG. 5 and reaches the reversing mechanism 15-6. Here, the surface polished by the positioning reversing mechanism 15-6 is sucked and reversed so as to face upward again, and is transferred to the primary cleaning station 15-7, where it is primarily cleaned with cleaning water (pure water). Subsequently, the semiconductor wafer S is picked up by the transfer robot 15-8 (see FIG. 6), transferred as shown by arrows b and c, and reaches the secondary cleaning station 15-9. The semiconductor wafer S is secondarily cleaned with cleaning water (pure water) at the secondary cleaning station 15-9.

The second-cleaned semiconductor wafer S is picked up by the unload-dedicated arm 10-2 of the center robot 10 and transferred as shown by arrows d and e in FIG.
It is placed on the unload unit 12 shown in FIG. In addition, 15
-11 is a dressing mechanism for dressing the polishing cloth (cloth) on the upper surface of the turntable 14-4,
As shown in FIG. 3, a rotary brush 15-12 is provided. It should be noted that the polishing sections 13 and 14 having the configurations shown in FIGS.
The configuration of the cleaning unit and the cleaning unit is an example, and the present invention is not limited to this.

The polishing apparatus of this embodiment comprises a central robot 10 having gripping arms 10-1 and 10-2, which constitutes a general-purpose transfer robot for transferring the semiconductor wafer S and transferring it to each section in the polishing apparatus. A load unit 11 which is arranged around the robot 10 and has a semiconductor wafer S to be polished mounted thereon, two polishing units 13 and 14 which polish the semiconductor wafer S carried in from the load unit 11, and a polishing unit A cleaning section 15 for cleaning the subsequent semiconductor wafer S, an unload section 12 for mounting the cleaned semiconductor wafer S, and a dedicated transfer mechanism for transferring and transferring the semiconductor wafer S between two adjacent sections. And the polishing head support arms 13-3 and 14-3 constituting the center robot 10 transfer the clean and dry semiconductor wafer S. , Polishing head support arm 1
3-3 and 14-3 are configured to carry a dirty and wet semiconductor wafer S.

The central robot 10 of the present embodiment has a load-dedicated arm 10-1 and an unload-dedicated arm 10-2.
It is preferably applied when the cleanness of the semiconductor wafer S carried in from the loading unit 11 and the cleanness of the semiconductor wafer S carried out to the unloading unit 12 are different.

(Second Embodiment) FIG. 7 is a diagram showing the structure of a second embodiment of the polishing apparatus of the present invention. In the figure, the parts denoted by the same reference numerals as in FIG. 1 indicate the same or corresponding parts. The present polishing apparatus has a loading unit 11, an unloading unit 12, polishing units 13 and 14, and a cleaning unit 15 for cleaning / drying in a hexagonal shape around the center robot 10 and within the reach of the arm of the center robot 10. Preliminary spaces 18 and 19 provided with anticipation of cases where further steps are required, and in which mechanisms and devices for performing those steps are arranged.
Is equipped with.

A thickness gauge for measuring the thickness of the semiconductor wafer is arranged in each of the preliminary spaces 18 and 19. In this case, the semiconductor wafer S is transferred to the center robot 10
Of the semiconductor wafer S before polishing by measuring the thickness of the semiconductor wafer S before polishing by grasping it by the arm 10-1 of the polishing unit 13 to the load position 13-1 of the polishing unit 13. Transfer. The semiconductor wafer S polished by the polishing unit 13 is cleaned by the cleaning unit 1 in the same manner as in the first embodiment.
After being transferred to No. 5 and washed there, it is guided again to the thickness gauge in the spare space 18 by the arm 10-1 of the center robot 10. Then, after measuring the thickness of the semiconductor wafer S after polishing with a thickness gauge, the semiconductor wafer is transferred to the unloading section 12 by the arm 10-2.

(Third Embodiment) FIG. 8 is a diagram showing the structure of a third embodiment of the polishing apparatus of the present invention. The polishing apparatus has a hexagonal shape around the center robot 10 and within the reach of the arm of the center robot 10, and has a loading unit 11, an unloading unit 12, and two polishing units 13, 1.
Three and one polishing unit 14, cleaning units 15 and 15 are provided between the polishing unit 13 and the polishing unit 13 and between the polishing unit 14 and the unloading unit 12, respectively. In this arrangement, the polishing process of the polishing unit 13 is the same as the polishing process of the polishing unit 14.
This is a suitable arrangement when double the time is required.

The transfer from the polishing parts 13, 13 to the cleaning part 15 and the transfer from the polishing part 14 to the cleaning part 15 are not performed by the central robot 10, but another transfer means (for example, polishing head supporting arms 13-3, 14-). 3), the loading of the semiconductor wafer on the polishing parts 13, 13, 14 and the picking up of the cleaned semiconductor wafer from the cleaning parts 15, 15 are carried out by the gripping arm of the central robot 10. That is, the center robot 10 does not handle the semiconductor wafer to which the slurry has adhered by polishing in the polishing parts 13, 13, 14 and prevents the gripping arm from being contaminated. This makes it possible to reduce contamination.

(Fourth Embodiment) FIG. 9 is a diagram showing the structure of a fourth embodiment of the polishing apparatus of the present invention, showing a polishing apparatus in the case where the center robot 10 has only one gripping arm 10-1. It is a figure which shows schematic structure. Figure 9
In FIG. 2, the parts designated by the same reference numerals as those in FIGS. In the case of having only one gripping arm 10-1 in this way, as shown in the figure, dedicated transport mechanisms are installed between the polishing units 13 and 14, and between the polishing units 13 and 14 and the cleaning unit 15, respectively. The present invention can be applied when the cleanliness of the semiconductor wafer S picked from the load unit 11 and the cleanliness of the semiconductor wafer S stored in the unload unit 12 are at the same level.

(Fifth Embodiment) FIG. 10 is a diagram showing the configuration of a fifth embodiment of the polishing apparatus of the present invention. The polishing apparatus has a hexagonal shape around the center robot 10 and within the reach of the gripping arm of the center robot 10, and has a loading unit 11, four polishing units 13, 14, 21, and 2.
2. The cleaning unit 15 is provided, and the unloading unit 12 is provided at the end of the cleaning unit 15. Further, the polishing apparatus includes a stocker 23 adjacent to the loading unit 11 and the unloading unit 12 for stocking the semiconductor wafers requiring polishing and the semiconductor wafers having been polished. Then, the semiconductor wafer whose polishing has been completed is carried out from the stocker 23, or the stocker 23
An automatic carrier 24 is installed for loading semiconductor wafers that require polishing.

Here, the polishing parts 13, 14, 21, 22 are
The central robot 10 is responsible for all the loading on the cleaning unit 15 and the picking from the loading unit 11 and the polishing units 13, 14, 21, 22. The center robot 10 includes a clean dedicated arm for holding a clean semiconductor wafer S and a dirty dedicated arm for holding a dirty semiconductor wafer S, and holds the clean semiconductor wafer S from the load unit 11 and polishes the polishing units 13, 14 ,. Two
Transporting to either 1 or 22 and cleaning in the cleaning unit 15,
The semiconductor wafer S, which has been dried, is transferred to the unloading section 12 by a clean-dedicated arm.
A dirty-only arm is used to carry between 21 and 22 and from the polishing section to the cleaning section 15. For example, when the center robot of FIG. 1 is used, the arm 10-1 is a clean-dedicated arm and the arm 10-2 is a dirty-dedicated arm. This makes it possible to minimize pollution.

The polishing apparatus of this embodiment comprises a central robot 10 having gripping arms 10-1 and 10-2, which constitutes a general-purpose transfer robot for transferring the semiconductor wafer S and transferring it to each part in the polishing apparatus. A load unit 11 which is arranged around the robot 10 and has a semiconductor wafer S to be polished placed thereon, and a polishing unit 1 which polishes the semiconductor wafer S carried in from the load unit 11
3, 14, 21, and 22, a cleaning unit 15 for cleaning the semiconductor wafer S after polishing, and an unloading unit 12 for mounting the clean semiconductor wafer S after cleaning. A clean dedicated arm 10-1 for carrying only the wafer S and a dirty dedicated arm 10-2 for carrying only the dirty semiconductor wafer S are provided.

The dirty dedicated arm 10-2 is cleaned by a cleaning mechanism (not shown) provided in the cleaning unit 15 after handling a dirty semiconductor wafer.

(Sixth Embodiment) FIG. 11 is a diagram showing the configuration of a sixth embodiment of the polishing apparatus of the present invention. In this embodiment, a general-purpose transfer robot 10A dedicated to clean semiconductor wafers and a general-purpose transfer robot 10B dedicated to dirty semiconductor wafers are separately provided. Further, in this embodiment, two polishing parts 13 and 14 and one cleaning part 15 are provided. The specific polishing procedure is as follows. First, a general-purpose transfer robot 10A dedicated to a clean semiconductor wafer receives the semiconductor wafer S, which is an object to be polished, from the load section 11 and transfers it to the load position 13- of the polishing section 13.
Place on 1.

After the polishing in the polishing section 13 is completed, the general-purpose transfer robot 10B dedicated to the dirty semiconductor wafer receives and transfers the semiconductor wafer S and places it on the loading position 15-1 of the cleaning section 15. After the cleaning in the cleaning unit 15 is completed, the general-purpose transfer robot 10A dedicated to the clean semiconductor wafer is moved to the unloading position 15- of the cleaning unit 15.
The semiconductor wafer S is received from 3, transferred, and placed on the unload unit 12. Through the above process, a series of polishing and cleaning is performed. When polishing is performed in the polishing section 14, polishing and cleaning are performed in the same process.

According to the polishing apparatus of this embodiment, both the polishing sections 13 and 14 perform polishing, and the cleaning section 15 cleans the semiconductor wafer polished by either polishing section, thereby It is possible to deal with one polishing section with one cleaning section. In particular, when the processing interval of the semiconductor wafer in the cleaning unit, that is, the interval from the start of one cleaning process to the start of the next wafer is shorter than the polishing time for one semiconductor wafer, cleaning is performed. Since there is no restriction due to the process and no waiting time occurs in the polishing process, the process can be made compact without slowing down, which is extremely effective.

Further, it is possible to set different polishing conditions for the polishing sections 13 and 14 and select a more suitable polishing section in accordance with the properties of the wafer to be polished. Further, with respect to the same semiconductor wafer, the polishing section 13 performs polishing, the cleaning section 15 performs cleaning, and then the polishing section 14
It is also possible to perform polishing twice on a single semiconductor wafer by performing polishing at 1 and cleaning at the cleaning unit 15. Incidentally, reference numerals 18 and 19 are spare spaces.

The polishing apparatus of this embodiment conveys a semiconductor wafer in the polishing apparatus and transfers it to each section.
General-purpose transfer robots 10A and 10B, two polishing units 13 and 14 arranged around the general-purpose transfer robots 10A and 10B for polishing the semiconductor wafer S to be polished, and the semiconductor wafer after polishing A cleaning unit 15 for cleaning S and an unloading unit 12 for mounting a clean semiconductor wafer S after cleaning are provided. One of the two general-purpose transfer robots, one general-purpose transfer robot 10A
Conveys only the clean semiconductor wafer S, while the general-purpose conveyance robot 10B conveys only the dirty semiconductor wafer S. The general-purpose transfer robot 10B is cleaned by a cleaning mechanism (not shown) provided in the cleaning unit 15 after handling a dirty semiconductor wafer.

By constructing the polishing apparatus as shown in the first to sixth embodiments, a plurality of polishing parts and cleaning parts for performing mechanical and chemical polishing of various steps on the semiconductor wafer are provided around the center robot. Because it will be placed
Since the entire device can be made compact, for example, by covering the entire device with a cover or the like and independently providing exhaust, the cleanliness does not decrease even if it is directly placed in a clean room, and the installation space is small in an expensive clean room. it can.

Although the loading section 11 and the unloading section 12 are separately arranged in the above embodiment, the loading section 11 and the unloading section 12 may be integrally arranged. For example, when the semiconductor wafers are picked from the basket that stores the semiconductor wafers that require polishing, and the semiconductor wafers are stored in the same basket after the polishing is completed (after the polishing and cleaning steps are completed), the configuration is integrated.

[0055]

As described above, according to the present invention, it is possible to construct a polishing apparatus having a cluster structure in which each function such as polishing and cleaning is unitized and a general-purpose transfer robot is used. From this, it is possible to achieve space saving and improvement in processing speed in a polishing device that performs a series of polishing including a cleaning step, and to make an efficient combination of each device such as a polishing unit and a cleaning unit, that is, polishing time. If the cleaning interval is longer than one cleaning part, one cleaning part should be used for multiple polishing parts, and if the polishing time is shorter than the cleaning interval, more cleaning parts should be used than the polishing part. Moreover, one or more polishing steps and cleaning steps can be fully automated, and changes in the steps can be easily dealt with.

Further, according to the present invention, since there is a means for separately handling a clean polishing object and a dirty polishing object, contamination of another polishing object caused by the dirty polishing object and a polishing apparatus. It is possible to prevent contamination inside.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing the configuration of a first embodiment of a polishing apparatus of the present invention.

FIG. 2A is a partial plan view showing the configuration of the polishing apparatus of the present invention, and FIG. 2B is a view showing the upper part of the cleaning mechanism 15.

FIG. 3 is a diagram showing a cross section taken along line A1-A2 of FIG.

FIG. 4 is a diagram showing a B1-B2 cross section of FIG.

5 is a diagram showing a C1-C2-C3-D1 cross section of FIG.

FIG. 6 is a diagram showing a cross section taken along line D1-D2 of FIG.

FIG. 7 is a schematic plan view showing the configuration of a second embodiment of the polishing apparatus of the present invention.

FIG. 8 is a schematic plan view showing the configuration of a third embodiment of the polishing apparatus of the present invention.

FIG. 9 is a schematic plan view showing the configuration of a fourth embodiment of the polishing apparatus of the present invention.

FIG. 10 is a schematic plan view showing the configuration of a fifth embodiment of the polishing apparatus of the present invention.

FIG. 11 is a schematic plan view showing the configuration of a sixth embodiment of the polishing apparatus of the present invention.

[Explanation of symbols]

10 center robot 11 Road section 12 Unloading section 13 Polishing part 14 Polishing part 15 Cleaning section 16 Dressing tool table 17 Dressing tool table 18 spare space 19 spare space 21 Polishing part 22 Polishing part 23 Stocker 24 Automatic guided vehicles S semiconductor wafer

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor, Hiromi Yajima, 72 Horikawa-cho, Sachi-ku, Kawasaki-shi, Kanagawa Stock, Toshiba Horikawa-cho factory (72) Inventor Masako Kodera 72, Horikawa-cho, Saiwai-ku, Kawasaki-shi, Kanagawa Company Toshiba Horikawa-cho Factory (72) Inventor Shiro Mishima 72 Horikawa-cho, Saiwai-ku, Kawasaki-shi, Kanagawa Stock Company Toshiba Horikawa-cho Factory (72) Inventor Atsushi Shigeta 72 Horikawa-cho, Kawasaki-shi, Kanagawa Prefecture Stock Company Toshiba Corporation Horikawa-cho Plant (72) Inventor Masayoshi Hirose 11-1 Haneda-Asahi-cho, Ota-ku, Tokyo Ebara Corporation (72) Inventor Norio Kimura 11-11 Haneda-Asahi-cho, Ota-ku, Tokyo Ebara Corporation In-house (72) Inventor Seiji Ishikawa 11-1 Haneda Asahi-cho, Ota-ku, Tokyo Incorporated EBARA CORPORATION (56) Reference JP-A-4-334025 (JP, A) Open flat 6-47657 (JP, A) (58 ) investigated the field (Int.Cl. ^7, DB name) H01L 21/304 B24B 37/04

Claims (13)

(57) [Claims] 1. A polishing apparatus which carries in a polishing object, polishes it after polishing, and carries out a clean polishing object; a robot for conveying the polishing object; and a polishing object to be polished. A loading unit to be placed, the loading unit being located within the reach of the robot; at least one polishing unit for polishing the polishing target carried from the loading unit; cleaning the polishing target after polishing At least one cleaning unit; and an unloading unit for placing a clean polishing object after cleaning, the unloading unit being located within the reach of the gripping arm of the robot; Adjacent to the load position where the clean polishing object conveyed from the load part is placed, The cleaning unit is provided with a turntable for polishing the polishing object and a polishing head support arm for transferring the polishing object from the load position onto the turntable; and the cleaning unit primarily cleans the dirty polishing object. A primary cleaning station and a secondary cleaning station for secondary cleaning of the polishing object that has been primarily cleaned by the primary cleaning station; the cleaning unit is configured to be able to dry the polishing object after cleaning; A robot is capable of transporting a clean polishing object from the secondary cleaning station to the unloading unit; a polishing device. 2. A polishing apparatus which carries in a polishing object, polishes it after polishing, and carries out a clean polishing object; and a robot having a gripping arm for conveying the polishing object in the polishing apparatus. The robot includes at least one polishing unit for polishing a polishing object conveyed by the robot; at least one cleaning unit for cleaning the polishing object after polishing; and the robot is a clean polishing object before or after polishing. A polishing apparatus comprising: a gripping arm that conveys only an object and a gripping arm that conveys a dirty object to be polished after polishing. 3. The polishing apparatus according to claim 2, further comprising a cleaning mechanism for cleaning a gripping arm that conveys a dirty polishing object. 4. A polishing device for carrying in a polishing object, polishing it, and then cleaning it, and then carrying out a clean polishing object; a dedicated arm for cleaning and a dirty polishing object for carrying only a clean polishing object. A robot having a dirty dedicated arm for transporting the object; at least one polishing section for polishing the polishing object transferred from the load section; and at least one cleaning section for cleaning the polishing object after polishing; The unit has a load position on which a clean polishing object conveyed through the clean exclusive arm of the robot is placed, and a turntable which is installed adjacent to the load position and polishes the polishing object. Included: The cleaning unit is a dirty polishing object And a secondary cleaning station for secondary cleaning of the polishing object that has been primarily cleaned by the primary cleaning station; the dedicated arm for clean of the robot is clean by the cleaning unit. A polishing object is capable of being transported from the cleaning unit, and the dirty dedicated arm is capable of transporting a dirty polishing target from the polishing unit to the cleaning unit. 5. A polishing apparatus which carries in a polishing object, polishes it after polishing, and carries out a clean polishing object; and a robot which has a gripping arm and conveys the polishing object in the polishing apparatus. A loading unit on which a polishing object to be polished is placed; at least one polishing unit for polishing the polishing target object conveyed from the loading unit; and at least one cleaning unit for cleaning the polishing target object after polishing An unloading unit for placing a clean polishing object after cleaning; two robots are installed, and the gripping arm of one robot can reach both the loading unit and the unloading unit. The gripping arm conveys only a clean polishing object before polishing or after cleaning, and in front of the other robot. The gripping arm is capable of carrying a dirty polishing object after polishing; a polishing device. 6. The polishing apparatus according to claim 5, further comprising a cleaning mechanism for cleaning the robot that conveys a dirty polishing object. 7. The stocker is arranged adjacent to the loading part and the unloading part, and a stocker for stocking a polishing object requiring polishing and a polishing object having been polished is stocked. Item 7. The polishing apparatus according to any one of items 1, 5 and 6. 8. A polishing method in which a polishing object is carried into a polishing apparatus, polished and then washed, and a clean polishing object is carried out of the polishing apparatus; a polishing arm is provided in the polishing apparatus. A carrying step of carrying the polishing object by a robot carrying the polishing object; at least one polishing step of polishing the polishing object carried by the robot; at least one cleaning step of the polishing object after the polishing The robot includes a clean-dedicated gripping arm that conveys only a clean polishing target before or after cleaning, and a dirty-dedicated gripping arm that conveys a dirty polishing target after polishing, Before polishing, which is polished in the polishing process Transport of the packaging object and performing by said clean only gripping arm; polishing method. 9. The polishing method according to claim 8, further comprising a cleaning mechanism for cleaning the dirty gripping arm that conveys a dirty polishing object. 10. A polishing method in which a polishing object is carried into a polishing apparatus, polished, and then washed, and a clean polishing object is carried out from the polishing apparatus, wherein the polishing apparatus includes a first robot and a second robot. And the first robot is capable of reaching both a load unit for mounting a polishing target object to be polished and an unloading unit for mounting a clean polishing target object after cleaning, Equipped with a clean gripping arm that conveys only clean polishing objects,
The second robot includes a dirty gripping arm that conveys a dirty polishing target; a polishing step of polishing the polishing target transferred from the load unit; and a cleaning of the dirty polishing target after polishing. And a cleaning step of cleaning the polishing object transferred after polishing; a cleaning step after cleaning on the unloading section for mounting a clean polishing object after cleaning. And a transport step of transporting a different polishing object by the clean gripping arm; a polishing method. 11. The polishing method according to claim 10, further comprising the step of cleaning the dirty gripping arm. 12. A method of manufacturing a semiconductor device by carrying a semiconductor wafer into a polishing apparatus, polishing and cleaning the semiconductor wafer, and then carrying out a clean semiconductor wafer from the polishing apparatus to manufacture a semiconductor device. A transfer step of transferring the semiconductor wafer by a robot that transfers the semiconductor wafer in the polishing apparatus; at least one polishing step of polishing the semiconductor wafer transferred by the robot; at least one step of cleaning the semiconductor wafer after polishing The robot includes a clean-dedicated gripping arm that conveys only a clean semiconductor wafer before or after polishing and a dirty-dedicated gripping arm that conveys a dirty semiconductor wafer after polishing. The semiconductor wafer before polishing, which is polished in the process, is transported only in the clean And performing by the arm; method of manufacturing a semiconductor device. 13. A method of manufacturing a semiconductor device, wherein a semiconductor wafer is loaded into a polishing apparatus, polished and then washed, and a clean semiconductor wafer is unloaded from the polishing apparatus to manufacture a semiconductor device. The robot includes a robot and a second robot, and the first robot can reach both a load unit for mounting a semiconductor wafer to be polished and an unload unit for mounting a clean semiconductor wafer after cleaning. And a clean gripping arm for carrying only clean semiconductor wafers, and the second robot has a dirty gripping arm for carrying dirty semiconductor wafers; a polishing step for polishing the semiconductor wafer carried from the loading unit And a carrying step of carrying by the dirty gripping arm in order to clean the dirty semiconductor wafer after polishing. A cleaning step of cleaning the semiconductor wafer transported after polishing; a transportation step of transporting the cleaned semiconductor wafer by the clean gripping arm to an unload section on which the cleaned semiconductor wafer is placed. A method of manufacturing a semiconductor device.