JP3530144B2 - Flexible IC module and manufacturing method thereof - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible IC module which is a base of an information carrier such as a non-contact type IC card and a manufacturing method thereof.

[0002]

2. Description of the Related Art Non-contact type information carriers such as non-contact type IC cards are being considered for use as substitutes for commuter passes, driver's licenses, telephone cards, cash cards, etc., and are expected to be used in large quantities. Therefore, how to simplify the manufacturing process and reduce the unit price is one of the most important technical issues.

Conventionally, as a method of manufacturing a non-contact type IC card, a reinforcing member made of glass fiber or the like is provided with a cut-out hole, and an IC chip and a coil which is a non-contact signal transmission means are provided in the cut-out hole. A method is known in which the substrate is housed, then the inside of the cutout hole is sealed with a resin to form a base, and finally a cover sheet is attached to the front and back surfaces of the base to obtain a required non-contact type IC card. ing.

According to this method, by adjusting the size of the cutout hole to an appropriate size in accordance with the size of the coil, it is possible to manufacture a non-contact type IC card in which the setting position of the coil with respect to the base body is accurately regulated. Therefore, it is possible to efficiently receive and transmit electric power and signals with external devices.

As another manufacturing method, for example, NIKKEI
As described in MECHANICAL 1997.1.6 no.497, pages 16 to 17, etc., a first resin sheet to which an IC chip and a coil which is a non-contact data transmission means are adhered, and these IC chips and A second resin sheet having no coil is attached to each of facing portions of a fixed mold and a movable mold of an injection molding machine, and after matching the molds, the cavity is filled with the resin, and the first and second resins are formed. A method of obtaining a non-contact type IC card in which a sheet, an IC chip and a coil are integrated by a filling resin has been proposed.

According to this method, a non-contact type IC card having a resin sheet (cover sheet) adhered to the front surface and the back surface can be obtained by injection molding, so that the base body in which the IC chip and the coil are embedded is made of resin. As compared with the conventional manufacturing method in which the cover sheet is adhered to the front and back surfaces of the base after curing, the manufacturing of the non-contact type IC card can be made more efficient, and the manufacturing cost thereof can be reduced.

On the other hand, I mounted on the non-contact type IC card
Regarding the method of connecting the C chip and the coil, a method of mounting the IC chip on the wiring board and connecting the coil to the electrode terminals formed on the wiring board is generally adopted.

Since this method has been technically established in the past, it is possible to connect the IC chip and the wiring board and the wiring board and the coil with high reliability.

[0009]

However, in the above-mentioned conventional non-contact type IC card manufacturing method, the former method accommodates the IC chip and the coil in the cutout hole formed in the reinforcing body and removes the inside and outside of the cutout hole. Since it is hardened with resin, the strength of the inside of the cutout hole without a reinforcement is low, and when an external force such as bending is applied, stress concentrates inside the cutout hole and the substrate is easily broken. .

Further, after accurately setting the IC chip and the coil in the reinforcing body having the required cutout holes, it is necessary to seal the resin in the cutout hole and impregnate and harden the resin into the reinforcing body. Therefore, the manufacturing process becomes complicated,
There is also a problem that it is difficult to manufacture an inexpensive information carrier. In particular, when various non-contact type IC cards are produced on the same line, it is necessary to prepare various kinds of reinforcing bodies having different cutout holes depending on the sizes of the IC chip and the coil to be stored. However, the production process becomes more complicated and the manufacturing cost of the non-contact type IC card becomes higher.

On the other hand, in the latter of the above-mentioned conventional non-contact type IC card manufacturing methods, the cover sheet to which the IC chip and the coil are adhered is attached to one of the molds and injection molding is carried out. The high temperature molten resin comes into contact with the portion where the adhesive is attached and the portion where the adhesive is not attached. Therefore, it has been found that there is a problem that wrinkles are likely to occur at the boundary portion between the respective parts due to the difference in thermal expansion coefficient between the part to which the adhesive is attached and the part to which the adhesive is not attached. According to experiments, it has been difficult to manufacture a non-contact type IC card in which the cover sheet does not wrinkle even if the resin temperature, the injection speed, and the injection pressure are variously changed.

Since the non-contact type IC card is handled by fingers and is directly visually inspected, a wrinkled surface is uncomfortable to use and aesthetically pleasing, and thus has no commercial value. Further, when printing is performed on the surface of the cover sheet after the non-contact type IC card is manufactured, it becomes impossible to print cleanly on the surface of the card, which is also of no commercial value.

Further, in the conventional IC chip-coil connection method, the wiring board is an indispensable constituent element, so that it is difficult to cope with thinning and flexibility of the non-contact type IC card at high cost. There is.

The present invention has been made to solve the above problems, and an object thereof is to provide a structure of a flexible IC module that can facilitate the production of an information carrier, and the flexible IC module. An object of the present invention is to provide a method for producing the lactic acid at low cost and with high efficiency.

[0015]

In order to solve the above problems, the present invention relates to the structure of a flexible IC module. First, an IC in which both ends of a coil are directly connected to input / output terminals of an IC chip. Connect the chip and coil
A simple substance that contains a low melting point synthetic resin in at least a part
It is sandwiched and integrated between two non-woven fabrics that have self-pressurizing properties, and the integrated non-woven fabric has resin impregnation properties.
I made it a structure.

As described above, when the integrated body of the IC chip and the coil is sandwiched between the two non-woven fabrics having the self-bonding property and integrated, the protective effect of the connected body is enhanced and the IC chip which is easily broken is handled. And a low-rigidity coil can be easily handled. For example, when a non-contact type IC card or the like is manufactured, the connection body can be easily handled.
The productivity of C cards and the like can be improved. Further, in the IC module of this configuration, since the base body is made of non-woven fabric or the like, which is extremely flexible,
Not only can it be used as a component of a flat plate-shaped information carrier, but it can also be applied as an information carrier attached to a curved portion or a portion subjected to repeated deformation. further,
As the IC chip-coil connection body, one in which both ends of the coil are directly connected to the input / output terminals of the IC chip is used, so that the reliability and thickness of the IC module, and eventually the non-contact IC card, can be improved. be able to.

In the present specification, "self-pressing property"
When the compressive force is applied to the flexible substrate at room temperature or under heating, the fibers constituting the flexible substrate are joined together, and when the compressive force is applied by stacking a plurality of flexible substrate materials, It is a characteristic that the flexible base materials that are overlapped with each other are bonded to each other and the shape of the flexible base is kept in a state in which the volume is smaller than that before compression.

[0018]

As the woven fabric, knitted fabric, or nonwoven fabric having a self-adhesive property by itself, a so-called conjugate fiber composed of two or more portions each having different melting points is used as a raw material fiber, or two or more kinds having different melting points are used. Synthetic resin fiber blends or mixtures, glass fiber, carbon fiber, Kepler fiber, chemical fiber, natural fiber or a combination of these as the material fiber, and the material fibers are joined with a resin binder. Can be used. On the other hand, as the woven fabric, knitted fabric, non-woven fabric or paper to which self-pressing property is imparted by impregnating an appropriate amount of synthetic resin, glass fiber,
Carbon fiber, Kepler fiber, chemical fiber, natural fiber or a combination thereof can be used as the material fiber. Examples of the non-woven fabric include those in which a web is composed of random fibers obtained by opening melt-spun synthetic resin filaments, or synthetic resin fibers having a fine reticulated structure by spraying a solution of a raw material polymer. It is possible to use a non-woven fabric having any known structure, such as one in which the above web is configured.

[0020]

As described above, when a non-woven fabric having compressibility in the thickness direction, self-compression bonding property, and resin impregnation property is used, it has the same function as the first problem solving means because it has self-compression bonding property. In addition to being exhibited, it has compressibility in the thickness direction, so when two nonwoven fabrics are compressed in the thickness direction with the connector of the IC chip and the coil sandwiched in between, the connector is attached to the inner surface of the two nonwoven fabrics. Since the concave portion for burying the non-woven fabric is formed and the surface of the nonwoven fabric can be formed flat, it is possible to produce a non-contact type IC card or the like having a flat surface and excellent aesthetics. In addition, since a non-woven fabric having a resin impregnating property is used, a desired non-contact type IC card or the like can be produced only by adhering a cover sheet having a resin layer to the outer surfaces of the two non-woven fabrics. The productivity of IC cards and the like can be improved.

The present invention, in the second, the first object as an IC chip in solutions, 50 [mu] m to 15 thickness
The configuration is such that the one with 0 μm is used.

Thus, the thickness is 50 μm to 150 μm.
The use of the IC chip can reduce the thickness of the flexible IC module and eventually the non-contact IC card.

On the other hand, regarding the method for manufacturing a flexible IC module, the present invention is based on at least a part of the case of having a low melting point.
The first non-woven fabric containing the synthetic resin , the IC chip-coil connecting body in which both ends of the coil are directly connected to the input / output terminals of the IC chip, and the low melting point synthetic resin are provided at least in part.
Combined it heavy and a second non-woven fabric that is included, superimposed
Hot pressing the first and second non-woven fabrics
The non-woven fabric after the press was made to have a resin impregnating property .

According to this structure, the first nonwoven fabric and I
Since the connection body of the C chip and the coil and the second non-woven fabric can be superposed in this order and each of these members can be integrated by simply hot pressing, the process is simple and the desired flexible IC module can be efficiently manufactured. It can be manufactured, and the productivity of the flexible IC module can be improved.

In the present specification, "hot press"
Means a first non-woven fabric, an IC chip-coil connecting body, and a second non-woven fabric, which are superposed on each other, between an upper mold and a lower mold having flat facing surfaces, in a thickness direction under heating. The method of applying the compressive force of.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION A first example of a flexible IC module according to the present invention will be described with reference to FIGS.
1 is a partially cutaway plan view of a flexible IC module according to this example, FIG. 2 is an enlarged cross-sectional view taken along the line AA of FIG. 1, and FIG. 3 is I mounted on the flexible IC module according to this example.
FIG. 4 is a cross-sectional view of a wire material forming the coil, FIG. 5 is a cross-sectional view showing a direct connection method between the IC chip and the coil, and a state of the connection portion. FIG. 7 is a cross-sectional view showing another direct connection method and the state of the connection portion, and FIG. 7 is a configuration diagram of the use state of the welding apparatus applied to the direct connection of the IC chip and the coil.

As is apparent from FIGS. 1 to 3, the flexible IC module of this example has the IC chip 1 and the I
It is directly connected to the input / output terminal (pad) 1a of the C chip 1, receives power supply from the reader / writer (not shown) to the IC chip 1 in a non-contact manner, and transmits data to and from the reader / writer (not shown). Coil 2 by contact
And are completely embedded inside the flexible base 3 made of non-woven fabric. As the IC chip 1, any IC chip conventionally mounted on a non-contact type IC card can be used, but in order to make the non-contact type IC card thinner, the total thickness is about 50 μm to 150 μm. It is particularly preferable to use a thinned product. The configuration of the IC chip 1 is a matter that is publicly known and is not the subject matter of the present invention, and thus the description thereof is omitted.

On the other hand, as for the coil 2, as shown in FIG. 4A, the core 2a made of a highly conductive metal material such as copper or aluminum is covered with an insulating layer 2b such as a resin. In order to facilitate the direct connection to the IC chip 1 as shown in FIG. 4 (b), a metal layer 2 for bonding such as gold or solder is formed around the core wire 2a in order to facilitate the direct connection to the IC chip 1.
It is also possible to use a wire which is covered with c and which is covered with the insulating layer 2b around the bonding metal layer 2c.

The wire has a diameter of 20 μm to 100 μm, and the coil 2 is formed by turning the wire several times to several tens of times according to the characteristics of the IC chip.

As a direct connection method between the IC chip 1 and the coil 2, wedge bonding, soldering or welding is particularly suitable.

When wedge-bonding the IC chip 1 and the coil 2 to each other, as shown in FIG.
As the chip 1, a chip having gold bumps 1d previously formed on the input / output terminals 1a is used. In this case, the coil 2 may be one that does not have the metal layer 2c for joining, but in order to make joining easier and more reliable, the core wire 2a
It is particularly preferable to use a material having a gold layer coated on the periphery thereof. The wedge bonding between the input / output terminal 1a and the coil 2 is performed by connecting the coil 2 to the input / output terminal 1a as shown in FIG.
Are overlapped with each other, the bonding tool 51 is pressed from the coil 2 side to apply ultrasonic waves, the insulating layer 2b is carbonized by the energy, and the gold bumps are melted. As a result, as shown in FIG. 5B, the input / output terminal 1a of the IC chip 1 and the coil 2 are directly connected.

When soldering the IC chip 1 and the coil 2 to each other, as shown in FIG. 6 (a), an IC chip 1 having an input / output terminal 1a on which a solder bump 1b is previously formed by solder plating is used. To be in this case,
As the coil 2, a coil having no joining metal layer 2c may be used, but in order to improve wettability to solder and facilitate soldering, gold or the like is coated around the core wire 2a. It is particularly preferable to use the above. The soldering of the input / output terminal 1a and the coil 2 is performed by superposing the end portion of the coil 2 on the input / output terminal 1a and pressing the bonding tool 52 heated to a predetermined temperature from the coil 2 side as shown in FIG. The energy is used to carbonize the insulating layer 2b and melt the solder bump 1b. As a result, as shown in FIG. 6B, the input / output terminal 1a of the IC chip 1 and the coil 2 are soldered via the solder 1c. The IC chip 1
Instead of forming the solder bump 1b on the input / output terminal 1a, it is possible to use a coil 2 having a core layer 2a coated with a solder layer and soldering in the same manner as described above. Furthermore, a solder bump 1b may be formed on the input / output terminal 1a of the IC chip 1, and the coil 2 may be covered with a solder layer around the core wire 2a.

Further, when the IC chip 1 and the coil 2 are welded, an IC chip in which gold bumps are formed on the input / output terminal 1a or a coil made of a wire material in which a gold layer is coated around the core wire 2a , Or both of these are used. As a welding machine, as shown in FIG. 7, two electrodes 61a, 61 are arranged in parallel with each other with a minute gap d therebetween.
b, a ribbon winding reel 63a, 63b attached to the welding head 62, and the ribbon winding reels 63a, 63b, some of which are tips of the electrodes 61a, 61b. Ribbon-shaped resistance heating element 64 wired so as to come into contact with the drive section, and the driving reel 63a.
A motor equipped with a motor 65 for driving can be used. Since the ribbon-shaped resistance heating element 64 has a large specific resistance and a high thermal conductivity, it can locally generate a high temperature and is excellent in strength. Most preferred is a molybdenum ribbon consisting of.

At the time of welding, as shown in FIG.
The end portion of the coil 2 is directly superposed on the input / output terminal 1a of the chip 1 and the welding head 62 is pressed from the coil 2 side. Then, pulse electric power is supplied to the electrodes 61a and 61b to carbonize the insulating layer 2b by utilizing the resistance heating of the ribbon-shaped resistance heating element 64, and the gold bump or the gold layer coated around the core wire 2a or Both are melted. The motor 65 drives the driving reel 63a as necessary to bring the ribbon-shaped resistance heating element 64, which is always clean, into contact with the welding head 62. If the ribbon-shaped resistance heating element 64 is provided with a brush 66 for removing carbides, the ribbon-shaped resistance heating element 64 can be repeatedly used, and the running cost can be reduced.

The welding machine of FIG. 7 can be used as a heat source for soldering instead of the bonding tool 52 shown in FIG. 6 (a).

As the non-woven fabric forming the flexible substrate 3, any non-woven fabric known in the art can be used as long as it has compressibility in the thickness direction, self-pressing property and resin impregnation property. For example, it is possible to use a non-woven fabric whose web is composed of ready-made short fibers made of glass fibers, carbon fibers, Kepler fibers, chemical fibers, natural fibers or a combination thereof, or melt-spun synthetic resin filaments are opened. Fibers are immediately spun from fiber raw materials such as non-woven fabrics in which webs are composed of random fibers obtained by spraying, and non-woven fabrics in which webs of synthetic resin fibers with a fine network structure are formed by spraying a solution of raw polymer. It is also possible to use a non-woven fabric. As a method for manufacturing a nonwoven fabric having such a synthetic resin fiber web, there are a spunbond method, a melt blow method, a flash spinning method and the like. Further, as a method of joining the produced webs, there are a thermal bond method and a latex bond method. When using a nonwoven fabric whose web is made of synthetic resin fibers, the web is made of a mixture of high melting point synthetic resin fibers and low melting point synthetic resin fibers in order to facilitate the bonding between the fibers. Can be used.

Of these non-woven fabrics, those that contain a low melting point synthetic resin at least in part and have a self-bonding property by themselves can be used as they are as the raw material of the flexible substrate 3. On the other hand, in the case where the low melting point synthetic resin is not included and does not have self-pressurizing property by itself, the self-pressurizing property is imparted by impregnating an appropriate amount of low melting point resin after the nonwoven fabric is manufactured, and the flexible base 3 is It can be used as a raw material.

The thickness of the flexible substrate 3 after compression molding is set in consideration of the thickness of the non-contact IC card which is the final product and the thickness of the cover sheet used for manufacturing the non-contact IC card. , It is sufficient if it is slightly thicker than the thickness of the mounted parts. For example, when the IC chip 1 having a thickness of 50 μm and the coil 2 made of a wire material having a wire diameter smaller than that of the IC chip 1 are mounted, the thickness of the flexible substrate 3 is 70 μm.
IC chip 1 with a thickness of 150 μm is sufficient if the thickness is at least m.
When mounting the coil 2 made of a wire material having a wire diameter smaller than that, the thickness of the flexible substrate 3 is set to 170 μm.
It is sufficient if it is m or more.

In the flexible IC module of this example, the IC chip 1 and the coil 2 which are the mounted parts are completely embedded in the base body 3 made of non-woven fabric or the like, and therefore the effect of protecting the IC chip 1 and the coil 2 is excellent. Further, since the substrate 3 is made of a non-woven fabric having a resin impregnating property, the desired non-contact type IC can be obtained by impregnating the substrate 3 with the resin and adhering the cover sheet with the impregnated resin.
Cards can be manufactured. In this case, since the resin can be substantially uniformly impregnated into the base, wrinkles do not occur on the surface of the base, and it is not necessary to use a spacer sheet or the like which is usually used for making the thickness uniform. A highly contactless IC card can be manufactured. Furthermore, since the base of the IC module of this configuration is made of non-woven fabric, etc., and it is extremely flexible, it can be used not only as a component of a flat-plate non-contact type IC card, but also for curved parts and repeated parts. It can also be applied as a component part of a portion to be deformed.

In addition, since the IC chip 1 and the coil 2 are directly connected, the wiring board can be omitted, and the flexible IC module and eventually the non-contact IC which is the final product.
The card can be made thinner and the cost can be reduced. In particular, when the solder method or the welding method is used as the direct connection method between the IC chip 1 and the coil 2, there are the following advantages as compared with the case where the wedge bonding method is applied. That is, in the wedge bonding, the ultrasonic wave oscillated by the bonding tool 51 is applied to the bonding portion while the bonding tool 51 is strongly pressed against the coil 2 superposed on the input / output terminal 1a of the IC chip 1 and insulated by the energy. Since this is done by destroying the layer 2b and promoting the melting of the gold plating layer 2d, the tip end of the coil 2 is deformed into a flat shape as shown in FIG. Cheap. In addition, the wedge bonding method is an IC because it applies ultrasonic waves and strong pressure to the connection part.
Chips are easily damaged, especially with a thickness of 50 μm
When a thin IC chip having a thickness of about 150 μm is used, the influence becomes remarkable. Further, in the wedge bonding method, it is difficult to maintain and manage connection conditions because ultrasonic waves whose condition settings are complicated are used, and it is difficult to stably manufacture good products.

On the other hand, in the solder method and the welding method, ultrasonic waves are not applied to the connection portion, and the pressing force of the bonding tool 52 and the welding head 62 is weaker than that of the wedge bonding method. Since the chips are not destroyed and ultrasonic waves are not used, maintenance of connection conditions is easy. When the soldering method according to the present invention is adopted, the bonding metal layer 2c and the insulating layer 2 are formed around the core wire 2a.
Since the wire coated with b is used, no oxide film is formed on the wire. Therefore, it is not necessary to use the flux required to remove the oxide film during normal soldering, and it is possible to prevent the manufacturing process from becoming complicated due to the addition of the flux cleaning process.

Next, a second example of the flexible IC module according to the present invention will be described with reference to FIGS. 8 and 9.
8 is a plan view of the flexible IC module according to this example, and FIG. 9 is an enlarged cross-sectional view taken along the line BB of FIG.

As is clear from FIG. 8 and FIG. 9, the flexible IC module of this example has an IC chip 1 and a coil 2 directly connected to the input / output terminal 1a of the IC chip 1 made of a non-woven fabric flexible substrate. It is configured to be embedded on one side of 3. The other parts are the same as those of the flexible IC module according to the first example, and thus the description thereof will be omitted to avoid duplication.

The flexible IC module of this example has the same effects as the flexible IC module according to the first embodiment, and the IC is provided on one side of the flexible substrate 3.
Since the chip 1 and the coil 2 are embedded, the chip 1 and the coil 2 can be thinly formed, and the manufacturing can be further simplified, so that the manufacturing cost can be reduced.

The method of manufacturing the flexible IC module according to the present invention will be described below. <Flexible IC
First Example of Module Manufacturing Method> A method of manufacturing the flexible IC module according to the first embodiment will be described with reference to FIG. FIG. 10 is an explanatory view of a method of manufacturing the flexible IC module.

Prior to manufacturing the flexible IC module, first and second non-woven fabrics having a predetermined shape and a predetermined size, which have compressibility in the thickness direction, self-compression bonding property, and resin impregnation property, are prepared. At the same time, the IC chip 1 having the input / output terminal 1a directly connected to both ends of the coil 2 is prepared (see FIG. 3).

Thereafter, as shown in FIG. 10, the first non-woven fabric 12 having a self-compression bonding property is placed on the lower mold 11 having a flat upper surface, and the first non-woven fabric 1 is formed.
The connection body of the IC chip 1 and the coil 2 is positioned and placed on the substrate 2. Next, these IC chip 1 and coil 2
After stacking the second non-woven fabric 13 having the self-bonding property from above, an upper mold 14 having a flat lower surface is pressed from above the second non-woven fabric 13 to heat the first non-woven fabric 13.
And, the second nonwoven fabrics 12 and 13 are compressed in the thickness direction. As a result, the required flexible IC module can be obtained. In the following description, a method of compressing the components of the flexible IC module in the thickness direction with heating by the lower die and the upper die is referred to as "hot pressing". Required printing may be applied to the surface of the produced flexible IC module.

When the first and second non-woven fabrics 12, 13 are uniformly compressed in the thickness direction, the first and second non-woven fabrics 12, 13 are compressed more in the setting portion of the IC chip 1 and the coil 2. Therefore, as shown in FIG. 2, a recess 15 is formed on the inner surface of each of the non-woven fabrics 12 and 13 according to the outer shape of the IC chip 1 and the coil 2.
Are embedded in the recess 15. Further, since the first and second nonwoven fabrics 12 and 13, which are the bases of the flexible substrate 3, are made of self-bonding nonwoven fabrics, the shape of FIG. 2 is maintained even after the compression force is removed. Further, if the compressibility of the first and second non-woven fabrics 12 and 13 is adjusted to an appropriate range of 100% or less, the first and second non-woven fabrics 12 and 13 are impregnated with resin after the flexible IC module is manufactured. Therefore, it can be applied to the production of information carriers.

According to the manufacturing method of this example, the flexible I
First and second non-woven fabrics 1 required for manufacturing C module
2, 13 and the connecting body of the IC chip 1 and the coil 2 are prepared in advance, these members and parts are sequentially stacked, and the desired flexible IC module is obtained only by compressing the laminated body in the thickness direction. Therefore, the flexible IC module can be manufactured with extremely high efficiency. Further, as the connecting body of the IC chip 1 and the coil 2, the one in which both ends of the coil 2 are directly connected to the input / output terminal 1a of the IC chip 1 is used.
It can be formed into a thin C module.

In the manufacturing method of FIG. 10, if the second nonwoven fabric 13 is omitted, the flexible IC module according to the second embodiment can be manufactured.

<Second Example of Method of Manufacturing Flexible IC Module> Next, a second example of the method of manufacturing the flexible IC module having the above-described structure will be described with reference to the manufacturing process diagram of FIG.

First, as shown in FIG. 11A, a first intermediate body 21 in which the coil 2 is embedded in one surface of the first nonwoven fabric 12 is produced. In the first intermediate body 21, the first non-woven fabric 12 having self-compression bonding property is placed on the lower die having a flat upper surface and the coil 2 is positioned on the first non-woven fabric 12. Then, the upper die having a flat lower surface is pressed from above the coil 2 and hot-pressed, so that the coil 2 can be manufactured again. When the coil 2 is placed on the first nonwoven fabric 12, both ends of the coil 2 are connected to the input / output terminals 1 provided on the IC chip 1 to be used.
The intervals are set to be substantially equal to the set interval a and set parallel to each other.

At the same time, as shown in FIG. 11 (b),
A second intermediate body 22 in which the IC chip 1 is embedded on one surface of the second nonwoven fabric 13 is produced. The second intermediate 22 is
The second non-woven fabric 13 having a self-compression bonding property is placed on the lower mold having a flat upper surface, and the second non-woven fabric 1
After the IC chip 1 is positioned and placed on the surface of the IC chip 3, an upper die having a flat lower surface is pressed from above the IC chip 1 and hot-pressed to manufacture the IC chip 1.
At this time, the IC chip 1 is attached upward to the second nonwoven fabric 13 so that the input / output terminals 1a are exposed on the surface of the second nonwoven fabric 13.

Then, as shown in FIG. 11C, the IC
The chip 1 and the coil 2 are placed inside, and the first and second intermediate bodies 21 and 22 are overlapped with each other so that the input / output terminal 1a of the IC chip 1 and both ends of the coil 2 are in contact with each other. Hot pressing is performed again using 11 and the upper mold 14 to produce the third intermediate body 23 in which the first and second nonwoven fabrics 12 and 13, the IC chip 1 and the coil 2 are integrated.

Finally, as shown in FIG. 11 (d), the ultrasonic transducer 24 is provided from the outer surface of the first nonwoven fabric 12 on which the coil 2 is mounted to the portion corresponding to the input / output terminal portion 1a of the IC chip 1. The insulating layer and the low melting point metal layer coated on the wire for coil formation are melted by heat and pressure generated by pressing and applying ultrasonic waves, so that the input / output terminal portion 1a and both ends of the coil 2 are melted. To be electrically connected. As a result, a desired flexible IC module can be obtained.

In the method of manufacturing the flexible IC module of this example, both ends of the coil 2 are fixed to the first non-woven fabric 12 at predetermined intervals in advance, so that the electrical connection with the IC chip 1 can be extremely facilitated. That is, some of the IC chips 1 used for manufacturing the flexible IC module have minute input / output terminals whose one side is about 100 μm. On the other hand, since the wire diameter of the coil 2 is about 50 μm, it is difficult to efficiently manufacture the connected body of the IC chip 1 and the coil 2 without fixing the coil end. The manufacturing efficiency can be improved to some extent by using a special jig or using an IC chip whose input / output terminals have been expanded, but the manufacturing process is complicated, and thus the manufacturing efficiency is dramatically increased. Is difficult. According to the manufacturing method of this example, since the coil 2 is fixed to the nonwoven fabric which is a component of the flexible IC module, the manufacturing process is not complicated and a good product can be manufactured with high efficiency.

<Third Example of Manufacturing Method of Flexible IC Module> Next, a third example of the manufacturing method of the flexible IC module having the above-described structure will be described with reference to the manufacturing process diagram of FIG.

First, as shown in FIG. 12A, a first stage intermediate body 31 in which the coil 2 is embedded on one surface of the first nonwoven fabric 12 is produced. In the first-stage intermediate body 31, the first non-woven fabric 12 having a self-compression bonding property is placed on a lower mold having a flat upper surface, and the coil 2 is positioned on the first non-woven fabric 12. After that, the upper die having a flat lower surface formed from above the coil 2 is pressed from above the coil 2 and hot-pressed, whereby it can be re-produced. When the coil 2 is placed on the first non-woven fabric 12, both ends of the coil 2 are made substantially parallel to each other by making the set intervals of the input / output terminals 1a provided on the IC chip 1 to be used substantially equal to each other. Set.
The manufacturing process up to this point is the same as the manufacturing method of the first intermediate body 21 according to the second example of the manufacturing method.

Next, as shown in FIG. 12B, the IC chip 1 was embedded in the first stage intermediate body 31, and the coil 2 and the IC chip 1 were embedded in one surface of the first nonwoven fabric 12. A second stage intermediate 32 is prepared. The intermediate body 32 of the second stage is formed on a lower die having a flat upper surface with the embedded surface of the coil 2 facing upward, and the intermediate body 31 of the first stage.
And the coil 2 embedded in the first-stage intermediate body 31
After the IC chip 1 is positioned and placed on the portion where both ends of the coil are set, the input / output terminal 1a is directed downward, and the input / output terminal 1a is aligned with both ends of the coil 2.
It can be re-produced by pressing an upper die having a flat lower surface from above the IC chip 1 and performing hot pressing again.

Further, as shown in FIG. 12C, the second non-woven fabric 13 is superposed on the embedded surfaces of the IC chip 1 and the coil 2 of the second stage intermediate body 32, and the lower mold 11 and the upper mold 14 are formed. Is hot-pressed once again to prepare a third stage intermediate body 33 in which the first and second nonwoven fabrics 12 and 13, the IC chip 1 and the coil 2 are integrated.

Finally, as shown in FIG. 12 (d), the ultrasonic transducer 24 is provided from the outer surface of the first nonwoven fabric 12 on which the coil 2 is mounted to the portion corresponding to the input / output terminal portion 1a of the IC chip 1. The insulating layer and the low melting point metal layer coated on the wire for coil formation are melted by heat and pressure generated by pressing and applying ultrasonic waves, so that the input / output terminal portion 1a and both ends of the coil 2 are melted. To be electrically connected. As a result, a desired completely buried type flexible IC module can be obtained.

The manufacturing method of this example also has the same effects as the manufacturing method of the second example.

After the second stage intermediate body 32 shown in FIG. 12B is manufactured, the IC is produced by using the ultrasonic transducer 24 and the like.
By electrically connecting the input / output terminal portion 1a of the chip 1 and both ends of the coil 2, a single-sided embedded type flexible IC module can be manufactured.

In addition, in each of the above-described embodiments, the flexible substrate 3 is made of a non-woven fabric. However, a flexible IC module can be manufactured by the same method when other woven fabric, knitted fabric, paper, leather or the like is used.

Further, in each of the above-described embodiments, the flexible IC module in which the IC chip 1 and the coil 2 are embedded as the mounting component has been described as an example, but the flexible IC module in which other mounting components are embedded is also described above. It can be manufactured by a method similar to.

A method of manufacturing a desired non-contact IC card using the flexible IC module manufactured as described above will be described below.

<First Example of Non-contact IC Card Manufacturing Method>
First, as shown in FIG. 13A, the first cover sheet 41 is attached to the fixed mold 42 of the injection molding machine, and
The second cover sheet 43 is attached to the movable mold 44 of the injection molding machine. In this case, as shown in FIG.
It is also possible to suck the cover sheets 41 and 43 by using the ventilation holes 45 formed in the movable mold 44 and the movable mold 44 so as to be brought into close contact with the molds 42 and 44.

The cover sheets 41 and 43 can be formed of any known transparent or opaque synthetic resin sheet as long as they have predetermined heat resistance, but from the viewpoint of pollution prevention, for example, polyethylene terephthalate. It is particularly preferable to use a synthetic resin sheet such as (hereinafter abbreviated as “PET”) or polyethylene naphthalate that does not generate chlorine gas during incineration. Required printing can be applied to the front surface or the back surface of the cover sheets 41 and 43.

In order to enhance the bondability to the base body 3, fine irregularities, for example, irregularities corresponding to No. 400 to No. 1000 of the abrasive grain size defined by JIS are formed on the back surfaces of the cover sheets 41, 43. Is preferred. Further, when printing is directly performed on the surfaces of the cover sheets 41 and 43, it is preferable to form fine irregularities on the surfaces of the cover sheets 41 and 43 in order to improve printability. In this case, in order to improve ink flow and improve printability, the surface of the cover sheets 41 and 43 has an abrasive grain size of 300 as specified by JIS.
It is preferable to form irregularities corresponding to Nos. 0 to 10000. As a method of manufacturing such a cover sheet, a method of embedding a filler (abrasive grains or the like) having a diameter of 0.1 μm to several tens of μm into the original sheet of the cover sheet by electrostatic coating, Examples thereof include a method of kneading the filler and a method of polishing the surface of the raw sheet with abrasive grains.

Next, as shown in FIG. 13B, the flexible IC module 10 manufactured as described above is overlaid on the first cover sheet 41 attached to the fixed mold 42.

After the fixed mold 42 and the movable mold 44 are closed, as shown in FIG. 13C, these molds 42,
A gate 47 in a cavity 46 defined by
Fill the resin from. As mentioned above, flexible I
Since the base body 3 of the C module 10 is made of a non-woven fabric having a resin impregnation property, when the cavity 46 is filled with the resin, the filled resin is impregnated into the base body 3.

Next, as shown in FIG. 13 (d), the movable mold 44 is retightened, and a non-contact IC of a predetermined shape and a predetermined size is contacted.
Mold the card. At the same time, the movable mold 44
The gate 47 is cut by.

Finally, as shown in FIG. 13 (e), the molds 42 and 44 are opened to open the first and second cover sheets 4.
The non-contact IC card in which the flexible IC modules 1 and 43 and the flexible IC module 10 are integrated is taken out.

According to the information carrier manufacturing method of this embodiment, the mounting parts (I) for the first and second cover sheets 41 and 43 are
Since the bonding of the C chip 1 and the coil 2) can be omitted, the manufacturing of the non-contact IC card can be made efficient. Further, since the heat load acting on the cover sheets 41, 43 at the time of filling the resin can be made uniform, it is possible to prevent the wrinkles of the cover sheets 41, 43 due to the uneven heat load. Therefore, a high-quality non-contact IC card can be manufactured with high efficiency, and the quality of design printing and the like can be improved. In addition, since the flexible IC module 10 is formed by sandwiching the mounted parts with the first and second non-woven fabrics, the thickness of each non-woven fabric is adjusted so that the non-contact IC card can be mounted in the thickness direction. The setting position can be adjusted appropriately. Furthermore, since the mounted component is held by the base body 3, the effect of protecting the mounted component can be enhanced.

According to this manufacturing method, as in the prior art, a complicated process of opening a cutout hole in the base body, mounting a mounting component inside the cutout hole, and sealing the periphery of the cutout hole with resin is performed. Since it is not necessary, the contactless IC card having the required shape can be manufactured at low cost.

<Second Example of Non-contact IC Card Manufacturing Method>
The manufacturing method of the non-contact IC card of this example relates to a method of manufacturing a non-contact type information carrier having no cover sheet by a so-called hot pressing method.

That is, as shown in FIG. 14, a first heat-melting sheet 4 made of a thermoplastic resin such as PET is preliminarily prepared and prepared on the upper surface of the lower mold 11 formed in a flat plate shape. The flexible IC module 10 and the second heat-meltable sheet 5 made of the same or different thermoplastic resin as the first heat-meltable sheet 4 are superposed in this order, and the second heat-meltable sheet 5 is formed. The upper die 14 formed in a flat plate shape is lowered from above to compress the laminated body under required heating and pressurizing conditions. In this compression process, the first and second heat-fusible sheets 4 and 5 are melted, and a part or all of them are impregnated into the flexible substrate 3 forming the flexible IC module 10. As a result, the flexible IC module 10 and the first and second heat-meltable sheets 4 and 5 are integrated, and the flexible IC module 1
0 is casing by the first and second heat fusible sheets 4, 5. Thereafter, if necessary, shaping of the outer peripheral portion and design printing on the surface of the heat-fusible sheet are performed to obtain a non-contact type information carrier as a product. In addition, in FIG.
For ease of illustration, the method of hot-pressing the non-contact type information carriers one by one is illustrated, but the flexible IC module 10 in which a large number of mounted parts are embedded in a large flexible substrate at a predetermined interval is used. By doing so, it is of course possible to hot press a large number of non-contact type information carriers at the same time.

In the non-contact type information carrier manufacturing method of this example, the flexible IC module 1 is manufactured by the so-called hot pressing method.
Since 0 casing is performed, it is easy to control heating conditions and compression conditions during casing, and it is possible to manufacture a highly accurate non-contact type information carrier.

<Third example of manufacturing method of non-contact IC card>
The method of manufacturing a non-contact IC card of this example relates to a method of manufacturing a non-contact type information carrier having a cover sheet by a so-called hot pressing method.

That is, as shown in FIG. 15, a resin material having excellent heat resistance, such as polyvinyl chloride (hereinafter abbreviated as "PVC"), is formed on the upper surface of the lower mold 11 formed in a flat plate shape. And the first cover sheet 41, for example PE
First heat-fusible sheet 4 made of a thermoplastic resin such as T
A flexible IC module 10 prepared and prepared in advance; a second heat-melting sheet 5 made of a thermoplastic resin which is the same as or different from the first heat-melting sheet 4; and the first cover sheet. 41 and a second cover sheet 43 made of the same or different heat-resistant resin are superposed in this order, and the upper die 14 formed in a plate shape is lowered from above the second bar sheet 43 to lower the required heating. Compress the laminate under pressure. In this compression process, the first and second heat-meltable sheets 4 and 5 are melted, and a part of them is impregnated into the flexible substrate 3 that constitutes the flexible IC module 10, and the first and second cover sheets 4 are also included.
1, 43 are bonded to the first and second heat-meltable sheets 4, 5. As a result, the flexible IC module 1
0, the first and second heat-fusible sheets 4 and 5 and the first and second cover sheets 41 and 43 are integrated, and the flexible IC module 10 is casing.

Thereafter, if necessary, shaping of the outer peripheral portion and design printing on the surface of the heat-fusible sheet are carried out to obtain a non-contact type information carrier as a product. Also in the case of this example, by using the flexible IC module 10 having a required configuration and size, a large number of non-contact type information carriers can be simultaneously obtained by one hot pressing. The non-contact type information carrier manufacturing method of this example also has the same effect as the non-contact type information carrier manufacturing method shown in FIG.

<Fourth example of manufacturing method of non-contact IC card>
The method for producing a non-contact IC card of this example relates to a method for producing a non-contact type information carrier having no cover sheet by a so-called roll pressing method.

That is, as shown in FIG. 16, a flexible IC module 10 in which a large number of mounting parts are embedded in a tape-shaped flexible substrate at a predetermined interval, and a tape-shaped flexible IC module made of a thermoplastic resin such as PET. The first heat-melting sheet 4 and the tape-shaped second heat-melting sheet 5 made of the same or different thermoplastic resin as the first heat-melting sheet 4 are individually wound around the rollers 71, 72, 73, respectively. Flexible IC module 1 pulled out from 71
The first heat-melting sheet 4 and the second heat-melting sheet 5 drawn out from the rollers 72 and 73 are overlapped and bonded to the front and back surfaces of 0, and then this laminated body is applied to the heating / pressurizing roller 74. Through compression molding. In FIG. 16, reference numeral 75 is a drawing roller, reference numeral 76 is a guide roller, and reference numeral 77 is a bonding roller.

In the process in which the laminate passes through the heating / pressurizing roller 74, the first and second heat-meltable sheets 4,
5 melts, and a part or all of it melts into the flexible substrate forming the flexible IC module 10. Thereby, the flexible IC module 10 and the first and second fusible sheets 4, 5 are integrated, and the flexible IC module 10 is casing by the first and second fusible sheets 4, 5. Hereinafter, design printing and cutting are performed on the laminate to obtain a non-contact type information carrier as a product.

In the non-contact type information carrier manufacturing method of this embodiment, the flexible IC module 1 is manufactured by the so-called roll pressing method.
Since the casing of 0 is performed, the casing process of the non-contact type information carrier can be made more efficient as compared with the case of casing the flexible IC module 10 by the so-called hot pressing method, and the manufacturing cost of the non-contact type information carrier can be reduced. You can

<Fifth Example of Method for Manufacturing Non-Contact IC Card>
The method for manufacturing a non-contact IC card of this example relates to a method for manufacturing a non-contact type information carrier having a cover sheet by a so-called roll pressing method.

That is, as shown in FIG. 17, a flexible IC module 10 in which a large number of mounting components are embedded in a tape-shaped flexible substrate at a predetermined interval and a tape-shaped flexible resin module such as PET are used. A first heat-meltable sheet 4, a tape-shaped second heat-meltable sheet 5 made of the same or different thermoplastic resin, and a tape-shaped heat-resistant resin material such as PVC. Cover sheets 41 and 43 with rollers 71 and 7, respectively.
2, 73, 78, 79 are individually wound and the roller 7
The flexible IC module 10 pulled out from the first and second sides of the rollers 72 and 73
Of the first heat-meltable sheet 4 and the second heat-meltable sheet 5 are overlapped, and the first heat-meltable sheet 4 and the second heat-meltable sheet 5 are first drawn out from the rollers 78 and 79 on the surfaces of the first and second heat-meltable sheets 4. Cover sheet 41 and second cover sheet 4
3 are laminated and bonded together, and then this laminated body is passed through a heating / pressurizing roller 74 to be compression-molded. Also in this figure, reference numeral 75 is a drawing roller, reference numeral 76 is a guide roller, and reference numeral 77 is a bonding roller.

According to the method of FIG. 17, in the process of the laminated body passing through the heating / pressurizing roller 74, the first and second layers are formed.
The heat-meltable sheets 4 and 5 are melted, and a part of the heat-meltable sheets is impregnated into the flexible substrate that constitutes the flexible IC module 10, so that the flexible IC module 10 and the first and second heat-meltable sheets 4 and 5 are integrated. At the same time, the first and second cover sheets 41 and 43 are adhered by the melted first and second heat-meltable sheets 4 and 5, and the flexible IC module 19 is casing. Hereinafter, performing design printing and cutting on the laminate,
Obtain a contactless information carrier that is a product.

The non-contact type information carrier manufacturing method of this embodiment is also shown in FIG.
It has the same effect as the non-contact type information carrier manufacturing method shown in FIG.

Hereinafter, other embodiments of the present invention will be listed.

In each of the above embodiments, the flexible substrate 3 is made of non-woven fabric.
A non-contact IC card can be manufactured by the same method when a knitted fabric, paper, leather or the like is used.

In each of the embodiments described above, the non-contact IC card is manufactured using the flexible IC module in which the IC chip 1 and the coil 2 are embedded in the base body 3. However, the IC chip 1 and the coil are formed on one side of the base body 3. Even when the flexible IC module in which 2 is embedded is used, a non-contact IC card can be manufactured by the same method.

In each of the above-described embodiments, the flexible IC module in which the IC chip 1 and the coil 2 are embedded as the mounting parts has been described as an example, but the flexible IC module in which other mounting parts are embedded is also used. A non-contact IC card can be manufactured by the same method.

In each of the above embodiments, the method of manufacturing a non-contact type IC card has been described as an example, but it is of course easy to form a non-contact type IC information carrier having another shape such as a coin shape or a ribbon shape. is there.

As for the method of directly connecting the IC chip and the coil, the connection method of connecting the IC chip and the coil via a conductive resin can be adopted in addition to the method exemplified in each of the embodiments.

The IC described in each of the above embodiments
A method for connecting the input / output terminal 1a of the chip 1 and the coil 2, that is, a bonding tool is used to bond the core wire 2a and the bonding metal layer 2c with a wire material that is still covered with the insulating layer 2b. While the insulating layer 2b is carbonized and removed by the energy provided by the bonding tool, I
The method of connecting the input / output terminal 1a of the C chip 1 and the coil 2 is simply the input / output terminal 1a of the IC chip 1 and the coil 2.
The present invention can be applied not only to the connection with, but also to the connection of a jumper wire to a wiring board or the connection of a coil in a magnetic head.

[0098]

According to the flexible IC module of the present invention, since the connecting body of the IC chip and the coil is sandwiched between two non-woven fabrics having self-compression bonding and integrated, the effect of protecting the connecting body is enhanced and The handling of IC chips that are easily destroyed and the handling of low-rigidity coils are facilitated. For example, the handling of the connecting body can be facilitated when manufacturing a non-contact type IC card or the like, and the productivity of the non-contact type IC card or the like is improved. Can be increased. Further, in the IC module of the present invention, since the base body is made of non-woven fabric and is extremely flexible, it can be used not only as a component of a flat plate-shaped information carrier but also in a curved portion or a portion subjected to repeated deformation. It can also be applied as an information carrier attached to the. Further, as the connecting body of the IC chip and the coil, one in which both ends of the coil are directly connected to the input / output terminal of the IC chip is used.
As a result, it is possible to improve reliability and reduce the thickness of the non-contact type IC card or the like.

Further, the method for manufacturing a flexible IC module of the present invention comprises: a first nonwoven fabric; an IC chip-coil connecting body in which both ends of the coil are directly connected to the input / output terminals of the IC chip; Since the non-woven fabric is superposed in this order and these respective members are integrated by hot pressing, the process is simple and the desired flexible IC module can be efficiently manufactured, and the productivity of the flexible IC module can be improved. .

[Brief description of drawings]

FIG. 1 is a partially cutaway plan view of a flexible IC module according to a first embodiment.

FIG. 2 is an enlarged sectional view taken along line AA of FIG.

FIG. 3 is a plan view of essential parts of an IC chip and a coil mounted on the flexible IC module according to the first embodiment.

FIG. 4 is a cross-sectional view of a wire rod that constitutes a coil.

FIG. 5 is a cross-sectional view showing a method of directly connecting an IC chip and a coil and a state of a connecting portion.

FIG. 6 is a cross-sectional view showing another direct connection method between the IC chip and the coil and a state of the connection portion.

FIG. 7 is a usage state diagram of a welding device applied to a direct connection between an IC chip and a coil.

FIG. 8 is a plan view of a flexible IC module according to a second embodiment example.

9 is an enlarged cross-sectional view taken along the line BB of FIG.

FIG. 10: First method of manufacturing flexible IC module
It is process drawing which shows an example.

FIG. 11: Second flexible IC module manufacturing method
It is process drawing which shows an example.

FIG. 12: Third method of manufacturing flexible IC module
It is process drawing which shows an example.

FIG. 13 is a process chart showing a first example of an IC card manufacturing method.

FIG. 14 is a process drawing showing a second example of the IC card manufacturing method.

FIG. 15 is a process drawing showing a third example of the IC card manufacturing method.

FIG. 16 is a process chart showing a fourth example of the IC card manufacturing method.

FIG. 17 is a process drawing showing a fifth example of the IC card manufacturing method.

[Explanation of symbols]

1 IC chip 1a Input / output terminal 1b solder bump 1c solder 2 coils 2a core line 2b insulating layer 2c Connection metal layer 3 Flexible substrate 4 First heat-fusible sheet 5 Second heat-fusible sheet 10 Flexible IC module 11 Lower mold 12 First non-woven fabric 13 Second non-woven fabric 14 Upper mold 15 hollow 21 First Intermediate 22 Second intermediate 23 Third Intermediate 24 Ultrasonic transducer 31 First Stage Intermediate 32 Second Stage Intermediate 33 3rd Stage Intermediate 41 First Cover Sheet 42 Fixed mold 43 Second cover sheet 44 movable mold 45 vents 46 cavities 47 gates 51,52 Bonding tool 61a, 61b electrodes 62 welding head 63a, 63b Ribbon winding reel 64 high resistance tape 65 motor 71-79 Roller

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshinobu Sueyoshi 1-88, Tora, Ibaraki, Osaka Prefecture Hitachi Maxell Co., Ltd. (72) Inventor Ryuzo Fukao 1-88, Tora, Ibaraki, Osaka Hitachi Maxell Incorporated (72) Inventor Kazuhiko Odo 1-88, Torora, Ibaraki-shi, Osaka Inside Hitachi Maxell Co., Ltd. (56) References JP-A-10-67194 (JP, A) JP-A-8-142555 (JP , A) Japanese Patent Laid-Open No. 6-52374 (JP, A) Japanese Patent Laid-Open No. 8-207476 (JP, A) Special Table 10-501475 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB) Name) G06K 19/00-19/18

Claims (3)

(57) [Claims] The method according to claim 1] IC chip and the coil of the connecting member formed by connecting the both ends of the coil to the input and output terminals of the IC chip directly, small
At least a part of it contains a low melting point synthetic resin, and it is sandwiched by itself between two non-woven fabrics having self-compression bonding property to integrate the non-woven fabrics. A flexible IC module having. 2. The flexible IC module according to claim 1, wherein the IC chip has a thickness of 50 μm.
The flexible IC module is characterized in that it has a thickness of m to 150 μm . 3. A low melting point synthetic resin is contained at least in part.
And Murrell first nonwoven, and connection of IC chip and a coil formed by connecting the both ends of the coil directly to the input and output terminals of the IC chip, and a second nonwoven, low melting synthetic resin in at least a part the combined it heavy, superimposed the first及
And the second non-woven fabric are hot-pressed, before hot-pressing
A method for manufacturing a flexible IC module, wherein the nonwoven fabric has a resin impregnating property .