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JP3525211B2 - Vacuum laminating equipment - Google Patents
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JP3525211B2 - Vacuum laminating equipment - Google Patents

Vacuum laminating equipment

Info

Publication number
JP3525211B2
JP3525211B2 JP2000074171A JP2000074171A JP3525211B2 JP 3525211 B2 JP3525211 B2 JP 3525211B2 JP 2000074171 A JP2000074171 A JP 2000074171A JP 2000074171 A JP2000074171 A JP 2000074171A JP 3525211 B2 JP3525211 B2 JP 3525211B2
Authority
JP
Japan
Prior art keywords
plate
vacuum
heat insulating
insulating plate
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000074171A
Other languages
Japanese (ja)
Other versions
JP2001260154A (en
Inventor
活之 榊原
Original Assignee
株式会社名機製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社名機製作所 filed Critical 株式会社名機製作所
Priority to JP2000074171A priority Critical patent/JP3525211B2/en
Publication of JP2001260154A publication Critical patent/JP2001260154A/en
Application granted granted Critical
Publication of JP3525211B2 publication Critical patent/JP3525211B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、真空雰囲気下にお
いて、加熱及び加圧処理により二種以上からなる積層材
を積層成形する真空積層装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum laminating apparatus for laminating and molding a laminated material composed of two or more kinds in a vacuum atmosphere by heat and pressure treatment.

【0002】[0002]

【従来の技術】所定温度で加熱された真空室内部で、膜
体により加圧して積層材を成形する装置に関する技術
は、特開平8−132531及び特開平10−1752
29等に開示している。
2. Description of the Related Art A technique relating to an apparatus for forming a laminated material by pressurizing with a film in a vacuum chamber heated at a predetermined temperature is disclosed in JP-A-8-132531 and JP-A-10-1752.
29, etc.

【0003】[0003]

【発明が解決しようとする課題】上記従来装置において
は、膜体を有する盤体における膜体内部の真空度が所定
時間で十分に上昇せず、真空室も膜体内部と同一の真空
ポンプが接続されている場合には、真空室の真空度も上
昇しないため、積層成形品に気泡が発生する。また、膜
体を有する盤体における膜体内部の真空ポンプと真空室
の真空ポンプを別個のものとした場合には、真空室の真
空度は十分上昇するが、真空室内の真空度より膜体内部
の真空度が低いことに起因して膜体が浮き上がり、積層
工程以前に積層材が接着され、積層成形品に気泡等の不
良が発生することがある。
In the above conventional apparatus, the degree of vacuum inside the film body of the board having the film body does not rise sufficiently within a predetermined time, and the vacuum chamber has the same vacuum pump as the inside of the film body. When connected, the degree of vacuum in the vacuum chamber does not rise, and thus bubbles are generated in the laminated molded product. Further, when the vacuum pump inside the film body and the vacuum pump in the vacuum chamber in the board having the film body are separated from each other, the degree of vacuum in the vacuum chamber rises sufficiently, but the degree of vacuum in the film chamber is higher than that in the vacuum chamber. Due to the low degree of vacuum inside, the film body may float, the laminated material may be bonded before the laminating step, and defects such as bubbles may occur in the laminated molded product.

【0004】[0004]

【課題を解決するための手段】そこで、本発明の発明者
は、上記課題を解決すべく鋭意研究した結果、真空度低
下の原因が断熱板にあることを突き止め、その解決手段
として断熱板の表面を樹脂コートしたのである。
The inventor of the present invention, as a result of diligent research to solve the above problems, found out that the cause of the decrease in the vacuum degree was the heat insulating plate, and as a means for solving the problem, the heat insulating plate The surface was resin coated.

【0005】[0005]

【発明の実施の形態】本発明の実施の形態を図面に基づ
き詳細に説明する。図1は本発明を実施する真空積層装
置を概略的に表す縦断面図である。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a vertical sectional view schematically showing a vacuum laminating apparatus for carrying out the present invention.

【0006】1は上板であり、凹部を有する略矩形の平
板である。上板1の凹部には上断熱板5、ヒータ7、上
定盤10が順次積み上げ配設されて盤体20を構成して
いる。上板1の略中央には上気孔3が穿孔され、上気孔
3は上板1の凹部底面に格子状に設けた溝に連通して、
上気孔3に接続した図示しない真空ポンプにより凹部内
と真空室19の脱気が全域で行われるようにしている。
2は下板であり、上板1と同一寸法の矩形状の平板であ
る。下板2の外周には額縁状の枠13が気密に固着さ
れ、枠13の上板1との対向面には真空室19を気密に
するためのOリング14が嵌挿してある。下板2と枠1
3により形成された凹部には、下断熱板6、ヒータ8、
中間部材9および膜体12が順次積み上げ配設され、膜
体12の上に必要に応じて載置する下定盤11とともに
盤体21を構成している。下板2の略中央には下気孔4
が穿孔され、下断熱板6とヒータ8にも下気孔4と同位
置に穿孔されている。下板2の凹部底面には下気孔4に
連通する格子状の溝が設けられ、下気孔4から膜体12
で覆った内部の脱気を図示しない真空ポンプで行うとと
もに通路を選択して加圧空気に接続する。また、中間部
材9は下気孔4と格子状溝に連通する多孔の通気構造と
し、下気孔4からの真空吸引と加圧空気の作用が膜体1
2の全域に均等に及ぶようにしている。
Reference numeral 1 denotes an upper plate, which is a substantially rectangular flat plate having a recess. An upper heat insulating plate 5, a heater 7, and an upper surface plate 10 are sequentially stacked in the concave portion of the upper plate 1 to form a plate body 20. An upper air hole 3 is bored at approximately the center of the upper plate 1, and the upper air hole 3 communicates with a groove formed in a grid pattern on the bottom surface of the concave portion of the upper plate 1,
A vacuum pump (not shown) connected to the upper air holes 3 degass the inside of the recess and the vacuum chamber 19.
Reference numeral 2 denotes a lower plate, which is a rectangular flat plate having the same dimensions as the upper plate 1. A frame-shaped frame 13 is airtightly fixed to the outer periphery of the lower plate 2, and an O-ring 14 for hermetically sealing the vacuum chamber 19 is fitted on the surface of the frame 13 facing the upper plate 1. Lower plate 2 and frame 1
In the recess formed by 3, the lower heat insulating plate 6, the heater 8,
The intermediate member 9 and the film body 12 are sequentially stacked and arranged, and together with the lower surface plate 11 placed on the film body 12 as necessary, a plate body 21 is formed. At the center of the lower plate 2, there is a lower air hole 4.
The lower heat insulating plate 6 and the heater 8 are also formed at the same positions as the lower air holes 4. Lattice-shaped grooves communicating with the lower pores 4 are provided on the bottom surface of the concave portion of the lower plate 2, and the lower pores 4 extend to the membrane body 12.
Deaeration of the inside covered with is performed by a vacuum pump (not shown), and a passage is selected to connect to pressurized air. In addition, the intermediate member 9 has a porous ventilation structure that communicates with the lower pores 4 and the lattice-shaped grooves, and the vacuum suction from the lower pores 4 and the action of the pressurized air are applied to the membrane member 1.
It is made to cover the whole area of 2.

【0007】上・下断熱板5,6は、ガラス繊維やアラ
ミド繊維などの補強材とセメントやケイ酸カルシウムな
どの無機質結合複合材からなり、具体的には日光化成
(株)のベスサーモFが好適に用いられる。上・下断熱
板5,6のうち少なくとも下断熱板6の表面は、1液性
シリコンワニス(信越化学工業(株)、KC-88)等を塗
布することによって樹脂コートし、封止膜22を形成し
ている。この封止膜22により断熱板内部の空隙が外部
と遮断され、断熱板に空気が蓄積されなくなり、真空度
の低下を防止するのである。封止膜22は、樹脂系の素
材で例示したが、空気を遮断できるものであれば、他の
材質でもよいことは言うまでもない。
The upper and lower heat insulating plates 5 and 6 are made of a reinforcing material such as glass fiber or aramid fiber and an inorganic binding composite material such as cement or calcium silicate. Specifically, Beth Thermo F of Nikko Kasei Co., Ltd. It is preferably used. At least the surface of the lower heat insulating plate 6 among the upper and lower heat insulating plates 5 and 6 is resin-coated by applying a one-component silicon varnish (KC-88, manufactured by Shin-Etsu Chemical Co., Ltd.) and the sealing film 22. Is formed. The sealing film 22 blocks the void inside the heat insulating plate from the outside, prevents air from being accumulated in the heat insulating plate, and prevents the degree of vacuum from decreasing. Although the sealing film 22 is exemplified by the resin-based material, it goes without saying that another material may be used as long as it can block air.

【0008】加熱装置としてのヒータ7,8は、薄板平
板状の電気抵抗加熱体であり、絶縁物はゴム材が好適に
用いられる。膜体12は、耐熱性、弾性、可撓性、伸縮
性に富んだ材質が求められ、シリコンゴム、特殊プラス
チック等が好適に用いられる。膜体12は、枠13とと
もに気密に下板2と組み上げられている。上定盤10
は、板圧1mm程度のステンレス鋼等からなり、ヒータ
7と略同一寸法を有し、表面にゴム膜を溶着することも
ある。下定盤11は、板圧1mm程度のステンレス鋼等
からなり、積層材18と略同一寸法を有する。上・下定
盤10,11は、積層材18の表面を平滑に仕上げるた
めに用いられ、積層材の表面が回路基板のように凹凸が
あり平滑ではなく、埋込みを目的とする場合は下定盤1
1を用いない。
The heaters 7 and 8 as a heating device are thin plate-shaped electric resistance heating elements, and a rubber material is preferably used as an insulator. The film body 12 is required to be made of a material having excellent heat resistance, elasticity, flexibility and stretchability, and silicon rubber, special plastic or the like is preferably used. The film body 12 is assembled with the lower plate 2 in an airtight manner together with the frame 13. Upper surface plate 10
Is made of stainless steel or the like with a plate pressure of about 1 mm, has substantially the same dimensions as the heater 7, and may have a rubber film welded to its surface. The lower surface plate 11 is made of stainless steel or the like with a plate pressure of about 1 mm, and has substantially the same dimensions as the laminated material 18. The upper and lower stools 10 and 11 are used to finish the surface of the laminated material 18 smoothly, and the surface of the laminated material is uneven like a circuit board and is not smooth.
Do not use 1.

【0009】次に、作動を説明する。まず下板2を図示
しない型締装置により下降させ、真空室19を開放す
る。図1において、右方から下搬送膜17とそれに載置
した積層材18を、右方の上方からローラ15を介して
上搬送膜16をそれぞれ真空室19内へ供給する。搬送
は、図1左方の積層材18をラミネートした上・下搬送
膜の端部を図示しないチャックで挟持して所定距離移動
することにより実行する。積層材18が下定盤11と全
面で重なる位置に到達・位置決めしたとき搬送を停止す
る。そして下板2を上昇させて、枠13を介して下板2
と上板1を図示しない型締装置により圧締させ、真空室
19を形成する。
Next, the operation will be described. First, the lower plate 2 is lowered by a mold clamping device (not shown) to open the vacuum chamber 19. In FIG. 1, the lower transport film 17 and the laminated material 18 placed on the lower transport film 17 are supplied from the right side to the upper transport film 16 through the roller 15 into the vacuum chamber 19 from the right upper side. The conveyance is carried out by sandwiching the end portions of the upper and lower conveyance films laminated with the laminated material 18 on the left side of FIG. When the laminated material 18 reaches and is positioned at a position where it is entirely overlapped with the lower surface plate 11, the conveyance is stopped. Then, the lower plate 2 is raised and the lower plate 2 is inserted through the frame 13.
Then, the upper plate 1 is clamped by a mold clamping device (not shown) to form a vacuum chamber 19.

【0010】下板2の上昇と前後して、下気孔4から真
空吸引して膜体12を中間部材9に密着させておく。こ
のとき、下断熱板6の表面に封止膜22があるので、下
断熱板6の内部に空気が蓄積されず、所定時間内に十分
真空吸引されて、膜体12内部の真空度低下を防止する
のである。下板2と上板1が圧締され、真空室19が形
成されると、上気孔3からも真空吸引する。この場合
も、下断熱板6および上断熱板5の表面に封止膜22が
あるので、真空室19の真空度は所定時間内に所定値ま
で上昇するのである。その後、下気孔4を真空源から大
気または必要に応じて加圧空気源に切換接続して膜体1
2を膨張させて積層材18を加熱・加圧する。積層材1
8の成形が終了した後、下板2を再び下降させて真空室
19を開放し、上・下搬送膜を積層材18とともに搬送
する。
Before and after the lower plate 2 is raised, the film body 12 is brought into close contact with the intermediate member 9 by vacuum suction from the lower air holes 4. At this time, since the sealing film 22 is present on the surface of the lower heat insulating plate 6, air is not accumulated inside the lower heat insulating plate 6 and is sufficiently vacuumed within a predetermined time to reduce the degree of vacuum inside the film body 12. Prevent it. When the lower plate 2 and the upper plate 1 are clamped and the vacuum chamber 19 is formed, vacuum suction is also performed from the upper pores 3. Also in this case, since the sealing film 22 is provided on the surfaces of the lower heat insulating plate 6 and the upper heat insulating plate 5, the degree of vacuum in the vacuum chamber 19 rises to a predetermined value within a predetermined time. After that, the lower pores 4 are switched from the vacuum source to the atmosphere or, if necessary, to the pressurized air source, and the film body 1 is connected.
2 is expanded to heat and press the laminated material 18. Laminated material 1
After the molding of 8 is completed, the lower plate 2 is lowered again to open the vacuum chamber 19, and the upper and lower transport films are transported together with the laminated material 18.

【0011】上記作動より明らかなように、下断熱板6
は真空、大気、加圧雰囲気を繰り返すため、真空と大気
雰囲気を繰り返す上断熱板5よりも、封止膜22がない
ときに空気蓄積量が多くなり、真空度の低下に及ぼす影
響が大きいのである。このことは、樹脂コートを施して
いない従来の下断熱板6を採用した真空積層装置の下気
孔4の真空度が、膜体12の加圧空気圧力が大なる程、
低くなることからも理解出来る。したがって、下断熱板
6にのみ封止膜22を形成するようにしてもよい。
As is clear from the above operation, the lower heat insulating plate 6
Since the vacuum, the atmosphere, and the pressurized atmosphere are repeated, the amount of accumulated air is larger when the sealing film 22 is not provided than in the upper heat insulating plate 5 where the vacuum and the atmospheric atmosphere are repeated. is there. This means that the lower the degree of vacuum of the lower pores 4 of the vacuum laminating apparatus that employs the conventional lower heat insulating plate 6 without resin coating, the larger the pressurized air pressure of the film body 12,
It can be understood from the lowering. Therefore, the sealing film 22 may be formed only on the lower heat insulating plate 6.

【0012】[0012]

【実施例】本発明の実施例を成形条件と真空度により示
す。試験を行った真空積層装置は、真空室の寸法が51
0×600×5mmであり、断熱板は信越化学工業
(株)のKC-88で樹脂コートし封止した。成形条件は、
加熱温度100℃、真空吸引時間30秒、加圧時間30
秒であり、上気孔3と下気孔4を一の真空ポンプに接続
して吸引した場合のデータを下記に示す。 加圧力(Mpa) 従来の真空度(Torr) 本発明の真空度(Torr) 0.1 1.9 1.3 0.5 2.5 1.5 1.0 3.1 1.7 のような結果となり、極めて顕著な効果を得た。
EXAMPLE An example of the present invention will be shown according to molding conditions and vacuum degree. The vacuum lamination device tested has a vacuum chamber size of 51
It is 0 × 600 × 5 mm, and the heat insulating plate was resin-coated with KC-88 manufactured by Shin-Etsu Chemical Co., Ltd. and sealed. The molding conditions are
Heating temperature 100 ℃, vacuum suction time 30 seconds, pressurization time 30
The data when the upper pores 3 and the lower pores 4 are connected to one vacuum pump and sucked are shown below. Applied pressure (Mpa) Conventional vacuum degree (Torr) Vacuum degree (Torr) of the present invention such as 0.1 1.9 1.3 0.5 0.5 2.5 1.5 1.0 1.0 3.1 1.7 As a result, a very remarkable effect was obtained.

【0013】[0013]

【発明の効果】断熱板を樹脂コートしたことにより、膜
体内部や真空室の真空度が向上して、積層成形品の気泡
などの成形不良が削減でき、積層成形作業の効率向上に
大きく貢献する。
The resin coating of the heat insulating plate improves the degree of vacuum inside the film body and the vacuum chamber, and can reduce molding defects such as bubbles in the laminated molded product, which greatly contributes to the improvement of the efficiency of the laminated molding work. To do.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明を実施する真空積層装置を概略的に示す
縦断面図である。
FIG. 1 is a vertical sectional view schematically showing a vacuum laminating apparatus for carrying out the present invention.

【符号の説明】[Explanation of symbols]

1 ……… 上板 2 ……… 下板 3 ……… 上気孔 4 ……… 下気孔 5 ……… 上断熱板 6 ……… 下断熱板 7,8 ……… ヒータ 9 ……… 中間部材 10 …… 上定盤 11 …… 下定盤 12 …… 膜体 13 …… 枠 14 …… Oリング 15 …… ローラ 16 …… 上搬送膜 17 …… 下搬送膜 18 …… 積層材 19 …… 真空室 20、21 …… 盤体 22 …… 封止膜 1 ……… Upper plate 2 ……… Lower plate 3 ……… Stomach 4 ……… Lower pore 5 ………… Upper heat insulating plate 6 ……… Lower heat insulating plate 7, 8 Heater 9 ………… Intermediate member 10 ... Upper surface plate 11 …… Lower surface plate 12 ... Membrane 13 …… Frame 14 …… O-ring 15 …… Laura 16 …… Top transport film 17 …… Lower carrier film 18 ... Laminated material 19 …… Vacuum chamber 20, 21 …… Board 22 ... Sealing film

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) B29C 43/00 - 43/58 B30B 1/00 - 15/34 B32B 1/00 - 35/00 F16L 59/00 - 59/22 B29C 63/00 - 65/82 ─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. 7 , DB name) B29C 43/00-43/58 B30B 1/00-15/34 B32B 1/00-35/00 F16L 59 / 00-59/22 B29C 63/00-65/82

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 加熱装置と断熱板を備えた一方の盤体
と、枠、膜体、加熱装置及び断熱板を備えた他方の盤体
を圧締して真空室を形成し、積層材を所定温度の真空下
で膜体により加圧成形する真空積層装置において、 断熱板内部の空隙を外部と遮断する封止膜を断熱板の表
面に形成したことを特徴とする真空積層装置。
1. A vacuum chamber is formed by pressing one plate body provided with a heating device and a heat insulating plate and the other plate body provided with a frame, a film body, a heating device and a heat insulating plate to form a laminated material. A vacuum laminating apparatus that press-molds a film under vacuum at a predetermined temperature, wherein a sealing film that blocks a void inside the heat insulating plate from the outside is formed on the surface of the heat insulating plate.
【請求項2】 膜体を有する盤体における断熱板にのみ
封止膜を形成したことを特徴とする請求項1に記載の真
空積層装置。
2. The vacuum laminating apparatus according to claim 1, wherein the sealing film is formed only on the heat insulating plate of the board having the film body.
JP2000074171A 2000-03-16 2000-03-16 Vacuum laminating equipment Expired - Lifetime JP3525211B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000074171A JP3525211B2 (en) 2000-03-16 2000-03-16 Vacuum laminating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000074171A JP3525211B2 (en) 2000-03-16 2000-03-16 Vacuum laminating equipment

Publications (2)

Publication Number Publication Date
JP2001260154A JP2001260154A (en) 2001-09-25
JP3525211B2 true JP3525211B2 (en) 2004-05-10

Family

ID=18592267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000074171A Expired - Lifetime JP3525211B2 (en) 2000-03-16 2000-03-16 Vacuum laminating equipment

Country Status (1)

Country Link
JP (1) JP3525211B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007245438A (en) * 2006-03-15 2007-09-27 Hitachi Plant Technologies Ltd Film sticking method and apparatus
JP4723450B2 (en) * 2006-10-11 2011-07-13 株式会社名機製作所 LAMINATING APPARATUS AND METHOD FOR CONVEYING LAMINATED MATERIAL

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2899130B2 (en) * 1991-05-09 1999-06-02 日立テクノエンジニアリング株式会社 High vacuum hot press
JPH05106782A (en) * 1991-10-15 1993-04-27 Meiki Co Ltd Heat insulating structural body
JP2709371B2 (en) * 1993-11-10 1998-02-04 ニチアス株式会社 Manufacturing method of fiber reinforced plastic insulation
JP3205866B2 (en) * 1997-04-17 2001-09-04 株式会社名機製作所 Vacuum laminating equipment

Also Published As

Publication number Publication date
JP2001260154A (en) 2001-09-25

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