JP3510475B2 - Conversion module - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a conversion module.

[0002]

2. Description of the Related Art A semiconductor package having a function as a CPU (central processing unit) is mounted on a motherboard in a personal computer via a socket.
At present, as such a semiconductor package,
A PGA (pin grid array) type in which a large number of I / O pins are erected on one side surface is the mainstream.

By the way, a user of a personal computer may desire an upgrade for the purpose of speeding up the processing. In this case, it is necessary to remove the existing semiconductor package from the socket and newly mount a higher-performance semiconductor package. At that time, it is suggested that a high-performance semiconductor package be mounted on a conversion module composed of a plurality of substrates and then indirectly mounted on a socket of a motherboard.

As a conventional conversion module, there has been proposed one in which a socket board and a conversion board are the main constituent elements. A plurality of plated through holes are provided in the conversion board (for example, double-sided board), and the base end portions of the external connection pins are inserted into the lower surface side openings thereof. In addition, these external connection pins are inserted into and removed from the sockets of the motherboard. The socket board has a plurality of I / O pins. These I / O pins are provided on the back surface of the socket substrate so as to project at locations corresponding to the plurality of plated through holes. Each I / O pin is inserted into each plated through hole and soldered, so that electrical continuity is achieved between the socket substrate side and the conversion substrate side. Further, since the I / O pin of the socket substrate is a socket-shaped pin having an insertion hole in its upper end surface, the I / O pin of the semiconductor package is fitted therein. Therefore, it is considered that by using such a conversion module, the semiconductor package can be adapted to the motherboard side, and the original performance of the package can be easily exhibited.

[0005]

By the way, recently, as a conversion module structure for a larger upgrade, a signal conversion element such as a semiconductor package is mounted in a region surrounded by a group of plated through holes, and the signal is converted by the element. Someone has come up with a proposal for conversion. However, when such a structure is adopted, it becomes necessary to make a replacement connection for a specific I / O pin.
That is, the specific I / O pin is once connected to the input side of the signal conversion element and the converted signal is obtained from the output side thereof without directly conducting to the external connection pin through the corresponding plated through hole. This is because. As a means for realizing the exchange connection as described above, a method of electrically connecting a specific I / O pin and the input side of the signal conversion element through, for example, a lead wire can be considered.

However, this method using a lead wire requires a series of complicated operations (cutting into a predetermined length, peeling of an insulating coating, preliminary soldering, positioning and soldering), which is inferior in workability. Become. In particular, as the semiconductor package becomes finer and the number of pins increases, it is expected that the positioning operation itself will become difficult and the connection reliability will be lowered.

Further, if the replacement connection is to be realized by a method of forming the conversion substrate itself into a multi-layer or a method of forming a build-up layer on the conversion substrate, there is a problem that the cost is increased. Therefore, in order to meet the demand for cost reduction, it is considered that a conversion substrate having a simple structure like a double-sided plate should be used.

Further, it is expected that demand for a conversion module structure suitable for a case where there are a plurality of places where the replacement connection is to be made, a case where the replacement connection path is complicated and long, and the like will increase in the future.

The present invention has been made to solve the above problems, and an object of the present invention is to have a structure capable of performing a replacement connection relatively easily and without increasing the cost, and having a connection reliability. To provide an excellent conversion module.

[0010]

In order to solve the above-mentioned problems, in the invention described in claim 1, a plurality of conversion through-holes are provided on a conversion board having a signal conversion element and provided with a plurality of plated through holes. I at the location corresponding to the plated through hole
A socket substrate for mounting a semiconductor package on which an I / O pin is provided is mounted, and the I / O is mounted on the plated through hole.
In a conversion module in which both boards are electrically connected by inserting pins, an insulating base material having a plurality of insertion holes into which the I / O pins can be inserted and a conductor pattern is provided between the boards. A specific I / O pin that is arranged and is connected to the primary side end of the conductor pattern at the opening edge of the landed through hole that occupies at least a part of the plurality of through holes and that requires replacement connection. Is shorter than other I / O pins that do not require replacement connection, and
The specific I / O pin is inserted into the land insertion hole and soldered, and the secondary side end of the conductor pattern and the replacement connection conductor portion on the conversion substrate side are connected via a conductor. The conversion module is characterized in that

According to a second aspect of the present invention, in the first aspect, the insulating base material has an area at least equal to the pin forming area of the socket substrate, and the insulating base material is provided at a plurality of locations on the outer peripheral portion of the pin forming area. , The specific I /
It is assumed that the land insertion holes are arranged separately from the land insertion holes through which the O pins are inserted, and the I / O pins having no replacement connection are inserted and soldered in the land insertion holes. .

According to a third aspect of the present invention, in the first or second aspect, a through portion larger than that corresponding to the signal conversion element is formed in a substantially central portion of the insulating base material, and the through portion is formed. It is assumed that a pad is formed on the secondary side end of the conductor pattern extending to the opening edge and the pad and the replacement connection conductor portion are soldered.

The "action" of the present invention will be described below. According to the invention described in claims 1 to 3, the specific I / O pin and the replacement connection conductor portion on the conversion board side have a land insertion hole,
As a result of being electrically connected through the conductor pattern and the conductor, a replacement connection is made for the specific pin. Since a predetermined conductor pattern is formed in advance on the insulating base material, unlike the case where a lead wire is used, for example, troublesome work such as cutting into a predetermined length or peeling off the insulating coating is unnecessary. Further, when each I / O pin of the socket board is inserted through each insertion hole, the insulating base material is held in a state in which it cannot be displaced in the surface direction between both boards, and therefore the positioning itself becomes extremely easy. . From the above, according to the present invention, the replacement connection can be performed relatively easily and the connection reliability is excellent.

Further, other I / O pins which do not require replacement connection are inserted into the openings of the corresponding individual plated through holes and are electrically connected to the plated through holes. On the other hand, since the specific I / O pin that requires replacement connection is formed short, it is not inserted into the opening of the corresponding plated through hole, and is separated from the plated through hole and is in a non-conductive state. Become. Therefore, a short circuit due to direct conduction is avoided in advance.

Furthermore, according to the present invention, the conversion substrate need only have a simple structure such as a double-sided plate, and it is not necessary to rely on a multi-layer plate or a buildup layer to perform replacement connection. Therefore, cost increase is surely avoided.

According to the second aspect of the present invention, the I / O pins at a plurality of positions in the outer peripheral portion of the pin forming area are soldered to the land insertion holes, so that the insulating base material is surely provided between the two substrates. It is fixed, which makes it more reliable. In addition, if it is the outer peripheral portion of the pin formation area,
Soldering can be performed relatively easily. Further, since it is an insulating base material having an area comparable to the pin formation area, there is ample space for forming a plurality of conductor patterns, a complicated and long conductor pattern, and the like. Therefore, it is possible to provide a conversion module structure suitable for a case where there are a plurality of places where the replacement connection is to be made, a case where the replacement connection path is complicated and long, and the like.

According to the third aspect of the invention, since only the soldering is required to electrically connect the secondary side end of the conductor pattern and the replacement connection conductor portion, the insulating base material and the conversion substrate are connected. The configuration of pins and the like can be omitted. Therefore, it is possible to avoid an increase in the number of parts and to achieve cost reduction.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION A PGA conversion module 1 according to an embodiment of the present invention will be described in detail below with reference to FIGS.

As shown in FIGS. 1 and 2, the conversion module 1 of this embodiment is a device for mounting the PGA 2 on the motherboard MB after signal conversion. The conversion module 1 has a plurality of substrates, that is, the conversion substrate 3 and the socket substrate 4, as its main constituent elements.

The conversion substrate 3 is a rigid double-sided plate having a rectangular shape. The conversion board 3 includes a plated through hole group in which a plurality of plated through holes 5 are arranged in a substantially square shape. As shown in FIG. 5, the plated through holes 5 are arranged in a grid pattern at a constant pitch. Of course, they may be arranged in a staggered pattern instead of the grid pattern. As shown in FIG. 4, the base end of the external connection pin 6 is inserted into the lower surface side opening of each plated through hole 5. The pin 6 may be joined by soldering.

One die pad 7 and a plurality of pads 8 surrounding the die pad 7 are formed in a substantially square area surrounded by the plated through hole group. A signal conversion QFP (quad flat package) 9 as a signal conversion element is surface-mounted on the die pad 7.
Each lead of the QFP 9 is joined to each pad 8 by using a solder S1 which is a conductive material. It should be noted that one of the pads 8 is assigned as a replacement connection pad 8a as a replacement connection conductor portion.

Pads 10 for connecting electronic components are formed on the upper surface side of the conversion substrate 3 in a region not surrounded by the through holes. The pad 10 has a D
An IP (dual in-line package) 11 is surface-mounted. An electronic component connecting pad 12 is also formed on the lower surface side of the conversion substrate 3, and a chip resistor 13 is surface-mounted there. These electronic components 11 and 13 are also
Both of the pads 10 and 12 are bonded with solder S1. Further, conductor patterns (not shown) are formed on the upper surface and the lower surface of the conversion substrate 3. The conductor pattern above is the land 5 of the plated through hole 5.
a, 5b, the QFP 9, and the electronic components 11, 13 are electrically connected to each other.

A mini via hole 15 is formed on the conversion board 3.
Are formed. Here, the mini via hole 15 is
It has a smaller diameter (several 10 μmφ) than a normal plated through hole for the purpose of pin insertion and front / back conduction, and is intended only for front / back conduction. One of the pads 8 corresponding to the side on which the conversion signal is output (see 8b in FIG. 1) is electrically connected to the upper end of the mini via hole 15 penetrating the upper and lower surfaces of the conversion substrate 3. .

Next, the structure of the socket substrate 4 will be described. As shown in FIGS. 1 and 2, the insulating base material 21 forming the socket substrate 4 has a square shape and a frame shape.
The size of the outer shape is substantially equal to the size of the PGA 2 as the mounted object. The insulating base material 21 has a square-shaped central hole 22. The reason for providing such a central hole 22 is that the QF
This is to secure a space for accommodating P9, to facilitate soldering, and to efficiently dissipate the heat generated by QFP9. Therefore, the central hole 22 is preferably formed slightly larger than the QFP 9 at the position corresponding to the QFP 9.

Around the center hole 22, a large number of pin insertion holes 23 having a circular cross section and having a diameter much smaller than that of the center hole 22 are formed in a grid pattern. Socket-shaped I / O pins 24 are inserted into the respective pin insertion holes 23. The lower end portion of the I / O pin 24 projects from the back surface side (lower surface side) of the insulating base material 21. Each socket-shaped I / O pin 24 is formed with an insertion hole 25 extending along the axial direction. The I / O pin 26 on the PGA2 side can be inserted into and removed from the insertion hole 25. That is, the socket substrate 4 is P
The GA 2 has a detachable structure on the front surface side (upper surface side).

For convenience of explanation, socket-shaped I / O pin 24
Among them, a specific I / O pin that requires a replacement connection is represented by 24A to be distinguished from other I / O pins 24 that do not require a replacement connection. Further, the plated through hole corresponding to the specific I / O pin 24A is represented by 5A to be distinguished from the other plated through holes 5.

The land 5Ab in the opening on the lower surface side of the plated through hole 5A and the lower end of the mini via hole 15 are electrically connected by a conductor pattern 16. Therefore,
The output side of the QFP 9 and the land 5Ab are electrically connected.

As shown in FIG. 2, the specific I / O
The small diameter portion of the pin 24A is formed to be somewhat shorter than the small diameter portions of the other I / O pins 24. Therefore, other I / O pins 24 that do not require replacement connection are plated with through holes 5.
Even if it is inserted into the upper opening of the
The O pin 24A is not inserted into the upper surface side opening of the corresponding plated through hole 5A. At this time, the specific I / O pin 24A is in a state of being separated from the land 5Aa of the upper surface side opening of the plated through hole 5A.

The specific I / O pin 24A can be obtained, for example, by cutting a small-diameter portion of the other I / O pin 24 which does not require replacement connection by a predetermined length. Of course, two types of I / O pins 24 and 24A having different lengths may be prepared in advance and used.

As shown in FIG. 1, the motherboard MB
The socket 30 is fixed in advance so as not to be removable by soldering, and the conversion module 1 is used while mounted on the upper surface side of the socket 30. At this time, the external connection pin 6 is inserted into the insertion hole of the socket-shaped pin 31 of the socket 30. Note that, for convenience in exchanging components, soldering is not performed on the connection portion.

The conversion module 1 of this embodiment has an insulating base material 36 in addition to the conversion board 3 and the socket board 4.
Is its constituent element. Hereinafter, the structure of the insulating base material 36 will be described.

As shown in FIG. 3, the insulating base material 36 of this embodiment is square and rigid, and has an area comparable to the pin formation area of the socket substrate 4. The thickness is about 0.8 mm. A substantially square-shaped penetrating portion 37 corresponding to the QFP 9 is formed in a substantially central portion of the insulating base material 36.
The insulating base material 36 is a so-called single-sided plate having a conductor pattern 38 on only one side surface (see FIG. 4 (a)). The conductor pattern 38 is formed by a conventionally known method (for example, an etching method).

The insulating substrate 36 has a large number of insertion holes 41, 42, 43 through which the I / O pins 24, 24A can be inserted. These insertion holes 41 to 43 are used for the I / O pins 24, 24.
It is arranged in a grid pattern corresponding to A.

One of a large number of insertion holes 41 to 43 corresponding to a position of a specific I / O pin 24A is an insertion hole having a circular land 44 at its upper opening edge (that is, a land with a land). The insertion hole 41).

At a plurality of locations on the outer peripheral portion of the pin forming area, specifically, at each corner portion of the area, specific I
Four landed insertion holes 42 are arranged separately from the landed insertion holes 41 through which the / O pins 24A are inserted. The land insertion holes 42 also have a circular land 44 at the opening edge on the upper surface side.

Then, these land insertion holes 41, 4
For items other than 2, land 4 is provided on each opening edge.
It is a landless insertion hole 43 having no four. In addition,
As shown in FIG. 4B, the land insertion holes 41, 4
It is also possible to adopt a through-hole structure in which the inner wall surface of 2 has, for example, a copper plating layer G1. In this case, the insulating base material 36A is a double-sided plate.

As shown in FIGS. 2 to 4, the primary side end of the conductor pattern 38 is connected to the land 44 of the land insertion hole 41. The secondary side end of the conductor pattern 38 extends linearly to the opening edge of the penetrating portion 37, and a rectangular pad 45 is formed there.

As shown in FIG. 2, the conductor pattern 38
The insulating base material 36 provided with is used in a state of being arranged between the substrates 3 and 4. At that time, the pattern formation surface of the insulating base material 36 is directed to the socket substrate 4 side. The insulating base material 36 arranged between the substrates 3 and 4 is held in a state in which it cannot be displaced in its own surface direction by inserting the I / O pins 24 and 24A into the insertion holes 41 to 43. In such a positioning state, as shown in FIG.
Takes a position just corresponding to the replacement connection pad 8a on the conversion substrate 3.

The tip of a specific I / O pin 24A is inserted through the land insertion hole 41, and both 24A and 41A are joined by soldering using solder S1 which is a conductor. Into the land insertion hole 42, the tips of the four I / O pins 24 at the corners of the pin formation area are also inserted and soldered. Similarly, the pad 45 at the secondary side end of the conductor pattern 38 and the replacement connection pad 8a are joined via the inter-plate connecting portion 46 made of solder S1.

It should be noted that another I / O pin 24 having no replacement connection is simply inserted into the landless insertion hole 43 without soldering. Next, this conversion module 1
An example of a method for manufacturing is introduced.

First, the conversion substrate 3, the socket substrate 4, and the insulating base material 36 are prepared in advance. The conversion board 3 is
For example, it can be obtained by using a copper foil laminated plate obtained by sticking copper foil on both sides of an insulating base material made of glass epoxy as a starting material and performing a conventionally known pattern formation such as a subtractive method. As a result, first the plated through holes 5,
5A, the mini via hole 15, the die pad 7, the pads 8, 8a, 8b, etc. are formed. Instead of the glass epoxy, a copper-clad laminate made of glass polyimide may be selected. The socket substrate 4 has the frame-shaped insulating base material 21 with the pin insertion holes 23 formed therethrough, and then the socket-shaped I / O
It can be obtained by inserting the pin 24. And
The small-diameter portion of a specific one of the socket-shaped I / O pins 24 is cut by a predetermined length to obtain a specific socket-shaped I / O pin 24.
A.

The insulating base material 36 shown in FIG. 4A can be manufactured, for example, as follows. In the first step, a single-sided copper-clad laminate (for example, glass epoxy or glass polyimide) is used as a starting material, and the central portion is punched to form the through portion 37. In the next step, by etching the copper foil with the resist provided, the conductor pattern 38 and the land 4 are formed at predetermined positions.
4 and the pad 45 are formed. In the last step, a plurality of insertion holes 41 to 4 are formed by drilling a predetermined part.
3 is formed. The order of performing the above three steps may be changed. Further, in the insulating base 36A as shown in FIG. 4B, the conductor pattern 38 and the like are manufactured by performing the subtractive method using the double-sided copper clad laminate as a starting material.

In the subsequent first pin stand process, the conversion substrate 3 is
The base end portion of the external connection pin 6 is press-fitted into the lower surface side opening portion of each plated through hole 5, 5A by press. In the subsequent solder printing step, cream solder is printed on the land 5a of the plated through hole 5 located on the upper surface side of the conversion substrate 3 by a screen printing method. This is because the upper surface side of the conversion substrate 3 is flat unlike the lower surface side from which the external connection pins 6 project, and is therefore suitable for printing. The cream solder may be printed by a method other than screen printing. As the cream solder, for example, eutectic solder (Pb: Sn = 3)
7:63, melting point 183 ° C.) powder dispersed in a vehicle and the like are used. At this time, the cream solder is also printed on the pads 8, 8a, 8b surrounding the QFP 9.

In the subsequent second pin stand process, the conversion substrate 3 is
The tip end of each socket-shaped I / O pin 24 is inserted into the upper surface side opening of the plated through hole 5 of
The QFP 9 is fixed on the die pad 7. At that time, each I /
The O pins 24 and 24A are previously inserted into the corresponding insertion holes 41 to 43. As a result, the insulating base material 36 is held between the two substrates 3 and 4 while being positioned as described above.

Between the lower surface of the insulating base material 36 and the upper surface of the conversion substrate 3, it is preferable to secure a gap corresponding to the printed thickness of the cream solder. This is because the cream solder is prevented from being crushed and spread and the solder bridge caused thereby can be prevented. A spacer or the like (not shown) may be used to ensure the gap.

In the subsequent reflow step, after the conversion board 3 having the socket board 4 mounted therein is set in the reflow furnace, the temperature in the furnace is raised to a temperature near the melting point of the cream solder to melt the solder S1. When the molten solder S1 cools and hardens, the socket-shaped I / O pin 24 is bonded to the plated through hole 5 and each lead of the QFP 9 is bonded to each pad 8, 8a, 8b.

Next, the insulating base material 36 positioned as described above by the arrangement between the substrates 3 and 4 is attached to the solder S.
Solder individually using 1. As a result, the land insertion hole 41 and the tip of the specific I / O pin 24A, the land insertion hole 42 and the tip of the I / O pin 24, the pad 45, and the replacement connection pad 8a are joined to each other. At this time, at the same time, the electronic components 11 and 13 are individually soldered to the corresponding pads 10 and 12, respectively.

As described above, the desired conversion module 1
After completing the above, the PGA 2 is mounted on the conversion module 1 and further mounted on the socket 30 of the motherboard MB. In this case, the signal of PGA2 flowing through the specific I / O pin 24A is the land 44 of the land insertion hole 41,
It is input to the QFP 9 via the route of the conductor pattern 38, the pad 45, the inter-plate connecting portion 46, and the replacement connection pad 8a. The converted signal is further output from the QFP 9, and then the pad 8b, the mini via hole 15,
Conductor pattern 16 and land 5 of plated through hole 5A
It is supplied to the motherboard MB side through a route of Ab, the external connection pin 6 and the socket-shaped pin 31. That is, the specific I / O pin 24A is not directly connected to the external connection pin 6 via the corresponding plated through hole 5A, but is indirectly connected to the external connection pin 6 instead. . When used in this way, signal conversion is mainly achieved by the QFP 9, and the original function of the PGA 2 can be fully exerted.

Now, the operation and effects characteristic of this embodiment will be listed below. (A) A predetermined conductor pattern 38 is formed in advance on the insulating base material 36 of this embodiment. Therefore, unlike the case where a lead wire is used, for example, a troublesome work such as cutting into a predetermined length or peeling an insulating coating is unnecessary. Also, each I / O pin 24, 24A of the socket substrate 4
The insulating base material 3 only by inserting the through holes 41 to 43 into
6 is held between the two substrates 3 and 4 in a state in which they cannot be displaced in the plane direction. Therefore, the positioning itself becomes extremely easy. From the above, according to the present embodiment, the replacement connection can be performed relatively easily, and the workability in manufacturing the replacement connection can be improved.

Further, since the soldering is performed in the above-described positioning state, the conductors can be reliably joined together, and the connection reliability can be made excellent. (B) In addition, a specific I / O pin 24A that requires replacement connection
Is shorter than the other I / O pins 24 that do not require replacement connection. Therefore, the I / O pin 24
A is not inserted into the upper surface side opening of the corresponding plated through hole 5A, but is separated from the plated through hole 5A and is in a non-conductive state. Therefore, a short circuit due to direct conduction is avoided in advance.

(C) Further, according to the configuration of this embodiment, the conversion substrate 3 need only have a simple structure of the double-sided plate, and it is not necessary to perform the replacement connection by relying on the multilayer plate or the buildup layer. Therefore, even when the replacement connection is performed, the cost increase can be reliably avoided.

(D) In this conversion module 1, four landed insertion holes 42 are arranged separately from the landed insertion holes 41 at each corner of the pin forming area of the insulating base material 36. The I / O pins 24 having no replacement connection are inserted and soldered in the land insertion holes 42. As a result, the insulating base material 36 is reliably fixed between the two substrates 3 and 4, thereby further improving reliability. Since there are few obstacles around the I / O pin 24 located on the outer peripheral portion of the pin formation area, soldering can be performed relatively easily. Therefore, the manufacture of the device is facilitated. further,
The insulating base material 36 of this embodiment has an area comparable to the pin formation area. Therefore, even if a plurality of conductor patterns 38, a complicated and long conductor pattern 38, etc. are to be formed, the insulating base material 36 has a space for the formation thereof.
Is fully present above. Therefore, the structure is suitable for the case where there are a plurality of places where the replacement connection is to be made, and the case where the replacement connection path is complicated and long.

(E) In this conversion module 1, a through portion 37 larger than the QFP 9 is formed substantially in the center of the insulating base material 36, and the secondary side end of the conductor pattern 38 extending to the opening edge of the through portion 37. The pad 45 is formed on the. Therefore, only soldering is required to electrically connect the secondary side end of the conductor pattern 38 and the replacement connection pad 8a. Therefore, it is possible to omit the configuration of the structure that connects the insulating base material 4 and the conversion substrate 3 (the conductive pin 54 described later). Therefore, it is possible to avoid an increase in the number of parts and to achieve cost reduction.

(F) In the present embodiment, when the insulating base material 36 having a single-sided plate structure as shown in FIG. 4A is adopted, the insulating base material 36 can be manufactured inexpensively and relatively easily by a conventionally known method. can do. Therefore, it is convenient for prevention of cost increase. On the other hand, when the insulating base material 36A having a double-sided plate structure as shown in FIG. 4B is adopted, the landed hole insertion holes 41 and 42 and the I / O pins 24A and 24 are connected to each other, though the price is not so low as that of the single-sided plate. Reliability is further improved. That is,
A copper plating layer G1 is formed on the inner wall surfaces of the land insertion holes 41, 42.
This is because the contact area between the conductors is larger than that in the case of FIG.

The present invention is not limited to the above embodiment, and can be modified into the following forms, for example. The conversion module 51 having the structure shown in FIG. 6 may be used. A secondary landed insertion hole 52 is arranged at a position different from the primary landed insertion hole 41 through which the specific I / O pin 24A is inserted. Conductor pattern 3 on a rigid insulating substrate 55 having a single-sided plate structure
The land 44 of the landed insertion hole 52 on the secondary side is connected to the secondary side end of No. 8. Of course, the insulating base material 55 may have a double-sided plate structure. A plated through hole 53 is formed in the conversion substrate 3 at a location substantially on the same axis as the landed insertion hole 52 on the secondary side. The upper end side opening of the plated through hole 53 and the landed hole 5 on the secondary side
A conductive pin 54, which is a conductive rod, is inserted into both of the two. The upper end of the pin 54 is soldered to the land 44 of the landed hole 52 on the secondary side. The lower end of the same pin 54 is soldered to the upper land 53a of the plated through hole 53. The external connection pin 6 is not inserted into the land 53b on the lower surface of the plated through hole 53. The upper surface side land 53a
The replacement connection pad 8a and the replacement connection pad 8a are connected by a conductor pattern 56. And, it is needless to say that even in such a different example, the same operational effect as the operational effect of the above-described embodiment (excluding the operational effect E) is exhibited.
Further, according to the configuration of this another example, the conduction between the insulating substrate 55 and the insulating substrate 55 can be achieved regardless of the thickness of the insulating substrate 55 and the size of the step between the conversion substrate 3 and the insulating substrate 55. be able to.

The insulating base material 36 is not limited to one having only one conductor pattern 38 connecting the land 44 and the pad 45. For example, the insulating base material 61 of FIG.
, A plurality of such conductor patterns 38 (here, 4
Of course, it does not matter if it is provided.

The shape of the insulating base materials 36, 36A, 55, 61 is not limited to the square shape, but may be any other shape. In addition, the insulating base materials 36, 36A, 5
The area of 5, 61 does not have to be as large as that of the embodiment or the other example of FIG. 7, for example, 1/2, 1/3 of the pin formation area,
It may be about 1/4.

The insulating base materials 36, 36A, 61 are not limited to rigid ones, and may be thin and flexible. By doing so, the step difference from the upper surface of the conversion substrate 3 becomes small, so that the solder S1 is easily covered and the soldering to the pad 45 becomes easy.
This leads to further improvement in connection reliability.

In place of the external connection pins 6 provided upright on the lower surface side of the conversion substrate 3, for example, solder balls or the like may be provided in the lower surface side openings of the plated through holes 5 and 5A. ◎ The I / O terminals of the socket substrate 4 are socket-shaped I
It is not limited to the / O pins 24 and 24A, and may be a non-socket type, for example.

When the insulating base material 36 A having a double-sided plate structure is adopted in the embodiment, it is preferable to form a so-called cross-section through hole at a position where the pad 45 is present, for example. By doing so, a large conductor portion is secured at the secondary side end of the conductor pattern 38, so that the connection reliability of the portion is further improved.

The conversion module 71 of another example shown in FIG. 8 may be configured. This conversion module 71
6 is different from the example shown in FIG. 6 in that the conductive pin 54 is long and the lower end portion projects from the lower surface side of the conversion substrate 3. The lower end of the conductive pin 54 is
It is soldered to the lower surface side land 53b of the through hole 53. And, it is better to have such a configuration as shown in FIG.
There is some manufacturing advantage compared with the case of. That is, since there is no obstructive structure around the lower surface side land 53b, the soldering work can be easily performed.

Further, in this conversion module 71, FIG.
The small diameter portion of the specific socket-shaped I / O pin 24A is formed shorter than that of the other example. The pin 24
The insertion hole 41 corresponding to the small diameter portion of A is not formed.
The small diameter portion is attached to the land 44. With such a configuration, not only the distance between the tip surface of the small-diameter portion and the land 5Aa is increased, but also an insulator is interposed therebetween.
Therefore, reliable insulation can be achieved and the reliability of the device can be improved.

Here, in addition to the technical ideas described in the claims, the technical ideas grasped by the above-described embodiment will be listed below together with their effects. (1) In Claim 1 or 2, said specific I / O
The secondary landed hole insertion hole is arranged at a position different from the primary landed hole insertion hole through which the pin is inserted, and the secondary side landed hole insertion hole of the secondary side is arranged at the secondary side end of the conductor pattern. A land is connected, and a plated through hole connected to the replacement connection conductor portion is formed at a location on the conversion substrate on the substantially same axis as the land insertion hole on the secondary side,
A conductive module is inserted and soldered in both the plated through hole and the landed insertion hole on the secondary side.

(2) The conversion module according to claim 3 or the technical idea 1, wherein the socket substrate has a central hole at a position corresponding to the signal conversion element. With this configuration, soldering is facilitated and workability is improved.

(3) Claims 1 to 3, technical ideas 1 and 2
2. The conversion module according to claim 1, wherein the conversion substrate is a double-sided plate having conductor patterns formed by a subtractive method on both sides thereof and having mini via holes. With this configuration, the conversion substrate becomes inexpensive and the cost increase can be prevented.

(4) Claims 1 to 3, technical ideas 1 to 3
In any one of the above, the insulating base material is a single-sided plate having the conductor pattern and the land only on one side surface and having no plating layer on the inner wall surface of each of the insertion holes. module. With this configuration, the insulating base material becomes inexpensive and the cost increase can be prevented.

[0067]

As described above in detail, according to the inventions described in claims 1 to 3, there is provided a structure that can be replaced by a replacement connection relatively easily and without increasing the cost. A highly reliable conversion module can be provided.

According to the second aspect of the present invention, it is suitable when there are a plurality of places where the replacement connection is to be made, or when the replacement connection path is complicated and long, and is excellent in reliability and easy to manufacture. Can be one.

According to the third aspect of the invention, it is possible to avoid an increase in the number of parts and to achieve cost reduction.

[Brief description of drawings]

FIG. 1 is a schematic side view for explaining a usage state of a conversion module according to an embodiment of the present invention.

FIG. 2 is a partially enlarged cross-sectional view of the conversion module of the embodiment.

FIG. 3 is a plan view of an insulating base material used in the embodiment.

4A and 4B are partially enlarged cross-sectional views taken along the line AA of FIG.

FIG. 5 is a partially enlarged plan view showing a state in which the insulating base material of the embodiment is arranged.

FIG. 6 is a partially enlarged sectional view of a conversion module of another example.

FIG. 7 is a plan view showing an insulating base material of another example.

FIG. 8 is a partially enlarged sectional view of a conversion module of another example.

[Explanation of symbols]

1, 51, 71 ... conversion module, 3 ... conversion board, 4 ...
Socket substrate for mounting semiconductor package, 5, 5A ... Plated through hole, 8a ... Replacement connection pad as replacement connection conductor part, 9 ... QFP as signal conversion element, 24
… Socket-shaped I / O pins that do not require replacement connection, 24A…
Specific socket-like I / O pins that require replacement connection, 36,
36A, 55, 61 ... Insulating base material, 37 ... Penetration part, 38 ...
Conductor patterns, 41, 42 ... Land insertion holes as insertion holes, 43 ... Land-free insertion holes as insertion holes, 44 ... Land, 45 ... Pads, 46 ... Plate-to-plate connecting portions as conductors, 54 ... Conductors Conductive pin as.

─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 23/32 H01R 33/76 H01R 33/94

Claims (3)

(57) [Claims] 1. A socket for mounting a semiconductor package, in which a conversion board having a signal conversion element and provided with a plurality of plated through holes is provided with I / O pins projecting at locations corresponding to the plurality of plated through holes. In a conversion module in which a board is mounted and both boards are electrically connected by inserting the I / O pin into the plated through hole, a plurality of insertion holes capable of inserting the I / O pin, An insulating base material including a conductor pattern is disposed between the both substrates, and a land at an opening edge of the landed through hole that occupies at least a part of the plurality of through holes is provided at a primary side end of the conductive pattern. Are connected to each other, a specific I / O pin that requires a replacement connection is formed to be shorter than another I / O pin that does not require a replacement connection, and the specific I / O pin is connected to the land with land. Is inserted through the hole and soldered, conversion module, characterized in that the secondary-side terminal and the converter board side of replacement connecting conductor part of the conductor pattern is connected through a conductor. 2. The insulating base material has an area at least equal to the pin formation area of the socket substrate, and the specific I / O pins are inserted into a plurality of locations on the outer peripheral portion of the pin formation area. 2. The landed land insertion holes are arranged separately from the landed land insertion holes, and the I / O pins having no replacement connection are inserted and soldered in the landed land insertion holes. The conversion module described in. 3. A substantially central portion of the insulating base material is formed with a through portion larger than that corresponding to the signal conversion element, and a secondary side end of the conductor pattern extending to an opening edge of the through portion. 3. The conversion module according to claim 1, wherein a pad is formed on the pad, and the pad and the replacement connection conductor portion are soldered to each other.