JP3501555B2 - Method for manufacturing liquid jet recording head - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a liquid jet recording head for generating a recording liquid droplet for use in an ink jet method, a liquid jet recording equipment with the recording head, a liquid jet recording with the liquid jet recording head head kit, is
Further, it relates to a method for manufacturing a liquid jet recording head . It should be noted that the term "recording" as used herein includes ink application and the like (printing) to all ink supports that receive ink such as cloth, thread, paper, and sheet material. It includes a printer as its output device, and the present invention can be applied to these.

[0002]

2. Description of the Related Art As a means for producing a liquid jet recording head applied to an ink jet recording system, a first substrate on which an ink ejection pressure generating element is conventionally formed is joined to a second substrate on which an ink ejection port is formed. It is known how to do it. Japanese Unexamined Patent Publication No. 62-264975 discloses a method of forming a polymer barrier layer on the first substrate, disposing the second substrate, and joining the two by heat and pressure. Here, examples of the polymer barrier layer include dry films such as Liston (registered trademark) and Berklel (registered trademark) marketed by DuPont.
Further, in US Pat. No. 4,774,530, a silicon substrate, in which an ink flow path is formed by anisotropic etching as a second substrate, is formed on the first substrate on which an ink ejection pressure generating element is formed, by using the above liston, barrel or An example is shown in which a liquid jet recording head is manufactured by adhering it through a polyimide film and cutting it at a required position.

However, when the printer is exposed to a severe environment, as described in Japanese Patent Publication No. 63-502015 (P2), the resin used as the adhesive layer is the first or the first. Peeling occurs at the interface between the second substrate and the adhesive layer, which hinders the operation of the printer. Further, according to the study by the present inventors, it was found that the adhesive layer made of Liston, Burcquerel, polyimide, or the like significantly promotes the peeling of the interface when weakly alkaline ink is used.

Here, the ink applied to the ink jet recording system is required to have properties such as plain paper printability, water resistance of the printed matter, and a function of preventing clogging of the ink ejection port due to evaporation of water. One way to meet these characteristics is to make the ink weakly alkaline. That is, by using a dye having a high solubility in a weakly alkaline aqueous solution, it is possible to obtain a printed matter having high water resistance to neutral water, and for the purpose of preventing clogging. It is possible to use an additive such as urea having an excellent water retention capacity. In this case, urea is hydrolyzed over time,
The aqueous solution exhibits weak alkalinity.

That is, in consideration of long-term use or use of alkaline ink, an adhesive having stronger adhesive force and high alkali resistance is required.

As a method for solving the above problems, the method described in Japanese Patent Publication No. 63-502015 has been proposed. In this method, a first substrate having an ink ejection port formed by electroforming is plated with gold, and the first substrate and a second substrate having an ink ejection pressure generating element are joined by solder. It is a thing. However, in this method, it is necessary to separately provide a solderable layer on the second substrate on which the ink ejection pressure generating element is formed, and in general, a silicon substrate is used as the substrate on which the ink ejection pressure generating element is formed. Wafers are best, but
Since silicon or silicon oxide cannot be soldered, the number of steps increases, resulting in high cost, and further, the use of solder has the drawback of lacking thermal stability.

Further, US Pat. No. 4,678,529 shows an example of bonding a substrate on which an ink ejection pressure generating element is formed and a silicon substrate on which an ink flow path is formed by anisotropic etching. However, there is no mention of what kind of compound is most suitable as an adhesive.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and a second base for forming an ink ejection port and a first substrate on which an ink ejection pressure generating element is formed.
As an adhesive for joining the bases of No. 1 and No. 2, a material that maintains a strong adhesive force during long-term use and has excellent alkaline ink resistance is provided. The main object of the invention is to improve the reliability of the liquid jet recording head and the liquid jet recording apparatus having the recording head by integrating the substrate of (1).

[0009]

In order to achieve the above object, the present invention is an adhesive for bonding a first substrate on which an ink ejection pressure generating element is formed and a second substrate on which an ink ejection port is formed. It is achieved by using a cationically polymerized cured product of an epoxy resin for the layer.

[0010]

[0011]

[0012]

[0013]

[0014]

[0015]

[0016]

[0017]

[0018]

[0019]

That is, according to the present invention, the first substrate on which the ink ejection pressure generating element is formed, the second substrate on which the first substrate is integrated to form the ink ejection port, or the ink ejection port. In a method of manufacturing a liquid jet recording head, wherein a second substrate having an outlet is integrated with an adhesive layer, in either of the first substrate or the second substrate,
Forming an adhesive layer containing at least an epoxy resin and a cationic polymerization initiator, it is semi-cured light irradiation portion of the adhesive layer by light irradiation of the adhesive layer, path of the adhesive layer
A step of performing turning, and a step of laminating a substrate having an adhesive layer formed thereon with a substrate having no adhesive layer formed thereon via the semi-cured adhesive layer, and heating to completely cure the adhesive layer, It is characterized in that the first substrate and the second substrate are integrated by an adhesive layer containing a cationically polymerized cured product of an epoxy resin. In the present invention, the adhesive layer may further contain a reducing agent. Also before
The second substrate has the ink supply port and the ink ejection port integrally formed.
It can be a molded member.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION As described above, the adhesive layer typified by Liston and Berklel may peel from the substrate due to long-term use or use of alkaline ink. It is believed that these are because the adhesive layer undergoes hydrolysis. Therefore, the present inventor has conducted intensive studies on adhesives having low hydrolyzability, and has found that a cationically cured product of an epoxy resin is optimal, and has reached the present invention. When the epoxy resin is cured by cationic polymerization, the cross-linking structure becomes an ether bond, so that an adhesive layer having excellent hydrolysis resistance can be formed.

In order to obtain a cationically cured product of an epoxy resin, conventionally known epoxy resins and cationic polymerization initiators can be preferably used. As the epoxy resin, a reaction product of bisphenol A and epichlorohydridone, a reaction product of phenol novolac or o-cresol novolac and epichlorohydrin, and JP-A-60-
-161973, JP-A-63-221121, JP-A-64-9216, and JP-A-2-1402.
Examples thereof include epoxy compounds having an oxycyclohexane skeleton described in JP-A-19. These epoxy resins having various molecular weights and introduced with a substituent are easily available, and can be appropriately selected according to the purpose. Furthermore, any cationically polymerizable compound such as a cyclic ether other than an epoxy group can be applied to the present invention.

As the cationic polymerization initiator, aromatic onium salts [J. POLYMER SCI: Symposi
um No. 56 383-395 (1976)], Irgacure 261 (registered trademark) marketed by Ciba Geigy, and S marketed by Asahi Denka Kogyo.
P-150 (trade name), SP-170 (trade name), and the like. These cationic polymerization initiators initiate cationic polymerization by irradiation with ultraviolet rays. In addition, CP-66 (brand name), CP- marketed by Asahi Denka Kogyo
77 (trade name) or a combination of an aromatic onium salt and a reducing agent (Japanese Patent Application No. 54-102394, J. POLY).
MER SCI: Polymer Chemical
Edition Vo 1121, 97-109 (198
According to 3), cationic polymerization is initiated by heating.

Further, additives and the like can be appropriately added to these epoxy cured product compositions, if necessary. For example, a silane coupling agent or the like may be added to further improve the adhesion.

Next, the usage of the adhesive of the present invention will be described in detail. First, for the type in which the reaction is initiated by heating as the cationic polymerization initiator, an adhesive layer is appropriately formed on the adhesive portion between the first substrate on which the ink ejection pressure generating element is formed and the second substrate forming the ink ejection port. After being formed and bonded, they may be bonded by heating.

Next, the type in which the cationic polymerization initiator initiates the reaction by light irradiation or light irradiation + heating will be described. In this case, the adhesive layer can be patterned by light irradiation, and the adhesive layer can be formed into the first or second adhesive layer by using a conventionally known photolithography technique.
It has an advantage that it can be formed at any position and thickness of the substrate.
That is, when the adhesive layer has a predetermined thickness and acts as a part of the ink flow path, or it is difficult to selectively form the adhesive layer only on the bonded portion of the first or second substrate. In particular, it is especially effective. Specifically, after the adhesive layer is uniformly formed on the first or second substrate by spin coating, a roll coater, or the like, patterning is performed by light irradiation (the light irradiation portion undergoes a cationic polymerization reaction, and the non-irradiation portion). (Solubility in solvent changes and patterning becomes possible) .After forming the adhesive layer at a predetermined position and thickness, bond it with the substrate without the adhesive layer, and completely heat the adhesive. By hardening, it joins.

Here, when an aromatic onium salt is used alone as a cationic polymerization initiator, it is often necessary to heat at high temperature for a long time to completely cure the adhesive after bonding. It is preferable to add a reducing agent to be described later to make the conditions for complete curing mild.

In the above method, the adhesive layer is cured (semi-cured state without being completely cured) to such an extent that it can be patterned by light irradiation, and the first or first adhesive layer is not formed. After bonding with the second substrate, it is necessary to completely cure it by heating. To make the epoxy resin semi-cured by such light irradiation,
This can be achieved by appropriately controlling the type, addition amount, and light irradiation amount of the epoxy resin and the cationic polymerization initiator. That is, the epoxy resin has different reactivity to cations depending on its structure (generally, the alicyclic epoxy resin has higher reactivity to cations than the aromatic epoxy resin), and the cationic polymerization initiator is The crosslink density of the epoxy resin differs depending on the type of the counter anion.

In particular, this difference in reactivity depending on the type of counter anion is preferably utilized in the present invention. That is, when PF ₆ ⁻ was used as the counter anion of the onium salt, the crosslinking density was increased in the photopolymerization reaction, and the reaction was stopped in the semi-cured state, as compared with the case where Sb ₆ ⁻ was used. In this state, patterning is performed using an appropriate solvent to bond the first or second substrate on which the adhesive layer is not formed, and when heated, the reaction proceeds completely due to the action of the reducing agent described later (onium). In a thermal reaction in which a salt and a reducing agent are used in combination, the reaction proceeds completely regardless of the type of counter anion of the onium salt), the first and second
Strongly adheres the substrate.

In order to explain the above reaction mode in detail,
A specific example will be described below.

As the epoxy resin, o-cresol novolac epoxy (Epicote 1 manufactured by Yuka Shell Epoxy Co., Ltd.)
54), onium salts of 4,4'-di -t- butyl diphenyl iodonium hexafluorophosphate (PF ₆ ^- If the salt), using copper triflate as a reducing agent, also be much photoreaction, the epoxy The glass transition temperature of the cured product is only about 100 ° C. However, patterning with an appropriate organic solvent is possible in this state. Then, the cured product is heated to 150 ° C.
On heating, the onium salt reacts with the reducing agent, and the glass transition temperature of the cured product rises to about 210 ° C.

On the other hand, as an onium salt, 4,4'-di-
t-Butyl hexafluoroantimonate (SbF
₆ ^- salt), the glass transition temperature of the cured product rises to about 150 ° C. only by photoreaction, and by heating at 150 ° C.,
The glass transition temperature is about 210 ° C. Here, when bonding the first or second substrate adhesive layer is not formed, it is expected that those who unreacted portion is more remaining is more strongly adhesive, PF ₆ ^- salt There SbF ₆ ^- it is advantageous for salt is understood.

[0033] Of course, SbF ₆ ^- in the case of using salts, adjusting the amount of light irradiation, the adjustment of the addition amount, the method of addition of the reaction inhibitor, the use to lower the glass transition temperature after light irradiation can in and, PF ₆ ^- benefits of using salt,
It is to be able to easily make a semi-cured state without special measures.

Next, the reducing agent used in the adhesive layer of the present invention will be described. The reducing agent thermally reacts with an onium salt to promote cationic polymerization, and examples thereof include a copper compound and an organic acid. Of these compounds, so-called redox type compounds having high reactivity and rapidly reacting at a certain temperature (preferably 100 ° C. or higher) are preferable, and specific examples thereof include copper triflate and ascorbic acid.

[0035]

The present invention will be described in more detail with reference to the following examples.

(Example 1) Reference Example In this example, an example in which an epoxy resin is cationically polymerized by heating an adhesive layer will be described. First, as shown in FIG. 1, a substrate (first substrate) 1 on which an ink ejection pressure generating element 10 (electrodes for energizing are not shown) is formed by the method described in US Pat. No. 4,829,324, and ink. A silicon substrate (second substrate) 2 having the ejection port 21 and the ink supply port 22 formed by anisotropic etching is prepared. Next, the composition shown in Table 1 below as an adhesive is dissolved in methyl isobutyl ketone (MIBK), and formed on the PET film by spin coating to a thickness of about 3 μm. Then, this film is pressed onto the substrate 2 to transfer the adhesive layer 30 to the adhesive surface 23 of the substrate 2 (FIG. 2). Finally, after the substrates 1 and 2 are aligned with each other, they are bonded (FIG. 3) and heated at 150 ° C. for 1 hour to cause the adhesive to undergo cationic polymerization to bond the two substrates. The recording head thus obtained was filled with the ink having the composition shown in Table 2 and stored at 60 ° C. for 3 months, but no peeling between the substrates was observed. The composition shown in Table 2 shows weak alkalinity (PH about 10), and it is understood that the adhesive layer of the present invention has excellent alkali resistance.

[0037]

[Table 1]

[0038]

[Table 2]

(Embodiment 2) This embodiment shows an example in which the adhesive layer is patterned by light irradiation and is completely cured by heating. First, a substrate (first base) 1 and a substrate (second base) 2 shown in FIG. 4 are manufactured by the method described in US Pat. No. 4,774,530. Then, the composition shown in Table 3 below was prepared as an adhesive on the substrate 1 by MI.
It is dissolved in BK and spin-coated to form a film having a thickness of 20 μm. Next, Canon Mask Aligner P
The LA600FA (using a cold mirror CM250) is used to pattern the adhesive layer 30 forming a part of the ink flow path. Exposure time is 10 minutes, after bake is 5
Development for 30 minutes at 0 ° C., MIBK / ethanol = 2/1
(Fig. 5). The adhesive layer 30 is in a semi-cured state at this point. Next, after the substrates 1 and 2 are aligned, they are joined and heated at 150 ° C. for 1 hour to cause the onium salt and the reducing agent to react, so that the adhesive layer 30 is completely cured and the substrates 1 and 2 are bonded. (Fig. 6).

The recording head thus obtained was applied to Example 1
Similarly, the inks shown in Table 2 were filled and stored at 60 ° C. for 3 months, but no peeling between the substrates was observed.

[0041]

[Table 3]

(Embodiment 3) In this embodiment, the head forming method described in JP-A-62-264957 is used.
An example in which the adhesive of the present invention is applied will be shown. As shown in FIG. 7, the ink ejection pressure generating element 10 and the ink supply port 2
A substrate (first substrate) 1 on which the ink discharge port 21 is formed and a substrate (second substrate) 2 on which the ink ejection port 21 is formed are manufactured. Then, the composition shown in Table 3 was applied to the substrate 1 by MIB.
It is dissolved in K and coated on a PET film to a thickness of 30 μm. The dry film thus obtained is laminated on the substrate 1, and the adhesive layer 3 is selectively irradiated with light.
0 was patterned on the substrate 1 (FIG. 8).

The adhesive layer 30 is further irradiated with light to be in a semi-cured state. Next, the substrates 2 are aligned and joined together, and heated at 150 ° C. for 1 hour to cause the onium salt and the reducing agent to react, thereby completely curing the adhesive layer 30,
The substrates 1 and 2 are adhered (FIG. 9).

The recording head thus obtained was used in Example 1
Similarly, the inks shown in Table 2 were filled and stored at 60 ° C. for 3 months, but no peeling between the substrates was observed.

(Embodiment 4) In this embodiment, an application example of the form shown in Embodiment 3 is shown. That is, the barrier 24 that forms a part of the ink flow path is formed on the substrate (first base) 1 by using the dry film Berkrel (registered trademark) manufactured by DuPont (FIG. 10). Next, an adhesive layer having the composition shown in Table 3 is uniformly formed on the substrate 1 by a roll coating method, and then the adhesive layer 30 is patterned by light irradiation so as to cover the barrier 24 (FIG. 11). Adhesive layer 3
0 is in a semi-cured state at this point. Hereinafter, the recording head obtained in the same manner as in Example 3 showed the same alkali resistance as the recording head in Example 3.

In the mode of this embodiment, it is clarified that the range of selection of the material forming the barrier can be expanded. For example, according to the method of the present embodiment, even a material that cannot be used conventionally because of excellent patterning property of the barrier 24 but poor ink resistance can be used.

(Embodiment 5) In this embodiment, Japanese Patent Laid-Open No. 2-1 is used.
Examples of using the adhesive of the present invention in the head manufacturing methods described in Japanese Patent No. 87345 and Japanese Patent Laid-Open No. 2-187346 are shown. As shown in FIG. 12, the ink ejection pressure generating element 1
A substrate (first substrate) 1 on which 0 is formed, and a member (second substrate) 2 on which the ink ejection port 21 is formed by an excimer laser after the ink supply port 22 and the ink ejection port are integrally molded. To make. Next, an adhesive having the composition shown in Table 4 below was MIBK / ethanol = 2 on the substrate 1.
/ 1, and applied by spin coating, transfer method,
The adhesive layer 30 is formed by light irradiation (FIG. 13). Next, the member 2 is aligned and then joined, and heated at 150 ° C. for 30 minutes to completely bond the substrate 1 and the member 2 (FIG. 14). The recording head thus obtained is
It exhibited alkali resistance similar to that of the recording heads of Examples 1 to 4.

As an application example of this embodiment, Bk,
In an integrated color recording head capable of ejecting four color inks of Y, M and C, it is necessary that the substrate 1 and the member 2 are completely in contact with each other in order to prevent color mixture between colors. The adhesive can be used particularly preferably.

[0049]

[Table 4]

(Others 1) The present invention provides excellent effects particularly in a liquid jet recording (ink jet recording) system, that is, a bubble jet recording head and a recording apparatus.

Regarding the typical structure and principle thereof, see, for example, US Pat. Nos. 4,723,129 and 4740.
No. 796. What is done using the basic principles is preferred. This method can be applied to both so-called on-demand type and continuous type,
Especially in the case of the on-demand type, at least one drive signal corresponding to the recording information is applied to the electrothermal conversion element arranged corresponding to the sheet or liquid path holding the liquid jet recording head (ink). By doing so, heat energy is generated that causes a rapid temperature rise in the electrothermal converter that exceeds nucleate boiling, causing nucleate boiling on the heat-acting surface of the recording head, and as a result, one-to-one correspondence with this drive signal. It is effective because bubbles can be formed in the liquid (ink). Liquid (ink) flows through the discharge holes due to the growth and contraction of these bubbles.
To form at least one drop.

When the driving signal has a pulse shape, the growth and contraction of the bubbles are immediately and appropriately performed, so that it is possible to achieve the ejection of the liquid (ink) with excellent responsiveness, which is more preferable.
As the pulse-shaped drive signal, US Pat. No. 446 is used.
Those described in 3359 and 4345262 are suitable. As an invention relating to the rate of temperature rise of the heat acting surface, US Pat.
If the conditions described in the specification No. 124 are adopted, more excellent recording can be performed.

As the constitution of the recording head, a combination constitution of a discharge hole, a liquid flow passage and an electrothermal converter element as disclosed in the above-mentioned respective specifications (straight liquid flow passage or right-angled liquid flow passage) In addition to the above, a configuration using US Pat. No. 4,558,333 and US Pat. No. 459600, which disclose a configuration in which a heat acting portion is arranged in a bending region, is also included in the present invention. In addition, Japanese Unexamined Patent Publication No. 59-123670 discloses a configuration in which a common slit is used as a discharge portion of an electrothermal converter element for a plurality of electrothermal converter elements, and an opening for absorbing a pressure wave of thermal energy. The present invention is effective even if the configuration is based on Japanese Patent Application Laid-Open No. 59-138461, which discloses a configuration in which the holes react with the ejection holes.

Further, as a full line type recording head capable of simultaneously recording over the entire width of the recording paper, a combination of a plurality of recording heads as disclosed in the above-mentioned specification can be used to satisfy the length, The present invention can exert the above-mentioned effects more effectively, though it may have any one of the constitutions as a single recording head formed in a specific manner.

In addition, by being mounted on the apparatus main body, it can be electrically connected to the apparatus main body and can be supplied with ink from the apparatus main body by a replaceable chip type recording head or the recording head itself. The present invention is also effective for a cartridge type recording head that is provided in a specific manner. Further, it is preferable to add a recovery means for the recording head, a preliminary auxiliary means, etc. to the recording apparatus because the effect of the recording head obtained by the present invention can be further stabilized. Specific examples thereof include capping means, cleaning means, pressure or suction means for the recording head, electrothermal transducer elements or heating elements other than these, or preheating means by a combination thereof, It is also effective to perform stable recording by adding a means for performing a preliminary ejection mode for performing ejection different from recording.

Further, the recording mode of the recording apparatus is not limited to the mode in which only the mainstream color such as black is recorded, but may be an apparatus in which the recording head is integrally formed or a combination of a plurality of recording heads. The present invention is also extremely effective for a recording head of an apparatus having at least one of a multicolored color and a full-colored mixed color.

The recording head obtained by the present invention is an ink which solidifies at room temperature or below even if the ink is not a liquid, and becomes soft or liquid at room temperature, or is generally used in ink jet. It can also be applied to those that become soft or become liquid at a temperature adjustment range of 30 ° C or higher and 70 ° C or lower. That is, the ink may be in a liquid state when the recording signal is applied.
In addition, ink that is positively absorbed by heat energy is prevented by absorbing it as energy for the state conversion of the ink from a solid state to a liquid state, or an ink that solidifies in a standing state for the purpose of preventing evaporation of the ink. In any case, heat such as ink that is liquefied and ejected as an ink state by applying heat energy according to the recording signal or that has already started to solidify when it reaches the recording medium. The use of ink which has the property of being liquefied only by energy is also applicable to the recording head according to the present invention.

In such a case, the ink is described in JP-A-54-5.
As described in Japanese Patent No. 66847 or Japanese Patent Application Laid-Open No. 60-71260, it is opposed to the electrothermal converter element while being held as a liquid or solid in the recess or through hole of the porous sheet. It may be in the form. In the present invention, the most effective one for each of the above-mentioned inks is to execute the above-mentioned film boiling method.

FIG. 15 is an external perspective view showing an example of an ink jet recording apparatus (IJRA) in which the liquid jet recording head obtained by the present invention is mounted as an ink jet cartridge (IJC).

In the figure, reference numeral 220 denotes an ink jet cartridge (I) provided with a group of nozzles for ejecting ink in opposition to the recording surface of the recording paper fed onto the platen 224.
JC). Reference numeral 16 denotes a carriage HC that holds the IJC 220, and is connected to a part of a drive belt 218 that transmits the driving force of the drive motor 217, and is slidable with two guide shafts 219A and 219B arranged in parallel with each other. By doing so, reciprocating movement over the entire width of the recording paper of the IJC 220 becomes possible.

Reference numeral 226 denotes a head recovery device, which is IJC2.
It is arranged at one end of the movement path of 20, for example, a position facing the home position. The head recovery device 226 is operated by the driving force of the motor 222 via the transmission mechanism 223, and the IJC 220 is capped. IJC by the cap portion 226A of the head recovery device 226
In association with capping to the 220, ink is sucked by an appropriate suction means provided in the head recovery device 226 or ink is pressure-fed by an appropriate pressurizing means provided in the ink supply path to the IJC 220 to discharge the ink. Ejection recovery processing such as removing the thickened ink in the nozzle by more forcibly discharging is performed. Also, the IJC 220 is protected by capping at the end of recording or the like.

Reference numeral 230 is a blade as a wiping member which is disposed on the side surface of the head recovery device 226 and is made of silicon rubber. The blade 230 is held by the blade holding member 230A in the form of a cantilever, and like the head recovery device 226, the motor 222 and the transmission mechanism 2 are provided.
23, it becomes possible to engage with the ejection surface of the IJC 220. This allows the IJC 220 to perform the recording operation at an appropriate timing, or the head recovery device 22.
After the ejection recovery process using No. 6, the blade 230 is IJC
The protrusion 220 is projected in the moving path of the IJC 220, and the dew condensation, the wetting, the dust or the like on the ejection surface of the IJC 220 is wiped off as the IJC 220 moves.

(Others 2) Further, in the liquid jet recording head of the present invention, a liquid jet recording head kit having the head can be constructed. FIG. 16 is a schematic diagram showing such a liquid jet recording head kit. The kit 500 includes an ink ejecting section 51 for ejecting ink.
1, a liquid ejection recording head 510 of the present invention, an ink container 520 which is an inseparable or separable liquid container from the head, and an ink filling means 530 holding ink for filling the ink container. It is stored in the kit container 501.

When the ink has been consumed, the insertion portion (injection) of the ink filling means 530 is inserted into the atmosphere communication port 521 of the ink container, the connection portion with the recording head, the hole formed in the wall of the ink container, or the like. (A needle, etc.) 531 is partially inserted,
The ink in the ink filling means may be filled in the ink container via the insertion portion.

As described above, the liquid jet recording head 510 of the present invention, the ink container 520, the ink filling means 530 and the like are housed in one kit container 501 to form the kit 500, and ink is consumed. As described above, the ink can be filled in the ink container immediately and easily, and the recording can be started quickly.

Although the liquid jet recording head kit 500 of this embodiment has been described as including the ink filling means 530, the kit is the ink filling means 53.
A separable type ink container 520 filled with ink without 0 may be contained in the kit container 501.

[0067]

As described above, in the liquid jet recording head of the present invention, the adhesive layer for joining the first substrate on which the ink ejection pressure generating element is formed and the second substrate on which the ink ejection port is formed. In addition, a cationically cured product of an epoxy resin is used. The cationic polymerization effect product of this epoxy resin is a material that maintains a strong adhesive force during long-term use and is excellent in alkaline ink resistance. By integrating the substrate of (1), the reliability of the liquid jet recording head and the liquid jet recording apparatus having the recording head can be improved.

[Brief description of drawings]

FIG. 1 is a schematic diagram of a manufacturing process of a recording head for explaining a first embodiment of the present invention in which an adhesive of the present invention is applied to a recording head having a known structure.

FIG. 2 is a schematic diagram of a manufacturing process of a recording head for explaining the first embodiment of the present invention in which the adhesive of the present invention is applied to a recording head having a known structure.

FIG. 3 is a schematic diagram of the manufacturing process of the recording head for explaining the first embodiment of the present invention in which the adhesive of the present invention is applied to a recording head having a known structure.

FIG. 4 is a schematic diagram of a manufacturing process of a recording head for explaining a second embodiment of the present invention in which the adhesive of the present invention is applied to a recording head having a known structure.

FIG. 5 is a schematic diagram of the manufacturing process of the recording head for explaining the second embodiment of the present invention in which the adhesive of the present invention is applied to the recording head having a known structure.

FIG. 6 is a schematic diagram of a manufacturing process of a recording head for explaining a second embodiment of the present invention in which the adhesive of the present invention is applied to a recording head having a known structure.

FIG. 7 is a schematic diagram of a manufacturing process of a recording head for explaining the third embodiment of the present invention in which the adhesive of the present invention is applied to a recording head having a known structure.

FIG. 8 is a schematic diagram of a manufacturing process of a recording head for explaining the third embodiment of the present invention in which the adhesive of the present invention is applied to a recording head having a known structure.

FIG. 9 is a schematic diagram of a manufacturing process of a recording head for explaining the third embodiment of the present invention in which the adhesive of the present invention is applied to a recording head having a known structure.

FIG. 10 is a schematic manufacturing process diagram of a recording head for explaining the fourth embodiment of the present invention in which the adhesive of the present invention is applied to a recording head having a known structure.

FIG. 11 is a schematic diagram of a manufacturing process of a recording head for explaining the fourth embodiment of the present invention in which the adhesive of the present invention is applied to a recording head having a known structure.

FIG. 12 is a schematic diagram of a manufacturing process of a recording head for explaining the fifth embodiment of the present invention in which the adhesive of the present invention is applied to a recording head having a known structure.

FIG. 13 is a schematic view of a recording head manufacturing process for explaining the fifth embodiment of the present invention in which the adhesive of the present invention is applied to a recording head having a known structure.

FIG. 14 is a schematic diagram of the manufacturing process of the recording head for explaining the fifth embodiment of the present invention in which the adhesive of the present invention is applied to the recording head having a known structure.

FIG. 15 is a perspective view showing an example of an ink jet recording apparatus (liquid ejection recording apparatus) equipped with the liquid ejection recording head of the present invention.

FIG. 16 is a schematic view showing a head kit having the liquid jet recording head of the present invention.

[Explanation of symbols]

1 Substrate on which ink ejection pressure generating element 10 is formed 2 Base for forming ink ejection port 21 10 Ink ejection pressure generating element 21 ink outlet 22 Ink supply port 30 adhesive layer

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Claims (3)

(57) [Claims] 1. A first substrate on which an ink ejection pressure generating element is formed, a second substrate integrally formed with the first substrate to form an ink ejection port, or an ink ejection port is formed. In a method for manufacturing a liquid jet recording head, which integrates a second substrate with an adhesive layer, at least one of the first substrate and the second substrate contains at least an epoxy resin and a cationic polymerization initiator. Forming an adhesive layer, semi-curing the light-irradiated portion of the adhesive layer by light irradiation of the adhesive layer, patterning the adhesive layer, and through the semi-cured adhesive layer Laminating the substrate on which the adhesive layer is formed and the substrate on which the adhesive layer is not formed,
A step of heating to completely cure the adhesive layer, wherein the first substrate and the second substrate are integrated with an adhesive layer containing a cationically polymerized cured product of an epoxy resin. Head manufacturing method. 2. The method for manufacturing a liquid jet recording head according to claim 1, wherein the adhesive layer further contains a reducing agent. 3. The second substrate is an ink supply port and ink.
The discharge port is a member integrally molded with the discharge port according to claim 1.
Manufacturing method of liquid jet recording head.