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JP3511658B2 - Manufacturing method of easy-open packaging material - Google Patents
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JP3511658B2 - Manufacturing method of easy-open packaging material - Google Patents

Manufacturing method of easy-open packaging material

Info

Publication number
JP3511658B2
JP3511658B2 JP32422593A JP32422593A JP3511658B2 JP 3511658 B2 JP3511658 B2 JP 3511658B2 JP 32422593 A JP32422593 A JP 32422593A JP 32422593 A JP32422593 A JP 32422593A JP 3511658 B2 JP3511658 B2 JP 3511658B2
Authority
JP
Japan
Prior art keywords
film
line
conductive ink
packaging material
plastic film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP32422593A
Other languages
Japanese (ja)
Other versions
JPH07187224A (en
Inventor
憲夫 毛利
淳 今泉
正人 照井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Inc filed Critical Toppan Inc
Priority to JP32422593A priority Critical patent/JP3511658B2/en
Publication of JPH07187224A publication Critical patent/JPH07187224A/en
Application granted granted Critical
Publication of JP3511658B2 publication Critical patent/JP3511658B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/007Forming single grooves or ribs, e.g. tear lines, weak spots
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0866Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation
    • B29C2035/0877Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation using electron radiation, e.g. beta-rays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/10Surface shaping of articles, e.g. embossing; Apparatus therefor by electric discharge treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/16Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Bag Frames (AREA)
  • Making Paper Articles (AREA)
  • Wrappers (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、プラスチックフィルム
上に、導電性インキで自由形状線を形成し、この導電性
インキ部分に開孔又はハーフカット線を設ける易開封性
包装材の製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an easy-open packaging material in which a free-form line is formed on a plastic film with a conductive ink and an opening or a half-cut line is provided in the conductive ink portion. It is a thing.

【0002】[0002]

【従来の技術】近年、例えば、弁当、即席めんなどに添
付されているしょう油やソースの液体又は粉状の調味
料、或いは乾燥された薬味類を内容物とする収容袋は、
一般に熱可塑性プラスチックフィルムをヒートシールし
てなる袋体内に、上記の内容物を収容して、それぞれ小
袋状にして添付されている。
2. Description of the Related Art In recent years, for example, a bag containing soy sauce or sauce liquid or powdered seasoning attached to bento boxes, instant noodles, etc., or dried condiments as contents is
Generally, the above-mentioned contents are contained in a bag body formed by heat-sealing a thermoplastic film and attached in the form of a pouch.

【0003】これらの収容袋からの内容物の取り出し
は、多くは収容袋のヒートシール部分の、少なくとも1
箇所にV字形状や直線状の切り欠き又はスリットを設
け、この切り欠き又はスリットから袋体を引き裂いて開
口し、内容物の取り出しが行われている。これらの収容
袋の開口方法は、菓子類などの固体食品、その他を収容
する包装袋についてもほぼ同様に行われている。
Removal of the contents from these storage bags is usually done by at least one of the heat-sealed portions of the storage bags.
A V-shaped or linear cutout or slit is provided at a location, and the bag body is torn and opened from this cutout or slit to take out the contents. The method for opening these storage bags is almost the same for packaging bags that store solid foods such as confectionery and the like.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、これら
の切り欠きやスリットは、収容袋内に内容物を収容する
封入作業の際に形成することが一般的である。従って、
収容袋を製造するに際し、プラスチックフィルムの使用
者側は、製袋装置のヒートシール機に同期して作動する
専用の切り欠き手段や、スリット手段を別途備えなけれ
ばならず、このために製袋装置の設備コスト、ランニン
グコストが増加するという問題がある。
However, these notches and slits are generally formed during the enclosing work for containing the contents in the containing bag. Therefore,
When manufacturing the storage bag, the user side of the plastic film must be provided with a special notch means or slit means that operates in synchronization with the heat-sealing machine of the bag-making device. There is a problem that equipment cost and running cost of the device increase.

【0005】このため、プラスチックフィルムの使用者
側からは、切り欠き手段、スリット手段、その他の付帯
設備などを準備する必要がなく、しかも収容袋の開封が
容易に行うことができる新規なプラスチックフィルムの
要請が強くなされている。
Therefore, it is not necessary for the user of the plastic film to prepare notch means, slit means, and other auxiliary equipment, and a new plastic film which can easily open the accommodating bag. Is strongly requested.

【0006】そこで本発明は、透明なプラスチックフィ
ルムに、導電性インキの印刷により自由形状線からな
る、ミシン目、ハーフカット線などを形成し、電子線又
は電気放電処理により、開孔やハーフカット線などを設
けることができる易開封性包装材の製造方法を提供する
ものである。
In view of the above, the present invention forms perforations, half-cut lines, etc., which are free-form lines, by printing conductive ink on a transparent plastic film, and opens or half-cuts by electron beam or electric discharge treatment. It is intended to provide a method for producing an easy-open packaging material that can be provided with lines and the like.

【0007】[0007]

【課題を解決するための手段】上記の目的を達成するた
め本発明は、透明なプラスチックフィルムの少なくとも
片面に、印刷インキに導電性材料を添加混合してなる導
電性インキで、該プラスチックフィルムの所定の位置に
自由形状線を形成し、該プラスチックフィルムに電子線
又は電気放電処理を行って、前記自由形状線部分を溶融
し、開孔又はハーフカット線を設けることを特徴とする
易開封性包装材の製造方法である。
In order to achieve the above object, the present invention provides a conductive ink comprising a transparent plastic film and at least one surface thereof, which is prepared by adding a conductive material to a printing ink and mixing the conductive ink. A free-form line characterized by forming a free-form line at a predetermined position, subjecting the plastic film to an electron beam or electric discharge treatment to melt the free-form line portion and providing an opening or a half-cut line. It is a manufacturing method of a packaging material.

【0008】前記自由形状線が、直線又は曲線からなる
実線、点線のいずれか一方又は両方で形成されているこ
とを特徴とするものである。
The free-form line is characterized by being formed by one or both of a solid line and a dotted line consisting of a straight line or a curved line.

【0009】更に、前記導電性インキが、印刷インキに
金属粉又はそのペースト・金属酸化物・カーボンブラッ
ク・アセチレンブラック・界面活性剤などのいずれかの
単独又は複数の導電性材料を添加混合したことを特徴と
するものである。
Further, the conductive ink is obtained by adding a single or a plurality of conductive materials such as metal powder or a paste thereof, metal oxide, carbon black, acetylene black, and a surfactant to the printing ink. It is characterized by.

【0010】[0010]

【作用】本発明の易開封性包装材は、透明なプラスチッ
クフィルムに、印刷インキに導電性材料を添加混合した
導電性インキを用いて印刷することによって、従来でき
なかった微細孔、ミシン目線、ハーフカット線などの自
由形状線を形成することができると共に、この自由形状
線を形成したプラスチックフィルムへの電子線又は電気
放電処理により、フイルムを溶融し自動的に自由形状の
微細孔、ハーフカット、ミシン目線などを設けることが
できる。
The easily-openable packaging material of the present invention is a transparent plastic film printed with a conductive ink obtained by adding a conductive material to a printing ink and printing the same. Free-form lines such as half-cut lines can be formed, and the film is melted by electron beam or electric discharge treatment to the plastic film on which the free-form lines are formed, and the free-form fine holes and half-cuts are automatically formed. , Perforations can be provided.

【0011】[0011]

【実施例】本発明を詳細に説明する。本発明に係わる透
明なプラスチックフィルムは、熱可塑性プラスチックフ
ィルム、熱硬化性プラスチックフィルムのいずれでもよ
い。また、これらのフィルムの厚さは、6μm〜20μ
mの範囲が適している。
The present invention will be described in detail. The transparent plastic film according to the present invention may be either a thermoplastic plastic film or a thermosetting plastic film. The thickness of these films is 6 μm to 20 μm.
A range of m is suitable.

【0012】このフィルムに形成する自由形状線は、導
電性インキにより実線や点線を印刷して、フィルムを破
り易くするためのミシン目線、ハーフカット線を構成す
るものである。また、これらは直線状、曲線状などいず
れの形状も印刷により自由に形成することができる。
The free-form lines formed on this film are solid lines and dotted lines printed with conductive ink to form perforation lines and half-cut lines for making the film easy to break. In addition, any of these shapes such as a linear shape and a curved shape can be freely formed by printing.

【0013】この印刷に用いる導電性インキは、印刷イ
ンキにアルミニウムなどの金属粉又はそのペースト、金
属酸化物、カーボンブラック、アセチレンブラック、有
機電解質系界面活性剤などの、いずれか一種又は複数の
導電性材料を5重量%〜30重量%の範囲で添加混合し
たものである。この導電性インキを用いての印刷は、ク
ラビア印刷法、スクリーン印刷法、オフセット印刷法が
可能で、フィルムの厚さと、フィルム上に形成する必要
な印刷膜厚に応じて印刷法を選択する。例えば、厚い膜
厚を必要とする場合には、スクリーン印刷、薄く印刷し
たい場合には、グラビア印刷かオフセット印刷法が適し
ている。但し、食品包装用に使用する場合には、これら
の中で食品衛生法に抵触しない導電性材料を使用するこ
とが必要である。
The conductive ink used for this printing includes any one or a plurality of conductive inks such as a metal powder of aluminum or the like or a paste thereof, a metal oxide, carbon black, acetylene black, an organic electrolyte type surfactant, etc. It is obtained by adding and mixing the conductive material in the range of 5% by weight to 30% by weight. Printing using this conductive ink may be a clavia printing method, a screen printing method, or an offset printing method, and the printing method is selected according to the thickness of the film and the required printing film thickness to be formed on the film. For example, screen printing is suitable when a thick film thickness is required, and gravure printing or offset printing is suitable when a thin film is desired. However, when used for food packaging, it is necessary to use a conductive material that does not conflict with the Food Sanitation Law among these.

【0014】この自由形状線を印刷した包装材を、冷凍
食品、レトルト食品などの包装体に使用する場合には、
電子レンジによる電子線放射により、導電性インキを発
熱させてフィルムを溶融し、開口することも可能であ
る。また、一般的な包装材料として使用する場合には、
電気放電(コロナ放電など)による抵抗熱でミシン目な
どの自由形状線を溶融し開孔、或いはハーフカット線を
形成するもので、従って広幅で、長尺なプラスチックフ
ィルムに予めミシン目などを開孔することが可能とな
る。
When the packaging material on which the free-form line is printed is used for a package of frozen food, retort food, etc.,
It is also possible to cause the conductive ink to generate heat by melting the film by electron beam radiation from a microwave oven to open the film. Also, when used as a general packaging material,
A free-form line such as perforations is melted by resistance heat due to electric discharge (corona discharge, etc.) to form holes or half-cut lines. Therefore, perforations are pre-opened on a wide, long plastic film. Perforations are possible.

【0015】また、この透明なプラスチックフィルムの
表面或いは裏面に、ハーフカット線とミシン目線など異
なる自由形状線を印刷して、同時にハーフカットとミシ
ン目を開孔することも可能である。更に、プラスチック
フィルムの裏面に導電性インキで自由形状線を形成し、
この裏面にプラスチックフィルムを積層した包装材にお
いても、電子線などの放射でフィルムを溶融し開孔する
ことも可能である。
It is also possible to print different free-form lines such as a half-cut line and a perforation line on the front surface or the back surface of this transparent plastic film, and simultaneously open the half-cut line and the perforation line. Furthermore, a free-form line is formed on the back surface of the plastic film with conductive ink,
Also in the packaging material in which the plastic film is laminated on the back surface, it is possible to melt and open the film by radiation such as an electron beam.

【0016】<実施例1>図1は、本発明の一実施例に
おける透明なプラスチックフィルム上にに導電性インキ
により直線を印刷し、電気放電によりハーフカットを形
成したフィルムの断面説明図である。透明プラスチック
フィルムとして、厚さ10μmのPETフィルム10を
用いて、その上面に、幅80μm〜100μm、厚さ1
0μmにアルミニウム金属ペーストを10重量%添加混
合した導電性インキ11で実線を印刷した。乾燥後、こ
のフィルムを電気放電(コロナ放電)処理機中を、20
〜30/分の速度で通過させた。結果は導電性インキを
印刷した部分に、深さ約5μm〜7μmのハーフカット
線Hを設けることができた。尚、フィルムの裏面に上記
同様に印刷した場合(図1C)においても、同様のハー
フカット線が得られた。
Example 1 FIG. 1 is a cross-sectional explanatory view of a film in which a straight line is printed on a transparent plastic film with a conductive ink and a half cut is formed by electric discharge in an example of the present invention. . A PET film 10 having a thickness of 10 μm is used as a transparent plastic film, and a width of 80 μm to 100 μm and a thickness of 1 are formed on the upper surface thereof.
A solid line was printed with conductive ink 11 in which 10% by weight of aluminum metal paste was added and mixed to 0 μm. After drying, the film was placed in an electric discharge (corona discharge) treatment machine for 20
Passage was at a rate of ~ 30 / min. As a result, the half-cut line H having a depth of about 5 μm to 7 μm could be provided on the portion where the conductive ink was printed. Similar half-cut lines were obtained when printed on the back surface of the film in the same manner as above (FIG. 1C).

【0017】<実施例2>図2は、本発明の他の実施例
における透明なプラスチックフィルム上に導電性インキ
でミシン目線を印刷し電気放電によりフィルムを開孔し
た状態を示す断面説明図である。実施例1と同様に導電
性インキを用いて、フィルム上に、幅80μm〜100
μmで厚さ15μm、1点の長さ3mmのミシン目線を
グラビア印刷で形成し、その面に電気放電(コロナ放
電)処理機中を、20〜30/分の速度で通過させるこ
とにより、フィルムを溶融し貫通させてミシン目を設け
たものである。尚、フィルムの裏面に上記同様に印刷し
た場合(図2C)においても、同様のミシン目が得られ
た。
<Embodiment 2> FIG. 2 is a sectional explanatory view showing a state in which perforation lines are printed with a conductive ink on a transparent plastic film in another embodiment of the present invention and the film is opened by electric discharge. is there. A conductive ink was used in the same manner as in Example 1 to form a film having a width of 80 μm to 100 μm on the film.
A film is formed by forming a perforation line with a thickness of 15 μm and a length of 3 mm at one point by gravure printing, and passing the surface through an electric discharge (corona discharge) treatment machine at a speed of 20 to 30 / min. Is perforated by melting and penetrating. Similar perforations were obtained when printed on the back surface of the film in the same manner as above (FIG. 2C).

【0018】<実施例3>図3は、積層フィルムの内面
に導電性インキでスポットの印刷を施したフィルムの断
面図(A)と、電気放電により溶融し開孔した積層フィ
ルムの断面説明図(B)である。厚さ16μmのPET
フィルム10の裏面に、実施例1と同様の導電性インキ
11で、厚さが20μmで、一辺が約2mmの略正方形
状のスポット印刷を行って、裏面より厚さ20μmのポ
リエチレンフィルム10aを、接着剤12を介してドラ
イラミネートした積層フィルムを、コロナ放電処理機中
を、20〜30/分の速度で通過させ、自動的にこの積
層フィルムに貫通したスポット孔Gを設けることができ
た。
Example 3 FIG. 3 is a sectional view (A) of a film in which spots are printed on the inner surface of the laminated film with a conductive ink, and a sectional explanatory view of the laminated film melted and opened by electric discharge. (B). 16μm thick PET
A conductive ink 11 similar to that used in Example 1 was used to perform spot printing on the back surface of the film 10 in a substantially square shape having a thickness of 20 μm and a side of about 2 mm, and a polyethylene film 10a having a thickness of 20 μm was formed from the back surface. The laminated film dry-laminated via the adhesive 12 was allowed to pass through the corona discharge treatment device at a speed of 20 to 30 / min, and spot holes G penetrating the laminated film could be automatically provided.

【0019】[0019]

【発明の効果】本発明の易開封性包装材は、透明なプラ
スチックフィルムに、印刷インキに導電性材料を添加混
合した導電性インキを用いた印刷によって、従来できな
かった微細孔用のスポット、ミシン目線、ハーフカット
線などの自由形状線を形成することができると共に、こ
の自由形状線を形成したプラスチックフィルムへの電子
線や電気放電処理により、自動的にフイルムを溶融し、
自由形状の開孔やハーフカット、ミシン目などを設ける
ことができる。
EFFECTS OF THE INVENTION The easy-open packaging material of the present invention is a spot for fine pores, which cannot be obtained by printing using a conductive ink obtained by adding a conductive material to a printing ink on a transparent plastic film. Free-form lines such as perforation lines and half-cut lines can be formed, and the film is automatically melted by electron beam or electric discharge treatment to the plastic film on which this free-form line is formed.
Free-form openings, half cuts, and perforations can be provided.

【0020】また、本発明の易開封性包装材は、フィル
ムにハーフカット線、ミシン目線、微細孔用のスポット
と異なる形状の自由形状線を形成することができ、しか
も、電子線や電気放電(コロナ放電)処理によって、自
動的にハーフカットや開孔を設けることができる。
Further, the easy-open packaging material of the present invention can form a free-form line having a shape different from a half-cut line, a perforation line, and a spot for a fine hole on a film, and further, an electron beam or an electric discharge. A half cut or an opening can be automatically provided by the (corona discharge) treatment.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例における透明なプラスチック
フィルム上に導電性インキで実線を印刷したフィルムの
斜視図(A)と、そのT−T断面図(B)と、裏面に導
電性インキを印刷した場合の断面図(C)と、電気放電
によりハーフカットを設けた状態を示すフィルムの断面
説明図(D)である。
FIG. 1 is a perspective view (A) of a film in which a solid line is printed with a conductive ink on a transparent plastic film according to an embodiment of the present invention, a TT cross-sectional view thereof (B), and a conductive ink on the back surface. FIG. 3C is a cross-sectional view of the case of printing (C) and a cross-sectional explanatory view (D) of the film showing a state in which a half cut is provided by electric discharge.

【図2】本発明の他の実施例における透明なプラスチッ
クフィルムに導電性インキでミシン目線を印刷したフィ
ルムの斜視図(A)と、そのT−T断面図(B)と、裏
面に導電性インキを印刷した場合の断面図(C)と、電
気放電により開孔したフィルムの断面説明図(D)であ
る。
FIG. 2 is a perspective view (A) of a film obtained by printing perforation lines with a conductive ink on a transparent plastic film according to another embodiment of the present invention, a TT cross-sectional view thereof (B), and a conductive surface on the back surface. It is sectional drawing (C) at the time of printing ink, and sectional explanatory drawing (D) of the film opened by electric discharge.

【図3】積層フィルムの内面に導電性インキでスポット
の印刷を施したフィルムの断面図(A)と、電気放電に
より溶融し開孔した積層フィルムの断面説明図(B)で
ある。
FIG. 3 is a cross-sectional view (A) of a film in which spots are printed with a conductive ink on the inner surface of the laminated film, and a cross-sectional explanatory view (B) of the laminated film melted and opened by electric discharge.

【符号の説明】[Explanation of symbols]

10 …PETフィルム 10a…ポリエチレンフィルム 11 …導電性インキ 12 …接着剤 H …ハーフカット線 G …ミシン目などの貫通孔 10 ... PET film 10a ... polyethylene film 11 ... Conductive ink 12 ... Adhesive H ... Half cut line G ... Through holes such as perforations

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI C08J 7/04 C08J 7/04 D (58)調査した分野(Int.Cl.7,DB名) B65D 65/26 - 65/36 B65D 33/00 B31B 1/76 321 B32B 15/08 C08J 7/00 305 C08J 7/04 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 identification code FI C08J 7/04 C08J 7/04 D (58) Fields investigated (Int.Cl. 7 , DB name) B65D 65/26-65 / 36 B65D 33/00 B31B 1/76 321 B32B 15/08 C08J 7/00 305 C08J 7/04

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】透明なプラスチックフィルムの少なくとも
片面に、印刷インキに導電性材料を添加混合してなる導
電性インキで、該プラスチックフィルムの所定の位置に
自由形状線を形成し、該プラスチックフィルムに電子線
又は電気放電処理を行って、導電性インキ部分に、開孔
又はハーフカット線を設けることを特徴とする易開封性
包装材の製造方法。
1. A free-form line is formed at a predetermined position on the plastic film by using a conductive ink prepared by adding a conductive material to a printing ink and mixing it on at least one surface of a transparent plastic film. A method for producing an easily openable packaging material, which comprises subjecting an electrically conductive ink portion to an opening or a half-cut wire by performing an electron beam or electric discharge treatment.
【請求項2】前記導電性インキによる自由形状線が、直
線又は曲線からなる実線、点線のいずれか一方又は両方
で形成されていることを特徴とする請求項1に記載の易
開封性包装材の製造方法。
2. The easy-open packaging material according to claim 1, wherein the free-form line formed by the conductive ink is formed by one or both of a solid line consisting of a straight line or a curved line and a dotted line. Manufacturing method.
【請求項3】前記導電性インキが、印刷インキに金属粉
又はそのペースト・金属酸化物・カーボンブラック・ア
セチレンブラック・界面活性剤などのいずれかの単独又
は複数の導電性材料を添加混合したことを特徴とする請
求項1及び請求項2に記載の易開封性包装材の製造方
法。
3. The conductive ink comprises a printing ink, and one or more conductive materials such as metal powder or a paste thereof, metal oxide, carbon black, acetylene black, and a surfactant are added and mixed. The method for producing the easy-open packaging material according to claim 1 or 2, characterized in that.
JP32422593A 1993-12-22 1993-12-22 Manufacturing method of easy-open packaging material Expired - Lifetime JP3511658B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32422593A JP3511658B2 (en) 1993-12-22 1993-12-22 Manufacturing method of easy-open packaging material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32422593A JP3511658B2 (en) 1993-12-22 1993-12-22 Manufacturing method of easy-open packaging material

Publications (2)

Publication Number Publication Date
JPH07187224A JPH07187224A (en) 1995-07-25
JP3511658B2 true JP3511658B2 (en) 2004-03-29

Family

ID=18163440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32422593A Expired - Lifetime JP3511658B2 (en) 1993-12-22 1993-12-22 Manufacturing method of easy-open packaging material

Country Status (1)

Country Link
JP (1) JP3511658B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4603286B2 (en) * 2004-04-21 2010-12-22 大日本印刷株式会社 Laminated body for sachet and packaging bag for sachet using the same
JP6140067B2 (en) * 2013-12-12 2017-05-31 加川 清二 Equipment for forming multiple microhole rows in a long plastic film
JP2019167120A (en) * 2018-03-22 2019-10-03 大日本印刷株式会社 Pouch
JP6899612B1 (en) * 2020-06-29 2021-07-07 株式会社音楽館 Face mask unit, manufacturing method of face mask unit

Also Published As

Publication number Publication date
JPH07187224A (en) 1995-07-25

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