JP3500080B2 - Electronics - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic equipment. 2. Description of the Related Art A general personal computer is provided with a memory, and this memory is provided with a CPU (CentralProceed) for controlling each circuit inside the personal computer.
The element is capable of writing and erasing various data processed by the ssingUnit. [0003] Such a memory is used for a CPU having a high processing speed.
When the CPU is used in connection with a CPU to process a large amount of data, it is desirable that the memory has a large capacity from the viewpoint of the data processing efficiency of the CPU. [0004] To increase the capacity of the memory, it is possible to increase the memory, and this expansion is performed by attaching a substrate having a memory element to a motherboard. In a large-sized personal computer called a desktop type, a memory board 2 can be vertically mounted on a motherboard 1 as shown in FIG.
See JP-A-5-110277). Therefore, it is easy to shorten the distance between the electrode groups 3 of the two memory substrates 2. Therefore, even when the operating speed is increased, it is possible to easily prevent the delay of the clock signal and the disturbance of the waveform due to the length of the signal line arranged between the electrode groups 3. On the other hand, in a small notebook personal computer, the distance from the bottom of the personal computer to the keyboard is short (thin).
The memory board 2 cannot be vertically mounted on a motherboard 1 on which a PU or the like is mounted and which is arranged parallel to the bottom surface. Therefore, a socket 4 is usually arranged on a motherboard 1 such as a notebook personal computer as shown in FIG. A socket 4 shown in FIG. 5 has a pair of first and second ends extending substantially perpendicular to the long side 41 from both ends of the long side 41 and extending parallel to the surface of the motherboard 1 on which the socket 4 is mounted. The first and second short sides 42 and 43 have a substantially U-shape. On the long side 41, n pieces (n is n) extending in parallel with each other between the inside of the socket 4 (the area surrounded by the long side 41 and the short sides 42 and 43) and the outside. A socket electrode group 5 composed of (positive integer) electrodes is provided. For convenience of explanation, the socket electrode group 5
Is referred to as an inner electrode end, and one end of each outer electrode is referred to as an outer electrode end. Further, each electrode of the socket electrode group 5 is referred to as a first electrode, a second electrode,..., An n-th electrode in order from the first short side 42 side. The long side 41 has a (m-1) th electrode and an mth electrode (m is 2 ≦ m ≦ n) of the socket electrode group 5 shifted from the center of the long side 41, and (Positive integer), a convex portion 6 protruding inward from the long side 41 in parallel with the extending direction of the short sides 42 and 43 is formed. The planar shape of the memory substrate 2 is substantially rectangular as shown in FIG. On the surface thereof, a memory element 7 is arranged and connected to the address terminal and the data terminal of the memory element 7 in a one-to-one correspondence.
The memory electrode group 8 including the plurality of electrodes is arranged on one long side (the right side in FIG. 5) of the memory substrate 2. For convenience of explanation, each electrode of the memory electrode group 8 is referred to as a first electrode, a second electrode,..., An n-th electrode in order from the lower side of the memory substrate 2 in FIG. The one long side is provided between the (m-1) -th electrode and the m-th electrode of the memory electrode group 8 by the protrusion 6.
Is formed with a concave notch 9 into which a can be fitted. The memory board 2 is mounted on the socket 4 so that the projection 6 and the notch 9 are fitted with each other so that the surface of the memory board 2 is parallel to the surface of the motherboard 1. This is done by plugging into 4. That is, the protrusion 6 functions as a positioning means when the memory board 2 is mounted. When the projection 6 and the notch 9 are fitted in this manner, the first electrode, the second electrode,..., The n-th electrode of the memory electrode group 8 are the first electrode of the socket electrode group 5, respectively. Electrode, second electrode: electrically connected to the inner electrode end of the n-th electrode. Therefore, the first electrode of the memory electrode group 8
The second electrode... N-th electrode and the first electrode of the socket electrode group 5, and the second electrode. It will be. In order to increase the number of memories using the socket 4 and the memory board 2, the same sockets 4 are added to the motherboard 1 as shown in FIG.
Memory boards 2 may be mounted on the respective devices. However, when sockets 4 of the same shape are linearly arranged in the same direction as shown in FIG. 5, the p-th electrode (p is p ≦ n
When connecting the same address or data terminals of the memory elements 7 arranged on the memory board 2 mounted on each socket 4 at least in the short side direction of the memory board 2 Signal lines are required. Generally, when the frequency of the operation clock is increased in order to improve the operation speed, the longer the length of such a signal line is, the more easily the signal line is affected by noise, and the operation becomes unstable. Also, as shown in FIG.
Are arranged facing each other so that the socket electrode group 5
Even if they are brought close to each other, a signal line for connecting the first electrode or the n-th electrode is longer than the length of the long side 41, and this does not completely solve the problem. According to an electronic apparatus of the present invention, a motherboard and a memory substrate having a main surface having a memory electrode group in which a series of electrodes are arranged are inserted, and the memory electrodes of the inserted memory substrate are inserted. A first socket having a first electrode group electrically connected to the motherboard in the same row as the group, and a memory board of the same form as the memory board inserted into the first socket are oriented in the direction of the main surface. A second electrode group which is inserted so as to be upside down with respect to the direction of the main surface of the memory board inserted into one socket, and which is electrically connected to the motherboard in the same arrangement as the memory electrode group of the inserted memory board; A second socket having: a main surface of the inserted memory board parallel to one surface of the motherboard, and the first and second electrode groups disposed on the motherboard so as to face each other. It is characterized by doing. FIG. 1 is a top view of the present embodiment. The first socket 10 shown in FIG. 1 is substantially perpendicular to the long side 101 from both ends of the long side 101, and the motherboard 1 on which the first socket 10 is mounted.
A pair of first and second short sides 102 extending parallel to the surface of
It has a substantially U-shape having 103. On the long side 101, a first electrode group 11 composed of n (n is a positive integer) electrodes extending parallel to each other between the inside and outside of the first socket 10 is arranged. ing. For convenience of explanation, the first socket 10
And each electrode of a second socket described later is connected to the first short side 102.
From the side, they are referred to as a first electrode, a second electrode,..., An n-th electrode (n is a positive integer). Further, the long side 101 is
Between the (m−1) th electrode and the mth electrode (m is 2 ≦ m ≦ n and a positive integer) of the first electrode group 11 shifted from the center of First convex portion 12 protruding inward from the long side 101 in parallel with the extending direction
Is formed. The second socket 13 is a substantially U-shaped socket, and a pair of first short side 132 and second short side 133 extend from one end of the long side 131 of the socket 13 in the same direction. . The long side 131 has a second socket 1
A second electrode group 14 composed of n electrodes extending parallel to each other between the inside and outside of the third electrode group 3 is arranged. Further, like the first socket 10, the long side 131 extends between the (m-1) th electrode and the m-th electrode of the second electrode group 14, and extends the short sides 132 and 133. A second convex portion 15 is formed to protrude inward from the long side 131 in parallel with the existing direction. The first socket 10 and the second socket 13 are connected to the outer side of the long side 101 of the first socket 10,
The motherboard is so arranged that the long side 131 of the second socket 13 faces the outside and the first electrode group 11 of the first socket 10 and the second electrode group 14 of the second socket 14 are on the same line. 1 is arranged on. FIGS. 2 and 3 are perspective views for explaining the mounting of the memory board on the memory socket of the present embodiment. The memory substrate 2 shown in FIGS.
Since the structure is the same as that of the memory substrate 2 described in the related art, the description is omitted. The mounting of the memory board 2 on the first socket 10 is carried out on the surface of the memory board 2 on which the memory elements 7 are not arranged so that the first projection 12 and the notch 9 are fitted. The memory board 2 is inserted into the first socket 10 such that the memory element 7 faces the surface of the motherboard 1 (face up) and the memory element 7 and the motherboard 1 are parallel. On the other hand, the mounting of the memory board 2 to the second socket 13 is performed such that the memory element 7 of the memory board 2 and the motherboard 1 are mounted such that the second projection 15 and the cutout 9 are fitted. The memory board 2 is inserted into the second socket 13 so that the memory element 7 and the motherboard 1 are parallel to each other. As described above, the first and second convex portions 12 and 15
When the notch 9 is fitted with the first electrode, the second electrode... N-th electrode of the memory electrode group 8 are the first electrode and the second electrode of the first and second electrode groups 11 and 14, respectively. Electrode ... nth
It is electrically connected to the inner electrode end of the electrode. The electrodes of the first electrode group 11 of the first socket 10 shown in FIG.
The electrode is bent in a U-shape as viewed from the side, and the electrode also extends outside the long side 101. On the other hand, the second socket 13 shown in FIG.
The electrodes of the electrode group 14 are inside the long side 131 and the second short side 13
The electrode is bent in a U-shape as viewed from the third side, and the electrode also extends outside the long side 131. The first and second sockets 10 of the memory board 2
At the time of mounting on the memory 13, the memory electrodes 2 of the memory board 2 are surrounded by the electrodes of the first and second electrode groups 11 and 14 of the first and second sockets 10 and 13, respectively. The substrate 2 is inserted. As described above, in this embodiment, the two memory boards 2 are turned face up and face down, respectively, with the first and second sockets 1.
0 and 13 can be attached. Further, the sockets 10 and 13 are arranged on the motherboard 1 such that the long sides of the two sockets 10 and 13 are opposed to each other and the first electrode group 11 and the second electrode group 14 are on the same line. did. With such an arrangement of the sockets 10 and 13, it is possible to shorten a signal line connecting between the electrodes through which the same signal of the first and second sockets 10 and 13 flows. According to the present invention, the sockets can be arranged on the motherboard so that the distance between the electrodes through which the same signal of the two sockets flows can be made as short as possible. This has the effect of preventing disturbance of the signal waveform.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top view showing an embodiment of the present invention. FIG. 2 is a perspective view showing mounting of a memory board to a socket of the embodiment. FIG. 3 is a perspective view showing the mounting of the memory board to the socket of the embodiment. FIG. 4 is a perspective view showing a conventional example in which a memory board is vertically mounted on a motherboard. FIG. 5 is a top view showing a conventional example. FIG. 6 is a top view showing a conventional example. [Description of Signs] 1 Motherboard 2 Memory board 3 Electrode group 4 Socket 5 Socket electrode group 5 6 Convex part 7 Memory element 8 Memory electrode group 9 Notch 10 First socket 11 First electrode group 12 First convex part 13 Second Socket 14 Second electrode group 15 Second convex portion 41 Long side 42 First short side 43 Second short side 101 Long side 102 First short side 103 Second short side 131 Long side 132 First short side 133 Second short side

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-10-3523 (JP, A) JP-A-10-49268 (JP, A) JP-A-5-191066 (JP, A) JP-A-62 202595 (JP, A) JP-A-8-288663 (JP, A) JP-A 6-13192 (JP, U) JP-A 2-58391 (JP, U) JP-A 48-111848 (JP, U) 1-108775 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 7/14, 1/14

Claims (1)

(57) Claims 1. A memory having on its main surface a motherboard and a memory electrode group in which a series of electrodes are arranged.
The board is inserted, and the memory electrode group of the inserted memory board
The same as the first and electrically connected to the motherboard
A first socket having one electrode group, and a memory board having the same form as a memory board inserted into the first socket.
The memory board inserts the orientation of its main surface into the first socket
Memory board to be upside down.
Inserted, same as memory electrode group of inserted memory board
Second electrodes electrically connected to the motherboard side by side
A second socket having a group, and each main surface of the inserted memory board is connected to the motherboard.
And the first and second electrode groups are opposed to each other.
An electronic device, wherein the electronic device is disposed on the motherboard .