JP3548375B2 - Coating method and apparatus - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a coating processing apparatus used in a processing step of obtaining a desired resin pattern by applying a photosensitive resin on a substrate, exposing and developing the resin in a semiconductor manufacturing or the like.
[0002]
[Prior art]
In the manufacture of a semiconductor device, in order to form an element on a semiconductor single crystal substrate such as silicon (hereinafter, referred to as a substrate), a photosensitive resin is applied to the substrate surface with a coating device and prepared in advance with an exposure device. The pattern of the mask (reticle) is exposed and transferred, and development processing is performed in a developing device to obtain an intended transfer pattern of the photosensitive resin. Elements are formed on the substrate in a later step using this transfer pattern as a mask. The precision with which the elements are formed depends on the transfer pattern, and the coating / exposure / development steps are extremely important steps in the manufacture of semiconductor elements.
[0003]
In the coating / exposure / development step, as shown in FIG. 5, a coating step and a development step are performed before and after the exposure step. The coating process includes a surface modification process (processing sequence 1) for improving the adhesion of the photosensitive resin to the substrate, a temperature control of the substrate immediately before coating (processing sequence 2), a dropping of the photosensitive resin onto the substrate surface, and a high speed. Thinning the resin on the substrate by rotation, removing unnecessary photosensitive resin from the substrate surface after coating (processing sequence 3), heat treatment for volatilizing the solvent in the photosensitive resin and improving the strength of the coating film ( Processing order 4), temperature control of the substrate immediately before exposure, and the like are performed. In the exposure step, selection of a mask (reticle), precise positioning of the substrate, projection of the mask on the substrate surface, and the like are performed (processing sequence 5).
[0004]
The development process includes a heat treatment for stabilizing the photosensitive resin immediately after the exposure (processing sequence 6), a temperature control of the substrate immediately before the development (processing sequence 7), a drop of the developing liquid on the substrate surface, and a removal / cleaning of the developing solution after the development. Drying of the substrate surface by high-speed rotation (processing sequence 8), heat treatment for pattern strengthening after development (processing sequence 9), cooling before collecting the substrate storage container, and the like are performed.
[0005]
Since photosensitive resin accounts for a large proportion of the cost of materials used for processing except for the substrate, means for reducing the amount used is required. As shown in FIG. 6, it has been proposed to reduce the amount of application by applying a thin film on a substrate using a resist nozzle 2 extending in the longitudinal direction (for example, Japanese Patent Application Laid-Open No. 58-170565). Publication). Further, as a structure related to a nozzle extending in a longitudinal direction, a structure described in JP-A-7-326564 is known.
[0006]
[Problems to be solved by the invention]
Although the above-described conventional resist reduction method spreads the resist film formed on the substrate thinly over the entire surface of the substrate, this method employs a sequential moving reduction projection exposure apparatus (hereinafter, referred to as a main device) mainly used in the current semiconductor manufacturing. , A stepper), a photosensitive resin is also applied to a portion that is not an exposure area. In addition, a step of washing the photosensitive resin with a solvent is required to prevent dust generation due to peeling of the photosensitive resin applied to the outer peripheral edge of the substrate.
[0007]
The present invention has been made in view of the above-described problems in the conventional example, and is a coating processing apparatus capable of reducing the amount of photosensitive resin used and eliminating the need for removing unnecessary resist at the end. The purpose is to provide.
[0008]
Means and action for solving the problem
In order to achieve the above object, in the present invention, a photosensitive resin is applied only to a portion necessary for actual exposure, and a photosensitive resin is not applied to a portion not exposed (not used as a product).
[0009]
That is, the coating processing apparatus of the present invention, when applying a photosensitive resin used in semiconductor device manufacturing and the like on the substrate, exudes the photosensitive resin from the slit-shaped discharge port, the discharge port in a certain direction In an apparatus for relatively moving and coating a substrate, the radiation of the discharge port is set to be equal to or a multiple of the dimension in consideration of a cut portion (scribe line) of an element as a product.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
In one embodiment of the present invention, the photosensitive resin application section including the photosensitive resin supply pipe is configured to be movable on the substrate and the discharge port (nozzle) is replaceable. The photosensitive resin can be applied with an arbitrary area (ejection port width × relative moving distance) with an arbitrary slit-shaped ejection port width. In the process of applying the photosensitive resin on the substrate, a distance detector for detecting the distance between the end of the photosensitive resin discharge port and the surface of the substrate is attached to the photosensitive resin application section. The substrate is moved in a direction perpendicular to the substrate surface, and the distance between the photosensitive resin discharge port end and the substrate surface is controlled to a predetermined distance. More preferably, in the processing step of applying a photosensitive resin on the substrate, in controlling the distance between the photosensitive resin discharge port end and the substrate surface at a predetermined interval, the substrate is provided with a plurality of distance detectors, If it is assumed that at least one of the position detectors at the end is out of the substrate and the function of the distance detector is not functioning properly, the discharge is started from a position where all the distance detectors can detect. If one or more of the plurality of distance detectors are outside the substrate during the movement of the photosensitive resin discharge port, the distance control is stopped and the application is continued with the immediately preceding distance data. Further, the substrate on which the coating process is to be performed is mounted on a temperature control plate controlled to a predetermined temperature. A positioning mechanism (alignment mechanism) and a substrate transport mechanism are provided so that the orientation flat or notch indicating the crystal direction of the substrate is positioned and mounted so as to be in a predetermined direction and position. Alternatively, the configuration is such that a predetermined application target range and the actual position of the substrate can be matched by a positioning mechanism (alignment mechanism) provided on the temperature control plate.
[0011]
In another embodiment of the present invention, a plurality of photosensitive resin supply units including a photosensitive resin supply pipe are provided, and a predetermined supply unit is selectively provided by a predetermined processing procedure. It is configured to be used for In addition, using a plurality of photosensitive resin supply units, when coating on a substrate, the photosensitive resin supply unit is replaced during the substrate coating process, and the type and thickness of the photosensitive resin are applied on a single substrate. It has a configuration and a processing method that can be applied differently.
[0012]
【Example】
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1 to 3 show the configuration of a coating apparatus according to an embodiment of the present invention. 1 is an overall view, FIG. 2 is an enlarged view of a coating processing section, and FIG. 3 is an enlarged view of a coating nozzle section. In the drawing, 1 is a substrate, 2 is a coating nozzle, 3 is a nozzle holding section, and 4 is X movement. The axis 5, the Y movement axis, 6 is a temperature control plate, 7 is a photosensitive resin, 8 is a substrate position detector, 9 is a substrate position adjustment (alignment) stage, 10 is a substrate transfer mechanism, and 11 is a distance sensor. The application nozzle 2 is provided with a photosensitive resin supply pipe 21, to which a photosensitive resin supply pipe (not shown) is connected to supply the photosensitive resin. The coating nozzle 2 can be moved in the X direction by the X movement axis 4 and in the Y direction by the Y movement axis 5. The photosensitive resin is formed at an arbitrary position on the substrate 1 with a coating width corresponding to the slit (ejection) width. Can be applied. As the application nozzle 2, other spare application nozzles 2a, 2b, 2c are prepared. These application nozzles 2, 2a, 2b, 2c have discharge ports with slit widths different from each other, and if a dimension taking into account the cut portion (scribe line) of the element to be manufactured is determined, the dimension is equal to the dimension or an integer. An application nozzle 2 having a double slit width (application width) is selected and attached to the nozzle holding unit 3, and the photosensitive resin supply pipe is connected. The remaining three nozzles are housed as spare nozzles 2a, 2b, and 2c at housing positions provided on the application unit base 22.
[0013]
FIG. 4 shows processing steps of the apparatus shown in FIGS.
The processing is performed in the following order.
1. The substrate 1 is placed on the temperature control plate 6 in a state where the positional accuracy is secured in advance. The position of the substrate 1 is set by the substrate position adjusting stage 9 performing the rotation / movement operation of the substrate position according to the information of the substrate position detector 8. After the position setting, the substrate transport mechanism 10 transports / places the substrate 1 from the substrate position adjusting stage 9 on the temperature control plate 6 while maintaining the positional accuracy.
2. The nozzle holding unit 3 selectively holds the application nozzle 2 according to predetermined processing contents.
3. The application nozzle 2 moves to a position determined in advance by the X movement axis 4 / Y movement axis 5.
4. The photosensitive resin 7 is discharged from the application nozzle 2. At the time of ejection, the nozzle holding unit 3 adjusts the holding height based on information from the distance sensor 11 so that the photosensitive resin ejection port and the surface of the substrate 1 have a predetermined height. If the distance sensor 11 is outside the substrate at the end of the substrate and the height cannot be adjusted, control is performed to fix the height of the application nozzle 2 using the immediately preceding distance information. In the case of processing in which both the discharge start position and the end position are outside the substrate, the coating is performed bidirectionally from the midpoint of the coating portion length or the scrub line position.
[0014]
5. The Y movement axis starts moving at a predetermined speed at the same time as the start of the discharge of the photosensitive resin 7 or at a predetermined timing.
6. After moving for a predetermined time or distance, the discharge of the photosensitive resin is stopped.
7. When the next application operation instruction on the same substrate using the same application nozzle 2 is determined in advance, the above processing 3 is repeated.
8. When the next application operation instruction on the same substrate 1 by another kind of photosensitive resin 7 is predetermined, the above processing 2 is repeated.
9. The application nozzle 2 moves to the standby position, and the nozzle holding unit 3 opens the application nozzle 2.
10. The substrate 1 is removed because it is transferred from the temperature control plate 6 to the next processing.
[0015]
[Modification of Embodiment]
In the above description, one example of the photosensitive resin supply unit including the photosensitive resin supply pipe has been described. However, a plurality of such photosensitive resin supply units are provided, and a predetermined processing procedure is performed. It is good also as composition which a specific supply part among a plurality is used selectively. In that case, when applying on the substrate using the plurality of photosensitive resin supply units, the photosensitive resin supply unit is exchanged during the substrate coating process, and the type and thickness of the photosensitive resin are applied on a single substrate. Can be applied differently.
[0016]
[Example of device production method]
Next, an embodiment of a device production method using the above-described coating apparatus will be described.
FIG. 7 shows a flow of manufacturing micro devices (semiconductor chips such as ICs and LSIs, liquid crystal panels, CCDs, thin-film magnetic heads, micro machines, etc.). In step 1 (circuit design), a device pattern is designed. Step 2 (mask fabrication) forms a mask on which the designed pattern is formed. On the other hand, in step 3 (wafer manufacturing), a wafer is manufactured using a material such as silicon or glass. Step 4 (wafer process) is referred to as a preprocess, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and includes processes such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). including. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7).
[0017]
FIG. 8 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. Step 14 (ion implantation) implants ions into the wafer. In step 15 (resist processing), a photosensitive agent is applied to the wafer. Step 16 (exposure) uses the exposure apparatus to print and expose the circuit pattern of the mask onto the wafer. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. Step 19 (resist stripping) removes unnecessary resist after etching. By repeating these steps, multiple circuit patterns are formed on the wafer.
By using the production method of the present embodiment, a highly integrated device, which was conventionally difficult to produce, can be produced at low cost.
[0018]
【The invention's effect】
As described above, according to the present invention, a photosensitive resin is applied only to a portion necessary for actual exposure, and a photosensitive resin is not applied to a portion that is not exposed (not used as a product). Therefore, it is possible to reduce the amount of photosensitive resin used, and it is not necessary to remove unnecessary resist at the edges. Can be avoided.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating a configuration of a coating apparatus according to an embodiment of the present invention.
FIG. 2 is an enlarged view of a coating processing unit in the apparatus of FIG.
FIG. 3 is an enlarged view of a coating nozzle portion in the apparatus of FIG.
FIG. 4 is a diagram showing a processing flow in the apparatus of FIG. 1;
FIG. 5 is a chart showing general coating / developing processing steps.
FIG. 6 is a diagram showing a configuration of a conventional coating apparatus.
FIG. 7 is a diagram showing a flow of manufacturing a micro device.
FIG. 8 is a diagram showing a detailed flow of a wafer process in FIG. 7;
[Explanation of symbols]
1: substrate, 2, 2a, 2b, 2c: coating nozzle, 3: nozzle holder, 4: X movement axis, 5: Y movement axis, 6: temperature control plate, 7: photosensitive resin, 8: substrate position detection 9: substrate position adjustment stage, 10: substrate transfer mechanism, 11: distance sensor, 21, 21a, 21b, 21c: photosensitive resin supply pipe, 22: coating unit base.

Claims (9)

A coating method for coating the photosensitive resin on the substrate by moving the discharge port relative to the substrate to be coated while causing the photosensitive resin to ooze out of the slit-shaped discharge port. 3. The coating method according to claim 1, wherein the radiation of the discharge port is set to the same size as or an integer multiple of a size in consideration of a cut portion of an element which is a product to be formed on the substrate to be coated. A coating nozzle having a slit-shaped discharge port and a supply pipe for supplying a photosensitive resin, and a stage for relatively moving the nozzle and a substrate to be coated, the nozzle being made to exude photosensitive resin from the discharge port In a coating processing apparatus for coating the substrate to be coated by moving the substrate relative to the substrate to be coated in a certain direction, the device which is a product to be radiated from the discharge port on the substrate to be coated. A coating processing apparatus characterized in that it can be set to the same dimension as the dimension taking into account the cut portion of the above or an integral multiple thereof. A nozzle supporting portion that detachably mounts the coating nozzle, a photosensitive resin coating portion that movably supports the coating nozzle on the substrate, and an optional coating nozzle that can be replaced with respect to the nozzle supporting portion. 3. The coating processing apparatus according to claim 2, wherein the photosensitive resin can be applied at an arbitrary area with an arbitrary slit-shaped discharge port width at the position. A distance detector for detecting the distance between the end of the coating nozzle and the surface of the substrate is attached to the photosensitive resin application section, and the photosensitive resin application section is moved in a direction perpendicular to the substrate surface, and the photosensitive resin is moved. 4. The coating apparatus according to claim 3, wherein the distance between the resin discharge port end and the substrate surface is controlled to a predetermined distance. A plurality of the distance detectors are attached to the photosensitive resin application part, and when applying the photosensitive resin on the substrate, the distance between the photosensitive resin discharge port end and the substrate surface is set to a predetermined interval. In controlling, if it is assumed that at least one of the plurality of position detectors at the end of the substrate is outside the substrate and the function of the distance detector does not function properly, the entire distance detector can detect It is set in advance to start discharging from the position, and if one or more of the plurality of distance detectors is out of the substrate during the movement of the photosensitive resin discharge port, distance control is stopped and the immediately preceding distance data is used. The coating processing apparatus according to claim 4, further comprising a control unit that continues the coating. A temperature control plate that is controlled at a predetermined temperature and mounts the substrate to be coated, and an orientation flat or notch indicating a crystal direction of the substrate is in a predetermined direction and position of the temperature control plate. The coating processing apparatus according to claim 1, further comprising a positioning mechanism for positioning the substrate and a substrate transport mechanism. A temperature control plate which is controlled to a predetermined temperature and mounts the substrate to be coated, and a positioning mechanism provided on the temperature control plate and which can match a predetermined coating target range with a real position of the substrate. The coating treatment apparatus according to any one of claims 1 to 5, further comprising: A plurality of photosensitive resin supply units, including the photosensitive resin supply pipe, are provided, and in a predetermined processing procedure, a specific supply unit among the plurality is selectively used. The coating treatment apparatus according to claim 3, wherein: In applying the photosensitive resin supply unit provided on the substrate using the plurality of photosensitive resin supply units, if the photosensitive resin supply unit is replaced during the substrate coating process and the type of the photosensitive resin and the coating thickness are different on a single substrate. 9. The coating processing apparatus according to claim 8, further comprising a configuration and a control unit capable of performing the coating while being applied.

Images