JP3545507B2 - Automatic molding equipment using release film - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an automatic molding apparatus using a release film, which is used for manufacturing a resin-sealed semiconductor device.
[0002]
[Prior art]
Conventionally, an automatic molding apparatus such as a transfer molding apparatus has been used as an apparatus for manufacturing a resin-encapsulated semiconductor device such as a PLCC or QFP. These automatic molding devices are configured to set a molding die having a cavity recess for resin molding or the like in a press device, and to automatically supply a resin tablet for resin molding and a molded product to perform resin molding. .
[0003]
When handling a strip-shaped molded product such as a lead frame, set a magazine containing a plurality of molded products in the molding machine, and the molded product is automatically supplied from the magazine to the mold, and the resin is molded. You. The product after resin molding is removed from the mold, and after removing unnecessary resin, only the product is stored in a storage tray or the like.
In the conventional resin molding device, the resin pressure-fed into the cavity comes into direct contact with the inner surface of the mold and is cured. Therefore, an ejector pin is provided in the mold, and the resin portion of the product is released by ejecting the ejector pin when the mold is opened.
[0004]
[Problems to be solved by the invention]
In recent years, semiconductor devices having extremely large power consumption and high-frequency characteristics have been mounted in recent semiconductor devices, and a resin-molded semiconductor device that can cope with these characteristics has been demanded. In a resin mold type semiconductor device, selection of a mold resin is important because a resin sealing material used for the resin mold greatly affects these characteristics.
[0005]
For example, in the case of a semiconductor device mounted with a semiconductor element having a large heat value, a resin having a high thermal conductivity, for example, a resin in which a ceramic filler having a high thermal conductivity and a high heat resistance is mixed at a high ratio may be used. . However, such a resin has a strong effect of abrading the mold, and if the resin mold is continued, the abrasion of the gate of the mold rapidly progresses, which causes a problem that mass production becomes impossible.
[0006]
Also, recent resin mold products tend to be thinner, but in the case of such a thin package, it becomes difficult to fill the cavity with resin during resin molding. A problem such as generation of voids occurs. Further, since the pitch of the bonding portion such as a lead frame is extremely narrow due to the miniaturization of the package, there is a problem that a wire sweep occurs when the resin passes between these wirings. As a method for solving these problems, it is considered to use a resin having high fluidity. However, if such a resin having high fluidity is used, sliding of a plunger, an ejector pin, or the like that comes into contact with the resin by a mold is considered. There is a problem that the resin invades the moving part and the operation becomes impossible, and there is a problem that the resin leaks on the parting surface of the mold and stains the mold and the molded product.
[0007]
The resin molding method using a release film has been devised as a method for solving such a problem in the conventional automatic molding apparatus. In other words, this resin molding method uses a flexible film that is easily peeled off from the resin with the required heat resistance and uses a release film, and covers the inner surface of a cavity or the like of the mold with the release film during resin molding. This is a method in which the resin is molded without bringing the resin into direct contact with the mold surface.
[0008]
FIG. 8 shows a resin molding method using a release film. In the figure, the left half of the center line shows a state before the resin is filled in the cavity, and the right half shows a state in which the cavity is filled with the resin. The molded product 204 is clamped by the upper mold 200 and the lower mold 202, and the resin 208 is filled into the cavity 210 from the pot 206 and resin-molded. Reference numerals 212a and 212b denote release films that cover the mold surface according to the inner surface shapes of the cavity recesses of the upper mold 200 and the lower mold 202, fill the cavity 210 with resin, and perform resin molding.
[0009]
In this example, a wrapping resin 214 in which the resin is sealed with a heat-resistant film is used as the mold resin. The wrapping resin 214 is supplied to the pot 206 in a state where the resin is sealed with a film, and the sealing portions on both side edges of the wrapping film are expanded by pumping the resin with a plunger, so that the resin 208 is filled in the cavity 210. .
[0010]
In the case of the resin molding method using a release film as described above, the molding resin used is used because the molding resin does not come into direct contact with the mold surface, and therefore, the abrasion of the mold at the gate portion or the cavity concave portion does not pose a problem. There is an advantage that the type is not restricted. Further, the mold release after the resin molding is easy, and the mold release can be easily performed without providing the ejector pins. In addition, since the mold surface is covered and molded with resin, there is an advantage that even if a resin having high fluidity is used, there is no fear that the resin may enter the gap portion of the mold.
[0011]
As described above, in the conventional resin molding apparatus, the type of resin to be used is restricted for reasons such as abrasion of the molding die, whereas the resin molding method using the release film described above has such restrictions. Instead, it is possible to use the most suitable resin according to the product, and to use the most suitable mold resin for the product.
The present invention proposes a configuration suitable for an automatic molding apparatus to which such a resin molding method using a release film is applied.
[0012]
[Means for Solving the Problems]
The present invention has the following configuration to achieve the above object.
That is, resin molding of the moldPart ofMold sideFlexibleRelease filmByIn an automatic molding device using a release film to cover and resin mold,The upper mold was fixed to the fixed platen and the fixed side, and the lower mold was fixed to the movable platen and the movable side.Molded productSupply to lower moldA press mechanism for resin molding;
It is controlled in conjunction with the resin molding operation in the press mechanism, and is adjusted to the set position of the molded article on the mold.Is absorbed by airIntermittently feed a long release film intermittentlyFor mold diesThe transport mechanism of the release film to be supplied, and is controlled in conjunction with the resin molding operation in the press mechanism,Formed in the strip shapeMolded productA product supply unit provided with a work carry-in head for transferring theProducts after resin moldingEquipped with a product unloading unit provided with a product unloading head that unloads the product from the lower moldAnd a loading / unloading mechanism.
Further, in an automatic molding apparatus using a release film for resin molding by covering the mold surface of the resin molding portion of the mold with a release film having flexibility, the upper mold is fixed to a fixed platen to a fixed side, A press mechanism that fixes the lower mold to the movable platen to make it movable and supplies a strip-shaped product to the lower mold to perform resin molding, and interlocks with the resin molding operation at the press mechanism. The transfer of a release film which is controlled and controlled to intermittently feed a long release film which is air-adsorbed in accordance with a set position of the molded article on the mold die and supplies the release film to the mold die. A transport unit that reciprocates between a mechanism unit and a position retracted from the press mechanism unit and a position entered the press mechanism unit in conjunction with a resin molding operation in the press mechanism unit. A work carrying head for supplying the strip-shaped article to the lower mold, a resin supply head for supplying the molding resin to the lower mold, and a resin molded product and unnecessary resin. And a carry-in / carry-out mechanism provided with a product carry-out head that carries out the product from the lower mold.Characterized byYou.
Further, an antistatic portion for preventing electrification of the release film is provided in the transport mechanism of the release film.
Further, the transport mechanism of the lease film has a supply reel around which a long release film is wound and a collection reel which winds up the release film after resin molding.
Also, the release film transport mechanism accommodates the release film on the discharge side without winding it on a reel.In a boxIt is characterized by having a storage section for introducing and storing.
The release film transport mechanism may include a feed drive unit that moves the feed head forward and backward in parallel with the feed direction of the release film, and pinches and transports the release film by the feed head.
Further, the release film transport mechanism includes a feed drive unit that feeds the fixed length by a pinch roller on the supply side.
Further, the invention is characterized in that the transport mechanism of the release film has a mechanism for transporting the release film by squeezing the release film on a collecting side with a squeezing roller.
Further, the release film transport mechanism has a sensor for detecting a transport position of the release film during transport.
[0013]
[Action]
In the automatic molding apparatus using the release film according to the present invention, a new release film is formed on the mold die of the press mechanism by the release film transport mechanism for each resin molding operation or for each of a plurality of resin molding operations. The product is supplied by a fixed-size feed, and then, a product to be molded and a molding resin are supplied to a molding die by a product carrying-in / out mechanism to be resin-molded. After the resin molding, the product and unnecessary resin are taken out of the press mechanism by the product carry-in / out mechanism.
The product carry-in / out mechanism has a work carry-in head, a resin supply head, and a product carry-out head, and a necessary operation such as supply of a molded product is automatically performed by these transport heads.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described.
[First Embodiment]
FIG. 1 is a front view showing the structure of a first embodiment of an automatic molding apparatus using a release film according to the present invention, and FIG. 2 is a plan view. This resin molding machine is composed of a press mechanism for resin molding the molded product, a release film transport mechanism for supplying the release film to the press mechanism in synchronization with the resin molding operation in the press mechanism, and a molded product. And a carry-in / carry-out mechanism for transferring the product after the resin molding from the press mechanism to the press mechanism.
[0015]
In FIG. 1, part A is the press mechanism, parts B and C are release film transport mechanisms, and part D is a product carry-in / out mechanism.
The release film 10 passes through the press mechanism unit A from the release film supply unit B installed on the left side of the press mechanism unit A in FIG. 1 and is collected at the release film collection unit C on the right side. As shown in FIG. 2, the product carry-in / carry-out mechanism D is disposed in a direction orthogonal to the direction in which the release film is conveyed by the release film carrying mechanism. The overall planar arrangement of the press mechanism A, the supply unit B, the recovery unit C, and the product loading / unloading mechanism D is substantially T-shaped.
[0016]
Press mechanism
The press mechanism A is provided with a press machine for mounting a mold for clamping and molding the article to be molded with a resin. The operation of mounting the upper mold 12 and the lower mold 14 on the press machine and performing resin molding is the same as in the case of a conventional transfer molding apparatus or the like.
In this example, the upper mold 12 is fixed to the fixed platen 15 to be on the fixed side, and the lower mold 14 is fixed to the movable platen 16 to be on the movable side. The movable platen 16 is guided and supported by a tie bar fixed on a base so as to be movable in the mold opening and closing direction, and is connected to and pressed by a press ram of a press device.
[0017]
In this example, a strip-shaped lead frame is used as the molded article 20. As shown in FIG. 2, a molding die sets two molded articles 20 with a pot 22 interposed therebetween. The release film 10 is transported as a long body in the left and right direction in the figure in two rows. The longitudinal direction of the molded product 20 is set on the mold in the left-right direction in FIG. 2, and the arrangement position of each series of release films 10 is set according to the arrangement position of the molded product 20. The release film is sent from the supply unit B toward the collection unit C at a fixed size.
[0018]
The pot 22 of the mold is provided in an elongated groove shape in a plane arrangement in the middle between the molded products 20. As the plunger for feeding the resin from the pot 22, a plunger whose pressing end face is formed in an elongated rectangular shape in accordance with the planar shape of the pot 22 is used. The resin to be set in the pot 22 is also a resin formed in an elongated stick shape according to the shape of the pot 22. Of course, the shape of the pot 22 provided in the molding die is not limited to the one formed in such an elongated groove shape, but a circular shape in which a columnar resin tablet is charged as in a conventional multi-pot type transfer molding apparatus. It may be.
[0019]
Release film transport mechanism
The release film transport mechanism supplies a new release film 10 to each of the upper mold 12 and the lower mold 14 every time the resin molding operation is performed a specified number of times by the press mechanism A, and the used release film 10 is molded into a mold. Remove from above and collect. When transporting the release film 10, it is possible to stop the transport of the release film 10, perform resin molding a plurality of times, and then transport the resin. However, usually, each time one resin molding is completed, a new release film is transferred. 10 is supplied.
[0020]
In FIG. 1, reference numeral 18 denotes a supply reel on which the release film 10 is wound in a roll shape, and reference numeral 19 denotes a collection reel for collecting the used release film 10. The release film 10 is a long film, and the release film 10 sent out from the supply reel 18 is taken up by the collection reel 19. In this example, two supply reels 18 and two collection reels 19 are used for the upper mold 12, and two supply reels 18 and two collection reels 19 are used for the lower mold 14. The supply reel 18 and the recovery reel 19 are arranged below the frame of the apparatus so as not to hinder the operation.
[0021]
As described above, the release film 10 covers the mold surfaces of the upper mold 12 and the lower mold 14 so as to prevent the resin from adhering to the mold surface such as the cavity concave portion during the resin molding. In this example, the release film 10 is suction-adsorbed to the mold surface of the mold and supported to prevent displacement during resin molding. After the resin molding, the molded article 20 is separated from the release film 10, the molded article 20 is taken out from the press mechanism A, and the release film 10 is wound up by a collecting reel.
[0022]
When the release film 10 is transported, the release film 10 is intermittently fed by the length of the release film 10 clamped by a mold. Since the length to be clamped by the mold differs depending on the product, the pull-out length of the release film 10 (the fixed length feeding length) may be set according to the product. The method adopted in this example as a method for feeding the release film 10 in a fixed size uses feed heads 26 and 27 reciprocating in the feed direction, and the release head 10 is pinched and pulled out by the feed heads 26 and 27. Is the way. The feed head 26 is provided on the supply side of the release film 10, and the feed head 27 is provided on the collection side.
[0023]
The feed heads 26 and 27 linearly reciprocate by setting a predetermined range using a linear servomotor. Reference numeral 28 denotes a stator of a linear servomotor, and the feed heads 26 and 27 are attached to a slider that is reciprocally driven on the stator 28. The moving range of the slider on the stator 28 is the pull-out length of the release film 10. The feed heads 26 and 27 pinch the release film 10 to move the release film 10 when moving forward (from left to right in FIG. 1), and pinch the release film 10 when moving backward. Release and move freely to release film 10.
The stator 28 is fixed to the fixed platen 15 on the upper mold 12 side, and is fixed to the movable platen 16 so as to move up and down together with the lower mold 14 on the lower mold 14 side.
[0024]
Reference numeral 30 denotes a support arm extending on both sides of the press mechanism A for supporting a linear servomotor or the like. The support arm 30 is fixed to the fixed platen 15 on the upper mold 12 side, and is fixed to the movable platen 16 on the lower mold 14 side.
The release film 10 is guided to a supply reel 18 and a recovery reel 19 via a roller 32 provided at an end of the support arm 30. The roller 32 on the upper mold 12 is extended slightly outward from the roller 32 on the lower mold 14, and the release film 10 on the upper mold 12 and the release film 10 on the lower mold 14 intersect to generate static electricity. This prevents dust from sticking together due to static electricity and hindering transport.
[0025]
Reference numeral 34 denotes a pinch head provided on the support arm 30 between the stator 28 of the linear servomotor and the roller 32. The pinch head 34 functions to pinch the release film 10 and prevent the release film 10 from being pulled back when the feed head 26 pulls out the release film 10 and returns to the original position in the supply section B. Further, the pinch head 34 of the collecting section C functions to pinch the release film 10 so that the release film 10 is not pulled back when the feed head 27 moves toward the press mechanism A.
[0026]
Reference numeral 36 denotes a tension roller installed on the support arm 30 between the stator 28 of the linear servomotor and the press mechanism A. The tension roller 36 has a guide function for transporting the release film 10 without shifting the position, and a function for preventing the release film 10 from sagging during transport.
[0027]
An adjustment head 40 guides the release film 10 and sets the release film 10 at a predetermined position of a mold. The adjustment heads 40 are arranged on both sides of the mold in the transport direction of the release film 10, and support the release film 10 so as to stretch over the mold. The drive of the adjustment head 40 is controlled so that the release film 10 projects in the mold opening and closing direction in order to contact and separate the release film 10 from the mold surfaces of the upper mold 12 and the lower mold 14.
[0028]
In this embodiment, the release film 10 is suction-supported on the mold surface by air suction and resin molding is performed. The outline of the resin molding operation in this case will be described. First, the release film 10 is air-adsorbed to the mold surface of the mold, and then is also air-adsorbed from the bottom of the cavity concave portion, so that the release film 10 becomes embossed according to the inner surface shape of the cavity concave portion. Next, the molded article 20 and the resin for molding are supplied, and the molded article 20 is clamped by the upper mold 12 and the lower mold 14 and resin-molded. After resin molding, the product is on the lower mold 14 side with the mold opened, and the release film 10 is suctioned to the upper mold 12 by air. The product is taken out from the lower mold 14, the release film 10 is separated from the upper mold 12 and the lower mold 14 by pneumatic ejection or the like, and the release film 10 is transported and driven.
[0029]
The operations of the feed heads 26 and 27, the adjustment head 40, and the like when the release film 10 peeled from the upper mold 12 and the lower mold 14 are transported are as follows.
First, before the release film 10 is peeled from the mold surface, the feed head 26 of the supply unit B is moved by a length of about twice the amount of protrusion of the adjust head 40 in advance, so that the release film 10 is slackened. The adjusting head 40 can protrude with a margin.
Next, the release film 10 on the mold surfaces of the upper mold 12 and the lower mold 14 is peeled off from the mold surface by pneumatic ejection or the like, and the adjustment head 40 is protruded to slightly separate the release film 10 from the mold surface. It is supported in the state where it is made.
[0030]
After the adjusting head 40 is protruded, the feed heads 26 and 27 are advanced to the fixed-size feed position to convey the release film 10, but the moving operation of the feed head 26 and the feed head 27, and the adjusting head 40 on the supply unit side. The operation of the adjusting head 40 on the collecting section side is controlled so as to slightly shift the timing. That is, on the supply unit side, after the feed head 26 has completely advanced to the feed position, the adjusting head 40 on the supply unit side is retracted, and on the recovery unit side, the feed head 27 is moved upward and downward from the forward completion position. After stopping at the previous coordinate by the length, lowering the collection-side adjustment head 40, it is moved to the forward completion position.
[0031]
At this time, if the tension sensor of the release film 10 detects the slack of the release film 10, a correction may be made as long as the tension is within the preset maximum feed amount.
When the feed head 26 and the feed head 27 are started to move, the feed unit side starts to move ahead of twice the adjustment head stroke length. If the feed head 26 and the feed head 27 move while maintaining this difference, the simplest feed control method can be used. However, this is performed smoothly so that the release film 10 is controlled so that the release film 10 does not contact the mold surface as much as possible. Good to do.
[0032]
The feed amount of the feed head 26 of the supply unit B and the feed head 27 of the collection unit C when transporting the release film 10 is basically the same, but the release film 10 may be stretched or stretched due to heat and clamping during resin molding. Because of contraction, the feed amounts of the feed heads 26 and 27 need to be corrected.
After the release film 10 is conveyed as described above, the release film is suctioned to the mold surface of the mold by air to prepare for the next resin mold. In this way, the resin film can be molded while transporting the release film 10.
[0033]
Product loading / unloading mechanism
In FIG. 1, reference numeral 50 denotes a product carrying-in / out mechanism, which is a transport head for setting a product to be molded into a mold and taking out the product from the mold. The transfer head 50 includes a work carry-in head for supplying a molded product to a mold, a resin supply head for supplying a resin for molding to the pot 22, and a product carry-out head for carrying out a product and unnecessary resin after resin molding. It has.
[0034]
The transport head 50 reciprocates between a position where it is retracted outside the press mechanism A and a position where it has entered the press mechanism A in order to carry in a molded article and carry out a product, and performs a required operation. In FIG. 2, reference numeral 51 denotes a guide rail for guiding and moving the transport head 50. The transport head 50 linearly reciprocates along the guide rail 51 to set the molded product 20 and take out the product.
[0035]
The work carry-in head, the resin supply head, and the product carry-out head are arranged in series in the moving direction of the carrying head 50, and are controlled so as to perform required operations. Several arrangements of these heads are possible depending on the order of the operation of setting a molded article or the like in the mold and the operation of taking out the product.
[0036]
For example, when performing operations such as setting of a molded product while moving the transport head 50 into the press mechanism A from outside the press mechanism A, a product unloading head is arranged at the forefront of the transport head 50, and then There is a method of arranging and operating a work carrying head and then a resin supply head. In this case, when the transport head 50 has entered the press mechanism A, the product is first picked up by the product unloading head, further advanced, the workpiece 20 is set by the work loading head, and further advanced by the resin supply head. To set the mold resin. Thereafter, the transport head 50 is moved out of the press mechanism A, the taken-out product is stored in the storage tray, and a new molded product is stored in the work loading head.Holding, Set the mold resin.
[0037]
This setting method is a case where resin molding is performed in an arrangement in which a resin path for resin filling is provided in an upper mold (upper runner molding). In other words, when wrapping resin is used as the resin to be supplied to the mold, the wrapping resin wrapping film is arranged so as to partially overlap with the molded product. It has to do with the placement of runners in the mold. As described above, the method of setting the molding resin on the molded article is the upper runner method, and the method of setting the molding resin is performed after setting the molding resin when the lower mold is provided with the runner.
[0038]
In addition to the above-mentioned setting method, the transport head 50 enters the press mechanism A from the outside of the press mechanism A, and firstly, the product is picked up by the product discharge head arranged at the forefront of the transport head 50 and pressed. The workpiece is unloaded from the mechanism A to the outside, the product is delivered to the storage device, and at the same time, the workpiece and the mold resin are chucked by the work loading head and the resin supply head, and the transport head 50 is again moved into the press mechanism A, It is also possible to adopt a setting method in which the molded article 20 is set by the work loading head, and then the molding resin is supplied by the resin supply head. According to the arrangement of the transport head 50 and the like, there is an advantage that such a supply method can be efficiently performed.
[0039]
In this way, the method of supplying the molded product and the mold resin after the product has been unloaded first is the method that allows the resin-molded product to be transported to the storage station as quickly as possible, and the product is partially cooled in a natural convection state This has the advantage that distortion and internal stress can be minimized. Thereafter, the product is sandwiched between plates heated to about 120 ° C., gradually cooled to about 50 ° C. while being lightly pressed, and stored in a magazine or the like. Can produce.
[0040]
As another method, after opening the mold, first, the transport head 50 is moved to the forefront by passing through the press mechanism A, and while the transport head 50 is moved in the returning direction, the pickup of the product and the setting of the molded article are performed. And so on. In this case, the arrangement of the heads in the transport head 50 is a resin supply head, a work carry-in head, and a product carry-out head from the front side of the transport head 50. By moving the transport head 50 in the return direction, first, the product is picked up by the product unloading head, then the workpiece is set by the work loading head, and the resin is supplied to the mold by the resin supply head. I do. Also in this case, molding is performed by the upper runner method.
[0041]
In the case of this method, since the product is taken out and the molded product is supplied while moving the transport head 50 in the retracting direction, the distance that the product picked up by the transport head 50 passes through the press mechanism A is reduced. In addition, there is an advantage that a thin burr of resin can be prevented from dropping on a mold.
[0042]
In addition, it is of course possible to arrange the product unloading head, the work loading head, and the resin supply head in the transfer head 50 in a different order from the above example. For example, in the above-described example, the molding resin is supplied after the molding resin is set in the molding die. On the contrary, the molding resin may be set after supplying the molding resin. In such a case, the arrangement of the work carry-in head and the resin supply head may be reversed from the above example.
[0043]
As described above, the order in which the molded article and the mold resin are set becomes a problem when resin molding is performed using the above-described wrapping resin. In this case, the setting order differs depending on whether the runner path connecting the pot and the cavity is provided in the lower mold or the upper mold. In other words, when the runner path is provided in the upper mold, the release film is adsorbed to the mold by air, and then the molded article is set in the lower mold, and the mold resin is set thereon. When the runner path is provided in the lower mold, the release film is air-absorbed to the mold, then the mold resin is set, and the molded article is set thereon.
[0044]
In the above example, the product is taken out or the molded product is set by moving the transport head 50 forward or backward only in one direction, but the product is set or the product is taken out. If the transfer head 50 is allowed to move forward and backward when performing the operation, it is possible to arbitrarily change the order in which the products are taken out and the setting order of the molded article regardless of the arrangement of each head in the transfer head 50. It is.
[0045]
The example shown in FIG. 2 is an example of a case where the product is taken out while the transport head 50 enters the press mechanism A. In the transport head 50, a product unloading head 52 is arranged at the forefront on the entry side, then a resin supply head 54, and then a work loading head 56 is arranged.
At the retreat position, the product is received from the product unloading head 52, stored in the storage tray, and the work loading head 56 is newly chucked to the molded product 20. Therefore, the product storage mechanism 60, the mold resin supply mechanism 70, and the molded article supply mechanism 80 are arranged in accordance with the positions of the product unloading head 52, the resin supply head 54, and the work carry-in head 56 in the transport head 50. .
[0046]
The product storage mechanism section 60 has a degate section 62 and a product storage section 64. The degate unit 62 receives the product from the product discharge head 52 when the transport head 50 moves to the retreat position, and performs an operation of removing unnecessary resin from the product. The product from which the unnecessary resin has been removed is stored in the product storage section 64. Unnecessary resin separated from the product is conveyed by the conveyor 66, dropped into the storage box 67 and stored.
[0047]
The mold resin supply mechanism 70 includes a mold resin storage 72 in which the mold resin is aligned and stored, and a mold resin for taking out the required number of mold resins from the mold resin storage 72 and transferring the same to the resin supply head 54. It has a transfer mechanism 74. The mold resin transfer mechanism 74 performs an operation of picking up the mold resin from the storage section 72 of the mold resin, transferring the mold resin to a position below the resin supply head 54 at the retracted position, and delivering the resin to the resin supply head 54.
[0048]
The molded article supply mechanism 80 is provided to the molded article storage section 82 containing the molded article to be molded with the resin, and to pull out the molded article from the molded article storage section 82 to the work loading head 56 at the retracted position. And a transfer mechanism 84 for transferring the molded product 20. The workpiece transfer mechanism 84 arranges the workpieces 20 side by side at the same position as the set position of the workpieces 20 on the mold, and transfers the workpieces 20 to the workpiece carry-in head 56 in the same arrangement. From the mold to the mold.
[0049]
The product loading / unloading mechanism D described above controls the transport head 50 to reciprocate in synchronism with the resin molding operation in the press mechanism A, so as to take out the product and supply the molded product and the molding resin. Is done. At the same time, the release film transport mechanism performs the release film transport operation in synchronization with the resin molding operation in the press mechanism A.
[0050]
[Second embodiment]
FIG. 3 shows a front view of an automatic molding apparatus using a release film in a second embodiment. This automatic molding apparatus also has a press mechanism A, release film transport mechanisms B and C, and a product loading / unloading mechanism as in the first embodiment. The planar arrangement of these components is the same as that of the first embodiment, and the operations of the press mechanism, the release film transport mechanism, and the product loading / unloading mechanism are the same as those of the first embodiment.
[0051]
In the second embodiment, the supply reels 18 are separately installed on the upper mold side and the lower mold side, and the supply reels 18 are installed on the fixed platen 15 and the movable platen 16, respectively. The structure for supplying the release film 10 from the supply reel 18 to the press mechanism via the roller 32 is the same as that of the first embodiment. The transport of the release film 10 is also performed using the feed heads 26 and 27.
[0052]
On the collecting side of the release film 10, the collecting reels 19 may be separately set in the upper die and the lower die similarly to the supply reel 18, and may be wound on the reels. It was moved downward as it was and introduced into the storage box 90 installed at the lower part of the apparatus. The release film 10 is lowered from different positions so that the release film 10 carried out from the upper mold and the release film 10 carried out from the lower mold do not intersect.
[0053]
[Third embodiment]
FIGS. 4 and 5 are a front view and a plan view, respectively, showing the overall configuration of a third embodiment of an automatic molding apparatus using a release film. The automatic molding apparatus in this embodiment is characterized in that the transport head is moved in parallel with the transport direction of the release film 10 to supply a molded article and take out the product. In this example, a release film supply section B and a release film recovery section C are arranged on both sides of the press mechanism section A, and a product supply section E is provided outside the supply section B, and a product take-out section F is provided outside the recovery section C. Are placed.
[0054]
The product supply section E is provided with a work carry-in head 100 for transferring a product to be molded onto a mold and a resin supply head 102 for supplying mold resin to a pot of the mold. The product take-out section F is provided with a product take-out head 104 for taking out the product from the mold and a resin take-out head 106 for taking out the unnecessary resin after the resin molding from the mold.
[0055]
The work carry-in head 100, the resin supply head 102, the product carry-out head 104, and the resin carry-out head 106 are set to a height position at the time of movement so that they can enter the press mechanism A when the mold is opened, and are horizontally moved by a guide mechanism. Will be supported. In this example, each transport head is moved using a ball screw, but the drive mechanism for moving these transport heads is not particularly limited.
[0056]
Product loading / unloading mechanism
The work carrying head 100 chucks and transfers the molded article 20 such as a lead frame onto the lower mold 14. Therefore, as shown in FIG. 4, a storage section 82 for storing the molded article 20 such as a lead frame is disposed below the retreat position of the work loading head 100, and the molded article 20 is transferred from the storage section 82 to the work loading head 100. Hand over. The mold mold is a two-piece mold, and the work carrying head 100 chucks and transfers the molded articles 20 two by two.
[0057]
In FIG. 5, reference numeral 108 denotes a pusher for projecting the molded products 20 from the storage portion 82 of the molded product 20 onto the table 110 two by two. The work carry-in head 100 is located above the table 110 at the retracted position, chucks the two molded articles 20 protruding on the table 110, and transports them to the setting position of the mold. The molded articles 20 are arranged side by side on the table 110 so as to coincide with the setting positions of the mold dies, and can be set on the lower mold 14 as they are simply by moving the work carrying head 100 in parallel.
[0058]
Reference numeral 72 denotes a storage unit that stores resin for molding. The resin supply head 102 is located above the mold resin storage 72 in the retracted position. In the case of this example, the resin formed in a stick shape is accommodated in the mold resin accommodating portion 72 in a vertically stacked manner, and is pushed up from below to be chucked one by one by the resin supply head 102. The resin supply head 102 is moved laterally to a position above the pot of the mold, and the molding resin is put into the pot and set.
[0059]
The product unloading head 104 enters the mold after the mold is opened, and picks up the resin-molded product from the lower mold 14. After being picked up, the product unloading head 104 moves to the retreat position and stores the product in the product storage portion 64 disposed below the retreat position. However, the product is stopped by the degate portion 62 at the preceding stage, and unnecessary resin is removed from the product.LeaveYou. The unnecessary resin removed by the degate unit 62 falls into the box 111 below. In the product storage section 64, the products are stored in such a manner that they are sequentially stacked.
[0060]
The resin unloading head 106 is used when unloading unnecessary resin from the mold. This means that when removing the product from the mold resin, there is a case where it is necessary to remove the unnecessary resin from the pot portion or the like by a separate operation from the removal of the product, in which case, the unnecessary resin is picked up by the resin discharge head 106, The product is picked up by the product discharge head 104. In this case, the degate operation is not particularly required, and the resin discharge head 106 is returned to the degate section 62 to drop the unnecessary resin onto the box 111.
[0061]
Release film transport mechanism
As in the first and second embodiments, the release film transport mechanism arranges the release film 10 so as to pass through the press mechanism A for each of the upper mold 12 and the lower mold 14 of the molding die. Supplied by fixed size feed.
FIG. 6 shows an enlarged view of the release film transport mechanism in this example. Reference numeral 18 denotes a supply reel around which a long release film 10 is wound, and is separately provided on the upper mold 12 and the lower mold 14.
[0062]
In the first and second embodiments, the feed heads 26 and 27 which advance and retreat in parallel with the transport direction of the release film 10 are used to feed the release film 10 by a fixed length. In this example, a pinch provided on the supply side is used. The fixed-size feed is performed by the roller 112. The method of using the pinch roller 112 is simple in structure, but has a fixed feed accuracy compared with the case where the feed heads 26 and 27 are used because the release film 10 slides between the rollers during the feed operation. May be lower. A motor 114 drives the pinch roller 112.
[0063]
On the collecting side of the release film 10, the release film 10 is nipped by the nipping rollers 116 and 117 and transported to the discharge side. The pressing rollers 116 and 117 are driven to rotate by a motor 114 via a timing belt. The release film 10 that has exited from the nipping rollers 116 and 117 can be taken up on a collection reel, but in this example is dropped and dropped into the box 111 below. In this case, since the release film 10 hanging on the discharge side obstructs the transport head entering the press mechanism A, the cutter 118 cuts the discharge film 10 after a certain length of discharge. Regarding the lower mold 14, the sagging of the release film 10 is not a problem, but is cut in the same manner to make it easy to store.
[0064]
When the release film 10 is used, it is also possible to use a method in which, for example, printing for transfer is performed on the release film 10 and a printed portion is transferred to a product when resin molding is performed. In such a case, when the release film 10 is transported, it is necessary to perform a highly accurate feed control. If the precision of the fixed feed of the release film 10 becomes a problem, it is necessary to correct the deformation of the release film 10 due to the heat and the clamping pressure during the resin molding as described above.
[0065]
In this example, in order to perform such a correction and perform accurate feeding control, sensors 120 for detecting the feeding position of the release film 10 are installed on the supply side and the collecting side, respectively. Is detected and the feed amount of the release film 10 is corrected. The sensor 120 on the supply side corrects a shift in the feed amount caused by the fixed-size feeding using the pinch roller 112, and the sensor 120 on the recovery side corrects a shift in the deformation that the release film 10 is elongated by the resin mold. There is.
[0066]
Note that the release film 10 may be shifted in the width direction while the release film 10 is being conveyed. The sensor 120 also detects such a displacement in the width direction. When the release film 10 is shifted in the width direction, the shift of the release film 10 is corrected by controlling the movement of the entire transport mechanism of the release film 10 in the width direction by a driving mechanism such as a motor. As the sensor 120, for example, a CCD camera is used.
[0067]
At the time of resin molding, the release film 10 is adsorbed and supported on the mold surfaces of the upper mold 12 and the lower mold 14 by air. In the above-described first and second embodiments, the adjusting head 40 and the like are used for performing the operation of bringing the release film 10 into and out of contact with the mold surface. In this example, the entire transport mechanism such as the supply roller 18 and the pressure rollers 116 and 117 supporting the release film 10 on both sides of the press mechanism A is moved up and down, whereby the release film 10 is moved relative to the mold surface. Try to get closer or farther away.
[0068]
In FIG. 6, reference numeral 124 denotes a support frame for supporting the supply roller 18. The support frame 124 is guided by a slide guide 126 and can be moved up and down by a motor 122. Reference numeral 130 denotes a support frame that supports the pressing rollers 116 and 117 on the collection side, and reference numeral 128 denotes a motor that moves the support frame 130 up and down. The support frame 130 is also guided and supported by the slide guide 132 so as to move up and down.
[0069]
In this manner, the release film 10 is made to approach parallel to the mold surface of the upper mold 12 or the lower mold 14 by vertically moving the support frames 124 and 130 on the supply side and the recovery side of each of the upper mold 12 and the lower mold 14. Alternatively, they can be separated.
When sending the release film 10 onto the mold, the release film 10 is conveyed while being separated from the mold surface. When the release film 10 has been sent out for a predetermined length, the delivery is stopped, and the motors 114 and 128 are operated to apply the release film 10 to the mold surface. The release film 10 is approached until it comes into contact with the mold, and the release film 10 is suction-supported to the mold by sucking air on the mold surface.
[0070]
After the resin molding, the mold is opened, the product on the lower mold 14 is picked up by the product discharge head 104, the unnecessary resin is discharged by the resin discharge head 106 as necessary, and the release film 10 is driven by the motors 122 and 128. Is protruded in a direction away from the mold surface to release the mold. Then, with the release film 10 separated from the mold surface, the pinch roller 112 and the pressing rollers 116 and 117 are driven to transport the release film 10 by a predetermined amount.
[0071]
The conveyance of the release film 10 and the operations of the work carry-in head 100, the resin supply head 102, the product carry-out head 104, and the resin carry-out head 106 are completely interlocked and controlled as in the above-described example. That is, after the mold is opened, the product is taken out, and after the release film 10 is newly supplied, the molded article 20 and the mold resin are set. The order of setting the mold resin and the molded article 20 and the like can be appropriately set. The automatic molding apparatus of this example has an advantage that the entire apparatus can be made compact because the loading / unloading mechanism of the product and the press mechanism for resin molding are arranged in series.
[0072]
[Fourth embodiment]
FIG. 7 is a front view showing a fourth embodiment of the automatic molding apparatus using a release film. In the fourth embodiment, as in the third embodiment, the transport head is moved in parallel with the transport direction of the release film to supply a molded article and take out the product.
Note that the fourth embodiment is configured to convey the release film 10 by using the feed heads 26 and 27 that advance and retreat in parallel with the feed direction of the release film 10 as in the first and second embodiments. It is.
[0073]
A configuration in which a supply reel 18 for supplying the release film 10 and a recovery reel 19 for collecting the release film 10 are arranged with the press mechanism interposed therebetween, and a configuration in which the feed heads 26 and 27 are moved forward and backward to feed the release film 10 by a fixed length. The configuration in which the release film 10 is moved toward and away from the mold surface by the adjustment head 40 is the same as in the first and second embodiments.
[0074]
Basically, a work carry-in head 100 as a supply mechanism of a molded article, a resin supply head 102 as a supply mechanism of a mold resin, and a product take-out head 104 as a product take-out mechanism are installed outside the transfer mechanism of the release film 10. The basic configuration is the same as that of the third embodiment. In this example, only the product take-out head 104 is provided on the product take-out side, and the resin take-out head is not provided. However, if it is necessary to take out unnecessary resin by a separate operation from the product take-out, a resin take-out head is separately provided. May be.
[0075]
The automatic molding apparatus using the release film of this example is configured to drive the feed heads 26 and 27 to transport the release film 10, but when configuring the automatic molding apparatus, the transport method of the release film 10 and the like are used. Various configurations can be selected. For example, even when the transport head is moved in a direction perpendicular to the transport direction of the release film to take out the product as in the first and second embodiments, the pinch roller as in the third embodiment is used. A method of transporting the release film using the pressing rollers 112 and 117 may be employed.
[0076]
In FIG. 2 and FIG. 5, reference numeral 140 denotes an antistatic portion provided for facilitating conveyance of the release film 10. If the release film 10 pulled out from the supply reel 18 is charged, a smooth transport operation may not be performed. In such a case, it is effective to remove static electricity by an antistatic means such as an ion blow and transport the toner, so that smooth transport can be achieved. Also, if the film is charged, minute dust may be adsorbed and transferred to the mold package. The antistatic means also has the effect of eliminating such problems.
[0077]
【The invention's effect】
According to the automatic molding apparatus using the lead frame according to the present invention, as described above,,Lease film transport mechanismBy feeding the release film to the resin mold by air suction and feeding it to the resin mold by the fixed size, the release film can be transported accurately without shifting the position. The carry-in / carry-out operation for carrying the molded article into the lower mold and carrying out the product after the resin molding from the lower mold is accurately automated, thereby enabling automatic molding using release films in various transport forms.
[Brief description of the drawings]
FIG. 1 is a front view of a first embodiment of an automatic molding apparatus using a release film.
FIG. 2 is a plan view of a first embodiment of an automatic molding apparatus using a release film.
FIG. 3 is a front view of a second embodiment of an automatic molding apparatus using a release film.
FIG. 4 is a front view of a third embodiment of an automatic molding apparatus using a release film.
FIG. 5 is a plan view of a third embodiment of an automatic molding apparatus using a release film.
FIG. 6 is a front view of a release film transport mechanism of a third embodiment.
FIG. 7 is a plan view of a fourth embodiment of an automatic molding apparatus using a release film.
FIG. 8 is an explanatory diagram of a resin molding method using a release film.
[Explanation of symbols]
10 Release film
12 Upper type
14 Lower mold
15 Fixed platen
16 movable platen
18 Supply reel
19 Collection reel
20 Molded product
22 pots
26, 27 feed head
30 Support arm
34 Pinch head
36 tension roller
40 Adjust Head
50 transport head
51 Guide rail
52 Product unloading head
54 Resin supply head
56 Work Loading Head
60 Product storage mechanism
62 Degate section
64 Product storage
66 conveyor
67 Storage Box
70 Mold resin supply mechanism
72 Mold resin storage
80 Molded product supply mechanism
82 Molding part storage
84 Molding mechanism transfer mechanism
90 storage box
100 Work loading head
102 Resin supply head
104 Product unloading head
106 Resin unloading head
108 Pusher
110 table
112 Pinch roller
114 motor
116, 117 Nipping roller
118 cutter
120 sensors
122, 128 motor
124, 130 support frame
140 Antistatic section

Claims (9)

In an automatic molding apparatus using a release film for resin molding by covering the mold surface of a resin molding portion of a mold mold with a release film having flexibility ,
A press mechanism that fixes the upper mold to the fixed platen to the fixed side, fixes the lower mold to the movable platen to the movable side, and feeds the strip-shaped molded product to the lower mold to perform resin molding. When,
The long release film, which is controlled in conjunction with the resin molding operation in the press mechanism and is sucked in air in accordance with the set position of the molded article on the mold die, is intermittently fed. A transfer mechanism for the release film to be supplied to the mold
A product supply unit provided with a work carry-in head that is controlled in conjunction with a resin molding operation in the press mechanism unit and that transfers the strip- shaped product to a lower mold; and a product after resin molding. And a carry-in / carry-out mechanism provided with a product take-out unit provided with a product take-out head for carrying the product out of the lower mold. In an automatic molding apparatus using a release film for resin molding by covering the mold surface of a resin molding portion of a mold mold with a release film having flexibility,
A press mechanism that fixes the upper mold to the fixed platen to the fixed side, fixes the lower mold to the movable platen to the movable side, and feeds the strip-shaped molded product to the lower mold to perform resin molding. When,
The long release film, which is controlled in conjunction with the resin molding operation in the press mechanism and is sucked in air in accordance with the set position of the molded article on the mold die, is intermittently fed. A transfer mechanism for the release film to be supplied to the mold
A transport head that reciprocates in conjunction with a resin molding operation in the press mechanism between a position retracted from the press mechanism and a position entered into the press mechanism, wherein the transport head includes A work carry-in head that supplies the molded product formed to the lower mold to the lower mold, a resin supply head that supplies the mold resin to the lower mold, and a product carry-out head that carries out the resin molded product and the unnecessary resin from the lower mold are provided. automatic molding apparatus using the features and to Brighter lease films to have a loading and unloading mechanism. 3. An automatic molding apparatus using a release film according to claim 1, wherein an antistatic portion for preventing charging of the release film is provided in the transport mechanism of the release film . The transport device of the release film is, the supply reel by winding an elongated release film, any one of claims 1 to 3; and a recovery reel for winding the release film after the resin molding one An automatic molding apparatus using the release film described in the above item . The transport device of the release film is, in any one of claims 1 to 3, characterized in that it has a housing part for housing and directly introduced into the storage box of the release film of the discharge side without wound on the reel Automatic molding equipment using release film. The release film transport mechanism, comprising a feed drive unit for moving the feed head forward and backward in parallel with the feed direction of the release film and pinching and transporting the release film by the feed head . An automatic molding apparatus using the release film according to any one of the preceding claims. An automatic molding apparatus using a release film according to any one of claims 1 to 3, wherein the transport mechanism of the release film has a feed drive unit for feeding a fixed size by a pinch roller on the supply side. . 8. The automatic molding apparatus using a release film according to claim 7 , wherein the transport mechanism of the release film has a mechanism for nipping and transporting the release film by a nipping roller on the collecting side . The automatic molding apparatus using a release film according to any one of claims 1 to 8, wherein the release film transport mechanism has a sensor for detecting a transport position of the release film during transport .

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