JP3502783B2 - Semiconductor device and manufacturing method thereof - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device composed of an LSI bare chip component and a printed circuit board, and a method of manufacturing the semiconductor device, and more particularly, to a semiconductor device and a method of manufacturing the semiconductor device that improve connection reliability. Regarding

[0002]

2. Description of the Related Art A bare chip component of an LSI and a printed circuit board are formed, and a protruding electrode formed on a chip electrode of the bare chip component is electrically connected to a substrate electrode of the printed circuit board while the bare chip component and the printed circuit board are printed. 2. Description of the Related Art A mounting structure of a semiconductor device is known which is formed by fixing a substrate and an adhesive using an adhesive. In this semiconductor device mounting structure, the joint reliability between the protruding electrode and the substrate electrode is an important factor.

By the way, the coefficient of thermal expansion of bare chip material silicon is about 4 ppm / ° C, whereas the coefficient of thermal expansion of a printed circuit board which is an organic material is about 15 ppm / ° C.
° C. Further, the adhesive filled between the bare chip component and the substrate has a function of mechanically fixing the two dissimilar materials and alleviating the stress concentration on the joint portion caused by the difference in thermal expansion coefficient. Furthermore, in the case of the mounting structure of the semiconductor device described above, since there is no solder or conductive paste material, the contact pressure (contact pressure) between the protruding electrode and the substrate electrode maintains the conduction between the electrodes due to the curing shrinkage force of the adhesive. It will be especially important in doing so.

In the case of an epoxy adhesive, it is in a viscous liquid state before being cured. When the temperature is raised, the viscosity is lowered to be in a "shabu-shabu" state, and when the temperature is further raised, the chemical reaction between the epoxy resin as the main ingredient and the curing agent proceeds at once. If the temperature is kept high until the curing reaction is completed, and then the temperature is lowered, it is in a “rubbery” soft state up to the glass transition temperature, but the adhesive is in a “hard” state near the glass transition temperature. And the volume shrinks, and the volume gradually decreases at a rate determined by the thermal expansion coefficient of the resin.

The stress centered on the curing shrinkage force generated by the shrinkage of the resin draws the space between the protruding electrode and the substrate electrode, so that the contact pressure (contact pressure) between the protruding electrode and the substrate electrode is increased. Will be maintained.

FIG. 10 shows a block diagram of the prior art. In FIG. 1A, a semiconductor device is composed of an LSI bare chip component 51 and a printed circuit board 52, and a protruding electrode 54 formed on a chip electrode 53 of the bare chip component 51 is replaced with a substrate electrode 56 of the printed circuit board 52. It is configured by fixing the bare chip component 51 and the printed circuit board 52 with an adhesive 57 while electrically connecting.

As shown in FIG. 11, in the process of manufacturing the semiconductor device having the structure shown in FIG.
A protruding electrode (bump) 54 is formed on the chip electrode 53 of No. 1 and an adhesive is applied to the position where the bare chip component is mounted on the printed circuit board 52, and the protruding electrode (bump) 54 and the substrate electrode 56 are aligned with each other to form a bare chip. The component 51 is placed on the printed circuit board 52 coated with the adhesive, the bare chip component 51 mounted is pressed against the printed circuit board 52 until the substrate electrode 56 is recessed, and the applied adhesive is cured during the pressing. It is manufactured by Of course, the tip portion of the protruding electrode 54 is also deformed during the pressing. It is well known that heat treatment is performed during the pressing.

The semiconductor device manufactured in the above manufacturing process has the bare chip component 5 as shown in FIG. 10 (b).
With respect to the amount of deformation of the protruding electrode 54 formed on one chip electrode 53 due to pressing, the dimension T11 of the tip of the protruding electrode protruding from the main body of the protruding electrode is about 10 to 15 μm. The bump height is about 50 to 60 μm. Further, in the deformation amount of the substrate electrode 56 of the printed circuit board 52, the recess amount T12 is about 7 μm or less. That is, the thickness T13 of the substrate electrode is 20 to 30 μm.
Is 1/3 or less.

In the semiconductor device manufactured in the above manufacturing process, as shown in FIG. 12, when the amount of deformation of the projecting electrode 54 or the substrate electrode 56 is not sufficient, the projecting electrode 54 and the substrate electrode 56 originally have a plastic region. It is conceivable that the protruding electrode 54 or the substrate electrode 56 has a deformation amount at the elastic region level where it should be deformed to a level. in this case,
As shown in the figure, the semiconductor device may expand or contract due to thermal stress or mechanical stress, and the contact pressure (contact pressure) between the projecting electrode 54 and the substrate electrode 56 is In some cases, it may not be possible to maintain the electrical continuity between the electrodes.

In this way, in the semiconductor device constituted by fixing the bare chip component 51 and the printed circuit board 52 with the adhesive 57, the protruding electrode 54 and the substrate electrode 5
The contact pressure with 6 (contact pressure) is particularly important for maintaining conduction between the electrodes, and the following technical measures are desired.

1) Since the protruding electrode is made of gold, the elastic deformation region is small and the plastic deformation region is almost the same. Therefore, when a load is applied to the protruding electrode, the protruding electrode is crushed according to the value of the load. However, when the protrusion of the protruding electrode forming the tip portion is crushed, the crush amount tends to be saturated.

2) Therefore, when the adhesive is hardened in a state where mounting is performed under a low load and the protruding electrodes still have a crushing allowance, the protruding electrodes are gradually plastically deformed by the curing shrinkage force of the adhesive and are crushed. Is expected. In this case, the curing shrinkage force of the adhesive does not contribute to the contact pressure between the protruding electrode and the substrate electrode. Therefore, it is important to secure the reliability by increasing the load until the deformation amount of the protruding electrode is saturated and crushing the protruding electrode.

[0013]

As described above, the conventional techniques have the following problems.

1) When the amount of deformation of the projecting electrode or the substrate electrode is not sufficient, the amount of deformation of the projecting electrode or the substrate electrode may reach the elastic region level. In this case, the curing shrinkage force of the adhesive does not contribute to the contact pressure between the protruding electrode and the substrate electrode, and the contact pressure (contact pressure) between the protruding electrode and the substrate electrode may not be secured in some cases.

2) Further, the semiconductor device may expand or contract due to thermal stress or mechanical stress, and contact pressure (contact pressure) between the protruding electrode and the substrate electrode cannot be secured. In some cases, continuity between electrodes cannot be maintained.

An object of the present invention is to allow the protruding electrode or the substrate electrode to be sufficiently deformed, to secure the contact pressure (contact pressure) between the protruding electrode and the substrate electrode by the curing shrinkage force of the adhesive, and It is an object of the present invention to provide a semiconductor device and a manufacturing method thereof capable of maintaining electrical continuity.

[0017]

In order to solve the above problems, the present invention takes the following means.

In order to sufficiently deform the protruding electrode or the substrate electrode, the load is increased until the deformation amount of the protruding electrode is saturated, and the protruding electrode and / or the substrate electrode is deformed.

By taking the above means, it is possible to deform to the saturated region where the protruding electrode and the substrate electrode are not deformed. Thereby, the curing shrinkage force of the adhesive sufficiently contributes to the contact pressure (contact pressure) between the protruding electrode and the substrate electrode. That is, the curing shrinkage force of the adhesive contributes to the contact pressure between the projecting electrode and the substrate electrode, so that the contact pressure (contact pressure) between the projecting electrode and the substrate electrode can be secured, and the conduction between the electrodes can be maintained. Can be maintained.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention has the following embodiments.

As shown in FIG. 1, the semiconductor device is an LSI
Of the bare chip component and the printed circuit board, the protruding electrode formed on the chip electrode of the bare chip component is electrically connected to the substrate electrode of the printed circuit board, and the bare chip component and the printed circuit board are bonded with an adhesive. In the semiconductor device configured by fixing by using the protruding electrode 4 formed on the chip electrode 3 of the bare chip component 1 deformed until the deformation amount is saturated, the substrate electrode 6 of the printed circuit board 2 is formed.
To be electrically connected to.

Further, as shown in FIG. 1, it is preferable that the substrate electrode of the printed circuit board is deformed until the deformation amount is saturated.

Further, as shown in FIG. 1, the amount of deformation of the protruding electrode 4 formed on the chip electrode 3 of the bare chip component 1 is such that the tip of the protruding electrode 4 is slightly smaller than the main body of the protruding electrode 4 (2 To 3 μm) is preferable.

Further, as shown in FIG. 1, the deformation amount of the substrate electrode 6 of the printed circuit board 2 is preferably 1/2 or more of the thickness of the substrate electrode.

By adopting the above-described embodiment, the deformation amount of the projecting electrode or the substrate electrode can be sufficiently deformed to the undeformed state, and the deformation amount of the projecting electrode and the substrate electrode can be deformed to the saturated region. it can. Thereby, the curing shrinkage force of the adhesive sufficiently contributes to the contact pressure (contact pressure) between the protruding electrode and the substrate electrode. Therefore, even if the semiconductor device expands or contracts due to thermal stress or mechanical stress, the curing shrinkage force of the adhesive is determined by the contact pressure (contact pressure) between the protruding electrode and the substrate electrode.
The contact pressure (contact pressure) between the protruding electrode and the substrate electrode can be secured, and the conduction between the electrodes can be maintained. In addition, in the deformation amount of the protruding electrode formed on the chip electrode of the bare chip component due to the pressing, the dimension T1 of the tip portion of the protruding electrode protruding from the main body of the protruding electrode is projected to about 2 to 3 μm. Further, in the deformation amount of the substrate electrode of the printed circuit board, the recess amount T2 is set to 1/2 or more of the thickness T3 of the substrate electrode.

Further, as shown in FIG. 3, in the method of manufacturing a semiconductor device, a bare chip component of an LSI and a printed circuit board are used, and a protruding electrode formed on a chip electrode of the bare chip component is a substrate electrode of the printed circuit board. In a method of manufacturing a semiconductor device, which is configured by fixing the bare chip component and the printed board with an adhesive while electrically connecting to the first chip electrode, a protruding electrode is formed on a chip electrode of the bare chip component. A processing step; a second processing step of deforming the protruding electrode formed on the chip electrode of the bare chip component until the deformation amount is saturated; and a third processing of applying an adhesive to the bare chip component mounting position of the printed circuit board. And the protruding electrodes formed in the second processing step and the board electrodes of the printed circuit board are aligned with each other, the bare chip component is placed in the third step. A fourth processing step of mounting the printed circuit board on which the adhesive is applied in the physical process, and the bare chip component mounted in the fourth processing step is pressed against the board electrode of the printed circuit board, and during the pressing, And a fifth treatment step of curing the adhesive applied in the third treatment step.

Further, as shown in FIG. 4, in the method of manufacturing the semiconductor device, prior to the processing of the third processing step, a processing step of deforming the substrate electrode of the printed circuit board until the deformation amount is saturated is performed. It is preferable to provide.

Further, in the method of manufacturing a semiconductor device, the bare chip component is pressed, the amount of movement of the bare chip component is detected during the pressing, and the amount of deformation of the protruding electrode formed on the chip electrode of the bare chip component is saturated. It is preferable to confirm that it is deformed up to.

According to the above embodiment, in the process of manufacturing a semiconductor device, a protruding electrode (bump) is formed on the chip electrode of the bare chip component, and the protruding electrode formed on the chip electrode of the bare chip component is deformed in advance. Deform until the amount is saturated, apply adhesive to the bare chip component placement position on the printed circuit board, align the protruding electrodes (bumps) and the substrate electrodes, and then place the bare chip component on the adhesive coated printed circuit board. A semiconductor device can be manufactured by placing the bare chip component on the printed circuit board until the substrate electrode is sufficiently recessed, and curing the applied adhesive during the pressing. In addition, before the adhesive applying step, a process step of deforming the substrate electrode of the printed circuit board until the deformation amount is saturated is added. Furthermore, by pressing the bare chip component, the amount of movement of the bare chip component is detected during the pressing, and it is possible to confirm that the protruding electrode formed on the chip electrode of the bare chip component is deformed until the deformation amount is saturated, The accuracy of deforming the protruding electrode until it is saturated is improved.

Further, as shown in FIG. 5, in the method of manufacturing a semiconductor device, a bare chip component of an LSI and a printed board are used, and a protruding electrode formed on a chip electrode of the bare chip component is a substrate electrode of the printed board. In a method of manufacturing a semiconductor device, which is configured by fixing the bare chip component and the printed board with an adhesive while electrically connecting to the first chip electrode, a protruding electrode is formed on a chip electrode of the bare chip component. While aligning the processing step, the second processing step of applying an adhesive to the bare chip component mounting position of the printed circuit board, and the position of the protruding electrode formed in the first processing step and the board electrode of the printed circuit board. A third processing step of mounting the bare chip component on the printed circuit board coated with the adhesive in the second processing step, and a board mounted in the third processing step. The chip component is pressed against the substrate electrode of the printed circuit board, the protruding electrode formed on the chip electrode of the bare chip component is deformed during the pressing until the deformation amount is saturated, and the adhesive applied in the second processing step. And a fourth treatment step of hardening the.

Further, as shown in FIG. 6, in the method of manufacturing a semiconductor device, in the fourth processing step, the substrate electrode of the printed circuit board is deformed while being pressed until the deformation amount is saturated. Preferably.

Furthermore, in the method of manufacturing a semiconductor device, the bare chip component is pressed against a substrate electrode of a printed circuit board, the amount of movement of the bare chip component is detected during the pressing, and a protrusion is formed on the chip electrode of the bare chip component. It is preferable to confirm that the electrode is deformed until the amount of deformation is saturated.

Further, in the method of manufacturing a semiconductor device, the bare chip component is pressed against a substrate electrode of a printed circuit board, the moving amount of the bare chip component is detected during the pressing, and the deformation amount of the substrate electrode of the printed circuit board is reduced. It is preferable to confirm that the material is deformed until it is saturated.

According to the above-described embodiment, in the process of manufacturing a semiconductor device, protruding electrodes (bumps) are formed on the chip electrodes of the bare chip component, and the adhesive is applied to the bare chip component mounting position of the printed board. While placing the protruding electrodes (bumps) and the substrate electrodes in position, place the bare chip component on the printed circuit board coated with the adhesive and press the bare chip component on the printed circuit board until the substrate electrode is sufficiently recessed. At the same time, the semiconductor device can be manufactured by deforming the protruding electrodes formed on the chip electrodes of the bare chip component until the deformation amount is saturated during the pressing and curing the applied adhesive. Also,
During the pressing, the board electrode of the printed board is deformed until the deformation amount is saturated. In addition, the bare chip component is pressed against a substrate electrode of a printed circuit board, the moving amount of the bare chip component is detected during the pressing, and the protruding electrode formed on the chip electrode of the bare chip component is deformed until the deformation amount is saturated. To confirm. Furthermore, it is possible to press the bare chip component against the substrate electrode of the printed circuit board, detect the amount of movement of the bare chip component during the pressing, and confirm that the substrate electrode of the printed circuit board is deformed until the amount of deformation is saturated. Therefore, it is possible to improve the accuracy of the deformation of the protruding electrode and the substrate electrode until the deformation amounts are saturated.

Further, as shown in FIG. 7, in the method of manufacturing a semiconductor device, a bare chip component of an LSI and a printed circuit board are used, and a protruding electrode formed on a chip electrode of the bare chip component is a substrate electrode of the printed circuit board. In a method of manufacturing a semiconductor device, which is configured by fixing the bare chip component and the printed board with an adhesive while electrically connecting to the first chip electrode, a protruding electrode is formed on a chip electrode of the bare chip component. A processing step, a second processing step of deforming the substrate electrode of the printed circuit board until a deformation amount is saturated, a third processing step of applying an adhesive to a bare chip component mounting position of the printed circuit board, and the third processing step. The bare chip component is coated with an adhesive in the third processing step while aligning the positions of the protruding electrodes formed in the first processing step and the board electrodes of the printed circuit board. A fourth processing step of mounting the printed circuit board on the printed circuit board, and the bare chip component mounted in the fourth processing step is pressed against the substrate electrode of the printed circuit board, and is applied in the third processing step during the pressing. And a fifth treatment step of curing the adhesive.

According to the above-described embodiment, in the process of manufacturing a semiconductor device, protruding electrodes (bumps) are formed on the chip electrodes of the bare chip component, and the board electrodes of the printed board are deformed in advance until the deformation amount is saturated. Then, the adhesive is applied to the mounting position of the bare chip component on the printed circuit board, and the bare chip component is mounted on the printed circuit board coated with the adhesive while aligning the positions of the protruding electrodes (bumps) and the substrate electrode. The semiconductor device can be manufactured by pressing the printed circuit board until the protruding electrodes of the placed bare chip component are sufficiently recessed and curing the applied adhesive during the pressing.

[0037]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A typical embodiment according to the present invention will be described with reference to FIGS. In the following, the same parts are denoted by the same reference numerals, and detailed description thereof may be omitted.

FIG. 1 shows the principle configuration of the present invention.

In FIG. 1A, the semiconductor device is LS
The bare chip component 1 is formed by the bare chip component 1 of I and the printed circuit board 2, and the protruding electrode 4 formed on the chip electrode 3 of the bare chip component 1 is electrically connected to the substrate electrode 6 of the printed circuit board 2. And the printed circuit board 2 are fixed to each other with an adhesive 7. The process of manufacturing the semiconductor device having the configuration shown in FIG.

As shown in FIG. 1B, in the semiconductor device having the above-mentioned structure, the amount of deformation of the protruding electrode 4 formed on the chip electrode 3 of the bare chip component 1 due to the pressing force is larger than that of the main body of the protruding electrode 4. The size T1 of the tip of the protruding electrode 4 protruding is about 2 to 3 μm. In addition, in the deformation amount of the substrate electrode 6 of the printed circuit board 2, the recess amount T2
Is 1 with respect to the thickness T3 (20 to 30 μm) of the substrate electrode 6.
/ 2 or more.

FIG. 2 shows the principle of the present invention.

For example, in order to deform the protruding electrode 4 until it is saturated, the protruding electrode 4 is pressed. Since the protruding electrode 4 is formed of gold, the elastic deformation region is small and the plastic deformation region is almost all. Therefore, when a load is applied to the protruding electrode 4, the protruding electrode 4 is crushed according to the value of the load.
That is, the amount of deformation of the protruding electrodes (bumps) 4 changes according to the value of the load until the load to be pressed reaches the point A. But,
When the pressing load reaches the point B, the amount of deformation of the protruding electrodes (bumps) 4 does not change. That is, when the protrusion of the protruding electrode 4 is crushed, the crush amount is saturated.

As described above, in the deformation amount of the protruding electrode 4 formed on the chip electrode 3 of the bare chip component 1 due to the pressing, the dimension T1 of the tip of the protruding electrode protruding from the main body of the protruding electrode is about 2 to 3 μm. It is possible to form the protruding electrode 4 that is deformed until the amount of deformation is saturated in the protruding shape. The method of confirming whether the deformation amount of the protruding electrode has reached the saturation region may be to detect whether the deformation amount of the protruding electrode with respect to the load is equal to or less than a specified value.

Next, a process of manufacturing the semiconductor device having the structure shown in FIG. 1 will be described.

FIG. 3 shows a diagram of an embodiment of the invention.

In the figure, the protruding electrodes (bumps) 4 are formed on the chip electrodes 3 of the bare chip component 1. Next, the protruding electrodes (bumps) 4 are deformed until the deformation amount is saturated. On the other hand, the adhesive 7 is applied to the bare chip component mounting position of the printed circuit board 2. Next, the bare chip component 1 is placed on the printed board 2 coated with the adhesive 7 while aligning the positions of the protruding electrodes 4 of the bare chip component 1 and the board electrodes 6 of the printed board 2. Further, a load is applied so as to press the mounted bare chip component 1 against the substrate electrode 6 of the printed circuit board 2, and the adhesive agent 7 applied during the pressing is cured. Then, the load is released to complete the manufacturing of the semiconductor device having the configuration shown in FIG.

FIG. 4 shows a diagram of an embodiment of the invention.

In the figure, the protruding electrodes (bumps) 4 are formed on the chip electrodes 3 of the bare chip component 1. Next, the protruding electrodes (bumps) 4 are deformed until the deformation amount is saturated. On the other hand, the board electrode 6 of the printed board 2 is deformed until the deformation amount is saturated. Next, the adhesive 7 is applied to the bare chip component mounting position of the printed circuit board 2. Next, the bare chip component 1 is bonded with the adhesive 7 while aligning the positions of the protruding electrodes 4 of the bare chip component 1 and the substrate electrodes 6 of the printed circuit board 2.
Is placed on the coated printed circuit board 2. Further, a load is applied so as to press the mounted bare chip component 1 against the substrate electrode 6 of the printed circuit board 2, and the adhesive agent 7 applied during the pressing is cured. Then, the load is released to complete the manufacturing of the semiconductor device having the configuration shown in FIG.

3 and 4, in the process of deforming the protruding electrodes (bumps) 4 until the deformation amount is saturated, the bare chip component 1 is pressed, and the movement amount of the bare chip component 1 is changed during the pressing. By detecting, it can be confirmed that the protruding electrode 4 is deformed until the deformation amount is saturated.

FIG. 5 shows a diagram of an embodiment of the present invention.

In the figure, protruding electrodes (bumps) 4 are formed on the chip electrodes 3 of the bare chip component 1. On the other hand, the adhesive 7 is applied to the bare chip component mounting position of the printed circuit board 2. Next, the bare chip component 1 is placed on the printed board 2 coated with the adhesive 7 while aligning the positions of the protruding electrodes 4 of the bare chip component 1 and the board electrodes 6 of the printed board 2. Further, a load is applied so as to press the placed bare chip component 1 against the substrate electrode 6 of the printed board 2, and the protruding electrodes (bumps) 4 are deformed during the pressing until the deformation amount is saturated. Further, the adhesive 7 applied during the pressing is cured. Then, the load is released to complete the manufacturing of the semiconductor device having the configuration shown in FIG.

FIG. 6 shows a diagram of an embodiment of the present invention.

In the figure, the protruding electrodes (bumps) 4 are formed on the chip electrodes 3 of the bare chip component 1. On the other hand, the adhesive 7 is applied to the bare chip component mounting position of the printed circuit board 2. Next, the bare chip component 1 is placed on the printed board 2 coated with the adhesive 7 while aligning the positions of the protruding electrodes 4 of the bare chip component 1 and the board electrodes 6 of the printed board 2. Further, a load is applied so as to press the placed bare chip component 1 against the substrate electrode 6 of the printed circuit board 2, and the protruding electrodes (bumps) 4 of the bare chip component 1 and the substrate electrode 6 of the printed circuit board 2 are pressed during the pressing. Deform until the amount of deformation is saturated. Further, the adhesive 7 applied during the pressing is cured. Then, the load is released to complete the manufacturing of the semiconductor device having the configuration shown in FIG.

5 and 6, in the process of deforming the protruding electrode (bumps) 4 or the substrate electrode 6 until the deformation amount is saturated, the bare chip component 1 is pressed, and the bare chip component 1 is pressed during the pressing. It is possible to confirm that the protruding electrode 4 or the substrate electrode 6 is deformed until the amount of deformation is saturated by detecting the amount of movement. The details will be described later.

FIG. 7 shows a diagram of an embodiment of the present invention.

In the figure, the protruding electrodes (bumps) 4 are formed on the chip electrodes 3 of the bare chip component 1. On the other hand, the board electrode 6 of the printed board 2 is deformed until the deformation amount is saturated. Next, the adhesive 7 is applied to the bare chip component mounting position of the printed circuit board 2. Next, the bare chip component 1 is placed on the printed board 2 coated with the adhesive 7 while aligning the positions of the protruding electrodes 4 of the bare chip component 1 and the board electrodes 6 of the printed board 2. Further, a load is applied so as to press the placed bare chip component 1 against the substrate electrode 6 of the printed circuit board 2, and the adhesive 7 applied during the pressing.
Cure. Then, the load is released to complete the manufacturing of the semiconductor device having the configuration shown in FIG. It is preferable to deform the protruding electrodes (bumps) 4 of the bare chip component 1 during the pressing until the deformation amount is saturated.

Next, a chip mounter apparatus for manufacturing a semiconductor device and a control method for confirming that the apparatus is used to deform the protruding electrode or the substrate electrode until the deformation amount is saturated will be described.

FIG. 8 shows a diagram of an embodiment of the present invention.

In the figure, the chip mounter device receives the bare chip component 1 and the printed circuit board 2 coated with the adhesive 7 via the carrying line, and the bare chip component 1
The semiconductor device is manufactured by joining the printed circuit board 2 and the printed circuit board 2.

The chip mounter device fixes the printed board 2 coated with the adhesive 7 and moves it in the XY directions, and the bare chip component 1 is picked up and the protruding electrodes 4 of the bare chip component 1 are placed on the XY table. A head 14 which is bonded to the substrate electrode 6 of the printed circuit board 2 fixed to 10.
And a load cell 1 for measuring the load pressing the head 14.
3, an encoder 12 that detects the rotation amount of the motor and replaces it with the displacement amount of the head 14, a motor 11 that applies a load that presses the head 14, and an arithmetic control unit 15 as main components.

Next, a method of controlling the chip mounter device will be described.

FIG. 9 shows a diagram of an embodiment of the present invention.

In step S10 of the figure, the arithmetic and control unit 15 drives the motor 11 and applies a load up to point A in FIG. 2 to lower the head 14.

In step S11, the arithmetic control unit 15
Reads the amount of displacement of the head 14 (the amount of movement of the bare chip component) from the encoder 11 and temporarily stores it.

In step S12, the arithmetic control unit 15
Drives the motor 11 so as to obtain a predetermined load step size and lowers the head 14.

In step S13, the arithmetic control unit 15
Reads the amount of displacement of the head 14 (the amount of movement of the bare chip component) from the encoder 11 and temporarily stores it.

In step S14, the arithmetic control unit 15
Calculates the difference between the displacement amount (bare chip component moving amount) and the current displacement amount (bare chip component moving amount) with respect to a predetermined load step size (bare chip component moving amount).

In step S15, the arithmetic control unit 15
Determines whether the difference in displacement amount (movement amount of bare chip component) is less than or equal to a specified value. If it is less than the specified value, the amount of deformation is saturated and the process ends. If the difference in the displacement amount (the amount of movement of the bare chip component) is not equal to or less than the specified value, the process returns to step S12.

As described above, the load is set at constant intervals, the displacement amount of the head 14 at that time is detected, and the displacement amount of the head 14 (movement amount of the bare chip component) is replaced with the deformation amount of the protruding electrode to obtain the deformation amount of the protruding electrode. Is detected and it is judged that the saturation region has been reached due to the difference in the deformation amount from the previous time. This allows
By pressing the bare chip part against the board electrode of the printed board,
It is possible to detect the amount of movement of the bare chip component during the pressing and confirm that the protruding electrode formed on the chip electrode of the bare chip component is deformed until the amount of deformation is saturated. It is also possible to press the bare chip component against the substrate electrode of the printed circuit board, detect the amount of movement of the bare chip component during the pressing, and confirm that the substrate electrode of the printed circuit board is deformed until the amount of deformation is saturated. .

Not limited to the chip mounter device, the load is set at a constant interval as described above, the displacement amount at that time is detected, and the displacement amount is replaced with the deformation amount of the protruding electrode or the deformation amount of the substrate electrode. It is possible to detect that the saturation region has been reached by detecting the difference in deformation amount from the previous time.

[0071]

As described above, according to the present invention, the following effects can be expected.

The amount of deformation of the projecting electrode or the substrate electrode can be sufficiently deformed to a state where it is not deformed, and the projecting electrode and the substrate electrode can be deformed to the saturation region of the amount of deformation. Thereby, the curing shrinkage force of the adhesive sufficiently contributes to the contact pressure (contact pressure) between the protruding electrode and the substrate electrode. Therefore, even if the semiconductor device expands or contracts due to thermal stress or mechanical stress, the curing shrinkage force of the adhesive contributes to the contact pressure (contact pressure) between the protruding electrode and the substrate electrode. However, the contact pressure (contact pressure) between the protruding electrode and the substrate electrode can be secured, and the conduction between the electrodes can be maintained.

In the process of manufacturing a semiconductor device, a protruding electrode (bump) is formed on the chip electrode of the bare chip component.
And deform the protruding electrode formed on the chip electrode of the bare chip component until the amount of deformation is saturated, apply an adhesive to the bare chip component mounting position of the printed circuit board, and form the protruding electrode (bump) and the substrate electrode. While aligning the position, place the bare chip component on the printed circuit board coated with adhesive,
A semiconductor device can be manufactured by pressing the mounted bare chip component against the printed circuit board until the board electrode is sufficiently recessed, and curing the applied adhesive during the pressing. In addition, the semiconductor device can be manufactured by adding a process of deforming the substrate electrode of the printed circuit board until the deformation amount is saturated before the adhesive applying step. Furthermore, by pressing the bare chip component, the amount of movement of the bare chip component is detected during the pressing, and it is possible to confirm that the protruding electrode formed on the chip electrode of the bare chip component is deformed until the deformation amount is saturated,
It is possible to improve the accuracy of the deformation of the protruding electrode until the deformation amount is saturated.

In the process of manufacturing a semiconductor device, a protruding electrode (bump) is formed on the chip electrode of the bare chip component.
And apply an adhesive to the position where the bare chip component is placed on the printed circuit board, and while aligning the positions of the protruding electrodes (bumps) and the substrate electrode, the bare chip component is placed on the printed circuit board coated with the adhesive, While pressing the bare chip component placed on the printed circuit board until the substrate electrode is sufficiently recessed, the protruding electrode formed on the chip electrode of the bare chip component is deformed during the pressing until the deformation amount is saturated, and the applied adhesive is applied. A semiconductor device can be manufactured by curing the agent. Further, the semiconductor device can be manufactured by deforming the substrate electrode of the printed circuit board during the pressing until the deformation amount is saturated. In addition, the bare chip component is pressed against a substrate electrode of a printed circuit board, the moving amount of the bare chip component is detected during the pressing, and the protruding electrode formed on the chip electrode of the bare chip component is deformed until the deformation amount is saturated. Can be confirmed. Furthermore, it is possible to press the bare chip component against the substrate electrode of the printed circuit board, detect the amount of movement of the bare chip component during the pressing, and confirm that the substrate electrode of the printed circuit board is deformed until the amount of deformation is saturated. You can
It is possible to improve the accuracy of the deformation of the protruding electrode and the substrate electrode until the deformation amounts are saturated.

In the process of manufacturing a semiconductor device, a protruding electrode (bump) is formed on the chip electrode of the bare chip component.
To deform the board electrode of the printed circuit board until the amount of deformation is saturated, apply an adhesive to the mounting position of the bare chip component on the printed circuit board, and align the protruding electrode (bump) with the board electrode to form a bare chip. By placing the component on the printed circuit board coated with the adhesive and pressing the printed circuit board until the protruding electrodes of the mounted bare chip component are sufficiently recessed, by curing the coated adhesive during the pressing. A semiconductor device can be manufactured.

[Brief description of drawings]

FIG. 1 is a principle configuration diagram of the present invention.

FIG. 2 is a diagram illustrating the principle of the present invention.

FIG. 3 is a diagram of an embodiment of the present invention.

FIG. 4 is a diagram of an embodiment of the present invention.

FIG. 5 is a diagram of an embodiment of the present invention.

FIG. 6 is a diagram of an embodiment of the present invention.

FIG. 7 is a diagram of an embodiment of the present invention.

FIG. 8 is a diagram of an embodiment of the present invention.

FIG. 9 is a diagram of an embodiment of the present invention.

FIG. 10 is a configuration diagram of a conventional technique.

FIG. 11 is a diagram of the prior art.

FIG. 12 is an explanatory diagram of a conventional technique.

[Explanation of symbols]

1: Bare chip part 2: Printed circuit board 4: protruding electrode 6: substrate electrode 7: Adhesive 11: Motor 12: Encoder 13: Load cell 14: Head 15: arithmetic control unit

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Kenji Matsuda Kenji Matsuda 2 No. 98, Unoki-nu, Unoki-cho, Kawakita-gun, Ishikawa Prefecture (56) References JP-A-10-233413 (JP, A) (58) ) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 21/60 311

Claims (12)

(57) [Claims] 1. A bare chip component and a printed circuit board which are composed of an LSI bare chip component and a printed circuit board, and electrically connect a protruding electrode formed on a chip electrode of the bare chip circuit component to a substrate electrode of the printed circuit board. In a semiconductor device constituted by fixing a substrate and an adhesive with an adhesive, a protruding electrode formed on a chip electrode of a bare chip component deformed until a deformation amount with respect to a load change is equal to or less than a specified value is printed. A semiconductor device, which is electrically connected to a substrate electrode of a substrate. 2. A substrate electrode of the printed circuit board has a load change.
The semiconductor device according to claim 1, wherein the semiconductor device is deformed until the amount of deformation with respect to is less than or equal to a specified value . 3. The deformation amount of the protruding electrode formed on the chip electrode of the bare chip component is such that the tip of the protruding electrode slightly protrudes from the main body of the protruding electrode. The semiconductor device according to claim 2. 4. The amount of deformation of the substrate electrode of the printed circuit board is 1/2 or more of the thickness of the substrate electrode, The semiconductor device according to claim 2, wherein: 5. A bare chip component and a printed circuit board which are composed of a bare chip component of an LSI and a printed circuit board, and electrically connect a protruding electrode formed on a chip electrode of the bare chip device to a substrate electrode of the printed circuit board. In a method of manufacturing a semiconductor device, which is configured by fixing a substrate to an adhesive using an adhesive, a first processing step of forming a protruding electrode on a chip electrode of a bare chip component, and a protrusion formed on a chip electrode of the bare chip component. Electrode against load change
It is formed by a second processing step of deforming until the amount of deformation becomes equal to or less than a specified value, a third processing step of applying an adhesive to a bare chip component mounting position of the printed circuit board, and a second processing step. A fourth processing step of placing the bare chip component on the printed circuit board coated with the adhesive in the third processing step while aligning the positions of the protruding electrodes and the board electrode of the printed circuit board, and the fourth processing step. A bare chip component mounted on the printed circuit board is pressed against a substrate electrode of a printed circuit board, and a fifth processing step of curing the adhesive applied in the third processing step during the pressing is performed. Device manufacturing method. 6. In the method of manufacturing a semiconductor device, prior to the processing of the third processing step, the board electrode of the printed board is deformed until the deformation amount with respect to a load change becomes a specified value or less . The method of manufacturing a semiconductor device according to claim 5, further comprising a processing step. 7. The method of manufacturing a semiconductor device according to claim 1, wherein the bare chip component is pressed, the amount of movement of the bare chip component is detected during the pressing, and the protruding electrode formed on the chip electrode of the bare chip component is deformed by a change in load. Is below the specified value
To verify that the deforming until method of manufacturing a semiconductor device according to claim 5 or claim 6, wherein the. 8. A bare chip component and a printed circuit board which are composed of an LSI bare chip component and a printed circuit board, and electrically connect a protruding electrode formed on a chip electrode of the bare chip circuit component to a substrate electrode of the printed circuit board. In a method of manufacturing a semiconductor device configured by fixing a substrate to an adhesive using an adhesive, a first processing step of forming a protruding electrode on a chip electrode of a bare chip component, and a bare chip component mounting position on the printed circuit board. While aligning the second processing step of applying the adhesive with the position of the protruding electrode formed in the first processing step and the board electrode of the printed circuit board, the bare chip component is coated with the adhesive in the second processing step. A third processing step of mounting the applied printed circuit board on the printed circuit board, and pressing the bare chip component mounted in the third processing step on the substrate electrode of the printed circuit board, The deformation of the protruding electrodes formed on the chip electrodes of the bare chip during pressing of the relative change in load
Is deformed until it becomes less than a specified value, and the second
And a fourth processing step of hardening the adhesive applied in the processing step of. 9. The method of manufacturing a semiconductor device according to claim 4, wherein in the fourth processing step, the substrate electrode of the printed circuit board is deformed while being pressed until a deformation amount with respect to a load change becomes a specified value or less. 9. The method for manufacturing a semiconductor device according to claim 8, further comprising the step of: 10. The method for manufacturing a semiconductor device, wherein the bare chip component is pressed against a substrate electrode of a printed circuit board, the amount of movement of the bare chip component is detected during the pressing, and a protrusion is formed on the chip electrode of the bare chip component. Electrodes
The method for manufacturing a semiconductor device according to claim 8 or 9, wherein it is confirmed that the deformation is performed until a deformation amount with respect to a load change becomes equal to or less than a specified value . 11. The method of manufacturing a semiconductor device according to claim 1, wherein the bare chip component is pressed against a substrate electrode of a printed circuit board, a moving amount of the bare chip component is detected during the pressing, and the substrate electrode of the printed circuit board is subjected to a load change. Deformation amount
10. The method for manufacturing a semiconductor device according to claim 9, further comprising confirming that the deformation is performed until the value becomes equal to or less than a specified value . 12. The bare chip component and the printed circuit board, which are composed of a bare chip component of an LSI and a printed circuit board, and electrically connect a protruding electrode formed on a chip electrode of the bare chip device to a substrate electrode of the printed circuit board. In a method of manufacturing a semiconductor device, which comprises bonding a substrate with an adhesive, a first processing step of forming a protruding electrode on a chip electrode of a bare chip component, and a substrate electrode of the printed circuit board against a load change. If the amount of deformation is less than the specified value
A second processing step of deforming the printed circuit board, a third processing step of applying an adhesive to a bare chip component mounting position of the printed circuit board, and a protruding electrode formed in the first processing step and a substrate of the printed circuit board. A fourth processing step of mounting the bare chip component on the printed board coated with the adhesive in the third processing step while aligning the position with the electrode, and a bare chip component mounted in the fourth processing step are described. And a fifth processing step of pressing the substrate electrode of the printed circuit board and curing the adhesive applied in the third processing step during the pressing.