JP3529181B2 - Method for producing aqueous resin dispersion - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [0001] BACKGROUND OF THE INVENTION 1. Field of the Invention
Shows tackiness by drying and elapses of time
Of an aqueous resin dispersion that gives it the property of becoming non-tacky with
This is related to the manufacturing method.
High strength by giving strength and leaving it at room temperature
Water-based resin dispersion that exhibits excellent heat resistance, water resistance, and adhesion
The method relates to a method for producing the same. [0002] 2. Description of the Related Art In recent years, the development of materials that are resource-saving and eco-friendly.
Departure is underway. Among them, solvent-based chloroprene
Replacement of adhesives is being actively pursued. This chloroprene
Adhesive (1) Adhesive strength immediately after solvent drying (contact property)
(2) High adhesiveness due to high crystallinity after curing
And (3) good heat resistance and water resistance.
are doing. The aqueous conversion of the chloroprene adhesive is, for example,
Emulsification of chloroprene rubber and conventional heat
Plastic acrylic emulsion, urethane emulsion
The contact performance and after curing have been improved.
The balance between adhesive strength, heat resistance and water resistance has not been achieved yet
Nothing can be added. [0003] On the other hand, conventional thermoplastic emulsions
Combination with thermosetting epoxy resin, not alone
Due to contact properties, adhesive strength after curing, heat resistance, water resistance
There is an attempt to balance. [0004] However, epoxy
Simply blending resin emulsions will not save
Separation of epoxy resin and remaining polymer components during storage
Used when manufacturing epoxy resin emulsions.
Disadvantage is that large amounts of emulsifiers affect water resistance
there were. On the other hand, for example, JP-A-49-10658
No. 6 reports that emulsion polymerization is carried out in the presence of epoxy resin
Solving the problem. Also, Japanese Patent Application Laid-Open No. 57-115418
In the Bulletin, the terminal of epoxy resin is partially acryloyl group.
Improves the compatibility with the acrylic polymer,
It prevents separation during storage and improves performance. This
These improvements have largely solved the conventional problems.
However, the compositions disclosed in both prior arts
Group and polymer of epoxy resin during storage of solution
-Reaction with carboxyl group derived from carboxylic acid in
The problem that progresses, resulting in reduced adhesive strength after storage
Was included. [0005] [MEANS FOR SOLVING THE PROBLEMS]
For emulsion polymerization of epoxy resin and radical polymerizable monomer
And especially the pH of the aqueous medium at that time.
To the Tg of the film of the obtained aqueous resin dispersion
It was completed by paying attention. That is, the present invention relates to (A)
In the presence of 20 to 60 parts by weight of epoxy resin, (B)
Radical polymerization containing lylic acid and / or methacrylic acid
40 to 80 parts by weight of the water-soluble monomer to adjust the pH of the aqueous medium to 5 to 8
And emulsion polymerization.
The film obtained from the aqueous resin dispersion having a Tg of 10
This is a method for producing an aqueous resin dispersion at -40 ° C. Hereinafter, the present invention will be described in detail. In the present invention
The epoxy resin used is defined as one or more epoxy resins per molecule.
A compound having a oxy group, for example, glycidyl ether
Ters, glycidyl esters, glycidylamines,
Linear aliphatic epoxides, alicyclic epoxides, etc.
No. As glycidyl ethers, aromatic groups
Lysidyl ether and aliphatic glycidyl ether
And aromatic glycidyl ethers such as bisphenol
Diglycidyl ether of phenol, phenol novolak
Of polyglycidyl ether and diphenol of biphenol
Ruether. Diglyci of the bisphenol
For example, bisphenol A, bis
Phenol F, bisphenol AD, bisphenol
S, tetramethylbisphenol A, tetrabromobis
Diglycidyl ethers such as phenol A;
As polyglycidyl ether of phenol novolak
For example, phenol novolak, cresol novolak
Polyglycidides such as brominated phenol novolak
Diglycidyl ester of biphenol
For example, biphenol, tetramethyl bif
And diglycidyl ethers of phenols. Aliphatic
As glycidyl ether, polyethylene glycol
, Polypropylene glycol, glycerin, tetrame
Glycidyl ethers such as tylene glycol;
You. As glycidyl esters, aromatic glycidyl
Esters, alicyclic glycidyl esters and the like.
You. Examples of the aromatic glycidyl ester include phthalic acid
Diglycidyl acids such as acid, terephthalic acid and isophthalic acid
Stell, and as the alicyclic glycidyl ester,
For example, hexahydrophthalic acid, tetrahydrophthalic acid,
Glycidyl esters such as dimer acid are exemplified. The glycidylamines include, for example, tet
Laglycidyl diaminodiphenylmethane, tetraglyci
Zirmetaxylylenediamine, triglycidylaminop
For example. Linear aliphatic epoxides and
For example, epoxidized polybutadiene, epoxidized
Soybean oil, etc. are examples of alicyclic epoxides
For example, 3,4 epoxy-6-methylcyclohexylmethyl
Carboxylate, 3,4 epoxycyclohexylmethyl
And carboxylate. Epoxy resins may be used alone or in two types
More than one kind may be combined. Preferred epoxy resins are
Glycidyl ethers from the viewpoint of heat resistance and water resistance
And more preferably a diglycidyl ester of bisphenol.
And particularly preferably biphenol A, bif
It is a diglycidyl ether of Enol F. Epoxy tree
Epoxy equivalent of fat is in the range of 100-10000
Can be used in the viewpoint of room temperature curability, heat resistance, and water resistance.
Is more preferably 150 to 3000, and still more preferably
Is from 170 to 1,000. In the present invention, acrylic acid and / or methanol
Examples of the radical polymerizable monomer containing lylic acid include a.
An aromatic unsaturated compound, b. α, β-unsaturated monocarboxylic
Alkyl esters of acids, c. Acrylic acid and / or
Combinations of methacrylic acid and the like can be mentioned. Aromatic insatiability
As the sum compound, for example, styrene, α-methylstyrene
And vinyltoluene. α, β-unsaturated
As an alkyl ester of a monocarboxylic acid, for example,
C1-C12 alkyl ester of lylic acid or methacrylic acid
Steal. Of acrylic or methacrylic acid
Examples of the C1-C12 alkyl ester include methyl
Acrylate, ethyl acrylate, propyl acryle
Salt, isopropyl acrylate, butyl acrylate
G, isobutyl acrylate, hexyl acrylate,
Cyclohexyl acrylate, 2-ethylhexyl acrylate
Relate, lauryl acrylate, methyl methacrylate
G, ethyl methacrylate, propyl methacrylate,
Isopropyl acrylate, butyl methacrylate,
Sobutyl methacrylate, hexyl methacrylate,
Clohexyl methacrylate, 2-ethylhexyl methacrylate
Acrylate, lauryl methacrylate, etc.
You. The radical polymerizable monomer is preferably a.
An aromatic unsaturated compound, b. α, β-unsaturated monocarboxylic
Alkyl esters of acids, c. Acrylic acid and / or
A combination of methacrylic acid, wherein a, b, and c are each
May be used alone or in mixtures of two or more.
You may. Preferably, a. As aromatic unsaturated compounds
Is styrene, b. α, β-unsaturated monocarboxylic
Examples of the C1-C12 alkyl ester of an acid include ethyl acetate.
Acrylate, butyl acrylate, 2-ethylhexyl
Acrylate, more preferably butyl acryl
Andc. Acrylic acid and / or methacrylic
As an acidMethacrylic acid. Further, other than the above-mentioned radical polymerizable monomers,
Combine radical polymerizable monomers as needed
Is also good. For example, hydroxyl-containing monomers such as 2-hydro
Xyacrylate, 2-hydroxymethacrylate,
Polyethylene glycol acrylate, amide group-containing mono
Mers such as acrylamide, methacrylamide, methylo
Group-containing monomers such as N-methylolacrylamide
, Dimethylol acrylamide, alkoxymethyl group
Containing monomers such as N-butoxymethylacrylamid
, N-methoxymethylacrylamide, containing epoxy group
Monomers such as glycidyl acrylate and glycidyl
Methacrylate, α, β-ethylenically unsaturated dicarboxylic acid
Mono- or diesters of acids such as maleic acid mono- or
Dibutyl, mono- or dioctyl fumarate, vinyl S
For example, vinyl acetate, vinyl propionate,
Tolyl such as acrylonitrile, methacrylonitrile,
Unsaturated carboxylic acids such as maleic acid, fumaric acid, itako
Acid, olefin such as butadiene, isoprene, chlorine
Containing vinyl monomers such as vinyl chloride and vinylidene chloride
Chloroprene, divinyl monomer such as divinylbenzene
Benzene, polyoxyethylene diacrylate, polyoxy
Examples include ethylene dimethacrylate
You. In the present invention, the epoxy resin and the radical
The ratio with the compatible monomer is 20 to 60% by weight of the epoxy resin.
40 to 80 parts by weight of a radical polymerizable monomer based on parts
It is. If the epoxy resin content is less than 20 parts by weight, heat resistance and resistance
Poor water solubility, and if more than 60 parts by weight, contact
The properties are poor. Preferably 25 to 5 epoxy resins
45 to 75 parts by weight of the radical polymerizable monomer per 5 parts by weight
Parts by weight. The film obtained from the aqueous dispersion of the present invention
Tg is 10-40 ° C. Contour above 10 ° C
Insufficient contact properties and poor adhesive strength.
Insufficient strength. Preferably it is 0-30 degreeC. Departure
The film obtained from Ming is composed of vinyl polymer and uncured epoxy.
A state in which the resin is compatible with the xy resin is preferable. That is,
The Tg of the film is reduced by the
Not only the factors, but also the amount and molecule of the dissolved epoxy resin
It also depends on the amount. For example, the T of the vinyl polymer itself
Even if g is set high, the amount of epoxy resin added is large.
In that case, the Tg of the film decreases due to the plasticizing effect.
You. The reverse is also possible. Therefore, radically polymerizable
The composition ratio of the polymer is determined by the T
It is also set by g. However, Kotank
In terms of heat resistance, heat resistance after curing epoxy resin, and water resistance
Therefore, the optimum range of the radical polymerizable monomer is appropriately determined.
It is. Preferred components of the present invention are: a. Aromatic
A saturated compound, b. C1, α, β-unsaturated monocarboxylic acid
An alkyl ester of -C12, and c. Acrylic acid
The composition ratio of methacrylic acid and / or methacrylic acid is preferably a.
20 to 80% by weight of an aromatic unsaturated compound, b. α, β-
C1-C12 alkyl esters of unsaturated monocarboxylic acids
20 to 80% by weight, c. Acrylic acid and / or
Methacrylic acid is 0.1 to 20% by weight. Tg of the present invention is determined by using a differential scanning calorimeter,
The measurement was performed at a heating rate of 10 ° C./min from 100 ° C. Got
When the inflection point of the data is Tg and there are two or more inflection points
Indicates the inflection point on the high temperature side as Tg. Sump for Tg measurement
Is obtained by drying the aqueous dispersion at room temperature or by heating.
Was used. However, in the case of drying by heating, excessive heating
Tg must be changed as soon as possible because of the change in Tg.
It is important. In the present invention, the emulsion polymerization is carried out by using a conventionally known milk
Polymerization technology, that is, radical polymerizable monomer,
The polymerization is carried out in the presence of a polymerization initiator, water and a surfactant.
You. In the case of the present invention, for example, radical polymerization with epoxy resin
Thorough stirring beforehand at room temperature or under heating.
To dissolve uniformly, add surfactant,
Powder and protective colloid, and water and a radical polymerization initiator.
Instead, a method of polymerizing after forming an emulsified dispersion liquid is exemplified.
In addition to this method, for example, radical polymerization with epoxy resin
A method of separately emulsifying and dispersing a reactive monomer and subjecting it to polymerization,
Radical polymerizable monomer by emulsifying and dispersing only oxy resin
And the like, and a method of directly polymerizing
The addition method can be added together with the emulsified dispersion or separately.
Can also be added. Radical polymerizable monomer during emulsion polymerization
And the epoxy resin may or may not react.
Preferably, it does not react. In the emulsion polymerization of the present invention, the pH in an aqueous medium is adjusted.
It is necessary to adjust to 5-8. For adjusting pH
Is, for example, addition of an alkali component.
Sodium hydrogen, sodium hydrogen carbonate, sodium hydroxide
Inorganic compounds such as ammonia, ammonia, triethyl alcohol
And organic amine compounds such as min. These pH controls
The stabilizer is added so that the emulsion polymerization is maintained at pH 5 to 8.
You. If the pH is less than 5, storage stability is not sufficient, and the pH is
If it exceeds 8, hydrolysis of the monomer and the like are likely to occur.
You. The surfactant used is ionic,
There are nonionic surfactants, and ionic surfactants and
Examples thereof include anionic, cationic and amphoteric. A
Examples of the nonionic surfactant include fatty acids and higher alcohols.
Sulfuric acid ester salt of coal, sulfuric acid ester of liquid fatty oil
Salts, fatty amines and fatty amide sulfates, fats
Phosphates of aliphatic alcohols, dibasic fatty acid esters
Sulfonate, aliphatic amide sulfonate, al
Killallyl sulfonate, formalin condensed naphthalene
Sulfonate and the like, as a cationic surfactant
Are, for example, primary amine salts, secondary amine salts, tertiary amine salts,
Quaternary ammonium salts, pyridinium salts and the like.
As the surfactant, for example, carboxylate type, sulfate sulfate
Ter salt type, sulfonate type, phosphate ester salt, etc.
Can be Nonionic surfactants include, for example,
Siethylene alkyl ether, polyoxyethylene al
Kill phenyl ether, polyoxyethylene alkyl ether
Stele, sorbitan alkyl ester, polyoxyethylene
And rensorbitan alkyl esters. Also
In addition to the non-reactive surfactants listed above,
Surfactants can also be used. With reactive surfactant
In some cases, a molecule has a radical polymerizable functional group
Sulfonic acid group, sulfonate group, sulfonate group,
One or more functional groups selected from sulfonic acid ester bases
Or a radically polymerizable functional group in one molecule
And polyoxyethylene, polyoxypropylene
Polyoxyethylene polyoxypropylene composite ties
With alkyl ether or alcohol
is there. These surfactants can be used alone or in combination of two or more.
You may combine them. Dispersant, protective colloid
As for example polyphosphate, polyacrylate, anhydrous
Maleic acid copolymer salt, polyvinyl alcohol,
Droxyethyl alcohol and the like. As the polymerization initiator, water-soluble and oil-soluble heavy
Co-initiators can be used. Examples of water-soluble polymerization initiators
For example, persulfates, peroxides, water-soluble azobis compounds,
Redox system of oxide-reducing agent and the like, persulfate
As, for example, ammonium persulfate, potassium persulfate,
Sodium persulfate, and the like.
Hydrogen peroxide, t-butyl hydroperoxide, t
-Butyl peroxymaleic acid, succinic peroxide
And the water-soluble azobis compound is, for example, 2,
2'-azobis (N-hydroxyethylisobutylamido
C), 2,2'-azobis (2-amidinopropane) 2
Hydrogen chloride, 4,4'-azobis (4-cyanopentane
Acid) and the like, and a redox system of a peroxide-reducing agent and
For example, sodium hydrogen sulfite, titanium
Sodium osulphate, sodium hydroxymethanesulfinate
Addition of reducing agents such as lium, cuprous salts, and ferrous salts are mentioned.
It is. Examples of oil-soluble polymerization initiators include peroxides and oils.
Soluble azobis compounds and the like, and as the peroxide,
For example, benzoyl peroxide, lauroyl peroxy
And the like. Examples of oil-soluble azobis compounds include
For example, 2,2'-azobisisobutyronitrile, 2,2
2'-azobis-2-methylbutyronitrile, 2,2 '
-Azobis-2,4-dimethylvaleronitrile and the like
Can be T-dodecyl mercaptan, n-dode
Molecular weight control of silmercaptan and low molecular weight halogen compounds
Add stabilizer, plasticizer, organic solvent, etc. before, during and after emulsion polymerization
Can be added. The polymerization temperature is, for example, 0 to 100 ° C.
Particularly preferably 30 to 90 ° C., in an inert atmosphere under normal pressure
Or it is performed under pressure as needed. The aqueous resin dispersion of the present invention is used as it is.
To cure the contained epoxy resin
You may mix | blend a hardening | curing agent as needed. As a curing agent
For example, polyamine type, acid anhydride type, phenol tree
Fat, polymercaptan, Lewis acid complex and the like.
As polyamine-based curing agents, aliphatic polyamines, alicyclic
Polyamine, aromatic polyamine, polyamide, tertiary amine
And aliphatic polyamines such as e.g.
Tylenediamine, diethylenetriamine, triethylene
Tetramine, tetraethylenepentamine and their modifications
Goods and the like. As the alicyclic polyamine, for example,
Isophoronediamine, menthanediamine, N-amino
Tilpiperazine, diaminodicyclohexylmethane
These modified products are exemplified. As aromatic polyamine
Is, for example, m-xylylenediamine, diaminodiphenyl
Methane, m-phenylenediamine, diaminodiphenyl
And sulfones and modified products thereof. Polyamide
For example, a dicarboxylic acid such as dimer acid and
And condensed products with liamine. As tertiary amine
Is, for example, dimethylbenzylamine, 2,4,6-tri
Tertiary amino groups such as dimethylaminomethylphenol
Containing compounds, their modified products, imidazole,
Tilimidazole, 2-ethyl-4-methylimidazo
And imidazole compounds such as 2-phenylimidazole
And modified products thereof. Other polyamines
Dicyandiimide, adipic dihydrazide, etc.
Is mentioned. Acid anhydrides are, for example, monofunctional
Phthalic anhydride, tetrahydrophthalic anhydride,
Sahydrophthalic acid, methyltetrahydrophthalic anhydride,
Methyl hexahydrophthalic anhydride and their modified products are listed.
Pyromellitic anhydride,
Examples include zophenone tetracarboxylic acid and modified products thereof.
It is. As a phenolic resin, for example, a novolak type
Phenol resin, resol type phenol resin, etc.
As a polymercaptan, for example, thioglyco
Condensates and polysulfides of oleic acid and polyhydric alcohols
And the like. Examples of Lewis acid complexes include trifluoride
Examples include amine complexes of boron. These curing agents
May be used alone or in combination of two or more. Preferably
Is a polyamine-based curing agent. Addition of polyamine curing agent
The added amount is preferably equivalent to the contained epoxy group.
Good. When the aqueous resin dispersion of the present invention is used,
Even with polyamine-based curing agents with high
It will not be compromised. The aqueous resin dispersion of the present invention is prepared by using a curing agent.
When cured, for example when applied as an adhesive
The two may be mixed before application to the body, and one
Apply the aqueous resin dispersion of the present invention to the
Apply a curing agent to the adherend and superpose the applied surfaces of both adherends
And mixing. Especially the latter
The law has the advantage that the pot life can be extended. The aqueous resin dispersion of the present invention can be cured at room temperature or at room temperature.
After the water is volatilized by heating, the curing may proceed at room temperature.
Alternatively, the curing may be advanced by heating. In addition, the water
Laminate adherends without scattering and harden at room temperature or by heating
You may proceed with the conversion. Necessary for the aqueous resin dispersion of the present invention
If necessary, a tackifier or rubber component may be added.
Examples of tackifiers include rosin and rosin
Natural type such as conductor type, terpene resin type, terpene derivative type
Tackifier, petroleum resin, styrene resin,
Malon indene resin, phenol resin, xylene
Fatty and other synthetic tackifiers. this
These tackifiers can be added in the form of an aqueous dispersion or an aqueous solution.
Preferably. As the rubber component, for example, liquid nitrite
Ril rubber, silicon rubber, and the like are included. Also curable
Melamine resin, urea resin,
Amino resin such as benzoguanamine resin may be added.
No. Also, disinfectant, preservative, defoamer, plasticizer, pH adjustment
An agent may be added. The aqueous resin dispersion of the present invention can be used as an adhesive,
Agents, paints, printing inks, gas barrier packaging materials
Use for materials, processed paper, textile processing agents, building materials, etc.
Can be. Adhesives include, for example, wood, plywood,
Metal board, gypsum board, iron, aluminum and other metals, plastic
Stick film, plastic foam, plastic
Cloth, leather, cotton, linen cloth, glass fiber, glass
Adhesive such as cloth or FRP. As an adhesive field
Examples include tapes, labels, wallpaper, flooring, etc.
In the field of materials, for example, concrete, wood, metal,
Polishes and the like, and as a fiber processing agent, for example,
Non-woven fabric, carpet, electric flocking cloth, laminated cloth, tire coat
And building materials, for example, sealing
Materials, latex cement, waterproofing materials and the like. [0026] Embodiments of the present invention will be described below. In addition,
Parts are by weight unless otherwise specified. [0027] Examples 1 to 12 and Comparative Examples 1 to 5 (1) Emulsion adjustment (Adjustment of emulsions of Examples 1 to 12)
100 parts mixture of dical polymerizable monomer and epoxy resin
And Emulgen 950 (Polyoxyethylene manufactured by Kao Corporation)
8 parts of a 25% aqueous solution of lennonylphenyl ether)
Benol WZ (Kao Corporation polyoxyethylene noni)
25% aqueous solution of
Parts, ammonium persulfate 0.2 parts, distilled water 43 parts
The mixture was stirred with a homomixer to prepare a pre-emulsion.
Sodium hydroxide was added to the pre-emulsion so that the pH became 7.
A 10% aqueous solution of the solution was added. Separate flask with stirrer
40 parts of distilled water and 2 parts of 25% aqueous solution of Emulgen 950
And heated to 80 ° C.,
A part of which is dissolved in 5 parts of water is added. In addition,
The emulsion is dropped continuously over 4 hours. After that,
Add 0.05 part of ammonium dissolved in 5 parts of water
Then, polymerization was continued at the same temperature for 1 hour. After that, keep it below 30 ° C
And an emulsion having a solid content of 50% was obtained. After polymerization
And the Tg of the emulsion after drying are shown in Table 1.
Shown. (Emulsion Adjustment of Comparative Examples 1 to 5) Table
Mixing of radical polymerizable monomer and epoxy resin shown in 2
The emulsion was subjected to emulsion polymerization in the same manner as in
I got it. Viscosity after polymerization, and after emulsion drying
Tg is also shown in Table 2. Comparative Example 5 shows the pH of the pre-emulsion.
The polymerization was carried out without adjusting the pH to 7, and the pH was adjusted to 7 after the polymerization.
Was. The pH of the pre-emulsion was 4. (2) Evaluation method and evaluation result a. Formulation with curing agent To the emulsions obtained in Examples 1 to 12 and Comparative Examples 1 to 5
Commercially available curing agent Ancamine 2075 (ACI Japan
Modified alicyclic polyamine made by Limited Limited
40 phr), ancamine 1769
(Modified aliphatic poly manufactured by ACI Japan Limited)
Amine added amount 25 phr to epoxy resin), 2
-Methylimidazole (addition amount 5 to epoxy resin)
phr) at the ratios shown in Tables 3 and 4 and mixed.
Obtained. B. Evaluation of adhesion performance Evaluation of the adhesion performance of the above compounded products by the method shown below
Was. The results are shown in Tables 5 and 6. Coating and bonding After adjusting the viscosity of the compound to 5000 cps with a thickener,
Plywood and 1 inch wide 9 using wire bar # 75
Apply to No. canvas and dry at 20 ° C. for 20 minutes. So
After laminating the dried surface of the product, 4.5kg
The roller was reciprocated twice. Initial bond strength Use a sample that has been stuck and left at 20 ° C for 1 hour
180 degrees peel strength with Tensilon tensile tester
It was measured. 2.0kg / inch or more is judged to be acceptable
You. The pulling speed was 50 mm / min. Bond strength after curing Using a sample that was left at 20 ° C for 7 days after lamination,
Measure 180 ° peel strength with Tensilon tensile tester
did. 4.0 kg / inch or more is judged to be acceptable. Pull
The tension speed was 50 mm / min. Heat resistance After bonding, the sample left at 20 ° C for 7 days
Under an atmosphere of ° C, pull a 200g weight in the 90 ° direction,
Pass if the weight does not drop after standing for 24 hours
In the case of, it was judged as failed. Weight is attached to the canvas side
Was. c. Storage stability evaluation Leave the emulsion alone in a 50 ° C oven for 2 weeks,
The initial adhesive strength after standing was measured. Table 7 shows the results.
If the rate of change of the initial adhesive strength before and after standing is 80% or more, it passes.
judge. [0032] [Table 1] [0033] [Table 2][0034] [Table 3] [0035] [Table 4] [0036] [Table 5][0037] [Table 6] [0038] [Table 7] [0039] The aqueous resin dispersion obtained from the present invention
Means that the pH during the emulsion polymerization was adjusted to 5-8,
There is no change during and no change in adhesive strength before and after storage. Ma
Emulsion by combining with conventional epoxy resin
Better compatibility than
And curing with epoxy resin proceeds smoothly
Therefore, it has the same performance as the solvent-based chloroprene adhesive.

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Claims (1)

(57) Claims: (A) In the presence of 20 to 60 parts by weight of an epoxy resin, (B) 40 to 80 parts by weight of a radical polymerizable monomer containing acrylic acid and / or methacrylic acid The method for producing an aqueous resin dispersion wherein the Tg of a film obtained from the aqueous resin dispersion is 10 to -40 ° C, wherein the pH of the aqueous medium is adjusted to 5 to 8 and emulsion polymerization is carried out. .