JP3519448B2 - Electronic component mounting method - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an electronic component on a printed circuit board using an electronic component inserter. 2. Description of the Related Art In recent years, as electronic devices have been miniaturized, the number of cases where electronic components are mounted on a printed circuit board at high density has increased. For this reason, an electronic component insertion machine that automatically inserts lead terminals of electronic components into through holes of a printed circuit board is required to have high-precision and high-efficiency functions. The electronic component insertion machine shown in FIG. 2 has a video camera 2 for image recognition processing installed above an XY table 1 on which one printed circuit board is placed. If an arbitrary through-hole area of the printed circuit board is specified through the operation panel 3,
The through-hole area becomes a target area for image recognition processing, and is subjected to pattern analysis by the image recognition device 4. The data obtained by the pattern analysis is compared with numerical control data (NC data). If there is a displacement in the through-hole in the through-hole area, the displacement is corrected by moving the XY table 1. As a result, the through-hole region is positioned immediately below the insertion head 5, and the lead terminals of the electronic components supplied by the insertion head 5 are inserted into the through-holes in the through-hole region without displacement. Reference numeral 6 denotes a main control unit including a CPU. [0004] FIG. 3 is a flow chart showing the conventional operation steps of the electronic component inserting machine thus constructed. First, the operator sets whether or not image recognition processing is necessary for the operation panel 3. If there is a through-hole area that requires image recognition processing, the through-hole area is specified by the NC data (step a). Next, the start key of the operation panel 1 is operated to load the printed circuit board onto the XY table 1 (step b). [0005] The XY table 1 positions the specified through-hole area of the printed circuit board in the field of view of the video camera 2 (step c). Next, the hole recognition area is subjected to pattern analysis by the image recognition device 4. The image recognition device 4 performs an image recognition process on the through-hole area, and detects a positional shift of the through-hole in the through-hole area by comparing with the NC data (step d). The XY table 1 is driven based on this detection signal, and the through-hole in the specified through-hole area is positioned just below the insertion head 5 without displacement (step e). Then, the insertion head 5 inserts the lead terminal of the electronic component into the through-hole in the through-hole area (step f). [0006] The mounting of the electronic component in a non-specified through-hole area for which the image recognition processing is not specified is performed according to steps e and f without receiving the image recognition processing. Also, when it is subsequently found that the insertion success rate of the electronic component in the unspecified through-hole area is unexpectedly low,
The operation of the electronic component insertion machine is temporarily stopped (step g), and the perforated area can be added to the area to be subjected to image recognition processing. This additional specification is achieved by inputting the NC data of the through-hole area to the operation panel 3 (step h). [0007] The through holes in the printed circuit board of a small lot are
In many cases, since the holes are drilled, the positions occupied by the through holes often deviate from the coordinates of the CAD data, which is the design value. In addition, burrs are often provided around the periphery of the through hole. For this reason, unless the through-hole area is subjected to the image recognition processing and compared with the NC data, that is, unless the positional deviation is corrected, the insertion success rate is low. Further, when the diameter clearance of the through hole is smaller than the wire diameter clearance of the lead terminal to be inserted, more accurate positioning with respect to the printed board is required. [0008] Although this problem can be solved by using the above-mentioned electronic component insertion machine, it takes time and effort to specify a through-hole area requiring image recognition processing. In addition, since the necessity of the image recognition processing is subjectively determined by the operator, a case lacking validity is likely to occur. In addition, since it is necessary to input NC data when specifying the through-hole area, there is also a trouble that the NC data of the through-hole area where the insertion success rate is likely to be low has to be prepared in advance. In addition, during operation of the electronic component insertion machine, it is not possible to additionally specify a through-hole area for image recognition processing, and the electronic component insertion machine is temporarily stopped. Was. Further, since the operator also performs the operation of releasing the specification of the through-hole area for which the image recognition processing becomes unnecessary, if the timing of the release of the specification is mistaken or the operation is forgotten, the operation efficiency is considerably reduced. Come. Accordingly, it is an object of the present invention to automatically set the necessity of image recognition processing for an arbitrary through-hole area in mounting an electronic component by an electronic component insertion machine, and to further reduce the insertion success rate of the through-hole area. It is an object of the present invention to provide a streamlined electronic component mounting method capable of performing an image recognition process only on a component. According to the present invention, there is provided an electronic component for automatically inserting lead terminals of an electronic component into through holes of a printed circuit board using an electronic component insertion machine in order to achieve the above-mentioned object. In the mounting method, inputting each target value of the insertion success rate and the number of consecutive successful insertions in any through-hole area of the printed board to the control unit of the electronic component insertion machine,
Comparing the actual insertion success rate of the through-hole area with the target value; and performing image recognition processing on the through-hole area when the actual insertion success rate of the through-hole area is lower than the target value. Detecting the positional deviation of the through-hole in the through-hole area by comparing with the NC data, and moving the printed circuit board by an amount corresponding to the positional deviation; Comparing, and when the target value is reached, canceling the image recognition process for the through-hole area. In the present invention, the necessity of image recognition processing for each through-hole area of a printed circuit board is automatically determined and set. Becomes unnecessary. In addition, since there is no need for specific addition or stoppage of the operation of the electronic component insertion machine for that purpose, the operation efficiency can be improved. Further, since the necessity of the image recognition processing is automatically determined and set based on the initially set target value, the operation suitable for the actual situation can be performed without depending on the subjectivity of the operator. Further, since the image recognition processing is performed only for the through-hole area having a low insertion success rate, labor and time loss is small. Furthermore, since the sorting operation of canceling the image recognition processing is performed based on the number of consecutive insertion successes set in advance as a target, not only can the operating efficiency be improved, but also rational production management with a target value can be performed. . Next, an embodiment of the present invention will be described with reference to the drawings. The electronic component insertion machine used in this embodiment is not mechanically much different from the one shown in FIG. 2, and will be used in the following description. In this embodiment, a target value of the success rate of insertion and a target value of the number of consecutive successful insertions in an arbitrary through-hole area of the printed circuit board are input to the main controller 6 in advance. The target through-hole area may be large, and the image recognition processing is performed on the through-hole area only when the actual insertion success rate in each of the through-hole areas is lower than the target value. Then, the positional deviation of the through-hole in the through-hole area subjected to the image recognition processing is detected by comparison with the NC data, and the printed circuit board moves by an amount corresponding to the positional deviation. Then, when the actual number of consecutive successful insertions in each through-hole area reaches the target value, the image recognition processing for the through-hole area is canceled. For this reason, in addition to the function of collecting the insertion success rate in each through-hole area of the printed circuit board, the function of storing the collected data and the function of comparing the collected various data with the target value in the CPU or the like. Also, a function for automatically determining whether or not the image recognition processing is necessary is set, and the like. The operation will be described below with reference to a flowchart shown in FIG. Before starting the mounting operation, the target value of the success rate of the insertion of the electronic component into the printed circuit board is determined by operating the operation panel 1 so that the image recognition processing can be automatically determined and set for the through-hole area. (Step a). In addition, a target value of the number of consecutive successful insertions is input by operating the operation panel 1 so that the image recognition processing can be automatically canceled (step b). Next, the start key of the operation panel 1 is operated (step c), the printed circuit board is loaded onto the XY table 1, and the mounting operation is started (step d). Then, the process goes through step l described below and proceeds to step e. Here, it is determined whether or not the actual insertion success rate in each through-hole area of the printed circuit board being mounted is lower than the target value. Is determined by If the result of the determination is negative, the hole area is automatically set as the image recognition processing area (step f). In this case, the drive of the XY table 1 causes the through-hole of the through-hole area to move through the video camera 2.
(Step g). The image signal obtained by the imaging by the video camera 2 is subjected to pattern analysis by the image recognition device 4, and a positional deviation is detected by comparing with the NC data (step h). Then, the position displacement is corrected by the movement of the XY table 1.
For this reason, the through-hole in the through-hole area is positioned just below the insertion head 5 without displacement (step i), and the lead terminal of the electronic component is inserted into the through-hole by the insertion head 5 (step j). If the value is not below the target value in the determination in step e, the process proceeds to step j via step i without receiving image recognition processing, and the electronic component is mounted.
Next, it is determined whether or not the mounting is completed (step k). If the determination result is negative, the process returns to step l. In step l, the actual number of consecutive successful insertions is compared with its target value. That is, the number of consecutive successes in insertion is determined by comparison with the target value from the cumulative value of the results after receiving the setting as the image recognition processing area. Then, when the number of consecutive successful insertions reaches the target value, the image recognition processing of the through-hole area is released. The cumulative calculation of the insertion success rate is continued for the released through-hole area in order to determine the necessity of the subsequent image recognition processing. However, this cumulative calculation does not include the results before the cancellation of the image recognition processing, and newly starts the calculation. Then, when the number of consecutive successful insertions after that progresses below the target value,
It is automatically set again in the image recognition processing area. As described above, according to the present invention, the image recognition processing for each through-hole area of the printed circuit board is automatically set or canceled in accordance with the result of successful insertion.
The input operation by the operator and the specific operation using the NC data become unnecessary. In addition, it is not necessary to additionally specify or stop the operation of the electronic component insertion machine. Further, the necessity of the image recognition processing is determined based on the preset target value of the insertion success rate and automatically set, so that the image recognition processing can be performed in accordance with the actual situation without relying on the subjectivity of the operator. . In addition, not only the through-hole area having a low insertion success rate can be set as the image recognition processing area, but also the image recognition processing is automatically canceled based on an arbitrarily set number of consecutive successful insertions. Recognition processing is eliminated, and operation efficiency and workability can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flowchart of operation steps of an electronic component mounting method according to an embodiment of the present invention. FIG. 2 is an external perspective view of the electronic component insertion machine. FIG. 3 is a flowchart showing operation steps of a conventional electronic component mounting method. [Description of Signs] 1 XY table 2 Video camera 3 Operation panel 4 Image recognition device 5 Insertion head 6 Main control unit

Claims (1)

(57) [Claim 1] In an electronic component mounting method for automatically inserting a lead terminal of an electronic component into a through hole of a printed board using an electronic component inserting machine, an arbitrary through area of the printed board is provided. Inputting the respective target values of the insertion success rate and the number of consecutive successful insertions into the control unit of the electronic component insertion machine, comparing the actual insertion success rate of the through-hole area with the target value, When the actual insertion success rate of the region is lower than the target value, the perforated region is subjected to image recognition processing, the positional deviation of the perforated hole in the perforated region is detected by comparison with NC data, and the positional deviation is detected. A step of moving the printed circuit board by a considerable amount; a step of comparing the actual number of successful continuous insertions of the through-hole area with the target value; An electronic component mounting method, comprising: