JP3514967B2 - Carrier tape forming equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier tape forming apparatus for accommodating and transporting small electronic components one by one in an accommodating recess, and more particularly to a carrier tape for forming an accommodating recess of a carrier tape into a tape. The present invention relates to a molding device.

[0002]

2. Description of the Related Art Conventionally, there is a carrier tape for accommodating and transporting small electronic parts one by one in a housing recess.
There are various methods for forming such a small accommodating recess P into the original film F, and one of them is a forming technique called "vacuum forming". Here, a conventional carrier tape forming apparatus using vacuum forming is shown in FIG.
Will be explained. FIG. 4 shows a basic outline of vacuum forming in the carrier tape forming apparatus. In such a carrier tape molding apparatus, the film F on which the accommodation recess P is molded is formed.
Is pulled by a pulling roll R so as to move in contact with respective outer peripheries below the pre-heating roll Ha, above the main heating roll Hb, and below the molding drum M. The preheating roll Ha preheats the film F to about 160 ° C., and the main heating roll Hb main heats the preheated film F to about 180 ° C. By these, before contacting the outer periphery of the forming drum M, the film F is sufficiently heated and softened so as to be easily vacuum formed. Further, the molding drum M vacuum-molds the accommodating recess P in the film F by bringing the still softened film F into close contact with the cavity C formed on the outer periphery of the molding drum M by vacuuming.

[0003]

However, the above-mentioned carrier tape molding apparatus has the following problems. That is, since the carrier tape containing the electronic components is also used as an assembly pallet of the automatic assembly line while the electronic components are housed in the housing recess P, it is necessary to maintain the accuracy of the automatic assembly. It is necessary to maintain the accuracy of the position of the electronic component (on the assembly pallet) by keeping the state of the electronic component accommodated in any of the accommodation recesses P.

However, in the housing drum P of the above-described carrier tape molding apparatus, in the housing recess P of the vacuum-formed carrier tape, the inner radius of the arc around the bottom surface of the housing recess cannot be reduced, so that each housing recess. It was difficult to maintain the accuracy of the housing position of the electronic components housed in. Therefore, in the accommodating recess of such a size, it has been desired that the inner radius of the circular arc around the bottom surface of the accommodating recess be as small as possible and uniform, but in the conventional carrier tape molding apparatus, such vacuum forming is possible. It was difficult. Also,
In order to prevent the film from being cooled and hardened by the time molding is completed, it is necessary to add sufficient heat to the film in advance to heat it, so the transition from the softened state to the hardened state is delayed, and when forming a large accommodation recess, its long side However, there were problems such as distortion of the film, restriction of the molding speed, and surface traces left by the heating roll on the film surface. The problem to be solved by the present invention is to obtain a carrier tape molding device for molding a carrier tape having an accurate housing recess shape at high speed.

[0005]

One aspect of the present invention is, in a carrier tape forming apparatus, a heating roll for directly heating a film, a forming drum for vacuum forming an accommodating concave portion having a cavity formed in the outer periphery, and a vacuum. In the latter half of the molding, a hot-air injection mechanism for pressure-injecting hot air toward the bottom of the accommodating recess being formed on the forming drum, and a film cooling mechanism for cooling the formed film are provided. The second invention of the present application is
In a carrier tape forming apparatus, a heating roll for preheating a film, a forming drum for forming a cavity in the outer periphery of the film for vacuum forming an accommodating recess, and a second half of the vacuum forming
, A hot-air injection mechanism for injecting hot air toward the bottom of the accommodating recess on the forming drum, a straightening roller for correcting the swell of the formed film, and a film cooling mechanism for cooling the formed film. With.

[0006]

In the carrier tape molding apparatus of the present invention,
When the original film is guided by a heating roll and goes around,
It is directly heated and sucked into the cavity by the forming drum to start the vacuum forming of the accommodation recess. In the latter half of this vacuum forming, high-pressure, high-temperature air is jetted toward the arc portion around the bottom surface of the accommodation recess to assist the forming. After that, the completed film is taken out of the molding apparatus through the undulation correcting roller of the film after molding and the film cooling mechanism.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, a carrier tape molding apparatus 100 includes a heating roll 110, a hot air blowing mechanism 120, a straightening roller 130, a film cooling mechanism 140, and a separation roller 150 around a molding drum 101. Forming drum 101 and heating roll 1
They are close to 10 but not in contact with each other. The film F moves on a common tangent line between the heating roll 110 and the forming drum 101. Similarly, the hot air blowing mechanism 120, the film cooling mechanism 140, and the separating roller 150 are also close to the forming drum 101, but are not in contact with each other. It should be noted that only the straightening roller 130 is in elastic contact with the forming drum 101 via the film F. In addition,
A guide roller 111 for the heating roll 110 is arranged close to the heating roll. The heating roll 110 preheats the film F to about 150 ° C.,
Before coming into contact with the outer periphery of the forming drum 101, the film F is heated to start softening so as to facilitate vacuum forming. Since the outer peripheral surface of the heating roll 110 is coated with a tetrafluoroethylene resin for improving the film peeling property, the upper limit of the heating temperature of the heating roll is limited to 180 ° C. or lower due to the heat resistance of this resin.

As shown in FIG. 2, a large number of cavities C, which form a mold for the accommodating recess P, are formed on the outer periphery of the molding drum 101 at equal intervals. The vacuum chamber 1 is provided in the cavity C through a minute gap 102 provided along the bottom side edge of the accommodation recess P.
03 is connected. The accommodation recess P is vacuum-formed in the film by bringing the softened film into close contact with the cavity C by drawing a vacuum. A vacuum exhaust device (not shown) is connected to the vacuum chamber 103. The holding temperature of the molding drum 101 is set to about 60 ° C. In FIG. 3, the hot air jetting mechanism 120 has an electric heater (not shown) in its main body, and the hot air jetting mechanism 120 can supply about 4
It is heated to 70 ° C. and jetted from the nozzle 121 toward the film F on the forming drum 101, particularly toward the bottom of the accommodating recess P that is being formed. The heat and dynamic pressure of the jetted air assist the vacuum forming of the bottom portion in the latter half stage of the formation of the accommodation recess P to form the accurate shape in a short time. The formed film is pressed against the undulation correction roller 130 to correct the undulation. The film cooling mechanism 140 cools the film by injecting compressed air at room temperature toward the film. The separation roller 150 takes out the formed film F from the forming drum 101.

In the carrier tape forming apparatus of the present invention, the original film F before forming is directly preheated when it is rotated along the heating roll 110, sucked into the cavity C by the forming drum 101, and vacuum formed. . At the time of this vacuum forming, the hot compressed air is jetted from the nozzle 121 of the hot air blowing mechanism 120 toward the bottom of the housing recess P that is being formed on the forming drum 101. The injection pressure assists the vacuum forming of the bottom portion in the latter half stage of the formation of the accommodation recess P, and completes the accurate shape.

Further, in the case of a polycarbonate film which is a high temperature plastic film having a softening temperature of about 300 ° C.,
The film is heated directly to about 180 ° C. with a heating roll, the pressurized air is heated within the range of about 450 ° C. to 550 ° C., and is jetted from the nozzle toward the film F on the forming drum 101 at high speed and accurately. Can be formed into a shape.

[0011]

According to the carrier tape molding apparatus of the present invention, high-pressure and high-temperature air is jetted toward the bottom surface of the accommodating recess without excessively heating the film, and the molding is assisted. Due to the heat and dynamic pressure of the generated air, it is possible to mold the carrier tape having the accurate shape of the accommodating recess, particularly the accurate shape of the bottom corner. Furthermore, the film forming speed is increased, and no trace of heating is left on the film. Moreover, a high temperature plastic film such as a polycarbonate film can be molded.

[Brief description of drawings]

FIG. 1 is a front view of a carrier tape molding apparatus of the present invention.

FIG. 2 is a partial sectional view of a molding drum of the carrier tape molding apparatus of the present invention.

FIG. 3 is a sectional view of a hot air blowing mechanism of the carrier tape molding apparatus of the present invention.

FIG. 4 is a schematic front view of a conventional carrier tape molding apparatus.

[Explanation of symbols]

101 molding drum 110 heating roll 120 Hot air injection mechanism 130 Roller for undulation correction

─────────────────────────────────────────────────── --- Continuation of front page (56) References JP-A-7-88949 (JP, A) JP-A-2-109830 (JP, A) JP-A-4-14445 (JP, A) JP-A-6- 278202 (JP, A) JP-A-11-151749 (JP, A) JP-A-3-21427 (JP, A) JP-A-2-18027 (JP, A) JP-B 39-6828 (JP, B1) (58) Fields investigated (Int.Cl. ⁷ , DB name) B29C 51/22 B29C 51/42 B29C 59/04 B65B 15/04

Claims (2)

(57) [Claims] 1. A heating roll for directly heating a film, a molding drum having a cavity formed on the outer periphery thereof for vacuum forming a storage recess, and a storage recess for forming a storage recess on the molding drum in the latter half of the vacuum forming .
It is equipped with a hot-air injection mechanism that injects hot air toward the bottom and a film cooling mechanism that cools the formed film , and vacuum-forms the bottom by the heat and dynamic pressure of the injected air.
A carrier tape molding apparatus, which is characterized by supporting the above . 2. A heating roll for preheating the film, a forming drum for forming a cavity in the outer periphery of the film by means of vacuum forming, and a housing recess for forming a container on the forming drum in the latter half of the vacuum forming .
A hot air blowing mechanism that blows hot air toward the bottom, a straightening roller that straightens the undulations of the formed film,
And a film cooling mechanism that cools the formed film , and the bottom of the film is cooled by the heat and dynamic pressure of the injected air.
A carrier tape molding apparatus, which is characterized by assisting blank molding .