JP3519675B2 - Substrate processing equipment - Google Patents
Substrate processing equipmentInfo
- Publication number
- JP3519675B2 JP3519675B2 JP2000235734A JP2000235734A JP3519675B2 JP 3519675 B2 JP3519675 B2 JP 3519675B2 JP 2000235734 A JP2000235734 A JP 2000235734A JP 2000235734 A JP2000235734 A JP 2000235734A JP 3519675 B2 JP3519675 B2 JP 3519675B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- treatment liquid
- processing apparatus
- liquid discharge
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims description 407
- 238000012545 processing Methods 0.000 title claims description 197
- 239000007788 liquid Substances 0.000 claims description 186
- 238000011282 treatment Methods 0.000 claims description 77
- 238000012546 transfer Methods 0.000 claims description 70
- 238000007667 floating Methods 0.000 claims description 9
- 238000000746 purification Methods 0.000 claims description 9
- 238000011084 recovery Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 5
- 230000001172 regenerating effect Effects 0.000 claims description 4
- 239000011148 porous material Substances 0.000 claims description 3
- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 description 93
- 239000010408 film Substances 0.000 description 69
- 230000032258 transport Effects 0.000 description 64
- 239000000243 solution Substances 0.000 description 25
- 238000000034 method Methods 0.000 description 11
- 238000011069 regeneration method Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000008929 regeneration Effects 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 6
- 238000012423 maintenance Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000007921 spray Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000007599 discharging Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000005339 levitation Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000002492 Rungia klossii Nutrition 0.000 description 1
- 244000117054 Rungia klossii Species 0.000 description 1
- 206010040844 Skin exfoliation Diseases 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 102220411551 c.74G>T Human genes 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、短尺または長尺の
プリント配線板等に用いる薄いシート状のプラスチック
フィルム、硝子繊維膜、金属箔又は紙等のシート状の材
料（以下、これらを単に基板ということがある）を支持
部材に接触させないで、薬品等による洗浄処理、加工処
理等の液体による処理装置あるいはこれらの処理装置を
用いて得られる処理基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sheet-like material such as a thin sheet-like plastic film, glass fiber film, metal foil or paper (hereinafter, simply referred to as a substrate for use in a short or long printed wiring board, etc.). However, the present invention relates to a processing apparatus using a liquid such as a cleaning processing or a processing processing with a chemical or the like or a processing substrate obtained by using these processing apparatuses without contacting the supporting member.
【０００２】[0002]
【従来の技術】前記基板を化学薬品または水（以下、こ
れらを処理液ということがある）により洗浄又は加工処
理する場合には、従来は図１２に示す洗浄又は加工装置
を使用していた。図１２は基板の処理液による洗浄又は
加工を行う装置の代表例であるエッチング装置であり、
以下特に断らない限り、エッチング装置について説明す
る。2. Description of the Related Art In the case of cleaning or processing the substrate with a chemical or water (hereinafter, these may be referred to as a processing solution), conventionally, a cleaning or processing apparatus shown in FIG. 12 has been used. FIG. 12 shows an etching apparatus which is a typical example of an apparatus for cleaning or processing a substrate with a processing liquid,
The etching apparatus will be described below unless otherwise specified.
【０００３】図１２（ａ）はエッチング装置の側面概略
図、図１２（ｂ）は図１２（ａ）のＡ−Ａ線矢視図を示
す。図１２に示すエッチング装置には、該装置の基板搬
入口７１と出口７２にそれぞれ配置された基板３を搬送
させる搬送ローラ７４がエッチング装置内部の基板搬送
方向に複数列配置され、さらに基板３を間に挟み込んで
搬送する一対の搬送ローラ７６と該エッチング装置内を
搬送中の基板３の上下方向から基板３に向けてエッチン
グ液を噴出するノズル７８が装置内部の基板搬送方向に
複数列配置されている。FIG. 12 (a) is a schematic side view of the etching apparatus, and FIG. 12 (b) is a view taken along the line AA of FIG. 12 (a). In the etching apparatus shown in FIG. 12, a plurality of transport rollers 74 for transporting the substrates 3 respectively arranged at a substrate loading port 71 and an exit port 72 of the device are disposed in a plurality of rows in the substrate transporting direction inside the etching device. A pair of conveying rollers 76 sandwiched between the conveying rollers and nozzles 78 for ejecting an etching solution from the vertical direction of the substrate 3 being conveyed in the etching apparatus toward the substrate 3 are arranged in a plurality of rows in the substrate conveying direction inside the apparatus. ing.
【０００４】上下一対の搬送ローラ７６は図１２（ｂ）
の平面図に示すように、基板搬送方向に直交する方向に
複数個間隔をあけて配置されており、また基板搬送方向
に隣接して配置される上下一対の搬送ローラ７６、・・
・は平面視で千鳥状に配置されており、さらに、エッチ
ング液スプレノズル７８はこれらの搬送ローラ７６の間
から基板３上にエッチング液を噴出できるように配置さ
れている。また、図示していないが基板３をエッチング
液に浸漬しながら搬送することで基板のエッチング処理
を行う場合もある。A pair of upper and lower conveying rollers 76 is shown in FIG.
As shown in the plan view of FIG. 1, a pair of upper and lower transport rollers 76 are arranged at intervals in a direction orthogonal to the substrate transport direction, and are adjacent to each other in the substrate transport direction.
Are arranged in a zigzag pattern in a plan view, and the etching liquid spray nozzles 78 are arranged so that the etching liquid can be jetted onto the substrate 3 from between the transport rollers 76. Further, although not shown, the substrate 3 may be subjected to the etching process by being transported while being immersed in the etching liquid.
【０００５】[0005]
【発明が解決しようとする課題】図１２に示す構成から
なる従来のエッチング装置では次のような問題点があっ
た。すなわち、搬送ローラ７６の表面と基板３の接触部
分の摩擦抵抗により基板３を搬送していたため、基板３
の表面に多少の傷が付くことは避けられない。また、エ
ッチング液スプレノズル７８からのエッチング液は多数
の搬送ローラ６６の間から基板３上に噴出されるため
に、搬送ローラ７６が基板３表面の一部を覆い隠し、基
板３の平面全体に、まんべんなく均一にエッチング液が
噴出されないことがある。The conventional etching apparatus having the structure shown in FIG. 12 has the following problems. That is, since the substrate 3 is transported by the frictional resistance between the surface of the transport roller 76 and the contact portion between the substrate 3 and the substrate 3,
It is inevitable that some scratches will be made on the surface of the. Further, since the etching liquid from the etching liquid spray nozzle 78 is jetted onto the substrate 3 from between the plurality of transportation rollers 66, the transportation roller 76 covers a part of the surface of the substrate 3 to cover the entire plane of the substrate 3. The etching solution may not be ejected uniformly and evenly.
【０００６】また、基板３をエッチング液に浸漬させな
がらエッチング処理する場合にも基板３が搬送ローラ７
６に接触しているために基板３の搬送ローラ７６との接
触部分にはエッチング液が当たらず、基板全体にわたり
均一にエッチングすることはできなかった。Further, when the substrate 3 is subjected to the etching treatment while being immersed in the etching liquid, the substrate 3 is also conveyed by the transport roller 7.
Since the substrate 3 was in contact with the substrate 6, the etching liquid did not hit the contact portion of the substrate 3 with the transport roller 76, and the entire substrate could not be etched uniformly.
【０００７】基板全体のエッチングの均一処理性を高め
るためには、エッチング液スプレノズル７８の設置個数
を多くする必要があるが、設置コストが高くなるだけで
なく、ノズル７８の詰まりを防ぐためのメインテナンス
作業の負担が増える。さらに、比較的薄いフィルムから
なる基板３であっても搬送ローラ７６を利用してエッチ
ング処理をするため、搬送ローラ７６の押し付け力が基
板３の表面に打痕等を発生させていた。In order to improve the uniform processability of the etching of the entire substrate, it is necessary to increase the number of the etching solution spray nozzles 78 to be installed, but not only the installation cost becomes high, but also the maintenance for preventing the nozzles 78 from being clogged. The work load increases. Further, even the substrate 3 made of a relatively thin film is etched by using the transport roller 76, and therefore the pressing force of the transport roller 76 causes a dent or the like on the surface of the substrate 3.
【０００８】また、図１３に前記搬送ローラ７６部分の
拡大斜視図を示すが、表面にはＯリング８０が取り付け
られた搬送ローラ７６がシャフト受け８１を介してシャ
フト７２に固着されている。搬送ローラ７６は、基板３
との当接面の摩擦抵抗力で基板３を搬送しているため、
シャフト受け８１とシャフト８２の僅かな隙間に前記摩
擦によりＯリング８０などから剥離した小さな固形物が
入り込むことがある。そのため搬送ローラ７６の回転が
スムーズにできなくなり、また回転しない搬送ローラ７
６が生じることもある。スムーズに回転しない搬送ロー
ラ７６又は回転しない搬送ローラ７６と基板３の間の摩
擦力が大きくなると、基板３上のレジストが不用意に剥
離することがあった。FIG. 13 shows an enlarged perspective view of the portion of the conveying roller 76. The conveying roller 76 having an O-ring 80 attached to the surface thereof is fixed to the shaft 72 via a shaft receiver 81. The transport roller 76 is the substrate 3
Since the substrate 3 is transported by the frictional resistance force of the contact surface with
A small solid substance separated from the O-ring 80 or the like due to the friction may enter into a slight gap between the shaft receiver 81 and the shaft 82. Therefore, the conveyance roller 76 cannot rotate smoothly, and the conveyance roller 7 does not rotate.
6 may occur. When the frictional force between the transport roller 76 that does not rotate smoothly or the transport roller 76 that does not rotate and the substrate 3 becomes large, the resist on the substrate 3 may be inadvertently peeled off.
【０００９】ところで、近年、各種電子機器にプリント
配線板が数多く用いられるが、電子機器の発達ととも
に、多機能化・高密度化・細線化・薄型化に対応できる
プリント配線板の製造装置を開発する要請が強くなって
いる。このようなプリント配線板に対する高性能化の要
求に対応するためには、図１２に示すエッチング装置の
前述の問題点は大きな障害になっており、導体回路の欠
損が原因となり、製品不良が増加する傾向にあり、不良
品発生によるコストが増加してきている。その導体回路
の欠損はプリント配線板製造過程での配線板表面のレジ
ストや導体回路の擦れによる前記回路の損傷等が原因で
あり、微細な配線回路の品質に大きな影響を及ぼし、プ
リント配線板製造コストの増加の大きな原因となってい
る。さらに、プリント配線板を薄型化すると、しわや打
痕が発生しやすく、また、その品質基準も厳しくなって
いるため、不良品の発生率が高く、導体回路の欠損同
様、プリント配線板製造コストの増加要因となってい
る。By the way, in recent years, many printed wiring boards have been used in various electronic equipments. With the development of electronic equipments, a printed wiring board manufacturing apparatus has been developed which can cope with multi-functionalization, high density, thinning and thinning. The request to do so is getting stronger. In order to meet the demand for higher performance of such a printed wiring board, the above-mentioned problems of the etching apparatus shown in FIG. 12 have become a major obstacle, and defective products increase due to conductor circuit loss. And the cost of defective products is increasing. The loss of the conductor circuit is caused by the damage of the circuit due to the resist on the surface of the wiring board or the rubbing of the conductor circuit in the manufacturing process of the printed wiring board, which has a great influence on the quality of the fine wiring circuit, and the printed circuit board manufacturing This is a major cause of increased costs. Furthermore, when the printed wiring board is made thinner, wrinkles and dents are more likely to occur, and the quality standards are stricter, resulting in a higher incidence of defective products, and similar to the loss of conductor circuits, the cost of manufacturing printed wiring boards is high. Has become a factor of increase.
【００１０】そこで、本発明の課題は、前記多機能化・
高密度化・細線化・薄型化に対応できるプリント配線板
等で用いられる処理基板をプラスチックフィルム、硝子
繊維膜、金属箔又は紙等のシート状の材料から製造する
ための基板処理装置、及び、該装置を用いて得られる高
性能処理基板を提供することである。Therefore, the object of the present invention is to realize the above-mentioned multi-functionality.
A substrate processing apparatus for manufacturing a processing substrate used in a printed wiring board or the like that can cope with high density, thinning, and thinning from a sheet material such as a plastic film, a glass fiber film, a metal foil or paper, and It is to provide a high-performance processed substrate obtained by using the apparatus.
【００１１】[0011]
【課題を解決するための手段】本発明の上記課題は次の
構成により解決される。すなわち、平面状に均一に処理
液を噴出させて処理液吐出膜を形成する平面状多孔質体
を複数個、前記処理液吐出膜が同一水平面上にあるよう
に並列配置して基板を前記処理液吐出膜上に浮上させ、
基板を水平状態に保ったまま搬送させる基板搬送路を形
成し、該基板搬送路とは別に独立して設けた該基板搬送
路上の基板を搬送方向に送る基板搬送手段と、基板搬送
速度調整手段を備えた基板処理装置である。The above object of the present invention is solved by the following constitution. That is, a plurality of planar porous bodies that uniformly eject a treatment liquid in a plane to form a treatment liquid ejection film are arranged in parallel so that the treatment liquid ejection films are on the same horizontal plane, and the substrate is treated as described above. Float above the liquid ejection film ,
Forming a substrate transfer path for conveying while keeping the substrate in a horizontal state, and the substrate transfer means for separately sending independently substrate on the substrate conveying <br/> passage provided in the conveying direction with the substrate transport path, Substrate transfer
It is a substrate processing apparatus provided with a speed adjusting means .
【００１２】以下、前記処理液吐出膜を表面に形成する
多孔質体を備えた基板処理装置をポーラス方式の処理装
置と呼ぶことにする。Hereinafter, a substrate processing apparatus provided with a porous body for forming the processing liquid discharge film on its surface will be referred to as a porous type processing apparatus.
【００１３】本発明のポーラス方式の基板処理装置は、
装置構成部材に接触することなく基板を浮上させること
でエッチング処理、現像処理、洗浄処理などを行う方
式、いわゆる非接触方式で処理する装置として利用でき
る。The porous substrate processing apparatus of the present invention is
It can be used as an apparatus for processing by a so-called non-contact method in which the substrate is floated without contacting the apparatus constituent members to perform etching processing, developing processing, cleaning processing, and the like.
【００１４】ここで、上記平面状に均一に処理液を噴出
させて処理液吐出膜を形成する平面状多孔質体は、前記
処理液吐出膜を上方に向けて形成して、該処理液吐出膜
上に基板を浮上支持させる基板搬送路を形成する平面状
多孔質体から構成されるか、又は前記処理液吐出膜を互
いに向き合うように上下に配置して、前記一対の多孔質
体の処理液吐出膜の間に基板を浮上支持させる基板搬送
路を形成する一対の平面状多孔質体から構成される。Here, the planar porous body for ejecting the treatment liquid evenly on the plane to form the treatment liquid discharge film is formed by directing the treatment liquid discharge film upward and discharging the treatment liquid. Treatment of the pair of porous bodies, which is composed of a planar porous body forming a substrate transport path for floatingly supporting the substrate on the film, or the treatment liquid ejection films are arranged vertically so as to face each other. It is composed of a pair of planar porous bodies that form a substrate transport path for floatingly supporting the substrate between the liquid ejection films.
【００１５】ポーラス方式の基板処理装置の下向きに処
理液の吐出膜を形成する多孔質体の毛細管の孔径は上向
きの処理液の吐出膜を形成する多孔質体の毛細管の孔径
より小さいものを使用することが望ましい。前記下向き
に処理液の吐出膜の膜厚が約２〜３ｍｍであれば、十分
下向きに吐出膜が形成できる。The pore size of the capillary of the porous body that forms the discharge film of the processing liquid downward in the porous substrate processing apparatus is smaller than the size of the pore of the capillary of the porous body that forms the discharge film of the upward processing liquid. It is desirable to do. If the thickness of the discharge film of the processing liquid is 2 to 3 mm downward, the discharge film can be formed sufficiently downward.
【００１６】また、基板の下面に上向きの処理液吐出膜
を当てて基板の下面側表面を処理するポーラス方式の基
板処理装置を用いる場合は、次の二つの場合である。
基板の片面のみをエッチング等の処理をする場合
この場合には、前記ポーラス方式の基板処理装置を基板
の下面側に配置し、基板の下面に処理液吐出膜を当てて
処理を行い、基板を挟んでポーラス方式の基板処理装置
の対称位置に基板の端部を後押しするベルトコンベア等
の基板搬送手段を配置して基板を搬送する構成にしても
良い。
基板の両側面を片面ずつ加工処理する場合
この場合には、下方から処理液を基板面に吹き付けるた
め、基板への処理液の吹き溜まりがなく、エッチング等
の処理精度が良い。しかし、片面ずつ加工処理するた
め、搬送途中で基板を反転する構成を設置する必要があ
る。There are the following two cases when a porous substrate processing apparatus that processes the lower surface of the substrate by applying an upward processing liquid discharge film to the lower surface of the substrate is used. When performing processing such as etching on only one side of the substrate In this case, the porous substrate processing apparatus is arranged on the lower surface side of the substrate, and the processing liquid ejection film is applied to the lower surface of the substrate to perform processing. The substrate may be transported by disposing substrate transporting means such as a belt conveyor that pushes the end of the substrate at a symmetrical position of the porous substrate processing apparatus sandwiching the substrate. In the case where both side surfaces of the substrate are processed one by one, in this case, since the processing liquid is sprayed onto the substrate surface from below, there is no accumulation of the processing liquid on the substrate and the processing accuracy such as etching is good. However, since the processing is performed on each side, it is necessary to install a structure that reverses the substrate during transportation.
【００１７】上記ポーラス方式の処理装置では、多孔質
体を複数個、前記処理液吐出膜が同一水平面上にあるよ
うに並列配置して得られる基板を前記処理液吐出膜上に
浮上させる基板搬送路のみでは基板は搬送路を前進でき
ないので基板搬送手段を別途設ける必要がある。In the above-mentioned porous processing apparatus, a substrate is conveyed in which a substrate obtained by arranging a plurality of porous bodies in parallel so that the treatment liquid discharge films are on the same horizontal plane is floated above the treatment liquid discharge film. Since the substrate cannot advance along the transfer path only by the path, it is necessary to separately provide a substrate transfer means.
【００１８】そのために本発明では、次のような基板搬
送手段を設ける。
（１）基板搬送路を形成する複数の並列配置される平面
状多孔質体の各平面状多孔質体の前流側と後流側のうち
の少なくとも後流側に配置した円筒状に均一に処理液を
噴出させて処理液吐出膜を形成する円筒状多孔質体から
なる基板搬送用ローラ又は処理液吐出膜を形成しないで
基板に直接接触する基板搬送用搬送ローラからなる基板
搬送手段
（２）基板側端面を挟むか、又は基板後端面を押し込む
基板押圧部材と該基板押圧部材を支持するエンドレスベ
ルトとからなる基板搬送手段
（３）長尺帯状の基板を平面状多孔質体の処理液吐出膜
上を搬送させる基板巻き出部と基板巻き取り部を備えた
搬送装置からなる基板搬送手段なお、上記基板搬送手段
は例示に過ぎず、これらの他の基板搬送手段を用いるこ
ともできる。Therefore, in the present invention, the following substrate transfer means is provided. (1) A uniform cylindrical shape disposed on at least the downstream side of the upstream side and the downstream side of each planar porous body of the plurality of planar porous bodies arranged in parallel to form the substrate transport path. Substrate transporting means (2) comprising a substrate transporting roller made of a cylindrical porous body for ejecting a processing liquid to form a processing liquid discharging film or a substrate transporting roller directly contacting the substrate without forming the processing liquid discharging film (2 ) Substrate transporting means comprising a substrate pressing member that sandwiches the substrate side end face or presses the substrate rear end face and an endless belt that supports the substrate pressing member (3) Treatment liquid for treating a long strip-shaped substrate as a planar porous body Substrate transporting means including a transporting device having a substrate unwinding portion and a substrate winding portion for transporting on the discharge film. The above substrate transporting means is merely an example, and other substrate transporting means may be used.
【００１９】また、前記基板搬送手段には基板搬送速度
調整手段を備えておき、基板の処理目的、処理の程度、
処理液の種類などに応じて適宜基板搬送速度の調整をす
ることができる。Further, the substrate transfer means is provided with a substrate transfer speed adjusting means, and the processing purpose of the substrate, the degree of the processing,
The substrate transfer speed can be appropriately adjusted according to the type of the processing liquid.
【００２０】また、本発明のポーラス方式の処理装置に
おいて、処理液吐出膜を形成する平面状多孔質体は、処
理液吐出膜を形成する処理液吐出部と処理液吐出膜形成
後の処理液を回収する処理液回収部を別々に設けて一体
化させた多孔質体ユニットを一組以上並列配置した構成
にしても良い。Further, in the porous type processing apparatus of the present invention, the planar porous body forming the processing liquid discharge film includes the processing liquid discharge part for forming the processing liquid discharge film and the processing liquid after the processing liquid discharge film is formed. Alternatively, one or more sets of porous body units may be arranged in parallel so that treatment liquid recovery units for recovering the above are separately provided and integrated.
【００２１】このように処理液吐出膜を形成する平面状
多孔質体をユニット化することで定期的に行う掃除等の
メンテナンス作業を簡素化することができ、前記ユニッ
トの組み付け、取り外しが簡単となり、予め多孔質体ユ
ニットを準備しておき、これと使用済みの多孔質体ユニ
ットと交換することで、メンテナンス作業が容易に行
え、かつメンテナンス時の基板処理装置の運転停止時間
を短縮化することができる。By thus unitizing the planar porous body forming the treatment liquid discharge film, it is possible to simplify the maintenance work such as cleaning which is regularly performed, and the unit is easily assembled and removed. By preparing a porous body unit in advance and exchanging it with a used porous body unit, maintenance work can be easily performed and the operation stop time of the substrate processing apparatus at the time of maintenance can be shortened. You can
【００２２】前記一体化させた多孔質体ユニットを用い
て、該多孔質体ユニットの処理液回収部から排出する処
理液を浄化して再生する浄化再生装置と該浄化再生装置
で得られた処理液を多孔質体ユニットの処理液吐出部に
供給する処理液循環経路を設けると、処理液が繰り返
し、使用可能になり、基板処理装置とその周りの周辺機
器を含む全体のシステムをコンパクト化でき、また周囲
の環境悪化を防ぐことができる。A purification regenerator for purifying and regenerating the treatment liquid discharged from the treatment liquid recovery unit of the porous body unit by using the integrated porous body unit, and a treatment obtained by the purification regenerator. By providing a processing liquid circulation path that supplies the liquid to the processing liquid discharge part of the porous body unit, the processing liquid can be used repeatedly and can be made compact as a whole system including the substrate processing equipment and the peripheral equipment around it. Also, it is possible to prevent deterioration of the surrounding environment.
【００２３】また、本発明の上記処理液循環経路を設け
たシステムにおいては、処理液を浄化して再生する浄化
再生装置には二段以上の処理液フィルターを設置し、該
フィルター効率と精度を向上させ、一段目フィルターで
は比較的大きな固形不純物を、二段目フィルターで多孔
質体の詰まりに影響する小さな固形不純物をのぞき、ポ
ーラス方式の多孔質体の目詰まりを防ぐことができる。
また、処理液によっては、上記浄化再生装置には液再生
用の化学的処理を行う機能を設けても良い。Further, in the system provided with the above-mentioned treatment liquid circulation path of the present invention, a purification regenerator for purifying and regenerating the treatment liquid is provided with two or more stages of treatment liquid filters to improve the filter efficiency and accuracy. The first-stage filter can remove relatively large solid impurities, and the second-stage filter can remove small solid impurities that affect the clogging of the porous body, thereby preventing clogging of the porous porous body.
Further, depending on the treatment liquid, the purification / regeneration device may be provided with a function of performing a chemical treatment for liquid regeneration.
【００２４】また、ポーラス方式の基板処理装置に隣接
して、少なくとも、その後流側に上下一対の搬送ローラ
を設けて、この搬送ローラでポーラス方式の基板処理装
置出口の基板を挟み込んで次工程に向けて搬送すること
もできる。ポーラス方式の基板処理装置出口部の基板は
すでに処理液で処理が済んだ基板であるので、前記基板
を挟み込むための一対の搬送ローラに基板が接触しても
良い。Further, adjacent to the porous substrate processing apparatus, at least a pair of upper and lower transport rollers are provided on the downstream side of the substrate processing apparatus, and the substrate at the exit of the porous substrate processing apparatus is sandwiched by the transport rollers for the next step. It can also be transported toward. Since the substrate at the exit of the porous substrate processing apparatus is a substrate that has already been treated with the treatment liquid, the substrate may come into contact with a pair of transport rollers for sandwiching the substrate.
【００２５】また、本発明の基板処理装置として次のよ
うな構成の基板処理装置を用いても良い。すなわち、両
端部に基板入口と基板出口を備え、天井壁面及び底壁面
を含む壁面により構成される基板搬送路と、該基板搬送
路を構成する天井壁面及び底壁面に基板搬送方向に向け
て傾斜角度をもって処理液を噴出する複数のスリットを
設けた基板処理装置と、該基板処理装置の基板搬送路に
隣接させて、少なくとも前記搬送路出口側に、前記搬送
路出口から搬出される基板を浮上支持するために、平面
状に均一に処理液を噴出させて処理液吐出膜を形成する
１以上の平面状多孔質体を、前記処理液吐出膜が同一水
平面上にあるように並列配置して基板を前記処理液吐出
膜上に浮上させ、基板を水平状態に保ったまま搬送させ
る基板搬送路を形成し、該基板搬送路とは別に独立して
設けた該基板搬送路上の基板を搬送方向に送る基板搬送
手段を備えた多孔質体の処理液吐出装置を配置した基板
処理装置である。A substrate processing apparatus having the following structure may be used as the substrate processing apparatus of the present invention. That is, a board transfer path having a board entrance and a board exit at both ends and formed of wall surfaces including a ceiling wall surface and a bottom wall surface, and a ceiling wall surface and a bottom wall surface forming the board transfer path are inclined toward the board transfer direction. A substrate processing apparatus provided with a plurality of slits for ejecting a processing liquid at an angle, and a substrate transfer path of the substrate processing apparatus.
Adjacent to each other, at least on the side of the exit of the transport path, a plane for supporting the substrate carried out from the exit of the transport path by levitation
The treatment liquid to form a treatment liquid discharge film
One or more planar porous bodies are treated with the same water as the treatment liquid discharge film.
The substrates are arranged in parallel so as to be on a plane, and the substrates are discharged with the processing liquid.
Float above the film and transport the substrate while keeping it horizontal.
The substrate conveyance path formed that, apart independently of the said substrate transport path
Substrate transport that transports the substrate on the provided substrate transport path in the transport direction
It is a substrate processing apparatus in which a porous processing liquid ejecting apparatus having means is arranged.
【００２６】前記ポーラス方式の基板処理装置の一種で
ある処理液吐出装置の多孔質体は、処理液吐出膜を上方
に向けて形成する平面状多孔質体からなり、前記処理液
吐出膜上に基板を浮上支持させる基板搬送路を形成する
か、又は処理液吐出膜を互いに向き合うように上下に配
置した一対の平面状多孔質体からなり、前記一対の多孔
質体からの処理液吐出膜の間に基板を浮上支持させる基
板搬送路を形成する。The porous body of the processing liquid ejecting apparatus, which is a kind of the porous substrate processing apparatus, is made of a planar porous body formed with the processing liquid ejecting film facing upward, and is formed on the processing liquid ejecting film. A substrate transport path for supporting the substrate in a floating manner is formed, or the treatment liquid ejection film is composed of a pair of planar porous bodies arranged vertically so as to face each other, and the treatment liquid ejection film from the pair of porous bodies is formed. A substrate transfer path for floating and supporting the substrate is formed therebetween.
【００２７】本発明の上記ポーラス方式の基板処理装置
は前述のように基板の浮上力があるが基板の表面に平行
な方向への搬送力はない。そのためポーラス方式の多孔
質体の処理液吐出装置をスリット方式の基板処理装置の
基板出口部に配置すると、スリット方式の基板処理装置
から搬送されてくる基板を減速させることができ、さら
に、減速された状態で基板がエッチング等の処理がなさ
れるのでスリット方式の基板処理装置に比較して、より
精密なエッチングが可能となる。The above-described porous substrate processing apparatus of the present invention has the floating force of the substrate as described above, but does not have the conveying force in the direction parallel to the surface of the substrate. Therefore, if the porous system processing liquid ejecting device is arranged at the substrate outlet of the slit type substrate processing device, the substrate conveyed from the slit type substrate processing device can be decelerated and further decelerated. Since the substrate is subjected to processing such as etching in this state, more precise etching can be performed as compared with the slit type substrate processing apparatus.
【００２８】また、前記スリット方式の基板処理装置で
は、基板のエッチング処理等に用いられる基板搬送路に
設けられたスリットからエッチング液等の処理液が基板
搬送路の入口側から出口側に向けて噴出するように基板
搬送路平面に対してスリットが傾斜して設けられている
ので、処理液は前記搬送路内を基板入口側から基板出口
側に向けて流れる。前記基板搬送路の基板入口側から基
板を適宜の手段で導入すると、基板は上下からの処理液
の噴出流により搬送路内のほぼ中央部を基板出口に向け
て搬送される。このとき、基板搬送路内を搬送される基
板は搬送路を構成する上下壁面には接触することなく搬
送され、しかも、その搬送中に処理液で目的とする処理
が行われる。Further, in the above-mentioned slit type substrate processing apparatus, a processing liquid such as an etching liquid is directed from the inlet side to the outlet side of the substrate transfer path through the slit provided in the substrate transfer path used for the substrate etching processing and the like. Since the slits are provided to be inclined with respect to the plane of the substrate transport path so as to jet, the processing liquid flows in the transport path from the substrate inlet side toward the substrate outlet side. When the substrate is introduced from the substrate inlet side of the substrate transfer path by an appropriate means, the substrate is transferred by the jet flow of the processing liquid from the upper and lower sides so that the substantially central portion in the transfer path faces the substrate outlet. At this time, the substrate transported in the substrate transport path is transported without contacting the upper and lower wall surfaces forming the transport path, and the target processing is performed with the processing liquid during the transportation.
【００２９】本発明のスリット方式の基板処理装置で基
板を処理液上に浮上させるためのスリットの設置個数、
各スリット間の間隔（ピッチ）、スリットからの液噴出
速度、噴出液の液圧力、搬送路壁面に対するスリット傾
斜角度、スリット流路の長さ等のスリット設定条件を目
的の基板処理態様に応じて適切なものにする必要があ
る。In the slit type substrate processing apparatus of the present invention, the number of slits for floating the substrate above the processing liquid,
Depending on the target substrate processing mode, slit setting conditions such as the interval (pitch) between the slits, the liquid ejection speed from the slits, the liquid pressure of the ejected liquid, the inclination angle of the slit with respect to the wall surface of the transfer path, the length of the slit flow path, etc. It needs to be appropriate.
【００３０】このように、本発明の基板処理装置では図
１２に示す従来技術のように、基板が搬送ローラなどと
の摩擦力で搬送されるのではなく、処理液の流れの中
で、処理液により搬送されるため、基板が薄いフィルム
状のものであっも、その表面にしわや打痕等が発生すこ
とがない。また、特にプリント配線板の導体回路パター
ン等の微細パターンは装置部材に接触することがないの
で損傷を受けることがない。さらに、基板表面の処理液
による処理がまんべんなく行えるので、基板表面を全体
に均一に処理できる。As described above, in the substrate processing apparatus of the present invention, unlike the prior art shown in FIG. 12, the substrate is not transferred by the frictional force with the transfer rollers, but is processed in the flow of the processing liquid. Since the substrate is transported by liquid, wrinkles and dents do not occur on the surface of the substrate even if it is a thin film. In addition, since the fine pattern such as the conductor circuit pattern of the printed wiring board does not come into contact with the device member, it is not damaged. Furthermore, since the substrate surface can be uniformly treated with the treatment liquid, the entire substrate surface can be uniformly treated.
【００３１】さらに、本発明には前記ポーラス方式の基
板処理装置だけでなく、前記ポーラス方式の基板処理装
置とスリット方式の基板処理装置を組合わせた基板処理
装置を用いても良く、またこれらの基板処理装置で得ら
れた処理基板も含まれる。Further, according to the present invention , not only the porous substrate processing apparatus but also the porous substrate processing apparatus is used.
It may be used a substrate processing apparatus that combines the substrate processing equipment of the location and the slit method, also treated substrate obtained in these substrate processing apparatus are included.
【００３２】なお、本発明の処理液に浮上させた状態
で、基板を精密加工処理を行うポーラス方式の基板処理
装置の前後の基板搬送工程では、従来技術の搬送ローラ
方式の搬送装置を用いることができる。It should be noted that in the substrate transfer process before and after the porous substrate processing apparatus for performing precision processing of the substrate while being floated on the processing liquid of the present invention, the conventional transfer roller type transfer apparatus is used. You can
【００３３】[0033]
【発明の実施の形態】本発明の実施の形態を図面と共に
説明する。本実施の形態では、処理液として主としてエ
ッチング液を用いるエッチング装置について説明する。
図１に示す実施の形態のエッチング装置の模式的な概略
側断面図、図２に図１のＡ−Ａ線矢視図、図３は図１の
円Ｓ内の拡大図、図４は図１のＢ−Ｂ線矢視図である。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to the drawings. In the present embodiment, an etching apparatus that mainly uses an etching liquid as a processing liquid will be described.
1 is a schematic schematic side sectional view of the etching apparatus of the embodiment shown in FIG. 1, FIG. 2 is a view taken along the line AA of FIG. 1, FIG. 3 is an enlarged view within a circle S of FIG. 1, and FIG. It is a BB line arrow view of 1 of FIG.
【００３４】図１に示す中央部のエッチング装置は、中
央部を貫通して基板搬送路１を形成したタンク２からな
るスリット方式の基板処理装置である。前記基板搬送路
１は、タンク２の対向する二つの側壁面にそれぞれ入口
１ａと出口１ｂを有し、前記入口１ａ側から出口１ｂ側
に向けて処理液（エッチング液）を噴出させて基板３を
浮上搬送させる複数のスリット５、６を壁面に備えてい
る。The central etching apparatus shown in FIG. 1 is a slit type substrate processing apparatus comprising a tank 2 having a substrate transfer path 1 formed therethrough. The substrate transfer path 1 has an inlet 1a and an outlet 1b on two opposing side wall surfaces of the tank 2, respectively, and jets a processing liquid (etching liquid) from the inlet 1a side toward the outlet 1b side to form the substrate 3 The wall surface is provided with a plurality of slits 5 and 6 for levitation transfer.
【００３５】本実施の形態では、基板３は、例えば合成
樹脂製の材料の両面に金属箔とレジスト膜をそれぞれ積
層したプリント配線用の基板（例えば２５０×６１０ｍ
ｍ、厚み０．１〜２．０ｍｍ）であり、図１のエッチン
グ装置は、この基板３の両面のレジスト膜を塩化第二銅
水溶液等のエッチング液で処理する場合に用いられる装
置である。In this embodiment, the substrate 3 is a substrate for printed wiring (for example, 250 × 610 m) in which a metal foil and a resist film are laminated on both sides of a synthetic resin material, for example.
m, thickness 0.1 to 2.0 mm), and the etching apparatus of FIG. 1 is an apparatus used when treating the resist films on both surfaces of the substrate 3 with an etching solution such as an aqueous solution of cupric chloride.
【００３６】タンク２内は基板搬送路１により上下二つ
の室に分けられ、それぞれの室内にはエッチング液が充
満するようにそれぞれエッチング液供給配管８、９が接
続されている。各エッチング液供給配管８、９には流量
調節弁１０、１１と加圧状態でエッチング液を各タンク
２ａ、２ｂ内に供給するための液供給ポンプ１２、１
３、圧力計１４、１５及び流量計１６、１７がそれぞれ
設けられている。The inside of the tank 2 is divided into an upper chamber and a lower chamber by the substrate transfer path 1, and etching liquid supply pipes 8 and 9 are connected to the respective chambers so that the chambers are filled with the etching liquid. The etching solution supply pipes 8 and 9 are provided with flow rate control valves 10 and 11 and solution supply pumps 12 and 1 for supplying the etching solution into the tanks 2a and 2b in a pressurized state.
3, pressure gauges 14 and 15 and flow meters 16 and 17 are provided, respectively.
【００３７】前記各エッチング液供給配管８、９を構成
し、かつ上室２ａの底壁面１８及び下室２ｂの天井壁面
１９には適宜のピッチで設けられた複数のスリット５、
６がそれぞれ形成されている。前記スリット５、６は、
基板３の搬送方向に直交する方向に、その長手方向を有
し、かつエッチング液が基板搬送路１の入口１ａ側から
出口１ｂ側に向けて噴出するように傾斜して設けられて
いる。従って前記基板搬送路１内に噴出されたエッチン
グ液は基板搬送路１内を入口１ａ側から出口１ｂ側に向
けて流れる。A plurality of slits 5, which constitute the etching liquid supply pipes 8 and 9 and are provided at an appropriate pitch on the bottom wall surface 18 of the upper chamber 2a and the ceiling wall surface 19 of the lower chamber 2b,
6 are formed respectively. The slits 5 and 6 are
The substrate 3 has a longitudinal direction in a direction orthogonal to the transport direction of the substrate 3 and is provided so as to be inclined so that the etching solution is jetted from the inlet 1a side to the outlet 1b side of the substrate transport path 1. Therefore, the etching liquid ejected into the substrate transfer path 1 flows in the substrate transfer path 1 from the inlet 1a side toward the outlet 1b side.
【００３８】基板搬送路１内を流れるエッチング液に向
けて基板３を適宜の手段で、その入口１ａ側から導入す
ると、基板３は基板搬送路１の上下方向からのエッチン
グ液の噴出流により、基板搬送路１内の中央部を搬送さ
れることになる。このとき基板搬送路１内の中央部を搬
送される基板３は該搬送路１を構成する上下壁面には接
触することなく搬送され、しかも、その搬送中にエッチ
ング液でエッチングが行われる。When the substrate 3 is introduced from the inlet 1a side of the substrate 3 toward the etching liquid flowing in the substrate transport path 1 by an appropriate means, the substrate 3 is jetted from the vertical direction of the substrate transport path 1 by It will be transported in the central portion of the substrate transport path 1. At this time, the substrate 3 transported through the central portion of the substrate transport path 1 is transported without contacting the upper and lower wall surfaces of the transport path 1, and etching is performed with the etching solution during the transportation.
【００３９】図１に示すスリット方式の基板処理装置で
は、エッチング液による基板３に対する浮上力と搬送推
力はスリット５、６までのエッチング液の水深（上室２
ａ、下室２ｂ内のエッチング液の液圧、スリット５、６
の設置個数、各壁面１８、１９での複数のスリット５、
６のピッチ、スリット５、６からの液噴出速度、噴出液
の液圧力、搬送路１の壁面に対するスリット傾斜角度、
スリット水路の長さ、エッチング液供給ポンプ１２、１
３の吐出圧等を基板３の重量、形状などに応じて適切に
設定することが必要である。また、エッチング液の種類
・密度、エッチング処理の程度に対するレジスト材質、
レジスト膜厚などの関係も考慮する必要がある。なお、
図４に示すように基板搬送路１の水平方向両端壁面部に
は基板搬送路１の中心部を基板３が流れるように誘導す
る基板ガイド２０を設ける。In the slit type substrate processing apparatus shown in FIG. 1, the levitation force and the transfer thrust of the etching liquid with respect to the substrate 3 are the depth of the etching liquid up to the slits 5 and 6 (the upper chamber 2).
a, hydraulic pressure of the etching liquid in the lower chamber 2b, slits 5 and 6
Number of installations, a plurality of slits 5 on each wall 18, 19,
6 pitch, liquid ejection speed from the slits 5, 6, liquid pressure of the ejected liquid, slit inclination angle with respect to the wall surface of the transport path 1,
Length of slit channel, etching solution supply pumps 12, 1
It is necessary to properly set the discharge pressure and the like of 3 according to the weight and shape of the substrate 3. Also, the type and density of the etching solution, the resist material for the degree of etching treatment,
It is also necessary to consider the relationship such as the resist film thickness. In addition,
As shown in FIG. 4, substrate guides 20 for guiding the substrate 3 to flow through the central portion of the substrate transport path 1 are provided on both wall surfaces of the substrate transport path 1 in the horizontal direction.
【００４０】また、図１に示すようにスリット方式の基
板処理装置の基板搬送路１の出口１ｂを出た基板３の搬
送速度を減速させるため及び精密エッチングのために、
市販品である静圧軸受等に使用される吐出液膜を形成す
る多孔質体２１（この多孔質体の材料は耐薬品性のある
セラミック等が用いられている）を用いることが望まし
い。Further, as shown in FIG. 1, in order to reduce the transport speed of the substrate 3 exiting the exit 1b of the substrate transport path 1 of the slit type substrate processing apparatus and for precision etching,
It is desirable to use a porous body 21 (a chemical-resistant ceramic or the like is used as the material of this porous body) that forms a discharge liquid film used in a commercially available hydrostatic bearing or the like.
【００４１】この多孔質体２１は多孔質体２１の底面部
から加圧したエッチング液を圧入させて多孔質体２１内
部を通し、その底面部に対向する表面部に吐出エッチン
グ液を吐出させ、吐出エッチング液のほぼ均一厚さの膜
２２を多孔質体表面部に形成させるものである。このポ
ーラス方式の基板処理装置は前記吐出エッチング液膜上
に基板３を持ち上げながら、エッチング処理を行う多孔
質体２１を基板処理装置の主要構成部材として用いる。In this porous body 21, a pressurized etching liquid is pressed from the bottom surface of the porous body 21 to pass through the inside of the porous body 21, and the discharged etching liquid is discharged to the surface portion facing the bottom surface. The film 22 of the discharge etching liquid having a substantially uniform thickness is formed on the surface of the porous body. This porous substrate processing apparatus uses the porous body 21 that performs etching while lifting the substrate 3 on the discharged etching liquid film, as a main component of the substrate processing apparatus.
【００４２】このポーラス方式の基板処理装置も前記ス
リット方式の基板処理装置と同様に装置構成部材に接触
することなく基板を浮上させることでエッチング処理で
きるので、いわゆる非接触方式の基板処理装置として利
用できる。This porous type substrate processing apparatus can also be used as a so-called non-contact type substrate processing apparatus because it can perform etching processing by floating the substrate without contacting the constituent members of the apparatus like the slit type substrate processing apparatus. it can.
【００４３】ポーラス方式の基板処理装置は基板３の両
側から平面状のエッチング液の吐出膜２２を形成する多
孔質体２１を臨ませるが、この方式の基板処理装置は多
孔質体２１の表面に対して直交する方向にエッチング液
が吐出するので、基板３の浮上力があるが基板３の表面
に平行な方向への搬送力はない。そのためスリット方式
の基板処理装置から搬送されてくる基板３をポーラス方
式の基板処理装置上方で減速させることができる。ま
た、減速された状態で基板３がエッチング等の処理がな
されるので、スリット方式の基板処理装置に比較して、
より精密なエッチングが可能となる。In the porous substrate processing apparatus, the porous body 21 forming the planar discharge film 22 of the etching solution is exposed from both sides of the substrate 3. In this system substrate processing apparatus, the surface of the porous body 21 is covered. Since the etching liquid is discharged in the direction perpendicular to the surface of the substrate 3, there is a floating force of the substrate 3 but no conveying force in the direction parallel to the surface of the substrate 3. Therefore, the substrate 3 conveyed from the slit type substrate processing apparatus can be decelerated above the porous type substrate processing apparatus. Further, since the substrate 3 is subjected to processing such as etching in a decelerated state, compared to a slit type substrate processing apparatus,
More precise etching becomes possible.
【００４４】スリット方式の基板処理装置を基板搬送路
１の出口１ｂを出た基板３はポーラス方式の基板処理装
置の入口部に設けられた一対の円筒状ポーラス方式搬送
ローラ５５の間を通る。この円筒状ポーラス方式搬送ロ
ーラ５５は軸芯部からローラ円筒部外周にエッチング液
吐出膜を形成する多孔質体のローラである。この一対の
円筒状ポーラス方式搬送ローラ５５をポーラス方式の基
板処理装置の入口部に配置し、その後方に平面状の吐出
エッチング液膜２２を形成する多孔質体２１を基板搬送
路を挟んで一対設ける。In the slit type substrate processing apparatus, the substrate 3 exiting the exit 1b of the substrate transfer path 1 passes between a pair of cylindrical porous type transfer rollers 55 provided at the inlet of the porous type substrate processing apparatus. The cylindrical porous transport roller 55 is a porous roller that forms an etching solution discharge film from the shaft core portion to the outer circumference of the roller cylindrical portion. The pair of cylindrical porous transport rollers 55 are arranged at the inlet of a porous substrate processing apparatus, and a pair of porous bodies 21 forming a planar discharge etching liquid film 22 behind them are sandwiched by a pair of porous transport rollers 55. Set up.
【００４５】一対の円筒状ポーラス方式搬送ローラ５５
はスリット方式の基板搬送装置１から排出したエッチン
グ液が後方に流れ込むのを防ぐ機能を有する。円筒状ポ
ーラス方式搬送ローラ５５からは基板３の両面にエッチ
ング液が吐出するが、その吐出膜は基板３と線接触をす
るだけなのでエッチング能力はほとんどない。しかし、
その後方にある平面状の吐出エッチング液膜２２を形成
する多孔質体２１は基板に向けて平面状にエッチング吐
出膜を形成し、且つ基板を搬送路の基板搬送方向へ送る
搬送力がないので、基板をゆっくり搬送する。これらの
ことが原因で、スリット方式の基板処理装置と比較する
と、一対の多孔質体２１は基板３の両面の精密エッチン
グを行うことができる。A pair of cylindrical porous transport rollers 55
Has a function of preventing the etching liquid discharged from the slit type substrate transfer device 1 from flowing backward. Although the etching liquid is discharged from the cylindrical porous type transport roller 55 to both surfaces of the substrate 3, the discharge film has only line contact with the substrate 3 and has almost no etching ability. But,
The porous body 21 forming the planar discharge etching liquid film 22 on the rear side forms a flat etching discharge film toward the substrate and has no carrying force for sending the substrate in the substrate carrying direction of the carrying path. , Transfer the substrate slowly. Due to these reasons, the pair of porous bodies 21 can perform precision etching on both surfaces of the substrate 3 as compared with the slit type substrate processing apparatus.
【００４６】一対の多孔質体２１の後方には基板を基板
搬送方向へ搬送させるために搬送ローラ２５と３組の一
対の搬送ローラ５６が配置されている。一対の搬送ロー
ラ５６の上側のローラが駆動ローラ５６ａであり、エッ
チング処理された基板３を搬送方向へ搬送させるための
ものであり、下側のローラはフリーローラ５６ｂであ
る。駆動ローラ５６ａは矢印ａに示すように上下移動調
整が可能な構成になっており、基板３の長さに応じて、
３組の一対の搬送ローラ５６の中で上側の基板搬送に不
要な駆動ローラ５６ａを上方に逃がす。これらの搬送ロ
ーラ５６は一対のブラケット５７により回転軸が支持さ
れている。Behind the pair of porous bodies 21, there are arranged a transport roller 25 and a pair of three transport rollers 56 for transporting the substrate in the substrate transport direction. The upper roller of the pair of transport rollers 56 is a drive roller 56a for transporting the etched substrate 3 in the transport direction, and the lower roller is a free roller 56b. The drive roller 56a is configured to be adjustable in vertical movement as shown by arrow a, and depending on the length of the substrate 3,
The drive roller 56a, which is unnecessary for the upper substrate transfer, of the pair of three transfer rollers 56 is released upward. The rotation shafts of these transport rollers 56 are supported by a pair of brackets 57.
【００４７】また、スリット方式の基板搬送装置のタン
ク２は基板３の搬送速度を減速させるために、一対の傾
斜角度調整用支点５８を中心に基板搬送路傾斜角度調整
用ジャッキ５９により図１の矢印Ｕ方向に上下動可能に
なっている。前記搬送ローラ支持用ブラケット５７はス
リット方式の基板搬送装置のタンク２の壁面２ｃに固着
しているので前記タンク２が傾斜すると、これと一体的
に動く。Further, the tank 2 of the slit type substrate transfer device is provided with a substrate transfer path tilt angle adjusting jack 59 as shown in FIG. 1 around a pair of tilt angle adjusting fulcrums 58 in order to reduce the transfer speed of the substrate 3. It can move up and down in the direction of arrow U. Since the carrier roller supporting bracket 57 is fixed to the wall surface 2c of the tank 2 of the slit type substrate carrier, when the tank 2 is tilted, it moves integrally with it.
【００４８】基板３の下面に上向きのエッチング液吐出
膜２２を当てて基板３の下面側表面を処理するポーラス
方式の基板処理装置を用いる場合は、
基板３の片面のみをエッチングの処理する場合と
基板３の両側面を片面ずつエッチング処理する場合で
ある。When a porous type substrate processing apparatus for processing the lower surface of the substrate 3 by applying the upward etching liquid ejection film 22 to the lower surface of the substrate 3 is used, only when one side of the substrate 3 is processed for etching. This is a case where both side surfaces of the substrate 3 are etched one by one.
【００４９】前記及び前記の場合には下方からエッ
チング液を基板面に吹き付けため、基板へのエッチング
液の吹き溜まりがなく、エッチング処理精度がスリット
方式の基板処理装置に比べて高くなる。しかし、前記
の場合には片面ずつ加工処理するため、図示していない
が、搬送途中で基板を反転する構成を設置する必要があ
る。In the above cases and the above cases, since the etching liquid is sprayed onto the substrate surface from below, there is no accumulation of the etching liquid on the substrate, and the etching processing accuracy is higher than that of the slit type substrate processing apparatus. However, in the above case, since the processing is performed one by one, it is necessary to install a structure (not shown) for reversing the substrate during transportation.
【００５０】例えば、図５（概略側断面図（図５
（ａ））と図５（ａ）のＡ−Ａ線矢視図（図５
（ｂ）））に示すように、前記ポーラス方式の基板処理
装置を基板３の下面側に配置し、基板３の下面にエッチ
ング液吐出膜を当ててエッチングを行う。For example, FIG. 5 (schematic side sectional view (FIG.
(A)) and the AA line arrow view of FIG.
As shown in (b)), the porous substrate processing apparatus is arranged on the lower surface side of the substrate 3, and an etching solution discharge film is applied to the lower surface of the substrate 3 to perform etching.
【００５１】このとき、ポーラス方式の基板処理装置に
は基板３の搬送能力がないので、基板３を挟んでポーラ
ス方式の基板処理装置の対称位置に基板の後端部を後押
しする部材２３を有するベルトコンベア等の搬送装置２
４を設けることもできる。At this time, since the porous substrate processing apparatus does not have the ability to convey the substrate 3, the member 23 for pushing the rear end of the substrate is provided at the symmetrical position of the porous substrate processing apparatus with the substrate 3 sandwiched therebetween. Conveyor device 2 such as belt conveyor
4 can also be provided.
【００５２】また、長尺帯状の基板３’をエッチング処
理する場合には、図６のポーラス方式の基板処理装置の
概略側断面図に示すように、基板搬送手段として平面状
多孔質体２１の処理液吐出膜２２上を搬送させる長尺帯
状の基板３’の巻き出リール２６と巻き取りリール部２
７を基板処理装置の外部に設け、基板処理装置内部、外
部には基板誘導ロール２８を備えた基板搬送装置を備え
ることができる。Further, when the long strip-shaped substrate 3'is subjected to the etching treatment, as shown in the schematic side sectional view of the porous substrate processing apparatus of FIG. Unwinding reel 26 and take-up reel unit 2 for a long strip-shaped substrate 3'which is to be transported on processing liquid ejection film 22.
7 may be provided outside the substrate processing apparatus, and a substrate transfer apparatus having a substrate guiding roll 28 may be provided inside and outside the substrate processing apparatus.
【００５３】図６に示すポーラス方式の基板処理装置を
用いると、連続したフィルム状の基板３’を巻き出しリ
ール部２６から一定のテンションを与えて基板３’を搬
送中にエッチング処理しながら巻き取りリール部２７で
巻き取る。When the porous substrate processing apparatus shown in FIG. 6 is used, a continuous film-shaped substrate 3'is unwound from the reel unit 26 while a constant tension is applied to the substrate 3'while it is being transferred while being etched. The take-up reel unit 27 winds up.
【００５４】基板３’の下側のみに、例えば銅箔が貼っ
てある片面基板３’を吐出エッチング液に当てることに
より、精度の良いエッチング処理が可能であり、基板
３’の処理面はエッチング加工中、ローラ２８に接触す
ることもなく、また基板３’上に処理液が溜まることも
なく、最も理想的な非接触のエッチング処理ができる。By applying, for example, a single-sided substrate 3'on which a copper foil is stuck to the discharge etching liquid only to the lower side of the substrate 3 ', an accurate etching process can be performed, and the processed surface of the substrate 3'is etched. During processing, neither the roller 28 is brought into contact with the processing liquid nor the processing liquid is accumulated on the substrate 3 ', and the most ideal non-contact etching processing can be performed.
【００５５】均一なエッチング液による処理と非接触効
果によりプリント配線基板などの細線パターンで要求さ
れる線幅のバラツキや、レジストの損傷によるパターン
の欠け等の不良発生原因が減少し、理想的な処理ができ
る。またエッチング液が勢い良く基板面に当たることが
ないので薄膜フィルムでも皺になりにくく、前記細線パ
ターンの作製に適した装置である。The treatment with a uniform etching solution and the non-contact effect reduce the variation in the line width required for a fine line pattern on a printed wiring board or the like, and the cause of defects such as chipping of the pattern due to resist damage is reduced. It can be processed. Further, since the etching liquid does not hit the surface of the substrate vigorously, even a thin film is unlikely to be wrinkled, and the device is suitable for producing the fine line pattern.
【００５６】ところで、プリント配線基板３を製造する
には次のような工程を経て行われる。まず、基板３の両
面に金属被膜を施し、その上にレジスト層を施す。次に
露光工程でレジスト膜の一部を硬化処理させた後、レジ
スト膜の非硬化部分を現像液で取り除いて水洗し、レジ
ストの非硬化部分を除く。その後、絞りローラによる水
の絞りとスリット・エアー・ブローによる水切り処理に
より基板内部に侵入している水分などを除き、エッチン
グ処理をすることにより非硬化部分のレジスト膜が取り
除かれることで露わになった金属皮膜部分を取り除く。
次いで硬化レジスト膜を剥離することで残った金属被膜
部分が電気配線として機能するプリント配線板が得られ
る。By the way, the printed wiring board 3 is manufactured through the following steps. First, a metal coating is applied on both sides of the substrate 3, and a resist layer is applied thereon. Next, after a part of the resist film is cured in the exposure step, the non-cured part of the resist film is removed with a developing solution and washed with water to remove the non-cured part of the resist. After that, the water is squeezed by a squeezing roller and the water is removed by slit air blow to remove the water that has entered the inside of the substrate, and the resist film in the non-cured area is removed by an etching process. Remove the metal film part that has become.
Then, the cured resist film is peeled off to obtain a printed wiring board in which the remaining metal film portion functions as electric wiring.
【００５７】上記プリント配線板の製造工程の中で基板
３の現像工程で、前記ポーラス方式の基板処理装置を用
いることができる。このとき両面プリント配線板を製造
する場合には基板３の両側から現像液の吐出膜を形成す
る多孔質体を望ませることが有効である。In the process of developing the printed wiring board, the porous substrate processing apparatus can be used in the process of developing the substrate 3. At this time, when manufacturing a double-sided printed wiring board, it is effective to make a porous body forming a discharge film of a developer from both sides of the substrate 3 desired.
【００５８】すなわち、図７の概略側断面図に示すよう
に上下方向から、均一に現像液を噴出させて現像液吐出
膜５１、５２を形成するポーラス方式の基板処理装置を
用いても良い。図７に示すように各ポーラス方式基板処
理装置の多孔質体３１、４１の各現像液吐出膜５１、５
２形成面を互いに向き合うように配置し、該一対の多孔
質体３１、４１の間に形成される現像液吐出膜５１、５
２で基板３を浮上支持させながら基板３の現像処理を行
う基板搬送路４０を形成する。一対の多孔質体３１、４
１の間に形成される現像液吐出膜５１、５２には基板搬
送力がないので、図８に示すように、隣接する複数の多
孔質体３１、４１の間に一対の搬送ローラ５３、５４を
複数組配置しても良い。一対の搬送ローラ５３、５４は
円筒状に均一に処理液を噴出させて処理液吐出膜を形成
する円筒状多孔質体からなる基板搬送用ローラ又は処理
液吐出膜を形成しないで基板に直接接触する基板搬送用
搬送ローラからなるローラを用いる。That is, as shown in the schematic side sectional view of FIG. 7, a porous substrate processing apparatus may be used in which the developing solution is ejected uniformly from the vertical direction to form the developing solution discharge films 51 and 52. As shown in FIG. 7, each developer discharge film 51, 5 of the porous bodies 31, 41 of each porous substrate processing apparatus.
2 forming surfaces are arranged so as to face each other, and the developing solution discharge films 51, 5 formed between the pair of porous bodies 31, 41.
At 2, the substrate transport path 40 for developing the substrate 3 is formed while the substrate 3 is suspended and supported. A pair of porous bodies 31, 4
Since the developing solution discharge films 51 and 52 formed between the first and the second members have no substrate carrying force, as shown in FIG. 8, a pair of carrying rollers 53 and 54 are provided between a plurality of adjacent porous bodies 31 and 41. A plurality of sets may be arranged. The pair of transfer rollers 53 and 54 directly contact the substrate without forming a processing liquid discharge film or a substrate transfer roller made of a cylindrical porous body that uniformly ejects the processing liquid in a cylindrical shape to form a processing liquid discharge film. A roller composed of a carrying roller for carrying the substrate is used.
【００５９】また、図９にポーラス方式の基板搬送装置
の側面図を示し、図１０（斜視図）に、基板搬送手段の
要部を示すが、一対の多孔質体３１、４１の間に形成さ
れる現像液吐出膜５１、５２で基板３を浮上支持させな
がら基板３の現像処理を行う基板搬送路４０を設け、該
基板搬送路４０の基板３の搬送方向の端部側面に当接す
る一対のバー３７をエンドレスベルト３８に等間隔に固
定して設けることで、基板搬送路４０内を搬送中の基板
３の搬送方向の後方端部の厚み方向の側面を後押しす
る。一対のバー３７は図示しない別部材で基板搬送装置
の構成部材に支持固定されたエンドレスベルト３８に等
間隔に固定されており、しかも図１０に示すように基板
３の搬送方向に直交する基板３の幅方向の基板両端の外
方から搬送中の基板３の後方または前方の厚み方向の側
面に当接するようなＬ字状の部材である。Further, FIG. 9 shows a side view of the porous substrate transfer device, and FIG. 10 (perspective view) shows the main part of the substrate transfer means, which is formed between the pair of porous bodies 31, 41. A substrate transfer path 40 for developing the substrate 3 is provided while the substrate 3 is floated and supported by the developing solution discharge films 51 and 52, and a pair of substrate contact paths 40 contact the end side surfaces of the substrate 3 in the transfer direction. By fixing the bars 37 to the endless belt 38 at equal intervals, the side surface in the thickness direction of the rear end portion in the transport direction of the substrate 3 being transported in the substrate transport path 40 is pushed backward. The pair of bars 37 are fixed at equal intervals to endless belts 38 which are supported and fixed to the constituent members of the substrate transfer device by separate members (not shown), and as shown in FIG. 10, the substrates 3 orthogonal to the transfer direction of the substrate 3 are provided. It is an L-shaped member that comes into contact with the rear or front side surface in the thickness direction of the substrate 3 being conveyed from outside the both ends of the substrate in the width direction.
【００６０】図示していないが基板３の搬送方向の前方
又は側方の厚み方向の側面を押圧して基板を搬送させる
ようにしても良い。前記基板搬送手段は、基板搬送速度
を変更して調整できる構成にしても良い。Although not shown, the side surface in the thickness direction, which is the front or side of the substrate 3 in the transport direction, may be pressed to transport the substrate. The substrate transfer means may be configured to be adjustable by changing the substrate transfer speed.
【００６１】また、本発明のポーラス方式の基板処理装
置として、例えば、図１１に示す例のように、平面状多
孔質体４１から処理液吐出膜５２を形成する処理液吐出
部６０と処理液吐出膜形成後の処理液を回収する処理液
回収部６１を別々に設けた多孔質体４１の組を一組以上
並列配置して一体化したユニット６２としても良い。Further, as the porous substrate processing apparatus of the present invention, for example, as in the example shown in FIG. 11, the processing liquid ejecting portion 60 for forming the processing liquid ejection film 52 from the planar porous body 41 and the processing liquid. A unit 62 may be formed by arranging one or more sets of the porous bodies 41 separately provided with the treatment liquid recovery unit 61 that collects the treatment liquid after the discharge film is formed in parallel.
【００６２】そして、本発明は、多孔質体ユニット６２
の処理液回収部６１から排出する処理液を浄化して再生
する再生前タンク６３、浄化再生装置６４、固形物分離
用ストレーナ６５付きの再生後タンク６６及び液ストレ
ーナー６７等からなる浄化再生系で得られた処理液を多
孔質体ユニット６２の処理液吐出部６０に供給する処理
液循環経路を設けた構成からなる基板処理システムとす
ることができる。The present invention is based on the porous unit 62.
A purification / regeneration system including a pre-regeneration tank 63 for purifying and regenerating the treatment liquid discharged from the treatment liquid recovery unit 61, a purification / regeneration device 64, a post-regeneration tank 66 with a strainer 65 for separating solids, and a liquid strainer 67. The substrate processing system can be configured to include a processing liquid circulation path that supplies the obtained processing liquid to the processing liquid discharger 60 of the porous body unit 62.
【００６３】従来は基板３全体を均一に各種薬液で処理
するためにスプレーノズル等から薬液を基板３上に噴霧
して処理液を基板上に拡散させることで、その目的を達
成していた。そのために、基板３とスプレーノズル（図
示せず）の距離を長く保つ必要があり、処理装置（図示
せず）の高さが高くなっていた。また、スプレーノズル
で処理液を噴霧するため、処理液を溜めるタンク内が処
理液で充満し、タンク内の搬送部品等の腐食、さらに、
ガス状または液状の処理液がタンクの隙間から漏れ、タ
ンク外周辺の環境悪化を招いていた。In the past, in order to uniformly treat the entire substrate 3 with various chemicals, the objective was achieved by spraying the chemicals onto the substrate 3 from a spray nozzle or the like and diffusing the treatment liquid onto the substrate. Therefore, it is necessary to keep the distance between the substrate 3 and the spray nozzle (not shown) long, and the height of the processing device (not shown) becomes high. Further, since the treatment liquid is sprayed by the spray nozzle, the inside of the tank for storing the treatment liquid is filled with the treatment liquid, so that the transportation parts in the tank are corroded.
The gaseous or liquid processing liquid leaked from the gap between the tanks, causing the environment around the tank to deteriorate.
【００６４】しかし、処理液吐出膜５２を形成する多孔
質体４１を一組以上並列配置して一体化して前記したユ
ニット６２とすることにより多孔質体４１を定期的に掃
除等を行うときメンテナンスを簡素化することができ
る。また、予め前記ユニット５９の予備を準備してお
き、使い古しのユニット６２を新品と交換するだけなの
で、交換時間が少なくて済み、基板処理装置のメインテ
ナンス時の運転停止時間を短縮化することができた。However, when one or more sets of the porous bodies 41 forming the treatment liquid ejection film 52 are arranged in parallel and integrated to form the unit 62 described above, maintenance is performed when the porous bodies 41 are regularly cleaned. Can be simplified. In addition, since a spare of the unit 59 is prepared in advance and the used unit 62 is simply replaced with a new unit, the replacement time is short, and the operation stop time during maintenance of the substrate processing apparatus can be shortened. It was
【００６５】もちろん、装置の組み付けに関しても、前
記ユニット６２の入口、出口を接続するだけで、従来の
設備のような大きなパイプの設置等が不要になり、装置
自体の簡素化、コンパクト化が可能になった。As for the assembly of the apparatus, of course, by simply connecting the inlet and the outlet of the unit 62, it is not necessary to install a large pipe unlike the conventional equipment, and the apparatus itself can be simplified and made compact. Became.
【００６６】本発明のシステムにおいては、多孔質体４
１の詰まりを防止するため、液フィルター６７は、フィ
ルター効率と精度を向上させるため、２次フィルター
（図示せず）、１次フィルターでは比較的大きなごみ
を、２次フィルターで多孔質の詰まりに影響する小さな
ゴミを採集し、多孔質体からの液吐出膜の形成性を高め
るように、液再生、循環システムに組み込んでいる。In the system of the present invention, the porous body 4
In order to prevent the clogging of No. 1, the liquid filter 67 improves the filter efficiency and accuracy, and in order to improve the filter efficiency and accuracy, the secondary filter (not shown) causes relatively large dust in the primary filter to become porous in the secondary filter. It collects small dust that influences and incorporates it into the liquid regeneration and circulation system so as to enhance the formation of the liquid discharge film from the porous body.
【００６７】基板３の片面のみを現像処理する場合に
は、図５に示すエッチング液による基板３の処理装置で
用いたポーラス方式の基板処理装置と同様に、基板３の
片面のみに向けて現像液の吐出膜を形成するポーラス方
式の基板処理装置を設け、さらに図示していないが基板
３の側端部を挟みながら又は後端部を後押しながら基板
を基板搬送路の搬送方向に搬送する基板駆動装置（図５
参照）を設けることもできる。In the case where only one side of the substrate 3 is developed, the development is performed toward only one side of the substrate 3 as in the porous substrate processing apparatus used in the apparatus for treating the substrate 3 with the etching solution shown in FIG. A substrate for transporting the substrate in the transport direction of the substrate transport path is provided with a porous substrate processing apparatus for forming a discharge film of the liquid, which is not shown in the drawing, while sandwiching the side edge of the substrate 3 or pushing the rear edge. Drive device (Fig. 5
Reference) can be provided.
【００６８】前記ポーラス方式の基板処理装置で基板３
を現像処理を行う前後の基板搬送工程では、従来から基
板搬送用に用いられる搬送ローラ４８を使用する搬送装
置を用いることができる。The substrate 3 is processed by the porous substrate processing apparatus.
In the substrate transfer process before and after the development processing, the transfer device using the transfer roller 48 which has been conventionally used for transferring the substrate can be used.
【００６９】なお、本発明は基板処理装置は上記プリン
ト配線板作成用の基板のエッチング処理、現像処理に用
いられるだけでなく、水洗浄処理、剥離処理など、その
他の基板を炭酸ソーダ、カセイ・ソーダ等の処理液によ
り処理する液体処理装置に適用できる。In the present invention, the substrate processing apparatus is not only used for the etching and developing treatments of the above-mentioned printed wiring board forming substrate, but also for other substrates such as water washing treatment, peeling treatment, etc. It can be applied to a liquid processing apparatus that processes with a processing liquid such as soda.
【００７０】[0070]
【発明の効果】本発明によれば、前記高密度化・細線化
・薄型化に対応したプリント配線板等の各種処理基板を
製造することができるようになり、前記処理基板の製造
コストの改善と同様に精密化へ大きく貢献する。According to the present invention, it becomes possible to manufacture various kinds of processed substrates such as printed wiring boards corresponding to the above-mentioned high density, thin line and thin type, and the manufacturing cost of the processed substrate is improved. It also contributes greatly to refinement.
【図１】 本発明の実施の形態のエッチング装置の模式
的な概略側断面図である。FIG. 1 is a schematic schematic side sectional view of an etching apparatus according to an embodiment of the present invention.
【図２】 図１のＡ−Ａ線矢視図である。FIG. 2 is a view taken along the line AA of FIG.
【図３】 図１の円Ｓ内の拡大図である。FIG. 3 is an enlarged view of a circle S in FIG.
【図４】 図１のＢ−Ｂ線矢視図である。FIG. 4 is a view taken along the line BB of FIG.
【図５】 本発明の実施の形態のポーラス方式の基板処
理装置を用いたエッチング装置の概略側断面図（図５
（ａ））と図５（ａ）のＡ−Ａ線矢視図（図５（ｂ））
である。FIG. 5 is a schematic side sectional view of an etching apparatus using a porous substrate processing apparatus according to an embodiment of the present invention (FIG. 5).
(A)) and the AA line arrow view of FIG. 5 (a) (FIG. 5 (b)).
Is.
【図６】 本発明の実施の形態のポーラス方式の基板処
理装置を用いたエッチング装置の概略側断面図である。FIG. 6 is a schematic side sectional view of an etching apparatus using a porous substrate processing apparatus according to an embodiment of the present invention.
【図７】 本発明の実施の形態のポーラス方式の基板処
理装置を用いる現像装置の概略側断面図である。FIG. 7 is a schematic side sectional view of a developing device that uses the porous substrate processing apparatus according to the embodiment of the present invention.
【図８】 本発明の実施の形態のポーラス方式の基板処
理装置を用いる現像装置の概略側断面図である。FIG. 8 is a schematic side sectional view of a developing device that uses the porous substrate processing apparatus according to the embodiment of the present invention.
【図９】 本発明の実施の形態のポーラス方式の基板処
理装置を用いる現像装置の概略側断面図である。FIG. 9 is a schematic side sectional view of a developing device using a porous substrate processing apparatus according to an embodiment of the present invention.
【図１０】 図９に示す基板搬送手段の要部斜視図であ
る。10 is a perspective view of an essential part of the substrate carrying means shown in FIG.
【図１１】 本発明の実施の形態のポーラス方式の多孔
質体を一体化したユニ」ットとするポーラス方式の基板
処理システムの系統図である。FIG. 11 is a systematic diagram of a porous substrate processing system which is a unit in which porous porous bodies of the embodiment of the present invention are integrated.
【図１２】 図１２（ａ）はエッチング装置の側面概略
図、図１２（ｂ）は図１２（ａ）のＡ−Ａ線矢視図であ
る。12A is a schematic side view of the etching apparatus, and FIG. 12B is a view taken along the line AA of FIG. 12A.
【図１３】 図１２に示すエッチング装置の搬送ローラ
部分の拡大斜視図である。13 is an enlarged perspective view of a conveyance roller portion of the etching apparatus shown in FIG.
１、４０ 基板搬送路 １ａ 基板搬送路
入口
１ｂ 基板搬送路出口 ２ タンク
２ａ タンク上室 ２ｂ タンク下室
３、３’ 基板 ５、６ スリット
８、９、２６ エッチング液供給配管
１０、１１、２７ 流量調節弁 １２、１３、２８
液供給ポンプ
１４、１５、２９ 圧力計 １６、１７、３０
流量計
２０ 基板ガイド ２１、３１、４１
多孔質体
２２ 吐出エッチング液膜 ２３ 基板後押し
部材
２４ 搬送装置 ２５ 搬送ローラ
２６ 巻き出リール ２７ 巻き取りリ
ール部
２８ 基板誘導ロール ３２、４２ 現像
液供給配管
３３、４３ 流量調節弁 ３４、４４ 現像
液供給ポンプ
３５、４５ 圧力計 ３６、４６ 流量
計
３７ バー ３８ エンドレス
ベルト
４８、５３、５４ 搬送ローラ ５１、５２ 現像
液吐出膜
５５ 円筒状ポーラス方式搬送ローラ
５６ 搬送ローラ ５７ ブラケット
５８ 傾斜角度調整用支点
５９ 基板搬送路傾斜角度調整用ジャッキ
６０ 処理液吐出部 ６１ 処理液回収
部
６２ 多孔質体ユニット ６３ 再生前タン
ク
６４ 浄化再生装置 ６５ ストレーナ
６６ 再生後タンク ６７ 液ストレー
ナー1, 40 Substrate transfer path 1a Substrate transfer path inlet 1b Substrate transfer path outlet 2 Tank 2a Tank upper chamber 2b Tank lower chamber 3, 3'Substrate 5,6 Slits 8, 9, 26 Etching liquid supply pipes 10, 11, 27 Flow rate Control valve 12, 13, 28
Liquid supply pumps 14, 15, 29 Pressure gauges 16, 17, 30
Flow meter 20 Substrate guide 21, 31, 41
Porous body 22 Ejection etching liquid film 23 Substrate pushing member 24 Conveying device 25 Conveying roller 26 Unwinding reel 27 Take-up reel section 28 Substrate guiding roll 32, 42 Developing solution supply pipe 33, 43 Flow control valve 34, 44 Developing solution supply Pumps 35, 45 Pressure gauges 36, 46 Flowmeters 37 Bars 38 Endless belts 48, 53, 54 Conveying rollers 51, 52 Developer discharging film 55 Cylindrical porous conveying rollers 56 Conveying rollers 57 Brackets 58 Inclination angle adjusting fulcrums 59 Substrate Transport path tilt angle adjustment jack 60 Treatment liquid discharge portion 61 Treatment liquid recovery portion 62 Porous body unit 63 Pre-regeneration tank 64 Purification regeneration device 65 Strainer 66 Post-regeneration tank 67 Liquid strainer
───────────────────────────────────────────────────── フロントページの続き (72)発明者 三浦 佳久 東京都大田区東▲こうじ▼谷５丁目21番 15号 ソニー株式会社 コアテクノロジ ー アンド ネットワークカンパニー内 (56)参考文献 特開2002−26490（ＪＰ，Ａ) 特開2001−207300（ＪＰ，Ａ) 特開2000−328265（ＪＰ，Ａ) 特開 昭63−33896（ＪＰ，Ａ) 特開 昭59−85891（ＪＰ，Ａ) 特開 昭59−85890（ＪＰ，Ａ) 特開 昭58−136796（ＪＰ，Ａ) 特開 昭51−18231（ＪＰ，Ａ) 特開 昭50−9535（ＪＰ，Ａ) 特開 平７−249602（ＪＰ，Ａ) 特開 平６−316778（ＪＰ，Ａ) 特開 平５−235507（ＪＰ，Ａ) 特開 平４−256461（ＪＰ，Ａ) 実開 平１−134652（ＪＰ，Ｕ) 特表2003−524079（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) C23F 1/00 - 4/04 C25F 1/00 - 7/02 H05K 3/02 - 3/08 H05K 3/10 - 3/26 H05K 3/38 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Yoshihisa Miura, Yoshihisa Miura, 5-21-15, Higashi ▲ Koji ▼ Tani, Ota-ku, Tokyo Sony Corporation Core Technology and Network Company (56) Reference JP 2002-26490 ( JP, A) JP 2001-207300 (JP, A) JP 2000-328265 (JP, A) JP 63-33896 (JP, A) JP 59-85891 (JP, A) JP 59 -85890 (JP, A) JP 58-136796 (JP, A) JP 51-18231 (JP, A) JP 50-9535 (JP, A) JP 7-249602 (JP, A) ) JP-A-6-316778 (JP, A) JP-A-5-235507 (JP, A) JP-A-4-256461 (JP, A) Fukuihei 1-134652 (JP, U) Special Table 2003-524079 (JP, A) (58) Fields surveyed (Int.Cl. 7 , DB name) C2 3F 1/00-4/04 C25F 1/00-7/02 H05K 3/02-3/08 H05K 3/10-3/26 H05K 3/38
Claims (13)
液吐出膜を形成する平面状多孔質体を複数個、前記処理
液吐出膜が同一水平面上にあるように並列配置して基板
を前記処理液吐出膜上に浮上させ、基板を水平状態に保
ったまま搬送させる基板搬送路を形成し、該基板搬送路
とは別に独立して設けた該基板搬送路上の基板を搬送方
向に送る基板搬送手段と、基板搬送速度調整手段を備え
たことを特徴とする基板処理装置。1. A substrate in which a plurality of planar porous bodies for uniformly ejecting a treatment liquid in a plane to form a treatment liquid discharge film are arranged in parallel so that the treatment liquid discharge films are on the same horizontal plane. The substrate above the processing liquid ejection film to keep the substrate horizontal.
Forming a substrate transport path for transporting remain Tsu, said substrate transport path
The substrate processing apparatus according to claim and a substrate conveying means for sending separate independent substrate on the substrate transportation path provided in the conveying direction, further comprising a substrate carrying speed adjusting means and.
液吐出膜を形成する平面状多孔質体は、前記処理液吐出
膜を上方に向けて形成して、該処理液吐出膜上に基板を
浮上支持させる基板搬送路を形成する平面状多孔質体か
ら構成されることを特徴とする請求項１記載の基板処理
装置。2. A planar porous body for ejecting a treatment liquid evenly in a plane to form a treatment liquid discharge film, wherein the treatment liquid discharge film is formed upward and formed on the treatment liquid discharge film. 2. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is composed of a planar porous body that forms a substrate transport path for supporting the substrate in a floating manner.
液吐出膜を形成する平面状多孔質体は、前記処理液吐出
膜を互いに向き合うように上下に配置して、前記一対の
多孔質体の処理液吐出膜の間に基板を浮上支持させる基
板搬送路を形成する一対の平面状多孔質体から構成され
ることを特徴とする請求項１記載の基板処理装置。3. A planar porous body for uniformly ejecting a treatment liquid in a planar manner to form a treatment liquid discharge film, wherein the treatment liquid discharge films are vertically arranged so as to face each other, and the pair of porous bodies are provided. 2. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus comprises a pair of planar porous bodies that form a substrate transport path for supporting the substrate in a floating manner between the processing liquid ejection films of the particulate body.
質体の各平面状多孔質体の前流側と後流側のうちの少な
くとも後流側に配置した円筒状に均一に処理液を噴出さ
せて処理液吐出膜を形成する円筒状多孔質体からなる基
板搬送用ローラ又は処理液吐出膜を形成しないで基板に
直接接触する基板搬送用搬送ローラであることを特徴と
する請求項１記載の基板処理装置。4. The substrate transfer means uniformly arranges the treatment liquid in a cylindrical shape arranged at least on the downstream side of the upstream side and the downstream side of each planar porous body of the plurality of planar porous bodies. A substrate transporting roller made of a cylindrical porous body that ejects a treatment liquid to form a processing liquid discharge film, or a substrate transporting transport roller that directly contacts the substrate without forming the processing liquid discharge film. 1. The substrate processing apparatus according to 1.
又は基板後端面を押し込む基板押圧部材と該基板押圧部
材を支持するエンドレスベルトとからなることを特徴と
する請求項１記載の基板処理装置。5. The substrate transfer means sandwiches the substrate-side end face, or
2. The substrate processing apparatus according to claim 1, further comprising a substrate pressing member that presses the substrate rear end surface and an endless belt that supports the substrate pressing member.
状多孔質体の処理液吐出膜上を搬送させる基板巻き出部
と基板巻き取り部を備えた搬送装置からなることを特徴
とする請求項１記載の基板処理装置。6. The substrate transporting means comprises a transporting device having a substrate unwinding portion and a substrate winding portion for transporting a long strip-shaped substrate over the treatment liquid discharge film of the planar porous body. The substrate processing apparatus according to claim 1.
は、処理液吐出膜を形成する処理液吐出部と処理液吐出
膜形成後の処理液を回収する処理液回収部を別々に設け
た多孔質体を一組以上並列配置して一体化した多孔質体
ユニットとすることを特徴とする請求項１記載の基板処
理装置。7. A planar porous body for forming a treatment liquid discharge film has a treatment liquid discharge part for forming a treatment liquid discharge film and a treatment liquid recovery part for collecting treatment liquid after the treatment liquid discharge film is formed separately. 2. The substrate processing apparatus according to claim 1, wherein one or more sets of the provided porous bodies are arranged in parallel to form an integrated porous body unit.
出する処理液を浄化して再生する浄化再生装置と該浄化
再生装置で得られた処理液を多孔質体ユニットの処理液
吐出部に供給する処理液循環経路を設けたことを特徴と
する請求項７記載の基板処理装置。8. A purification regenerator for purifying and regenerating the treatment liquid discharged from the treatment liquid recovery unit of the porous body unit, and the treatment liquid obtained by the purification regenerator to the treatment liquid discharge unit of the porous body unit. The substrate processing apparatus according to claim 7, further comprising a processing liquid circulation path for supplying the processing liquid.
られることを特徴とする処理基板。9. A processed substrate obtained by using the substrate processing apparatus according to claim 1.
天井壁面及び底壁面を含む壁面により構成される基板搬
送路と、該基板搬送路を構成する天井壁面及び底壁面に
基板搬送方向に向けて傾斜角度をもって処理液を噴出す
る複数のスリットを設けた基板処理装置と、 該基板処理装置の基板搬送路に隣接させて、少なくとも
前記搬送路出口側に、前記搬送路出口から搬出される基
板を浮上支持するために、平面状に均一に処理液を噴出
させて処理液吐出膜を形成する１以上の平面状多孔質体
を、前記処理液吐出膜が同一水平面上にあるように並列
配置して基板を前記処理液吐出膜上に浮上させ、基板を
水平状態に保ったまま搬送させる基板搬送路を形成し、
該基板搬送路とは別に独立して設けた該基板搬送路上の
基板を搬送方向に送る基板搬送手段を備えた多孔質体の
処理液吐出装置を配置したことを特徴とする基板処理装
置。10. A substrate inlet and a substrate outlet are provided at both ends,
A substrate transfer path constituted by wall surfaces including a ceiling wall surface and a bottom wall surface, and a plurality of slits for ejecting a processing liquid at an inclination angle toward the substrate transfer direction are provided on the ceiling wall surface and the bottom wall surface forming the substrate transfer path. The substrate processing apparatus and the substrate transfer path of the substrate processing apparatus are adjacent to each other, and at least
On the exit side of the transfer path , the processing liquid is ejected uniformly in a plane to support the substrate carried out from the exit of the transfer path.
One or more planar porous bodies for forming a treatment liquid discharge film
In parallel so that the treatment liquid discharge films are on the same horizontal plane.
The substrate is placed and floated on the treatment liquid discharge film,
Form a substrate transfer path to transfer while keeping it horizontal,
Of the substrate transport path provided apart independently of the substrate transport path
A substrate processing apparatus, comprising a porous processing liquid ejecting device provided with a substrate transfer means for transferring a substrate in a transfer direction .
孔質体は、その処理液吐出膜を上方に向けて形成する平
面状多孔質体からなり、前記処理液吐出膜上に基板を浮
上支持させる基板搬送路を形成するか、又はその処理液
吐出膜を互いに向き合うように上下に配置した一対の平
面状多孔質体からなり、前記一対の多孔質体からの処理
液吐出膜の間に基板を浮上支持させる基板搬送路を形成
することを特徴とする請求項１０記載の基板処理装置。11. A porous body used in a treatment liquid discharge device for a porous body is a planar porous body formed with its treatment liquid discharge film facing upward, and a substrate is floated on the treatment liquid discharge film. A substrate transport path to be supported is formed, or the processing liquid discharge film is composed of a pair of planar porous bodies arranged vertically so as to face each other, and between the processing liquid discharge films from the pair of porous bodies. 11. The substrate processing apparatus according to claim 10, wherein a substrate transport path for supporting the substrate in a floating manner is formed.
手段は、前記複数の平面状多孔質体の各平面状多孔質体Means is each planar porous body of the plurality of planar porous bodies
の前流側と後流側のうちの少なくとも後流側に配置したOf at least one of the upstream side and the downstream side of the
円筒状に均一に処理液を噴出させて処理液吐出膜を形成Forming a processing solution discharge film by uniformly ejecting the processing solution in a cylindrical shape
する円筒状多孔質体からなる基板搬送用ローラ又は処理Substrate transporting roller or treatment made of cylindrical porous material
液吐出膜を形成しないで基板に直接接触する基板搬送用For substrate transfer that directly contacts the substrate without forming a liquid discharge film
搬送ローラであることを特徴とする請求項１０記載の基The base according to claim 10, which is a transport roller.
板処理装置。Plate processing equipment.
て得られることを特徴とする処理基板。13. A processed substrate obtained by using the substrate processing apparatus according to claim 10 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000235734A JP3519675B2 (en) | 2000-08-03 | 2000-08-03 | Substrate processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000235734A JP3519675B2 (en) | 2000-08-03 | 2000-08-03 | Substrate processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002053983A JP2002053983A (en) | 2002-02-19 |
| JP3519675B2 true JP3519675B2 (en) | 2004-04-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000235734A Expired - Fee Related JP3519675B2 (en) | 2000-08-03 | 2000-08-03 | Substrate processing equipment |
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| JP (1) | JP3519675B2 (en) |
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| JP4725801B2 (en) * | 2006-11-27 | 2011-07-13 | パナソニック電工株式会社 | Wiring board processing equipment |
| JP5877954B2 (en) * | 2011-03-07 | 2016-03-08 | 株式会社ゼビオス | Substrate processing apparatus having non-contact levitation transfer function |
| CN113873773B (en) * | 2021-09-07 | 2022-04-12 | 深圳市格安电子有限公司 | Double-position alternating type numerical control high-speed printed circuit board electric spark etching equipment |
| CN116321765B (en) * | 2023-05-15 | 2023-07-28 | 深圳市凌航达电子有限公司 | Etching processing method and device for copper-clad circuit board |
| CN116924010B (en) * | 2023-08-28 | 2026-04-03 | 北京晶亦精微科技股份有限公司 | A substrate transfer method and apparatus |
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| JP2002053983A (en) | 2002-02-19 |
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