JP3548673B2

JP3548673B2 - Electronic circuit element

Info

Publication number: JP3548673B2
Application number: JP23299197A
Authority: JP
Inventors: 宏吉田
Original assignee: Sharp Corp
Current assignee: Sharp Corp
Priority date: 1997-08-28
Filing date: 1997-08-28
Publication date: 2004-07-28
Anticipated expiration: 2017-08-28
Also published as: JPH1174555A

Description

【０００１】
【発明が属する技術分野】
本発明は、電子回路素子および受光装置ならびに電子回路素子の製造方法に関し、特に家庭電化製品およびパーソナルコンピュータなどのオフィスオートメーション機器に有利に実施される遠隔制御のための受光装置ならびに赤外線光空間伝送素子などの構成に関する。
【０００２】
【従来の技術】
先行技術では、遠隔制御の受光装置において、単一の半導体集積回路チップで、赤外光の受光ならびに増幅および波形整形などの処理を行う構成を有する。赤外線送信機から送信された赤外光デジタル信号は、前記半導体チップのホトダイオード部の受光面に入光され、光信号から電気信号に変換され、こうして得られた微弱な電気信号が、その半導体チップでたとえば数万倍に増幅され、波形整形のためにフィルタ回路および検波回路で処理され、送信された信号と同様なデジタル出力信号が得られる。
【０００３】
たとえば１０ｍ以上の送受信間距離を必要とする遠隔制御の受光装置では、上述のように信号増幅率が非常に大きい。したがって電磁ノイズの悪影響を受けやすくなる。したがって半導体チップをシールドする必要がある。
【０００４】
上述の先行技術では、単一の半導体チップが用いられているので、シールドが困難であり、電磁ノイズによって悪影響を受ける。したがって複数の個別的な電子部品を搭載し、金属製ケースでシールドを施した構成に比べると、特性面で劣る結果になる。
【０００５】
図１４は上述の問題を解決する他の先行技術の平面図であり、図１５はその断面図である。金属製リードフレーム１のパッド部２に、ホトダイオードチップ３と、そのホトダイオードチップ３からの電気信号を増幅および波形整形するもう１つの半導体チップ４とが搭載される。パッド部２には、屈曲部５を介してシールド部６が半導体チップ４を覆うようにして延び、さらに左右両側壁７が形成される。このシールド部６には、ホトダイオード３の受光面に光を導く光透過孔８が形成される。合成樹脂製パッケージ９によって封止され、このパッケージ９からは、リード１０が露出する。パッド部２には、チップ抵抗１１およびチップコンデンサ１２が搭載され、半導体チップ４に電気的に接続される。さらにリード部１３，１４が設けられる。
【０００６】
半導体チップ４などは、ワイヤボンディング１５，１６されて電気的に接続される。
【０００７】
図１４および図１５に示される先行技術では、シールド部６によって半導体チップ４を覆うことができ、したがって耐ノイズ性能を向上することができるけれども、新たな問題が発生する。リードフレーム１の接続部５において参照符１１７，１１８で示されるように２カ所で９０度折り曲げなければならない。したがって製造が困難であり、パッド部２とシールド部６との間隔ｄ１を比較的大きくしなければならず、これによってパッケージ９の厚み（図１５の左右方向の厚み）を薄くすることができず、構成が大形化する。またこの折り曲げ加工時に、ワイヤボンド部１５，１６が損傷しないようにしなければならず、製造が困難である。
【０００８】
さらに図１４および図１５の先行技術では、リード部１０，１３，１４は直線状であり、配線基板に立てて置く構成としたとき、自立が可能であるようにするために、リード部１０，１３，１４の厚みを０．４ｍｍ以上とする必要がある。そのようにすると高密度実装、小形化に限界がある。リード部品１０，１３，１４の板厚を薄くして高密度実装、小形化を可能にすると、それらのリード部１０，１３，１４の強度が低下し、配線基板上で自立性がなくなってしまう。このような自立性がない構造では、パッケージ９を配線基板上に保持するためのホルダなどを、別途、設ける必要がある。
【０００９】
【発明が解決しようとする課題】
本発明の目的は、耐ノイズ性能を向上し、構成を小形化し、しかも高密度実装が可能であり、さらに配線基板に挿入実装して自立性を確保することができるようにした電子回路素子を提供することである。
【００１０】
【課題を解決するための手段】
本発明は、ベース部と、ベース部と同一の金属板から成る第１リード部とを有するベースフレームと、
ベース部上に搭載され、第１リード部に電気的に接続される電子回路チップと、
ベース部上の電子回路チップを覆うシールド部と、シールド部と同一の金属板から成る第２リード部とを有するシールドフレームとを含み、
第１および第２リード部は、
基端部寄りで相互に重なる重なり部と、
重なり部に連なり、遊端部寄りでずれている挿入実装部とを有し、
挿入実装部は、第１および第２リード部の軸線に垂直な仮想平面内で、相互に角度θをなしており、さらに
第１リード部と第２リード部との前記重なり部を固定するはんだと、
ベースフレームと電子回路チップとシールド部とを封止する合成樹脂製パッケージとを含むことを特徴とする電子回路素子である。
【００１１】
本発明に従えば、電子回路チップがベース部上に搭載されたベースフレームに、シールドフレームを重ねてシールド部によって電子回路チップを覆うようにしたので、電磁シールドが確実になるとともに、ベース部とシールド部とを近接することが容易に可能であり、製造が容易であるとともに小形化が可能であり、ワイヤボンドにシールド部などが不所望に接触するおそれがなく、または製造時に不所望にワイヤボンドに接触することはなく、品質が安定化されるとともに、製造が極めて容易である。
【００１２】
さらに本発明に従えば、ベースフレームの第１リード部とシールドフレームの第２リード部とは、基端部寄りの重なり部で重なるように構成され、はんだによって固定されるので、これらのリード部の強度を大きくすることができる。したがって配線基板にリード部を挿入して自立性を確保することができる。
【００１３】
さらに第１および第２リード部は上述のように部分的に重ねられて固定されるので、第１リード部および第２リード部の厚みを、それぞれ小さくすることができる。これによって高密度実装が可能になり、さらに小形化が図られることになる。
【００１４】
一般的にいえば、複数の隣接するリード部の間隔は、そのリード部を構成する金属板の厚み未満にして高密度化することは、製造上困難である。本発明では、第１リード部と第２リード部とを薄くし、これらの第１および第２リード部を重ねてはんだで固定することによって、強度の向上を図ることができるとともに、隣接するリード部相互間の間隔を小さくし、高密度化が上述のように可能になる。
本発明に従えば、第１および第２リード部の基端部寄り、すなわちベース部およびシールド部寄りの部分は、相互に重なって前述のようにはんだで固定され、重なり部を形成する。これらの第１および第２リード部の遊端部寄りの部分は、配線基板の取付け孔を挿通してその配線基板のランドにはんだ付けされる挿入実装部を形成する。
特に本発明に従えば、リード部は、第１および第２リード部によって構成され、これらの挿入実装部が、第１および第２リード部の長手方向である軸線（後述の図１の上下方向）に垂直な仮想平面内で、相互にたとえば９０度の角度θをなし、したがって自立性を確保して希望する正確な姿勢で本件電子回路素子を配線基板に立てて置くことができる。
【００１５】
また本発明は、シールド部は、
電子回路チップの上方を覆うシールド部本体と、
シールド部本体に連なり、電子回路チップの外周を覆う外周部とを有することを特徴とする。
【００１６】
本発明に従えば、シールドフレームのシールド部は、ベース部および電子回路チップから距離をあけて上方を覆うシールド部本体と、電子回路チップの外周を覆う外周部とを有し、これによって耐シールド性能を向上することができる。このことは特に、電子回路チップ、たとえば半導体集積回路チップにおける電気信号の増幅率が大きい構成では、耐ノイズ性能を向上することが重要である。
【００１７】
また本発明は、ベースフレームの厚みは、シールドフレームの厚みを超える値に選ばれることを特徴とする。
【００１８】
本発明に従えば、ベースフレーム厚みを、たとえば０．２ｍｍとし、シールドフレームの厚みをたとえば０．１０〜０．１５ｍｍに選ぶ。シールドフレームのシールド部は、電子回路チップを覆って電磁シールドを達成する機能を有していてもよく、したがってシールドフレームの金属板の厚みを、薄くすることができる。またこのような薄いシールドフレームの第２リード部を補強する働きを果す。
【００１９】
ベースフレームはシールドフレームよりも厚くし、電子回路チップが搭載されるのに充分な強度を有する。
【００２０】
また本発明は、パッケージは、第１および第２リード部を部分的に封止し、
このパッケージによって封止された第１および第２リード部の相互の対向する面に、第１および第２リード部の全幅にわたって凹溝が形成されることを特徴とする。
【００２１】
本発明に従えば、第１リード部の全幅にわたる凹溝が形成されるとともに、第２リード部の全幅にわたる凹溝が形成され、これらの凹溝は、第１および第２リード部の相互に対向する面に形成され、合成樹脂製パッケージで封止されるので、溶融はんだに第１および第２リード部のパッケージから露出した部分をたとえば浸漬してはんだディップした際に、溶融はんだの表面張力によって第１および第２リード部からパッケージ内に入り込んだ溶融はんだは、凹溝で停止し、それ以上内方に侵入することが防がれる。これによって溶融はんだの悪影響による故障などを防ぐことができる。
【００２２】
凹溝は、第１および第２リード部の長手方向、すなわち軸線方向の同一位置に形成されてもよいけれども、それらの軸線方向に相互にずれていてもよい。
【００２６】
また本発明は、（ａ）ベースフレームであって、
ベース部と、
ベース部と同一の金属板から成り、ベース部とともに一平面内に形成される第１リード部とを有し、
第１リード部は、
ベース部に連なる第１中央リード部と、
第１中央リード部の左右両側方に間隔をあけて配置される一対の第１側リード部とを有し、
各第１側リード部は、
第１中央リード部に平行であり、基端部寄りの第１側重なり部と、
第１側重なり部に連なり、遊端部寄りで外側方に延びる第１外側延在部と、
第１外側延在部に連なり、第１中央リード部と平行に延びる第１挿入実装部とを有するベースフレームと、
（ｂ）ベース部上に搭載され、第１中央リード部および第１側重なり部とに電気的に接続される電子回路チップと、
（ｃ）シールドフレームであって、
ベース部上の電子回路チップを覆うシールド部と、
シールド部と同一の金属板から成る第２リード部とを有し、
第２リード部は、シールド部に連なる立上り部と、
立上り部に連なり、第１中央リード部に全長にわたって重なる第２中央リード部と、
第２中央リード部の左右両側方に間隔をあけて配置される一対の第２側リード部とを有し、
各第２側リード部は、
第１側重なり部に重なり、基端部寄りの第２側重なり部と、
第２側重なり部に連なり、第１側延在部に重なり、遊端部寄りで外側方に延びる第２外側延在部と、
第２外側延在部に連なり、第１挿入実装部の長手方向途中まで重なり、第２側リード部と平行に延びる垂下部と、
垂下部に連なり、垂下部の厚み方向に相互に逆方向にほぼ直角に屈曲して延びる屈曲部と、
屈曲部に連なり、第２側リード部と平行に延び、第１および第２中央リード部の軸線に垂直な仮想平面内で、第１挿入実装部と相互にほぼ９０度の角度θをなしている第２挿入実装部とを有するシールドフレームと、
（ｄ）第１中央リード部と第２中央リード部とを固定し、第１側重なり部と第２側重なり部とを固定し、第１外側延在部と第２外側延在部の基端部寄りの部分とを固定するはんだと、
（ｅ）ベース部と第１中央リード部の基端部と電子回路チップとシールド部と第２リード部の基端部とを封止する合成樹脂製パッケージとを含むことを特徴とする電子回路素子である。
【００２７】
本発明に従えば、ベースフレームおよびシールドフレームは、図１４および図１５に関連して述べた先行技術に比べて薄くすることができ、したがってベースフレームの第１中央リード部と左右一対の第１側リード部との間隔を小さくして高密度化が可能であり、同様に、シールドフレームの第２中央リード部と第２側リード部との間を小さくして高密度化が可能である。
【００２８】
さらに第１側リード部は、外側方で第１外側延在部が延びて、第１挿入実装部が形成され、これによって第１中央リード部と第１挿入実装部との間隔を大きくし、配線基板への挿入実装が容易である。このことはシールドフレームに関しても同様であり、すなわち第２側リード部は第２外側延在部から垂下部を有し、垂下部の第２中央リード部から遠ざかった側部で屈曲部が連なる。したがって第２中央リード部と屈曲部との間隔を大きくして、配線基板への実装を容易にすることができる。
【００２９】
さらに本発明に従えば、一対の第２側リード部は、第２中央リード部に関して左右で、屈曲部は第２中央リード部および垂下部の厚み方向に相互に逆方向（後述の図３の左右方向）に延び、したがって第１および第２リード部によって本件電子回路素子を配線基板に希望する姿勢で正確に立てて置くことが可能になり、正確な実装姿勢を得ることができる。
【００３０】
また本発明は、（ａ）ベースフレームであって、
ベース部と、
ベース部と同一の金属から成り、ベース部とともに一平面内に形成される第１リード部とを有し、
第１リード部は、
ベース部に連なる第１中央リード部と、
第１中央リード部の左右両側方に間隔をあけて配置される一対の第１側リード部とを有し、
各第１側リード部は、
第１中央リード部に平行であり、基端部寄りの第１側重なり部と、
第１側重なり部に連なり、遊端部寄りで外側方に延びる第１外側延在部と、
第１外側延在部に連なり、第１中央リード部と平行に延びる第１挿入実装部とを有するベースフレームと、
（ｂ）ベース部上に搭載され、ベース部とは反対側に臨む受光面を有する受光用半導体チップと、
（ｃ）ベース部上に、受光用半導体チップよりも第１リード部寄りで、搭載され、受光用半導体チップのワイヤボンド接続されるとともに、第１側リード部の基端部にワイヤボンド接続され、受光用半導体チップからの出力信号を処理する処理用半導体チップと、
（ｄ）シールドフレームであって、
受光用半導体チップと処理用半導体チップとを覆い、受光面に対応する光透過孔が形成されるシールド部本体と、少なくとも受光用半導体チップの左右両側方と、第１リード部とは反対側とを、囲む外周部とを有するシールド部と、
シールド部と同一の金属板から成る第２リード部とを有し、
第２リード部は、
シールド部に連なる立上り部と、
立上り部に連なり、
第１中央リード部に全長にわたって重なる第２中央リード部と、
第２中央リード部の左右両側方に間隔をあけて配置される一対の第２側リード部とを有し、
各第２側リード部は、
第１側重なり部に重なり、基端部寄りの第２側重なり部と、
第２側重なり部に連なり、第１側延在部に重なり、遊端部寄りで外側方に延びる第２外側延在部と、
第２外側延在部に連なり、第１挿入実装部の長手方向途中まで重なり、第２側リード部と平行に延びる垂下部と、
垂下部に連なり、垂下部の厚み方向に相互に逆方向にほぼ直角に屈曲して延びる屈曲部と、
屈曲部に連なり、第２側リード部と平行に延び、第１および第２中央リード部の軸線に垂直な仮想平面内で、第１挿入実装部と相互にほぼ９０度の角度θをなしている第２挿入実装部とを有するシールドフレームと、
（ｅ）第１中央リード部と第２中央リード部とを固定し、第１側重なり部と第２側重なり部とを固定し、第１外側延在部と第２外側延在部の基端部寄りの部分とを固定するはんだと、
（ｆ）ベース部と第１中央リード部の基端部と受光用半導体チップと処理用半導体チップとシールド部と第２リード部の基端部とを封止し、少なくとも受光面直上は透光性である合成樹脂製パッケージとを含むことを特徴とする受光装置である。
【００３１】
本発明の受光装置に従えば、ホトダイオードなどの受光用半導体チップと、その受光用半導体チップからの光信号を電気信号に変換した出力を増幅および波形整形などして処理する処理用半導体チップとを、ベースフレームのベース部に搭載し、処理用半導体チップは受光用半導体チップよりも第１リード部寄り、すなわち第１リード部の基端部寄りに配置され、したがって処理用半導体チップは、シールド部によってシールドが容易に行われ、耐シールド性能を向上することができる。
【００３２】
さらにシールドフレームのシールド部本体には、受光用半導体チップの受光面に光を導く光透過孔が形成され、この受光用半導体チップを外周部が囲んでシールドするので、受光用半導体チップの耐シールド性能をも向上することができる。
【００３３】
本発明の実施の一形態では、このシールド部の外周部のベース部側の端面を、ベース部上に当接して配置することによって、強度の向上を図ることができ、製造が容易になり、合成樹脂製パッケージのたとえばトランスファモールドなどの成形時の品質を向上することができる。
【００３４】
この受光装置はまた、前述の請求項７と同様な作用が達成される。
【００３５】
また本発明は、ベース部と、ベース部と同一の金属板から成る第１リード部とを有するベースフレームの前記ベース部上に電子回路チップを搭載し、
ベース部上の電子回路チップを覆うシールド部と、シールド部と同一の金属板から成り、第１リード部に少なくとも部分的に重なる第２リード部とを有するシールドフレームを設け、
第１リード部と第２リード部とを一対の金型で相互の近接方向に圧接した状態で、ベースフレームと電子回路チップとシールド部とを、合成樹脂製パッケージによって封止し、
前記封止後、第１リード部と第２リード部とをはんだによって固定し、
はんだによる固定後、第１リード部と第２リード部との遊端部寄りの挿入実装部が、第１および第２リード部の軸線に垂直な仮想平面内で、相互に角度θをなすように、屈曲することを特徴とする電子回路素子の製造方法である。
【００３６】
本発明の電子回路素子の製造方法に従えば、電子回路チップを電子フレームのベース部上に搭載した後、シールドフレームをベースフレームに重ね、その後、たとえばトランスファモールドの一対の金型で第１および第２リード部を相互の近接方向に圧接した状態で、合成樹脂製パッケージによって封止し、この封止後、第１リード部と第２リード部とをはんだによって固定し、はんだがパッケージ内方に入り込むのを抑制し、このはんだ付け後、第１および第２リード部の挿入実装部の屈曲作業を行うようにしたので、この屈曲時に、第１および第２リード部が相互に位置ずれを生じるおそれはない。
【００３７】
【発明の実施の形態】
図１は、本発明の実施の一形態の分解斜視図である。電子回路素子である遠隔制御の受光装置１６は基本的には、１枚の金属板によって製造されるベースフレーム１７と、もう１枚の金属板によって製造されるシールドフレーム１８と、合成樹脂製パッケージ１９とを含み、印刷配線基板（以下、単に配線基板と略称する場合がある）２０に立てて置かれて、挿入実装される。
【００３８】
図２は受光装置１６の正面図であり、図３はその受光装置１６の側面図である。ベースフレーム１７の上にシールドフレーム１８が重ねられ、パッケージ１９によって部分的に覆われる。シールドフレーム１８には、後述の第２中央リード部５２と、後述の第２側リード部５３ａ，５３ｂとを有する。
【００３９】
図４はベースフレーム１７の製造途中における平面図であり、図５は図４の切断面線Ｖ−Ｖから見た断面図である。ベースフレーム１７は、基本的にはベース部２１と、このベース部２１と同一の金属板から成り、ベース部２１とともに一平面内に形成される第１リード部２２とを有する。第１リード部２２は、完成後の状態が図１および図２に示されるように、ベース部２１に連なる第１中央リード部２４と、この第１中央リード部２４の図２における左右両側方に間隔をあけて配置される一対の第１側リード部２５ａ，２５ｂとを有する。以下の説明では、各参照符における添え字ａ，ｂを省略して総括的に数字だけで表す場合がある。
【００４０】
各第１側リード部２５は、第１中央リード部２４に平行であり、基端部２６寄りの第１側重なり部２７と、第１側重なり部２７に連なり、遊端部２８寄り（図４の下方）で外側方に延びる第１外側延在部２９と、第１外側延在部２９に連なり、第１中央リード部２４と平行に延びる第１挿入実装部３０とを有する。第１中央リード部２４と第１外側延在部２９とは、タイバー３１によって、第１リード部２２の長手方向、すなわち図４の上下方向である軸線方向に垂直に、すなわち幅方向に延びて一体的に連結されて形成されている。第１リード部２２の遊端部２８は、ガイドバー３２によって幅方向に連なって一体的な形成される。
【００４１】
タイバー３１には、第１中央リード部２４の軸線に平行に、基端部２６側（図４の上方）に平行に両外方で延びる補強部３３が、第１側リード部２７との間でそれぞれ形成される。
【００４２】
ベース部２１上には、受光用半導体チップはホトダイオード３４が電気絶縁性接着剤３５によって固定されて搭載される。このホトダイオード３４の受光面３６は、ベース部２１とは反対側（図５の左方）に臨む。
【００４３】
ベース部２１上にはまた、ホトダイオード３４よりも第１リード部２２寄り（すなわち図４および図５の下方）で、処理用半導体チップ３７が、銀ペーストなどの導電性接着剤３８によって固定されて搭載される。ホトダイオード３４と処理用半導体チップ３７とは、金などの導線から成るワイヤボンド３９によって電気的に接続される。また同様に導線４０によって第１重なり部２２の第２リード部１８とは部分的に重ならない基端部２６寄りの端部に、ワイヤボンド接続される。
【００４４】
処理用半導体チップ３７は、ホトダイオード３４からの光信号が変換された電気信号を受信し、その電気信号を高利得で増幅し、波形整形して導出する機能を達成し、増幅回路を含む。さらにこの処理用半導体チップ３７は、フィルタ回路および検波回路などを含んでいる。こうして得られた処理用半導体チップ３７からのデジタル出力信号は、第１中央リード部２４および各第１側リード部３０間から、導出される。
【００４５】
図６はシールドフレーム１８の平面図であり、図７はそのシールドフレーム１８の切断面線ＶＩＩ−ＶＩＩから見た断面図である。さらに図８は、図６の切断面線ＶＩＩＩ−ＶＩＩＩから見た断面図である。製造時におけるシールドフレーム１８は基本的には、シールド部４３と、このシールド部４３と同一の金属板から成る第２リード部４４とを有する。シールド部４３は、シールド本体４５と、外周部４６とを有する。外周部４６は、少なくともホトダイオード３４の図４および図６の左右両側方を囲む側部４７と、第１および第２リード部２２，４４とは反対側である基端部側（図６および図７の上方）を囲む端部４８とを有する。こうして形成される収納空間４９内には、ホトダイオード３４と処理用半導体チップ３７が収納されて覆われる。シールド部本体４５には、ホトダイオード３４の受光面３６に対応して光透過孔５０が形成される。
【００４６】
第２リード部４４は、シールド部４３のシールド部本体４５に連なる立上り部５１と、この立上り部５１に連なり、前述のベースフレーム１７における第１中央リード部２４に全長にわたって重なる第２中央リード部５２と、第２中央リード部５２の図６における左右両側方に間隔をあけて配置される一対の第２側リード部５３とを有する。
【００４７】
第２側リード部５３は、前述の第１側重なり部２７に重なり、基端部５４寄りの第２側重なり部５５と、第２側重なり部５５に連なり、第１側延在部２９に重なり、遊端部５６寄りで外側方に延びる第２外側延在部５７ａ，５７ｂと、第２外側延在部５７に連なり、第１挿入実装部３０の長手方向（図４〜図７の上下方向）の途中まで重なり、第２中央リード部５２および第２側リード部５５と平行に延びる垂下部５８と、垂下部５８に連なる屈曲部５９と、屈曲部５９に連なり、第２中央リード部５２および第２側リード部５５と平行に延びる第２挿入実装部６０とを有する。
【００４８】
タイバー６１は、第２外側延在部５７を含み、第２側重なり部５５と垂下部５８とに一体的に連なる。ガイドバー６２は、第２中央リード部５２と第２挿入実装部６０との遊端部５６を一体的に連ねる。
【００４９】
ベースフレーム１７とシールドフレーム１８とは、金属製であって、たとえば鉄から成り、または鉄とニッケルとの合金などから成り、Ａｕめっきが施されていてもよい。パッケージ１９に覆われる部分では、このようなめっきが施されていなくてもよい。ベースフレーム１７の厚みは、たとえば０．２ｍｍであり、ホトダイオード３４および処理用半導体チップ３７を安定して支持することができる強度を有する。シールドフレーム１８の厚みは、０．１０〜０．１５ｍｍであり、シールド部４３によるシールドの目的を達成するためおよび第１リード部２２の補強を行うために、ベースフレーム１７よりも薄くてよい。
【００５０】
図４および図５に明らかに示されるように、パッケージ１９によって覆われる第１リード部２２の基端部２６寄りで、第１中央リード部２４と、第１側重なり部２７と補強部３３とには、第２リード部４４に対向する表面に、図４の左右方向である全幅にわたって凹溝６３が形成される。凹溝６３の断面形状は、Ｕ字状であってもよく、Ｖ字状であってもよい。同様にして図７に明らかに示されるように、パッケージ１９で覆われる第２リード部４４の基端部５４付近には、第２中央リード部５２と第２重なり部５５と補強部６４には、全幅にわたって延びる凹溝６５が、第１リード部２２に対向する表面に形成される。凹溝６５は、前述の凹溝６３と同様な断面形状で形成される。
【００５１】
補強部６４は、第２中央リード部５２と第２側重なり部５５との間でタイバー６１から基端部５４に向けて延び、前述の立上り部５１と、同様な立上り部を介して、シールド部本体４５に連なる。
【００５２】
パッケージ１９は、透明な熱硬化性エポキシ樹脂に、粉末染料を拡散して混合した材料が用いられる。この染料は、赤外光を透過し、かつ可視光を遮断する光学的特性を有する。
【００５３】
ベース部２１には、ホトダイオード３４と処理用半導体チップ３７との間に、透孔６６が幅方向（図４の左右方向）に延びて形成される。この透孔６６を形成することによって、電気絶縁性接着剤３５が処理用半導体チップ３７側にはみ出して移動することはなく、また導電性接着剤３８がホトダイオード３４側にはみ出して移動することがない。これによってホトダイオード３４と処理用半導体チップ３７とが、ベース部２１上に、高品質で固定されることができる。
【００５４】
本発明の実施の一形態である受光装置１６の製造手順を述べる。図４および図５に示されるように、ベースフレーム１７のベース部２１にホトダイオード３４と処理用半導体チップ３７とを搭載し、ワイヤ３９，４０などによってワイヤボンド接続を行う。また図６および図７に示されるシールドフレーム１８を準備する。
【００５５】
その後、ベースフレーム１７上に、シールド部４３を重ねて、シールド部４３によってホトダイオード３４と処理用半導体チップ３７とを覆う。この状態でシールド部４３の側部４７と端部４８とを含む外周部４６の端面６７は、ベース部２１のホトダイオード３４および処理用半導体チップ３７が搭載された表面の外周部付近に当接して支持され、これとともに第１リード部２２と第２リード部４４とが当接して重なる。
【００５６】
このようにしてベースフレーム１７とシールドフレーム１８とを重ねた状態の平面は、図９に示され、その側面は図１０に示される。
【００５７】
凹溝６３，６５は、第１および第２リード部２２，４４の軸線方向（図４〜図７の上下方向）の同一位置に、図示のように形成されてもよいけれども、その軸線方向にずれて形成されてもよく、これらの凹溝６３，６５が重なっていなくてもよい。このようにして外周部４６の端面６７がベース部２１の表面に当接することによって、シールド部４３とホトダイオード３４および処理用半導体チップ３７と厚み方向（図５、図７および図１０の左右方向）の隙間が安定して設定される。したがってワイヤボンドおよび導線３９，４０がシールド部４３の空間４９側の内面に接触するおそれはない。
【００５８】
次に、図１０に仮想線で示されるように、トランスファモールド方式で、金型６８，６９を用いて第１および第２リード部２２，４４を相互の近接方向に圧接した状態で、前述の熱硬化性エポキシ樹脂と染料との混合材料を注入して成形し、こうしてパッケージ１９で、ベースフレーム１７とシールドフレーム１８の各一部、さらにホトダイオード３４および処理用半導体チップ３７などを封止する。金型６８，６９の挟み込み圧力によって、第１および第２リード部２２，４４の基端部２６，５４付近が密着された状態に保たれて、成形が行われる。パッケージ１９には、受光面３６に対応して凸レンズ部７０が形成され、集光効率を向上することができる。
【００５９】
パッケージ１９の形成後、図１１の斜線を施して示すようにタイバー３１，６１を、第１および第２リード部２２，４４の軸線方向に平行に切断除去する。図１２は、図１１のタイバー６１およびガイドバー６２の切断前におけるパッケージ１９完成後の側面図である。またガイドバー３２，６２を、図１の斜線を施して示すように切断して除去する。タイバー３１，６１の切断と同時に、補強部３３，６４を、図１１の斜線を施して示すように、切断をする。こうしてベース部２１およびシールド部４３は、第１および第２中央リード部２４，５２と電気的に接続された状態となり、これらの第１および第２中央リード部２４，５２は、接地電位とされる。
【００６０】
その後、パッケージ１９から露出している第１および第２リード部２２，４４の全体を、溶融はんだに浸漬してはんだディップ工程を行う。こうして第１および第２リード部２２，４４の重なり部分が電気的および機械的に接合され、また強度が向上される。溶融はんだがパッケージ１９内ではい上がることは、前述の凹溝６３，６５によって防止することができる。
【００６１】
はんだ付け後、第２リード部４４の垂下部５８ａの折曲げ線７２で屈曲部５９ａを角度θをなして屈曲加工する。また垂下部５８ｂの折曲げ線７３で屈曲部５９ｂを角度θをなして屈曲加工する。本発明の実施の一形態では、θ＝９０度である。折曲げ線７２，７３は、第１および第２中央リード部２４，５２から遠ざかった垂下部５８ａ，５８ｂの側部の延長線上にある。
【００６２】
垂下部５３は、第１挿入実装部３０の長手方向（図４〜図７の上下方向）の途中まで重なっている。屈曲部５９ａ，５９ｂは、垂下部５８ａ，５８ｂの厚み方向（図２および図６の紙面に垂直方向、図３の左右方向）に相互に逆方向であり、一方の屈曲部５９ａは、図２では手前に突出し、また他方の屈曲部５９ｂは、背後に屈曲している。こうして第２挿入実装部６０は、第１および第２側リード部５５、したがって第１および第２中央リード部２４，５２と平行に延び、しかも第１および第２中央リード部２４，５２の軸線に垂直な（すなわち図２および図３の紙面に垂直な水平面である）仮想平面内で、第１挿入実装部３０と相互に前述の角度θをなしている。これによって第１および第２リード部２２，４４の自立性が確保される。
【００６３】
図１および図２に示されるように、配線基板２０に設けられる取付け孔１２０，１２１には第１挿入実装部３０ａ，３０ｂがそれぞれ挿通され、取付け孔１２２，１２３には第２挿入実装部６０ａ，６０ｂがそれぞれ挿通され、取付け孔１２４には第１および第２中央リード部２４，５２が重なった状態で挿通される。この状態で第１挿入実装部３０、第２挿入実装部６０、第１および第２中央リード部２４，５２は、配線基板２０のランド１３０，１３１，１３２，１３３，１３４にはんだ付けされる。また屈曲部５９ａ，５９ｂの下端面１４０ａ，１４０ｂは、配線基板２０の上面に当接して、受光装置１６が位置決めされる。
【００６４】
図１３は、本発明の実施の他の形態の側面図である。この実施の形態では、ベースフレーム１７の背後にさらに半導体チップなどの電子回路チップ７５を固定し、もう１つのシールドフレーム７６を、シールドフレーム１８とは反対側で、ベースフレーム１７に重ねる。シールドフレーム７６は、前述のシールドフレーム１８と同様な構成を有する。本発明の実施の他の形態では、１または複数のベースフレーム１７と、１または複数のシールドフレーム１８，７６とが、さらに多数、重ねられて構成されてもよい。
【００６５】
本発明は、遠隔制御の受光装置のために関連して実施されるだけでなく、その他の電子回路素子に関連して、広範囲に実施することができる。本発明で、ホトダイオード３４と処理用半導体チップ３７とが個別的にベース部２１に取付けられる構造だけでなく、それらの構成要素３４，３７がたとえば単一の半導体チップに構成された場合などにおいても、本発明を実施することができる。
【００６６】
【発明の効果】
本発明によれば、ベースフレームとシールドフレームとを重ねて構成されるので、ベースフレームのベース部上の電子回路チップに近接してシールドフレームのシールド部を配置することができ、これによって厚みを小さくして電磁シールドを確実に行いながら、小形化を達成することが容易に可能であるとともに、製造が容易である。
【００６７】
また本発明によれば、第１および第２リード部の基端部寄りの重なり部を重ねてはんだ付けするので、強度を大きくして自立性を確保し、配線基板に挿入実装して立てて置くことができる。
【００６８】
さらに本発明によれば、このような第１および第２リード部の強度を確保しつつ、これらの第１および第２リード部を薄くすることができるので、隣接するリード部の間隔を小さくし、高密度化が可能である。このことによってもまた、小形化が可能になる。
【００６９】
第１および第２リード部の挿入実装部は、相互に角度θをなしているので、本件電子回路素子を配線基板に立てて実装し、その姿勢を正確に保つことが、大きな強度で可能になる。
本発明によれば、電子回路チップを、シールド部本体だけでなく外周部によって覆うようにしたので、耐シールド性能を向上することができる。
【００７０】
本発明によれば、電子回路チップが搭載されるベースフレームは、シールドフレームよりも厚くし、これによって正確な組立作業を行うことができ、これに対してシールドフレームは、ベースフレームよりも薄くして、電子回路チップのシールド機能を充分に達成するとともに、第１リード部の補強を、第２リード部によって行うことができる。
【００７１】
本発明によれば、パッケージ内方で第１および第２リード部には凹溝を相互の対向する面に形成し、たとえばはんだディップ時に、溶融はんだが第１および第２リード部の微小な隙間を通ってパッケージ内方に大きく侵入することを抑制することができ、品質の向上を図ることができるようになる。
【００７３】
本発明によれば、ベースフレームの第１外側延在部から第２挿入実装部が連なるので、第１中央リード部と第１挿入実装部との間隔を大きくし、こうして高密度化を図りながら、配線基板への挿入実装形の電子回路素子を容易に実現することができる。同様にしてシールドフレームは第２外側延在部から垂下部を経て屈曲部から第２挿入実装部に連なるので、第２中央リード部と、垂下部および第２挿入実装部との間隔を大きくし、配線基板への挿入実装を、高密度化を図りながら、容易に可能にすることができる。
【００７４】
本発明によれば、前述の請求項１，６と同様な効果が達成されるとともに、赤外光などの光は、シールド部本体の光透過孔を経て受光面に受光され、このシールド部本体には外周部が連なるので、処理用半導体チップだけでなく、受光用半導体チップの電磁シールドが確実に行われるようになる。
【００７５】
本発明によれば、たとえばトランスファモールドなどによって一対の金型で第１および第２リード部を圧接した状態で合成樹脂製パッケージによって封止し、その後はんだ付けして第１および第２リード部を固定し、その後、挿入実装部を屈曲加工するようにしたので、第１および第２リード部が正確に重ねられた状態で屈曲加工が可能になり、正確に製造することができるようになる。
【図面の簡単な説明】
【図１】本発明の実施の一形態の分解斜視図である。
【図２】受光装置１６の正面図である。
【図３】受光装置１６の側面図である。
【図４】ベースフレーム１７の製造途中における平面図である。
【図５】図４の切断面線Ｖ−Ｖから見た断面図である。
【図６】シールドフレーム１８の平面図である。
【図７】シールドフレーム１８の切断面線ＶＩＩ−ＶＩＩから見た断面図である。
【図８】図６の切断面線ＶＩＩＩ−ＶＩＩＩから見た断面図である。
【図９】ベースフレーム１７とシールドフレーム１８とを重ねた状態の平面図である。
【図１０】ベースフレーム１７とシールドフレーム１８とを重ねた状態の側面図である。
【図１１】パッケージ１９の形成後、切断した図である。
【図１２】図１１のタイバー６１およびガイドバー６２の切断前におけるパッケージ１９完成後の側面図である。
【図１３】本発明の実施の他の形態の側面図である。
【図１４】他の先行技術の平面図である。
【図１５】他の先行技術の断面図である。
【符号の説明】
１６遠隔制御の受光装置
１７ベースフレーム
１８，７６シールドフレーム
１９合成樹脂製パッケージ
２０印刷配線基板
２１ベース部
２２第１リード部
２４第１中央リード部
２５第１側リード部
２６，５４基端部
２７第１側重なり部
２８，５６遊端部
２９第１外側延在部
３０第１挿入実装部
３１，６１タイバー
３２，６２ガイドバー
３３，６４補強部
３４ホトダイオード
３５電気絶縁性接着剤
３６受光面
３７処理用半導体チップ
３８導電性接着剤
３９ワイヤボンド
４０導線
４３シールド部
４４第２リード部
４５シールド本体
４６外周部
４９収納空間
５０光透過孔
５１立上り部
５２第２中央リード部
５３第２側リード部
５５第２側重なり部
５７第２外側延在部
５８垂下部
５９屈曲部
６０第２挿入実装部
６３凹溝
６５凹溝
６６透孔
６７端面
６８，６９金型
７０凸レンズ部
７２，７３折曲げ線
７５電子回路チップ[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic circuit element, a light receiving device, and a method of manufacturing an electronic circuit element, and more particularly to a light receiving device for remote control and an infrared light spatial transmission element that are advantageously implemented in office automation equipment such as home appliances and personal computers. And so on.
[0002]
[Prior art]
In the prior art, a remote-controlled light receiving device has a configuration in which a single semiconductor integrated circuit chip performs processing such as receiving infrared light and amplifying and shaping a waveform. The infrared digital signal transmitted from the infrared transmitter enters the light receiving surface of the photodiode portion of the semiconductor chip, is converted from an optical signal to an electric signal, and the weak electric signal obtained in this way is converted into the semiconductor chip. The signal is amplified by, for example, tens of thousands of times, processed by a filter circuit and a detection circuit for waveform shaping, and a digital output signal similar to the transmitted signal is obtained.
[0003]
For example, in a remote-controlled light-receiving device that requires a transmission-reception distance of 10 m or more, the signal amplification factor is very large as described above. Therefore, it becomes susceptible to the adverse effects of electromagnetic noise. Therefore, it is necessary to shield the semiconductor chip.
[0004]
In the above-mentioned prior art, since a single semiconductor chip is used, shielding is difficult, and is adversely affected by electromagnetic noise. Therefore, as compared with a configuration in which a plurality of individual electronic components are mounted and shielded by a metal case, the result is inferior in characteristics.
[0005]
FIG. 14 is a plan view of another prior art which solves the above-mentioned problem, and FIG. 15 is a cross-sectional view thereof. A photodiode chip 3 and another semiconductor chip 4 for amplifying and waveform-shaping an electric signal from the photodiode chip 3 are mounted on the pad portion 2 of the metal lead frame 1. In the pad portion 2, a shield portion 6 extends so as to cover the semiconductor chip 4 via a bent portion 5, and further, left and right side walls 7 are formed. A light transmitting hole 8 for guiding light to the light receiving surface of the photodiode 3 is formed in the shield portion 6. The package 10 is sealed with a synthetic resin package 9, and the lead 10 is exposed from the package 9. A chip resistor 11 and a chip capacitor 12 are mounted on the pad section 2 and are electrically connected to the semiconductor chip 4. Further, lead portions 13 and 14 are provided.
[0006]
The semiconductor chip 4 and the like are electrically connected by wire bonding 15 and 16.
[0007]
In the prior art shown in FIGS. 14 and 15, although the semiconductor chip 4 can be covered with the shield portion 6 and the noise resistance can be improved, a new problem occurs. The joint 5 of the lead frame 1 must be bent 90 degrees at two points as shown by reference numerals 117 and 118. Therefore, manufacturing is difficult, and the distance d1 between the pad portion 2 and the shield portion 6 must be relatively large, so that the thickness of the package 9 (the thickness in the left-right direction in FIG. 15) cannot be reduced. , The configuration becomes large. In addition, it is necessary to prevent the wire bonding portions 15 and 16 from being damaged during the bending process, which is difficult to manufacture.
[0008]
Further, in the prior art of FIGS. 14 and 15, the lead portions 10, 13, and 14 are linear, and when the lead portions 10, 13, and 14 are configured to stand upright on a wiring board, the lead portions 10, 13, and 14 are made independent. It is necessary to make the thickness of 13, 14 0.4 mm or more. In this case, there is a limit to high-density mounting and downsizing. If the thickness of the lead components 10, 13, 14 is reduced to enable high-density mounting and miniaturization, the strength of the lead portions 10, 13, 14 is reduced, and the independence on the wiring board is lost. . In such a structure without independence, it is necessary to separately provide a holder or the like for holding the package 9 on the wiring board.
[0009]
[Problems to be solved by the invention]
SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic circuit element that has improved anti-noise performance, has a small configuration, can be mounted at high density, and can be inserted and mounted on a wiring board to ensure autonomy. To provide.
[0010]
[Means for Solving the Problems]
The present invention provides a base frame having a base portion and a first lead portion made of the same metal plate as the base portion;
An electronic circuit chip mounted on the base portion and electrically connected to the first lead portion;
A shield frame having a shield portion covering the electronic circuit chip on the base portion, and a second lead portion made of the same metal plate as the shield portion,
The first and second lead portions are
An overlapping portion overlapping each other near the base end,
Having an insertion mounting portion connected to the overlapping portion and shifted near the free end portion,
The insertion mounting portions are at an angle θ to each other in an imaginary plane perpendicular to the axis of the first and second lead portions.
Solder for fixing the overlapping portion of the first lead portion and the second lead portion;
An electronic circuit element including a synthetic resin package for sealing a base frame, an electronic circuit chip, and a shield part.
[0011]
According to the present invention, the electronic circuit chip is mounted on the base frame mounted on the base portion, the shield frame is overlapped, and the electronic circuit chip is covered by the shield portion. It is possible to easily bring the shield part close to the shield part, it is easy to manufacture, and it is possible to reduce the size. There is no contact with the bond, the quality is stabilized and the production is very easy.
[0012]
Furthermore, according to the present invention, the first lead portion of the base frame and the second lead portion of the shield frame are configured to overlap at an overlapping portion near the base end portion, and are fixed by solder. Can be increased in strength. Therefore, the independence can be ensured by inserting the lead into the wiring board.
[0013]
Furthermore, since the first and second lead portions are partially overlapped and fixed as described above, the thickness of the first and second lead portions can be reduced. This enables high-density mounting and further downsizing.
[0014]
Generally speaking, it is difficult to increase the density by setting the interval between a plurality of adjacent lead portions to be smaller than the thickness of the metal plate constituting the lead portions. According to the present invention, the first lead portion and the second lead portion are thinned, and the first and second lead portions are overlapped and fixed with solder, so that the strength can be improved and the adjacent lead can be improved. The distance between the parts is reduced, and the density can be increased as described above.
According to the present invention, the portions near the base ends of the first and second lead portions, that is, the portions near the base portion and the shield portion overlap with each other and are fixed with the solder as described above to form an overlap portion. The portions near the free ends of the first and second lead portions form insertion mounting portions which are inserted through the mounting holes of the wiring board and soldered to the lands of the wiring board.
In particular, according to the present invention, the lead portion is constituted by a first and a second lead portion, and the insertion mounting portion is formed by an axis (longitudinal direction of FIG. In the virtual plane perpendicular to ()), the electronic circuit element can be placed upright on the wiring board in a desired and accurate posture while forming an angle θ of, for example, 90 degrees with each other.
[0015]
Also, in the present invention, the shield portion
A shield body that covers above the electronic circuit chip;
And an outer peripheral portion connected to the shield portion main body and covering the outer periphery of the electronic circuit chip.
[0016]
According to the present invention, the shield part of the shield frame has a shield part main body that covers the upper part at a distance from the base part and the electronic circuit chip, and an outer peripheral part that covers the outer periphery of the electronic circuit chip. Performance can be improved. This is particularly important for an electronic circuit chip, for example, a semiconductor integrated circuit chip in which the amplification factor of an electric signal is large, to improve the noise resistance.
[0017]
Further, the present invention is characterized in that the thickness of the base frame is selected to a value exceeding the thickness of the shield frame.
[0018]
According to the present invention, the thickness of the base frame is, for example, 0.2 mm, and the thickness of the shield frame is, for example, 0.10 to 0.15 mm. The shield portion of the shield frame may have a function of covering the electronic circuit chip to achieve an electromagnetic shield, and thus the thickness of the metal plate of the shield frame can be reduced. Also, it functions to reinforce the second lead portion of such a thin shield frame.
[0019]
The base frame is thicker than the shield frame and has sufficient strength to mount the electronic circuit chip.
[0020]
Further, according to the present invention, the package partially seals the first and second lead portions,
A groove is formed on the mutually facing surfaces of the first and second leads sealed by the package over the entire width of the first and second leads.
[0021]
According to the present invention, a concave groove extending over the entire width of the first lead portion is formed, and a concave groove extending over the entire width of the second lead portion is formed. These concave grooves are formed between the first and second lead portions. Since it is formed on the opposing surface and sealed with a synthetic resin package, when the portions of the first and second lead portions exposed from the package are immersed, for example, in a solder dip, the surface tension of the molten solder is reduced. Accordingly, the molten solder that has entered the package from the first and second lead portions is stopped at the concave groove, and is prevented from intruding further inward. This can prevent a failure or the like due to the adverse effect of the molten solder.
[0022]
The concave groove may be formed at the same position in the longitudinal direction of the first and second lead portions, that is, at the same position in the axial direction, but may be shifted from each other in the axial direction.
[0026]
The present invention also provides (a) a base frame,
A base part,
A first lead portion formed of the same metal plate as the base portion and formed in one plane with the base portion;
The first lead part is
A first central lead portion connected to the base portion;
A pair of first side leads arranged at intervals on both left and right sides of the first central lead,
Each first side lead portion is
A first side overlapping portion parallel to the first central lead portion and near the base end;
A first outer extending portion connected to the first side overlapping portion and extending outward near the free end;
A base frame having a first insertion mounting portion connected to the first outer extension portion and extending in parallel with the first central lead portion;
(B) an electronic circuit chip mounted on the base portion and electrically connected to the first central lead portion and the first side overlapping portion;
(C) a shield frame,
A shield part covering the electronic circuit chip on the base part,
A second lead portion made of the same metal plate as the shield portion,
The second lead portion includes a rising portion connected to the shield portion,
A second central lead portion connected to the rising portion and overlapping the first central lead portion over the entire length;
A pair of second side leads arranged at intervals on both left and right sides of the second central lead,
Each second side lead part is
A second side overlapping portion overlapping the first side overlapping portion and near the base end;
A second outer extension that is continuous with the second side overlap, overlaps the first side extension, and extends outward near the free end;
A hanging part that extends to the second outer extension part, overlaps partway in the longitudinal direction of the first insertion mounting part, and extends in parallel with the second side lead part;
A bent portion that is connected to the hanging portion and extends by bending at a substantially right angle in a direction opposite to each other in the thickness direction of the hanging portion;
In a virtual plane perpendicular to the axis of the first and second central lead portions, extending at an angle θ of approximately 90 ° with the first insertion mounting portion in a continuation of the bent portion and extending in parallel with the second side lead portion. A shield frame having a second insertion mounting portion,
(D) fixing the first central lead portion and the second central lead portion, fixing the first side overlapping portion and the second side overlapping portion, and forming a first outer extending portion and a second outer extending portion. Solder to fix the part near the end,
(E) An electronic circuit comprising: a base portion, a base end portion of the first central lead portion, an electronic circuit chip, a shield portion, and a synthetic resin package for sealing the base end portion of the second lead portion. Element.
[0027]
According to the present invention, the base frame and the shield frame can be made thinner than the prior art described in connection with FIGS. 14 and 15, and therefore, the first central lead portion of the base frame and the pair of left and right first frames. It is possible to increase the density by reducing the distance between the side lead portions, and similarly, it is possible to increase the density by reducing the distance between the second central lead portion and the second side lead portion of the shield frame.
[0028]
Further, the first side lead portion has a first outer extension portion extending outwardly to form a first insertion mounting portion, thereby increasing a distance between the first central lead portion and the first insertion mounting portion, It is easy to insert and mount on a wiring board. The same is true for the shield frame, that is, the second side lead portion has a hanging portion from the second outer extending portion, and the bent portion continues on the side portion of the hanging portion remote from the second central lead portion. Therefore, it is possible to increase the distance between the second central lead portion and the bent portion, and to facilitate mounting on the wiring board.
[0029]
Further, according to the present invention, the pair of second side lead portions are left and right with respect to the second central lead portion, and the bent portions are opposite to each other in the thickness direction of the second central lead portion and the hanging portion (see FIG. Therefore, the first and second lead portions allow the electronic circuit element of the present invention to be accurately erected on a wiring board in a desired posture, and an accurate mounting posture can be obtained.
[0030]
The present invention also provides (a) a base frame,
A base part,
A first lead portion made of the same metal as the base portion and formed in one plane with the base portion;
The first lead part is
A first central lead portion connected to the base portion;
A pair of first side leads arranged at intervals on both left and right sides of the first central lead,
Each first side lead portion is
A first side overlapping portion parallel to the first central lead portion and near the base end;
A first outer extending portion connected to the first side overlapping portion and extending outward near the free end;
A base frame having a first insertion mounting portion connected to the first outer extension portion and extending in parallel with the first central lead portion;
(B) a light-receiving semiconductor chip mounted on the base portion and having a light-receiving surface facing the opposite side to the base portion;
(C) mounted on the base portion closer to the first lead portion than the light-receiving semiconductor chip, and wire-bonded to the light-receiving semiconductor chip and wire-bonded to the base end of the first-side lead portion; A processing semiconductor chip for processing an output signal from the light receiving semiconductor chip;
(D) a shield frame,
A shield body covering the light receiving semiconductor chip and the processing semiconductor chip and having a light transmitting hole corresponding to the light receiving surface, at least the left and right sides of the light receiving semiconductor chip, and the side opposite to the first lead portion; A shield portion having an outer peripheral portion surrounding the
A second lead portion made of the same metal plate as the shield portion,
The second lead part is
A rising part connected to the shield part,
Connect to the rising part,
A second central lead overlapping the first central lead over its entire length;
A pair of second side leads arranged at intervals on both left and right sides of the second central lead,
Each second side lead part is
A second side overlapping portion overlapping the first side overlapping portion and near the base end;
A second outer extension that is continuous with the second side overlap, overlaps the first side extension, and extends outward near the free end;
A hanging part that extends to the second outer extension part, overlaps partway in the longitudinal direction of the first insertion mounting part, and extends in parallel with the second side lead part;
A bent portion that is connected to the hanging portion and extends by bending at a substantially right angle in a direction opposite to each other in the thickness direction of the hanging portion;
In a virtual plane perpendicular to the axis of the first and second central lead portions, extending at an angle θ of approximately 90 ° with the first insertion mounting portion in a continuation of the bent portion and extending in parallel with the second side lead portion. A shield frame having a second insertion mounting portion,
(E) fixing the first central lead portion and the second central lead portion, fixing the first side overlapping portion and the second side overlapping portion, and forming a first outer extending portion and a second outer extending portion. Solder to fix the part near the end,
(F) sealing the base portion, the base end portion of the first central lead portion, the light receiving semiconductor chip, the processing semiconductor chip, the shield portion, and the base end portion of the second lead portion; A light-receiving device comprising: a synthetic resin package having an insulating property.
[0031]
According to the light-receiving device of the present invention, a light-receiving semiconductor chip such as a photodiode and a processing semiconductor chip that performs processing such as amplification and waveform shaping of an output obtained by converting an optical signal from the light-receiving semiconductor chip into an electric signal are processed. Mounted on the base portion of the base frame, the processing semiconductor chip is disposed closer to the first lead portion than the light receiving semiconductor chip, that is, closer to the base end portion of the first lead portion. As a result, the shield can be easily performed, and the shield resistance can be improved.
[0032]
Further, a light transmitting hole for guiding light to the light receiving surface of the light receiving semiconductor chip is formed in the shield portion main body of the shield frame, and the light receiving semiconductor chip is surrounded and shielded by an outer peripheral portion. Performance can also be improved.
[0033]
In one embodiment of the present invention, by arranging the end face of the outer peripheral portion of the shield portion on the base portion side in contact with the base portion, strength can be improved, and manufacturing is facilitated. It is possible to improve the quality of the synthetic resin package at the time of molding such as a transfer mold.
[0034]
This light receiving device also achieves the same effect as the above-mentioned claim 7.
[0035]
Further, according to the present invention, an electronic circuit chip is mounted on the base portion of a base frame having a base portion and a first lead portion made of the same metal plate as the base portion,
A shield frame that covers the electronic circuit chip on the base portion and a second lead portion that is made of the same metal plate as the shield portion and that at least partially overlaps the first lead portion is provided.
The base frame, the electronic circuit chip, and the shield are sealed with a synthetic resin package in a state where the first lead and the second lead are pressed against each other by a pair of molds in a direction of approaching each other.
After the sealing, the first lead portion and the second lead portion are fixed with solder,
After fixing with solder, the insertion mounting portion near the free end of the first lead portion and the second lead portion forms an angle θ with each other in an imaginary plane perpendicular to the axis of the first and second lead portions. And a method of manufacturing an electronic circuit element characterized by bending.
[0036]
According to the method for manufacturing an electronic circuit element of the present invention, after mounting the electronic circuit chip on the base portion of the electronic frame, the shield frame is overlaid on the base frame, and then, for example, the first and the second are formed by a pair of transfer molds. In a state where the second lead portions are pressed against each other in a direction close to each other, the package is sealed with a synthetic resin package. After this sealing, the first lead portion and the second lead portion are fixed with solder, and the solder is After the soldering, the insertion and mounting portions of the first and second lead portions are bent, so that the first and second lead portions are displaced from each other during the bending. There is no danger.
[0037]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is an exploded perspective view of one embodiment of the present invention. The remote control light receiving device 16 which is an electronic circuit element is basically composed of a base frame 17 made of one metal plate, a shield frame 18 made of another metal plate, and a synthetic resin package. 19, and is placed upright on a printed wiring board (hereinafter, sometimes simply referred to as a wiring board) 20 and inserted and mounted.
[0038]
FIG. 2 is a front view of the light receiving device 16, and FIG. 3 is a side view of the light receiving device 16. A shield frame 18 is overlaid on the base frame 17 and partially covered by the package 19. The shield frame 18 has a later-described second central lead portion 52 and later-described second side lead portions 53a and 53b.
[0039]
FIG. 4 is a plan view of the base frame 17 in the process of being manufactured, and FIG. 5 is a cross-sectional view taken along line VV of FIG. The base frame 17 basically has a base portion 21 and a first lead portion 22 formed of the same metal plate as the base portion 21 and formed in one plane together with the base portion 21. As shown in FIGS. 1 and 2 after completion, the first lead portion 22 has a first central lead portion 24 connected to the base portion 21 and the left and right sides of the first central lead portion 24 in FIG. And a pair of first side lead portions 25a and 25b arranged at an interval. In the following description, the suffixes a and b in each reference symbol may be omitted, and may be represented by only numbers.
[0040]
Each first side lead portion 25 is parallel to the first central lead portion 24, is connected to a first side overlap portion 27 near the base end portion 26, is continuous with the first side overlap portion 27, and is close to the free end portion 28 (FIG. 4), a first outer extension 29 extending outwardly (below 4), and a first insertion mount 30 connected to the first outer extension 29 and extending in parallel with the first central lead 24. The first central lead portion 24 and the first outer extending portion 29 are extended by the tie bar 31 perpendicularly to the longitudinal direction of the first lead portion 22, ie, the axial direction which is the vertical direction in FIG. They are integrally connected. The free end portion 28 of the first lead portion 22 is formed integrally with the guide bar 32 in a continuous manner in the width direction.
[0041]
The tie bar 31 has a reinforcing portion 33 extending outwardly in parallel with the axis of the first central lead portion 24 and in parallel with the base end portion 26 side (upward in FIG. 4) between the tie bar 31 and the first side lead portion 27. Respectively.
[0042]
On the base portion 21, the light receiving semiconductor chip is mounted with a photodiode 34 fixed by an electrically insulating adhesive 35. The light receiving surface 36 of the photodiode 34 faces the opposite side (left side in FIG. 5) from the base 21.
[0043]
The processing semiconductor chip 37 is fixed on the base portion 21 closer to the first lead portion 22 than the photodiode 34 (that is, below the FIGS. 4 and 5) by a conductive adhesive 38 such as a silver paste. Be mounted. The photodiode 34 and the processing semiconductor chip 37 are electrically connected by a wire bond 39 made of a conductive wire such as gold. Similarly, a wire 40 is connected by wire 40 to the end of the first overlapping portion 22 near the base end 26 which does not partially overlap with the second lead portion 18.
[0044]
The processing semiconductor chip 37 receives the electric signal obtained by converting the optical signal from the photodiode 34, amplifies the electric signal with a high gain, performs a waveform shaping, and derives the function, and includes an amplifier circuit. Further, the processing semiconductor chip 37 includes a filter circuit, a detection circuit, and the like. The digital output signal from the processing semiconductor chip 37 thus obtained is derived from between the first central lead 24 and each first side lead 30.
[0045]
FIG. 6 is a plan view of the shield frame 18, and FIG. 7 is a cross-sectional view of the shield frame 18 as viewed from a section line VII-VII. FIG. 8 is a sectional view taken along section line VIII-VIII in FIG. The shield frame 18 at the time of manufacture basically has a shield part 43 and a second lead part 44 made of the same metal plate as the shield part 43. The shield part 43 has a shield body 45 and an outer peripheral part 46. The outer peripheral portion 46 has a side portion 47 surrounding at least the left and right sides of the photodiode 34 in FIGS. 4 and 6 and a base end side opposite to the first and second lead portions 22 and 44 (see FIGS. 7 (above 7). In the storage space 49 thus formed, the photodiode 34 and the processing semiconductor chip 37 are stored and covered. A light transmitting hole 50 is formed in the shield body 45 so as to correspond to the light receiving surface 36 of the photodiode 34.
[0046]
The second lead portion 44 is provided with a rising portion 51 connected to the shield portion main body 45 of the shield portion 43 and a second center lead portion connected to the rising portion 51 and overlapping the first center lead portion 24 of the base frame 17 over the entire length. 52, and a pair of second side lead portions 53 arranged at an interval on both left and right sides of the second central lead portion 52 in FIG.
[0047]
The second side lead portion 53 overlaps the first side overlap portion 27 described above, is connected to the second side overlap portion 55 near the base end portion 54, is continuous with the second side overlap portion 55, and is connected to the first side extension portion 29. The second outer extension portions 57a and 57b that overlap and extend outward near the free end portion 56 and the second outer extension portion 57, and extend in the longitudinal direction of the first insertion mounting portion 30 (up and down in FIGS. 4 to 7). Direction), a hanging portion 58 extending parallel to the second central lead portion 52 and the second side lead portion 55, a bent portion 59 connected to the hanging portion 58, and a second central lead portion connected to the bent portion 59. 52 and a second insertion mounting portion 60 extending in parallel with the second side lead portion 55.
[0048]
The tie bar 61 includes a second outer extending portion 57 and is integrally connected to the second side overlapping portion 55 and the hanging portion 58. The guide bar 62 integrally connects the free end portion 56 of the second center lead portion 52 and the second insertion mounting portion 60.
[0049]
The base frame 17 and the shield frame 18 are made of metal, for example, made of iron, or an alloy of iron and nickel, and may be plated with Au. In the portion covered by the package 19, such plating may not be performed. The thickness of the base frame 17 is, for example, 0.2 mm, and has a strength capable of stably supporting the photodiode 34 and the processing semiconductor chip 37. The thickness of the shield frame 18 is 0.10 to 0.15 mm, and may be smaller than the base frame 17 in order to achieve the purpose of shielding by the shield portion 43 and to reinforce the first lead portion 22.
[0050]
As clearly shown in FIGS. 4 and 5, near the base end portion 26 of the first lead portion 22 covered by the package 19, the first central lead portion 24, the first side overlapping portion 27, the reinforcing portion 33, On the surface facing the second lead portion 44, a concave groove 63 is formed over the entire width in the left-right direction of FIG. The cross-sectional shape of the concave groove 63 may be U-shaped or V-shaped. Similarly, as clearly shown in FIG. 7, near the base end portion 54 of the second lead portion 44 covered with the package 19, the second central lead portion 52, the second overlapping portion 55, and the reinforcing portion 64 A groove 65 extending over the entire width is formed on the surface facing the first lead portion 22. The groove 65 is formed in the same cross-sectional shape as the groove 63 described above.
[0051]
The reinforcing portion 64 extends from the tie bar 61 toward the base end portion 54 between the second central lead portion 52 and the second side overlapping portion 55, and is shielded via the same rising portion as the above-described rising portion 51. Connected to the main body 45.
[0052]
The package 19 is made of a material obtained by diffusing a powder dye into a transparent thermosetting epoxy resin. This dye has an optical property of transmitting infrared light and blocking visible light.
[0053]
A through hole 66 is formed in the base portion 21 between the photodiode 34 and the processing semiconductor chip 37 so as to extend in the width direction (the left-right direction in FIG. 4). By forming the through holes 66, the electrically insulating adhesive 35 does not protrude and move to the processing semiconductor chip 37 side, and the conductive adhesive 38 does not protrude and move to the photodiode 34 side. . Thus, the photodiode 34 and the processing semiconductor chip 37 can be fixed on the base 21 with high quality.
[0054]
A manufacturing procedure of the light receiving device 16 according to one embodiment of the present invention will be described. As shown in FIGS. 4 and 5, the photodiode 34 and the processing semiconductor chip 37 are mounted on the base 21 of the base frame 17, and wire bonding is performed by wires 39 and 40. Also, a shield frame 18 shown in FIGS. 6 and 7 is prepared.
[0055]
Then, the shield part 43 is overlaid on the base frame 17, and the photodiode 34 and the processing semiconductor chip 37 are covered by the shield part 43. In this state, the end surface 67 of the outer peripheral portion 46 including the side portion 47 and the end portion 48 of the shield portion 43 comes into contact with the vicinity of the outer peripheral portion of the surface of the base portion 21 on which the photodiode 34 and the processing semiconductor chip 37 are mounted. The first lead portion 22 and the second lead portion 44 abut and overlap with each other.
[0056]
FIG. 9 shows a plane in which the base frame 17 and the shield frame 18 are overlapped in this way, and FIG. 10 shows a side surface thereof.
[0057]
The concave grooves 63 and 65 may be formed at the same position in the axial direction of the first and second lead portions 22 and 44 (up and down directions in FIGS. 4 to 7) as shown in the drawing, but in the axial direction. The grooves 63 and 65 may not be formed so as to be shifted from each other. In this manner, the end face 67 of the outer peripheral portion 46 abuts on the surface of the base portion 21, and thus the shield portion 43, the photodiode 34, and the processing semiconductor chip 37, and the thickness direction (the horizontal direction in FIGS. 5, 7, and 10). Is set stably. Therefore, there is no possibility that the wire bond and the conductive wires 39 and 40 come into contact with the inner surface of the shield portion 43 on the space 49 side.
[0058]
Next, as shown by the imaginary line in FIG. 10, the first and second lead portions 22, 44 are pressed against each other by the transfer molding method using the dies 68, 69 in the direction of approaching each other. A mixed material of a thermosetting epoxy resin and a dye is injected and molded. Thus, the package 19 is used to seal the base frame 17 and a part of the shield frame 18, the photodiode 34, the processing semiconductor chip 37, and the like. The molding is performed while the base portions 26 and 54 of the first and second lead portions 22 and 44 are kept in close contact with each other by the sandwiching pressure of the molds 68 and 69. A convex lens portion 70 is formed on the package 19 corresponding to the light receiving surface 36, so that the light collection efficiency can be improved.
[0059]
After the formation of the package 19, the tie bars 31, 61 are cut and removed in parallel to the axial direction of the first and second lead portions 22, 44 as shown by hatching in FIG. FIG. 12 is a side view after the package 19 is completed before cutting the tie bar 61 and the guide bar 62 of FIG. Also, the guide bars 32 and 62 are cut and removed as shown by hatching in FIG. Simultaneously with the cutting of the tie bars 31, 61, the reinforcing portions 33, 64 are cut as shown by hatching in FIG. Thus, the base portion 21 and the shield portion 43 are electrically connected to the first and second central lead portions 24, 52, and the first and second central lead portions 24, 52 are set to the ground potential. You.
[0060]
Thereafter, the entire first and second lead portions 22, 44 exposed from the package 19 are immersed in molten solder to perform a solder dipping process. Thus, the overlapping portions of the first and second lead portions 22 and 44 are electrically and mechanically joined, and the strength is improved. The rise of the molten solder in the package 19 can be prevented by the above-described grooves 63 and 65.
[0061]
After the soldering, the bent portion 59a is bent at an angle θ at the bending line 72 of the hanging portion 58a of the second lead portion 44. The bent portion 59b is bent at an angle θ at the bending line 73 of the hanging portion 58b. In one embodiment of the present invention, θ = 90 degrees. The fold lines 72 and 73 are on extensions of the sides of the hanging portions 58a and 58b that are away from the first and second central lead portions 24 and 52.
[0062]
The hanging part 53 overlaps halfway in the longitudinal direction (the vertical direction in FIGS. 4 to 7) of the first insertion mounting part 30. The bent portions 59a and 59b are opposite to each other in the thickness direction of the hanging portions 58a and 58b (the direction perpendicular to the paper surface of FIGS. 2 and 6 and the horizontal direction of FIG. 3). , And the other bent portion 59b is bent behind. Thus, the second insertion mounting portion 60 extends parallel to the first and second side leads 55, and thus the first and second central leads 24, 52, and furthermore, the axis of the first and second central leads 24, 52. 2 (in other words, a horizontal plane perpendicular to the plane of FIG. 2 and FIG. 3), the first insertion mounting portion 30 and the above-described angle θ are mutually formed. As a result, the independence of the first and second lead portions 22 and 44 is ensured.
[0063]
As shown in FIGS. 1 and 2, first insertion mounting portions 30 a and 30 b are inserted through mounting holes 120 and 121 provided in wiring board 20, and second insertion mounting portion 60 a is inserted into mounting holes 122 and 123. , 60b are respectively inserted, and the first and second central lead portions 24, 52 are inserted into the mounting hole 124 in an overlapping state. In this state, the first insertion mounting portion 30, the second insertion mounting portion 60, and the first and second center lead portions 24, 52 are soldered to the lands 130, 131, 132, 133, 134 of the wiring board 20. In addition, the lower end surfaces 140a and 140b of the bent portions 59a and 59b abut on the upper surface of the wiring board 20, and the light receiving device 16 is positioned.
[0064]
FIG. 13 is a side view of another embodiment of the present invention. In this embodiment, an electronic circuit chip 75 such as a semiconductor chip is further fixed behind the base frame 17, and another shield frame 76 is placed on the base frame 17 on the side opposite to the shield frame 18. The shield frame 76 has the same configuration as the shield frame 18 described above. In another embodiment of the present invention, one or a plurality of base frames 17 and one or a plurality of shield frames 18 and 76 may be further stacked.
[0065]
The invention can be implemented widely, not only in connection with remote-controlled light receiving devices, but also in connection with other electronic circuit elements. According to the present invention, not only the structure in which the photodiode 34 and the processing semiconductor chip 37 are individually attached to the base portion 21 but also the case where the constituent elements 34 and 37 are configured as a single semiconductor chip, for example. The present invention can be implemented.
[0066]
【The invention's effect】
According to the present invention, since the base frame and the shield frame are overlapped with each other, the shield portion of the shield frame can be arranged close to the electronic circuit chip on the base portion of the base frame. It is easy to achieve downsizing while ensuring electromagnetic shielding by reducing the size, and it is easy to manufacture.
[0067]
Further, according to the present invention, since the overlapping portions near the base end portions of the first and second lead portions are overlapped and soldered, the strength is increased to secure self-sustainability, and the first and second lead portions are inserted and mounted on the wiring board to stand upright. Can be placed.
[0068]
Further, according to the present invention, since the first and second leads can be made thinner while ensuring the strength of the first and second leads, the distance between the adjacent leads can be reduced. It is possible to increase the density. This also enables miniaturization.
[0069]
Since the insertion mounting portions of the first and second lead portions are at an angle θ to each other, it is possible to mount the electronic circuit element on the wiring board upright and maintain its posture accurately with a large strength. Become.
According to the present invention, the electronic circuit chip is covered not only by the shield portion main body but also by the outer peripheral portion, so that the shield resistance can be improved.
[0070]
According to the present invention, the base frame on which the electronic circuit chip is mounted is made thicker than the shield frame, which enables accurate assembly work, while the shield frame is made thinner than the base frame. Thus, the shield function of the electronic circuit chip can be sufficiently achieved, and the first lead portion can be reinforced by the second lead portion.
[0071]
According to the present invention, concave grooves are formed in the first and second lead portions inside the package on surfaces facing each other, and, for example, at the time of solder dip, molten solder is formed in a minute gap between the first and second lead portions. Large intrusion into the package through the semiconductor device can be suppressed, and the quality can be improved.
[0073]
According to the present invention, since the second insertion mounting portion continues from the first outer extension portion of the base frame, the distance between the first center lead portion and the first insertion mounting portion is increased, and thus the density is increased. In addition, an electronic circuit element of an insertion mounting type on a wiring board can be easily realized. Similarly, the shield frame continues from the bent portion to the second insertion mounting portion via the second outer extending portion via the hanging portion, so that the distance between the second central lead portion and the hanging portion and the second insertion mounting portion is increased. In addition, it is possible to easily perform insertion mounting on a wiring board while increasing the density.
[0074]
According to the present invention, the same effects as those of the first and sixth aspects are achieved, and light such as infrared light is received on the light receiving surface via the light transmission hole of the shield portion main body. Since the outer peripheral portion is continuous, electromagnetic shielding of not only the semiconductor chip for processing but also the semiconductor chip for light reception can be surely performed.
[0075]
According to the present invention, the first and second leads are sealed by a synthetic resin package in a state where the first and second leads are pressed by a pair of molds by, for example, transfer molding, and then the first and second leads are soldered. After the fixing, the insertion mounting portion is bent, so that the bending can be performed in a state where the first and second lead portions are accurately overlapped, and the manufacture can be performed accurately.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of an embodiment of the present invention.
FIG. 2 is a front view of the light receiving device 16;
FIG. 3 is a side view of the light receiving device 16;
FIG. 4 is a plan view of the base frame 17 during its manufacture.
FIG. 5 is a cross-sectional view taken along line VV of FIG. 4;
FIG. 6 is a plan view of the shield frame 18. FIG.
FIG. 7 is a cross-sectional view of the shield frame 18 as viewed from a section line VII-VII.
FIG. 8 is a sectional view taken along section line VIII-VIII in FIG. 6;
FIG. 9 is a plan view showing a state in which the base frame 17 and the shield frame 18 are overlaid.
FIG. 10 is a side view of a state where the base frame 17 and the shield frame 18 are overlaid.
FIG. 11 is a view cut after the formation of the package 19;
FIG. 12 is a side view after the package 19 is completed before cutting the tie bar 61 and the guide bar 62 of FIG. 11;
FIG. 13 is a side view of another embodiment of the present invention.
FIG. 14 is a plan view of another prior art.
FIG. 15 is a cross-sectional view of another prior art.
[Explanation of symbols]
16 Remote control light receiving device
17 Base frame
18,76 shield frame
19. Synthetic resin package
20 Printed wiring board
21 Base part
22 1st lead part
24 1st center lead
25 1st side lead part
26,54 Base end
27 First side overlap
28,56 free end
29 1st outside extension
30 1st insertion mounting part
31,61 Tie bar
32,62 guide bar
33,64 reinforcement
34 Photodiode
35 Electrically insulating adhesive
36 Light receiving surface
37 Semiconductor chips for processing
38 Conductive adhesive
39 wire bond
40 conductors
43 Shield
44 2nd lead part
45 Shield body
46 Outer circumference
49 storage space
50 Light transmission hole
51 Rise
52 2nd center lead part
53 Second side lead
55 Second side overlapping part
57 2nd outside extension part
58 Hanging part
59 Bend
60 second insertion mounting part
63 groove
65 Groove
66 through hole
67 End face
68,69 mold
70 convex lens part
72, 73 bending line
75 Electronic Circuit Chip

Claims

A base frame having a base portion and a first lead portion made of the same metal plate as the base portion;
An electronic circuit chip mounted on the base portion and electrically connected to the first lead portion;
A shield frame having a shield portion covering the electronic circuit chip on the base portion, and a second lead portion made of the same metal plate as the shield portion,
The first and second lead portions are
An overlapping portion overlapping each other near the base end,
Having an insertion mounting portion connected to the overlapping portion and shifted near the free end portion,
The insertion mounting part has an angle θ with each other in an imaginary plane perpendicular to the axis of the first and second lead parts, and further has a solder for fixing the overlapping part between the first lead part and the second lead part. When,
An electronic circuit element including a synthetic resin package for sealing a base frame, an electronic circuit chip, and a shield part.

The shield part,
A shield body that covers above the electronic circuit chip;
2. The electronic circuit element according to claim 1, further comprising an outer peripheral portion connected to the shield main body and covering an outer periphery of the electronic circuit chip.

3. The electronic circuit device according to claim 1, wherein the thickness of the base frame is selected to be greater than the thickness of the shield frame.

The package partially seals the first and second leads,
4. A groove is formed on the mutually facing surfaces of the first and second leads sealed by the package over the entire width of the first and second leads. An electronic circuit element according to one of the above.

The electronic circuit device according to claim 4, wherein the concave groove is in a package.

(A) a base frame,
A base part,
A first lead portion formed of the same metal plate as the base portion and formed in one plane with the base portion;
The first lead part is
A first central lead portion connected to the base portion;
A pair of first side leads arranged at intervals on both left and right sides of the first central lead,
Each first side lead portion is
A first side overlapping portion parallel to the first central lead portion and near the base end;
A first outer extending portion connected to the first side overlapping portion and extending outward near the free end;
A base frame having a first insertion mounting portion connected to the first outer extension portion and extending in parallel with the first central lead portion;
(B) an electronic circuit chip mounted on the base portion and electrically connected to the first central lead portion and the first side overlapping portion;
(C) a shield frame,
A shield part covering the electronic circuit chip on the base part,
A second lead portion made of the same metal plate as the shield portion,
The second lead portion includes a rising portion connected to the shield portion,
A second central lead portion connected to the rising portion and overlapping the first central lead portion over the entire length;
A pair of second side leads arranged at intervals on both left and right sides of the second central lead,
Each second side lead part is
A second side overlapping portion overlapping the first side overlapping portion and near the base end;
A second outer extension that is continuous with the second side overlap, overlaps the first side extension, and extends outward near the free end;
A hanging part that extends to the second outer extension part, overlaps partway in the longitudinal direction of the first insertion mounting part, and extends in parallel with the second side lead part;
A bent portion that is connected to the hanging portion and extends by bending at a substantially right angle in a direction opposite to each other in the thickness direction of the hanging portion;
In a virtual plane perpendicular to the axis of the first and second central lead portions, extending at an angle θ of approximately 90 ° with the first insertion mounting portion in a continuation of the bent portion and extending in parallel with the second side lead portion. A shield frame having a second insertion mounting portion,
(D) fixing the first central lead portion and the second central lead portion, fixing the first side overlapping portion and the second side overlapping portion, and forming a first outer extending portion and a second outer extending portion. Solder to fix the part near the end,
(E) An electronic circuit comprising: a base portion, a base end portion of the first central lead portion, an electronic circuit chip, a shield portion, and a synthetic resin package for sealing the base end portion of the second lead portion. element.

(A) a base frame,
A base part,
A first lead portion made of the same metal as the base portion and formed in one plane with the base portion;
The first lead part is
A first central lead portion connected to the base portion;
A pair of first side leads arranged at intervals on both left and right sides of the first central lead,
Each first side lead portion is
A first side overlapping portion parallel to the first central lead portion and near the base end;
A first outer extending portion connected to the first side overlapping portion and extending outward near the free end;
A base frame having a first insertion mounting portion connected to the first outer extension portion and extending in parallel with the first central lead portion;
(B) a light-receiving semiconductor chip mounted on the base portion and having a light-receiving surface facing the opposite side to the base portion;
(C) mounted on the base portion closer to the first lead portion than the light-receiving semiconductor chip, and wire-bonded to the light-receiving semiconductor chip and wire-bonded to the base end of the first-side lead portion; A processing semiconductor chip for processing an output signal from the light receiving semiconductor chip;
(D) a shield frame,
A shield body covering the light receiving semiconductor chip and the processing semiconductor chip and having a light transmitting hole corresponding to the light receiving surface, at least the left and right sides of the light receiving semiconductor chip, and the side opposite to the first lead portion; A shield portion having an outer peripheral portion surrounding the
A second lead portion made of the same metal plate as the shield portion,
The second lead part is
A rising part connected to the shield part,
Connect to the rising part,
A second central lead overlapping the first central lead over its entire length;
A pair of second side leads arranged at intervals on both left and right sides of the second central lead,
Each second side lead part is
A second side overlapping portion overlapping the first side overlapping portion and near the base end;
A second outer extension that is continuous with the second side overlap, overlaps the first side extension, and extends outward near the free end;
A hanging part that extends to the second outer extension part, overlaps partway in the longitudinal direction of the first insertion mounting part, and extends in parallel with the second side lead part;
A bent portion that is connected to the hanging portion and extends by bending at a substantially right angle in a direction opposite to each other in the thickness direction of the hanging portion;
In a virtual plane perpendicular to the axis of the first and second central lead portions, extending at an angle θ of approximately 90 ° with the first insertion mounting portion in a continuation of the bent portion and extending in parallel with the second side lead portion. A shield frame having a second insertion mounting portion,
(E) fixing the first central lead portion and the second central lead portion, fixing the first side overlapping portion and the second side overlapping portion, and forming a first outer extending portion and a second outer extending portion. Solder to fix the part near the end,
(F) sealing the base portion, the base end portion of the first central lead portion, the light receiving semiconductor chip, the processing semiconductor chip, the shield portion, and the base end portion of the second lead portion; A light-receiving device comprising: a synthetic resin package having an insulating property.

An electronic circuit chip mounted on the base portion of the base frame having a base portion and a first lead portion made of the same metal plate as the base portion;
A shield frame that covers the electronic circuit chip on the base portion and a second lead portion that is made of the same metal plate as the shield portion and that at least partially overlaps the first lead portion is provided.
The base frame, the electronic circuit chip, and the shield are sealed with a synthetic resin package in a state where the first lead and the second lead are pressed against each other by a pair of molds in a direction of approaching each other.
After the sealing, the first lead portion and the second lead portion are fixed with solder,
After fixing with solder, the insertion mounting portion near the free end of the first lead portion and the second lead portion forms an angle θ with each other in an imaginary plane perpendicular to the axis of the first and second lead portions. And a method of manufacturing an electronic circuit element characterized by bending.