JP3496451B2 - Application method of bond for bonding electronic parts - Google Patents

Description

Description: BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention
For bonding electronic components to apply a bond to the substrate for bonding
The present invention relates to a method for applying a bond. [0002] Various kinds of electronic components are bonded to a substrate.
In order to apply a bond at a predetermined position on the substrate,
It is. In this case, if the coating amount of the bond is too small,
Insufficient adhesive strength of the product, and excessive electronic components
Problems, such as being buried in the bond.
The amount must be adjusted to be appropriate. [0003] The adjustment of the amount of coating is performed by:
Conventionally, air pressure that pressurizes the bond stored in the syringe
This was done by changing the size, pressurization time, etc. Only
While applying the bond with the bond application device.
Other than factors such as the magnitude of air pressure and pressurization time.
There are also factors that affect the amount of bond applied.
For example, moving or painting the syringe with respect to the substrate
Cloth timing interval distance or syringe on board
Depending on factors such as the timing of application
Experience that the amount of bond applied to the substrate is different
Is known. But these factors and bond application
The relationship with the amount was not disclosed, and the setting of the factor was changed.
Even if the coating amount is adjusted by applying
When fabrics are applied, the applied amount varies depending on the application point.
There was a problem of being born. [0004] Accordingly, the present invention provides a method of controlling the distance of movement of a syringe and the coating.
Many coatings on substrates with different coating conditions such as cloth timing
There is no variation in the amount of bond applied to the point, and
For bonding electronic parts that can apply a stable bond at high speed
An object of the present invention is to provide a method for applying a bond. SUMMARY OF THE INVENTION [0005] The present invention provides
The bonded bond is ejected from the nozzle by applying air pressure.
A syringe to be drawn out and applied to the substrate, and installed below the syringe.
And the syringe with respect to the board
A moving table and a box provided for relatively moving in the horizontal direction
Method for Bonding Electronic Components Using Bonder
Air pressure for causing the syringe to perform a discharging operation.
The syringe starts to press the substrate
To move the nozzle relatively horizontally and ejected to the lower end of the nozzle.
Parameter of the first discharge retrospective time until the solder is applied to the substrate.
Baa Tao And the air during the previous coating operation of the coating
Syringe contacts the substrate from the start of pressure application.
And moved relatively horizontally and was discharged to the lower end of the nozzle.
The second discharge retrospective time before applying the bond to the substrate
Parameters and , Relationship with the amount of bond applied to the substrate
The application condition adjustment data indicating
It is stored in the condition adjustment data storage unit, and each bond application
At the time of the first discharge retrospective obtained from the point position data
Between and parameters of the second discharge retrospective time
And the application conditions Adjustment Pressurization of the air pressure based on the data
Adjust the time to adjust the length of the syringe attached to the lower end of the syringe nozzle.
Bond applied to the substrate by adjusting the amount of
Was adjusted. [0006] According to the present invention having the above structure, the present invention
Lower end of nozzle during dispensing operation and previous dispensing operation
Is applied to the substrate after the discharge of the bond is started from the part
Depending on the parameters of the discharge retrospective time up to
Based on the application condition adjustment data obtained and stored
By adjusting the pressure time, the nozzle
So that the amount of bond attached to the lower end of the
Bonds that can be reduced and therefore have a stable coating weight
Can be applied. Next, an embodiment of the present invention will be described with reference to the drawings.
Will be explained. FIG. 1 is a view of a bond according to an embodiment of the present invention.
FIG. 2 is a perspective view of a coating apparatus, and FIG.
FIG. 3 is a perspective view of a substrate showing an application mode of the bond, and FIG.
FIG. 4A is a block diagram of a control system of the coating apparatus, and FIG.
4 is a timing chart of the coating operation of the coating apparatus of FIG.
(B) is an enlarged view of a nozzle of the coating apparatus of the bond, and FIG.
(C) is the bond at the lower end of the nozzle of the coating device of the same bond.
5A is a graph showing the amount of adhesion, and FIG.
5B is a timing chart of the coating operation of FIG.
Fig. 5 (c) is an enlarged view of the nozzle of the nozzle
Is a graph showing the amount of adhered bond at the lower end of the nozzle of the coating device.
FIG. 6 (a) shows a tie of the coating operation of the coating apparatus of the same bond.
FIG. 6 (b) is a chart of the coating apparatus of the same bond.
Fig. 6 (c) is an enlarged view of the chisel,
FIG. 7A is a graph showing the amount of bond attached to the lower end of the
(B) shows the bond at the lower end of the nozzle of the coating apparatus of the bond.
FIG. 8 is a graph showing the amount of adhesion, and FIG.
Flow chart, figure for feedforward quantity
9 is the moving distance of the syringe and the coating surface of the coating device of the same bond.
A graph showing the relationship with the product, and FIG.
FIG. 11 is a graph showing the relationship between the pressing time and the application area of FIG.
(A) and (b) show the movement of the syringe of the coating apparatus of the same bond.
It is a graph showing the relationship between distance and application area. First, referring to FIG.
The overall structure will be described. In FIG. 1, the main body frame 11
A transparent cover box 12 is covered on top of
The components described below are provided inside the cover box 12.
Is arranged. 13 is an X table, 14 is an X table
Y-teeth arranged on both sides of the
The X table 13 has a head 15 mounted thereon.
Is being worn. The head 15 has a plurality of syringes.
16 and the camera 10 are held. [0009] Each syringe 16 stores a bond.
It is stored, but the bond by each syringe 16
Is different, and is applied to the target substrate, target chip, etc.
It is selectively used according to. X table which is a moving table
The motors Mx and My and the
Ball screw 18 driven and rotated by motors Mx and My
Are arranged, and the motors Mx and My are driven.
Then, the head 15 moves horizontally in the X direction or the Y direction. What
The motors Mx and My and the ball screw 18 are not
Are shown only partially. Below the moving path of the head 15, a pair of right and left
Rod-shaped guide rails 19a and 19b are provided.
You. Boards are provided on the inner surfaces of the guide rails 19a and 19b.
A conveyor belt 21 for transporting the conveyor belt 20 is provided.
A clamper 1 is provided at the center of one of the guide rails 19a.
9c, and the substrate 20 is connected to the other guide rail.
Press against the 19b side to fix. Therefore, the guide rail
19b and clamper 19c constitute a positioning portion of the substrate 20
are doing. Then, the substrate 20 positioned in this manner is
Is applied to the substrate. Reference numeral 22 denotes a conveyor belt driving motor, 2
3 is a guide rail 19a and a guide according to the width of the substrate 20.
One of the guides is used to adjust the distance between the drains 19b.
The rail 19a is mounted on the substrate with respect to the other guide rail 19b.
A motor for moving in the width direction (Y direction) of 20;
24 is the guide. Next, a guide rail 19b is provided on the side of the guide rail 19b.
The test application unit 30 of the bond 1 will be described. guide
On the side of the rail 19b, a pay-out reel 31 and a take-up reel are provided.
The reel 32 is opposed to the reel 31.
Take up the wound tape 33 with the take-up reel 32
You. This tape 33 is transparent or translucent light transmissive
Tape made of synthetic resin. The light below the horizontal running portion of the tape 33
A light source unit (not shown) having a light source is provided.
Light is irradiated toward the pump 33. 34 is water of the tape 33
It is a receiving tray for the tape 33 disposed directly below the flat running section.
To hold the tape 33 horizontally,
It is formed of a transparent or white light transmitting plate. This tape
The horizontal running section 33 has a step for trial application of the bond.
Page. FIG. 2 shows an application mode of the bond.
The syringe 16 moves horizontally on the substrate 20 in the X and Y directions.
While discharging the bond 1 from the nozzle 16a, the substrate 2
Predetermined application point P of 0 (P1, P2, P3,... Pn)
In order. In the figure, D (D1, D2, D3,...)
Dn) is the moving distance of the syringe between each application point. Ma
Ta (Ta1, Ta2, Ta3,... Tan)
Is a discharge retrospective time between each application point (described later).
As will be described in detail later, the coating device of the present bond has a moving distance of
The syringe 16 is moved at a high speed between the application points where D is different.
To discharge the bond 1 from the nozzle 16a
Adjust the pressurizing time for applying air pressure into the syringe 16.
With this, the coating amount is uniform at each of the coating points P1 to Pn.
This realizes stable application of the bond 1. Next, the configuration of a control system of the bond applying apparatus will be described.
Will be described. In FIG. 3, reference numeral 40 denotes a main control unit,
Receives data from each section described below,
Issue an order to control the overall operation. Application data storage unit 4
1 stores the coordinates of each application point on the substrate 20 to be applied.
You. The application condition storage unit 42 is used to discharge the bond 1
The pressurization time is stored. Coating condition adjustment data storage unit 43
Stores the adjustment data of the above-described pressurization time. The recognizing unit 44 captures an image captured by the camera 10.
Based on the image data of each application point,
The application area of the bonded bond 1 is calculated. This application area is
Used as an index to indicate the amount of bond 1 applied at each application point
It is. The motor drive unit 45 moves the syringe 16 horizontally.
Motor M for each axis of X table 13 and Y table 14
x-axis, My-axis, and Z-axis motor that moves the syringe 16 up and down
Control Mz. The valve drive unit 46 is connected to the syringe 16
The operation of the pressure valve 47 for applying air pressure is controlled. The bond applying apparatus has the above-described configuration.
In the following, electronic components are connected by this bond application device.
A method of applying a worn bond will be described. First, the coating equipment
Before explaining the specific operation of the
A method for applying the metal 1 will be described with reference to FIG.
I do. In the bond applying apparatus, the nozzle 16a
Is ejected and adheres to the lower end of the nozzle 16a.
Bond 1 (the amount Q of this bond 1 is hereinafter referred to as “adhesion amount”).
Is transferred to the substrate 20 to apply the bond 1
Is performed, the timing at which the coating is performed (FIG. 4)
As shown in (e) of (b), the nozzle 16a descends
The bond 1 discharged at its lower end lands on the substrate 20
(Hereinafter referred to as the “adhesion amount during application”)
Q) Qe is the amount of bond 1 actually applied to substrate 20
(Hereinafter simply referred to as “application amount”)
Become. In other words, if the applied amount Qe during coating is large,
The amount Qt increases, and conversely, if it is low, the coating amount Qt is low.
Become. Therefore, a stable bond having a uniform coating amount Qt
In order to realize the coating of No. 1, the coating amount Qe at the time of coating should be uniform.
Is required. In addition, (d) of FIG.
Indicates a state immediately before the bond 1 lands on the substrate 20.
The adhesion amount Q at this time is the adhesion amount at the time of application described above.
It can be considered that it is almost equal to Qe. Therefore, the adhesion amount Qe at the time of application and the syringe 1
6 in the XY and Z directions,
4 to FIG.
This will be described with reference to FIG. 4A to 6, FIG.
A velocity pattern in the horizontal direction (XY directions) of the syringe 16;
Speed pattern of the vertical movement (Z direction) of the nozzle 16a, and
Timing indicating the opening and closing timing of the
It is a chart. (B) shows the air pressure inside the syringe 16.
Of the adhesion amount Q of the bond 1 discharged by pressurizing
The change and the height of the nozzle 16a are shown at each timing.
It is something. (C) is for the amount of adhesion Q of bond 1
Shows intermittent changes. As will be described later, the coating amount Qt of the bond 1
Is the air pressure for causing the syringe 16 to perform the discharging operation.
From the timing t0 when the pressurization starts, the syringe 16
20 and the nozzle 16a moves horizontally.
The bond 1 that has descended and has been discharged to the lower end of the nozzle 16a
Until the timing t5 when the substrate 20 is landed and applied.
Time (in the present invention, referred to as “ejection retrospective time”) Ta
(For each of t0, t5, and Ta,
reference). That is, the discharge retrospective time Ta is applied to the substrate 20.
This is a parameter of the applied amount Qt of the bond to be performed. Also,
The discharge retrospective time Ta is determined based on whether the syringe 16 is located at the application point.
Distance to the next coating point
The travel distance D is a parameter of the discharge retrospective time Ta.
(See also FIG. 2). FIG. 4 shows that the moving distance D is the target.
Standard moving distance Ds which is a standard numerical value (for example, 10 mm)
(Ie, when the discharge retrospective time Ta is the standard)
FIG. 5 shows that the moving distance D is shorter than Ds in FIG.
FIG. 6 shows a long case. In FIG. 4, the time origin t0 is a series of operations.
Starts at the time of application, that is, application at one application point
At the timing to start moving to the next dispensing point
is there. First, at the time origin t0, the XY
Speed in the direction rises and reaches the highest speed at t1
Then, the vehicle decelerates and stops at t2. That is,
The die 16 reaches the application point at this timing t2. Next
At this timing t2, the Z-axis motor Mz starts driving.
The nozzle 16a starts descending. Also, the time origin t
At the same time as starting the movement in the XY directions at 0,
The pressurizing valve 47 is opened, and from the lower end of the nozzle 16a
The discharge of the bond 1 is started. Note that in FIG.
Dashed arrows A, B, C, and D indicate holes in the nozzle 16a.
The flow direction of the code is shown. This pressurizing valve 47 is
It is opened for a set time (pressurization time Td). What
The pressurizing time at the standard moving distance Ds is defined as Tds.
You. As shown in FIGS. 4B and 4C, the nozzle
The adhesion amount Q of the bond 1 discharged to the lower end of the bottom 16a is dynamic.
The amount of bond 1 at the start of cropping (a), that is, the first
From the initial deposition amount Qi and pressurized as shown in (c).
The maximum amount Qm at timing t4 when the valve 47 is closed
It becomes. Thereafter, after the pressurizing valve 47 is closed,
As shown by the dashed arrow C in FIG.
Flow slightly back through the nozzle 16a, and the adhesion amount Q of the bond 1 is
Time (from time t4 to time t6 shown in FIG.
Time "Tw")
1 shows the phenomenon of “return”. In (d), indicated by a broken line
Bond 1 shows the state of the maximum amount Qm, and is shown by a solid line.
Bond 1 shows Bond 1 decreasing due to "return"
are doing. After this time Tw has elapsed, the bond 1
Is a constant amount Qr. Next, at timing t5, the nozzle 16a
Bond 1 that has reached the bottom dead center of the lowering motion and is attached to the lower end
Is applied on the surface of the substrate 20. This timing
The amount of the bond 1 at the time t5 is the above-mentioned adhesion amount Qe during coating.
In this case, the painting is performed when the moving distance is the standard moving distance Ds.
This is the cloth deposition amount Qes. The application amount Qts (moving
The amount of coating when the distance is the standard moving distance Ds)
Applied. As a result, at the timing t5, the bonding
The landing amount Q is Qts (moving distance is
The amount of application in the case of the quasi-movement distance Ds), and thereafter
It continues to decrease during the return time Tw (FIG. 4B).
(See arrow D in dashed line). And timing t
It becomes a fixed amount at 6. At timing t5 in FIG.
The graph q ', which is indicated by a dashed line, shows the case where the coating was not performed.
The solid line graph q shows the adhesion amount Q of this chain line.
The graph is shifted downward by the coating amount Qts at the timing t5.
It has become. S shown in (f) is a substrate
Coating area of bond 1 with coating amount Qts applied on 20
(G) indicates the nozzle 1 at the timing t7.
6a has completely risen and the return time Tw has passed, and
Q is a fixed amount and remains at the lower end of the nozzle 16a
(Hereinafter referred to as “residual amount” Qn) Qns (moving distance is
(The residual amount in the case of the quasi-movement distance Ds)
I have. Next, referring to FIG. 5, the movement of the syringe 16 will be described.
When the distance D is short (that is, when the discharge retrospective time Ta is short)
) Will be described. As shown in FIG.
Acceleration / deceleration time in XY direction from t to t2
Shorter than the distance Ds, that is, the syringe 16
Is short. The button in FIG.
In the graph showing the change over time of the adhesion amount Q of the
Graph a shown by a solid line is a graph of the standard movement distance Ds shown in FIG.
Shows the case where coating is performed with the same standard pressurization time Tds as
You. A graph q ′ shown by a chain line after timing t5 is shown in FIG.
Amount of bond 1 when coating is not performed as in the case of
Represents Q. Further, a graph b indicated by a broken line indicates the pressure time Td.
This shows the case where adjustments have been made, which will be described later.
You. When the moving distance D is short, the pressing time Td
Move in XY directions before timing t4 when
The operation is completed (t2), and the pressurizing valve 47 is closed.
Before and after the timing t4, the lowering of the nozzle 16a opens.
Is started, and the coating of the bond 1 on the substrate 20 is performed at a timing t5.
Cloth is made. For this reason, the attached amount Q is reduced by return.
Within a short time, that is, when the amount of adhesion at the time of application is Qe1 (moving
The adhesion amount at the time of coating when the distance D is short. Qe1> Qes)
The application is performed in the state, and as a result, the
Amount Qt1 of the bond 1 to be applied (when the moving distance D is short)
Application amount) is larger than that in the case of FIG. in this case
In addition, after the timing t5 when the coating is performed, the bond 1
The adhesion amount Q continues to decrease during the return time Tw (t4 to t6).
(See the dashed arrows D and E shown in FIG. 5 (b) (f) and (g).
), And then a certain residual amount Qn1 (if the moving distance D is short)
Residual amount). FIG. 5B and FIG.
After t6 and t7, the bond 1 returns and the nozzle 16a
This shows a state where the ascent is completed. Next, FIG. 6 shows a case where the moving distance D is long.
(That is, when the discharge retrospective time Ta is long).
You. As shown in the graph of FIG.
Time during which the constant speed is maintained after acceleration at
1 ′) is long, indicating that the moving distance D is long. Figure
6 (c) is a graph showing the change over time in the amount of adhesion Q of the bond 1;
In the graph, the graph c shown by a solid line represents the standard movement shown in FIG.
The application is performed with the same standard pressurization time Tds as in the case of the distance Ds.
The following shows the case. The graph indicated by the dashed line after timing t5
The character q ′ indicates the amount of adhesion Q when the coating is not performed. Ma
In addition, a graph d shown by a broken line is obtained by adjusting the pressurizing time Td.
A case is shown, which will be described later. When the moving distance D is long, the nozzle 16a
Starts descending (t3), reaches the bottom dead center and its lower end
To apply the bond 1 attached to the substrate 20 to the substrate 20
At 5, the return of Bond 1 has already been completed (t6) and
The adhesion amount Q of the node 1 is Qr. In other words, when applying
The amount of deposition Qe2 (the amount of adhesion at the time of application when the moving distance D is long) is
Equal to Qr (Qe2 = Qr <Qes).
The cloth amount Qt2 (the amount of application when the moving distance D is long) is as shown in the above figure.
4, less than in the two examples of FIG. Fig. 6 (b) (h)
Indicates that the rising of the nozzle 16a has been completed at the timing t7.
The state is shown, and the adhesion amount Q is the remaining amount Qn2 (moving distance).
(Residual amount when D is long). As described above, the bond applied to the substrate 20
The application amount Qt of No. 1 corresponds to the discharge retrospective time Ta (timing t0 to t0).
(time between t5), but this variation is
This is due to the return phenomenon of the bond 1 described above. sand
That is, the adhesion amount Q of the bond 1 fluctuates due to the return phenomenon.
If the application is performed during the return time Tw
At any time during the interval Tw, it is attached to the lower end of the nozzle 16a.
Depending on whether the bond 1 to be landed is
Therefore, the applied amount Qe at the time of application is different, so that the applied amount Qt is
Because it is different. Conventionally, the discharge retrospective time Ta is long,
The return time Tw has passed since the application was performed.
Later, that is, the attached amount Q of the bond 1 became a constant amount Qr.
Because of this state, the adhesion amount Qe at the time of application is always a fixed amount
Qr, and no variation in the coating amount Qt occurred. I
Since the discharge discharge retrospective time Ta is long, as a result,
Im longer and hindered speeding up. Therefore, in order to reduce the tact time
It is necessary to shorten the discharge retrospective time Ta
Inevitably, the application must be performed during the return time Tw
However, in this case, the applied adhesion amount Qe is equal to the discharge retroactive time Ta.
Will vary. Next, the initial adhesion amount Qi will be described.
In the above description, the initial adhesion amount Qi is equal in each case.
The application amount depends on the discharge retrospective time Ta.
However, in practice, the initial coating amount Qi is
As described, it is not constant.
Also varies depending on the initial adhesion amount Qi. Hereinafter, FIG.
Referring to (a) and (b), the variation of the initial adhesion amount Qi
The factors will be described. FIGS. 7 (a) and 7 (b) show the corresponding coatings.
When taking into account the condition of the previous application of the cloth,
Time of the adhesion amount Q of the bond 1 adhering to the lower end of the screw 16a
FIG. 7 (a) shows the target change in the previous line.
When the discharge retrospective time T′a during discharge is short, FIG.
It is about the long case. In FIG. 7 (a), Ta is
Discharge retrospective time (hereinafter referred to as "first discharge retrospective time")
And T'a (1) is the discharge retrospective time at the time of the previous application.
(Hereinafter, referred to as “second ejection retrospective time”). Qi
(1) and Q'i (1) are the time of the application and the last time, respectively.
Shows the initial amount of coating during application. The adhesion amount Q of bond 1 is pressurized
Increases during time Td (t0 to t1), and reaches maximum at t1
It decreases after reaching the quantity Qm. And at timing t2
The nozzle 16a reaches the bottom dead center and moves down to bond 1
20, the amount of coating Qt1 is reduced,
After that, it continues to decrease for the return time Tw (t1 to t4)
You. Then, the button at timing t3 at which pressurization is started again
And the initial adhesion amount Qi (1) at the time of the application.
Become. Thereafter, the pressure increases during the pressurization time Td (t3 to t5).
Then, after reaching the maximum amount Qm at timing t5, it decreases again.
Less. Then, bond 1 is applied by descending nozzle 16a.
The amount of adhesion at t6, which is the timing of
This is the cloth deposition amount Qe (1). In FIG. 7B, Ta is the first
The discharge retrospective time, and T'a (2) is the second discharge retrospective.
Time. Qi (2) and Q'i (2) are
Shows the initial amount of adhesion at the time of application and at the time of previous application. Bond 1
Increases during the pressurization time Td (t0 to t1),
After reaching the maximum amount Qm, the return time Tw (t1 to t2)
The amount decreases to a constant amount Qr. And at timing t3
The nozzle 16a reaches the bottom dead center and moves down to bond 1
By applying the composition to the area 20, the application amount Qt2 is reduced,
After that, keep a certain amount. Then, pressurization is started again.
The adhesion amount of the bond 1 at the time of the imaging t4 is an initial value at the time of the application.
This is the adhesion amount Qi (1). Then, during the pressurization time Td
(T4 to t5) increases and reaches the maximum amount Qm at timing t5.
After reaching, it decreases again. Then descend the nozzle 16a
At time t7, which is the timing to apply bond 1
The amount is the applied adhesion amount Qe (2) during the application. As described above, the first discharge retrospective time Ta is equal.
Even if the second discharge retrospective time T'a is different
The initial adhesion amount Qi at the time of the application is different, and
As a result, the application adhesion amount Qe is different. That is,
2 has a long discharge retrospective time T′a, that is, FIG.
The initial adhesion amount Qi (2) in the case of T′a (2) is shown in FIG.
(A) The initial adhesion amount Qi (1) in the case of T'a (1)
Less. Therefore, the second discharge retrospective time
When the coating amount Qe (2) when T'a is long, the
Adhesion amount Qe (1) at the time of application when return time T'a is short
Less than. As described above, the adhesion amount Qe at the time of coating is
In order to adjust, only the discharge retrospective time Ta at the time of the coating is applied.
In addition, the discharge retrospective time T'a at the time of the previous application is also considered.
It must be put in. In this bond application apparatus, the
Timing to start horizontal movement of the die 16 and application of bond 1
And the timing to start pressurizing for
The discharge retrospective time Ta is such that the syringe 16 moves between the application points.
Time. In addition, the time required for this movement
The moving distance that the nozzle 16 moves between the application points on the substrate 20
D is approximately the same assuming other conditions are the same.
It is practically acceptable to regard it as an example. So this
What approximately represents the discharge retrospective time Ta by using the moving distance D
Can be treated as That is, the moving distance D is different.
In this case, the applied amount Qe at the time of application varies,
As a result, the application amount varies. In an actual coating apparatus, the substrate 20
When considering the application conditions for each application point,
It is more convenient to use the intuitive moving distance D as the distance in
Therefore, in this embodiment, the variation of the coating amount is reduced.
When the moving distance D is used as a control factor,
An example will be described. The arrangement of application points on an actual substrate may vary.
The moving distance when the syringe 16 moves between the application points.
The separation D is not constant. And the moving distance at the time of the application
(Hereinafter referred to as “first movement distance”) D and the time of previous application
Of the moving distance (hereinafter referred to as “second moving distance”) D ′
The combination of both will be even more diverse. Therefore
In this case, apply at the same application condition for all application points
Is performed, the application amount varies as described above. others
Therefore, if an attempt is made to obtain a uniform coating amount,
It is necessary to adjust cloth conditions appropriately. Below, for this purpose
Diagram of feedforward control of application conditions performed
8 will be described with reference to the drawings. First, it is stored in the control unit 40 (FIG. 3).
The moving distance (second moving distance) D ′ at the previous coating
(ST1), and this second moving distance D '
The formula for estimating the dispersion of the applied coating area is
The data is read from the data storage unit 43 (FIG. 3) (ST2).
The formula for estimating the application area variation is expressed by the first moving distance D
And one for the combination of the second moving distance D ′
And the predicted variation in the coating area
You. This prediction formula is obtained by calculating the first movement distance D and the second movement distance.
Varying the distance D 'and conducting coating experiments systematically
And sort the experimental results into appropriate linear approximations.
With the second moving distance D 'fixed.
In consideration of this, as shown in FIG.
Approximated by two straight lines on the graph showing the relationship with the application area S
Is represented by That is, first, the second moving distance D ′ is
If specified, the application area corresponding to D '
A fluctuation prediction formula is obtained, and then the first moving distance D
Is given, the predicted value of the variation of the application area
Will be required. Next, in response to a movement command to the application position, the application
The position of each application point stored in the data storage unit 41 (FIG. 3)
The first movement distance that the syringe 16 moves based on the data
D is calculated (ST3). Then, the first moving distance D
Of the application area read in ST2 based on
Prediction calculation of variation of coating area by fluctuation prediction formula
Is performed (ST4). That is, the first transfer is performed in ST3.
Given the dynamic distance D, it can be seen from the graph of FIG.
The application area S in the interval Tds is obtained. So this S and
The difference ΔS from the desired application area Sd is obtained, and this ΔS
Is the expected variation in the application area. Next, with respect to the variation ΔS of the coating area,
The corresponding adjustment pressurization time Δt is calculated from the graph of FIG.
(ST4). This graph also shows the pressurization time Td and coating
The relationship with the area S is obtained from the experimental data and approximated by a graph.
It is a thing. The above-mentioned Sd and the variation ΔS to be adjusted
Is given, the corresponding Δt is calculated as shown in FIG.
Is calculated (ST5). Coating strips represented by these graphs
The condition adjustment data is stored in the application condition adjustment data storage unit 43.
It is sent to the main control unit 40 when necessary. Next, the Lord
The control unit 40 determines the adjusted pressurizing time Δt as a standard application time.
Calculate individual pressurization time Td in addition to Tds
(ST6). That is, the syringe 16 is moved for each application point.
During the different pressurization times Td adjusted according to the moving distance D,
Bond 1 is discharged from nozzle 16a by pressurizing syringe 16
(ST7), and application to the substrate 20 is performed (ST7).
8). The adjustment pressurizing time Δt is determined by feed forward
5 and FIG. 6 again when the coating is performed
It will be described in the light of the above. In FIG. 5, the timing line (a)
Δt1 shown in the figure is the value when the above-mentioned first movement distance D is short.
The adjustment pressurization time Δt. That is, in this case coating
The pressurizing time Tds is set to Δt
An adjustment is made to shorten it by one. As a result, the group indicating Q
The rough is a broken line graph b shown in FIG.
As indicated by Qe′1 (= Qes), the landing amount Qe
4 is equal to the case of the standard movement distance Ds. In FIG. 6, Δt2 represents the first movement.
The adjustment pressurization time Δt when the distance D is long, in this case
In order to increase the adhesion amount Qe during coating,
Pressurization time Tds shown in the Mining diagram is lengthened by Δt2
Adjustments are made. As a result, the graph showing Q is (c)
A graph d indicated by a broken line shown in FIG.
As shown by e′2 (= Qes), the standard shown in FIG.
It is equal to the case of the moving distance Ds. As described above, the first movement of the syringe 16
Even if the distance D and the second moving distance D 'are different,
Compression time Td is the combination of each moving distance D, D '
By adjusting according to
Qe can be obtained. FIG. 11 shows a feed forward of this embodiment.
Example of the effect when the code is applied to the actual bond 1 application
It is shown. FIGS. 11A and 11B are plotted on the horizontal axis.
The moving distance D of the syringe 16 and the application area S on the vertical axis
When no feedforward is performed,
The degree of variation of the application area S in the case of
Things. The data collection method is the same for the syringe 16
Corresponds to the application and the previous application in the present embodiment.
The application is performed twice in succession, and the application corresponding to the application is performed.
The result, ie the application point of the later application of the two applications
The application area S is measured, and the result is used as the travel distance during subsequent application.
It is plotted at a point corresponding to D. In FIGS. 11A and 11B, the graph a
And a 'when the coating is performed twice at the same moving distance D
2 shows the data. Graphs b and b ′ are
The moving distance D at the time of the first application is 5 mm, and the second application
The moving distance D during dispensing is shown on the horizontal axis at each data point.
Data when the distance is That is, the last application
The moving distance D at the time of coating is short, and the moving distance D at the time of coating is long.
It is an example of a coating pattern. Graphs c and c ′ are
Conversely, it corresponds to the distance indicated on the horizontal axis at each data point
5 mm moving distance after coating with moving distance D
D is the data when coating was performed. That is, last time
The moving distance D during coating is long, and the moving distance D during coating is
It is an example of a short application pattern. As is apparent from FIG.
When applying under the same application conditions without performing forward
Is the combination of the travel distance D at the time of the application and the previous application.
As a result, the application area S varies greatly. to this
Adjust the pressurization time Td by performing feed forward
In this case, as shown in FIG.
The surrounding area is narrow, and a substantially uniform application area S is obtained. As described above, when the syringe 16 is applied this time.
Moving distance D and moving distance D 'at the time of previous application are different
Even in this case, the pressurizing time Td is adjusted according to the moving distances D and D '.
To obtain a uniform coating amount Qe during coating.
be able to. Note that, in the above embodiment,
The movement distances D and D 'are used as parameters of the intervals Ta and T'a.
As described above, the discharge retrospective times Ta and T'a
As parameters, the discharge retrospective time Ta, T'a itself
Or the driving time of the X-axis motor or Y-axis motor
Or the number of revolutions, etc., and the point is that the discharge retrospective time Ta,
It is only necessary to use parameters that have a correlation with
You. According to the present invention, during the coating operation,
Discharge the bond from the lower end of the nozzle during the previous coating operation
At the time of discharge from the start of discharge until application to the substrate
Determined and stored in advance by experiment according to the parameters between
The pressurization time based on the applied application condition adjustment data
The syringe between each application point.
Nozzle at application timing even when the moving distance is significantly different
It is possible to keep the amount of bond attached to the lower end constant.
Simple method of adjusting the operating time of the pressure valve
With this, a stable amount of bond can be applied. In addition,
Stable bond amount after ejecting bond from swarf
Nozzle landed on substrate during bond return time
To reduce the time required for discharge
And therefore the time of the dispensing operation at each dispensing point
The interval is shortened, and the takt time can be significantly reduced
it can. As a result, at high speeds that were previously impossible
In addition, bond application to a substrate with a stable application amount is realized.
It is.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a bond applying apparatus according to one embodiment of the present invention. FIG. 2 is a substrate showing a bond applying mode by a bond applying apparatus according to one embodiment of the present invention. FIG. 3 is a block diagram of a control system of the bond applying apparatus according to one embodiment of the present invention. FIG. 4A is a timing chart of a coating operation of the bond applying apparatus according to one embodiment of the present invention. Chart (b) is an enlarged view of a nozzle of a bond applying apparatus according to an embodiment of the present invention. (C) is a graph showing a bond adhesion amount at a lower end portion of the nozzle of the bond applying apparatus according to an embodiment of the present invention. 5A is a timing chart of the coating operation of the bond coating apparatus according to one embodiment of the present invention. FIG. 5B is an enlarged view of a nozzle of the bond coating apparatus according to one embodiment of the present invention. Bond at the lower end of the nozzle of the bond application device according to the embodiment FIG. 6A is a timing chart of a coating operation of the bond coating apparatus according to one embodiment of the present invention; FIG. 6B is an enlarged view of a nozzle of the bond coating apparatus according to one embodiment of the present invention; (C) A graph showing a bond adhesion amount at a lower end portion of a nozzle of the bond applying apparatus according to one embodiment of the present invention. (A) A lower end of a nozzle of the bond applying apparatus according to one embodiment of the present invention. (B) Graph showing the amount of bond adhesion at the lower end of the nozzle of the bond application device according to one embodiment of the present invention. Flow chart for feed-forwarding the application amount of the apparatus. FIG. 9 is a graph showing the relationship between the moving distance of a syringe and the application area of a bond application apparatus according to an embodiment of the present invention. Coating device in the form of FIG. 11A is a graph showing a relationship between a moving distance of a syringe and an application area of a bond applying apparatus according to an embodiment of the present invention. 1 is a graph showing a relationship between a moving distance of a syringe and a coating area of a bond applying apparatus according to an embodiment of the present invention. [Description of References] 1 Bond 10 Camera 11 X table 12 Y table 16 Syringe 16a Nozzle 19a Guide rail 19b Guide rail 19c clamper 20 substrate 31 pay-out reel 32 take-up reel 33 tape 40 main control unit 41 coating data storage unit 42 coating condition storage unit 43 coating condition adjustment data storage unit 44 recognition unit Ta first discharge retrospective time T'a second Discharge retrospective time

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-1-253295 (JP, A) JP-A-4-246886 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 3/34

Claims (1)

(57) [Claim 1] A syringe which is applied from the nozzle to the substrate by applying pressure to the bond stored in the inside by air pressure, and a substrate positioning portion provided below the syringe. And a method of applying a bond for bonding electronic components by a bond applying device having a moving table for moving the syringe in a horizontal direction relative to the substrate, wherein air pressure is applied to cause the syringe to perform a discharging operation. the timing for starting the syringe of the previous relative horizontal movement to the first ejection retroactive time parameters and the coating before applying a bond discharged to the lower end of the nozzle to the substrate relative to the substrate The syringe moves horizontally relative to the substrate from the timing of starting the application of air pressure during the application operation to apply the bond discharged to the lower end of the nozzle to the substrate. And parameters of the second discharge retroactive time to, may be stored in the coating condition adjusting data storing unit determined by experiment a coating condition adjusting data showing the relationship between the coating amount of the bond that is applied to the substrate, each bond A parameter of the first ejection retrospective time obtained from the position data of the application point and a second
The application of the bond applied to the substrate by adjusting the pressurizing time of the air pressure based on the parameters of the discharge retrospective time and the application condition adjustment data to adjust the amount of the bond attached to the lower end of the syringe nozzle A method for applying a bond for bonding electronic parts, characterized by adjusting the amount.