JP3538097B2 - Image sensor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image sensor used for an image input section of a facsimile machine or the like.

[0002]

2. Description of the Related Art FIGS. 12 (a), 12 (b), and 13 show a conventional image sensor, and FIG. 12 (a) is a side view showing a state where a side plate showing the image sensor is removed. FIG. 12B is a front view. In the figure, 1 is a document, 2 is a line light source in which light emitting diodes are linearly arranged, 3
Is an erecting equal-magnification imaging rod lens array composed of a plurality of rod lenses (not shown), 4 is a sensor substrate, 5 is a sensor IC linearly arranged on the sensor substrate 4, Reference numeral 6 denotes a glass plate located on the document running surface, 7 denotes an upper sensor frame, 8 denotes a lower sensor frame, 9 denotes a wire cable, 10 denotes a connector, and 11 denotes an FP.
Reference numerals C and 12 denote resin side plates, and reference numeral 13 denotes a pass range until light reflected by the original 1 is imaged by the sensor IC 5.
FIG. 13 is a perspective view showing the details of the upper sensor frame 7, 14 is a long groove processed to allow reflected light from a document coming out of the rod lens array 3 to pass, and 15 is a wire to pass the wire cable 9. Reference numeral 16 denotes a tapped hole processed for fixing the resin side plate 12.

Next, the operation will be described. Line light source 2
Light passes through the glass plate 6 and illuminates the document 1 uniformly. The illuminating light is reflected from the original 1 like a passing range 13 according to the density information of the image, passes through the long groove 14 in the rod lens of the rod lens array 3 and forms an image on the sensor IC 5. The sensor IC 5 accumulates electric charges in accordance with the intensity of the reflected light, and outputs the electric charge via the sensor substrate 4, the FPC 11, and the connector 10. Upper sensor frame 7 includes line light source 2, rod lens array 3, glass plate 6, connector 1
0, which is connected to the lower sensor frame 8 which supports the resin side plate 12 and supports the sensor substrate 4, and forms an image sensor. The wire cable 9 passes through the groove 15 and passes through the line light source 2.
And the connector 10 are electrically connected, and the FPC 11 is electrically connected between the sensor board 4 and the connector 10.

[0004]

Since the conventional image sensor is configured as described above, the light reflected by the original 1 contains the density information of the image on the original surface, and the glass through which this light passes. Aluminum processing portions such as the long groove 14, the groove 15, and the tapped hole 16 are provided between the plate 6 and the rod lens array 3, in the long groove 14 located below the rod lens array 3, and in the passing range 13 between the long groove 14 and the sensor IC 5. If there is foreign matter such as aluminum chips such as burrs generated from the wire, the wire cable 9, and solder chips or solder flux from the mounted components on the sensor substrate 4, accurate document surface image density information is not transmitted to the sensor IC 5. There was a problem. Further, as shown in FIG. 14, when the long groove 14 is located below the rod lens array 3, when the rod lens array 3 is displaced or tilted, the light reflected by the long groove 14 hits the sensor IC 5, and an accurate document surface is obtained. There is a problem that image density information is not transmitted.

[0005] The present invention has been made to solve the above-described problems, and has as its object to accurately transmit image density information of a document 1 to a sensor IC 5.

[0006]

According to a first aspect of the present invention, there is provided an image sensor comprising a rod lens for converging light reflected from a document.
Light to the exit side of the rod lens array
Of the rod lens array.
The rod lens door from one or the other side
First and second frames divided so as to sandwich a ray
Supported on the first frame in the passage area,
Receiving light focused by the rod lens array
A sensor substrate having a sensor IC;
The light from the ray onto the sensor IC on the sensor substrate.
The second fixing the rod lens array to image
Set the position of frame 1 in advance, and
The one side surface of the rod lens array in the first
First fixing means for fixing to the frame of
The other side of the lens array to the second frame.
And a second fixing means connected to the second frame.
The mounting component provided on the sensor substrate and
The sensor substrate is separated from the sensor IC so as to be separated.
A projection projecting toward the sensor IC,
Provided on the sensor substrate between the mounting component,
A separating portion that is in close contact with the protrusion, wherein the protrusion and the
Due to the separation unit, light on the mounting component side is transmitted to the sensor IC side.
It is obtained so as to prevent from entering into the passage range.

According to a second aspect of the present invention , the image sensor includes
2. The separation unit according to claim 1, wherein the separation unit is made of a resin.
It is what is described in.

[0008]

[0009]

[0010]

[0011]

[0012]

[0013]

[0014]

[0015]

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 One embodiment of the present invention will be described with reference to FIGS. FIG.
(A) is a side view with the side plate removed, FIG. 1 (b)
Is a front view. In the drawing, reference numeral 1 denotes an original, 2 denotes a line light source in which light-emitting diodes are linearly arranged, and 3 denotes an erecting equal-magnification imaging rod lens array having a plurality of rod lenses (not shown)
It is constituted by. 4 is a sensor substrate, 5 is a sensor IC arranged linearly on the sensor substrate 4, 6 is a glass plate located on the document running surface, 10 is a connector, and 13 is a sensor IC 5 which reflects light reflected by the document 1. Indicates a passing range until an image is formed. 17, a sensor frame A for placing the sensor substrate 4, 18 a sensor frame B for placing the line light source 2, 18a a sensor frame B1
Reference numeral 8 denotes a protrusion, 19 denotes a sensor frame protrusion for positioning the rod lens array 3, and 20 denotes a hole provided in the sensor frame B. Reference numeral 21 denotes a line light source substrate on which the line light source 2 is mounted, and reference numeral 27 denotes a separation unit that separates the sensor IC from other components.

As described above, in the present embodiment, the sensor frame for fixing the line light source 2 and the sensor substrate 4 is divided into two parts, the sensor frame A17 and the sensor frame B18. There is no need to machine long grooves to pass. For this reason, it is assembled as a close contact image sensor with burrs and burrs left by machining of long grooves and the like remaining, and burrs and burrs fall off the sensor frame due to vibrations and the like caused by subsequent transportation, and these foreign substances generate reflected light. It is possible to perform accurate reading of an original without moving to the passage range 13 without interrupting transmission of image density information on the original surface. Also, there is no need to process the long groove, and the manufacturing time can be reduced.

FIG. 2 is a sectional view showing a case where a conductive metal 22 having a spring property is used in place of the wire cable 9 of FIG. Reference numeral 23 denotes a power supply terminal engaging portion of the line light source substrate 21, and 24 denotes a terminal engaging portion on the sensor substrate 4, which is connected to a connector via a pattern on the sensor substrate 4 and can be connected to an external power supply. it can. The conductive metal 22 having a spring property is formed in a U-shape, and both ends are sandwiched between the engaging portions of the power supply terminals 23 and the terminals 24 and are stretched by the spring force of the conductive metal 22. The contact pressure is increased and mechanical and electrical coupling is achieved.
The conductive metal 22 is protected by a non-conductive layer except for both ends.

As described above, the soldering becomes unnecessary, and foreign matters such as solder chips and flux do not enter the passing range of the reflected light and do not obstruct the density information of the document surface. Further, the soldering process can be omitted, and the assembling time can be reduced.

Embodiment 2 This embodiment will be described with reference to FIGS. FIG. 3A is a side view in a state where a side plate is removed, and FIG. 3B is a front view. In the figure, reference numeral 12 denotes a resin side plate on which a pin-shaped protrusion 12a is provided on the inside. Reference numeral 18 denotes a sensor frame B, and reference numeral 20 denotes a hole provided in the sensor frame B18.

The pin-shaped protrusion 12 inside the resin side plate 12
Since a is fixed by inserting a into the hole 20 of the sensor frame B18, there is no need to fix it using screws, and therefore there is no need to machine a tapped hole in the sensor frame B18. Therefore, since there is no burrs or burrs generated at the time of screw tightening, the same effect as in the first embodiment can be obtained. In the present embodiment, the projecting portion is provided on the resin side plate 12, but the sensor frame A17 or the sensor frame B1
8 and a hole may be provided in the resin side plate 12.

Embodiment 3 FIG. This embodiment will be described with reference to FIGS. FIG. 4A is a side view in a state where a side plate is removed, and FIG. 4B is a front view. In the figure, reference numeral 25 denotes a groove provided inside the resin side plate 12.
Reference numeral 9 denotes a wire cable that electrically connects the second line light source and the fourth sensor substrate. Reference numeral 18 denotes a sensor frame B.

As shown in the figure, the wire cable 9 passes through the groove 25 and connects the line light source 2 and the sensor substrate 4, so that it is not necessary to machine the groove for passing the wire cable 9 in the sensor frame B18. . As described above, since it is not necessary to form a groove in the sensor frame B18, the same effect as in the first embodiment can be obtained.

Embodiment 4 This embodiment will be described with reference to FIGS. FIG. 5A is a side view, and FIG.
(B) is a front view. In the figure, reference numeral 26 denotes a conductive metal having a spring property, which is embedded in the resin side plate 12.
Reference numeral 23 denotes a power supply terminal engaging portion of the line light source 2, and reference numeral 24 denotes a terminal engaging portion on the sensor substrate 4, which is connected to a connector via a pattern on the sensor substrate and can be connected to an external power supply. . In the first embodiment, the line light source substrate 21 on which the power supply terminal engaging portion 23 connected to the conductive metal 22 having spring properties is mounted and the sensor substrate 4 on which the terminal engaging portion 24 is mounted are parallel. However, in the present embodiment, the line light source substrate 21 and the sensor substrate 4 are connected at a place that is not parallel. The conductive metal 26 having a spring property is formed in a U-shape, and both ends are respectively sandwiched between the engaging portions of the power supply terminals 23 and the terminals 24 and are stretched by the spring force of the conductive metal 26 to form a contact surface. The contact pressure of the
It is electrically connected and is buried in the resin side plate 12 except for both ends of the conductive metal 26.

As described above, in the first embodiment, the conductive metal having the spring property is protected by the non-conductive layer. However, in the present embodiment, the resin side plate also serves as the non-conductive layer. Therefore, it has the same effect as that of the first embodiment, and it is possible to attach a conductive metal when attaching the resin side plate.
Further, since the conductive metal is fixed together with the fixing of the resin side plate, there is no electrical short / open due to displacement.

Embodiment 5 6, reference numeral 4 denotes a sensor substrate, 5 denotes a sensor IC arranged linearly on the sensor substrate 4, 28 denotes a range of components mounted on the sensor substrate 4 using solder, and 27 denotes a resin. This is a separation section formed by a molding agent.

As shown in FIGS. 6 and 1, the sensor IC 5 mounted on the sensor substrate 4 is separated from the components mounted using solder by using the separating portion 27 of a resin molding agent. In the area 28 where the soldering component is mounted in the existing space, the solder waste and the solder flux
The light does not penetrate into the passing range 13 of the reflected light from the document, and does not obstruct the density information on the document surface. Further, light other than the reflected light from the original 1 does not enter and does not obstruct the density information on the original surface.

Also, the separating portion 27 of the resin molding agent is
Projection 18a provided on sensor frame B18 shown in FIG.
In order to better block the gap between the sensor IC 4 and the sensor IC 5 and the components mounted using solder, the shading information may be hindered by infiltration of solder dust, solder flux, and light other than reflected light from the original. Absent.

Further, there is an effect of fixing the sensor frame B18, the sensor substrate 4, and the sensor frame A17. Further, since the resin is used as the molding agent, the separating portion is easily formed, and the gap between the sensor frame B and the sensor substrate is easily closed.

Embodiment 6 FIG. In the first embodiment, the sensor frame A17 and the sensor frame B18 are provided with the projecting portions 19 in order to determine the position of the rod lens array 3 between the rod lens array 3 and the sensor IC 5, but as shown in FIG. When using the sensor frame A17 and the sensor frame B18 which are not provided with the protrusions, the rod lens array 3 is fixed to the surface of the sensor frame A17 with a double-sided tape, an adhesive, or an adhesive as shown in FIG. Therefore, it is necessary to accurately perform positioning in the X direction which directly affects the resolution of the image sensor. In the present embodiment, a method of attaching the rod lens array 3 will be described with reference to FIG. In the figure, 1
Is a document lens, 3 is an erecting equal-magnification imaging rod lens array, 4 is a sensor substrate, 5 is a sensor IC linearly arranged on the sensor substrate 4, 6 is a glass plate located on the document running surface, 17 is a sensor frame A on which the sensor substrate 4 is placed, a is the thickness of the glass plate 6, b is the dimension from the glass plate 6 to the sensor IC 5, c is the bonding surface between the sensor frame A17 and the rod lens array 3, and 29 is Any reference plane. However, the reference surface 29 is a surface perpendicular to the bonding surface c. f is the thickness of the sensor IC5.

The position of the rod lens array 3 must be located at the center with respect to the optical distance of the sum of the thickness a of the glass plate 6 and the dimension b from the glass plate 6 to the sensor IC 5, and the position deviated from the center , The resolution is inferior.
Therefore, the assembly is performed as follows. Sensor IC5
Is mounted on the sensor frame A17. Dimensions x ₁ from the reference plane 29 to the sensor frame A17 in the state of this assembly, to measure the dimensions x ₂ from the reference plane 29 to the sensor substrate 4. From these measured dimensions, the thickness a of the glass plate 6 and the thickness f of the sensor IC 5, a dimension x ₃ from the reference plane 29 to the center of the rod lens array 3 is calculated by the following equation, and the rod lens array 3 is connected to the sensor frame A 17. Fixed to.

[0032]

(Equation 1)

In addition to the above assembling example, when there is a transparent mold 30 (FIG. 10) having a thickness g and a glass plate substrate 31 (FIG. 11) having a thickness h as shown in FIGS.
Equations (1) are as follows.

[0034]

(Equation 2)

As described above, in the present embodiment, the positional relationship between the sensor frame and the sensor substrate is measured to position the rod lens array, and the rod lens array is fixed with a double-sided tape or an adhesive or an adhesive. Since the sensor frame has no protrusions, light passing through the rod lens array collides with the protrusions and is reflected toward the light receiving portion of the sensor IC. The image density information can be made accurate without being read by the sensor IC.

According to the invention, a rod lens array is provided.
Eliminates the need for groove processing between the
Prevents foreign matter from being generated by
This has the effect of making it possible to take.

[0037]

[0038]

[0039]

[0040]

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[0042]

[0043]

[0044]

[0045]

[0046]

[Brief description of the drawings]

FIG. 1 is a diagram showing an image sensor according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating an image sensor according to an embodiment of the present invention.

FIG. 3 is a diagram showing a side plate of an image sensor according to another embodiment of the present invention.

FIG. 4 is a view showing a groove of a side plate of an image sensor according to another embodiment of the present invention.

FIG. 5 is a view showing a conductive metal of an image sensor according to another embodiment of the present invention.

FIG. 6 is a perspective view of a sensor substrate of an image sensor according to another embodiment of the present invention.

FIG. 7 is a diagram showing an image sensor according to another embodiment of the present invention.

FIG. 8 is a perspective view showing a positional relationship among a rod lens array, a sensor substrate, and a sensor frame of an image sensor according to another embodiment of the present invention.

FIG. 9 is an explanatory view showing one example of a method for manufacturing an image sensor of the present invention.

FIG. 10 is an explanatory diagram illustrating an example of the method for manufacturing an image sensor according to the present invention.

FIG. 11 is an explanatory view illustrating an example of the image sensor manufacturing method of the present invention.

FIG. 12 is a diagram showing a conventional image sensor.

FIG. 13 is a diagram showing a sensor frame of a conventional image sensor.

FIG. 14 is a diagram showing a positional relationship among a rod lens array, a sensor substrate, and a sensor frame of a conventional image sensor.

[Explanation of symbols]

1 manuscript 2 line light source 3 rod lens array 4 Sensor board 5 Sensor IC 6 glass plate 7 Upper sensor frame 8 Lower sensor frame 9 wire cable

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-2-177776 (JP, A) JP-A-3-204265 (JP, A) JP-A-2-89461 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) H04N 1/028

Claims (2)

(57) [Claims] 1. A rod lens array for converging light reflected from a document, and a light exit side of the rod lens array.
To form a passage range of the light, the first and second frames from the one and the other side not and out side of the light divided so as to sandwich the rod lens array of the rod lens array, wherein the passing range A sensor substrate supported on a first frame and having a sensor IC for receiving light converged by the rod lens array; and light from the rod lens array on the sensor IC of the sensor substrate. set the position of the front <br/> Symbol first frame for fixing the rod lens array to image in advance, the one side of Oite the rod lens array in position <br/> location that the set Said
A first fixing means for securing the first frame, the second fastening means of solid <br/> wearing the other side surface of the rod lens array to said second frame, continuous to said second frame and provided, a projecting portion projecting toward the direction of the sensor substrate so as to partition and separating the sensor IC and the mounting part provided on the sensor substrate, the sensor IC
And provided on the sensor substrate between the mounting component,
A separating portion that is in close contact with the protrusion , wherein the protrusion and
Due to the separation unit, light on the mounted component side is transmitted to the sensor I.
An image sensor, wherein the image sensor is prevented from entering the passing area on the C side . Wherein said separation unit has an image sensor according to claim 1, characterized by being configured by a resin.