JP3548146B2 - Photocurable composition and plasma display panel formed with black pattern using the same - Google Patents
Photocurable composition and plasma display panel formed with black pattern using the same Download PDFInfo
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- JP3548146B2 JP3548146B2 JP2001292712A JP2001292712A JP3548146B2 JP 3548146 B2 JP3548146 B2 JP 3548146B2 JP 2001292712 A JP2001292712 A JP 2001292712A JP 2001292712 A JP2001292712 A JP 2001292712A JP 3548146 B2 JP3548146 B2 JP 3548146B2
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- parts
- black
- acid
- photocurable composition
- composition
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- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004386 Erythritol Substances 0.000 description 1
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- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- 229910019828 La0.7Sr0.3CoO3 Inorganic materials 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
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- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
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- 150000001412 amines Chemical class 0.000 description 1
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- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- PCDHSSHKDZYLLI-UHFFFAOYSA-N butan-1-one Chemical compound CCC[C]=O PCDHSSHKDZYLLI-UHFFFAOYSA-N 0.000 description 1
- KVNRLNFWIYMESJ-UHFFFAOYSA-N butyronitrile Chemical compound CCCC#N KVNRLNFWIYMESJ-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
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- 238000001723 curing Methods 0.000 description 1
- PESYEWKSBIWTAK-UHFFFAOYSA-N cyclopenta-1,3-diene;titanium(2+) Chemical compound [Ti+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 PESYEWKSBIWTAK-UHFFFAOYSA-N 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- WOWBFOBYOAGEEA-UHFFFAOYSA-N diafenthiuron Chemical compound CC(C)C1=C(NC(=S)NC(C)(C)C)C(C(C)C)=CC(OC=2C=CC=CC=2)=C1 WOWBFOBYOAGEEA-UHFFFAOYSA-N 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- KUMNEOGIHFCNQW-UHFFFAOYSA-N diphenyl phosphite Chemical compound C=1C=CC=CC=1OP([O-])OC1=CC=CC=C1 KUMNEOGIHFCNQW-UHFFFAOYSA-N 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- WSTZPWUPYWHZRR-UHFFFAOYSA-N ethene;2-ethyl-2-(hydroxymethyl)propane-1,3-diol Chemical group C=C.CCC(CO)(CO)CO WSTZPWUPYWHZRR-UHFFFAOYSA-N 0.000 description 1
- ZUNGGJHBMLMRFJ-UHFFFAOYSA-O ethoxy-hydroxy-oxophosphanium Chemical compound CCO[P+](O)=O ZUNGGJHBMLMRFJ-UHFFFAOYSA-O 0.000 description 1
- ORBFAMHUKZLWSD-UHFFFAOYSA-N ethyl 2-(dimethylamino)benzoate Chemical compound CCOC(=O)C1=CC=CC=C1N(C)C ORBFAMHUKZLWSD-UHFFFAOYSA-N 0.000 description 1
- ZJXZSIYSNXKHEA-UHFFFAOYSA-N ethyl dihydrogen phosphate Chemical compound CCOP(O)(O)=O ZJXZSIYSNXKHEA-UHFFFAOYSA-N 0.000 description 1
- AZHPCFQBBJISDG-UHFFFAOYSA-N ethyl(oxido)phosphanium Chemical class CC[PH2]=O AZHPCFQBBJISDG-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
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- 235000019253 formic acid Nutrition 0.000 description 1
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- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 238000004128 high performance liquid chromatography Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000007603 infrared drying Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 1
- CAAULPUQFIIOTL-UHFFFAOYSA-N methyl dihydrogen phosphate Chemical compound COP(O)(O)=O CAAULPUQFIIOTL-UHFFFAOYSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- ZFGUAQSDWQIVMM-UHFFFAOYSA-N n'-hydroxy-2-methylbutanimidamide Chemical compound CCC(C)C(N)=NO ZFGUAQSDWQIVMM-UHFFFAOYSA-N 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
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- CMPQUABWPXYYSH-UHFFFAOYSA-N phenyl phosphate Chemical compound OP(O)(=O)OC1=CC=CC=C1 CMPQUABWPXYYSH-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 235000011044 succinic acid Nutrition 0.000 description 1
- 150000003444 succinic acids Chemical class 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 125000005590 trimellitic acid group Chemical group 0.000 description 1
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Images
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- Gas-Filled Discharge Tubes (AREA)
- Materials For Photolithography (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、プラズマディスプレイパネル(以下、PDPと略称する)の前面基板に精細な電極回路、ブラックパターンを形成するのに有用なアルカリ現像型でかつ光硬化型の組成物、及びそれを用いて白黒二層構造を有するバス電極の下層(黒層)、ブラックマトリックスを形成した前面基板を備えるPDPに関するものである。
【0002】
【従来の技術】
PDPはプラズマ放電による発光を利用して映像や情報の表示を行なう平面ディスプレイであり、パネル構造、駆動方法によってDC型とAC型に分類される。PDPによるカラー表示の原理は、リブ(隔壁)によって離間された前面ガラス基板と背面ガラス基板に形成された対向する両電極間のセル空間(放電空間)内でプラズマ放電を生じさせ、各セル空間内に封入されているHe、Xe等のガスの放電により発生する紫外線で背面ガラス基板内面に形成された蛍光体を励起し、3原色の可視光を発生させるものである。各セル空間は、DC型PDPにおいては格子状のリブにより区画され、一方、AC型PDPにおいては基板面に平行に列設されたリブにより区画されるが、いずれにおいてもセル空間の区画は、リブによりなされている。以下、添付図面を参照しながら簡単に説明する。
【0003】
図1は、フルカラー表示の3電極構造の面放電方式PDPの構造例を部分的に示している。前面ガラス基板1の下面には、放電のための透明電極3a又は3bと該透明電極のライン抵抗を下げるためのバス電極4a又は4bとから成る一対の表示電極2a、2bが所定のピッチで多数列設されている。これらの表示電極2a、2bの上には、電荷を蓄積するための透明誘電体層5(低融点ガラス)が印刷、焼成によって形成され、その上に保護層(MgO)6が蒸着されている。保護層6は、表示電極の保護、放電状態の維持等の役割を有している。一方、背面ガラス基板11の上には、放電空間を区画するストライプ状のリブ(隔壁)12と各放電空間内に配されたアドレス電極(データ電極)13が所定のピッチで多数列設されている。また、各放電空間の内面には、赤(14a)、青(14b)、緑(14c)の3色の蛍光体膜が規則的に配され、フルカラー表示においては、前記のように赤、青、緑の3原色の蛍光体膜14a、14b、14cで1つの画素が構成される。
さらに、放電空間を形成する一対の表示電極2a、2bの両側部には、画像のコントラストをさらに高めるために、同様にストライプ状のブラックマトリックス10,10が形成されている。
なお、上記構造のPDPでは、一対の表示電極2aと2bの間に交流のパルス電圧を印加し、同一基板上の電極間で放電させるので、「面放電方式」と呼ばれている。
また、上記構造のPDPでは、放電により発生した紫外線が背面基板11の蛍光体膜14a、14b、14cを励起し、発生した可視光を前面基板1の透明電極3a、3bを透して見る構造となっている。
【0004】
このような構造のPDPにおいて、前記バス電極4a、4bの形成は、従来、Cr−Cu−Crの3層を蒸着やスパッタリングにより成膜した後、フォトリソグラフィー法でパターニングが行なわれてきた。
しかし、工程数が多く高コストとなるため、最近では、銀ペースト等の導電性ペーストをスクリーン印刷した後、焼成する方法、あるいは150μm以下の線幅とするためには、感光性導電性ペーストを塗布し、パターンマスクを通して露光した後、現像し、次いで焼成する方法が行なわれている。
【0005】
このようにしてバス電極4a、4bが形成されるPDPの前面基板においては、近年、画面のコントラストを向上させるために、バス電極を形成する際に、表示側となる下層(透明電極3a、3bと接触する層)に黒色ペーストを印刷し、その上に導電性の銀ペーストの白層を印刷して、白黒二層構造の電極を形成することが行なわれている。この場合、黒色ペーストとしては、銅―鉄系、銅―クロム系等の黒色複合酸化物を配合した樹脂組成物が用いられている。
【0006】
また前記ブラックマトリックスの形成は、従来、CRTディスプレイや液晶ディスプレイパネル等のブラックマトリックスの形成に使用されている遮光膜形成用感光性樹脂組成物を転用することが試みられてきた。
しかし、PDPの製造においては高温焼成工程があり、この工程で遮光膜形成用感光性樹脂組成物中に含有されるカーボンブラックが分解し、満足できるブラックマトリックスの形成は困難であった。
そこで、光重合性化合物、光重合開始剤及び遮光性材料を含有する遮光膜形成用感光性樹脂組成物においても、上記遮光性材料として、銅―鉄系、銅―クロム系等の黒色複合酸化物を配合した樹脂組成物が用いられている。
【0007】
【発明が解決しようとする課題】
しかしながら、銅―鉄系、銅―クロム系等の黒色複合酸化物を配合した樹脂組成物を用いてバス電極における黒層(下層)、ブラックマトリックスを形成すると、焼成の際に赤っぽく変色し、画面のコントラスト向上のための充分な黒さを得ることができない。
また、銅―鉄系、銅―クロム系等の黒色複合酸化物を配合した樹脂組成物は、ペーストとしての保存安定性が悪く、また、光重合性モノマー及び光重合開始剤と共に配合して光硬化性組成物に構成した場合、光重合性モノマーの重合が開始してゲル化してしまう。そのため、低温で保管する必要があり、量産性に対応できないという問題があった。
さらに、黒色度を上げるために黒色複合酸化物微粒子の配合量を増大すれば、光の透過を妨げ、充分な光硬化性が得られないという問題が発生する。
【0008】
そこで本発明は、このような従来技術が抱える課題を解決するためになされたものであり、その主たる目的は、保存安定性に優れると共に、乾燥、露光、現像、焼成の各工程において基板に対する優れた密着性、解像性、焼成性を損なうことなく、焼成後において充分な黒さを有する焼成皮膜を形成できる光硬化性組成物を提供することにある。
本発明の他の目的は、このような光硬化性組成物から高精細の電極回路、特に前面基板に形成される、白黒2層構造のバス電極において充分な層間導電性(透明電極とバス電極白層との層間導通)と黒さを同時に満足し得る下層(黒層)電極回路、ならびにブラックマトリックスを形成したPDPを提供することにある。
【0009】
【課題を解決するための手段】
前記目的を達成するために、本発明のプラズマディスプレイパネルの前面基板の黒色パターンを形成するための光硬化性組成物の基本的な第一の態様は、(A)ランタン複合酸化物微粒子、(B)有機バインダー、(C)光重合性モノマー、及び(D)光重合開始剤を含有する光硬化性組成物であって、この光硬化性組成物が、導電性粒子として上記(A)ランタン複合酸化物微粒子のみを含有し、かつ、(A)ランタン複合酸化物微粒子は粒径5μ m 以下であることを特徴としており、また第二の態様は、上記各成分に加えて、(E)無機微粒子を含有することを特徴としている。このような本発明の光硬化性組成物は、ペースト状形態であってもよく、また予めフィルム状に製膜したドライフィルムの形態であってもよい。さらに本発明によれば、このような光硬化性組成物の焼成物から前面基板の電極回路、ブラックマトリックスが形成されてなるPDPが提供される。
【0010】
【発明の実施の形態】
本発明者らは、前記目的の実現に向け鋭意研究した結果、光硬化性樹脂組成物に、黒色化成分としてランタン複合酸化物微粒子を添加すると、形成される黒色皮膜が緻密なものとなり、薄膜でも充分な黒さを呈することができ、その結果、乾燥、露光、現像、焼成の各工程において基板に対する優れた密着性、解像性、焼成性を損なうことなく、焼成後において充分な黒さを有する焼成皮膜(バス電極の黒層、ブラックマトリックス)を形成し得ることを見出した。
【0011】
さらに本発明者らの研究によれば、ランタン複合酸化物微粒子を光重合性モノマー及び光重合開始剤と共に配合した光硬化性組成物の場合、理由は必ずしも明確ではないが極めて保存安定性に優れ、量産性に充分対応可能であること、さらにまた、上記のように少量でも充分な黒色度の緻密な焼成皮膜が得られることから、薄い膜厚で充分なコントラストを達成できできることを見出し、本発明を完成するに至ったものである。
しかも、本発明の光硬化性組成物は、前記したように保存安定性に優れ、かつ、薄い膜厚で充分なコントラストが得られることから、PDPの量産性、低コスト化にとって極めて有用なものである。
【0012】
このような本発明の光硬化性樹脂組成物において、ランタン複合酸化物微粒子は、粒径が5μm以下、好ましくは0.01μm以上5μm以下の微粒子を用いることが望ましい。この理由は、粒径が5μmより小さいと、少量の添加でも、密着性等を損なうことなく緻密な黒色焼成皮膜を形成できる樹脂組成物を提供することができるからである。一方、ランタン複合酸化物微粒子の粒径が5μmよりも大きくなると、焼成皮膜の緻密性が悪くなり、形成される焼成皮膜の黒色度が低下し易い。
【0013】
このランタン複合酸化物微粒子(A)の配合量は、有機バインダー(B)100質量部当り0.1〜100質量部、好ましくは5〜50質量部の範囲が適当である。この理由は、黒色微粒子の配合量が上記範囲よりも少ないと、焼成後に充分な黒さが得られず、一方、上記範囲を超える配合量では、光の透過性が劣化する他に、コスト高となり好ましくないからである。
【0014】
前記、有機バインダー(B)としては、カルボキシル基を有する樹脂、具体的にはそれ自体がエチレン性不飽和二重結合を有するカルボキシル基含有感光性樹脂及びエチレン性不飽和二重結合を有さないカルボキシル基含有樹脂のいずれも使用可能である。好適に使用できる樹脂(オリゴマー及びポリマーのいずれでもよい)としては、以下のようなものが挙げられる。
(1)(a)不飽和カルボン酸と(b)不飽和二重結合を有する化合物を共重合させることによって得られるカルボキシル基含有樹脂
(2)(a)不飽和カルボン酸と(b)不飽和二重結合を有する化合物の共重合体にエチレン性不飽和基をペンダントとして付加させることによって得られるカルボキシル基含有感光性樹脂
(3)(c)エポキシ基と不飽和二重結合を有する化合物と(b)不飽和二重結合を有する化合物の共重合体に、(a)不飽和カルボン酸を反応させ、生成した2級の水酸基に(d)多塩基酸無水物を反応させて得られるカルボキシル基含有感光性樹脂
(4)(e)不飽和二重結合を有する酸無水物と(b)不飽和二重結合を有する化合物の共重合体に、(f)水酸基を有する化合物を反応させて得られるカルボキシル基含有感光性樹脂
(5)(e)不飽和二重結合を有する酸無水物と(b)不飽和二重結合を有する化合物の共重合体に、(f)水酸基と不飽和二重結合を有する化合物を反応させて得られるカルボキシル基含有感光性樹脂
(6)(g)エポキシ化合物と(h)不飽和モノカルボン酸を反応させ、生成した2級の水酸基に(d)多塩基酸無水物を反応させて得られるカルボキシル基含有感光性樹脂
(7)(b)不飽和二重結合を有する化合物とグリシジル(メタ)アクリレートの共重合体のエポキシ基に、(i)1分子中に1つのカルボキシル基を有し、エチレン性不飽和結合を持たない有機酸を反応させ、生成した2級の水酸基に(d)多塩基酸無水物を反応させて得られるカルボキシル基含有樹脂
(8)(j)水酸基含有ポリマーに(d)多塩基酸無水物を反応させて得られるカルボキシル基含有樹脂
(9)(j)水酸基含有ポリマーに(d)多塩基酸無水物を反応させて得られるカルボキシル基含有樹脂に、(c)エポキシ基と不飽和二重結合を有する化合物をさらに反応させて得られるカルボキシル基含有感光性樹脂
【0015】
前記したようなカルボキシル基含有感光性樹脂及びカルボキシル基含有樹脂は、単独で又は混合して用いてもよいが、いずれの場合でもこれらは合計で組成物全量の10〜80質量%の割合で配合することが好ましい。これらのポリマーの配合量が上記範囲よりも少な過ぎる場合、形成する皮膜中の上記樹脂の分布が不均一になり易く、充分な光硬化性及び光硬化深度が得られ難く、選択的露光、現像によるパターニングが困難となる。一方、上記範囲よりも多過ぎると、焼成時のパターンのよれや線幅収縮を生じ易くなるので好ましくない。
【0016】
また、上記カルボキシル基含有感光性樹脂及びカルボキシル基含有樹脂としては、それぞれ重量平均分子量1,000〜100,000、好ましくは5,000〜70,000、及び酸価50〜250mgKOH/g、かつ、カルボキシル基含有感光性樹脂の場合、その二重結合当量が350〜2,000、好ましくは400〜1,500のものを好適に用いることができる。上記樹脂の分子量が1,000より低い場合、現像時の皮膜の密着性に悪影響を与え、一方、100,000よりも高い場合、現像不良を生じ易いので好ましくない。また、酸価が50mgKOH/gより低い場合、アルカリ水溶液に対する溶解性が不充分で現像不良を生じ易く、一方、250mgKOH/gより高い場合、現像時に皮膜の密着性の劣化や光硬化部(露光部)の溶解が生じるので好ましくない。さらに、カルボキシル基含有感光性樹脂の場合、感光性樹脂の二重結合当量が350よりも小さいと、焼成時に残渣が残り易くなり、一方、2,000よりも大きいと、現像時の作業余裕度が狭く、また光硬化時に高露光量を必要とするので好ましくない。
【0017】
本発明において光重合性モノマー(C)は、組成物の光硬化性の促進及び現像性を向上させるために用いる。光重合性モノマー(C)としては、例えば、2−ヒドロキシエチルアクリレート,2−ヒドロキシプロピルアクリレート、ジエチレングリコールジアクリレート、トリエチレングリコールジアクリレート、ポリエチレングリコールジアクリレート、ポリウレタンジアクリレート、トリメチロールプロパントリアクリレート、ペンタエリスリトールトリアクリレート、ペンタエリスリトールテトラアクリレート、トリメチロールプロパンエチレンオキサイド変性トリアクリレート、トリメチロールプロパンプロピレンオキサイド変性トリアクリレート、ジペンタエリスリトールペンタアクリレート、ジペンタエリスリトールヘキサアクリレート及び上記アクリレートに対応する各メタクリレート類;フタル酸、アジピン酸、マレイン酸、イタコン酸、こはく酸、トリメリット酸、テレフタル酸等の多塩基酸とヒドロキシアルキル(メタ)アクリレートとのモノ−、ジ−、トリ−又はそれ以上のポリエステルなどが挙げられるが、特定のものに限定されるものではなく、またこれらを単独で又は2種以上を組み合わせて用いることができる。これらの光重合性モノマーの中でも、1分子中に2個以上のアクリロイル基又はメタクリロイル基を有する多官能モノマーが好ましい。
このような光重合性モノマー(C)の配合量は、前記有機バインダー(カルボキシル基含有感光性樹脂及び/又はカルボキシル基含有樹脂)(B)100質量部当り20〜100質量部が適当である。光重合性モノマー(C)の配合量が上記範囲よりも少ない場合、組成物の充分な光硬化性が得られ難くなり、一方、上記範囲を超えて多量になると、皮膜の深部に比べて表面部の光硬化が早くなるため硬化むらを生じ易くなる。
【0018】
前記光重合開始剤(D)の具体例としては、ベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル等のベンゾインとベンゾインアルキルエーテル類;アセトフェノン、2,2−ジメトキシー2−フェニルアセトフェノン、2,2−ジエトキシー2−フェニルアセトフェノン、1,1−ジクロロアセトフェノン等のアセトフェノン類;2−メチル−1−[4−(メチルチオ)フェニル]−2−モルフォリノプロパン−1−オン、2−ベンジル−2−ジメチルアミノ−1−(4−モルフォリノフェニル)−ブタノン−1等のアミノアセトフェノン類;2−メチルアントラキノン、2−エチルアントラキノン、2−t−ブチルアントラキノン、1−クロロアントラキノン等のアントラキノン類;2,4−ジメチルチオキサントン、2,4−ジエチルチオキサントン、2−クロロチオキサントン、2,4−ジイソプロピルチオキサントン等のチオキサントン類;アセトフェノンジメチルケタール、ベンジルジメチルケタール等のケタール類;ベンゾフェノン等のベンゾフェノン類;又はキサントン類;(2,6−ジメトキシベンゾイル)−2,4,4−ペンチルホスフィンオキサイド、ビス(2,4,6−トリメチルベンゾイル)−フェニルフォスフィンオキサイド、2,4,6−トリメチルベンゾイルジフェニルフォスフィンオキサイド、エチル−2,4,6−トリメチルベンゾイルフェニルフォスフィネイト等のフォスフィンオキサイド類;各種パーオキサイド類などが挙げられ、これら公知慣用の光重合開始剤を単独で又は2種以上を組み合わせて用いることができる。これらの光重合開始剤(D)の配合割合は、前記有機バインダー(カルボキシル基含有感光性樹脂及び/又はカルボキシル基含有樹脂)(B)100質量部当り1〜30質量部が適当であり、好ましくは、5〜20質量部である。
【0019】
また、上記のような光重合開始剤(D)は、N,N−ジメチルアミノ安息香酸エチルエステル、N,N−ジメチルアミノ安息香酸イソアミルエステル、ペンチル−4−ジメチルアミノベンゾエート、トリエチルアミン、トリエタノールアミン等の三級アミン類のような光増感剤の1種あるいは2種以上と組み合わせて用いることができる。
さらに、より深い光硬化深度を要求される場合、必要に応じて、可視領域でラジカル重合を開始するチバ・スペシャルティ・ケミカルズ社製イルガキュアー784等のチタノセン系光重合開始剤、ロイコ染料等を硬化助剤として組み合わせて用いることができる。
【0020】
さらに、より深い光硬化深度を要求される場合、必要に応じて、熱重合触媒を前記光重合開始剤(D)と併用して用いることができる。この熱重合触媒は、数分から1時間程度にわたって高温におけるエージングにより未硬化の光重合性モノマーを反応させうるものであり、具体的には、過酸化ベンゾイル等の過酸化物、アゾイソブチロニトリル等のアゾ化合物等があり、好ましくは、2,2´−アゾビスイソブチロニトリル、2,2´−アゾビス−2−メチルブチロニトリル、2,2´−アゾビス−2,4−ジバレロニトリル、1´−アゾビス−1−シクロヘキサンカルボニトリル、ジメチル−2,2´−アゾビスイソブチレイト、4,4´−アゾビス−4−シアノバレリックアシッド、2−メチル−2,2´−アゾビスプロパンニトリル、2,4−ジメチル−2,2,2´,2´―アゾビスペンタンニトリル、1,1´−アゾビス(1−アセトキシ−1−フェニルエタン)、2,2,2´,2´−アゾビス(2−メチルブタナミドオキシム)ジヒドロクロライド等が挙げられ、より好ましいものとしては環境にやさしいノンシアン、ノンハロゲンタイプの1,1´−アゾビス(1−アセトキシ−1−フェニルエタン)が挙げられる。
【0021】
本発明の組成物は、必要に応じて軟化点400〜600℃のガラス粉末、導電性粉末、耐熱性黒色顔料、シリカ粉末等の無機微粒子(E)を、本発明の光硬化性樹脂組成物の特性を損なわない量的割合で配合することができる。
ガラス粉末は、焼成後の導体回路との密着性向上のために、ランタン複合酸化物微粒子(A)100質量部当り300質量部以下、好ましくは200質量部以下の割合で添加できる。このガラス粉末としては、ガラス転移点(Tg)300〜500℃、ガラス軟化点(Ts)400〜600℃のものが好ましい。また、解像度の点からは、平均粒径20μm以下、好ましくは5μm以下のガラス粉末を用いることが好ましい。
【0022】
上記のようなガラス粉末を光硬化性樹脂組成物に添加することにより、露光・現像後の皮膜は600℃以下で容易に焼成可能となる。但し、本発明の組成物では燃焼性の良好な有機バインダーが用いられ、ガラス粉末が溶融する前に脱バインダーが完了するように組成されているものの、ガラス粉末の軟化点が400℃より低いと、これよりも低い温度で溶融が生じて有機バインダーを包み込み易くなり、残存する有機バインダーが分解することによって組成物中にブリスターが生じ易くなるので好ましくない。
ガラス粉末としては、酸化鉛、酸化ビスマス、又は酸化亜鉛などを主成分とする非結晶性フリットが好適に使用できる。
【0023】
光硬化性樹脂組成物に多量の無機フィラーやガラス粉末を配合した場合、得られる組成物の保存安定性が悪く、ゲル化や流動性の低下により塗布作業性が悪くなる傾向がある。従って、本発明の組成物では、組成物の保存安定性向上のため、無機フィラーやガラス粉末の成分である金属あるいは酸化物粉末との錯体化あるいは塩形成などの効果のある化合物を、安定剤として添加することが好ましい。安定剤としては、硝酸、硫酸、塩酸、ホウ酸等の各種無機酸;ギ酸、酢酸、アセト酢酸、クエン酸、ステアリン酸、マレイン酸、フマル酸、フタル酸、ベンゼンスルホン酸、スルファミン酸等の各種有機酸;リン酸、亜リン酸、次亜リン酸、リン酸メチル、リン酸エチル、リン酸ブチル、リン酸フェニル、亜リン酸エチル、亜リン酸ジフェニル、モノ(2−メタクリロイルオキシエチル)アシッドホスフェート等の各種リン酸化合物(無機リン酸、有機リン酸)などの酸が挙げられ、単独で又は2種以上を組み合わせて用いることができる。このような安定剤は、前記のガラス粉末や無機微粒子(E)100質量部当り0.1〜10質量部の割合で添加することが好ましい。
【0024】
耐熱性黒色顔料としては、耐熱性に優れる無機顔料を広く用いることができる。一般には、Cr、Co、Ni、Fe、Mn,Ruなどの酸化物、複合酸化物がこれにあたり、これらを単独で又は2種以上を組合わせて用いることができる。
【0025】
シリカ粉末としては、特に合成アモルファスシリカ微粉末が望ましく、その具体例としては、日本アエロジル(株)製のAEROSIL(登録商標)50、130、200、200V、200CF、200FAD、300、300CF、380、OX50、TT600、MOX80、MOX170、COK84、日本シリカ工業(株)製のNipsil(登録商標)AQ、AQ−S、VN3、LP、L300、N−300A、ER−R、ER、RS−150、ES、NS、NS−T、NS−P、NS−KR、NS−K、NA、KQ、KM、DS等が挙げられ、これらを単独で又は2種以上を組み合わせて用いることができる。これらの中でも、一次粒子径が5〜50nm、比表面積が50〜500m2/gのものが好ましい。
【0026】
上記のような合成アモルファスシリカ微粉末を、前記したような光硬化性樹脂組成物に添加すると、焼成工程において骨材して働き焼成時の変形を抑えることができるためである。
【0027】
本発明においては、組成物を希釈することによりペースト化し、容易に塗布工程を可能とし、次いで乾燥させて造膜し、接触露光を可能とさせるために、適宜の量の有機溶剤を配合することができる。具体的には、メチルエチルケトン、シクロヘキサノンなどのケトン類;トルエン、キシレン、テトラメチルベンゼンなどの芳香族炭化水素類;セロソルブ、メチルセロソルブ、カルビトール、メチルカルビトール、ブチルカルビトール、プロピレングリコールモノメチルエーテル、ジプロピレングリコールモノメチルエーテル、ジプロピレングリコールモノエチルエーテル、トリエチレングリコールモノエチルエーテルなどのグリコールエーテル類;酢酸エチル、酢酸ブチル、セロソルブアセテート、ブチルセロソルブアセテート、カルビトールアセテート、ブチルカルビトールアセテート、プロピレングリコールモノメチルエーテルアセテートなどの酢酸エステル類;エタノール、プロパノール、エチレングリコール、プロピレングリコール、テルピネオールなどのアルコール類;オクタン、デカンなどの脂肪族炭化水素;石油エーテル、石油ナフサ、水添石油ナフサ、ソルベントナフサなどの石油系溶剤が挙げられ、これらを単独で又は2種以上を組み合わせて用いることができる。
【0028】
本発明の光硬化性樹脂組成物は、さらに必要に応じて、シリコーン系、アクリル系等の消泡・レベリング剤、皮膜の密着性向上のためのシランカップリング剤、等の他の添加剤を配合することもできる。さらにまた、必要に応じて、公知慣用の酸化防止剤や、保存時の熱的安定性を向上させるための熱重合禁止剤、焼成時における基板との結合成分としての金属酸化物、ケイ素酸化物、ホウ素酸化物などの微粒子を添加することもできる。
【0029】
本発明の光硬化性樹脂組成物は、予めフィルム状に成膜されている場合には基板上にラミネートすればよいが、ペースト状組成物の場合、スクリーン印刷法、バーコーター、ブレードコーターなど適宜の塗布方法で基板、例えばPDPの前面基板となるガラス基板に塗布し、次いで指触乾燥性を得るために熱風循環式乾燥炉、遠赤外線乾燥炉等で例えば約60〜120℃で5〜40分程度乾燥させて有機溶剤を蒸発させ、タックフリーの塗膜を得る。その後、選択的露光、現像、焼成を行なって所定のパターンの電極回路、ブラックマトリクスを形成する。
【0030】
露光工程としては、所定の露光パターンを有するネガマスクを用いた接触露光及び非接触露光が可能である。露光光源としては、ハロゲンランプ、高圧水銀灯、レーザー光、メタルハライドランプ、ブラックランプ、無電極ランプなどが使用される。露光量としては50〜1000mJ/cm2程度が好ましい。
【0031】
現像工程としてはスプレー法、浸漬法等が用いられる。現像液としては、水酸化ナトリウム、水酸化カリウム、炭酸ナトリウム、炭酸カリウム、珪酸ナトリウムなどの金属アルカリ水溶液や、モノエタノールアミン、ジエタノールアミン、トリエタノールアミンなどのアミン水溶液、特に約1.5質量%以下の濃度の希アルカリ水溶液が好適に用いられるが、組成物中のカルボキシル基含有樹脂のカルボキシル基がケン化され、未硬化部(未露光部)が除去されればよく、上記のような現像液に限定されるものではない。また、現像後に不要な現像液の除去のため、水洗や酸中和を行なうことが好ましい。
【0032】
焼成工程においては、現像後の基板を空気中又は窒素雰囲気下で約400〜600℃の加熱処理を行ない、所望のパターンを形成する。なお、この時の昇温速度は、15℃/分以下に設定することが好ましい。
【0033】
【実施例】
以下、本発明を実施例に基づいて具体的に説明するが、本発明が下記実施例に限定されるものでないことはもとよりである。なお、以下において「部」は、特に断りのない限りすべて質量部であるものとする。
(合成例1)
温度計、攪拌機、滴下ロート、及び還流冷却器を備えたフラスコに、メチルメタクリレートとメタクリル酸を0.87:0.13のモル比で仕込み、溶媒としてジプロピレングリコールモノメチルエーテル、触媒としてアゾビスイソブチロニトリルを入れ、窒素雰囲気下、80℃で2〜6時間攪拌し、樹脂溶液として有機バインダーAを得た。
この有機バインダーA中の共重合樹脂は、重量平均分子量が約10,000、酸価が74mgKOH/gであった。
なお、得られた共重合樹脂の重量平均分子量の測定は、島津製作所製ポンプLLC−6ADと昭和電工製カラムShodex(登録商標)KF−804、KF−802を三本つないだ高速液体クロマトグラフィーにより測定した。
【0034】
このようにして得られた有機バインダーAを用い、以下に示す組成比にて配合し、攪拌機により攪拌後、3本ロールミルにより練肉してペースト化を行なった。なお、低融点ガラス粉末としては、Bi2O3 50% 、B203 15%、ZnO15%、SiO2 6%、BaO 17%を粉砕し、熱膨張係数α300=85×10−7 /℃、ガラス転移点460℃、平均粒径1.6μmとしたものを使用した。
【0035】
上層用(白色系)感光性導電ペースト;
有機バインダーA 100.0部
ペンタエリスリトールトリアクリレート 50.0部
2−ベンジル−2−ジメチルアミノ−1−
(4−モルフォリノフェニル)ブタン−1−オン 5.0部
ジプロピレングリコールモノメチルエーテル 80.0部
銀粉 450.0部
ガラス粉末 22.0部
リン酸エステル 1.0部
【0036】
下層用(黒色系)感光性黒色ペースト:
(組成物例1)
有機バインダーA 100.0部
ペンタエリスリトールトリアクリレート 50.0部
2−ベンジル−2−ジメチルアミノ−1−
(4−モルフォリノフェニル)ブタン−1−オン 5.0部
ジプロピレングリコールモノメチルエーテル 80.0部
ランタン複合酸化物微粒子(La0.7Sr0.3CoO3)40.0部
(粒径0.5μm)
【0037】
(組成物例2)
有機バインダーA 100.0部
ペンタエリスリトールトリアクリレート 50.0部
2−ベンジル−2−ジメチルアミノ−1−
(4−モルフォリノフェニル)ブタン−1−オン 5.0部
ジプロピレングリコールモノメチルエーテル 80.0部
ランタン複合酸化物微粒子(La0.7Sr0.3MnO3)40.0部
(粒径0.5μm)
【0038】
(組成物例3)
有機バインダーA 100.0部
ペンタエリスリトールトリアクリレート 50.0部
2−ベンジル−2−ジメチルアミノ−1−
(4−モルフォリノフェニル)ブタン−1−オン 5.0部
ジプロピレングリコールモノメチルエーテル 80.0部
ランタン複合酸化物微粒子(La0.7Sr0.3MnO3)20.0部
(粒径0.5μm)
四三酸化コバルト(Co3O4) 20.0部
(粒径0.20μm、比表面積4.9m2/g)
ガラス粉末 20.0部
マロン酸 1.0部
【0039】
(組成物例4)
有機バインダーA 100.0部
ペンタエリスリトールトリアクリレート 50.0部
2−ベンジル−2−ジメチルアミノ−1−
(4−モルフォリノフェニル)ブタン−1−オン 5.0部
ジプロピレングリコールモノメチルエーテル 80.0部
ランタン複合酸化物微粒子(La0.7Sr0.3MnO3)20.0部
(粒径0.5μm)
酸化ルテニウム 20.0部
(粒径0.20μm、比表面積4.9m2/g)
ガラス粉末 20.0部
マロン酸 1.0部
【0040】
(組成物例5)
有機バインダーA 100.0部
ペンタエリスリトールトリアクリレート 50.0部
2−ベンジル−2−ジメチルアミノ−1−
(4−モルフォリノフェニル)ブタン−1−オン 5.0部
ジプロピレングリコールモノメチルエーテル 80.0部
ランタン複合酸化物微粒子(La0.7Sr0.3MnO3)40.0部
(粒径0.5μm)
ガラス粉末 20.0部
リン酸エステル 1.0部
合成アモルファスシリカ微粉末 5.0部
(日本アエロジル(株)製、AEROSIL200;1次粒子の平均粒径12nm、BET法による比表面積200±25m2/g)
【0041】
(組成物例6)
有機バインダーA 100.0部
ペンタエリスリトールトリアクリレート 50.0部
2−ベンジル−2−ジメチルアミノ−1−
(4−モルフォリノフェニル)ブタン−1−オン 5.0部
ジプロピレングリコールモノメチルエーテル 80.0部
ランタン複合酸化物微粒子(La0.7Sr0.3MnO3)40.0部
(粒径0.5μm)
ガラス粉末 20.0部
次亜リン酸 1.0部
【0042】
(比較組成物例1)
有機バインダーA 100.0部
ペンタエリスリトールトリアクリレート 50.0部
2−ベンジル−2−ジメチルアミノ−1−
(4−モルフォリノフェニル)ブタン−1−オン 5.0部
ジプロピレングリコールモノメチルエーテル 80.0部
銅−鉄系黒色複合酸化物 40.0部
(CuO−Fe2O3−Mn2O3、粒径0.17μm)
【0043】
(比較組成物例2)
有機バインダーA 100.0部
ペンタエリスリトールトリアクリレート 50.0部
2−ベンジル−2−ジメチルアミノ−1−
(4−モルフォリノフェニル)ブタン−1−オン 5.0部
ジプロピレングリコールモノメチルエーテル 80.0部
銅−クロム系黒色複合酸化物 40.0部
(CuO−Cr2O3−Mn2O3、粒径0.45μm)
【0044】
このようにして得られた組成物例1〜6及び比較組成物例1、2の各ペーストについて、バス電極評価(抵抗値、層間導通、焼成後色調、L*値)、ブラックマトリクス評価(焼成後色調、L*値)、ペースト安定性の評価を行った。その評価方法は以下のとおりである。
【0045】
抵抗値:
ガラス基板上に、評価用ペーストを300メッシュのポリエステルスクリーンを用いて全面に塗布し、次いで、熱風循環式乾燥炉にて90℃で20分間乾燥して指触乾燥性の良好な皮膜を形成した。次に、この皮膜上に、上層(白)用導電性ペーストを200メッシュのポリエステルスクリーンを用いて全面に塗布し、次いで、熱風循環式乾燥炉にて90℃で20分間乾燥して指触乾燥性の良好な二層の皮膜を形成した。その後、光源をメタルハライドランプとし、パターン寸法100μm×10cmのネガマスクをもちいて、組成物上の積算光量が500mJ/cm2となるように露光した後、液温30℃の0.5wt%Na2CO3水溶液を用いて現像を行ない、水洗した。最後に空気雰囲気下にて5℃/分で昇温し、550℃で30分間焼成して基板を作製した。こうして得られた焼成皮膜について抵抗値を測定した。
【0046】
層間導通:
ITO膜付きガラス基板上に上記と同様の方法により100μm×3cmのパターン形成を行なった。これにより得られた焼成皮膜の上層(白層)とITOにテスターをあて導通の確認を行なった。
【0047】
焼成後色調:
ITO膜付きガラス基板上に上記と同様の方法(ブラックマトリクス評価については上層(白)用導電性ペーストを塗布、乾燥しない)により3cm×10cmのパターン形成を行なった。これにより得られた焼成皮膜をガラス側から目視により観察し、色調の確認を行なった。
【0048】
L*値:
上記焼成後色調を確認した試験片を用いて色彩色差計(ミノルタカメラ(株)製、CR−221)を用いてL*a*b*表色系の値をJIS−Z−8729に従って測定し、明度を表す指数であるL*値を黒色度の指標として評価した。このL*値が小さいほど黒色度に優れる。
【0049】
ペースト安定性:
組成物例1〜6及び比較組成物例1、2の各ペーストを300gづつ密閉容器に入れ30℃で1ヶ月間放置した後の状態の確認を行なった。
【0050】
これらの評価結果を表1および表2に示す。
【表1】
【0051】
【表2】
【0052】
表1および表2に示す結果から明らかなように、本発明の組成物に係るペーストは、比較組成物のペーストに比べてペースト安定性に優れ、焼成後においても、充分な黒さを満足し得るバス電極用下層(黒層)、ブラックマトリクスを形成できることがわかった。
【0053】
なお、上記評価用ペーストについて、現像後のライン形状、焼成後のライン形状、密着性を評価したが、いずれも問題はなかった。これらの評価に使用する基板は、ガラス基板上に形成した皮膜を、ライン/スペース=50/100μmとなるネガフィルムを用いてパターン露光し、次いで、液温が30℃の0.5wt%Na2CO3水溶液にて現像を行ない、水洗し、その後、焼成すること以外は、上記抵抗値評価の場合と同様にしてパターン焼成基板を作成した。これらの評価方法は、現像後のライン形状については、現像まで終了したパターンを顕微鏡観察し、ラインに不規則なばらつきがなく、よれ等がないかどうかで評価し、焼成後のライン形状については、焼成まで終了したパターンを顕微鏡観察し、ラインに不規則なばらつきがなく、よれ等がないかどうかで評価した。また密着性は、セロハン粘着テープによるピーリングを行ない、パターンの剥離がないかどうかで評価した。
【0054】
【発明の効果】
以上説明したように、本発明の光硬化性樹脂組成物によれば、乾燥、露光、現像、焼成の各工程において基板に対する優れた密着性、解像性、焼成性を損なうことなく、焼成後において充分な黒さを満足し得る、PDPバス電極の黒層、ブラックマトリクスを形成することができる。
さらに本発明の光硬化性樹脂組成物は、保存安定性に優れ、かつ、薄い膜厚で充分なコントラストが得られることから、PDPの量産性、低コスト化にとって極めて有用なものである。
【図面の簡単な説明】
【図1】面放電方式のAC型PDPの部分分解斜視図である。
【符号の説明】
1 前面ガラス基板
2a,2b 表示電極
3a,3b 透明電極
4a,4b バス電極
5 透明誘電体層
6 保護層
10 ブラックマトリックス
11 背面ガラス基板
12 リブ
13 アドレス電極
14a,14b,14c 蛍光体膜[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an alkali-developable and photo-curable composition useful for forming a fine electrode circuit and a black pattern on a front substrate of a plasma display panel (hereinafter abbreviated as PDP), and a method using the same. The present invention relates to a PDP including a lower layer (black layer) of a bus electrode having a black and white two-layer structure and a front substrate on which a black matrix is formed.
[0002]
[Prior art]
A PDP is a flat panel display that displays images and information using light emission by plasma discharge, and is classified into a DC type and an AC type according to a panel structure and a driving method. The principle of the color display by the PDP is that a plasma discharge is generated in a cell space (discharge space) between two opposing electrodes formed on a front glass substrate and a rear glass substrate separated by a rib (partition wall), and each cell space is formed. The phosphor formed on the inner surface of the rear glass substrate is excited by ultraviolet rays generated by the discharge of a gas such as He or Xe sealed therein, thereby generating visible light of three primary colors. Each cell space is defined by grid-like ribs in a DC-type PDP, while each cell space is defined by ribs arranged in parallel with a substrate surface in an AC-type PDP. Made with ribs. Hereinafter, a brief description will be given with reference to the accompanying drawings.
[0003]
FIG. 1 partially shows a structural example of a surface discharge type PDP having a three-electrode structure for full color display. On the lower surface of the front glass substrate 1, a large number of pairs of
Further, on both sides of the pair of
In the PDP having the above-described structure, an AC pulse voltage is applied between the pair of
Further, in the PDP having the above-described structure, the ultraviolet light generated by the discharge excites the
[0004]
In the PDP having such a structure, the
However, since the number of steps is large and the cost is high, recently, in order to screen-print a conductive paste such as a silver paste and then sinter it, or to obtain a line width of 150 μm or less, a photosensitive conductive paste is used. A method of applying, exposing through a pattern mask, developing, and then firing is used.
[0005]
In recent years, on the front substrate of the PDP on which the
[0006]
In the formation of the black matrix, it has been conventionally attempted to divert a photosensitive resin composition for forming a light-shielding film, which is used for forming a black matrix of a CRT display, a liquid crystal display panel, or the like.
However, in the production of PDP, there is a high-temperature baking step, in which carbon black contained in the photosensitive resin composition for forming a light-shielding film is decomposed, and it has been difficult to form a satisfactory black matrix.
Therefore, even in the photosensitive resin composition for forming a light-shielding film containing a photopolymerizable compound, a photopolymerization initiator and a light-shielding material, as the light-shielding material, a black composite oxide such as copper-iron or copper-chromium is used. A resin composition containing a compound is used.
[0007]
[Problems to be solved by the invention]
However, when a black layer (lower layer) and a black matrix in a bus electrode are formed using a resin composition containing a black composite oxide such as a copper-iron type or a copper-chromium type, the color becomes reddish upon firing. However, sufficient blackness for improving the contrast of the screen cannot be obtained.
In addition, a resin composition containing a black composite oxide such as a copper-iron type or a copper-chromium type has a poor storage stability as a paste, and is mixed with a photopolymerizable monomer and a photopolymerization initiator. In the case of constituting a curable composition, polymerization of the photopolymerizable monomer starts and gels. Therefore, it is necessary to store at a low temperature, and there is a problem that mass productivity cannot be accommodated.
Further, if the compounding amount of the black composite oxide fine particles is increased in order to increase the blackness, light transmission is hindered, and there arises a problem that sufficient photocurability cannot be obtained.
[0008]
Therefore, the present invention has been made in order to solve such problems of the prior art, and its main purpose is to provide excellent storage stability and excellent drying, exposure, development, and baking of the substrate in each step of baking. An object of the present invention is to provide a photocurable composition capable of forming a fired film having sufficient blackness after firing without impairing the adhesion, resolution, and firing properties.
Another object of the present invention is to provide a high-definition electrode circuit from such a photocurable composition, particularly a sufficient interlayer conductivity in a black-and-white two-layer bus electrode formed on a front substrate (a transparent electrode and a bus electrode). It is an object of the present invention to provide a lower layer (black layer) electrode circuit capable of simultaneously satisfying blackness and interlayer conduction with a white layer, and a PDP formed with a black matrix.
[0009]
[Means for Solving the Problems]
To achieve the above object, the present inventionFor forming a black pattern on the front substrate of a plasma display panelThe first basic embodiment of the photocurable composition contains (A) lanthanum composite oxide fine particles, (B) an organic binder, (C) a photopolymerizable monomer, and (D) a photopolymerization initiator.A photocurable composition, wherein the photocurable composition contains only the (A) lanthanum composite oxide fine particles as conductive particles, and the (A) lanthanum composite oxide fine particles have a particle size of 5 μm. m Is belowThe second aspect is characterized by containing (E) inorganic fine particles in addition to the above components. Such a photocurable composition of the present invention may be in the form of a paste, or may be in the form of a dry film previously formed into a film. Further, according to the present invention, there is provided a PDP in which an electrode circuit of a front substrate and a black matrix are formed from a fired product of such a photocurable composition.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
The present inventors have conducted intensive studies for realizing the above object, and as a result, when adding lanthanum composite oxide fine particles as a blackening component to the photocurable resin composition, the formed black film becomes dense, and the thin film is formed. However, it can exhibit sufficient blackness, and as a result, has excellent adhesion to the substrate in each of the steps of drying, exposure, development and firing, without impairing the excellent blackness after firing without impairing the resolution. It has been found that a fired film (black layer of a bus electrode, black matrix) having the following can be formed.
[0011]
Furthermore, according to the study of the present inventors, in the case of a photocurable composition in which lanthanum composite oxide fine particles are blended with a photopolymerizable monomer and a photopolymerization initiator, the reason is not necessarily clear, but the storage stability is extremely excellent. It was found that it was possible to sufficiently cope with mass production, and that a small fired film with sufficient blackness could be obtained even with a small amount as described above, and that sufficient contrast could be achieved with a thin film thickness. The invention has been completed.
In addition, the photocurable composition of the present invention has excellent storage stability and sufficient contrast can be obtained with a thin film thickness as described above, and is therefore extremely useful for mass production of PDPs and cost reduction. It is.
[0012]
In such a photocurable resin composition of the present invention, it is desirable to use fine particles of lanthanum composite oxide having a particle size of 5 μm or less, preferably 0.01 μm or more and 5 μm or less. The reason for this is that if the particle size is smaller than 5 μm, a resin composition capable of forming a dense black fired film without impairing adhesion or the like can be provided even with a small amount of addition. On the other hand, when the particle size of the lanthanum composite oxide fine particles is larger than 5 μm, the denseness of the fired film is deteriorated, and the blackness of the fired film to be formed tends to be reduced.
[0013]
The amount of the lanthanum composite oxide fine particles (A) is suitably in the range of 0.1 to 100 parts by mass, preferably 5 to 50 parts by mass per 100 parts by mass of the organic binder (B). The reason is that if the blending amount of the black fine particles is smaller than the above range, sufficient blackness cannot be obtained after firing, while if the blending amount exceeds the above range, the light transmittance deteriorates and the cost increases. This is not preferable.
[0014]
As the organic binder (B), a resin having a carboxyl group, specifically, a photosensitive resin having a carboxyl group itself having an ethylenically unsaturated double bond and having no ethylenically unsaturated double bond Any of the carboxyl group-containing resins can be used. Examples of the resin (which may be either an oligomer or a polymer) that can be suitably used include the following.
(1) Carboxyl group-containing resin obtained by copolymerizing (a) an unsaturated carboxylic acid and (b) a compound having an unsaturated double bond
(2) Carboxyl group-containing photosensitive resin obtained by adding an ethylenically unsaturated group as a pendant to a copolymer of (a) an unsaturated carboxylic acid and (b) a compound having an unsaturated double bond
(3) Secondary (a) produced by reacting (a) an unsaturated carboxylic acid with a copolymer of (c) a compound having an epoxy group and an unsaturated double bond and (b) a compound having an unsaturated double bond. Carboxyl-containing photosensitive resin obtained by reacting (d) a polybasic acid anhydride with a hydroxyl group of
(4) Carboxyl group-containing compound obtained by reacting (f) a compound having a hydroxyl group with a copolymer of (e) an acid anhydride having an unsaturated double bond and (b) a compound having an unsaturated double bond Photosensitive resin
(5) A copolymer of (e) an acid anhydride having an unsaturated double bond and (b) a copolymer of a compound having an unsaturated double bond is reacted with (f) a compound having a hydroxyl group and an unsaturated double bond. -Containing photosensitive resin obtained by
(6) Carboxyl group-containing photosensitive resin obtained by reacting (g) epoxy compound with (h) unsaturated monocarboxylic acid, and reacting (d) polybasic anhydride with generated secondary hydroxyl group.
(7) (b) an epoxy group of a copolymer of a compound having an unsaturated double bond and glycidyl (meth) acrylate, (i) having one carboxyl group in one molecule, and having an ethylenically unsaturated bond A carboxyl group-containing resin obtained by reacting an organic acid having no secondary hydroxyl group with (d) a polybasic acid anhydride
(8) Carboxyl group-containing resin obtained by reacting (j) hydroxyl group-containing polymer with (d) polybasic acid anhydride
(9) A compound obtained by further reacting (c) a compound having an epoxy group and an unsaturated double bond with a carboxyl group-containing resin obtained by reacting (d) a polybasic acid anhydride with (j) a hydroxyl group-containing polymer. Carboxyl group-containing photosensitive resin
[0015]
The carboxyl group-containing photosensitive resin and the carboxyl group-containing resin as described above may be used alone or as a mixture, but in any case, they are blended in a proportion of 10 to 80% by mass of the total amount of the composition. Is preferred. If the compounding amount of these polymers is too small than the above range, the distribution of the resin in the film to be formed tends to be uneven, and it is difficult to obtain sufficient photocurability and photocuring depth, selective exposure, and development. Patterning becomes difficult. On the other hand, if the amount is larger than the above range, the pattern is likely to be distorted and the line width shrinks during firing, which is not preferable.
[0016]
The carboxyl group-containing photosensitive resin and the carboxyl group-containing resin have a weight average molecular weight of 1,000 to 100,000, preferably 5,000 to 70,000, and an acid value of 50 to 250 mgKOH / g, respectively. In the case of a carboxyl group-containing photosensitive resin, those having a double bond equivalent of 350 to 2,000, preferably 400 to 1,500 can be suitably used. When the molecular weight of the resin is lower than 1,000, the adhesion of the film at the time of development is adversely affected. On the other hand, when the molecular weight is higher than 100,000, poor development tends to occur, which is not preferable. When the acid value is lower than 50 mg KOH / g, the solubility in an aqueous alkali solution is insufficient, and poor development is likely to occur. On the other hand, when the acid value is higher than 250 mg KOH / g, the adhesion of the film deteriorates during development and the light-cured portion (exposure) Part) is not preferred. Furthermore, in the case of a carboxyl group-containing photosensitive resin, if the double bond equivalent of the photosensitive resin is less than 350, residues tend to remain during baking, while if it is more than 2,000, the working margin during development is large. Is small, and a high exposure amount is required at the time of photocuring, which is not preferable.
[0017]
In the present invention, the photopolymerizable monomer (C) is used for promoting photocurability of the composition and improving developability. Examples of the photopolymerizable monomer (C) include 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, polyurethane diacrylate, trimethylolpropane triacrylate, and pentane. Erythritol triacrylate, pentaerythritol tetraacrylate, trimethylolpropane ethylene oxide-modified triacrylate, trimethylolpropane propylene oxide-modified triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and methacrylates corresponding to the above acrylates; phthalic acid , Adipic acid, maleic acid, itako Mono-, di-, tri- or higher polyesters of acids, succinic acids, trimellitic acids, polybasic acids such as terephthalic acid and hydroxyalkyl (meth) acrylates, but are not limited to specific ones. However, these can be used alone or in combination of two or more. Among these photopolymerizable monomers, polyfunctional monomers having two or more acryloyl groups or methacryloyl groups in one molecule are preferable.
An appropriate amount of the photopolymerizable monomer (C) is 20 to 100 parts by mass per 100 parts by mass of the organic binder (carboxyl group-containing photosensitive resin and / or carboxyl group-containing resin) (B). When the amount of the photopolymerizable monomer (C) is less than the above range, it is difficult to obtain a sufficient photocurability of the composition. On the other hand, when the amount exceeds the above range, the surface is harder than the deep part of the film. Since the photocuring of the part is accelerated, uneven curing is likely to occur.
[0018]
Specific examples of the photopolymerization initiator (D) include benzoin and benzoin alkyl ethers such as benzoin, benzoin methyl ether, benzoin ethyl ether and benzoin isopropyl ether; acetophenone, 2,2-dimethoxy-2-phenylacetophenone, Acetophenones such as 2-diethoxy-2-phenylacetophenone and 1,1-dichloroacetophenone; 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2- Aminoacetophenones such as dimethylamino-1- (4-morpholinophenyl) -butanone-1; anthraquinones such as 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone and 1-chloroanthraquinone; Thioxanthones such as 4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone and 2,4-diisopropylthioxanthone; ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal; benzophenones such as benzophenone; or xanthones; (2,6-dimethoxybenzoyl) -2,4,4-pentylphosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, ethyl Phosphine oxides such as -2,4,6-trimethylbenzoylphenyl phosphinate; various peroxides; and these known and commonly used photopolymerization initiators may be used alone or in combination of two or more. In combination it can be used. The mixing ratio of the photopolymerization initiator (D) is suitably from 1 to 30 parts by mass per 100 parts by mass of the organic binder (carboxyl group-containing photosensitive resin and / or carboxyl group-containing resin) (B). Is 5 to 20 parts by mass.
[0019]
The photopolymerization initiator (D) as described above includes N, N-dimethylaminobenzoic acid ethyl ester, N, N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, triethanolamine And other photosensitizers such as tertiary amines.
Furthermore, when a deeper photocuring depth is required, if necessary, a titanocene-based photopolymerization initiator such as Irgacure 784 manufactured by Ciba Specialty Chemicals, which initiates radical polymerization in the visible region, or a leuco dye is cured. They can be used in combination as auxiliaries.
[0020]
Further, when a deeper photocuring depth is required, a thermal polymerization catalyst can be used in combination with the photopolymerization initiator (D), if necessary. This thermal polymerization catalyst is capable of reacting an uncured photopolymerizable monomer by aging at a high temperature for several minutes to about 1 hour. Specifically, a peroxide such as benzoyl peroxide, azoisobutyronitrile And the like, preferably 2,2'-azobisisobutyronitrile, 2,2'-azobis-2-methylbutyronitrile, 2,2'-azobis-2,4-divalero Nitrile, 1'-azobis-1-cyclohexanecarbonitrile, dimethyl-2,2'-azobisisobutyrate, 4,4'-azobis-4-cyanovaleric acid, 2-methyl-2,2'-azo Bispropanenitrile, 2,4-dimethyl-2,2,2 ', 2'-azobispentanenitrile, 1,1'-azobis (1-acetoxy-1-phenylethane), 2, , 2 ', 2'-azobis (2-methylbutanamide oxime) dihydrochloride and the like, and more preferred are environmentally friendly non-cyanide and non-halogen type 1,1'-azobis (1-acetoxy-1-phenyl). Ethane).
[0021]
The composition of the present invention may contain, if necessary, inorganic fine particles (E) such as a glass powder having a softening point of 400 to 600 ° C., a conductive powder, a heat-resistant black pigment, and a silica powder, and the photocurable resin composition of the present invention. Can be blended in a quantitative ratio that does not impair the characteristics of
The glass powder can be added at a ratio of 300 parts by mass or less, preferably 200 parts by mass or less, per 100 parts by mass of the lanthanum composite oxide fine particles (A) in order to improve the adhesion to the conductor circuit after firing. The glass powder preferably has a glass transition point (Tg) of 300 to 500 ° C and a glass softening point (Ts) of 400 to 600 ° C. From the viewpoint of resolution, it is preferable to use glass powder having an average particle size of 20 μm or less, preferably 5 μm or less.
[0022]
By adding the glass powder as described above to the photocurable resin composition, the film after exposure and development can be easily fired at 600 ° C. or lower. However, in the composition of the present invention, an organic binder having good flammability is used, and although the composition is so set that the debinding is completed before the glass powder is melted, the softening point of the glass powder is lower than 400 ° C. However, melting occurs at a temperature lower than this, so that the organic binder is easily wrapped, and the remaining organic binder is decomposed to easily cause blisters in the composition, which is not preferable.
As the glass powder, an amorphous frit containing lead oxide, bismuth oxide, zinc oxide or the like as a main component can be suitably used.
[0023]
When a large amount of an inorganic filler or a glass powder is blended with the photocurable resin composition, the obtained composition has poor storage stability, and tends to be poor in coating workability due to gelation or reduced fluidity. Therefore, in the composition of the present invention, in order to improve the storage stability of the composition, a compound having an effect of complexing or forming a salt with a metal or oxide powder that is a component of an inorganic filler or glass powder is used as a stabilizer. It is preferable to add as. Stabilizers include various inorganic acids such as nitric acid, sulfuric acid, hydrochloric acid, and boric acid; various acids such as formic acid, acetic acid, acetoacetic acid, citric acid, stearic acid, maleic acid, fumaric acid, phthalic acid, benzenesulfonic acid, and sulfamic acid. Organic acid; phosphoric acid, phosphorous acid, hypophosphorous acid, methyl phosphate, ethyl phosphate, butyl phosphate, phenyl phosphate, ethyl phosphite, diphenyl phosphite, mono (2-methacryloyloxyethyl) acid Examples include acids such as various phosphate compounds (inorganic phosphoric acid, organic phosphoric acid) such as phosphate, and they can be used alone or in combination of two or more. Such a stabilizer is preferably added at a ratio of 0.1 to 10 parts by mass per 100 parts by mass of the glass powder or the inorganic fine particles (E).
[0024]
As the heat-resistant black pigment, an inorganic pigment excellent in heat resistance can be widely used. Generally, oxides such as Cr, Co, Ni, Fe, Mn, and Ru and composite oxides correspond to these, and these can be used alone or in combination of two or more.
[0025]
As the silica powder, synthetic amorphous silica fine powder is particularly desirable, and specific examples thereof include AEROSIL (registered trademark) 50, 130, 200, 200 V, 200 CF, 200 FAD, 300, 300 CF, 380 manufactured by Nippon Aerosil Co., Ltd. OX50, TT600, MOX80, MOX170, COK84, Nipsil (registered trademark) AQ, AQ-S, VN3, LP, L300, N-300A, ER-R, ER, RS-150, ES manufactured by Nippon Silica Industry Co., Ltd. , NS, NS-T, NS-P, NS-KR, NS-K, NA, KQ, KM, DS, and the like. These can be used alone or in combination of two or more. Among these, the primary particle diameter is 5 to 50 nm, and the specific surface area is 50 to 500 m.2/ G is preferred.
[0026]
This is because, when the above-mentioned synthetic amorphous silica fine powder is added to the above-described photocurable resin composition, it acts as an aggregate in the firing step and can suppress deformation during firing.
[0027]
In the present invention, an appropriate amount of an organic solvent is blended to form a paste by diluting the composition, to facilitate the application step, and then to form a film by drying, and to enable contact exposure. Can be. Specifically, ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene and tetramethylbenzene; cellosolve, methyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, Glycol ethers such as propylene glycol monomethyl ether, dipropylene glycol monoethyl ether, and triethylene glycol monoethyl ether; ethyl acetate, butyl acetate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate Acetates such as ethanol; propanol, ethylene glycol, propylene glycol And alcohols such as terpineol; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha, and these may be used alone or in combination of two or more. Can be used.
[0028]
The photocurable resin composition of the present invention further contains, if necessary, other additives such as a silicone-based or acrylic-based defoaming / leveling agent, a silane coupling agent for improving the adhesion of the film, and the like. It can also be blended. Furthermore, if necessary, known and commonly used antioxidants, thermal polymerization inhibitors for improving thermal stability during storage, metal oxides and silicon oxides as binding components with the substrate during firing And fine particles such as boron oxide.
[0029]
The photocurable resin composition of the present invention may be laminated on a substrate when it is previously formed into a film, but in the case of a paste composition, a screen printing method, a bar coater, a blade coater, or the like as appropriate. For example, a glass substrate to be a front substrate of a PDP, and then a hot-air circulating drying oven, a far-infrared drying oven, etc., for example, at about 60 to 120 ° C. to obtain 5 to 40 to obtain touch dryness. After drying for about a minute to evaporate the organic solvent, a tack-free coating film is obtained. Thereafter, selective exposure, development, and baking are performed to form a predetermined pattern of electrode circuits and a black matrix.
[0030]
As the exposure step, contact exposure and non-contact exposure using a negative mask having a predetermined exposure pattern are possible. As an exposure light source, a halogen lamp, a high-pressure mercury lamp, a laser beam, a metal halide lamp, a black lamp, an electrodeless lamp, or the like is used. The exposure amount is 50 to 1000 mJ / cm2The degree is preferred.
[0031]
As the developing step, a spray method, an immersion method, or the like is used. Examples of the developer include aqueous solutions of metal alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, and sodium silicate, and aqueous solutions of amines such as monoethanolamine, diethanolamine, and triethanolamine. A dilute aqueous alkali solution having a concentration of is preferably used, as long as the carboxyl group of the carboxyl group-containing resin in the composition is saponified and the uncured portion (unexposed portion) is removed. However, the present invention is not limited to this. After the development, it is preferable to perform washing with water or acid neutralization in order to remove an unnecessary developer.
[0032]
In the baking step, the substrate after development is subjected to a heat treatment at about 400 to 600 ° C. in the air or a nitrogen atmosphere to form a desired pattern. In addition, it is preferable to set the heating rate at this time to 15 ° C./min or less.
[0033]
【Example】
Hereinafter, the present invention will be described specifically with reference to Examples, but it is needless to say that the present invention is not limited to the following Examples. In the following, “parts” are all parts by mass unless otherwise specified.
(Synthesis example 1)
In a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux condenser, methyl methacrylate and methacrylic acid were charged at a molar ratio of 0.87: 0.13, dipropylene glycol monomethyl ether was used as a solvent, and azobisisomethyl was used as a catalyst. Butyronitrile was added, and the mixture was stirred at 80 ° C. for 2 to 6 hours under a nitrogen atmosphere to obtain an organic binder A as a resin solution.
The copolymer resin in the organic binder A had a weight average molecular weight of about 10,000 and an acid value of 74 mgKOH / g.
The weight average molecular weight of the obtained copolymer resin was measured by high performance liquid chromatography using three pumps (Shimadzu Corporation LLC-6AD) and Showa Denko column Shodex (registered trademark) KF-804 and KF-802. It was measured.
[0034]
The organic binder A thus obtained was blended at the following composition ratio, stirred by a stirrer, and then kneaded with a three-roll mill to form a paste. In addition, as the low melting point glass powder, Bi2O3 50%, B203 15%, ZnO 15%, SiO2 6% and BaO 17% are pulverized, and the thermal expansion coefficient α300= 85 × 10-7 / ° C, a glass transition point of 460 ° C, and an average particle size of 1.6 µm.
[0035]
Upper layer (white) photosensitive conductive paste;
Organic binder A 100.0 parts
Pentaerythritol triacrylate 50.0 parts
2-benzyl-2-dimethylamino-1-
(4-morpholinophenyl) butan-1-one 5.0 parts
Dipropylene glycol monomethyl ether 80.0 parts
Silver powder 450.0 parts
Glass powder 22.0 parts
Phosphate ester 1.0 part
[0036]
Lower layer (black) photosensitive black paste:
(Composition example 1)
Organic binder A 100.0 parts
Pentaerythritol triacrylate 50.0 parts
2-benzyl-2-dimethylamino-1-
(4-morpholinophenyl) butan-1-one 5.0 parts
Dipropylene glycol monomethyl ether 80.0 parts
Lanthanum composite oxide fine particles (La0.7Sr0.3CoO3) 40.0 parts
(Particle size 0.5 μm)
[0037]
(Composition example 2)
Organic binder A 100.0 parts
Pentaerythritol triacrylate 50.0 parts
2-benzyl-2-dimethylamino-1-
(4-morpholinophenyl) butan-1-one 5.0 parts
Dipropylene glycol monomethyl ether 80.0 parts
Lanthanum composite oxide fine particles (La0.7Sr0.3MnO3) 40.0 parts
(Particle size 0.5 μm)
[0038]
(Composition example 3)
Organic binder A 100.0 parts
Pentaerythritol triacrylate 50.0 parts
2-benzyl-2-dimethylamino-1-
(4-morpholinophenyl) butan-1-one 5.0 parts
Dipropylene glycol monomethyl ether 80.0 parts
Lanthanum composite oxide fine particles (La0.7Sr0.3MnO3) 20.0 parts
(Particle size 0.5 μm)
Cobalt tetroxide (Co3O4) 20.0 parts
(Particle size 0.20 μm, specific surface area 4.9 m2/ G)
Glass powder 20.0 parts
Malonic acid 1.0 part
[0039]
(Composition example 4)
Organic binder A 100.0 parts
Pentaerythritol triacrylate 50.0 parts
2-benzyl-2-dimethylamino-1-
(4-morpholinophenyl) butan-1-one 5.0 parts
Dipropylene glycol monomethyl ether 80.0 parts
Lanthanum composite oxide fine particles (La0.7Sr0.3MnO3) 20.0 parts
(Particle size 0.5 μm)
Ruthenium oxide 20.0 parts
(Particle size 0.20 μm, specific surface area 4.9 m2/ G)
Glass powder 20.0 parts
Malonic acid 1.0 part
[0040]
(Composition example 5)
Organic binder A 100.0 parts
Pentaerythritol triacrylate 50.0 parts
2-benzyl-2-dimethylamino-1-
(4-morpholinophenyl) butan-1-one 5.0 parts
Dipropylene glycol monomethyl ether 80.0 parts
Lanthanum composite oxide fine particles (La0.7Sr0.3MnO3) 40.0 parts
(Particle size 0.5 μm)
Glass powder 20.0 parts
Phosphate ester 1.0 part
Synthetic amorphous silica fine powder 5.0 parts
(Aerosil 200 manufactured by Nippon Aerosil Co., Ltd .; average particle diameter of primary particles: 12 nm, specific surface area by BET method: 200 ± 25 m)2/ G)
[0041]
(Composition example 6)
Organic binder A 100.0 parts
Pentaerythritol triacrylate 50.0 parts
2-benzyl-2-dimethylamino-1-
(4-morpholinophenyl) butan-1-one 5.0 parts
Dipropylene glycol monomethyl ether 80.0 parts
Lanthanum composite oxide fine particles (La0.7Sr0.3MnO3) 40.0 parts
(Particle size 0.5 μm)
Glass powder 20.0 parts
Hypophosphorous acid 1.0 part
[0042]
(Comparative composition example 1)
Organic binder A 100.0 parts
Pentaerythritol triacrylate 50.0 parts
2-benzyl-2-dimethylamino-1-
(4-morpholinophenyl) butan-1-one 5.0 parts
Dipropylene glycol monomethyl ether 80.0 parts
Copper-iron black composite oxide 40.0 parts
(CuO-Fe2O3-Mn2O3, Particle size 0.17 μm)
[0043]
(Comparative composition example 2)
Organic binder A 100.0 parts
Pentaerythritol triacrylate 50.0 parts
2-benzyl-2-dimethylamino-1-
(4-morpholinophenyl) butan-1-one 5.0 parts
Dipropylene glycol monomethyl ether 80.0 parts
Copper-chromium black composite oxide 40.0 parts
(CuO-Cr2O3-Mn2O3, Particle size 0.45 μm)
[0044]
With respect to the pastes of the composition examples 1 to 6 and the comparative composition examples 1 and 2 thus obtained, the bus electrode evaluation (resistance value, interlayer conduction, color after firing, L*Value), black matrix evaluation (color tone after firing, L*Value) and evaluation of paste stability. The evaluation method is as follows.
[0045]
Resistance value:
A paste for evaluation was applied on the entire surface of a glass substrate using a 300-mesh polyester screen, and then dried at 90 ° C. for 20 minutes in a hot-air circulating drying oven to form a film having good dryness to the touch. . Next, a conductive paste for the upper layer (white) is applied on the entire surface of the film using a 200-mesh polyester screen, and then dried at 90 ° C. for 20 minutes in a hot-air circulating drying oven to dry to the touch. A two-layer film having good properties was formed. Thereafter, a metal halide lamp was used as a light source, and a negative mask having a pattern size of 100 μm × 10 cm was used.2After exposure so as to obtain 0.5 wt% Na at a liquid temperature of 30 ° C.2CO3Development was carried out using an aqueous solution, followed by washing with water. Finally, the temperature was raised at a rate of 5 ° C./min in an air atmosphere, followed by baking at 550 ° C. for 30 minutes to produce a substrate. The resistance value of the fired film thus obtained was measured.
[0046]
Interlayer conduction:
A 100 μm × 3 cm pattern was formed on a glass substrate with an ITO film by the same method as described above. A tester was applied to the upper layer (white layer) and ITO of the fired film thus obtained, and the conduction was confirmed.
[0047]
Color after firing:
A 3 cm × 10 cm pattern was formed on the glass substrate with an ITO film by the same method as described above (for the evaluation of the black matrix, the upper layer (white) conductive paste was applied and not dried). The fired film thus obtained was visually observed from the glass side, and the color tone was confirmed.
[0048]
L*value:
Using a test piece whose color tone has been confirmed after the above-mentioned firing, a color difference meter (CR-221, manufactured by Minolta Camera Co., Ltd.) is used.*a*b*The value of the color system is measured according to JIS-Z-8729, and L is an index representing lightness.*The value was evaluated as an index of blackness. This L*The smaller the value, the better the blackness.
[0049]
Paste stability:
300 g of each of the pastes of Composition Examples 1 to 6 and Comparative Composition Examples 1 and 2 were placed in a closed container and left at 30 ° C. for one month to check the state.
[0050]
Tables 1 and 2 show the evaluation results.
[Table 1]
[0051]
[Table 2]
[0052]
As is clear from the results shown in Tables 1 and 2, the paste according to the composition of the present invention is superior in paste stability to the paste of the comparative composition, and satisfies sufficient blackness even after firing. It was found that the resulting lower layer (black layer) for the bus electrode and the black matrix could be formed.
[0053]
With respect to the evaluation paste, the line shape after development, the line shape after firing, and the adhesion were evaluated, but no problem was found. The substrate used in these evaluations was obtained by subjecting a film formed on a glass substrate to pattern exposure using a negative film having a line / space of 50/100 μm, followed by 0.5 wt% Na having a liquid temperature of 30 ° C.2CO3A pattern fired substrate was prepared in the same manner as in the above-described resistance value evaluation, except that development was performed with an aqueous solution, washing was performed, and then firing was performed. For these evaluation methods, the line shape after development is evaluated by observing the pattern completed until development under a microscope, without irregular irregularities in the lines, and whether there is no warping or the like. The pattern completed until firing was observed under a microscope to evaluate whether or not there was no irregular variation in the lines, and whether or not there was any distortion. The adhesion was evaluated by peeling with a cellophane pressure-sensitive adhesive tape and checking for peeling of the pattern.
[0054]
【The invention's effect】
As described above, according to the photocurable resin composition of the present invention, excellent adhesion, resolution, and firing properties to the substrate in each of the steps of drying, exposure, development, and firing, after firing, In this case, a black layer and a black matrix of a PDP bus electrode which can satisfy sufficient blackness can be formed.
Further, the photocurable resin composition of the present invention is excellent in storage stability and can provide a sufficient contrast with a small film thickness, and thus is extremely useful for mass production of PDPs and cost reduction.
[Brief description of the drawings]
FIG. 1 is a partially exploded perspective view of a surface discharge type AC PDP.
[Explanation of symbols]
1 Front glass substrate
2a, 2b Display electrode
3a, 3b transparent electrode
4a, 4b bus electrode
5 Transparent dielectric layer
6 Protective layer
10 Black Matrix
11 Back glass substrate
12 ribs
13 Address electrode
14a, 14b, 14c phosphor film
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001292712A JP3548146B2 (en) | 2001-09-26 | 2001-09-26 | Photocurable composition and plasma display panel formed with black pattern using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001292712A JP3548146B2 (en) | 2001-09-26 | 2001-09-26 | Photocurable composition and plasma display panel formed with black pattern using the same |
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| JP2003096309A JP2003096309A (en) | 2003-04-03 |
| JP3548146B2 true JP3548146B2 (en) | 2004-07-28 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7648655B2 (en) | 2007-10-30 | 2010-01-19 | E. I. Du Pont De Nemours And Company | Conductive composition for black bus electrode, and front panel of plasma display panel |
| US7781971B2 (en) | 2007-08-03 | 2010-08-24 | E.I. Du Pont De Nemours And Company | Conductive composition for black bus electrode, and front panel of plasma display panel |
| US8193707B2 (en) | 2007-11-06 | 2012-06-05 | E. I. Du Pont De Nemours And Company | Conductive composition for black bus electrode, and front panel of plasma display panel |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006063226A (en) * | 2004-08-27 | 2006-03-09 | Solar:Kk | Visible light-curable putty composition |
| KR20080112324A (en) * | 2006-04-26 | 2008-12-24 | 다이요 잉키 세이조 가부시키가이샤 | Photocurable conductive pastes and photocurable black pastes used to form two-layered bus electrodes, and plasma display panels |
| JP4765820B2 (en) * | 2006-08-03 | 2011-09-07 | 東レ株式会社 | Photosensitive paste and method of manufacturing electronic component using the same |
| JP6260326B2 (en) * | 2014-02-14 | 2018-01-17 | 凸版印刷株式会社 | Thin film transistor device and manufacturing method thereof |
| JP6764636B2 (en) * | 2014-10-08 | 2020-10-07 | 東京応化工業株式会社 | Radiation-sensitive resin composition, pattern manufacturing method, transparent insulating film, and display device |
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2001
- 2001-09-26 JP JP2001292712A patent/JP3548146B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7781971B2 (en) | 2007-08-03 | 2010-08-24 | E.I. Du Pont De Nemours And Company | Conductive composition for black bus electrode, and front panel of plasma display panel |
| US7648655B2 (en) | 2007-10-30 | 2010-01-19 | E. I. Du Pont De Nemours And Company | Conductive composition for black bus electrode, and front panel of plasma display panel |
| US8193707B2 (en) | 2007-11-06 | 2012-06-05 | E. I. Du Pont De Nemours And Company | Conductive composition for black bus electrode, and front panel of plasma display panel |
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| Publication number | Publication date |
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| JP2003096309A (en) | 2003-04-03 |
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