JP3530604B2 - Chip inductor - Google Patents
Chip inductorInfo
- Publication number
- JP3530604B2 JP3530604B2 JP28831494A JP28831494A JP3530604B2 JP 3530604 B2 JP3530604 B2 JP 3530604B2 JP 28831494 A JP28831494 A JP 28831494A JP 28831494 A JP28831494 A JP 28831494A JP 3530604 B2 JP3530604 B2 JP 3530604B2
- Authority
- JP
- Japan
- Prior art keywords
- core
- coil
- pair
- chip inductor
- wound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011241 protective layer Substances 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 238000000605 extraction Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 13
- 239000004020 conductor Substances 0.000 description 9
- 238000004804 winding Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000004907 flux Effects 0.000 description 6
- 229920003002 synthetic resin Polymers 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- 230000000630 rising effect Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 230000035699 permeability Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000005062 Polybutadiene Substances 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Description
【発明の詳細な説明】
【0001】
【産業上の利用分野】本発明は、コイルを巻装したコア
の両端にコイルの両端が接続される一対の電極片を設け
たチップインダクタに関する。
【0002】
【従来の技術】従来、この種のチップインダクタとして
は、例えば、特開平2−50404号公報に記載の構成
が知られている。
【0003】この特開平2−50404号公報に記載の
チップインダクタは、ドラム型コアの巻芯部に巻装した
コイルの両端を、ドラム型コアの両端面から軸方向に突
設した一対のリード端子にそれぞれ接続し、コイルを保
護層にて覆っている。さらに、ドラム型コアの両端面に
臨ませてそれぞれ立ち上がらせた一対の電極片の立ち上
がり部をドラム型コアの両端面より離間した位置で上端
に設けた係合部にリード端子を係合させて電気的かつ機
械的に接続し、コイルを巻装したドラム型コア、リード
端子および電極片の立ち上がり部を一体的にモールド体
にて覆うようにモールド成形している。
【0004】
【発明が解決しようとする課題】しかしながら、上述の
特開平2−50404号公報に記載のチップインダクタ
において、ドラム型コアの断面が円形であるため、コイ
ルの巻装の際、巻き弛みやばらけが生じるおそれがあ
り、所定のインダクタンスが得られない。
【0005】また、ドラム型コアの端面に電極片の立ち
上がり部が対向するため、コイルに通電した際に発生す
る磁束がこの立ち上がり部と交差することにより、Q値
が低下する問題がある。
【0006】本発明は、このような問題点に鑑みなされ
たもので、所定の特性が安定して得られるチップインダ
クタを提供することを目的とする。
【0007】
【課題を解決するための手段】請求項1記載のチップイ
ンダクタは、コイルと、中間に前記コイルが巻装される
四角柱状に形成した巻芯部およびこの巻芯部の前記コイ
ルが巻装される軸方向の両端に設けられかつ前記巻芯部
の対向する一対の辺に外方に向けてフランジ状に突出す
る四角柱状の突縁部を備えたコアと、前記コアの巻芯部
と同一面となる突縁部の一側面に設けられ前記コイ ルの
両端がそれぞれ接続される一対の導電部と、前記コイル
の両端をそれぞれ接続された一対の導電部に接続される
一対の電極片と、前記導電部に接続される前記コイルか
らの導線の引き出し線が位置する側の前記コイルの外周
面に設けた合成樹脂の保護層と、前記コイルが巻装され
たコアおよび前記一対の電極片の一部を一体に埋設する
モールド体とを具備したものである。
【0008】
【作用】請求項1記載のチップインダクタは、コイルを
巻装するコアの巻芯部を四角柱状に形成するとともに四
角柱状の巻芯部の対向する一対の辺に外方に向けて突出
し四角柱状に突縁部を設けてコアを形成したため、四角
柱状の巻芯部に巻装したコイルがばらけたり巻き弛みが
なく、また、導電部に接続されるコイルからの導線の引
き出し線が位置する側に設けた合成樹脂の保護層が確実
にコイルの巻き弛みやばらけを防止でき、所定の特性が
安定して得られる。また、コアの体積に対する表面積の
割合が減少し、モールド体の硬化の際に生じる応力によ
るコアに受ける歪みが低減し、透磁率の減少を防止して
所定の特性が安定して容易に得られる。さらに、コアの
突縁部の一側面に、コイルの両端がそれぞれ接続される
とともに一対の電極片がそれぞれ接続される一対の導電
部を設けたため、コイルに通電した際に電極片と交差す
る磁束量が減少して、Q値の低下が防止される。
【0009】
【実施例】以下、本発明のチップインダクタの一実施例
の構成を図面を参照して説明する。
【0010】図1および図2において、1はチップイン
ダクタで、このチップインダクタ1は、フェライトなど
の磁性材料にて形成されたコア2を有している。このコ
ア2は、断面長方形の四角柱状の巻芯部3と、この巻芯
部3の軸方向の両端に長手の対向する辺から略垂直にフ
ランジ状に突出する四角柱状の突縁部4とから平面略H
字状に角型に成形されている。また、コア2の突縁部4
の巻芯部3と同一面上となる側面に、導電性材料にて形
成された導電部5がそれぞれ設けられている。
【0011】そして、チップインダクタ1は、コア2の
巻芯部3にポリウレタン被覆電線などの導線7が巻回さ
れ、両端がそれぞれ導電部5,5に電気的かつ機械的に
接続されてコイル8が巻装されている。さらに、このコ
イル8の外周面には、導電部5に接続されるコイル8か
らの導線7の引き出し線7a,7aが位置する側に、コイル
8の巻き弛みやばらけを防止するポリブタジエンなどの
合成樹脂の保護層9が設けられている。
【0012】また、コア2には、金属製の細長板状の電
極片10の一端が、導電部5に電気的かつ機械的にそれぞ
れ接続されている。
【0013】そして、チップインダクタ1は、コイル8
が巻装されたコア2および一対の電極片10,10の一部が
モールド樹脂にて一体にモールド成形されてモールド体
11内に埋設され、モールド体11の外周面に沿って電極片
10,10が同方向に折曲されて電極が形成され、チップ状
に形成されている。
【0014】なお、電極片10は、単なる金属片に限ら
ず、外面に半田層があらかじめ設けられたものを用いた
り、折曲した後に半田層を外面に設けてもよい。
【0015】次に、上記実施例の製造工程を図面を参照
して説明する。
【0016】まず、図3に示すように、あらかじめフェ
ライトなどの磁性材料にて巻芯部3の軸方向の両端に突
縁部4を設けた平面略H字状のコア2を形成し、このコ
ア2の突縁部4の巻芯部3と同一面となる側面に、図4
に示すように、蒸着やスパッタ、厚膜印刷、金属箔接着
などにより導電部5を一対設ける。
【0017】そして、このコア2の一方の導電部5にポ
リウレタン被覆電線などの導線7の一端をパルスヒート
などの熱圧着などにより電気的かつ機械的に接続し、こ
の導線7をコア2の巻芯部3に所定回数巻回し、導線7
の他端を他方の導電部5に同様に電気的かつ機械的に接
続し、図5に示すように、コア2の巻芯部3にコイル8
を巻装する。
【0018】次に、コイル8を巻装したコア2を、図6
に示すように、帯状の金属フレーム13に対向して突出す
る金属片13a ,13a 間に、引き出し線7a,7aが接続され
た一対の導電部5,5を金属片13a ,13a の先端に載置
するようにコア2を載置させ、溶接や熱圧着などにより
導電部5と金属片13a とをそれぞれ接続する。そして、
コイル8の金属片13a が取り付けられた面に、図7に示
すように、ポリブタジエンなどの合成樹脂の保護層9を
設ける。
【0019】この後、図8に示すように、コイル8が巻
装されたコア2および一対の金属片13a ,13a の先端部
分をモールド樹脂にて一体に略直方体にモールド成形
し、硬化したモールド体11の外周面に適宜マーキングを
施す。
【0020】そして、金属フレーム13の金属片13a ,13
a の基端部を切断して金属片13a を電極片10とし、これ
らモールド体11から突出する一対の電極片10,10を、モ
ールド体11の外周面に沿って保護層9側に折曲し先端を
それぞれ対向させて電極を形成し、チップインダクタ1
を形成する。
【0021】次に、上記実施例の作用を説明する。
【0022】上記実施例により作製したチップインダク
タ1のコイル8に通電し、インダクタンスやQ値の周波
数特性を測定した。また、比較例としてドラム型コアを
有するチップインダクタを、外径寸法が同一となるよう
に形成したものを用いた。その結果を、図9および図1
0に示す。
【0023】この図9に示す周波数特性の結果から、本
実施例のものは従来のドラム型コアを用いたものより高
いQ値が得られるとともに、周波数の変化におけるイン
ダクタンスの変化の割合が少なく、安定した特性が得ら
れることがわかる。
【0024】さらに、図10に示す直流重畳特性の結果
から、本実施例のものは従来のものより直流重畳電流の
増大に伴うインダクタンスの低下が少なく、電流容量を
大きくとれることがわかる。
【0025】ところで、導線7がコア2の巻芯部3に巻
回する際に、導線7が偏って巻回された場合には、所定
のインダクタンスが得られないことが知られている。
【0026】そして、従来の巻芯部が円柱状のドラム型
のコアに導線を巻回する場合、導線と巻芯部の外周面と
の引っ掛かりがなく導線がばらけたり巻き弛みが生じる
場合があり、このばらけたり巻き弛みにより所定のイン
ダクタンスが得られないが、本実施例のコア2は巻芯部
3が四角柱状であるため、導線7が巻芯部3の角部に引
っ掛かるように巻回されるので、ばらけたり巻き弛みが
なく均一に巻回でき、線間容量が安定して所定のインダ
クタンスが得られる。さらに、本実施例はコイル8の一
部に保護層9を設け、コイル8のモールド成形時におけ
る巻き弛みやばらけを確実に防止しているため、所定の
インダクタンスが得られる。
【0027】一方、チップインダクタ1の外形寸法を所
定の範囲内となるように形成する場合には、コア2を四
角柱状に形成することが一番断面積を広く取れる。この
ため、本実施例のように巻芯部3を四角柱状に形成し、
この巻芯部3の軸方向の両端に長手の対向する辺から略
垂直にフランジ状に四角柱状の突縁部4を突出形成して
コア2を平面略H字状の角型に形成することにより、広
い断面積のコア2が得られ、Q値が高いチップインダク
タ1が得られる。さらに、本実施例のコア2は体積が従
来のドラム型コアの体積より大きくなるので、磁気特性
が向上する。
【0028】一方、コア2をモールド樹脂にてモールド
成形しモールド体11にて被覆した場合、モールド樹脂の
硬化・収縮によって内部応力が生じ、この内部応力がコ
ア2に働く。本実施例のチップインダクタ1は、面実装
のために電極が形成される実装面が平面となるように直
方体状にモールド成形するので、従来のドラム型のコア
はコアの周面にモールド体の厚さが均一となっておらず
コアの肉厚のうすい部分に応力負荷が集中し透磁率が低
下するのに対し、本実施例のコア2は角柱状であるた
め、モールド体11の厚さがコア2の周面に略均一の厚さ
となるように形成される。したがって、モールド体11の
硬化収縮の際に発生する内部応力がコア2に略均一に掛
かり、本実施例は局所的に内部応力が集中することがな
く、透磁率の低下が少なく、安定したインダクタンスが
得られる。
【0029】また、本実施例は、コア2の突縁部4の巻
芯部3に対して同一面となる側面に導電部5を設け、こ
の導電部5に、巻芯部3に巻装したコイル8の導線7の
引き出し線7aおよび電極片10の一端を磁束方向と平行に
電気的かつ機械的にそれぞれ接続するため、コイル8に
通電した際に発生する磁束が電極片10と交差する量が減
少し、Q値の低下を防止できる。
【0030】
【発明の効果】請求項1記載のチップインダクタによれ
ば、コイルを巻装するコアの巻芯部を四角柱状に形成す
るとともに四角柱状の巻芯部の対向する一対の辺に外方
に向けて突出し四角柱状に突縁部を設けてコアを形成し
たため、四角柱状の巻芯部に巻装したコイルがばらけた
り巻き弛みがなく、また、導電部に接続されるコイルか
らの導線の引き出し線が位置する側に設けた合成樹脂の
保護層が確実にコイルの巻き弛みやばらけを防止でき、
所定の特性を安定して得ることができ、また、コアの体
積を増大でき、モールド体の硬化の際に生じる応力によ
りコアが受ける歪みを低減できるとともに透磁率の減少
を防止でき、所定の特性を安定して容易に得ることがで
き、さらに、コアの突縁部の一側面に、コイルの両端が
それぞれ接続されるとともに一対の電極片がそれぞれ接
続される一対の導電部が磁束と平行方向になり、コイル
に通電した際に電極片と交差する磁束量を減少でき、Q
値の低下を防止できる。 Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip inductor provided with a pair of electrode pieces to which both ends of a coil are connected at both ends of a core on which the coil is wound. 2. Description of the Related Art Conventionally, as this type of chip inductor, for example, a configuration described in Japanese Patent Application Laid-Open No. 2-50404 has been known. In the chip inductor described in Japanese Patent Application Laid-Open No. 2-50404, a pair of leads is provided in which both ends of a coil wound around a core portion of a drum core are axially projected from both end surfaces of the drum core. Each coil is connected to a terminal, and the coil is covered with a protective layer. Furthermore, the lead terminals are engaged with the engaging portions provided at the upper end at positions spaced apart from the both end surfaces of the drum core, with the rising portions of the pair of electrode pieces rising toward the both end surfaces of the drum core. They are electrically and mechanically connected, and are molded so that the drum-shaped core on which the coil is wound, the lead terminals, and the rising portions of the electrode pieces are integrally covered with the molded body. [0004] However, in the above-described chip inductor disclosed in Japanese Patent Application Laid-Open No. 2-50404, since the cross section of the drum core is circular, the winding becomes loose when the coil is wound. There is a possibility that the dispersion will occur, and a predetermined inductance cannot be obtained. Further, since the rising portion of the electrode piece faces the end face of the drum type core, there is a problem that the magnetic flux generated when the coil is energized intersects with the rising portion, thereby lowering the Q value. The present invention has been made in view of the above problems, and has as its object to provide a chip inductor capable of stably obtaining predetermined characteristics. According to a first aspect of the present invention, there is provided a chip inductor, wherein the coil is wound around a coil.
Core portion formed in a quadrangular prism and the coil is provided on both axial ends being wound and the winding core of the winding core
Protrude outward on a pair of opposite sides of
Core having a rectangular pillar-shaped protruding edge portion, and a core portion of the core
Said coil provided on one side surface of the flange portion to be flush with
A pair of conductive portions, both ends of which are respectively connected, and the coil
Are connected to a pair of conductive parts connected respectively.
A pair of electrode pieces and the coil connected to the conductive portion
Outer periphery of the coil on the side where the lead wire of these conductors is located
And a protective layer of a synthetic resin provided on a surface, a portion of the core and the pair of electrode pieces which the coil is wound is to comprise a mold member embedding integrally ash. [0008] [action] chip inductor according to claim 1 is four to form a core portion of the core of winding a coil in quadrangular prism shape
Projecting outward on a pair of opposing sides of the prismatic core
Since the core was formed by providing a protruding edge in the shape of a square pillar,
The coil wound around the pillar-shaped core has no looseness or looseness , and the lead wire from the coil connected to the conductive part is not drawn.
The synthetic resin protective layer provided on the side where
In addition, it is possible to prevent the coil from being loosened or dislodged, and to obtain predetermined characteristics stably. In addition, the surface area of the core
The ratio decreases and the stress generated during curing of the mold
Reduces the strain on the core, preventing the permeability from decreasing.
Predetermined characteristics can be obtained stably and easily. In addition , the core
Both ends of the coil are connected to one side of the protruding edge
And a pair of conductive members to which a pair of electrode pieces are respectively connected.
Part, so that when the coil is energized,
As a result, the amount of magnetic flux is reduced, and a decrease in the Q value is prevented. An embodiment of a chip inductor according to the present invention will be described below with reference to the drawings. 1 and 2, reference numeral 1 denotes a chip inductor. The chip inductor 1 has a core 2 made of a magnetic material such as ferrite. The core 2 includes a quadrangular prismatic core 3 having a rectangular cross section, and a quadrangular prism-shaped protruding edge 4 that protrudes in a flange shape substantially perpendicularly from longitudinally opposite sides at both axial ends of the core 3. From plane H
It is formed into a square shape in the shape of a letter. Also, the protruding edge 4 of the core 2
A conductive portion 5 formed of a conductive material is provided on a side surface on the same plane as the core portion 3. In the chip inductor 1, a conductive wire 7 such as a polyurethane-coated electric wire is wound around a core portion 3 of a core 2, and both ends are electrically and mechanically connected to conductive portions 5 and 5, respectively. Is wound. Further, on the outer peripheral surface of the coil 8, on the side where the lead wires 7 a, 7 a of the conductor 7 from the coil 8 connected to the conductive portion 5 are located, a polybutadiene such as a polybutadiene for preventing the coil 8 from being loosened or loosened. A protective layer 9 made of a synthetic resin is provided. The core 2 is electrically and mechanically connected to the conductive portion 5 at one end of an elongated metal plate-shaped electrode piece 10. The chip inductor 1 includes a coil 8
The core 2 on which is wound and a part of the pair of electrode pieces 10, 10 are integrally molded with a molding resin to form a molded body.
11 and embedded along the outer peripheral surface of the mold body 11.
The electrodes 10 and 10 are bent in the same direction to form electrodes, and are formed in a chip shape. The electrode piece 10 is not limited to a mere metal piece, and may be one having a solder layer provided on the outer surface in advance, or a solder layer provided on the outer surface after bending. Next, the manufacturing process of the above embodiment will be described with reference to the drawings. First, as shown in FIG. 3, a substantially H-shaped flat core 2 having projections 4 at both ends in the axial direction of a winding core 3 is formed in advance from a magnetic material such as ferrite. FIG. 4 shows a side surface of the protruding edge portion 4 of the core 2 which is flush with the core 3.
As shown in (1), a pair of conductive portions 5 are provided by vapor deposition, sputtering, thick film printing, metal foil bonding, or the like. Then, one end of a conductive wire 7 such as a polyurethane-coated electric wire is electrically and mechanically connected to one conductive portion 5 of the core 2 by thermocompression bonding such as pulse heating, and the conductive wire 7 is wound around the core 2. The conductor 3 is wound around the core 3 a predetermined number of times.
Is electrically and mechanically connected to the other conductive portion 5 in the same manner, and as shown in FIG.
Is wound. Next, the core 2 on which the coil 8 is wound is connected to the core 2 shown in FIG.
As shown in FIG. 5, a pair of conductive portions 5, 5 to which the lead wires 7a, 7a are connected are mounted on the tips of the metal pieces 13a, 13a between the metal pieces 13a, 13a protruding opposite to the strip-shaped metal frame 13. The core 2 is placed so as to be placed, and the conductive portion 5 and the metal piece 13a are respectively connected by welding, thermocompression bonding, or the like. And
As shown in FIG. 7, a protective layer 9 made of a synthetic resin such as polybutadiene is provided on the surface of the coil 8 to which the metal piece 13a is attached. Thereafter, as shown in FIG. 8, the core 2 around which the coil 8 is wound and the tip portions of the pair of metal pieces 13a, 13a are integrally molded into a substantially rectangular parallelepiped with a molding resin, and the cured mold is formed. The outer peripheral surface of the body 11 is appropriately marked. The metal pieces 13a, 13a of the metal frame 13
a is cut into a metal piece 13a to form an electrode piece 10, and a pair of electrode pieces 10, 10 projecting from the molded body 11 are bent toward the protective layer 9 along the outer peripheral surface of the molded body 11. The electrodes are formed with their tips facing each other, and the chip inductor 1
To form Next, the operation of the above embodiment will be described. The coil 8 of the chip inductor 1 manufactured in the above embodiment was energized, and the frequency characteristics of inductance and Q value were measured. Further, as a comparative example, a chip inductor having a drum-shaped core formed so as to have the same outer diameter was used. The results are shown in FIG. 9 and FIG.
0 is shown. From the results of the frequency characteristics shown in FIG. 9, in the case of this embodiment, a higher Q value can be obtained than in the case of using the conventional drum core, and the rate of change of the inductance with respect to the change of the frequency is small. It can be seen that stable characteristics can be obtained. Further, from the results of the DC superimposition characteristics shown in FIG. 10, it can be seen that in the present embodiment, the decrease in inductance due to the increase in the DC superposition current is smaller than that of the conventional device, and the current capacity can be increased. It is known that when the conductor 7 is wound around the core portion 3 of the core 2, a predetermined inductance cannot be obtained if the conductor 7 is unbalancedly wound. When a conventional core is wound around a cylindrical drum-shaped core, the conductor may not be caught between the conductor and the outer peripheral surface of the core, and the conductor may be loosened or loosened. There, although predetermined inductance by loosening the winding or the loosened is not obtained, the core 2 of the present embodiment, since the core portion 3 is square pillar shape, such that the conductive wire 7 is caught by the corners of the core part 3 since the wound around, be uniformly wound without winding slack or loose, predetermined inductance is obtained line-to-line capacitance is stable. Further, in the present embodiment, the protective layer 9 is provided on a part of the coil 8 to securely prevent the coil 8 from being loosened or loosened at the time of molding, so that a predetermined inductance can be obtained. On the other hand, when the chip inductor 1 is formed so that the outer dimensions are within a predetermined range, the core 2 may be formed in a quadrangular prism shape to obtain the widest cross-sectional area. For this reason, the core part 3 is formed in a quadrangular prism shape as in this embodiment,
At both ends in the axial direction of the core part 3, a quadrangular prism-shaped protruding edge part 4 is formed so as to protrude from a longitudinally opposed side substantially in the form of a flange so that the core 2 is formed into a substantially H-shaped square plane. As a result, a core 2 having a wide cross-sectional area can be obtained, and a chip inductor 1 having a high Q value can be obtained. Further, since the core 2 of this embodiment has a larger volume than that of the conventional drum core, the magnetic characteristics are improved. On the other hand, when the core 2 is molded with a mold resin and covered with the mold body 11, an internal stress is generated by the curing and shrinkage of the mold resin, and the internal stress acts on the core 2. Since the chip inductor 1 of the present embodiment is molded in a rectangular parallelepiped shape so that the mounting surface on which the electrodes are formed for surface mounting is flat, the conventional drum-type core is formed on the peripheral surface of the core. While the thickness is not uniform and the stress load is concentrated on the thin portion of the core and the magnetic permeability is reduced, the core 2 of the present embodiment is prismatic, so the thickness of the mold body 11 is small. Is formed on the peripheral surface of the core 2 so as to have a substantially uniform thickness. Therefore, the internal stress generated at the time of curing shrinkage of the mold body 11 is substantially uniformly applied to the core 2, and in this embodiment, the internal stress is not locally concentrated, the magnetic permeability is less reduced, and the stable inductance is reduced. Is obtained. In this embodiment, a conductive portion 5 is provided on the side surface of the protruding edge portion 4 of the core 2 which is flush with the core portion 3, and the conductive portion 5 is wound around the core portion 3. Since the lead wire 7a of the conducting wire 7 of the coil 8 and one end of the electrode piece 10 are electrically and mechanically connected in parallel to the magnetic flux direction, the magnetic flux generated when the coil 8 is energized intersects the electrode piece 10. The amount is reduced, and a decrease in the Q value can be prevented. According to the chip inductor according to claim 1, wherein, according to the present invention, to form the winding core portion of the core of winding a coil in quadrangular prism shape
And a pair of opposing sides of the square core
The core is formed by protruding toward
Therefore, the coil wound around the square pillar-shaped core has no looseness or looseness .
Of the synthetic resin provided on the side where the lead wire of
The protective layer can reliably prevent coil loosening and loosening,
Predetermined characteristics can be obtained stably , and the core body
And the stress generated during curing of the mold
Reduced core strain and reduced magnetic permeability
And it is possible to obtain predetermined characteristics stably and easily.
And one end of the coil on one side of the protruding edge of the core.
Connected and a pair of electrode pieces
A pair of conductive parts connected in parallel to the magnetic flux
The amount of magnetic flux that intersects the electrode piece when current is
The value can be prevented from lowering.
【図面の簡単な説明】
【図1】本発明のチップインダクタの一実施例を示す断
面図である。
【図2】同上側面図である。
【図3】同上チップインダクタの製造工程のコアを示す
斜視図である。
【図4】同上チップインダクタの製造工程の導電部形成
後のコアを示す斜視図である。
【図5】同上チップインダクタの製造工程のコイルを巻
装した状況を示す斜視図である。
【図6】同上チップインダクタの製造工程の金属片を接
続した状況を示す斜視図である。
【図7】同上チップインダクタの製造工程の保護層を設
けた状況を示す斜視図である。
【図8】同上チップインダクタの製造工程のモールド成
形の状況を示す斜視図である。
【図9】同上チップインダクタの周波数特性を示すグラ
フである。
【図10】同上チップインダクタの直流重畳特性を示す
グラフである。
【符号の説明】
1 チップインダクタ
2 コア
3 巻芯部
4 突縁部
5 導電部7 導線 7a 引き出し線
8 コイル9 合成樹脂の保護層
10 電極片
11 モールド体BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view showing one embodiment of a chip inductor of the present invention. FIG. 2 is a side view of the same. FIG. 3 is a perspective view showing a core in a manufacturing process of the same chip inductor. FIG. 4 is a perspective view showing a core after a conductive portion is formed in a manufacturing process of the chip inductor. FIG. 5 is a perspective view showing a state in which a coil is wound in a manufacturing process of the chip inductor. FIG. 6 is a perspective view showing a state in which metal pieces are connected in a manufacturing process of the same chip inductor. FIG. 7 is a perspective view showing a state in which a protective layer is provided in a manufacturing process of the chip inductor. FIG. 8 is a perspective view showing a state of molding in a manufacturing process of the same chip inductor. FIG. 9 is a graph showing frequency characteristics of the same chip inductor. FIG. 10 is a graph showing a DC superposition characteristic of the same chip inductor. [Description of Signs] 1 chip inductor 2 core 3 core part 4 protruding edge part 5 conductive part 7 conductive wire 7a lead wire 8 coil 9 protective layer 10 of synthetic resin 10 electrode piece 11 molded body
Claims (1)
部およびこの巻芯部の前記コイルが巻装される軸方向の
両端に設けられかつ前記巻芯部の対向する一対の辺に外
方に向けてフランジ状に突出する四角柱状の突縁部を備
えたコアと、前記コアの巻芯部と同一面となる突縁部の一側面に設け
られ前記コイルの両端がそれぞれ接続される一対の導電
部と、 前記コイルの両端をそれぞれ接続された一対の導電部に
接続される一対の電極片と、 前記導電部に接続される前記コイルからの導線の引き出
し線が位置する側の前記コイルの外周面に設けた合成樹
脂の保護層と、 前記コイルが巻装されたコアおよび前記一対の電極片の
一部を一体に埋設するモールド体とを具備したことを特
徴とするチップインダクタ。(57) [Claim 1] A coil, a quadrangular pillar-shaped core portion in which the coil is wound in the middle, and an axial direction of the core portion where the coil is wound. It is provided at both ends and is outside the pair of opposite sides of the core portion.
A core provided with a quadrangular prism- shaped protruding edge protruding in a flange shape toward one side, and provided on one side surface of the protruding edge which is flush with the core of the core.
And a pair of conductive members to which both ends of the coil are respectively connected.
Part and a pair of conductive parts each connected to both ends of the coil.
Lead wire extraction from a pair of electrode pieces to be connected and the coil connected to the conductive part
A synthetic tree provided on the outer peripheral surface of the coil on the side where the tie line is located
Chip inductor, wherein the protective layer of fat, and a kite comprising a mold body embedded integrally a part of the core and the pair of electrode pieces which the coil is wound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28831494A JP3530604B2 (en) | 1994-11-22 | 1994-11-22 | Chip inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28831494A JP3530604B2 (en) | 1994-11-22 | 1994-11-22 | Chip inductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08148341A JPH08148341A (en) | 1996-06-07 |
| JP3530604B2 true JP3530604B2 (en) | 2004-05-24 |
Family
ID=17728580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28831494A Expired - Fee Related JP3530604B2 (en) | 1994-11-22 | 1994-11-22 | Chip inductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3530604B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4532167B2 (en) * | 2003-08-21 | 2010-08-25 | コーア株式会社 | Chip coil and substrate with chip coil mounted |
| JP4490698B2 (en) * | 2004-02-05 | 2010-06-30 | コーア株式会社 | Chip coil |
| WO2009037978A1 (en) * | 2007-09-19 | 2009-03-26 | Murata Manufacturing Co., Ltd. | Coil antenna, and its manufacturing method |
| JP2014170783A (en) * | 2013-03-01 | 2014-09-18 | Murata Mfg Co Ltd | Electronic component |
-
1994
- 1994-11-22 JP JP28831494A patent/JP3530604B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08148341A (en) | 1996-06-07 |
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