JP3549063B2

JP3549063B2 - Manufacturing method of printed wiring board

Info

Publication number: JP3549063B2
Application number: JP20711894A
Authority: JP
Inventors: 賢司笹岡
Original assignee: Toshiba Corp
Current assignee: Toshiba Corp
Priority date: 1994-08-31
Filing date: 1994-08-31
Publication date: 2004-08-04
Anticipated expiration: 2019-08-04
Also published as: JPH0878845A

Description

【０００１】
【産業上の利用分野】
本発明は印刷配線板の製造方法に係り、特に配線および実装の高密度化が可能で、かつ信頼性の高い印刷配線板を工数の低減を図りながら、歩留まり良好に製造し得る方法に関する。
【０００２】
【従来の技術】
たとえば両面型印刷配線板もしくは多層型印刷配線板においては、両面導電パターンなどの配線層間の電気的な接続を、次のようにして行っている。たとえば両面型印刷配線板の場合は、先ず、両面銅箔張り基板の所定位置に穴明け加工（穿設加工）を施す。次いで、前記穿設した穴の内壁面を含め、全面に化学メッキ処理を施してから、さらに電気メッキ処理で厚付けし、穴内壁面の金属層を厚くして信頼性を高め、配線層間の電気的な接続を行っている。
【０００３】
また、多層印刷配線板の場合は、先ず、基板両面に張られた銅箔を、それぞれパターニングする。その後、パターニング面上に絶縁性シート（たとえばプリプレグ）を介して銅箔を積層・配置し、加熱加圧により一体化する。次いで、前述の両面型印刷配線板のときと同様に、穴明け加工およびメッキ処理による配線層間の電気的な接続を行う。この配線層間の接続後、表面銅箔についてのパターニングにより、多層型印刷配線板を得ている。なお、より配線層の多い多層型印刷配線板の場合は、中間に介挿させる両面型印刷配線板数を増やす方式で製造できる。
【０００４】
さらに、図３に断面的に示す構成の多層印刷配線板を製造する手段として、ビルドアップ法も知られている。図３において、１は絶縁性支持基板、２ａは第１の配線パターン層、３は層間絶縁樹脂層、４は層間絶縁樹脂層３に設けた微細孔（ブラインドホール）、２ｂは第２の配線パターン層であり、前記第１の配線パターン層２ａおよび第２の配線パターン層２ｂは、ブラインドホール４によって、電気的に接続した構成を採っている。そして、このビルドアップ法は、通常、ガラス・エポキシ樹脂系を支持基材１とした銅張り積層板を素材とし、先ず、前記銅層について、たとえばフォトエッチング処理を施して、第１の配線パターン層２ａを形成する。次いで、前記第１の配線パターン層２ａ形成面に、たとえば感光性を有するエポキシ樹脂を全面塗布し、この感光性エポキシ樹脂層（層間絶縁樹脂層３を成す）に、紫外線など選択的に照射してから、現像処理して１の配線パターン層２ａを選択的に露出させる（ブラインドホール４の形設）。その後、前記感光性エポキシ樹脂層３表面を、たとえば化学処理により粗面化してから、化学メッキにより、要すればさらに電気メッキを併用して、導電性金属層を全面的に被着形成する。前記被着形成した導電性金属層について、たとえばフォトエッチング処理を施して、第２の配線パターン層２ｂを形成すると同時に、ブラインドホール４による接続を行う。
【０００５】
前記印刷配線板の製造方法において、配線層間の電気的な接続をメッキ方法によらず行う方法も知られている。すなわち、両面銅箔張り基板の所定位置に穴明けし、この穴内に導電性ペーストを印刷法などにより流し込み、穴内に流し込んだ導電性ペーストの樹脂分を硬化させて、配線層間を電気的に接続する方法も行われている。
【０００６】
【発明が解決しようとする課題】
上記で説明したように、配線層間の電気的な接続にメッキ法を利用する印刷配線板の製造方法においては、基板に配線層間の電気的な接続用の穴明け（穿穴）加工、穿設した穴内壁面を含めたメッキ処理工程などを要し、印刷配線板の製造工程が冗長であるとともに、工程管理も繁雑であるという欠点がある。特に、ビルドアップ法においては、微細なブラインドホール４内に導体層を形成するが、非貫通穴なブラインドホール４内壁面に、銅を一様に析出させ得ないのが実情である。つまり、微細なブラインドホール４内壁面に所要の導電体層を、再現性良好に形成することが事実上至難であり、信頼性のうえで問題がある。
【０００７】
さらに、層間の絶縁樹脂層を、紫外線硬化型樹脂で形成した場合は、一般的に電気絶縁特性，耐熱性，耐薬品性など劣るばかりでなく、メッキ金属膜との接着性も劣るため、多層印刷配線板の高性能化など図り得ない。
【０００８】
一方、配線層間の電気的な接続用の穴に、導電性ペーストを印刷などにより埋め込む方法の場合も、前記メッキ法の場合と同様に穴明け工程を必要とする。しかも、穿設した穴内に、均一（一様）に導体性ペーストを流し込み埋め込むことが難しく、電気的な接続の信頼性に問題があった。いずれにしても、前記穴明け工程などを要することは、印刷配線板のコストや歩留まりなどに反映し、低コスト化などへの要望に対応し得ないという欠点がある。また、前記配線層間の電気的な接続構成の場合は、印刷配線板の表裏面に、配線層間接続用の導電体穴が設置されているため、その導電体穴の領域に配線を形成・配置し得ないし、さらに電子部品を搭載することもできないので、配線密度の向上が制約されるとともに、電子部品の実装密度向上も阻害されるという問題がある。
【０００９】
いずれにしても、従来の製造方法によって得られる印刷配線板は、高密度配線や高密度実装による回路装置のコンパクト化、ひいては電子機器類の小形化などの要望に、十分応え得るものといえず、前記コスト面を含め、実用的により有効な印刷配線板の製造方法が望まれている。
【００１０】
本発明は上記事情に対処してなされたもので、簡易なプロセスで、配線パターン層間における所要の絶縁性および所要の電気的な接続も確実に確保された、信頼性の高い印刷配線板を歩留まりよく製造し得る方法の提供を目的とする。
【００１１】
【課題を解決するための手段】本発明に係る第１の印刷配線板の製造方法は、第１の支持基体主面の所定位置に、導体バンプ群を形設する工程と、前記第１の支持基体の導体バンプ形設面、もしくは第２の支持基体の少なくとも一主面に、所要厚さの絶縁・接着性の樹脂層を形成する工程と、前記第１の支持基体導体のバンプ形設面に絶縁・接着性樹脂層を介し第２の支持基体を対接させて積層・配置して、積層体を形成する工程と、前記積層体を加圧し、前記絶縁・接着性樹脂層の厚さ方向に、前記バンプの先端部をそれぞれ貫挿させ、第１の支持基体−第２の支持基体間を接続する導体部を形成する工程とを具備して成ることを特徴とする。
【００１２】
本発明に係る第２の印刷配線板の製造方法は、第１の導電性支持基体主面の所定位置に、導体バンプ群を形設する工程と、前記第１の導電性支持基体の導体バンプ形設面、もしくは第２の導電性支持基体の少なくとも一主面に、所要厚さの絶縁・接着性の樹脂層を形成する工程と、前記第１の導電性支持基体の導体バンプ形設面に、絶縁・接着性樹脂層を介し第２の導電性支持基体を対接させて積層・配置して、積層体を形成する工程と、前記積層体を加圧し、前記絶縁・接着性樹脂層の厚さ方向に、前記バンプの先端部をそれぞれ貫通させ、第１の導電性支持基体−第２の導電性支持基体間を電気的に接続する導体部を形成する工程と、前記貫通型導体部を形成した積層体の導電性支持基体をパターニングして、前記導体部に接続する配線パターンを形成する工程とを具備して成ることを特徴とする。
【００１３】
本発明において、導体バンプ群を形設する支持基体としては、たとえば剥離性の良好な合成樹脂シート類，もしくは導電性シート（箔）などが挙げられる。そして、この支持基体は１枚のシートであってもよいし、パターン化されたものでもよく、その形状はとくに限定されない。さらに、導体バンプ群は、一方の主面だけでなく、両主面にそれぞれ形設した形のものを用いてもよい。
【００１４】
ここで、前記導体バンプは、たとえば銀，金，銅，半田粉などの導電性粉末、これらの合金粉末もしくは複合（混合）金属粉末と、たとえばポリカーボネート樹脂，ポリスルホン樹脂，ポリエステル樹脂，フェノキシ樹脂，フェノール樹脂，ポリイミド樹脂などのバインダー成分とを混合して調製された導電性組成物、あるいは導電性金属などで構成される。そして、前記バンプ群の形設は、導電性組成物で形成する場合、たとえば比較的厚いメタルマスクを用いた印刷法により、アスペクト比の高いバンプを形成でき、そのバンプの高さは一般的に、５０〜４００μｍ程度が望ましく、さらにバンプの高さは一層の合成樹脂系シートを貫通し得る高さおよび複数層の合成樹脂系シートを貫通し得る高さとが適宜混在していてもよい。
【００１５】
一方、導電性金属のバンプを形成する手段としては、（ａ）ある程度形状もしくは寸法の一定化された微小金属魂を、粘着剤層を予め設けておいた支持基体面に散布し、選択的に固着させるか（このときマスクを配置して行ってもよい）、（ｂ）銅箔などを支持基体とした場合は、メッキレジストを印刷・パターニングして、銅，錫，金，銀，半田などメッキして選択的に微小な金属柱（バンプ）群の形成、（ｃ）支持基体面に半田レジストの塗布・パターニングして、半田浴に浸漬して選択的に微小な金属柱（バンプ）群の形成などが挙げられる。ここで、バンプに相当する微小金属魂もしくは微小な金属柱は、異種金属を組合わせて成る多層構造、多層シェル構造でもよい。たとえば銅を芯にし表面を金や銀の層で被覆して耐酸化性を付与したり、銅を芯にし表面を半田層被覆して半田接合性をもたせたりしてもよい。
【００１６】
なお、本発明において、導体バンプ群を導電性組成物で形成する場合は、メッキ法などの手段で行う場合に較べて、さらに工程など簡略化し得るので、低コスト化の点で有効である。
【００１７】
本発明において、前記導体バンプ群が貫挿され、貫通型の導体部を形成する絶縁・接着性樹脂としては、たとえばポリカーボネート樹脂，ポリスルフォン樹脂，ポリエーテルイミド樹脂，熱可塑性ポリイミド樹脂，４フッ化ポリエチレン樹脂，４フッ化ポリエチレン樹脂，６フッ化ポリプロピレン樹脂，ポリエーテルエーテルケトン樹脂，塩化ビニル樹脂，ポリエチレン樹脂などの熱可塑性樹脂が先ず挙げられる。また、支持基体面に、いわゆるＢステージの状態で、所要の絶縁・接着性樹脂層を形成し得る熱硬化性樹脂、たとえばエポキシ樹脂，ビスマレイミドトリアジン樹脂，ポリイミド樹脂，フェノール樹脂，ポリエーテル樹脂，メラミン樹脂、あるいは未加硫な（生ゴム）ブタジエンゴム，ブチルゴム，天然ゴム，ネオプレンゴム，シリコーンゴムなども使用し得る。さらに、これらは共重合体系や混合系であってもよいし、ガラスクロスやマットなどの無機酸化物，紙などの有機物をを組み合わせた形態、もしくは無機酸化物粉末など添加・含有させた系でもよい。そして、絶縁・接着性樹脂層の形成は、たとえばスクリーン印刷法，キャスティングローラコート法，スピナコート法などで行うことができ、この絶縁・接着性樹脂層の厚さは、製造する印刷配線板の品種、用途などによって異なるが、一般的に５０〜８００μｍ程度が好ましい。
【００１８】
さらに、本発明において、バンプ群を形設した支持基体などの主面に、絶縁・接着性樹脂層を介して、他の支持基体を積層配置して成る積層体をそのまま、もしくは加熱して加圧するとき、当て板として、寸法や変形の少ない金属板もしくは耐熱性樹脂板、たとえばステンレス板，真鍮板、ポリイミド樹脂板（シート），ポリテトラフロロエチレン樹脂板（シート）など使用することが好ましい。この積層体の加圧に当っては、加熱して絶縁・接着性樹脂層が柔らかくなった状態で加圧し、バンプ群を貫挿させると、より良好なバンプ群の貫挿を達成し得る。
【００１９】
【作用】
本発明に係る印刷配線板の製造方法によれば、配線層間を電気的に接続する層間の導体部は、いわゆる積層一体化する工程での加熱・加圧により、層間絶縁層を成す絶縁・接着性樹脂の可塑状態化と、支持基体面の導体バンプ群の圧入とによって、確実に信頼性の高い配線層間の電気的な接続が達成される。つまり、プロセスの簡易化を図りながら、微細な配線パターン層間を任意な位置（箇所）で、高精度にかつ信頼性の高い電気的な接続を形成し得るので、配線密度の高い印刷配線板を低コストで製造することが可能となる。加えて、前記層間絶縁層は、絶縁・接着性樹脂で形成されるため、その硬化（固化）収縮性と相俟って配線パターン層間の強固な一体性も容易に確保される。さらにまた、前記配線パターン層間の電気的な接続に当たり、接続穴の形設も不要となるので、その分高密度配線および高密度実装の可能な印刷配線板が得られることになる。
【００２０】
【実施例】
以下、図１（ａ）〜（ｆ）および図２（ａ）〜（ｆ）を参照して本発明の実施例を説明する。
【００２１】
実施例１
図１（ａ）〜（ｆ）は本実施例の実施態様を模式的に示したものである。先ず、厚さ３５μｍの電解銅箔を第１の支持基体５として、ポリマータイプの銀系の導電性ペースト（商品名，熱硬化性導電性ペーストＤＷ−２５０Ｈ−５，製造元：東洋紡績ＫＫ）、および板厚の２００μｍのステンレス板の所定箇所に０．４ｍｍ径の穴を明けたメタルマスクをそれぞれ用意した。そして、前記電解銅箔（第１の支持基体）５面に、前記メタルマスクを位置決め配置して導電性ペーストを印刷し、この印刷された導電性ペーストが乾燥後、同一マスクを用い同一位置に再度印刷する方法で３回印刷を繰り返し、高さ２００μｍ弱の山形の導体パンブ６を形成（形設）した。一方、同じく厚さ３５μｍの電解銅箔を第２支持基体７とし、この第２支持基体７の一主面に、スピンコート法によって、厚さ１００μｍ程度のエポキシ樹脂層８を被着・形成した。
【００２２】
次いで、図１（ａ）に断面的に示すごとく、前記エポキシ樹脂層８を設けた第２支持基体７面に、前記導体パンブ６を設けた第１の支持基体５を、エポキシ樹脂層８と導体パンブ６とを対向させて、配置して積層体化した。その後、前記第１の支持基体５および第２支持基体７裏面に、それぞれポリイミド樹脂フィルムを当て板として積層・配置し、樹脂圧として１ＭＰａで加圧し、そのまま取りだし、表裏の当て板を剥離したところ、図１（ｂ）に断面的に示すごとく、前記導体バンプ６が、絶縁・接着性樹脂層８中に圧入し、第２支持基体７に対接して、先端が潰された形になって貫通する導体部６′を備えた積層板を得た。
【００２３】
前記積層板の両面の電解銅箔（第１の支持基体５および第２支持基体７）について、通常のエッチングレジストインク（商品名，ＰＳＲ−４０００Ｈ，製造元：太陽インキＫＫ）をスクリーン印刷し、導体パターン部をマスクしてから、塩化第２銅をエッチング液としてエッチング処理後、レジストマスク剥離して、図１（ｃ）に断面的に示すような、両面配線型の印刷配線板９を作製した。この両面配線型の印刷配線板９の両面配線パターン５′，７′の所定面に、前記第１の支持基体５面へ導体バンプ６を形成した場合と同様な手段で、導体バンプ１０をそれぞれ設けた。また、前記第２の支持基体７に、絶縁・接着性樹脂層８を設けた場合と同様の手段で、２枚の電解銅箔（第３，第４の支持基体）１１，１２面に，それぞれ絶縁・接着性樹脂層１３，１４を設けたものを用意した。その後、前記導体バンプ１０を設けた両面配線型の印刷配線板９に、絶縁・接着性樹脂層１３，１４を設けた第３の支持基体１１，第４の支持基体１２を、図１（ｄ）に断面的に示すごとく配置して積層体化した。この積層体について、第３の支持基体１１および第４支持基体１４裏面に、それぞれポリイミド樹脂フィルムを当て板として積層・配置し、樹脂圧として１ＭＰａで加圧し、そのまま取りだし、表裏の当て板を剥離したところ、図１（ｅ）に断面的に示すように、前記導体バンプ１０が、絶縁・接着性樹脂層１３，１４中に圧入し、第３支持基体１１および第４支持基体１２に対接して、先端が潰された形になって貫通する導体部１０′を備えた多層型積層板１５を得た。
【００２４】
前記多層型積層板１５の両面の電解銅箔（第３の支持基体１１および第４支持基体１２）について、前記と同様にフオトエッチング処理をそれぞれ施して、図１（ｆ）に断面的に示すような、多層配線型の印刷配線板１６を作製した。この多層配線型の印刷配線板１６の製造過程で、テスターによって各導体部６′，１０′を表裏面から導通テストしたところ、全数が０．０１Ω以下の抵抗であった。図中１１′，１２′は配線パターンである。
【００２５】
なお、前記では、第１の支持基体５の一主面に導体バンプ６を設けたが、予め配線パターン化したものを第１の支持基体５とし、この配線パターンの形成された面に導体バンプ６を設けた構成を採ることも可能であった。
【００２６】
実施例２
図２（ａ）〜（ｆ）は本実施例の実施態様を模式的に示したものである。先ず、厚さ３５μｍの電解銅箔を第１の支持基体５として、ポリマータイプの銀系の導電性ペースト（商品名，熱硬化性導電性ペーストＤＷ−２５０Ｈ−５，製造元：東洋紡績ＫＫ）、および板厚の２００μｍのステンレス板の所定箇所に０．４ｍｍ径の穴を明けたメタルマスクをそれぞれ用意した。そして、前記電解銅箔（第１の支持基体）５面に、前記メタルマスクを位置決め配置して導電性ペーストを印刷し、この印刷された導電性ペーストが乾燥後、同一マスクを用い同一位置に再度印刷する方法で３回印刷を繰り返し、高さ２００μｍ弱の山形の導体パンブ６を形成（形設）した。その後、前記導体パンブ６を形成した第１の支持基体５面に、スピンコート法によって、厚さ１５０μｍ程度のエポキシ樹脂層８を被着・形成した。
【００２７】
次いで、予め用意しておいた、同じく厚さ３５μｍの電解銅箔を第２支持基体７を、図２（ａ）に断面的に示すごとく、前記エポキシ樹脂層８を設けた第１支持基体５面に対向させて、配置して積層体化した。その後、前記第１の支持基体５および第２支持基体７裏面に、それぞれポリイミド樹脂フィルムを当て板として積層・配置し、樹脂圧として１ＭＰａで加圧し、そのまま取りだし、表裏の当て板を剥離したところ、図１（ｂ）に断面的に示すごとく、前記絶縁・接着性樹脂層８中を貫挿する導体バンプ６が、第２支持基体７に対接して、先端が潰された形になって貫通する導体部６′を備えた積層板を得た。
【００２８】
前記積層板の両面の電解銅箔（第１の支持基体５および第２支持基体７）について、通常のエッチングレジストインク（商品名，ＰＳＲ−４０００Ｈ，製造元：太陽インキＫＫ）をスクリーン印刷し、導体パターン部をマスクしてから、塩化第２銅をエッチング液としてエッチング処理後、レジストマスク剥離して、図１（ｃ）に断面的に示すような、両面配線型の印刷配線板９を作製した。この両面配線型の印刷配線板９の両面配線パターン５′，７′の所定面に、前記第１の支持基体５面へ導電性バンプ６を形成した場合と同様な手段で、導体バンプ１０をそれぞれ設けた。また、前記導体バンプ１０を形成した印刷配線板９面に、前記と同様の手段で、それぞれ絶縁・接着性樹脂層１３，１４を設けた。
【００２９】
その後、前記導体バンプ１０および絶縁・接着性樹脂層１３，１４を設けた両面配線型の印刷配線板９に、予め用意しておいた、厚さ３５μｍの２枚の電解銅箔（第３の支持基体１１，第４の支持基体１２）を、図１（ｄ）に断面的に示すごとく配置して積層体化した。この積層体について、第３の支持基体１１および第４支持基体１４裏面に、それぞれポリイミド樹脂フィルムを当て板として積層・配置し、樹脂圧として１ＭＰａで加圧し、そのまま取りだし、表裏の当て板を剥離したところ、図１（ｅ）に断面的に示すように、前記絶縁・接着性樹脂層１３，１４中を貫挿する導体バンプ１０が、第３支持基体１１および第４支持基体１２に対接して、先端が潰された形になって貫通する導体部１０′を備えた多層型積層板１５を得た。
【００３０】
前記多層型積層板１５の両面の電解銅箔（第３の支持基体１１および第４支持基体１２）について、前記と同様にフオトエッチング処理をそれぞれ施して、図１（ｆ）に断面的に示すような、多層配線型の印刷配線板１６を作製した。この多層配線型の印刷配線板１６の製造過程で、テスターによって各導体部６′，１０′を表裏面から導通テストしたところ、全数が０．０１Ω以下の抵抗であった。図中１１′，１２′は配線パターンである。
【００３１】
なお、前記では、両面配線型の印刷配線板９に導体バンプ１０および絶縁・接着性樹脂層１３，１４を設けたが、両面配線型の印刷配線板９に絶縁・接着性樹脂層１３，１４を設け、第３の支持基体１１および第４支持基体１２面に導体バンプ１０を設けた形でも、多層型積層板１５を製造し得る。また、両面配線型の印刷配線基板９に導体バンプ１０および絶縁接着性樹脂層１３，１４を設けたが、第３の支持基体１１および第４の支持基体１２に導体バンプ１０および絶縁接着性樹脂層１３，１４を設けた形でも、多層型積層板１５を製造し得る。
【００３２】
本発明は、上記実施例に限定されるものでなく、発明の趣旨を逸脱しない範囲でいろいろの変形を採り得る。たとえば、前記では絶縁・接着性樹脂としてエポキシ樹脂の使用例を示したが、エポキシ樹脂の代わりにポリエーテルイミド樹脂などを用いてもよいし、また配線パターン層の接続もヴィアホール型だけでなく、ヴィアホール型およびスルホール型の並立型でもよい。
【００３３】
【発明の効果】
本発明によれば、パターン層間を接続する導体バンプを形設する工程、絶縁・接着性樹脂層を形成，介在させて熱プレスする工程、外層パターニングする工程というプロセスの簡略化、換言すると製造工程数を従来の製造方法に比べ格段に少ない工程に低減しながら、強固もしくは緻密に一体化した両面型印刷配線板もしくは多層型印刷配線板を容易に製造することが可能となる。特に工程の繰り返しが多い多層型印刷配線板の製造においては、大幅な工程数の低減となり、生産性ないし量産性の向上に効果がある。また、絶縁・接着性樹脂を層間絶縁層としたことにより、配線パターン層および層間配線部の接続の信頼性なども大幅に改善され、すぐれた機能的の確保も可能となる。
【００３４】
加えて、従来の多層型印刷配線板などの製造工程で、必要不可欠であった穴明け工程、メッキ工程が不要になることに伴い、製造工程で発生する不良が大幅に抑えられ、歩留まりが向上するばかりでなく、信頼性の高い印刷配線板が得られることになる。また、製造される印刷配線板は、層間接続用の穴が表面に存在しないので、配線密度の格段な向上を図り得るし、電子部品の実装用エリアも、穴の位置に関係なく設定し得ることになり、実装密度も格段に向上し、ひいては実装電子部品間の距離を短縮できるので、回路の性能向上をも図り得る。つまり、本発明は、印刷配線板の低コス化に寄与するだけでなく、実装回路装置のコンパクト化や、高性能化などにも大きく寄与するものといえる。
【図面の簡単な説明】
【図１】本発明の第１の実施態様例を模式的に示すもので、（ａ）は導体バンプを形設した第１の支持基体と絶縁・接着性樹脂層を設けた第２の支持基体とを積層配置する状態を示す断面図、（ｂ）は熱プレスにより積層一体化した積層板を示す断面図、（ｃ）は両面支持基体をパターニングして両面配線型化した状態を示す断面図、（ｄ）は導体バンプを形設した両面配線型と絶縁・接着性樹脂層をそれぞれ設けた第３の支持基体，第４の支持基体とを積層配置する状態を示す断面図、（ｅ）熱プレスにより積層一体化した多層型積層板を示す断面図、（ｆ）は多層型積層板の両面を配線型化した多層型配線板の断面図。
【図２】本発明の第２の実施態様例を模式的に示すもので、（ａ）は導体バンプおよび絶縁・接着性樹脂層を設けた第１の支持基体と第２の支持基体とを積層配置する状態を示す断面図、（ｂ）は熱プレスにより積層一体化した積層板を示す断面図、（ｃ）は両面支持基体をパターニングして両面配線型化した状態を示す断面図、（ｄ）は面面に導体バンプおよび絶縁・接着性樹脂層を設けた両面配線型と第３の支持基体，第４の支持基体とを積層配置する状態を示す断面図、（ｅ）熱プレスにより積層一体化した多層型積層板を示す断面図、（ｆ）は多層型積層板の両面を配線型化した多層型配線板の断面図。
【図３】ビルドアップ法で構成した多層印刷配線板の構造を示す断面図。
【符号の説明】
１……絶縁性支持基体２ａ……第１の配線パターン層２ｂ……第２の配線パターン層３……層間絶縁層４……ブラインドホール５……第１の支持基体５′，７′，１１′，１２′……配線パターン６，１０……導体バンプ６′，１０′……導体部７……第２の支持基体
８，１３１４，……絶縁・接着性樹脂層９……両面型印刷配線板１１……第３の支持基体１２……第４の支持基体１５……多層型積層板
１６……多層型印刷配線板[0001]
[Industrial applications]
The present invention relates to a method for manufacturing a printed wiring board, and more particularly to a method for manufacturing a highly reliable printed wiring board with a high yield while enabling high-density wiring and mounting, while reducing man-hours.
[0002]
[Prior art]
For example, in a double-sided printed wiring board or a multilayer printed wiring board, electrical connection between wiring layers such as double-sided conductive patterns is performed as follows. For example, in the case of a double-sided printed wiring board, first, a drilling process (piercing process) is performed at a predetermined position on a double-sided copper foil-clad board. Next, the entire surface including the inner wall surface of the drilled hole is subjected to chemical plating, and then the surface is further plated by electroplating. Connection.
[0003]
In the case of a multilayer printed wiring board, first, copper foils stretched on both sides of the substrate are respectively patterned. Thereafter, a copper foil is laminated and arranged on the patterning surface via an insulating sheet (for example, prepreg), and integrated by heating and pressing. Next, as in the case of the double-sided printed wiring board described above, electrical connection between wiring layers is performed by drilling and plating. After the connection between the wiring layers, a multilayer printed wiring board is obtained by patterning the surface copper foil. In the case of a multilayer printed wiring board having more wiring layers, it can be manufactured by a method of increasing the number of double-sided printed wiring boards interposed in the middle.
[0004]
Further, a build-up method is also known as a means for manufacturing a multilayer printed wiring board having a configuration shown in cross section in FIG. 3, reference numeral 1 denotes an insulating support substrate, 2a denotes a first wiring pattern layer, 3 denotes an interlayer insulating resin layer, 4 denotes a fine hole (blind hole) provided in the interlayer insulating resin layer 3, and 2b denotes a second wiring. The first wiring pattern layer 2a and the second wiring pattern layer 2b are pattern layers, and are electrically connected by blind holes 4. In this build-up method, a copper-clad laminate using a glass-epoxy resin support substrate 1 as a raw material is usually used. First, the copper layer is subjected to, for example, a photo-etching process to form a first wiring pattern. The layer 2a is formed. Next, for example, a photosensitive epoxy resin is applied on the entire surface of the first wiring pattern layer 2a forming surface, and the photosensitive epoxy resin layer (forming the interlayer insulating resin layer 3) is selectively irradiated with ultraviolet light or the like. After that, a development process is performed to selectively expose the one wiring pattern layer 2a (formation of the blind hole 4). After that, the surface of the photosensitive epoxy resin layer 3 is roughened by, for example, a chemical treatment, and then a conductive metal layer is entirely formed by chemical plating, if necessary, further using electroplating. The deposited conductive metal layer is subjected to, for example, a photoetching process to form the second wiring pattern layer 2b, and at the same time, to perform connection by the blind hole 4.
[0005]
In the method of manufacturing a printed wiring board, a method of making an electrical connection between wiring layers without depending on a plating method is also known. That is, a hole is drilled at a predetermined position on the double-sided copper foil-clad substrate, a conductive paste is poured into the hole by a printing method or the like, and a resin component of the conductive paste poured into the hole is cured to electrically connect the wiring layers. There are also ways to do that.
[0006]
[Problems to be solved by the invention]
As described above, in a method of manufacturing a printed wiring board using a plating method for electrical connection between wiring layers, a hole is formed in a substrate for electrical connection between wiring layers. There is a disadvantage that a plating process including the inner wall surface of the hole is required, the manufacturing process of the printed wiring board is redundant, and the process management is complicated. In particular, in the build-up method, a conductor layer is formed in the fine blind hole 4, but copper cannot be uniformly deposited on the inner wall surface of the blind hole 4 having no through hole. That is, it is practically very difficult to form a required conductive layer on the inner wall surface of the fine blind hole 4 with good reproducibility, and there is a problem in reliability.
[0007]
Further, when the insulating resin layer between the layers is formed of a UV-curable resin, not only is the electrical insulation property, heat resistance and chemical resistance generally inferior, but also the adhesion to the plated metal film is inferior. It is impossible to improve the performance of printed wiring boards.
[0008]
On the other hand, a method of embedding a conductive paste in a hole for electrical connection between wiring layers by printing or the like also requires a drilling step as in the case of the plating method. In addition, it is difficult to uniformly (uniformly) pour and embed the conductive paste into the formed hole, and there is a problem in reliability of electrical connection. In any case, the necessity of the perforation step and the like is reflected in the cost and yield of the printed wiring board, and has a drawback that it is impossible to meet the demand for cost reduction and the like. Further, in the case of the electrical connection configuration between the wiring layers, since conductor holes for connecting the wiring layers are provided on the front and back surfaces of the printed wiring board, wiring is formed and arranged in the region of the conductor holes. However, since it is impossible to mount electronic components, there is a problem that the improvement of the wiring density is restricted and the improvement of the mounting density of the electronic components is hindered.
[0009]
In any case, the printed wiring board obtained by the conventional manufacturing method cannot sufficiently respond to the demand for compact circuit devices by high-density wiring and high-density mounting and, consequently, downsizing of electronic devices. Therefore, there is a demand for a method of manufacturing a printed wiring board which is practically more effective including the above cost.
[0010]
SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and the yield of a highly reliable printed wiring board in which a required insulation property and a required electrical connection between wiring pattern layers are reliably ensured by a simple process. The purpose is to provide a method that can be manufactured well.
[0011]
A first method of manufacturing a printed wiring board according to the present invention comprises forming a conductive bump group at a predetermined position on a main surface of a first support base; Forming an insulating / adhesive resin layer of a required thickness on the conductor bump forming surface of the support base or at least one principal surface of the second support base; Stacking and arranging a second support base in contact with the surface via an insulating / adhesive resin layer to form a stacked body, and pressing the stacked body to obtain a thickness of the insulating / adhesive resin layer. A step of forming a conductor portion connecting the first support base and the second support base in such a manner that the front ends of the bumps are inserted through the bumps in the vertical direction.
[0012]
In a second method of manufacturing a printed wiring board according to the present invention, a step of forming a conductive bump group at a predetermined position on a main surface of a first conductive support base; and a step of forming a conductive bump group on the first conductive support base. Forming an insulating / adhesive resin layer having a required thickness on at least one main surface of the second conductive support base; and forming a conductive bump on the first conductive support base. Forming a laminate by laminating and arranging the second conductive support base in contact with each other via an insulating / adhesive resin layer, and pressing the laminate to form the insulating / adhesive resin layer. Forming a conductor portion for electrically connecting between a first conductive support base and a second conductive support base by penetrating the tip portions of the bumps in the thickness direction of the bump; Patterning the conductive support base of the laminate in which the portion is formed, and connecting to the conductor portion Characterized in that formed by and forming a turn.
[0013]
In the present invention, examples of the support base on which the conductor bump group is formed include synthetic resin sheets having good releasability, and conductive sheets (foil). The supporting base may be a single sheet or a patterned base, and the shape is not particularly limited. Further, the conductor bump group may be formed not only on one main surface but also on both main surfaces.
[0014]
Here, the conductive bumps are made of a conductive powder such as silver, gold, copper, or solder powder, an alloy powder or a composite (mixed) metal powder thereof, for example, a polycarbonate resin, a polysulfone resin, a polyester resin, a phenoxy resin, or a phenol. It is composed of a conductive composition prepared by mixing a binder component such as a resin or a polyimide resin, or a conductive metal. When the bump group is formed of a conductive composition, a bump having a high aspect ratio can be formed by, for example, a printing method using a relatively thick metal mask. , 50 to 400 μm, and the height of the bumps may be a mixture of a height capable of penetrating one synthetic resin sheet and a height capable of penetrating a plurality of layers of synthetic resin sheets.
[0015]
On the other hand, the means for forming the conductive metal bumps include: (a) spraying a minute metal soul having a certain shape or size on a support substrate surface provided with an adhesive layer in advance, and selectively (B) When a copper foil or the like is used as a support base, a plating resist is printed and patterned to form copper, tin, gold, silver, solder, or the like. (C) Applying and patterning a solder resist on the surface of the supporting substrate and immersing it in a solder bath to selectively form small metal pillars (bumps) And the like. Here, the minute metal soul or minute metal pillar corresponding to the bump may have a multilayer structure or a multilayer shell structure formed by combining different kinds of metals. For example, copper may be used as a core and the surface may be coated with a layer of gold or silver to provide oxidation resistance, or copper may be used as a core and the surface may be coated with a solder layer to provide solder bonding properties.
[0016]
In the present invention, when the conductive bump group is formed of a conductive composition, the steps and the like can be further simplified as compared with the case where the conductive bump group is formed by a method such as a plating method, which is effective in terms of cost reduction.
[0017]
In the present invention, as the insulating / adhesive resin into which the conductor bump group is inserted to form a penetrating-type conductor, for example, polycarbonate resin, polysulfone resin, polyetherimide resin, thermoplastic polyimide resin, tetrafluoride A thermoplastic resin such as a polyethylene resin, a tetrafluoropolyethylene resin, a hexafluoropropylene resin, a polyetheretherketone resin, a vinyl chloride resin, and a polyethylene resin is first mentioned. A thermosetting resin capable of forming a required insulating / adhesive resin layer on the surface of the supporting base in a so-called B-stage state, such as an epoxy resin, a bismaleimide triazine resin, a polyimide resin, a phenol resin, a polyether resin, Melamine resin or unvulcanized (raw rubber) butadiene rubber, butyl rubber, natural rubber, neoprene rubber, silicone rubber and the like can also be used. Furthermore, these may be a copolymer system or a mixed system, a form in which an inorganic oxide such as glass cloth or mat, or an organic substance such as paper is combined, or a system in which an inorganic oxide powder is added or contained. Good. The insulating / adhesive resin layer can be formed by, for example, a screen printing method, a casting roller coating method, a spinner coating method, or the like. The thickness of the insulating / adhesive resin layer depends on the printed wiring board to be manufactured. Generally, it is preferably about 50 to 800 μm, although it varies depending on the kind and use.
[0018]
Further, in the present invention, a laminated body obtained by laminating another supporting base on a main surface of a supporting base or the like on which a bump group is formed via an insulating / adhesive resin layer as it is or by heating. When pressing, it is preferable to use a metal plate or a heat-resistant resin plate having a small size or deformation, such as a stainless steel plate, a brass plate, a polyimide resin plate (sheet), a polytetrafluoroethylene resin plate (sheet), as the backing plate. When pressurizing the laminated body and applying pressure in a state where the insulating / adhesive resin layer is softened by heating and allowing the bumps to penetrate, more favorable penetration of the bumps can be achieved.
[0019]
[Action]
According to the method of manufacturing a printed wiring board according to the present invention, the conductors between the layers electrically connecting the wiring layers are insulated and bonded to form an interlayer insulating layer by heating and pressing in a so-called lamination and integration process. The highly reliable electrical connection between the wiring layers is reliably achieved by the plasticization of the conductive resin and the press-fitting of the conductive bumps on the support base surface. In other words, a highly accurate and highly reliable electrical connection can be formed at an arbitrary position (location) between the fine wiring pattern layers while simplifying the process. It can be manufactured at low cost. In addition, since the interlayer insulating layer is formed of an insulating / adhesive resin, strong integration between wiring pattern layers can be easily ensured together with its curing (solidification) shrinkage. Furthermore, since there is no need to form connection holes for electrical connection between the wiring pattern layers, a printed wiring board capable of high-density wiring and high-density mounting can be obtained.
[0020]
【Example】
Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 (a) to (f) and FIGS. 2 (a) to (f).
[0021]
Example 1
FIGS. 1A to 1F schematically show an embodiment of the present embodiment. First, a 35 μm-thick electrolytic copper foil was used as the first support base 5, using a polymer type silver-based conductive paste (trade name, thermosetting conductive paste DW-250H-5, manufacturer: Toyobo Co., Ltd.), A metal mask having a hole of 0.4 mm in diameter at a predetermined position of a stainless steel plate having a thickness of 200 μm was prepared. Then, on the surface of the electrolytic copper foil (first supporting base) 5, the metal mask is positioned and arranged, and a conductive paste is printed. After the printed conductive paste is dried, the conductive mask is placed at the same position using the same mask. Printing was repeated three times by a printing method again to form (form) a mountain-shaped conductor pump 6 having a height of less than 200 μm. On the other hand, an electrolytic copper foil having a thickness of 35 μm was used as the second support base 7, and an epoxy resin layer 8 having a thickness of about 100 μm was formed on one main surface of the second support base 7 by spin coating. .
[0022]
Next, as shown in cross section in FIG. 1A, the first support base 5 provided with the conductor tub 6 is attached to the surface of the second support base 7 provided with the epoxy resin layer 8 and the epoxy resin layer 8. The conductor pump 6 was arranged so as to be opposed, and a laminate was formed. Then, a polyimide resin film was laminated and arranged on the back surface of the first support base 5 and the second support base 7 as a backing plate, respectively, and pressed at 1 MPa as a resin pressure, taken out as it was, and the front and back backing plates were peeled off. However, as shown in cross section in FIG. 1B, the conductor bump 6 is press-fitted into the insulating / adhesive resin layer 8, comes into contact with the second support base 7, and has a crushed tip. To obtain a laminated plate having a conductor portion 6 'penetrating therethrough.
[0023]
Screen printing of an ordinary etching resist ink (trade name, PSR-4000H, manufacturer: Taiyo Ink KK) on the electrolytic copper foils (first support base 5 and second support base 7) on both sides of the laminate, After masking the conductive pattern portion, etching treatment is performed using cupric chloride as an etchant, and the resist mask is peeled off to produce a double-sided wiring type printed wiring board 9 as shown in cross section in FIG. did. The conductor bumps 10 are respectively formed on predetermined surfaces of the double-sided wiring patterns 5 'and 7' of the double-sided wiring type printed wiring board 9 by the same means as in the case where the conductor bumps 6 are formed on the first support base 5 surface. Provided. Also, by the same means as when the insulating / adhesive resin layer 8 is provided on the second support base 7, two electrolytic copper foils (third and fourth support bases) 11 and 12 Those provided with insulating and adhesive resin layers 13 and 14, respectively, were prepared. Thereafter, the third support base 11 and the fourth support base 12 provided with the insulating and adhesive resin layers 13 and 14 are mounted on the double-sided wiring type printed wiring board 9 provided with the conductor bumps 10 as shown in FIG. ) To form a laminate. With respect to this laminated body, a polyimide resin film is laminated and arranged on the back surface of the third support substrate 11 and the fourth support substrate 14 as a backing plate, respectively, and is pressed at 1 MPa as a resin pressure. 1 (e), the conductor bump 10 is pressed into the insulating / adhesive resin layers 13 and 14, and comes into contact with the third support base 11 and the fourth support base 12. Thus, a multilayer laminate 15 having a conductor portion 10 'penetrating in a crushed shape was obtained.
[0024]
The electrolytic copper foils (the third support base 11 and the fourth support base 12) on both surfaces of the multilayer laminate 15 are each subjected to photoetching in the same manner as described above, and are shown in cross section in FIG. Such a multilayer wiring type printed wiring board 16 was produced. In the process of manufacturing the multilayer wiring type printed wiring board 16, a continuity test was performed on each of the conductor portions 6 'and 10' from the front and back surfaces by a tester. In the figure, 11 'and 12' are wiring patterns.
[0025]
In the above description, the conductor bumps 6 are provided on one main surface of the first support base 5. However, the first support base 5 is preliminarily formed into a wiring pattern, and the conductor bumps 6 are formed on the surface on which the wiring pattern is formed. 6 could be adopted.
[0026]
Example 2
2A to 2F schematically show an embodiment of the present embodiment. First, a 35 μm-thick electrolytic copper foil was used as the first support base 5, using a polymer type silver-based conductive paste (trade name, thermosetting conductive paste DW-250H-5, manufacturer: Toyobo Co., Ltd.), A metal mask having a hole of 0.4 mm in diameter at a predetermined position of a stainless steel plate having a thickness of 200 μm was prepared. Then, on the surface of the electrolytic copper foil (first supporting base) 5, the metal mask is positioned and arranged, and a conductive paste is printed. After the printed conductive paste is dried, the conductive mask is placed at the same position using the same mask. Printing was repeated three times by a printing method again to form (form) a mountain-shaped conductor pump 6 having a height of less than 200 μm. Thereafter, an epoxy resin layer 8 having a thickness of about 150 μm was formed on the surface of the first support base 5 on which the conductor pump 6 was formed by spin coating.
[0027]
Next, as previously shown in FIG. 2 (a), a second support base 7 made of an electrolytic copper foil having a thickness of 35 μm and a first support base 5 provided with the epoxy resin layer 8 is also provided. It was arranged facing the surface to form a laminate. Then, a polyimide resin film was laminated and arranged on the back surface of the first support base 5 and the second support base 7 as a backing plate, respectively, and pressed at 1 MPa as a resin pressure, taken out as it was, and the front and back backing plates were peeled off. However, as shown in cross section in FIG. 1B, the conductive bump 6 penetrating through the insulating / adhesive resin layer 8 comes into contact with the second support base 7 and has a crushed tip. To obtain a laminated plate having a conductor portion 6 'penetrating therethrough.
[0028]
Screen printing of an ordinary etching resist ink (trade name, PSR-4000H, manufacturer: Taiyo Ink KK) on the electrolytic copper foils (first support base 5 and second support base 7) on both sides of the laminate, After masking the conductive pattern portion, etching treatment is performed using cupric chloride as an etchant, and the resist mask is peeled off to produce a double-sided wiring type printed wiring board 9 as shown in cross section in FIG. did. The conductive bumps 10 are formed on the predetermined surfaces of the double-sided wiring patterns 5 ', 7' of the double-sided wiring type printed wiring board 9 by the same means as when the conductive bumps 6 are formed on the surface of the first support base 5. Each was provided. Insulating / adhesive resin layers 13 and 14 were provided on the surface of the printed wiring board 9 on which the conductor bumps 10 were formed by the same means as described above.
[0029]
Thereafter, two 35 μm-thick electrolytic copper foils (third prepared) were prepared in advance on a double-sided wiring type printed wiring board 9 provided with the conductor bumps 10 and the insulating / adhesive resin layers 13 and 14. The support base 11 and the fourth support base 12) were arranged as shown in cross section in FIG. About this laminated body, a polyimide resin film is laminated and arranged as a backing plate on the back surface of the third support base 11 and the fourth support base 14, respectively, and is pressed at 1 MPa as a resin pressure. When peeled off, as shown in cross section in FIG. 1E, the conductor bumps 10 penetrating through the insulating and adhesive resin layers 13 and 14 correspond to the third support base 11 and the fourth support base 12. In contact therewith, a multi-layer laminate 15 having a conductor portion 10 'penetrating with its tip crushed was obtained.
[0030]
The electrolytic copper foils (the third support base 11 and the fourth support base 12) on both surfaces of the multilayer laminate 15 are each subjected to photoetching in the same manner as described above, and are shown in cross section in FIG. Such a multilayer wiring type printed wiring board 16 was produced. In the process of manufacturing the multilayer wiring type printed wiring board 16, a continuity test was performed on each of the conductor portions 6 'and 10' from the front and back surfaces by a tester. In the figure, 11 'and 12' are wiring patterns.
[0031]
In the above description, the conductive bumps 10 and the insulating / adhesive resin layers 13 and 14 are provided on the double-sided wiring type printed wiring board 9, but the insulating / adhesive resin layers 13 and 14 are provided on the double-sided wiring type printed wiring board 9. And the conductive bumps 10 are provided on the surfaces of the third support base 11 and the fourth support base 12, the multilayer laminate 15 can be manufactured. Although the conductor bumps 10 and the insulating adhesive resin layers 13 and 14 are provided on the double-sided wiring type printed wiring board 9, the conductor bumps 10 and the insulating adhesive resin are provided on the third support base 11 and the fourth support base 12. Even in the form in which the layers 13 and 14 are provided, the multilayer laminate 15 can be manufactured.
[0032]
The present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the invention. For example, in the above, an example of using an epoxy resin as the insulating / adhesive resin was shown, but a polyetherimide resin or the like may be used instead of the epoxy resin, and the connection of the wiring pattern layer is not limited to the via hole type. , Via-hole type and through-hole type.
[0033]
【The invention's effect】
According to the present invention, a process of forming conductive bumps for connecting between pattern layers, a process of forming and interposing an insulating / adhesive resin layer, hot pressing, and a process of outer layer patterning are simplified, in other words, a manufacturing process. It is possible to easily manufacture a double-sided printed wiring board or a multilayer printed wiring board that is firmly or densely integrated, while reducing the number to significantly fewer steps as compared with the conventional manufacturing method. Particularly, in the production of a multilayer printed wiring board in which steps are frequently repeated, the number of steps is greatly reduced, which is effective in improving productivity or mass productivity. In addition, since the insulating / adhesive resin is used as the interlayer insulating layer, the reliability of the connection between the wiring pattern layer and the interlayer wiring portion is greatly improved, and excellent functions can be secured.
[0034]
In addition, drilling and plating processes, which were essential in the manufacturing process of conventional multilayer printed wiring boards, are no longer required, significantly reducing defects in the manufacturing process and improving yield. In addition, a highly reliable printed wiring board can be obtained. Further, since the printed wiring board to be manufactured has no holes for interlayer connection on the surface, the wiring density can be remarkably improved, and the mounting area of the electronic component can be set regardless of the position of the hole. As a result, the mounting density is remarkably improved, and the distance between the mounted electronic components can be shortened, so that the performance of the circuit can be improved. That is, it can be said that the present invention not only contributes to cost reduction of the printed wiring board, but also greatly contributes to downsizing and high performance of the mounted circuit device.
[Brief description of the drawings]
FIG. 1 schematically shows a first embodiment of the present invention, in which (a) shows a first support base on which a conductor bump is formed and a second support provided with an insulating / adhesive resin layer. FIG. 3B is a cross-sectional view showing a state in which the substrates are stacked and arranged. FIG. 4B is a cross-sectional view showing a laminated plate laminated and integrated by hot pressing. FIG. FIG. 4D is a cross-sectional view showing a state in which a double-sided wiring type in which a conductor bump is formed, and a third support base and a fourth support base each provided with an insulating / adhesive resin layer are stacked; FIG. 4 is a cross-sectional view showing a multilayered laminated board laminated and integrated by hot pressing. FIG. 5F is a cross-sectional view of a multilayered wiring board in which both surfaces of the multilayer laminated board are formed into a wiring type.
FIG. 2 schematically shows a second embodiment of the present invention, wherein (a) shows a first support base and a second support base provided with conductor bumps and an insulating / adhesive resin layer. (B) is a cross-sectional view showing a laminated plate laminated and integrated by hot pressing; (c) is a cross-sectional view showing a state in which a double-sided support substrate is patterned to form a double-sided wiring; d) is a cross-sectional view showing a state in which a double-sided wiring type provided with conductor bumps and an insulating / adhesive resin layer on the surface, a third support base, and a fourth support base are stacked, and (e) hot pressing. FIG. 3F is a cross-sectional view showing a multi-layered laminated board obtained by laminating and unifying, and FIG. 4F is a cross-sectional view of a multi-layered wiring board in which both surfaces of the multi-layered laminated board are formed into a wiring type.
FIG. 3 is a sectional view showing a structure of a multilayer printed wiring board formed by a build-up method.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Insulating support base 2a ... 1st wiring pattern layer 2b ... 2nd wiring pattern layer 3 ... Interlayer insulating layer 4 ... Blind hole 5 ... 1st support base 5 ', 7', 11 ', 12' ... wiring pattern 6, 10 ... conductor bump 6 ', 10' ... conductor part 7 ... second support base 8, 13 14 ... ... insulating and adhesive resin layer 9 ... both sides Molded printed wiring board 11 Third support base 12 Fourth support base 15 Multilayer laminated board 16 Multilayer printed wiring board

Claims

Forming a conductive bump group with a conductive paste at a predetermined position on the main surface of the first support base;
Forming a holeless insulating and adhesive resin layer of a required thickness on at least one principal surface of the second support base;
Laminating and arranging the conductor bump forming surface of the first support base in contact with the insulating / adhesive resin layer of the second support base to form a laminate;
The laminated body is pressed, and the tip of the conductor bump is inserted in the thickness direction of the insulating / adhesive resin layer by its own rigidity. Forming a conductor portion for connecting between the two supporting bases. 2. A method for manufacturing a printed wiring board, comprising:

Forming a conductive bump group with a conductive paste at a predetermined position on the main surface of the first support base;
Forming an insulating / adhesive resin layer of a required thickness on the conductive bump forming surface of the first support base;
A step of the the first face forming an insulating-adhesive resin layer of the support base, and laminated and arranged with Taise' the one main surface of the second support substrate to form a laminate,
Pressurizing the laminate and forming a conductor portion connecting the first support base and the second support base by plastic deformation of the tip of the conductor bump. Board manufacturing method.

Forming a conductive bump group with a conductive paste at a predetermined position on the main surface of the first conductive support base;
Forming a non-hole insulating and adhesive resin layer of a required thickness on at least one main surface of the second conductive support base;
Laminating and arranging the conductive bump forming surface of the first conductive support base in contact with the insulating / adhesive resin layer of the second conductive support base to form a laminate;
The laminated body is pressurized, and the tip of the conductive bump is inserted in the thickness direction of the insulating / adhesive resin layer by its own rigidity, and the first conductive support base is plastically deformed at the tip. Forming a conductor portion for electrically connecting the second conductive support bases;
Patterning the conductive support base of the laminate having the conductor portion formed thereon to form a wiring pattern connected to the conductor portion.

Forming a conductive bump group with a conductive paste at a predetermined position on the main surface of the first conductive support base;
A step of forming an insulating / adhesive resin layer of a required thickness on the conductive bump forming surface of the first conductive support substrate
Forming a laminate by laminating and disposing a second conductive support base in contact with the surface of the first conductive support base on which the insulating / adhesive resin layer is formed;
Pressing the laminate to form a conductor portion for electrically connecting the first conductive support base and the second conductive support base by plastic deformation of the tip of the conductor bump;
Patterning the conductive support base of the laminate having the conductor portion formed thereon to form a wiring pattern connected to the conductor portion.