JP3518693B2 - Thermocompression bonding tool, method of manufacturing the same, and thermocompression bonding apparatus using the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermocompression bonding tool used for fixing a circuit component on a printed wiring board via solder, a method for manufacturing the same, and a thermocompression bonding apparatus using the same. .

[0002]

2. Description of the Related Art FIG. 6 is a schematic perspective view showing an example of a conventional thermocompression bonding apparatus used for fixing a circuit component on a printed wiring board via solder.

In FIG. 6, the thermocompression bonding apparatus 51 is mainly composed of a thermocompression bonding tool 52 and a temperature controller 53.

Of these, the thermocompression bonding tool 52 is folded back at the intermediate portion to be formed into a substantially U shape, and electrodes 54a and 54b are provided at both ends, and a diamond tip 55 is provided on the lower surface of the intermediate portion. Is attached. The wiring cable 5 is provided between the temperature controller 53 and the electrodes 54a and 54b and the diamond tip 55.
Connected at 6.

In addition, although not shown, the thermocompression bonding tool 52 is provided with a vacuum hole for vacuum suction on the lower surface of the diamond tip 55, and through this hole, an IC (not shown) or the like is formed on the lower surface of the diamond tip 55. It is ready for vacuum suction of electronic components.

The thermocompression-bonding tool 52 is formed as a thermocouple as a whole, and a large current is applied to the thermocompression-bonding tool 52 from the temperature controller 53 in a state where the electronic components are vacuum-adsorbed on the lower surface of the diamond chip 55. Flow of several hundred degrees (150 degrees) within a few seconds due to Joule heat.
The temperature can be raised up to 250 degrees Celsius) and soldering can be performed using this as a heat source.

[0007]

However, in the above-mentioned conventional thermocompression bonding apparatus, since a large current is passed through the thermocompression bonding tool 52, the connection portion between the wiring cable 56 and the electrodes 54a, 54b up to the thermocompression bonding tool 52, etc. The shape of
There is a problem that the thermocompression bonding tool 52 becomes large.

In addition, the temperature control system for the heat generating section is
There is a problem that know-how is required and the cost is high because a large current is handled.

Further, since the wiring cable 56 connecting between the temperature controller 53 and the thermocompression bonding tool 52 is thick and heavy, the electronic components adsorbed by the thermocompression bonding tool 52 can be accurately aligned and rotated. There was a problem that became a heavy load when making adjustments.

Further, since there is no degree of freedom in the shape of the thermocompression bonding tool 52 and the drawing out of the wiring cable 56, it is difficult to change / adjust the temperature distribution, change the shape of other portions, and the like. There is also a problem that the cost is high due to the complexity.

The present invention has been made in view of the above problems, and an object thereof is a thermocompression-bonding tool having a large degree of freedom in shape, a small size and excellent temperature rising characteristics, a method for manufacturing the same, and a heat using the same. It is to provide a crimping device.

[0012]

According to the present invention, there is provided a thermocompression bonding tool including a heating unit for pressing a target object to apply heat, wherein the heating unit is a chemical vapor deposition method. The electrically insulating ceramic produced by the above is used as a substrate, the electrically conductive ceramic is formed in a pattern on the substrate, and the electrically insulating ceramic produced by the chemical vapor deposition method is covered with the electrically conductive ceramic. This is achieved by providing and configuring a thickness greater than that of the electrically conductive ceramic.

Further, according to the present invention, a head portion holding a thermocompression bonding tool having a heating portion for pressing the object to apply heat, and the object to the lower side of the head portion are provided. In a thermocompression bonding apparatus having a base part for setting, the heating part is made of an electrically insulating ceramic produced by a chemical vapor deposition method as a substrate, and an electrically conductive ceramic is formed in a pattern on the substrate. In addition, the electrically conductive ceramic is formed by covering the electrically conductive ceramic with a thickness larger than the thickness of the electrically conductive ceramic.

Further, according to the present invention, the object is to provide a method for producing a thermocompression bonding tool having a heating portion for pressing a target object to apply heat, wherein the heating portion is formed by a chemical vapor deposition method. The electrically insulating ceramic thus obtained is used as a substrate, and the electrically conductive ceramic is formed in a pattern on the substrate. Thereafter, the electrically conductive ceramic is covered with the electrically insulating ceramic by the chemical vapor deposition method. It is achieved by making it thicker than the thickness of the conductive ceramic. Further, preferably, the electric
The electrically insulating ceramic covering the air conduction conductive ceramic
Is preferably formed so as to have a planar shape by cutting the surface within a range in which the electrically conductive ceramic is not exposed after being provided so as to be thicker than the electrically conductive ceramic.

Further, according to the present invention, there is provided a heating portion for pressing the object to apply heat, and a vacuum hole for vacuum-adsorbing the object to a portion pressed against the object. In the thermocompression-bonding tool having the above-mentioned heating unit, the electrically conductive ceramics formed by the chemical vapor deposition method are used as a substrate, and the electrically conductive ceramics are formed in a pattern on the substrate. An electrically insulating ceramic that covers the ceramic and is made by chemical vapor deposition is provided with a smooth surface and a thickness greater than the thickness of the electrically conductive ceramic, and the vacuum hole is opened in the smooth surface. It is achieved by adopting a different configuration.

Further, according to the present invention, the object is to have a heating portion for pressing the object to apply heat, and a vacuum hole for vacuum-adsorbing the object at a portion pressed against the object. In a thermocompression bonding apparatus comprising a head unit holding a thermocompression bonding tool having the base unit and a base unit for setting the object on the lower side of the head unit, the heating unit is a chemical vapor deposition method. The electrically insulative ceramic made by the above is used as a substrate, and the electrically conductive ceramic is formed in a pattern on the substrate, and the electrically insulative ceramic produced by the chemical vapor deposition method is covered on the surface of the electrically conductive ceramic. Is made smoother and provided thicker than the thickness of the electrically conductive ceramic, and the vacuum holes are opened on the smooth surface. It is achieved me.

Further, according to the present invention, there is provided a heating unit for pressing the object to apply heat, and a vacuum hole for vacuum-sucking the object to a portion pressed against the object. In the method for manufacturing a thermocompression bonding tool having, the heating unit is an electrically insulating ceramic produced by a chemical vapor deposition method as a substrate, and the electrically conductive ceramic is formed in a pattern on the substrate, and After that, an electrically insulating ceramic is formed over the electrically conductive ceramic by chemical vapor deposition to have a surface smoother than the thickness of the electrically conductive ceramic, and the vacuum hole is formed on the smooth surface. It is achieved by opening the. Further, preferably, the electrical conductive before <br/> Symbol electrically insulating ceramic covering the ceramic, the electrically conductive ceramic is not exposed later provided by coating thicker than the thickness of the electrically conductive ceramic It is advisable to cut the surface within the range and form a flat surface.

[0018]

According to this, the heating section is formed by patterning the electrically conductive ceramic on the electrically insulating ceramic produced by the chemical vapor deposition method, and further electrically insulating the electrically conductive ceramic on the electrically conductive ceramic. By applying a three-layered structure by coating a functional ceramic, a pulse heating type heating tool can be realized. Further, since the wiring can be made thin, the thermocompression bonding tool can be easily handled, the bonding pressure and the θ direction can be finely adjusted, and a predetermined position can be heated with high accuracy. Further, it becomes possible to reduce the voltage and current required for heat generation of the heater.

In addition, an electrically insulating ceramic which is made by a chemical vapor deposition method with a flat surface is made thicker than the electrically conductive ceramic so as to cover the electrically conductive ceramic, and the smooth surface is provided. By providing the vacuum hole on the surface of the plate, the air leakage during vacuum suction is eliminated, and more reliable suction can be obtained.

[0020]

Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 4 is a schematic perspective view of a thermocompression bonding apparatus shown as an embodiment of the present invention.

In FIG. 4, the thermocompression bonding apparatus 1 is an apparatus used for temporarily fixing an IC (integrated circuit) (not shown) as an electronic component on the printed wiring board 2 via solder, and is roughly classified. It is composed of a base portion 3, a frame portion 4, an electrical component portion 5 as a controller, and the like.

More specifically, an XY fine movement table 6 on which the printed wiring board 2 is set is installed on the base portion 3, and the printed wiring board set on the XY fine movement table 6 is installed. 2 is moved in the XY direction, and the position can be adjusted.

The electrical component section 5 is fixedly attached to the frame section 4 while being positioned directly above the XY fine movement table 6, and a head section 7 is provided on the lower surface side so as to project downward. A thermocompression bonding tool 8 is attached to the lower end of the head portion 7.

As shown in detail in FIG. 3, the thermocompression bonding tool 8 includes a tool body 9 made of metal or the like having a low thermal conductivity, and a heating unit 10 is attached to the lower surface side of the tool body 9. Further, vacuum holes 11 for vacuum suction are formed in the tool body 9 and the heating unit 10 so as to vertically penetrate therethrough.

The inner diameter of the vacuum suction hole 11 is different between the upper and lower sides, and the inner diameter formed on the lower surface 10a of the heating portion 10 is smaller than the inner diameter formed on the upper end of the tool body 9. In addition, the suction force on the lower surface 10a of the heating unit 10 can be increased.

The heating unit 10 is shown in FIG. 2 and A--A in FIG.
As shown in detail in FIG. 1, which is an enlarged cross-sectional view, an electrically insulating ceramic formed in a hat shape by providing a collar-shaped portion on the base of a hollow columnar main body portion by chemical vapor deposition (CVD). 12 [hereinafter, "PBN12" (Pyrolytic Boro
n Nitride)] is used as a substrate, and this PBN 12
On top of the electrically conductive ceramic 13 [hereinafter referred to as "PG1
3 ”(abbreviation of Pyrolytic Graphite)] is vapor-deposited to form a heater pattern, and an electrically insulating ceramic 14 [hereinafter, referred to as“ PBN12] made by a chemical vapor deposition method like PBN12 is formed. PBN14 "]
It is made as a heater formed by coating (overcoating) with a three-layer structure.

When the PBN 14 is overcoated, the PBN 1 is formed on the tip (lower surface) side of the heating unit 10.
4 is overcoated with a thickness larger than the thickness of PG13 formed on PBN12, and then PG13
The entire surface of the PBN 14 is machined by an amount such that the pattern surface is not exposed to maintain the smoothness of the lower surface 10a of the heating unit 10. Further, when the PG 13 is formed on the PBN 12, the electrodes 13a and 13b of the PG 13 are also formed at the same time, and when the heating part 10 is attached to the tool body 9, the electrodes 13a and 13b and the electrical component part 5 are electrically connected. Planned.

Next, the operation of the thermocompression bonding apparatus thus constructed will be described. First, the printed wiring board 2 is set on the XY fine movement table 6, and the XY fine movement table 6 is used to move the X-
The position is adjusted by moving in the Y direction. On the other hand, the electronic component mounted on the printed wiring board 2 is vacuum-sucked to the lower surface 10a of the heating unit 10, that is, the lower surface of the PBN 14, and attached to the thermocompression bonding tool 8.

The thermocompression-bonding tool 8 to which the electronic component is attached is rotated on the horizontal plane by the head portion 7, and the electronic component is aligned with the wiring pattern of the printed wiring board 2. After that, the electronic components are lowered and the electronic components are printed on the printed wiring board 2.
It is pressed upward, and at the same time, the heating unit 10 is heated to temporarily solder the electronic component onto the printed wiring board 2. Also, after confirming that the thermocompression bonding tool 8 has cooled to a temperature sufficient for the solder to solidify, the head portion 7 is lifted up together with the thermocompression bonding tool 8 to complete the temporary soldering.

Further, the electronic components provisionally soldered on the printed wiring board 2 in this way are permanently soldered in the next step, and the mounting is completed.

In this embodiment, a series of operations such as vacuum suction, rotation operation of the head section 7, pressing force, control of heating temperature, etc. are all incorporated in the electrical equipment section 5 and a control circuit (CPU) not shown. The configuration is controlled by.

In the above embodiment, the case where the electronic component is temporarily soldered has been described. However, the electronic component can be used for the main soldering, and in this case, the electronic component already soldered to the printed wiring board 2 can be used. It suffices to heat only the lead portion of the component, and the vacuum suction of the electronic component is not performed.

Further, in the above-described embodiment, when the PBN 14 is overcoated, the PBN 12 is covered with a thickness larger than that of the PG 13 formed on the PBN 12, and thereafter the pattern surface of the PG 13 is not exposed. Although the PBN 14 is entirely machined by machining or the like so as to maintain the flatness (smoothness) of the lower surface 10a of the heating portion 10, the structure of covering the entire surface of the PBN 12 is not shown. As shown, the PBN 14 is provided only on the PG 13 formed in a substantially zigzag pattern on the PBN 12, and thereafter, the lower surface of the PBN 14 is cut by machining or the like in a range where the PG 13 is not exposed, and a flat surface on the lower surface of the heating unit 10 is formed. If the vacuum hole 11 is opened and provided in this smooth surface, It is possible to be able to obtain a reliable adsorption by eliminating the air leakage between the smooth surface and the electronic component at the time of adsorption.

Therefore, in the thermocompression bonding apparatus constructed as described above, the heating portion is formed by patterning the PG (electrically conductive ceramic) 13 on the PBN (electrically insulating ceramic) 12 made by the chemical vapor deposition method. Since the PG 13 is formed into a circular shape, and the PG 13 is further covered with PBN (electrically insulating ceramic) 14 to form a three-layer structure, about 300
Pulse heating can be performed, such as high temperature rise characteristics of ℃ / sec or more. Also, the wiring by the PG pattern can be made thin, the thermocompression bonding tool can be handled easily, the bonding pressure and the θ direction can be finely adjusted, and a predetermined position can be heated with high accuracy. Further, it becomes possible to reduce the voltage and current required for heat generation of the heater.

In addition, a PBN14 made by chemical vapor deposition with a flat surface is made thicker than the thickness of PG13 so as to cover the PG13, and a vacuum hole 11 is opened in the smooth surface of the PBN14. In the case where the vacuum suction is performed, air leakage between the smooth surface electronic component and the vacuum suction is eliminated and reliable suction can be obtained.

The shape of the heating portion 10 is not limited to the shape of each of the above embodiments, and any shape such as a disc, a square plate, a tube, a crucible, etc. may be used.

[0037]

As described above, according to the present invention,
The heating section is formed by forming an electrically conductive ceramic in a pattern on an electrically insulating ceramic produced by a chemical vapor deposition method, and further covering the electrically conductive ceramic with an electrically insulating ceramic to form three layers. Since the structure is adopted, a pulse heating type heating tool can be realized, the temperature distribution can be improved, and the temperature rising speed can be improved. Further, since the wiring can be made thin, the thermocompression bonding tool can be easily handled, the bonding pressure and the θ direction can be finely adjusted, and a predetermined position can be heated with high accuracy. Further, it becomes possible to reduce the voltage and current required for heat generation of the heater.

In addition, an electrically insulating ceramic made by a chemical vapor deposition method with a flat surface is made thicker than the thickness of the electrically conductive ceramic so as to cover the electrically conductive ceramic, and the electrically smooth ceramic is smoothed. By providing the vacuum holes on the surface of the plate, the air leakage during vacuum suction is eliminated, and more reliable suction can be expected.

[Brief description of drawings]

FIG. 1 is an enlarged cross-sectional view of a main part of a thermocompression bonding tool according to an embodiment of the present invention.

FIG. 2 is a schematic perspective view of a heating unit in the thermocompression bonding tool shown in FIG.

FIG. 3 is a perspective view of the same thermocompression-bonding tool as shown in FIG.

FIG. 4 is a schematic configuration perspective view of a thermocompression bonding apparatus according to an embodiment of the present invention.

FIG. 5 is a perspective view showing a modified example of the heating unit.

FIG. 6 is a schematic configuration perspective view showing an example of a conventional thermocompression bonding apparatus.

[Explanation of symbols]

1 Thermocompression bonding device 2 printed wiring board 3 base 7 head 8 Thermo-compression tool 9 Tool body 10 heating unit 11 vacuum holes 12 PBN (electrically insulating ceramic) 13 PG (electrically conductive ceramic) 14 PBN (electrically insulating ceramic)

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-3-198360 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/60 H01L 21/52 B23K 3 / 04

Claims (8)

(57) [Claims] 1. A thermocompression bonding tool including a heating unit for pressing a target object to apply heat, wherein the heating unit is a substrate made of an electrically insulating ceramic produced by a chemical vapor deposition method. The electrically conductive ceramic is formed in a pattern on the substrate, and the electrically insulative ceramic produced by the chemical vapor deposition method is provided so as to cover the electrically conductive ceramic in a thickness larger than the thickness of the electrically conductive ceramic. A thermocompression bonding tool. 2. A head part holding a thermocompression bonding tool having a heating part for pressing the object to apply heat, and a base part for setting the object on the lower side of the head part. In the thermocompression bonding apparatus, the heating section uses an electrically insulating ceramic formed by a chemical vapor deposition method as a substrate, and the electrically conductive ceramic is formed in a pattern on the substrate and the electrically conductive ceramic is covered. A thermocompression bonding apparatus, characterized in that an electrically insulating ceramic produced by chemical vapor deposition is provided thicker than the electrically conductive ceramic. 3. A method for manufacturing a thermocompression bonding tool including a heating unit for pressing a target object to apply heat, wherein the heating unit is a substrate made of an electrically insulating ceramic produced by a chemical vapor deposition method. An electrically conductive ceramic is formed in a pattern on this substrate, and thereafter, an electrically insulating ceramic is formed thicker than the electrically conductive ceramic by a chemical vapor deposition method so as to cover the electrically conductive ceramic. A method for manufacturing a thermocompression bonding tool characterized by the above. Wherein said electrically insulating ceramic covering the electrically conductive ceramic cutting surface to the extent that the electrically conductive ceramic is not exposed later provided with thicker coating than the thickness of the electrically conductive ceramic The method for manufacturing a thermocompression bonding tool according to claim 3, wherein the thermocompression bonding tool is formed into a flat shape. 5. A thermocompression-bonding tool, comprising: a heating unit for pressing a target object to apply heat, and a vacuum hole for vacuum-adsorbing the target object in a portion pressed against the target object, Part of the electrically insulating ceramics produced by the chemical vapor deposition method as a substrate, the electrically conductive ceramics are formed on the substrate in a pattern, and the electrically conductive ceramics are covered by the chemical vapor deposition method. A thermocompression-bonding tool, characterized in that the electrically insulating ceramic to be produced has a smooth surface and is provided thicker than the thickness of the electrically conductive ceramic, and the vacuum hole is opened on the smooth surface. 6. A thermocompression bonding tool having a heating portion for pressing the object to apply heat and holding a vacuum hole for vacuum-adsorbing the object at a portion pressed against the object. A thermocompression bonding apparatus comprising a head portion and a base portion for setting the object on the lower side of the head portion, wherein the heating portion is an electrically insulating ceramic substrate made by chemical vapor deposition. As the electrically conductive ceramic, a pattern is formed on the substrate, and the electrically conductive ceramic is formed by chemical vapor deposition to cover the electrically conductive ceramic so that the surface is smooth and the electrically conductive ceramic is formed. The thermocompression-bonding device is provided with a thickness larger than that of the above, and the vacuum hole is provided on the smooth surface. 7. A method of manufacturing a thermocompression bonding tool, comprising: a heating unit for pressing an object to apply heat; and a vacuum hole for vacuum-adsorbing the object in a portion pressed against the object. , The heating portion is a substrate made of an electrically insulating ceramic produced by a chemical vapor deposition method, the electrically conductive ceramic is formed in a pattern on the substrate, and then the electrically conductive ceramic is covered. An electrically insulating ceramic is formed by chemical vapor deposition to have a surface that is thicker than the thickness of the electrically conductive ceramic, and that the vacuum hole is provided on the smooth surface. A method for manufacturing a characteristic thermocompression bonding tool. Wherein said electrically insulating ceramic covering the electrically conductive ceramic cutting surface to the extent that the electrically conductive ceramic is not exposed later provided with thicker coating than the thickness of the electrically conductive ceramic The method for manufacturing a thermocompression bonding tool according to claim 7, wherein the thermocompression bonding tool is formed in a flat shape.