JP3523452B2 - Substrate positioning device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board positioning device for sucking and positioning a lower surface of a printed board by a suction means in order to perform a predetermined work on the printed board.

[0002]

2. Description of the Related Art In this type of substrate positioning apparatus, a conventional substrate positioning apparatus as shown in FIG.
As shown in FIG. 3, the printed circuit board 21 is placed on the substrate suction jig 20, the end surfaces on both sides thereof are positioned by being pressed by the pair of substrate holders 22, and then the upper surface of the substrate suction jig 20 is perforated. Negative pressure is suctioned and fixed from the suction port 23, and in this state, a predetermined work such as printing of solder paste is performed.

[0003]

However, in the prior art described above, if the substrate 21 has a certain thickness, the substrate 21 may be securely positioned and fixed by suction and lateral clamping, as shown in FIG. When attempting to position the thin substrate 21 as described above, the substrate 21 warps when the substrate 21 is pressed, which causes a gap between the substrate 21 and the substrate suction jig 20 to leak a vacuum. There may be a problem that the substrate 21 cannot be securely fixed.

Therefore, it is an object of the present invention to perform reliable positioning according to a printed board even if the type of the board changes.

[0005]

Therefore, according to the present invention, in a substrate positioning apparatus for sucking and positioning the lower surface of a printed circuit board to perform a predetermined operation on the printed circuit board, the substrate is positioned by the suction means. A pair of pressing means for pressing and positioning both side surfaces of the substrate,
Is sucked by the suction means and positioned
A switching means for switching the operation or non-operation of the pressing means is provided.

According to the present invention, in the board positioning device according to the first aspect of the present invention, there is provided a storage means for storing data for deciding whether to activate or deactivate the pressing means for each type of printed circuit board. The switching means switches the operation or non-operation of the pressing means according to the data stored in the storage means.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described in detail below with reference to the drawings.

The screen printer 1 will be described with reference to FIG.

An XY table 3 is placed on the base 2 and is movable in the XY directions parallel to the base 2. A printed circuit board 21 is positioned and fixed on the table 3, and as shown in FIG. 3, a substrate suction jig 20 is incorporated in the upper portion of the table 3 (note that this is described as a conventional technique. Since the structure is the same as that of the substrate suction jig 20, the description will be given using the same reference numerals.).

A substrate retainer 22 for sandwiching and retaining the substrate 21 is opened and closed by a cylinder 6 (not shown in FIG. 3), which will be described later, between a position for engaging the substrate 21 and a position for separating the substrate 21 in the horizontal direction. It is done like this.

A screen plate 7 is fixed above a predetermined stop position of the XY table 3, and a solder paste (not shown) on the screen plate 7 is printed on a printed board 21 by a squeegee 8 which moves vertically and horizontally. To be done.

Next, the control block of the screen printing machine 1 will be described with reference to FIG. 25 is a CPU,
Based on the data stored in the RAM 26, the operation of the screen printing machine 1 is centrally controlled according to the program stored in the ROM 27. Interface 2 to CPU 25
A control target such as a cylinder 6 that drives the substrate retainer 22 is connected via 8 and a drive circuit 29. Further, the interface 28 is a CRT that displays various data and the like.
30 is connected, a touch panel switch is formed on the screen of the CRT 30, and various operations such as setting operation can be performed on the displayed operation screen.

The RAM 26 is provided with a board holder 2 for positioning the board 21 of each kind for each kind of the printed board 21.
2 stores pressing data for instructing whether or not to perform the pinching operation.
As shown in, the data "actuation" is written, and the data "non-actuation" is stored when the action is not performed. “AAA” and “BBB” indicate substrate types.

With the above configuration, the operation will be described below.

First, when the type of the printed board 21 to be produced, that is, the screen printing is set by the setting means (not shown), the pressing data is selected based on the board type.

When the board type "AAA" is selected and set, "operation" is selected as the pressing data.

Next, when the production operation is started, the board 21 of the board type "AAA" having a large board thickness is conveyed to a conveyor (not shown) and transferred onto the board suction jig 20 of the XY table 3. The CPU 25 as a switching means actuates the cylinder 6 in accordance with the "actuation" of the pushing data to push the substrate holder 2
2 is closed and the printed circuit board 21 is clamped as shown in FIG. As a result, the printed board 21 is positioned and pressed around the center position of the opening and closing of the board holder 22.

Next, since the thickness of the substrate is large, the printed substrate 21 is not warped even when pushed by the substrate holder 22, and the printed substrate 21 is sucked by the negative pressure from the suction port 23, and further securely fixed and positioned.

Next, the screen plate 7 is lowered or the XY table 3 is lifted so that the distance between the screen plate 7 and the printed circuit board 21 becomes a predetermined distance, and the squeegee 8 moves the screen plate 7 along the screen plate 7 to a predetermined distance. While moving while pressing, paste solder (not shown) on the screen plate 7 is printed in a predetermined pattern on the printed board 21.

Next, when printing is completed, vacuum suction from the suction port 23 is stopped, the substrate holder 22 is opened, and the engagement with the substrate 21 is released.

Next, the printed board 21 is the board suction jig 2
0 is transferred onto a discharge conveyor (not shown) from above and conveyed to a downstream device.

Next, when changing the type of the printed circuit board 21 to be produced, the setting of the type of the printed circuit board 21 is changed to "BBB" as a part of various setup change operations.

Next, when the production operation is restarted, the "BBB" substrate 21 having a small substrate thickness is transferred onto the substrate suction jig 20.

Next, the CPU 25 causes the "BB" in the RAM 26 to
Since the pressure data “non-operation” corresponding to “B” is not issued and the command for driving the cylinder 6 is not issued, the substrate retainer 22 is not driven, the substrate 21 does not warp, and the suction port 23 as shown in FIG. It is surely sucked by the negative pressure from and is fixed and positioned on the substrate suction jig 20. Thin substrate 2
Since it is 1, it is firmly fixed only by vacuum suction without using the substrate retainer 22. Further, if the positioning marks are positioned with a certain degree of accuracy when they are transferred to the substrate suction jig 20, it is desirable that the recognition marks (two or three) are provided on the printed board 21, but only one. ) Is recognized by a camera (not shown) and the position of the substrate 21 can be grasped, the alignment with the screen plate 7 can be positioned by the correction movement of the XY table 3 in the horizontal direction, and there is no problem.

Next, the printed board 21 is processed in the same manner as described above.
The paste solder is printed on.

The vacuum suction of the substrate 21 on which printing has been completed is released, and the substrate 21 is transferred to the discharge conveyor as described above.

Next, a second embodiment will be described.

In the above-described first embodiment, the pressing data is set for each substrate type to switch the operation or non-operation of the substrate retainer 22. However, the CRT 30 displays a screen as shown in FIG. The operation of the substrate retainer 22 can be appropriately switched by pressing the "non-operation" switch section and the "setting" switch section.

That is, when the type of the substrate 21 is changed and the thick substrate is positioned, the screen of FIG. 6 is displayed and
By pressing "ACTIVATE" and then "SET", the CPU 25 as a switching means stores in the predetermined area of the RAM 26 that it is in a state to be activated. As a result, after the substrate is transferred onto the substrate suction jig 20, the substrate holder 22
Clamps and presses the substrate 21. The work is advanced in the same manner as in the first embodiment.

When screen-printing the thin substrate 21, the screen of FIG. 6 is displayed at the time of setup change, and the "non-operation" switch section is pressed to press the "setting" switch section, Switch. After this, when the production operation is performed, the substrate 21 is fixed only by vacuum suction of the suction port 23 without operating the substrate retainer 22 when it is transferred onto the substrate suction jig 20. . Hereafter, the work is carried out in the same manner as in the first embodiment.

[0031]

As described above, according to the present invention, the substrate is warped.
It can be surely sucked without fail and can be positioned reliably according to the printed circuit board.

[Brief description of drawings]

FIG. 1 is a diagram showing pressing data set for each substrate type.

FIG. 2 is a side view showing a screen printing machine.

FIG. 3 is a side view showing a substrate suction jig.

FIG. 4 is a side view showing a substrate suction jig.

FIG. 5 is a control block diagram of the screen printing machine.

FIG. 6 is a diagram showing a CRT screen.

FIG. 7 is a side view showing a substrate suction jig according to a conventional technique.

[Explanation of symbols]

5 Chip-shaped electronic components 20 Substrate suction jig (suction means) 21 Printed circuit board 22 Substrate pressing (pressing means) 25 CPU (switching means) 26 RAM (storage means)

Claims (2)

(57) [Claims] 1. A board positioning device for sucking and positioning a lower surface of a board by a suction means for performing a predetermined operation on a printed circuit board, wherein both side surfaces of the board sucked by the suction means are pressed and positioned. a pair of pressing means for said substrate is the
The above-mentioned push when being sucked and positioned by the suction means
A substrate positioning device comprising switching means for switching the operation or non-operation of the pressure means . 2. A storage means for storing data for deciding whether to actuate or deactivate the pressing means for each type of printed circuit board, wherein the switching means stores the data stored in the storing means. The substrate positioning apparatus according to claim 1, wherein the pressing means is switched between operating and non-operating depending on the operation.