JP3537717B2 - Film-type platinum resistance thermometer, method of manufacturing the same, and thin surface sensor - Google Patents
Film-type platinum resistance thermometer, method of manufacturing the same, and thin surface sensorInfo
- Publication number
- JP3537717B2 JP3537717B2 JP29358799A JP29358799A JP3537717B2 JP 3537717 B2 JP3537717 B2 JP 3537717B2 JP 29358799 A JP29358799 A JP 29358799A JP 29358799 A JP29358799 A JP 29358799A JP 3537717 B2 JP3537717 B2 JP 3537717B2
- Authority
- JP
- Japan
- Prior art keywords
- platinum resistance
- film
- coating resin
- resistance wire
- flexible substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title claims description 120
- 229910052697 platinum Inorganic materials 0.000 title claims description 60
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000000758 substrate Substances 0.000 claims description 41
- 239000011248 coating agent Substances 0.000 claims description 24
- 238000000576 coating method Methods 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 23
- 238000003860 storage Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 14
- 239000000945 filler Substances 0.000 claims description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 description 11
- 239000004642 Polyimide Substances 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229920002379 silicone rubber Polymers 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Thermistors And Varistors (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、従来よりも飛躍的
に小形化できるフィルム型白金測温抵抗体およびその製
造方法と、このフィルム型白金測温抵抗体を用いて表面
温度を高精度で測定可能な薄型表面センサに関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film-type platinum resistance temperature detector which can be drastically reduced in size compared to the prior art, a method of manufacturing the same, and a surface temperature using the film-type platinum resistance temperature detector with high accuracy. The present invention relates to a thin surface sensor that can be measured.
【０００２】[0002]
【従来の技術】従来、表面センサとして使用される白金
測温抵抗体は、主に金属のブロックなどに白金抵抗線を
封入したタイプが主流である。この種のタイプは、柔軟
性に問題があり、曲面加工することが困難なため曲面の
表面温度を精度よく測定できなかった。また、その形状
が大きく微少曲面の表面温度の測定が困難であった。2. Description of the Related Art Conventionally, as a platinum resistance temperature detector used as a surface sensor, a type in which a platinum resistance wire is sealed in a metal block or the like is mainly used. This type has a problem in flexibility and it is difficult to form a curved surface, so that the surface temperature of the curved surface cannot be measured accurately. In addition, the shape was so large that it was difficult to measure the surface temperature of a minute curved surface.
【０００３】但し、柔軟性を考慮した製品では、シリコ
ンラバー型センサがある。これは、柔軟性に関しての問
題はないが使用中に断線したり、抵抗値が変化してしま
い正確な温度測定ができないというトラブルが発生して
いた。これらの問題は、製作方法や構造に問題があった
と考えられる。また、フィルム型センサは、欧米諸国等
で製作されていることは確認されているが、厚さ０．５
ｍｍ、幅１０ｍｍ、長さ１００ｍｍ以上という大きさが
最小である。However, among products considering flexibility, there is a silicon rubber type sensor. This has no problem with flexibility, but has caused troubles such as disconnection during use and a change in resistance value, making it impossible to measure temperature accurately. It is considered that these problems were caused by the manufacturing method and the structure. It has been confirmed that the film-type sensor is manufactured in Europe and the United States.
mm, width 10 mm and length 100 mm or more are the smallest.
【０００４】これを図１２によって簡単に説明する。図
１２は従来のフィルム型センサの一例を示す平面図であ
る。１はフィルム型センサ全体を示す。２は全体のベー
スとなるポリイミドテープ、３はポリイミド芯、４は白
金抵抗線で、ポリイミド芯３に巻回され、その両端はリ
ード線５，６に接続される。７，８は前記リード線５，
６の被覆である。そしてポリイミド芯３は、ポリイミド
テープ２に接着される。リード線５，６もポリイミドテ
ープ２に接着され、全体として１個のフィルム型センサ
１が構成されている。[0004] This will be briefly described with reference to FIG. FIG. 12 is a plan view showing an example of a conventional film sensor. Reference numeral 1 denotes the entire film type sensor. Reference numeral 2 denotes a polyimide tape serving as an entire base, reference numeral 3 denotes a polyimide core, reference numeral 4 denotes a platinum resistance wire wound around the polyimide core 3, and both ends thereof are connected to lead wires 5 and 6. 7, 8 are the lead wires 5,
6 is a coating. Then, the polyimide core 3 is bonded to the polyimide tape 2. The lead wires 5 and 6 are also adhered to the polyimide tape 2 to form one film type sensor 1 as a whole.
【０００５】[0005]
【発明が解決しようとする課題】上述したフィルム型セ
ンサは小形とは云っても前述したように、厚さ０．５ｍ
ｍ，幅１０ｍｍ，長さ１００ｍｍ以上もあり、微少面の
温度測定には向かなかった。また、曲面加工ができない
ため、無理に測定しようとすると白金抵抗線４に無理な
力がかかり、断線事故となる不具合があった。The above-mentioned film-type sensor has a thickness of 0.5 m even though it is small.
m, width 10 mm, length 100 mm or more, it was not suitable for measuring the temperature of a minute surface. In addition, since curved surface processing cannot be performed, an unreasonable force is applied to the platinum resistance wire 4 when an attempt is made to perform a forced measurement, and there is a problem that a disconnection accident occurs.
【０００６】本発明の目的は、従来のものに比べて極め
て小型で、かつ曲面加工ができるフィルム型白金測温抵
抗体およびその製造方法ならびにこのフィルム型白金測
温抵抗体を用いた薄型表面センサを提供することにあ
る。SUMMARY OF THE INVENTION It is an object of the present invention to provide a film-type platinum resistance temperature detector which is extremely small in size as compared with a conventional one and which can be formed into a curved surface, a method of manufacturing the same, and a thin surface sensor using the film-type platinum resistance temperature detector Is to provide.
【０００７】[0007]
【課題を解決するための手段】本発明にかかるフィルム
型白金測温抵抗体は、高耐熱性で可撓性を有するフィル
ムの両面に、このフィルムより低融点のコーティング樹
脂が被覆された上部基材ならびに下部基材と、さらに前
記上部基材と下部基材の前記コーティング樹脂の融着に
より形成された可撓性基板に支持される少なくとも２本
のリード線と、前記可撓性基板に形成された白金抵抗線
の収納室と、この収納室に収納され両端が前記リード線
に接続された白金抵抗線と、前記コーティング樹脂と白
金抵抗線とは接着しない前記白金抵抗線の外力によるず
れを防止する弾力性絶縁充填物とを備えたものである。Means for Solving the Problems A film-type platinum resistance temperature detector according to the present invention comprises an upper substrate in which a coating film having a lower melting point than the film is coated on both sides of a film having high heat resistance and flexibility. A material and a lower substrate, at least two lead wires supported by a flexible substrate formed by fusing the coating resin of the upper substrate and the lower substrate, and formed on the flexible substrate. A storage room for the platinum resistance wire, a platinum resistance wire housed in the storage room and both ends connected to the lead wire, and a shift caused by an external force of the platinum resistance wire that does not adhere to the coating resin and the platinum resistance wire. And a resilient insulating filler for prevention.
【０００８】また、本発明にかかるフィルム型白金測温
抵抗体の製造方法は、高耐熱性で可撓性を有するフィル
ムの両面に、このフィルムより低融点のコーティング樹
脂が被覆された上部基材と下部基材との間に、所要数の
リード線を配置し、全体を加熱しながら加圧して前記コ
ーティング樹脂を溶融し、一体化して可撓性基板を形成
して前記リード線を固定し、次いで前記可撓性基板の一
部を切り欠いて白金抵抗線の収納室を形成し、この収納
室内に所定の抵抗値を有する白金抵抗線を収納してその
両端を所要の前記リード線に接続し、その後、前記コー
ティング樹脂と白金抵抗線とは接着しない弾力性絶縁充
填物を、前記収納室内に充填して固化させるものであ
る。Further, the method of manufacturing a film-type platinum resistance temperature sensor according to the present invention is directed to an upper substrate in which a coating resin having a lower melting point than the film is coated on both sides of a film having high heat resistance and flexibility. A required number of lead wires are arranged between the base material and the lower base material, and the whole is heated and pressurized to melt the coating resin, integrated to form a flexible substrate, and fixed the lead wires. Then, a part of the flexible substrate is cut out to form a platinum resistance wire storage chamber, a platinum resistance wire having a predetermined resistance value is stored in the storage chamber, and both ends of the platinum resistance wire are connected to the required lead wires. After the connection, the coating resin is filled with an elastic insulating filler that does not adhere to the platinum resistance wire, and is solidified.
【０００９】さらに、本発明にかかる薄型表面センサ
は、上記フィルム型白金測温抵抗体と、被測定物の表面
形状に合わせて曲面加工が施されるとともに、前記可撓
性基板が接着される熱検出板とからなるものである。Further, in the thin surface sensor according to the present invention, the film-type platinum resistance temperature detector is subjected to a curved surface processing in accordance with the surface shape of an object to be measured, and the flexible substrate is bonded. And a heat detection plate.
【００１０】そして、熱検出板は、１枚の板を２つ折り
するか、または２枚の板を溶接もしくは張り合わせ、そ
の隙間に可撓性基板が挿入されたものである。[0010] The heat detection plate is obtained by folding one plate or welding or laminating two plates, and a flexible substrate is inserted into a gap therebetween.
【００１１】[0011]
【発明の実施の形態】はじめに、本発明にかかるフィル
ム型白金測温抵抗体の実施形態について図１，図２を用
いて説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First, an embodiment of a film type platinum resistance thermometer according to the present invention will be described with reference to FIGS.
【００１２】図１は本発明にかかるフィルム型白金測温
抵抗体の平面図，図２は、図１のＡ−Ａ線による断面拡
大図である。なお、図１では点線となる部分もわかり易
くするため実線で示してある。FIG. 1 is a plan view of a film-type platinum resistance temperature detector according to the present invention, and FIG. 2 is an enlarged sectional view taken along line AA of FIG. In FIG. 1, the portions indicated by dotted lines are indicated by solid lines for easy understanding.
【００１３】図１，図２において、１１はフィルム型白
金測温抵抗体（以下、単に測温抵抗体という）を示す。
１２，１５はそれぞれ高耐熱性で可撓性を有する例えば
ポリイミドのような材料からなるフィルム、１３，１６
はこれらのフィルム１２，１５の両面に被覆された例え
ば０．０５ｍｍ以下の厚みのコーティング樹脂で、フィ
ルム１２，１５より低融点の材料、例えばフッ素樹脂が
用いられ、それぞれ上部基材１４と下部基材１７を構成
している。１８は可撓性基板で、上部基材１４と下部基
材１７とを加熱，加圧することでコーティング樹脂１
３，１６が溶融し、一体化したものである。１９，２０
はリード線で、そのうちリード線２０は短く切って中継
端子として用いている。そして、可撓性基板１８の形成
時に上部基材１４と下部基材１７との間で各リード線１
９，２０は支持される形となる。In FIGS. 1 and 2, reference numeral 11 denotes a film-type platinum resistance temperature detector (hereinafter simply referred to as a resistance temperature detector).
Reference numerals 12 and 15 denote films made of a material such as polyimide, which have high heat resistance and flexibility.
Is a coating resin having a thickness of, for example, 0.05 mm or less, which is coated on both surfaces of the films 12 and 15; a material having a lower melting point than the films 12 and 15, for example, a fluororesin is used; The material 17 is constituted. Reference numeral 18 denotes a flexible substrate, which heats and presses the upper base material 14 and the lower base material 17 to form the coating resin 1.
3 and 16 are melted and integrated. 19, 20
Is a lead wire, of which the lead wire 20 is cut short and used as a relay terminal. When the flexible substrate 18 is formed, each of the lead wires 1 is placed between the upper substrate 14 and the lower substrate 17.
9 and 20 are supported.
【００１４】２１は白金抵抗線の収納室で、可撓性基板
１８の一部を切り欠いて形成される。２２は白金抵抗線
で、２本が収納室２１に収納され、その両端はそれぞれ
リード線１９，２０に接続される。２３は弾力性絶縁充
填物で、コーティング樹脂１３，１６や白金抵抗線２２
と接着しない材料、例えばシリコンゴムが用いられる。
なお、２４，２５はポリイミドのような材料からなるフ
ィルムである。Reference numeral 21 denotes a storage room for the platinum resistance wire, which is formed by cutting out a part of the flexible substrate 18. Reference numeral 22 denotes a platinum resistance wire, two of which are stored in a storage room 21, and both ends of which are connected to lead wires 19 and 20, respectively. Numeral 23 denotes an elastic insulating filler, which covers the coating resin 13, 16 or the platinum resistance wire 22.
For example, a material that does not adhere to the substrate, such as silicon rubber, is used.
24 and 25 are films made of a material such as polyimide.
【００１５】上記構成の測温抵抗体１１は、白金抵抗線
２２が弾力性絶縁充填物２３やコーティング樹脂１３，
１６に接触はしているが接着していないので自由度が大
きく、外力が加わっても断線等を起こすことがない。In the resistance temperature detector 11 having the above-described structure, the platinum resistance wire 22 is made of an elastic insulating filler 23, a coating resin 13,
16 is in contact with, but not adhered to, so that the degree of freedom is large, and even if an external force is applied, disconnection or the like does not occur.
【００１６】次に、図１，図２に示す測温抵抗体１１の
製造方法を図３〜図８を参照して説明する。なお、図
１，図２と同じ箇所には同一符号を付してある。Next, a method of manufacturing the resistance bulb 11 shown in FIGS. 1 and 2 will be described with reference to FIGS. 1 and 2 are denoted by the same reference numerals.
【００１７】はじめに、図３に示すように、リード線１
９，２０となるニッケル平板（例えば厚さ０．０５ｍ
ｍ、幅２ｍｍ）を３本並べて上部基材１４と下部基材１
７の間に配置する。なお、リード線１９，２０にはニッ
ケル平板の他に、白金平板などの他の金属を用いること
もできる。First, as shown in FIG.
9, 20 nickel plate (eg, 0.05 m thick)
m, width 2 mm) and the upper substrate 14 and the lower substrate 1
7 between. Note that other metals such as a platinum flat plate can be used for the lead wires 19 and 20 in addition to the nickel flat plate.
【００１８】次にポリイミドフィルムの融点に近い温度
で圧力をかけると、図４に示すように上部基材１４と下
部基材１７とは張合わせられて一体化し、可撓性基板１
８が形成される。Next, when pressure is applied at a temperature close to the melting point of the polyimide film, the upper substrate 14 and the lower substrate 17 are bonded and integrated as shown in FIG.
8 are formed.
【００１９】その後、リード線２０となるニッケル平板
だけ短く切断する。After that, only the nickel flat plate serving as the lead wire 20 is cut short.
【００２０】次いで、可撓性基板１８の中央部分を切り
欠いて白金抵抗線の収納室２１を図５（図１も参照）の
ように形成する。Next, a central portion of the flexible substrate 18 is cut out to form a platinum resistance wire storage chamber 21 as shown in FIG. 5 (see also FIG. 1).
【００２１】次いで、図６のように可撓性基板１８の下
面に上面側のみがコーティング樹脂で被覆されたフィル
ム２４を融着する。Next, as shown in FIG. 6, a film 24 having only the upper surface covered with a coating resin is fused to the lower surface of the flexible substrate 18.
【００２２】次に、アニールされコイル状になった２本
の白金抵抗線２２を図７のように収納室２１内に配置す
る。Next, the two platinum resistance wires 22 which have been annealed and coiled are arranged in the storage chamber 21 as shown in FIG.
【００２３】次いで２本の白金抵抗線２２の両端をそれ
ぞれリード線１９，２０に接続し、２本のリード線１９
端からみて２本の白金抵抗線２２が直列になるようにす
る。（図１を参照）。Next, both ends of the two platinum resistance wires 22 are connected to lead wires 19 and 20, respectively.
The two platinum resistance wires 22 are arranged in series as viewed from the end. (See FIG. 1).
【００２４】その後、弾力性絶縁充填物２３として、例
えばシリコンゴムを収納室２１内に流し込み、固化させ
て図８のように白金抵抗線２２を固定する。Thereafter, as the elastic insulating filler 23, for example, silicon rubber is poured into the storage chamber 21 and solidified to fix the platinum resistance wire 22 as shown in FIG.
【００２５】最後に、可撓性基板１８の上面に下面側の
みがコーティング樹脂で被覆されたフィルム２５を融着
して（図２参照）工程を終了する。Finally, a film 25 whose only lower surface is coated with the coating resin is fused to the upper surface of the flexible substrate 18 (see FIG. 2), and the process is completed.
【００２６】この製作方法により、素子の導線形式は２
導線式、３導線式、４導線式に対応できる構造である。
また、ポリイミドフィルムの板厚の選択により、現在の
ところ最小厚さ０．２ｍｍまでの製作が可能であり、最
小の大きさは、幅３．０ｍｍ長さ４．０ｍｍの製作が可
能である。また、口出し線の本数を増やすことでダブル
及びトリプル等の製作も可能である。According to this manufacturing method, the conductor type of the element is 2
It is a structure that can support a conductor type, a three-wire type, and a four-wire type.
In addition, by selecting the thickness of the polyimide film, it is possible to produce a film having a minimum thickness of 0.2 mm at present, and a minimum size of 3.0 mm in width and 4.0 mm in length is possible. Further, by increasing the number of lead wires, double, triple, and the like can be manufactured.
【００２７】従って、板厚、幅及び長さの数値がこれよ
り大きければ製作に関しての問題はない。また、使用温
度に関係なく使用される場合、シリコンゴムと白金抵抗
線との相性の良さから、ポリイミドフィルム以外にガム
テープ、ビニールテープ、紙テープなどの各種テープ類
での製作も可能である。Accordingly, if the numerical values of the plate thickness, width and length are larger than these values, there is no problem in manufacturing. In addition, when used regardless of the operating temperature, various tapes such as a gum tape, a vinyl tape, and a paper tape can be manufactured in addition to the polyimide film because of the good compatibility between the silicon rubber and the platinum resistance wire.
【００２８】図９に本発明の他の実施形態を示す。図９
では図１と同様にわかり易くするために点線となる部分
も実線で示してある。この実施形態では白金抵抗線２２
は１本とし、リード線２０は用いていない。他は図１，
図２の実施形態と同様である。FIG. 9 shows another embodiment of the present invention. FIG.
In FIG. 1, the portions indicated by dotted lines are also shown by solid lines for easy understanding similarly to FIG. In this embodiment, the platinum resistance wire 22
And one lead wire 20 is not used. Others are shown in Figure 1,
This is similar to the embodiment of FIG.
【００２９】図１０は、本発明の薄型表面センサの一実
施形態を示す平面図である。この実施形態では測温に上
述した測温抵抗体１１を用い、これに熱検出板３１を取
り付けて薄型表面センサ３０としたものである。FIG. 10 is a plan view showing one embodiment of the thin surface sensor of the present invention. In this embodiment, the temperature measuring resistor 11 described above is used for temperature measurement, and a heat detecting plate 31 is attached to the temperature measuring resistor 11, thereby forming a thin surface sensor 30.
【００３０】熱検出板３１の構造は、図１１に示すよう
に例えば、板厚０．０５ｍｍのステンレスの板を２枚折
り合わせ、その隙間３２にフィルム型白金測温抵抗体を
入れる構造である。ステンレスの板にかえてその他の金
属又は樹脂でも製作はできる。また、板厚、幅及び長さ
等における制限はない。As shown in FIG. 11, the structure of the heat detecting plate 31 is, for example, a structure in which two stainless steel plates having a thickness of 0.05 mm are folded, and a film-type platinum temperature measuring resistor is inserted into the gap 32. . Other metals or resins can be used instead of stainless steel plates. In addition, there is no limitation on the thickness, width, length, and the like.
【００３１】製作方法は、まずステンレスの板を指定さ
れた寸法に切断する。その後、片側を溶接するか、又は
折り曲げてからフィルム型白金測定抵抗体を挟み込み曲
面加工した後に反対側を溶接する。この製造工程におい
て指定された曲面加工が自由自在に可能である。この時
の最小の大きさは板厚０．３ｍｍ、隙間０．２ｍｍであ
り、幅１０ｍｍ、長さ１０ｍｍの製作が可能である。従
って、板厚、幅及び長さの数値がこれにより大きければ
製作に関しての問題はない。In the manufacturing method, first, a stainless steel plate is cut into a specified size. Then, one side is welded, or the other side is welded after bending and bending a film-type platinum measuring resistor into a curved surface. The curved surface processing specified in this manufacturing process can be freely performed. At this time, the minimum size is a plate thickness of 0.3 mm, a gap of 0.2 mm, and a width of 10 mm and a length of 10 mm can be manufactured. Therefore, if the numerical values of the plate thickness, the width and the length are larger, there is no problem in the production.
【００３２】その後、隙間３２にエポキシ樹脂等を充填
してフィルム型白金測温抵抗体１１を固定し完成する。Thereafter, the film 32 is filled with an epoxy resin or the like to fix the film-type platinum resistance temperature detector 11 to complete it.
【００３３】なお、上記実施形態では、コイル状の白金
抵抗線２２を用いたが、これは直線状のものであっても
よい。Although the coil-shaped platinum resistance wire 22 is used in the above embodiment, it may be a linear one.
【００３４】[0034]
【発明の効果】本発明にかかるフィルム型白金測温抵抗
体によれば、白金抵抗線が弾力性絶縁充填物やコーティ
ング樹脂に接着していないので外力が加わっても断線を
起こすことがなく、したがって曲面加工を施すことがで
きる。また、外力によって抵抗値及び温度係数の変化を
殆ど起こさない。According to the film-type platinum resistance temperature detector of the present invention, since the platinum resistance wire is not adhered to the elastic insulating filler or the coating resin, it does not break even when an external force is applied. Therefore, curved surface processing can be performed. Further, the resistance value and the temperature coefficient hardly change due to the external force.
【００３５】また、本発明の製造方法によればフィルム
型白金測温抵抗体を同一品質で生産することができる。Further, according to the manufacturing method of the present invention, a film-type platinum resistance temperature detector can be produced with the same quality.
【００３６】さらに本発明にかかる薄型表面センサは、
上述のフィルム型白金測温抵抗体を用い、これに熱検出
板を取り付けたので、フィルム型白金測温抵抗体の最小
板厚０．２ｍｍ以上開いていれば組込むことが可能であ
る。これは、使用用途により加工が自由自在に可能であ
り、その曲面を付けた状態で使用できることが利点であ
る。例えば、配管などの表面温度を測定したいとき、配
管の外径は殆どが異なっている。このとき曲率が指定さ
れれば、それなりの曲面加工をしてから使用することが
可能である。Further, the thin surface sensor according to the present invention comprises:
Since the above-mentioned film-type platinum resistance temperature detector was used and a heat detection plate was attached thereto, the film-type platinum resistance temperature detector can be incorporated if the minimum plate thickness is 0.2 mm or more. This is advantageous in that the processing can be freely performed depending on the intended use, and that it can be used with its curved surface. For example, when it is desired to measure the surface temperature of a pipe or the like, the outer diameter of the pipe is almost different. At this time, if the curvature is specified, it is possible to use after performing a suitable curved surface processing.
【図１】本発明にかかる測温抵抗体の一実施形態を示す
平面図である。FIG. 1 is a plan view showing one embodiment of a resistance temperature detector according to the present invention.
【図２】図１におけるＡ−Ａ線による断面拡大図であ
る。FIG. 2 is an enlarged sectional view taken along line AA in FIG.
【図３】本発明にかかる測温抵抗体の製造方法を説明す
るための断面図である。FIG. 3 is a cross-sectional view for explaining a method for manufacturing a resistance temperature detector according to the present invention.
【図４】本発明にかかる測温抵抗体の製造方法を説明す
るための断面図である。FIG. 4 is a cross-sectional view for explaining the method of manufacturing the resistance bulb according to the present invention.
【図５】本発明にかかる測温抵抗体の製造方法を説明す
るための断面図である。FIG. 5 is a cross-sectional view for explaining the method of manufacturing the resistance bulb according to the present invention.
【図６】本発明にかかる測温抵抗体の製造方法を説明す
るための断面図である。FIG. 6 is a cross-sectional view for explaining the method of manufacturing the resistance bulb according to the present invention.
【図７】本発明にかかる測温抵抗体の製造方法を説明す
るための断面図である。FIG. 7 is a cross-sectional view for explaining the method of manufacturing the resistance bulb according to the present invention.
【図８】本発明にかかる測温抵抗体の製造方法を説明す
るための断面図である。FIG. 8 is a cross-sectional view for explaining the method of manufacturing the resistance bulb according to the present invention.
【図９】本発明にかかる測温抵抗体の他の実施形態を示
す平面図である。FIG. 9 is a plan view showing another embodiment of the resistance temperature detector according to the present invention.
【図１０】本発明にかかる薄型表面センサの一実施形態
を示す平面図である。FIG. 10 is a plan view showing one embodiment of a thin surface sensor according to the present invention.
【図１１】図１０における熱検出板の側面図である。FIG. 11 is a side view of the heat detection plate in FIG.
【図１２】従来のフィルム型センサの一例を示す平面図
である。FIG. 12 is a plan view showing an example of a conventional film sensor.
１１ フィルム型白金測温抵抗体（測温抵抗体） １２，１５ フィルム １３，１６ コーティング樹脂 １４ 上部基材 １７ 下部基材 １８ 可撓性基板 １９，２０ リード線 ２１ 収納室 ２２ 白金抵抗線 ２３ 弾力性絶縁充填物 ２４，２５ フィルム ３０ 薄型表面センサ ３１ 熱検出板 ３２ 隙間 11 Film type platinum resistance temperature detector (resistance temperature detector) 12,15 film 13,16 Coating resin 14 Upper substrate 17 Lower substrate 18 Flexible substrate 19,20 Lead wire 21 storage room 22 Platinum resistance wire 23 Elastic insulating filler 24,25 film 30 Thin surface sensor 31 Heat detection plate 32 gap
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平９−105683（ＪＰ，Ａ) 特開 平７−333073（ＪＰ，Ａ) 特開 昭57−211028（ＪＰ，Ａ) 実開 平７−333073（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) G01K 7/18 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-9-105683 (JP, A) JP-A-7-333073 (JP, A) JP-A-57-121028 (JP, A) 333073 (JP, U) (58) Field surveyed (Int. Cl. 7 , DB name) G01K 7/18
Claims (4)
面に、このフィルムより低融点のコーティング樹脂が被
覆された上部基材ならびに下部基材と、さらに前記上部
基材と下部基材の前記コーティング樹脂の融着により形
成された可撓性基板に支持される少なくとも２本のリー
ド線と、前記可撓性基板に形成された白金抵抗線の収納
室と、この収納室に収納され両端が前記リード線に接続
された白金抵抗線と、前記コーティング樹脂と白金抵抗
線とは接着しない前記白金抵抗線の外力によるずれを防
止する弾力性絶縁充填物とを備えたことを特徴とするフ
ィルム型白金測温抵抗体。An upper substrate and a lower substrate having both surfaces of a highly heat-resistant and flexible film coated with a coating resin having a lower melting point than the film, and further comprising an upper substrate and a lower substrate. At least two lead wires supported by a flexible substrate formed by fusing the coating resin, a platinum resistance wire storage chamber formed on the flexible substrate, and both ends stored in the storage chamber A film comprising: a platinum resistance wire connected to the lead wire; and an elastic insulating filler for preventing displacement of the platinum resistance wire, which does not adhere to the coating resin and the platinum resistance wire, due to an external force. Type platinum resistance thermometer.
面に、このフィルムより低融点のコーティング樹脂が被
覆された上部基材と下部基材との間に、所要数のリード
線を配置し、全体を加熱しながら加圧して前記コーティ
ング樹脂を溶融し、一体化して可撓性基板を形成して前
記リード線を固定し、次いで前記可撓性基板の一部を切
り欠いて白金抵抗線の収納室を形成し、この収納室内に
所定の抵抗値を有する白金抵抗線を収納してその両端を
所要の前記リード線に接続し、その後、前記コーティン
グ樹脂と白金抵抗線とは接着しない弾力性絶縁充填物
を、前記収納室内に充填して固化させることを特徴とす
るフィルム型白金測温抵抗体の製造方法。2. A required number of lead wires are arranged between an upper substrate and a lower substrate coated with a coating resin having a lower melting point than the film on both sides of a film having high heat resistance and flexibility. Then, the coating resin is melted by applying pressure while heating the whole, and integrated to form a flexible substrate to fix the lead wires. Then, a part of the flexible substrate is cut out to form a platinum resistor. A wire storage chamber is formed, a platinum resistance wire having a predetermined resistance value is stored in the storage chamber, and both ends thereof are connected to the required lead wires, and thereafter, the coating resin and the platinum resistance wire do not adhere to each other. A method for manufacturing a film-type platinum resistance temperature detector, wherein an elastic insulating filler is filled in the storage chamber and solidified.
面に、このフィルムより低融点のコーティング樹脂が被
覆された上部基材ならびに下部基材と、さらに前記上部
基材と下部基材の前記コーティング樹脂の融着により形
成された可撓性基板に支持される少なくとも２本のリー
ド線と、前記可撓性基板に形成された白金抵抗線の収納
室と、この収納室に収納され両端が前記リード線に接続
された白金抵抗線と、前記コーティング樹脂と白金抵抗
線とは接着しない前記白金抵抗線の外力によるずれを防
止する弾力性絶縁充填物とを備えたフィルム型白金測温
抵抗体と、被測定物の表面形状に合わせて曲面加工が施
されるとともに、前記可撓性基板が接着される熱検出板
とからなることを特徴とする薄型表面センサ。3. An upper base material and a lower base material each having a highly heat-resistant and flexible film coated on both surfaces with a coating resin having a lower melting point than the film, and further comprising the upper base material and the lower base material. At least two lead wires supported by a flexible substrate formed by fusing the coating resin, a platinum resistance wire storage chamber formed on the flexible substrate, and both ends stored in the storage chamber A platinum resistance wire connected to the lead wire, and a film-type platinum resistance thermometer comprising a resilient insulating filler for preventing a displacement of the platinum resistance wire due to an external force that does not adhere to the coating resin and the platinum resistance wire. A thin surface sensor comprising: a body; and a heat detection plate to which a curved surface is formed in accordance with a surface shape of an object to be measured and to which the flexible substrate is adhered.
か、または２枚の板を溶接もしくは張り合わせ、その隙
間に可撓性基板が挿入されたものであることを特徴とす
る請求項３に記載の薄型表面センサ。4. The heat detecting plate according to claim 1, wherein one plate is folded in two or two plates are welded or bonded, and a flexible substrate is inserted in a gap therebetween. Item 4. A thin surface sensor according to item 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29358799A JP3537717B2 (en) | 1999-10-15 | 1999-10-15 | Film-type platinum resistance thermometer, method of manufacturing the same, and thin surface sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29358799A JP3537717B2 (en) | 1999-10-15 | 1999-10-15 | Film-type platinum resistance thermometer, method of manufacturing the same, and thin surface sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001116625A JP2001116625A (en) | 2001-04-27 |
| JP3537717B2 true JP3537717B2 (en) | 2004-06-14 |
Family
ID=17796665
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29358799A Expired - Lifetime JP3537717B2 (en) | 1999-10-15 | 1999-10-15 | Film-type platinum resistance thermometer, method of manufacturing the same, and thin surface sensor |
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| Country | Link |
|---|---|
| JP (1) | JP3537717B2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4496736B2 (en) * | 2003-09-01 | 2010-07-07 | ソニー株式会社 | Display device |
| JP5896160B2 (en) | 2012-09-28 | 2016-03-30 | 三菱マテリアル株式会社 | Temperature sensor |
| KR101625386B1 (en) * | 2014-05-15 | 2016-05-31 | 한국산업기술대학교 산학협력단 | Platinum temperature sensor which is available in flexible and high-temperature insulation, and its manufacturing method |
| CN111982331B (en) * | 2020-09-04 | 2025-06-06 | 丹东科亮电子有限公司 | Ultra-thin platinum thermal sensor induction core making equipment |
| CN116337262A (en) * | 2023-04-20 | 2023-06-27 | 广州德芯半导体科技有限公司 | A doped thin-film platinum resistance temperature sensor and its preparation method |
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1999
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