JP3498620B2 - Electronic component mounting method - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an electronic component on a substrate. 2. Description of the Related Art A mounting apparatus for mounting an electronic component on a substrate is provided with a supply unit in which a number of parts feeders such as a tape feeder for storing the electronic components are arranged in parallel. The operation of picking up the electronic component by the transfer head and transferring the electronic component onto the substrate is repeatedly performed. With respect to the types of electronic components that are mounted in a large number on one mounting stage, a plurality of parts feeders containing electronic components of the same type are prepared and arranged in the supply unit. Conventionally, when there are a plurality of parts feeders for the same kind of electronic parts, the electronic parts are first picked up from one part feeder, and when this parts feeder is out of order, another parts feeder is sequentially picked up. To pick up electronic components. However, the above method has the following drawbacks in improving the mounting efficiency. The arrangement of the parts feeders in the supply part of the electronic components is considered so that an operation sequence in which the mounting operation such as the movement of the transfer head and the elevating operation is minimized is realized. That is, the arrangement of the parts feeders that can achieve the rational mounting order, the shortest moving distance, and the positional relationship between the parts feeders are determined. [0004] However, even if an optimal mounting operation sequence is set in advance based on the arrangement of the parts feeders determined in this way, the mounting operation sequence that is set is always realized during the actual mounting operation. Not exclusively. This is because at the time of setting the mounting sequence, it is not possible to foresee at what point in each parts feeder a component break will occur. In particular, when the transfer head is provided with a plurality of suction nozzles and the parts feeder is arranged on the premise that a plurality of electronic components are simultaneously suctioned by the same lifting / lowering operation, the above-mentioned parts run out and the parts run out. An electronic component that was to be picked up from one of the parts feeders must be picked up from another parts feeder, and as a result, the originally scheduled simultaneous suction cannot be performed. Also, the optimal mounting operation sequence initially set cannot be realized for the subsequent mounting operations, and as a result, the efficiency of the entire mounting operation is not improved. As described above, in the conventional electronic component mounting method, when there are a plurality of parts feeders each containing the same electronic component, a method for preventing a decrease in the mounting efficiency due to the occurrence of component shortage has not been established. There was a problem that improvement was difficult. Accordingly, an object of the present invention is to provide a mounting method of an electronic component that can improve mounting efficiency. According to a first aspect of the present invention, there is provided a method for mounting an electronic component, comprising a transfer head having a plurality of suction nozzles from a plurality of parts feeders arranged in parallel at a supply section of the electronic component. An electronic component mounting method of picking up an electronic component and mounting the electronic component on a substrate, the process of creating a histogram of the number of mounted electronic components for each type of electronic component mounted on the substrate,
If there the steps of creating a histogram the number of mounted electronic components performing rearrangement type of electronic components as large irregularities in the number of mounted adjacent the electronic component does not occur, the electronic component count implementation is projected is , Excessive mounting of prominent electronic components
nex is divided into two mounting numbers ng1 and ng2
And the ratio of the number of mounting ng1 to the number of mounting ng2
Are the two parts on both sides of each insertion position.
Data so that they almost match the ratio of the sum of the number of mounted data. [0010] According to the present invention, the electronic component supply unit is provided with multiple components.
Multiple suction nozzles from several side-by-side parts feeders
Pick up electronic components with the transfer head provided
When mounted on the substrate, it is possible to perform the implementation efficiently implemented. Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2A is a perspective view of a transfer head of the electronic component mounting apparatus, and FIG. FIG. 3 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus, FIG. 4 is a flowchart of creating feeder arrangement data of the electronic component mounting apparatus, and FIGS. (B), (c), and (d) are diagrams showing the remaining mounting number histogram of the supply unit of the electronic component mounting apparatus, FIG. 6 is a flowchart showing processing after the start of the electronic component mounting operation,
FIGS. 7A, 7B, 7C, and 7D show histograms of the remaining mounting numbers in the same mounting operation, and FIGS.
(B), (c) is a figure which shows the multiple taking pattern in the same mounting operation. First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, an electronic component mounting apparatus 1 includes:
An electronic component supply unit 2 is provided with a large number of tape feeders 3 as part feeders. The tape feeder 3 picks up the electronic components held on the tape at the pickup position 3.
a. The electronic component supplied to the pickup position 3a is picked up by the suction nozzle of the transfer head 4, picked up by the camera 5, imaged and recognized, and then mounted on the substrate 7 positioned on the transport path 6. Next, the transfer head 4 will be described with reference to FIG. In FIG. 2A, the transfer head 4 is horizontally moved by a head moving mechanism (not shown), and the Z-axis motor 1 is moved.
It is moved up and down by the Z-axis table 10 driven to 0a. A box-shaped elevating unit 11 is mounted on the Z-axis table 10, and a nozzle support unit 12 that supports a plurality of suction nozzles 13 is coupled to a lower surface of the elevating unit 11. The suction nozzle 13 is vertically moved by a cylinder 14 via a nozzle rod 15, and is rotated by a θ-axis motor 16 mechanically connected by a belt, a gear, or the like, so that the suction nozzle 13 performs θ rotation. Do. FIG. 2B shows a planar arrangement of the suction nozzles 13 mounted on the lower surface of the transfer head 4. In the example shown in the present embodiment, six suction nozzles 13 are provided, and the overall shape of the nozzle arrangement is a regular hexagon having the position of each suction nozzle 13 as an apex. These six suction nozzles 13 are provided in three pairs C1, C
2, C3. In the combinations C1 and C3, the pitch P between the nozzles matches the arrangement interval p of the tape feeder 3 shown in FIG. Since the suction nozzles 13 are arranged at the vertices of a regular hexagon, the pitch p ′ between the nozzles in the combination C2 is equal to twice the pitch p.
That is, the transfer head 4 has a pitch p which is the basic pitch.
And / or suction nozzles arranged at a pitch p 'which is an integral multiple of the pitch p. Therefore, when picking up electronic components from the tape feeder 3 by the transfer head 4, two electronic components can be simultaneously picked up from two adjacent tape feeders 3 by using the combinations C1 and C3. If C2 is used, two electronic components can be simultaneously picked up from two tape feeders 3 arranged one by one. Next, the configuration of a control system of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 3, a CPU 20 is an overall control unit, and controls operations and processes performed by each unit described below according to various programs stored in a program storage unit 21. The program storage unit 21 stores programs for various operations and processes. The mounting data storage unit 22 stores mounting data such as mounting coordinate data of the board 7 and electronic component type data. The mounting operation sequence storage unit 23 stores a mounting operation sequence such as picking up of an electronic component by the transfer head 4 and transfer and mounting on the substrate 7. The mounting operation sequence is determined by the mounting operation sequence calculation unit 28 based on a remaining mounting number histogram described later. The remaining mounted number data storage unit 24 stores, in real time, a remaining mounted number histogram created and updated by the remaining mounted number data calculation unit 29 based on the mounting data. The mechanism driving unit 25 drives a head moving mechanism 26 that moves the transfer head 4 and a transport conveyor 27 in the transport path 6. This electronic component mounting apparatus is configured as described above, and a method of mounting an electronic component will be described below. First, with reference to FIGS. 4 and 5, determination of feeder arrangement data for determining the arrangement of the tape feeders 3 in the supply unit 2 and generation of a remaining mounting number histogram which is a basis for generating a mounting operation sequence will be described. The feeder arrangement data is data for allocating a tape feeder containing electronic components to be mounted to each arrangement position of the supply unit 2, and is closely related to the efficiency of the mounting operation. This is particularly important in a mounting apparatus which aims at improving the mounting operation efficiency by simultaneously picking up a plurality of electronic components by a transfer head having a plurality of suction nozzles as in the present embodiment. In the flow shown in FIG.
The number of electronic components mounted on one mounting stage for each type, that is, the number of mounted electronic components is represented by a histogram (ST
1). As a result, a histogram as shown in FIG. 5A is created. The histogram has irregular irregularities as a whole due to the variation in the number of mounted electronic components. Next, the types of electronic components are rearranged in this histogram (ST
2). Here, as shown in FIG. 5B, the electronic components with the largest number of mountings are arranged at the center, and the types of the electronic components are arranged in a histogram shape such that the number of mountings decreases toward both sides. Are shown. Here, only the arrangement example in which the center is higher is shown as the most common form, but for the reason described later, as shown in FIG. other,
Conversely, an arrangement example in which the center becomes lower (b) or an arrangement example in which the number of mountings sequentially changes from one end to the other end (c) may be adopted. The point is that the arrangement should be such that no unevenness in the number of mountings occurs between adjacent electronic components. Next, electronic components of the same type which are stored in a plurality of tape feeders are determined (ST).
3). The number of mounted electronic components greatly varies depending on the type, and a specific electronic component may be mounted more than others. In such a case, a plurality of tape feeders are prepared for the specific electronic component. This determination is made based on the above-described histogram, that is, since electronic components protruding in the histogram are supplied using a plurality of tape feeders, the arrangement of the plurality of tape feeders and the distribution of the number of components are determined. Determine (ST4). The arrangement of the tape feeders and the distribution of the number of components picked up from each tape feeder when a plurality of tape feeders are arranged for the same component will be described. In the histogram shown in FIG. 5B, the component type g protrudes. If it is intended to realize a histogram in which the component type g is arranged at the center and the number of components is sequentially reduced toward both sides, component types f and h on both sides are obtained.
Since the mounting numbers nf and nh are 10, 9 respectively, it is appropriate to set the mounting number ng to 11. In the example shown here, if the mounting number ng is set to 11, the protruding excess mounting number nex becomes 13 pieces. Therefore, if this excess mounting number nex is supplied and a histogram in which the mounting number changes gently as described above is to be realized,
Here, two additional tape feeders are required. That is, in such a case, three tape feeders are assigned to one component type g. A method of distributing the 13 mounted numbers to the other two tape feeders and an insertion position of the tape feeder will be described. This distribution and insertion position is shown in FIG.
As shown in (b) and (d) , the 13 pieces are distributed to 2
The distribution of the number of mountings and the insertion position are such that the number of mountings is sequentially reduced toward both sides without unevenness in the histogram shape after one tape feeder is inserted into the histogram shown in FIG. 5B. That is, 13 ng
1 and ng2, and ng1 and ng
2, so that the ratio of 2 substantially matches the ratio of the sum of the mounting numbers of the two tape feeders on both sides of each insertion position,
Select the insertion position. In the example shown in FIG. 5B, the component types d and e
Are 6 and 9, respectively, and the mounting numbers ni and nj of component types i and j are 6 and 4, respectively. Therefore, a tape feeder of component type g is replaced with a tape feeder of component types d and e, respectively. , And between the tape feeders of the component types i and j, and the number of mounted components may be divided into eight and five for these two tape feeders (ng1 = 8, ng2). = 5). The determination of the allocation number is performed by the following method. That is, the sum of the number of mounted component types d and e is fifteen, and the sum of the number of mounted component types i and j is ten. Therefore, 13 pieces are allocated so as to be closest to the 15:10 ratio, and eight and five allocation results are obtained. That is, as shown in FIG. 5D, the tape feeders of the component type g are inserted into the tape feeder position numbers 5 and 11, and eight and five mounting numbers are allocated to each. Similarly, the number of mounted three tape feeders determined in this way is also substantially proportional to the total number of mounted component types g as the sum of the number of mounted two tape feeders on both sides of each tape feeder. And distributed. As a result, the component type g becomes the tape feeder position number 5, 8, 1
In the mounting operation, a predetermined number of electronic components determined by the above-described method are picked up from these three tape feeders. In this manner, the arrangement of a plurality of tape feeders accommodating the same type of electronic component is determined,
The horizontal axis position of the histogram with the distribution of the number of mounted
A mounting number histogram is created in correspondence with the tape feeder position number of the tape feeder 3 in the supply unit 2 (S
T5). That is, the height of this implementation count histogram is
It indicates the number of packages picked up from the tape feeder and mounted, and indicates the frequency of access of the transfer head to the tape feeder during the mounting operation. The mounting number histogram created as described above is constantly updated not only before starting the mounting operation but also during the mounting operation. That is, the number of electronic components already mounted in the mounting operation is subtracted from the histogram each time the transfer head 4 reciprocates between the supply unit 2 and the substrate 7 for each reciprocating operation cycle, and remains unmounted at that time. The histogram of the number of mounted packages (the remaining mounted number histogram) is always created in real time. Then, as will be described later, the sequence of the mounting operation is similarly determined in real time based on the remaining mounting number histogram. Next, the processing after the start of the mounting operation will be described with reference to FIG. This process is performed for the purpose of optimizing the mounting operation during the mounting operation based on the above-described remaining mounting number histogram. In the flow of FIG. 6, first, the mounting operation sequence is determined based on the remaining mounting number histogram (ST11). Here, the electronic components picked up in one reciprocating operation cycle in the mounting operation of picking up the electronic components from the supply unit 2 and transferring and mounting the electronic components on the substrate 7 by the six suction nozzles 13 provided in the transfer head 4. Determine the combination. This determination made based on the remaining mounted number histogram will be described with reference to FIG. In this determination, three combinations C1, C shown in FIG.
2. An operation sequence for causing all of the suction nozzles 13 constituting C3 to pick up electronic components most efficiently is determined. That is, all the suction nozzles 13 respectively suck the electronic components, and the suction operation can be performed by three lifting operations, and the combination of the electronic components that can be suctioned in the order of C1, C2, and C3 is selected. Ask. If such a combination is required, six electronic components can be picked up in one reciprocating operation cycle with the minimum number of elevating operations and the shortest moving distance, and the mounting capability of the transfer head 4 can be maximized. An efficient mounting operation to be utilized is realized. First, as shown in FIG.
The electronic component to be sucked is determined by 1. In this case, first, a combination of electronic components (hereinafter, abbreviated as “adjacent adsorbable components”) that are arranged so as to be able to adsorb simultaneously from two adjacent tape feeders is first selected. Here, when there are a plurality of adjacent adsorbable parts, the first condition is to preferentially pick up components having a large number of mounted components, and when there are a plurality of components that meet the first condition, As condition 2, priority is given to the one with the larger sum of the mounting numbers of the two tape feeders on both sides thereof. That is, the fact that the sum of the number of mountings is large means that there is no large unevenness in the number of mountings on both sides in this range on the histogram, and therefore, when the transfer head 4 accesses the range, there is a high probability that a plurality of components can be simultaneously picked up. It is. Next, as shown in FIG.
2 determines the electronic components to be simultaneously sucked. In this case, since the pitch of the suction nozzles 13 is twice as large as the feeder pitch, a combination of electronic components (hereinafter referred to as “1”) that can be simultaneously suctioned from the tape feeders arranged one by one. Abbreviated as "jumpable suckable part"). Here, as a third condition, after the suction operation by the combination C1 shown in FIG. 7A is completed, a one-step jumpable component that can be reached by the transfer head 4 with the minimum moving distance is selected. . If there are a plurality of components that meet the third condition, the one with the larger number of components to be mounted is selected. Thereafter, as shown in FIG. 7C, the electronic components to be simultaneously sucked by the combination C3 are determined. Here, as the fourth condition, after the suction operation by the combination C2 shown in FIG. 7B is completed, an adjacent suctionable component that the transfer head 4 can reach with a minimum moving distance is selected. Also in this case, if there are a plurality of components that meet the fourth condition, the adjacent suctionable component with the larger number of mounted components is selected. In this way, the combinations C1, C2, C
After the electronic components are sucked and picked up by the six suction nozzles 13 constituting No. 3, the remaining mounting number histogram is removed from the six mounting nozzles as shown in FIG.
Change to a new shape. In other words, this indicates that the number of mountings is removed by the one reciprocating cycle of the transfer head 4 in the multiple pattern shown in FIG. In addition to this example, the multiple mounting pattern of this mounting number includes, as shown in FIG.
There are two multi-patterns shown in (c), all of which are patterns in which a plurality of electronic components are sequentially picked up by combinations C1, C2, and C3. In other words, if one of the three patterns shown in FIG. 8 is used to break down the peaks appearing in the remaining mounting number histogram, efficient mounting operation for taking out six electronic components in one reciprocating operation is always achieved. You are doing it. In order to be able to continue such mountain landslide, it is necessary that the shape of the remaining mounting number histogram does not show large partial unevenness from the beginning. Therefore, by selecting a histogram shape as shown in FIG. 5C, an efficient mounting operation is realized as a result. Thereafter, the combination of the electronic components determined as described above, that is, the path and the mounting order for transferring and mounting the six electronic components held by the suction nozzles 13 on the substrate 7 are set. You. The mounting order and the transfer path are set so as to satisfy the condition that the time required for the entire mounting operation is the shortest. Returning to the flow of FIG. 6 again, the mounting operation sequence determined by the above method is stored in the mounting operation sequence storage unit 23 (ST12). Then, the electronic components are picked up in accordance with the mounting operation sequence (ST13), and then the transfer head 4 is moved onto the substrate 7 to sequentially mount the electronic components (ST14). During the mounting operation, it is always checked whether each tape feeder has run out of components (ST15). Here, it is determined whether or not there is another tape feeder containing the same type of electronic component as the electronic component that has run out of components (ST16), and only one tape feeder is arranged for the same component. In this case, a notification of the running out of parts is given (ST17). If there is another tape feeder containing the same type of electronic component as the component that has run out of components, the remaining number of mounted tape feeders is distributed to other tape feeders (ST18). At this time, if there are a plurality of tape feeders to be distributed, the tape feeders should be picked up from the part feeder in which the part has run out in the same manner as in the example shown in FIG. The number of existing electronic components (remaining mounting number) is distributed. That is, for each of the other tape feeders, the sum of the remaining mounting numbers of the two adjacent tape feeders is calculated, and the number of mountings is distributed almost in proportion to the sum of the remaining mounting numbers. Add to
By allocating in such a manner, even when unforeseen component breaks occur, disturbances in the distribution of the number of remaining components can be minimized, and a decrease in mounting efficiency due to component breaks can be minimized. Next, after the distribution of the remaining mounting numbers,
Even in the case where no component run-out has occurred in step 15, the histogram of the remaining mounted number is updated (ST19). Then, it is confirmed whether the planned mounting work is completed (ST2).
0), if the mounting is completed, the mounting operation is ended; if not completed, the process returns to ST11, and the next mounting operation sequence is determined based on the updated remaining mounting number histogram. As described above, in the present embodiment,
A sequence of a mounting operation such as a pick-up operation of an electronic component and a transfer mounting operation to a substrate is determined in real time during the mounting operation. This makes it possible to determine the most efficient mounting operation sequence under the circumstances at the time, even when an unforeseeable situation such as running out of parts occurs. Can be suppressed. According to the present invention, the supply part of the electronic component is duplicated.
Multiple suction nozzles from several side-by-side parts feeders
Pick up electronic components with the transfer head provided
When mounted on the substrate, it is possible to perform multiple parts feeders or RaMinoru <br/> instrumentation efficiently implementation.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 (a) shows a transfer head of the electronic component mounting apparatus according to an embodiment of the present invention. Perspective view (b) Arrangement drawing of suction nozzles of a transfer head of the electronic component mounting apparatus according to one embodiment of the present invention. FIG. 3 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to one embodiment of the present invention. FIG. 4 is a flowchart of creating feeder arrangement data of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 5A is a diagram illustrating the remaining mounting of the supply unit of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 4B is a diagram illustrating a number histogram, and FIG. 4C is a diagram illustrating a remaining mounting number histogram of the supply unit of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 4D shows a histogram of the remaining number of mounted electronic components according to an embodiment of the present invention. FIG. 6 is a diagram showing a histogram of the remaining mounting number of the supply unit of the mounting apparatus. FIG. 6 is a flowchart showing processing after the start of an electronic component mounting operation according to an embodiment of the present invention. FIG. 6B is a diagram showing a remaining mounting number histogram in the mounting operation of the embodiment. FIG. 6C is a diagram showing a remaining mounting number histogram in the mounting operation of the embodiment of the present invention. FIG. 8 (d) is a diagram illustrating a histogram, and FIG. 8 (b) is a diagram illustrating a histogram of a remaining mounting number in the mounting operation according to the embodiment of the present invention. b) A diagram showing a multiple pattern in a mounting operation according to an embodiment of the present invention. (c) A diagram showing a multiple pattern in a mounting operation according to an embodiment of the present invention. Supply 3 tape feeder 4 mounting head 7 substrates 13 suction nozzles

Claims (1)

(57) [Claims 1] Electronic parts are picked up from a plurality of parts feeders arranged side by side in a supply part for electronic parts by a transfer head having a plurality of suction nozzles and mounted on a substrate. a method of mounting an electronic component, comprising the steps of creating a histogram implementation number of each type of electronic components mounted on the substrate, the type of electronic components as large irregularities in the number of mounted adjacent the electronic component does not occur a step of creating a histogram the number of mounted electronic components performing rearrangement, when the number of mounting there is an electronic component which projects, over the number of mounted electronic parts protruding n of
ex is divided into two mounting numbers ng1 and ng2.
And the ratio of the number of mounting ng1 to the number of mounting ng2 is
Two parts feeders on both sides sandwiching each insertion position
And distributing them so as to substantially match the ratio of the sum of the number of mounted electronic components.