JP3529554B2 - Manufacturing method of electronic device - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a method for manufacturing an electronic device.

[0002]

2. Description of the Related Art As an example of an electric component using an electronic element, there is a contact type thin film magnetic head 41 as shown in FIG. The magnetic head 41 is formed by joining the magnetic head element 30, which is an electronic element, to the support beam 36f. The magnetic head element 30 is manufactured as follows. FIG. 4 (A)
As shown in FIG. 3, the element plate 1 is formed by forming the element layer 4 on the substrate 2 with the separation layer 3 interposed therebetween. In the element layer 4, a large number of element elements 5 are arranged vertically and horizontally. The head element 30 is formed by subjecting the element plate 1 to the following first to fifth steps. In the first step, as shown in FIG. 4B, the element plate 1 is cut into a large number of strips 43 by, for example, laser scribing means. Each strip 43 includes a large number of element elements 5 in a column. In the strip body 43 cut into strips in the first step, the element element 5
We must separate each other with high precision. Therefore, the following 2nd-5th processes must be performed. That is, as a second step, as shown in FIG. 4C, the large number of strips 43 are put in an etching tank, and the separation layer 3 of each strip 43 is etched to remove strips 44 from the substrate 2, respectively. Separate. In this case, each strip 44 is in a state where a large number of element elements 5 are continuously arranged. Next, as a third step, in order to separate the element elements 5 in the strip piece 44 from each other with high accuracy, a large number of these element elements 5 are correctly arranged. That is, as shown in FIG. 4D, the strip piece 44 is correctly attached to a predetermined holding plate 45 by using an adhesive wax 46. Next, as a fourth step, the element elements 5 in the strip 44 are cut into a large number of electronic elements 30 by a laser scribing method. A solid line 47 indicates a portion where the division has been completed, and an imaginary line 48 indicates a portion where the division is to be performed. After the cutting, as a fifth step, each electronic element 30 is separated from the holding plate 45.

The electronic element 30 is separated from the holding plate 45, for example, as follows. As shown in FIG. 4 (E), a large number of support beams 36f which are continuous in a comb shape are respectively arranged along the electronic element 30 and are joined together. Next, the wax 46 is loosened by heating, and the supporting beam 36f is separated from the holding plate 45, so that the electronic elements 30 bonded to each of them are held by the holding plate 45.
Separate from above.

[0004]

In this conventional method of manufacturing an electronic device, the cutting of the first step must be followed by the cutting of the fourth step to the second to fifth steps. However, there is a problem that a lot of work is required.

Further, in the above conventional manufacturing method, FIG.
As shown in FIG. 3, the melt 21f of the substrate 2, the separation layer 3, the element layer 4, etc., which is generated during the cutting by the laser scribing, adheres to the surface 7 of the element layer 4 in a swelling manner, for example, or the melt is cut. The powder 22f is scattered and adheres to the surface 7. The melt 21f and the cutting powder 22f cause the following problems. For example, when the surface 7 is a surface of the magnetic head element facing the magnetic disk, when the finished magnetic head is used, the melt 21f in the raised state and the adhering chips 22f are There is a problem that the contact between the contact pad 8 provided on the facing surface 7 and the magnetic disk is obstructed.
When the surface 7 is a joint surface with the support beam 36f,
When the magnetic head element 30 and the support beam 36f are joined, there is a problem that the melt 21f and the cutting powder 22f impede the joining of the connection pad provided on the surface 7 and the conductive path in the support beam 36f. there were.

Further, in the above conventional manufacturing method, the holding plate is used.
The strips 44 must be firmly glued with wax 46 in order to properly align and cut the multiple element elements 5 on the 45. Therefore, when separating some of the electronic elements 30 from the holding plate 45 in the fifth step, the wax 46 must be loosened, and then the other electronic elements 30 remaining on the holding plate 45 are loosened. Due to the wax 46, the arrangement is disturbed as shown in (F). The electronic elements 30 whose arrangement is disturbed become unusable because it is difficult to bond them to the new supporting beam 36f. This has been a problem that deteriorates the yield of the electronic device 30.

The method of manufacturing an electronic device of the present application is provided to solve the above-mentioned problems of the prior art. The purpose is to perform a step of forming a groove in the element plate in one direction and a direction intersecting with the element plate, and then to perform a step of separating the substrate and the element element once so that all the element elements are mutually isolated. It is an object of the present invention to provide a manufacturing method capable of making a separable state. A further object is a manufacturing method capable of performing a step of forming a large number of grooves in one direction on an element plate, and subsequently performing a step of forming a large number of grooves in a direction intersecting with the element plate. Is to provide. Even if a groove is formed in each of the one direction and the direction intersecting with that direction, by increasing the depth of the groove formed in one direction, the etching liquid is applied to the adhesive layer from the groove. Let it reach
It is to be able to quickly separate the element elements from the substrate. As described above, the object of the present invention is to provide the third step in the case of cutting the element elements in one direction and then cutting the element elements in the other direction that intersects with the prior art, as compared with the prior art. It is an object of the present invention to provide a simple manufacturing method that saves labor such as the (adhesion step) and the fifth step (separation step). Another object is to provide a manufacturing method capable of preventing a melted material or cutting powder generated at the time of cutting from adhering to the element surface. Another object is to provide a manufacturing method capable of obtaining a large number of electronic devices in a form that can be used with high yield. Other objects and advantages will be readily apparent from the drawings and the following description related thereto.

[0008]

In order to achieve the above object, a method of manufacturing an electronic device according to the present invention comprises a substrate for supporting an device layer and a substrate formed on the substrate and separated by being dissolved by an etching solution. For an element plate composed of an adhesive layer having a function as a layer and an element layer formed on the adhesive layer and having a large number of element elements arranged vertically and horizontally,
A large number of electronic elements are manufactured from the element plate by performing a cutting step for separating the element elements from each other and a step of dissolving the adhesive layer with an etching solution for separating the substrate and the element elements. In the method of manufacturing an electronic element, the cutting step includes a plurality of through-grooves having a depth that allows the etching solution to reach the adhesive layer from the surface of the element layer to the adhesive layer on the element plate. It consists of a process of forming parallel stripes, and a process of forming a plurality of semi-cut grooves with a depth that can stay in the middle of the thickness of the element layer and prevent the element elements from being separated from each other so as to intersect the through groove. The step of melting the adhesive layer is a step of melting the adhesive layer by allowing an etching solution to reach the adhesive layer through the through groove, and after the melting step, the element elements separated from the substrate are separated into It is intended to produce a large number of electronic devices by dividing the groove.

[0009]

DETAILED DESCRIPTION OF THE INVENTION The drawings showing the embodiments of the present invention will be described below. In FIGS. 1A and 1B, reference numeral 1 denotes an element plate which is a source for manufacturing a large number of electronic elements. The electronic element may be a magnetic head element in a contact type magnetic head or another sensor, but the magnetic head element will be described here as an example. The element plate 1 has a diameter of, for example, about 6 inches,
It is composed of members indicated by reference numerals 2 to 4. Reference numeral 2 is a substrate for supporting the element layer, which is for supporting the element layer 4 having a very small thickness as compared with the area so as not to be damaged. As the substrate 2, for example, a ceramic substrate having a strength capable of supporting the element layer is used. Denoted at 3 is a separation layer formed on the substrate 2 for integrally bonding the substrate 2 and the element layer in a state where they can be separated by an etching means, and is also called an adhesive layer. The separation layer 3 is formed of a material having a property of being dissolved by an etching solution, such as copper. An element layer 4 is formed on the adhesive layer 3 and has a large number of element elements 5 arranged vertically and horizontally. The element elements 5 become individual electronic elements by being separated from each other as described later. Each element element 5 has a configuration in which the element body is embedded in the mother body or partially exposed. The base is made of ceramic, for example. The element body is a main body portion that performs magnetic and electrical operations in an electronic element, and is composed of a magnetic body such as a core and a yoke and a conductor such as a coil and a lead wire. These element elements 5 are arranged vertically and horizontally in order so that they can be separated into a large number of elements by cutting the cells vertically and horizontally. In the element layer 4, the above-mentioned mother bodies are continuously arranged to form a mother body layer, and the element bodies are arranged vertically and horizontally in the mother body layer. The element layer 4 as described above is formed by using, for example, a thin film forming technique, and the base layer is a type in which ceramic thin films are laminated, and the element body is incorporated therein with a shape having a head function. Has been. The thickness of the element layer 4 is, for example, about 50 μm. Reference numeral 7 indicates the surface of the element layer 4. The surface 7 is a surface of the magnetic head element that faces the magnetic disk, for example, and a contact pad 8 for reading and writing data from and to the magnetic disk in each element element 5 is provided in the exposed state. ing. The contact pad 8 is formed of a hard carbon film formed by a discharge chemical vapor deposition method under a carbon-based gas in the above thin film forming technique. The surface 7 may be the surface on the other side of the magnetic head element, for example, on the side where the support beam is joined.

A large number of electronic elements are manufactured by applying the following means to the above element plate.
As shown in FIG. 1C, first, the surface 7 of the element layer 4 is formed.
Then, the protective layer 9 is formed. The protective layer 9 is provided to prevent adhesion of unwanted substances to the surface 7, and is provided so as to cover the entire surface 7 and fill up the irregularities therein, for example, the contact pad 8. A photoresist, for example, is used as a material for the protective layer 9, and is coated on the entire surface 7 by means of spin coating, and is cured in an electric furnace.
The thickness of the protective layer 9 may be sufficient to prevent the attachment of unwanted matter to the surface 7, and is, for example, about 10 μm.

Next, as shown in (D) to (H) of FIG.
The element plate 1 is subjected to a cutting step for separating the element elements 5 from each other. This step is performed by loading the element plate 1 into a device for cutting. Cutting can be done by means of laser scribing, machine slicing, etc.,
Since it is easy to properly form the narrow groove, for example, laser scribe means is used. In the cutting step, a step of forming a sheet element dividing groove 11 described below on the element plate 1, a step of forming a strip element dividing groove 13, and a step of forming an element element dividing groove 17, And a step of forming the disconnecting groove 18 of the connecting portion.

The sheet element dividing groove 11 is for dividing the element layer 4 into a plurality of sheet elements 12, 12, ... The sheet element 12 becomes an element sheet 25 (see FIG. 2) by performing an etching process described later, and its size is set so that the element sheet 25 having a size suitable for handling can be obtained. The sheet element dividing groove 11 is formed as a through groove in order to obtain the individual element sheets 25.
The through groove is for dividing the element layer 4 from each other on both sides of the groove, and for allowing the etching solution to reach the adhesive layer 3 from the surface of the element layer 4. The depth of the through-groove is such that it reaches the adhesive layer 3 from the surface 7 of the element layer 4 through the protective layer 9 as shown in FIG. Form.

The strip element dividing groove 13 is for dividing the sheet element 12 into a plurality of strip elements 14 arranged in parallel with each other, and for the purpose of such division, the strip element dividing groove 13 is provided.
Are formed in parallel. The strip elements 14 are each formed by grouping a large number of element elements 5 in the area of the sheet element 12 into strip-shaped groups. Each strip element 14 includes a large number (for example, about 50) of element elements 5 arranged in one row. The dimensions of the strip element 14 are, for example, about 1 mm in width and 50 mm in length. The strip element dividing grooves 13 as described above are formed at the boundary positions between the element elements 5. The distance D1 between the adjacent strip element division grooves 13 is the same as the width W1 of one element element 5. The length of each strip element division groove 13 is shown in FIG. 1 so that the strip elements 14 can be connected to each other when the sheet element 12 becomes the element sheet 25.
As shown in (E), the length is formed such that the groove-free portion 15 remains between the end 13a of the strip element division groove 13 and the sheet element division groove 11. The grooveless portion 15 functions as a connecting portion for keeping the connected state of the strip elements 14. In the peripheral sheet element 12 in the element layer 4, the strip element division groove 13 is formed between the strip element 14 and the peripheral edge of the element layer 4 in order to keep the strip elements 14 connected to each other in the same manner as described above. It is formed to have a length where a part without a mark remains. The strip element dividing groove 13 is formed as a through groove in order to completely separate the element element 5 between the strip elements 14.

The element element dividing groove 17 is for dividing the element elements 5 in each strip element 14 in the sheet element 12 from each other, and for the purpose of such division, the element element dividing groove 17 is described above. Plural strips are formed in a state intersecting with the through groove. In the case of this example in which a large number of element elements 5 are arranged vertically and horizontally in order to separate the element elements 5 from each other, the intersecting state is a state orthogonal to the strip element dividing groove 13. . The element element dividing groove 17 is provided in the adjacent element element 5
It is formed at the boundary position between the element elements 5 for the purpose of the mutual division. The distance D2 between the adjacent element element division grooves 17 is the same as the length L1 of one element element 5. The length of the element element dividing groove 17 is formed to reach the peripheral edge of the element layer 4 in order to divide the element elements 5 in all the strip elements 14. The element element dividing groove 17 is formed as a half cut groove in order to prevent the element elements from being separated from each other. A half-cut groove is used when the element elements 5 are separated from the substrate 2 and the element elements 5 on both sides of the half-cut groove are kept connected to each other, and the adjacent element elements 5 are to be separated by breakage due to application of an external force. Is for specifying the breaking position to a predetermined fixed position (position where the half cut groove is formed). As shown in FIG. 1H, such a half-cut groove is formed through the protective layer 9 to a depth that remains from the surface 7 of the element layer 4 to the middle of the thickness of the element layer 4.

The disconnecting groove 18 of the connecting portion is for disconnecting the connecting portion 15 connecting the strip elements 14 to each other, and for such purpose, the disconnecting groove 18 is the end portion 13a of the strip element dividing groove 13. The element layers 4 are formed so as to reach the peripheral edge of the element layer 4 while being connected to each other. The separation groove 18 is a device sheet.
In the state of 25, the connecting portion 15 exists and is formed as a half cut groove so that the connecting state of the strip elements 14 is maintained.

The through grooves 11 and 13 and the half cut grooves 17 and 18 are formed through the protective layer 9. Therefore, as shown in FIG. 1 (G), the melt 21 generated by the formation of the grooves 11, 13, 17, 18 adheres to the wall surfaces on both sides of the groove in the protective layer 9 and scatters. The cut chips 22 adhere to the upper surface of the protective layer 9.

The grooves 11, 13, 17, and 18 are formed by converting the fundamental wavelength of the YAG laser of 1.066 μm to 0.266 μm by using a wavelength conversion element, and by using a convex lens of 25 μm.
It is performed by scribing from above the protective layer 9 with the laser beam focused on. The part that scribes is a ceramic matrix that is unrelated to the head function. The sheet element dividing groove 11 and the strip element dividing groove 13 are formed by programming the stage on which the element plate 1 is installed in the above cutting device so as to draw the pattern of the sheet element 12 by NC control, and processing the through groove. For example, the laser power 40
It is performed under the conditions of 0 mW / cm ² and a stage operating speed of 100 mm / min. The grooves 17 and 18 are similarly formed by programming the connection pattern of the element elements 5 and processing them into half-cut grooves. The processing is performed, for example, under the conditions of 200 mW / cm ² and 200 mm / min. The steps of forming the grooves 11, 13, 17 and 18 are as follows.
Once the element plate 1 has been loaded into the cutting device, it may be carried out as it is, and they may be formed in any order.

Next, in order to separate the substrate 2 from the element elements 5, a step of dissolving the adhesive layer 3 with an etching solution to separate a large number of element elements 5 from the substrate 2 is performed. The dissolution of the adhesive layer 3 with the etching solution can be performed by immersing the element plate 1 in an acidic etching solution 24 (for example, nitric acid) in the etching bath 23 as shown in FIG. In this case, in the immersed state, as shown by an arrow 26 in FIG. 2B, the etching solution is passed through the element layer through the through grooves such as the sheet element dividing groove 11 and the strip element dividing groove 13 at various places in the element plate 1. The adhesive layer 3 is reached from the surface 7 of 4. Therefore,
The adhesive layer 3 is simultaneously melted from the element plate 1 at various places where the sheet element dividing groove 11 and the strip element dividing groove 13 are provided. As a result, the entire adhesive layer 3 is dissolved in a short time, and the substrate 2 and the element element 5 can be separated in a short time. In the above case, nitric acid does not reach the separation layer 3 in the half-cut groove portion. Further, since the ceramic thin film that is the base of the head is not attacked by the etching solution, the original shape can be maintained. By the above etching, the plurality of sheet elements 12 on the element plate 1 are separated from the substrate 2, respectively, and become the element sheet 25 as shown in FIG. In the element sheet 25, the strip element dividing groove 13 is a cut 13 'that penetrates from the front surface to the back surface of the element sheet 25. And each strip element 14
Is a connection element in which a plurality of element elements 5 are connected in one row via the element division grooves 17. The element sheet 25 obtained after the above etching is rinsed with pure water and dried, and then moved to the next step.

Next, the protective layer 9 covering the element layer 4 is removed. When the protective layer 9 is removed, the melt 21 and chips 22 attached to it are also removed. The protective layer 9 is removed by using a solvent suitable for the material used for the protective layer 9.

Next, the element sheet 5 separated from the substrate 2 is divided in the half cut groove 17 to form an element sheet.
Obtain a large number of electronic devices from 25. The above-mentioned division is performed as follows, for example, in order to prevent a plurality of electronic elements from being separated and to obtain them in a state where they are arranged in one row. First, a large number of element elements 5 on the element sheet 25 are held by a holder 31 as shown in FIG. Holder 31
In order to be able to hold these element elements 5 without misalignment with each other, it is possible to use, for example, those which are sucked and held by vacuum. In the state of being held by the holding tool 31, first, the element sheet 25 is broken along the disconnecting groove 18 at the position shown by reference numeral 27 in FIG. 2C, and the plurality of strip elements 14 are connected to each other at their one ends 14a. Remove the connecting piece 28 that was used. In this state, the strip elements 14 arranged in parallel have their other ends 14b.
, The element elements 5 and the element dividing grooves 17 in each strip element 14 are accurately aligned in a line by a connecting piece 28 'different from the above. Next, at the end of each strip element 14, a plurality of element elements 5 arranged in the direction of the arrow 34 (the row of the element elements 5 in the strip element 14 is called one line, Element element 5
This arrangement is referred to as one row in the present specification) is held by another holding tool 32. As the holder 32, a holder that sucks and holds by vacuum is preferably used for the same reason as the holder 31. Then, the plurality of element elements 5 held by the holder 32 are connected to the element dividing groove 17 at the position indicated by the arrow 29.
In, a plurality of strip-shaped elements 14 arranged in parallel are divided. As a result, a plurality of electronic elements arranged in a line are obtained on the holder 32. The division in the element division groove 17 causes breakage at the position of the element division groove 17 by applying a mechanical force such as pressure or vibration to the element elements 5 arranged in one row as shown by an arrow 33. You can do it.

Next, a plurality of electronic devices obtained as described above
Use of 30 is performed as follows, for example. Above holder 32
In the present embodiment, the upper surface of the upper electronic element is the disk facing surface. For this reason, the electronic device of FIG. 2 is provided with a bonding surface provided with a connection pad and adapted to bond with the supporting beam as an upper surface.
As shown in FIG. 5, the holder 35 is replaced by another holder 35. The above 1
When holding the element elements 5 in the row when the element elements 5 in the row are divided, this holding change is not necessary when the joining surface is the upper surface. Next, as shown in (F) and (G) of FIG. 2, joining of the electronic elements 30 on the holder 35 in order from the one located at the end thereof (the electronic elements 30 at other positions may be used). By joining the supporting beam 36 with the supporting beam 36 on the surface and separating the supporting beam 36 from the holder 35, the element element 30 that has completed the joining is held by the holder 35.
Separate from. In this case, the electronic element 30 by the holder 35
When the adsorption is not performed or is weak, the electronic element 30 to be separated may be separated from the holder 35 as it is.
Further, when the electronic element 30 is strongly attracted by the holder 35, the vacuum attraction of the electronic element 30 to be separated may be released or loosened. The joining is performed by a known method such as soldering or bonding. When the electronic element 30 is used as described above, it is not necessary to loosen the holding of the electronic element 30 remaining on the holder 35, so the holder 35
There is no position disturbance with respect to. Therefore, by bringing the support beam 36 to the holder 35 at predetermined positions in sequence, proper bonding with the electronic elements 30 can be repeated one after another. When all the electronic elements 30 on the holder 35 have been removed, the steps from the break in the element dividing groove 17 are repeated. In addition, the bonding with the supporting beams may be performed by simultaneously preparing a plurality of supporting beams and bonding the electronic element 30 to each of them.

In the means for forming the pattern of the element sheet 25 by using the laser scribing and NC programming stage control as described above, the dimension and shape of the element sheet 25 can be freely adjusted according to the dimension design of the head element as an electronic element. Can be changed according to the density of head elements formed on the substrate. In addition, the act of handling the element elements by the element sheet 25, that is, the sheet-shaped head element group, not only improves workability but also prevents damage and leads to improvement in yield. Furthermore, the method of individualizing the electronic elements by dividing the half-cut groove 17 enables a large-scale batch processing and also enables the subsequent bonding step to be performed by repeating the same method, thereby improving workability and yield. Bring

[0023]

As described above, according to the present invention, when manufacturing the electronic element 30, the step of forming the groove 13 in one direction on the element plate 1 and the groove 17 in the direction intersecting with the step. Since the step of forming can be continuously performed, and further, the step of separating the substrate 2 and the element element 5 can be performed once so that all the element elements 5 can be separated from each other. However, there is an operational effect that the manufacturing can be performed with less labor. Moreover, in the case of forming the above-mentioned grooves 13 and 17,
Since the depth of the groove 13 formed in one direction is deepened,
In the step of melting the adhesive layer 3, there is also an effect that the etching liquid can reach the adhesive layer 3 from the groove 13 described above, and the element element 5 can be quickly separated from the substrate 2.
Further, in the case of forming the grooves 13 and 17, the protective layer 9 is previously provided on the element layer 4, and the melt 21 and the cutting powder 22 at the time of forming the groove are formed.
Is adhered to the protective layer 9, the melt 21 and the cutting powder 22 can be removed together with the protective layer 9 by removing the protective layer 9 after the cutting step. As a result, an electronic device without adhesion of the melt 21 and the cutting chips 22
There is an effect that you can get 30. This has the advantage that it is possible to obtain a magnetic head element that is less likely to cause problems such as poor contact with the magnetic disk and poor bonding with the support beam. Further, the present invention has a feature that a large number of electronic elements 30 can be obtained in a state where they are all divided and arranged in a line. Therefore, when they are sequentially used, for example, when they are sequentially joined to the support beam to be removed, the remaining electronic elements 30 are not affected (the remaining electronic elements 30 Therefore, there is an advantage that electronic devices can be used with a high yield.

[Brief description of drawings]

FIG. 1A to FIG. 1H are views for explaining a process of cutting an element plate in a process of manufacturing an electronic element from the element plate, and among these, (F) is a cross-sectional view of 1F-1F position in (E) (hatching is omitted to avoid congestion in the drawing).

2A to 2G are views for explaining steps from etching to taking out an electronic element.

FIG. 3 is a view showing a contact type thin film magnetic head.

FIGS. 4A to 4G are views for explaining a conventional manufacturing process of an electronic element.

[Explanation of symbols]

1 element plate 2 substrates 3 separation layers 4 element layers 9 Protective layer 13 through groove 17 Half cut groove

─────────────────────────────────────────────────── --- Continuation of the front page (56) Reference JP-A-7-85421 (JP, A) JP-A-7-129925 (JP, A) JP-A-8-64556 (JP, A) JP-A-6- 224298 (JP, A) JP-A-5-266449 (JP, A) JP-A-6-162439 (JP, A) JP-A-6-150250 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) G11B 5/31 H01L 21/306

Claims (3)

(57) [Claims] 1. A substrate for supporting an element layer, an adhesive layer formed on the substrate and having a function as a separation layer by being dissolved by an etching solution, and a large number of elements formed on the adhesive layer. For an element plate composed of element layers formed by arranging elements vertically and horizontally, a cutting step for separating the element elements from each other, and an adhesive layer formed by an etching solution for separating the substrate and the element elements. In the method of manufacturing an electronic element for manufacturing a large number of electronic elements from the element plate by performing a step of melting, the cutting step, the element plate, from the surface of the element layer to reach the adhesive layer. A step of forming a plurality of parallel through grooves having a depth that allows the etching solution to reach from the surface of the element layer to the adhesive layer, and a depth that can prevent the element elements from being separated from each other by staying in the middle of the thickness of the element layer. Half cut groove above The step of forming a plurality of lines in a state intersecting with the through groove, the step of melting the adhesive layer is a step of melting the adhesive layer by allowing an etching solution to reach the adhesive layer through the through groove, and the step of melting After that, a large number of electronic elements are manufactured by dividing the element elements separated from the substrate in the half cut grooves. 2. A protective layer is formed on the surface of the element layer before the formation of the through-groove and the half-cut groove, and the through-groove and the half-cut groove are formed through the protective layer, thereby forming the grooves. 2. The method for manufacturing an electronic element according to claim 1, wherein the melt and the cutting dust generated together are attached to the protective layer. 3. The plurality of element elements, wherein a plurality of strip elements each having a plurality of element elements connected to each other through a half-cut groove are parallel to each other and are connected to each other at least at one end thereof. 2. The electronic element according to claim 1, wherein the electronic element is separated from the substrate in a state where the plurality of electronic elements are arranged in a line by separating the plurality of electronic elements from each other in a parallel state. Production method.