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JP3554555B2 - Susceptor support structure - Google Patents
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JP3554555B2 - Susceptor support structure - Google Patents

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JP3554555B2
JP3554555B2 JP2002029119A JP2002029119A JP3554555B2 JP 3554555 B2 JP3554555 B2 JP 3554555B2 JP 2002029119 A JP2002029119 A JP 2002029119A JP 2002029119 A JP2002029119 A JP 2002029119A JP 3554555 B2 JP3554555 B2 JP 3554555B2
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support member
susceptor
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chamber
enlarged diameter
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JP2002373837A (en
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和明 山口
義信 後藤
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NGK Insulators Ltd
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NGK Insulators Ltd
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Description

【0001】
【発明の属する技術分野】
本発明は、サセプターのチャンバーへの取付構造に関するものである。
【0002】
【従来の技術】
半導体製造用途等においては、例えば図6に示すように、セラミックヒーター2をチャンバー10の内側壁面へと取り付ける必要がある。このため、セラミックス板製の筒状の支持部材21の一端21aをセラミックヒーター2の接合面(背面)2bへと取り付け、この支持部材21の他端21cをチャンバー10の内側壁面10dへと取り付けることが行われている。支持部材21は、アルミナ、窒化アルミニウム等の耐熱性のセラミックスによって形成されている。支持部材21の内側空間6とチャンバー10の開口10aとを連通させる。支持部材21とチャンバー10との間はOリング20によって気密に封止する。これによって、支持部材21の内側空間6とチャンバー10の内部空間5との間を気密に封止し、チャンバー10の内部空間5内のガスがチャンバー10の外部へと漏れないようにする。セラミックサセプター2内には、例えば抵抗発熱体4が埋設されている。
【0003】
【発明が解決しようとする課題】
セラミックサセプター2の半導体ウエハー1の設置面(加熱面)2aの温度は、例えば400℃以上、時には600℃以上にも達する。一方、Oリング等のゴム製の封止部材20は高熱には耐えられず、その耐熱温度は通常200℃程度である。このため、チャンバー内に冷却フランジ8を設けることによって、Oリングの周辺を冷却し、Oリングの周辺の温度が200℃以下となるように調節することが好ましい。
【0004】
ところが、セラミックサセプター2の温度が上記のように高くなり、支持部材21の一端21aの温度が例えば400℃を超え、支持部材21の他端21cの温度を200℃以下に冷却したものとすると、支持部材の内部における温度勾配は200℃以上となる。
【0005】
支持部材のサセプターに対する接合強度を向上させるためには、およびガス穴や、端子および熱電対を通すための貫通孔を支持部材21の壁面の内部に設けるためには、支持部材21を肉厚にし、支持部材のサセプターに対する接合面積を増大させる必要がある。しかし、支持部材を肉厚にすると、前述のように支持部材に温度勾配があることから、支持部材を伝搬する熱伝導量が大きくなる。この結果、支持部材の接合部分21aの近辺からの熱伝導の増大によって、加熱面2aにコールドスポットが生ずる。このため、支持部材の本体部分は肉薄にし、支持部材のサセプター側端部に肉厚の拡張部分(フランジ部分)を設けることが有用である。
【0006】
しかし、支持部材の端部に肉厚のフランジ部分を設けると、サセプターを高温に加熱するときに、本体部分とフランジ部分との境界付近に集中する内部応力が過大になる傾向がある。このために、支持部材の破壊を避けるためには、サセプターにおける温度の上限に限界がある。
【0007】
本発明の課題は、被処理物を加熱するためのサセプターと、このサセプターに接合されており、内側空間が設けられている支持部材と、支持部材に接合されている開口が設けられたチャンバーとを備えており、チャンバーの開口と支持部材の内側空間とが連通しており、支持部材の内側空間がチャンバーの内部空間に対して気密に封止されている取付構造において、サセプターから支持部材中へと伝達される熱を抑制すると共に、サセプターを高温にしたときに支持部材に集中する応力を緩和することである。
【0008】
【課題を解決するための手段】
本発明は、被処理物を加熱するためのサセプター、およびこのサセプターに接合されており、内側空間が設けられている支持部材開口が設けられたチャンバーであって、該支持部材とこのチャンバーが接合されており、その開口支持部材の内側空間と連通しているチャンバー、および、チャンバーの内部空間に対して気密に封止されている支持部材の内側空間、を備えている支持構造であって、前記支持部材が、さらに、筒状の本体部分を規定する第1の壁部と、前記支持部材の前記サセプター側の端部に設けられた拡径部を規定する第2の壁部と、前記支持部材の縦断面の外側輪郭において前記本体部分と前記拡径部との間に一つまたは複数の連続したアール部分とを備えており、前記第2の壁部の外表面の部分が前記第1の壁部の外表面の部分と平行であり、前記第1の壁部の半径方向の厚みが前記第2の壁部の半径方向の厚みより小さく、前記支持部材の内表面が前記支持部材の全長さに亘って均一な内径を有することを特徴とするものである。
【0009】
拡径部とは、本体部分に比べて外径が大きくなっている部分を指している。
【0010】
「本体部分と拡径部との間に一つのアール部分が設けられている」とは、本体部分と拡径部との間に、2つ以上のアール部分が設けられている場合を排除することを意図している。アール部の個数は曲率中心の数によって定まる。曲率中心が1つであれば、その曲率中心に対応するアール部も1つである。アール部が2つあれば、各アール部に対応して各曲率中心が存在する。
【0011】
また、本発明においては、本体部分と拡径部との間に、複数のアール部分が連続的に形成されている場合を含む。ここで、複数のアール部分とは、曲率中心の異なる複数のアール部分を意味する。また、複数のアール部分が連続しているとは、複数のアール部分の間に、直線状部、真直部分や段差などのアール部以外の形態を挟むことなしに、複数のアール部が連続的に形成されていることを意味する。この場合には、複数のアール部分の各曲率半径が異なっていても良いし、各曲率半径が同一であってもよい。
【0012】
むろん、拡径部とサセプターとの間に、別途アール部分を設けることは排除されない。
【0013】
図1−図3の実施形態を参照しつつ、本発明を更に説明する。
【0014】
筒状の支持部材7の一端には拡径部7aが設けられており、他端にも拡径部7cが設けられている。拡径部7aの接合面(端面)7eがサセプター2の接合面(背面)2bへと接合されている。支持部材7の他端の拡径部7cの端面7gがチャンバー10の内側壁面10dへと接合されている。支持部材7の内側空間6とチャンバー10の開口10aとが連通している。支持部材7とチャンバー10との間はOリング20によって気密に封止する。7dは支持部材7の縦断面の内側輪郭であり、7fは外側輪郭である。
【0015】
支持部材とサセプターとの接合方法は特に限定されず、例えばろう材によって接合でき、あるいは特開平8−73280号公報に記載のようにして固相接合または固液接合できる。サセプター2の加熱面2aの最高温度は、例えば400℃以上、時には600℃以上、1200℃以下に達する。
【0016】
チャンバー10の外側空間11、チャンバー10の開口10aおよび支持部材7の内側空間6が連通しており、チャンバー10の内部空間5とは隔離されている。チャンバー10内に冷却フランジ8を設けることによって、封止部材20の周辺を冷却し、封止部材20の周辺の温度が230℃以下となるように調節している。
【0017】
支持部材7は、筒状の本体部分7bと、サセプター側の拡径部7aと、チャンバー側の拡径部7cとを備えている。本発明は、本体部分7bから拡径部7aへと至る、支持部材7の縦断面の外側輪郭7fに関するものである。
【0018】
即ち、本例では、図2、3に示すように、本体部分の外側輪郭は略真直であり、拡径部7aの外側面16も略真直であり、支持部材7の中心軸Aに対して略平行である。支持部材7の外側輪郭を見ると、本体部分7bからサセプター2へと向かって、アール部分13(13A、13B)、真直部14、角15、拡径部7aの外側面16、アール部分17、サセプターの背面18が順に形成されている。なお、Rはアール部分13(13A、13B)の曲率半径であり、REはアール部分17の曲率半径である。
【0019】
本発明者は、前述した拡径部近辺における応力集中を緩和する構造を検討していく過程で、例えは図1−図3に示したような特定形態が特に有効であることを発見した。即ち、本体部分7bと拡径部7aとの間に一つのアール部分13(13A、13B)を設けた場合に、特に支持部材の内部応力が減少し、かつ支持部材7のチャンバー10側の端部7cの温度を最も低く抑制できることを見出した。
【0020】
本発明者は、他の複数の形態についても詳細に検討を加え、支持部材の内部応力のシミュレーションを行った。例えば、図5に示すような形態の支持部材7Aを検討した。この例では、本体部分7fと拡径部7aの外側面16との間に、第一のアール部分21、真直部22、角23、真直部24、第二のアール部分25、真直部26、角15が設けられている。R1、R2は、それぞれアール部分21、25の各曲率半径である。本発明者は、このように本体部分7fと拡径部7aとの間に複数のアール部分を設け、各アール部分の曲率半径を種々変更することで、支持部材の内部応力の低減を図った。しかし、実際のシミュレーション結果によると、本体部分7fと拡径部7aとの間に単一のアール部分を設けることによって、多数のアール部分を設けて応力を分散させた場合に比べて、支持部材における内部応力の最大値が著しく低下することを発見し、本発明に到達した。
【0021】
アール部分13の曲率半径は限定されないが、支持部材における内部応力を低減するという観点から、3mm以上とすることが好ましく、5mm以上とすることが更に好ましく、10mm以上とすることが一層好ましい。
【0022】
また、アール部分の曲率半径が大きくなると、支持部材を伝達される熱が多くなる傾向がある。例えは、図3においては、実線で示すアール部分13Aの曲率半径Rは相対的に小さく、点線で示すアール部分13Bの曲率半径Rは相対的に大きい。支持部材7における内部応力を低減するという観点からは、曲率半径が大きいアール部分13Bの方が好適である。しかし、アール部分の曲率半径が大きいと、それだけ支持部材の横断面の面積が大きくなり、支持部材の他端の拡径部7c(図1参照)近辺の温度が上昇する傾向がある。こうした支持部材のチャンバー側端部における温度を低減するという観点からは、アール部分13の曲率半径30mm以下が好ましく、25mm以下が更に好ましく、20mm以下が最も好ましい。アール部分13の曲率半径の最も好適な範囲は14−16mmである。
【0023】
本発明の好適な実施形態においては、例えば図3に示すように、支持部材7の縦断面の外側輪郭7fにおいて、拡径部7aと湾曲部分13A(13B)との間に、支持部材7の中心軸Aに対して交差する方向に延びる真直部14を設ける。この真直部14を設けることによって、拡径部7aの厚さを十分に大きくでき、あるいは、本体部分7bの厚さを十分に小さくできる。例えば図3において直線状部を設けないと、拡径部7aの厚さは著しく小さい設計になる。
【0024】
真直部14のAに対する傾斜角度θは限定されないが、上記の観点から、45−90度とすることが好ましい。
【0025】
また、好適な実施形態においては、支持部材7の縦断面の外側輪郭7fにおいて、拡径部7aとサセプター2の表面18との間に他のアール部分17が設けられている。
【0026】
この際、図2、3に示すように、他のアール部分17の少なくとも一部がサセプターに形成されていることが好ましい。言い換えると、サセプター2の表面18と接合面7eとの間に段差aが生じていることが好ましい。これによって、接合部分における応力集中を最大限緩和できる。
【0027】
本発明においては、図4に示すように、接合面7eとサセプター2の表面(露出面)18との間に段差が生じないようにすることもできる。ただし、この場合には、アール部分17Aを形成すると、アール部分17Aにおける支持部材の厚さが非常に小さくなり、かつ異形となる。このため、アール部分17Aの近辺に応力が集中し易くなり、あるいは剥離の起点となり易い。
【0028】
他のアール部分17、17Aの曲率半径REは、接合部分における応力を最小限とするという観点からは1mm以上が好ましく、2mm以上が更に好ましい。
【0029】
段差aは限定されないが、接合部分における応力を低減するという観点からは1mm以上が好ましい。
【0030】
好適な実施形態においては、拡径部7aの外側輪郭16が支持部材7の中心軸Aと略平行に延びる。外側輪郭または外側面16の長さbを大きくすることは、つまり拡径部7aの厚さを大きくすることを意味している。そして、bを大きくすることによって、拡径部の近辺における応力が一層減少することを発見した。この観点からは、bを2mm以上とすることが好ましく、5mm以上とすることが一層好ましい。
【0031】
しかし、bを大きくすると、今度は支持部材7を伝達してチャンバーの方へと逃げる熱が多くなり、支持部材のチャンバー側端部の温度が上昇し、規定温度(例えば200℃)を超える傾向がある。このため、bは10mm以下が特に好ましい。
【0032】
サセプター、支持部材の材質は限定されないが,好ましくはセラミックスである。ハロゲン系腐食性ガスに対して耐蝕性を有するセラミックスが好ましく、特に窒化アルミニウムまたは緻密質アルミナが好ましく、95%以上の相対密度を有する窒化アルミニウム質セラミックス、アルミナが一層好ましい。
【0033】
セラミックサセプターは何らかの加熱源によって加熱されるが、その加熱源は限定されず、外部の熱源(例えば赤外線ランプ)によって加熱されるサセプターと、内部の熱源(例えばサセプター内に埋設されたヒーター)によって加熱されるサセプターとの双方を含む。サセプター中には、抵抗発熱体、静電チャック用電極、プラズマ発生用電極などの機能性部品を埋設することができる。
【0034】
封止部材の材質は限定されないが、Oリングシールやメタルリングシールを例示できる。
【0035】
【実施例】
(本発明例1−5)
図1−図3を参照しつつ説明した本発明の取付構造を作製した。サセプター2としては、直径330mm、厚さ15mmの窒化アルミニウム焼結体製の円盤を使用した。支持部材7は、緻密質の窒化アルミニウム焼結体によって成形した。支持部材7とサセプター2とを、特開平8−73280号公報に記載のようにして固相接合した。支持部材7とチャンバー10との間は、ネジによって締めつけ固定した。Oリング12はフッ素ゴムからなる。
【0036】
支持部材7の全長は180mmとした。支持部材7の内径は38mmとし、本体部分7bの厚さは8mmとし、拡径部7aの厚さは8mmとした。アール部分17の曲率半径REは3mmとし、段差aは2mmとし、真直部分16の長さbは5mmとした。アール部分13の曲率半径Rは表1に示す。
【0037】
この状態で、サセプター2の設置面2aの温度を約600°に加熱したものという設定で、シュミレーションを行った。この状態で、支持部材7の内部応力をその全体にわたって計算し、最大応力を求めた。また、支持部材7のチャンバー側の端部7cの温度を求めた。
【0038】
【表1】

Figure 0003554555
【0039】
(比較例1)
図5に示した比較例の構造を作製した。基本的には本発明例1と同様にしたが、ただしアール部分21、25、真直部分22、24、26、角23、15を設けた。アール部分21の曲率半径R1は5mmとし、R2を3mmとした。実験1と同様にして最大応力と支持部材7のチャンバー側の端部7cの温度を求めた。この結果、最大応力は3.2kgf/mmであり、7cの温度は180℃であった。
【0040】
(本発明例6、7)
本発明例6においては、本発明例1と同様の構造を作製した。ただし、アール部分17の曲率半径REは3mmとし、段差aは2mmとし、真直部分16の長さbは5mmとし、アール部分13の曲率半径Rは15mmとした。この結果、最大応力2.6kgf/mmであった。
【0041】
本発明例7においては、本発明例6において真直部分16を除いた。この結果、最大応力は2.7kgf/mmであった。
【0042】
(本発明例8、9)
本発明例1と同様の構造を作製した。ただし、真直部分16の高さbを表2のように変更した。各構造について、最大応力と端部7cの温度とを算出した。
【0043】
【表2】
Figure 0003554555
【0044】
【発明の効果】
以上述べたように、本発明によれば、サセプターから支持部材中へと伝達される熱を抑制すると共に、サセプターを高温にしたときにも支持部材に集中する応力を緩和できる。
【図面の簡単な説明】
【図1】本発明の一実施形態に係る取付構造の全体を概略的に示す断面図である。
【図2】図1の構造において、支持部材7とサセプター2との接合部分の拡大図である。
【図3】図2の一部を更に拡大して示す図である。
【図4】本発明の他の実施形態に係る取付構造を示す断面図である。
【図5】本発明外の取付構造を示す断面図である。
【図6】本発明外の取付構造を示す断面図である。
【符号の説明】
2 サセプター 2a 設置面 2b、18 背面
5 チャンバーの内部空間 6 支持部材の内側空間 7、7A 支持部材 7a 拡径部 7b 本体部分 7c 拡径部(チャンバー側の端部) 7d 支持部材の内側輪郭(内側面)
7e、7g 接合面 7f 支持部材の外側輪郭(外側面)
8 冷却機構 10 チャンバー 10a 開口 10dチャンバーの内側面 13 本体部分7bと拡径部7aとの間のアール部分 14 アール部分13と拡径部との間の真直部分 16 拡径部の外側面(外側輪郭) 17 他のアール部分 20 封止部材 A 支持部材の中心軸 R アール部分13の曲率半径
RE アール部分17、17Aの曲率半径 O 曲率中心[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a structure for attaching a susceptor to a chamber.
[0002]
[Prior art]
In a semiconductor manufacturing application or the like, for example, as shown in FIG. 6, it is necessary to attach the ceramic heater 2 to the inner wall surface of the chamber 10. Therefore, one end 21a of the cylindrical support member 21 made of a ceramic plate is attached to the joint surface (back surface) 2b of the ceramic heater 2, and the other end 21c of the support member 21 is attached to the inner wall surface 10d of the chamber 10. Has been done. The support member 21 is formed of a heat-resistant ceramic such as alumina or aluminum nitride. The inside space 6 of the support member 21 communicates with the opening 10a of the chamber 10. The space between the support member 21 and the chamber 10 is hermetically sealed by an O-ring 20. Thereby, the space between the inner space 6 of the support member 21 and the inner space 5 of the chamber 10 is hermetically sealed, so that gas in the inner space 5 of the chamber 10 does not leak to the outside of the chamber 10. In the ceramic susceptor 2, for example, a resistance heating element 4 is embedded.
[0003]
[Problems to be solved by the invention]
The temperature of the installation surface (heating surface) 2a of the ceramic susceptor 2 on which the semiconductor wafer 1 is provided reaches, for example, 400 ° C. or more, and sometimes 600 ° C. or more. On the other hand, the rubber sealing member 20 such as an O-ring cannot withstand high heat, and its heat-resistant temperature is usually about 200 ° C. For this reason, it is preferable to provide a cooling flange 8 in the chamber to cool the periphery of the O-ring and adjust the temperature around the O-ring to 200 ° C. or less.
[0004]
However, if the temperature of the ceramic susceptor 2 increases as described above, the temperature of the one end 21a of the support member 21 exceeds, for example, 400 ° C., and the temperature of the other end 21c of the support member 21 is cooled to 200 ° C. or less, The temperature gradient inside the support member is 200 ° C. or more.
[0005]
In order to improve the bonding strength of the support member to the susceptor, and to provide gas holes and through holes for passing terminals and thermocouples inside the wall surface of the support member 21, the support member 21 is made thick. In addition, it is necessary to increase the bonding area of the support member to the susceptor. However, when the thickness of the supporting member is increased, the amount of heat conduction propagating through the supporting member increases because the supporting member has a temperature gradient as described above. As a result, a cold spot is generated on the heating surface 2a due to an increase in heat conduction from the vicinity of the joint 21a of the support member. For this reason, it is useful to make the main body portion of the support member thin, and to provide an expanded portion (flange portion) at the end of the support member on the susceptor side.
[0006]
However, when a thick flange is provided at the end of the support member, the internal stress concentrated near the boundary between the main body and the flange tends to be excessive when the susceptor is heated to a high temperature. For this reason, there is a limit to the upper limit of the temperature in the susceptor in order to avoid breaking the support member.
[0007]
An object of the present invention is to provide a susceptor for heating an object to be processed, a supporting member joined to the susceptor, an inner space provided, and a chamber provided with an opening joined to the supporting member. In the mounting structure in which the opening of the chamber and the inner space of the support member are in communication with each other, and the inner space of the support member is hermetically sealed with respect to the inner space of the chamber, the susceptor and the support member And to reduce the stress concentrated on the support member when the susceptor is heated to a high temperature.
[0008]
[Means for Solving the Problems]
The present invention is a susceptor for heating the object to be processed, and the susceptor is joined to the support member in which the inner space is provided, a chamber opening is provided, this chamber and the support member are joined, a chamber whose opening is communicated with the inner space of the support member, and, had the support structure comprises a inner space of the support member are hermetically sealed against the inner space of the chamber The support member further includes a first wall defining a cylindrical main body, and a second wall defining an enlarged portion provided at an end of the support member on the susceptor side. An outer contour of a longitudinal section of the support member, the main body portion and the enlarged diameter portion include one or more continuous radius portions, and a portion of an outer surface of the second wall portion is provided. Outside the first wall Parallel to the surface portion, the radial thickness of the first wall portion is smaller than the radial thickness of the second wall portion, and the inner surface of the support member extends over the entire length of the support member. and is characterized in Rukoto which have a uniform internal diameter.
[0009]
The enlarged diameter portion refers to a portion having an outer diameter larger than that of the main body.
[0010]
“One round portion is provided between the main body portion and the enlarged diameter portion” excludes a case where two or more round portions are provided between the main body portion and the enlarged diameter portion. Is intended. The number of round portions is determined by the number of centers of curvature. If there is one center of curvature, there is also one rounded portion corresponding to the center of curvature. If there are two radius parts, each curvature center exists corresponding to each radius part.
[0011]
Further, the present invention includes a case where a plurality of radius portions are continuously formed between the main body portion and the enlarged diameter portion. Here, the plurality of R portions mean a plurality of R portions having different centers of curvature. In addition, a plurality of radius portions are continuous means that a plurality of radius portions are continuous without interposing a form other than a radius portion such as a linear portion, a straight portion, and a step between the radius portions. It means that it is formed in. In this case, the radii of curvature of the plurality of radius portions may be different, or the radii of curvature may be the same.
[0012]
Of course, it is not excluded that a separate radius portion is provided between the enlarged diameter portion and the susceptor.
[0013]
The present invention will be further described with reference to the embodiment of FIGS.
[0014]
An enlarged diameter portion 7a is provided at one end of the cylindrical support member 7, and an enlarged diameter portion 7c is provided at the other end. The joining surface (end surface) 7e of the enlarged diameter portion 7a is joined to the joining surface (back surface) 2b of the susceptor 2. The end surface 7g of the enlarged diameter portion 7c at the other end of the support member 7 is joined to the inner wall surface 10d of the chamber 10. The inner space 6 of the support member 7 communicates with the opening 10a of the chamber 10. The space between the support member 7 and the chamber 10 is hermetically sealed by an O-ring 20. 7d is the inside contour of the longitudinal section of the support member 7, and 7f is the outside contour.
[0015]
The method of joining the support member and the susceptor is not particularly limited, and for example, it can be joined with a brazing material, or can be made by solid-phase joining or solid-liquid joining as described in JP-A-8-73280. The maximum temperature of the heating surface 2a of the susceptor 2 reaches, for example, 400 ° C. or more, sometimes 600 ° C. or more and 1200 ° C. or less.
[0016]
The outer space 11 of the chamber 10, the opening 10 a of the chamber 10, and the inner space 6 of the support member 7 communicate with each other, and are isolated from the inner space 5 of the chamber 10. By providing the cooling flange 8 in the chamber 10, the periphery of the sealing member 20 is cooled, and the temperature around the sealing member 20 is adjusted to be 230 ° C. or less.
[0017]
The support member 7 includes a cylindrical main body portion 7b, an enlarged diameter portion 7a on the susceptor side, and an enlarged diameter portion 7c on the chamber side. The present invention relates to an outer contour 7f of a longitudinal section of the support member 7 extending from the main body portion 7b to the enlarged diameter portion 7a.
[0018]
That is, in this example, as shown in FIGS. 2 and 3, the outer contour of the main body portion is substantially straight, the outer surface 16 of the enlarged diameter portion 7 a is also substantially straight, and They are almost parallel. Looking at the outer contour of the support member 7, from the main body portion 7b toward the susceptor 2, a round portion 13 (13A, 13B), a straight portion 14, a corner 15, an outer surface 16 of the enlarged diameter portion 7a, a round portion 17, A back surface 18 of the susceptor is formed in order. Note that R is the radius of curvature of the radius portion 13 (13A, 13B), and RE is the radius of curvature of the radius portion 17.
[0019]
The inventor of the present invention has found that a specific form as shown in FIGS. 1 to 3 is particularly effective in the course of studying a structure for alleviating the stress concentration in the vicinity of the above-mentioned enlarged diameter portion. That is, when one radius portion 13 (13A, 13B) is provided between the main body portion 7b and the enlarged diameter portion 7a, the internal stress of the support member is reduced, and the end of the support member 7 on the chamber 10 side. It has been found that the temperature of the portion 7c can be suppressed to the lowest.
[0020]
The inventor of the present invention has studied the other plural forms in detail and simulated the internal stress of the support member. For example, a support member 7A having a configuration as shown in FIG. 5 was studied. In this example, a first round portion 21, a straight portion 22, a corner 23, a straight portion 24, a second round portion 25, a straight portion 26, between the main body portion 7f and the outer surface 16 of the enlarged diameter portion 7a. A corner 15 is provided. R1 and R2 are the radii of curvature of the radius portions 21 and 25, respectively. The present inventor has reduced the internal stress of the support member by providing a plurality of radius portions between the main body portion 7f and the enlarged diameter portion 7a and variously changing the radius of curvature of each radius portion. . However, according to an actual simulation result, the support member is provided by providing a single radius portion between the main body portion 7f and the enlarged diameter portion 7a, compared to a case where a large number of radius portions are provided and stress is dispersed. The present inventors have found that the maximum value of the internal stress in the sample significantly decreases and arrived at the present invention.
[0021]
The radius of curvature of the radius portion 13 is not limited, but is preferably 3 mm or more, more preferably 5 mm or more, and even more preferably 10 mm or more, from the viewpoint of reducing internal stress in the support member.
[0022]
Also, when the radius of curvature of the radius portion increases, the heat transmitted to the support member tends to increase. For example, in FIG. 3, the radius of curvature R of the radius portion 13A shown by a solid line is relatively small, and the radius of curvature R of the radius portion 13B shown by a dotted line is relatively large. From the viewpoint of reducing the internal stress in the support member 7, the radius portion 13B having a large radius of curvature is more preferable. However, when the radius of curvature of the radius portion is large, the area of the cross section of the support member is correspondingly large, and the temperature near the enlarged diameter portion 7c (see FIG. 1) at the other end of the support member tends to increase. From the viewpoint of reducing the temperature at the end of the support member on the chamber side, the radius of curvature of the radius portion 13 is preferably 30 mm or less, more preferably 25 mm or less, and most preferably 20 mm or less. The most preferable range of the radius of curvature of the radius portion 13 is 14-16 mm.
[0023]
In a preferred embodiment of the present invention, for example, as shown in FIG. 3, in the outer contour 7 f of the longitudinal section of the support member 7, the support member 7 is disposed between the enlarged diameter portion 7 a and the curved portion 13 A (13 B). A straight portion 14 extending in a direction intersecting with the central axis A is provided. By providing the straight portion 14, the thickness of the enlarged diameter portion 7a can be made sufficiently large, or the thickness of the main body portion 7b can be made sufficiently small. For example, if the linear portion is not provided in FIG. 3, the thickness of the enlarged diameter portion 7a is designed to be extremely small.
[0024]
The inclination angle θ of the straight portion 14 with respect to A is not limited, but is preferably 45 to 90 degrees from the above viewpoint.
[0025]
In a preferred embodiment, another radius portion 17 is provided between the enlarged diameter portion 7 a and the surface 18 of the susceptor 2 in the outer contour 7 f of the longitudinal section of the support member 7.
[0026]
At this time, as shown in FIGS. 2 and 3, it is preferable that at least a part of the other radius portion 17 is formed on the susceptor. In other words, it is preferable that a step a occurs between the surface 18 of the susceptor 2 and the bonding surface 7e. Thereby, the stress concentration at the joint can be reduced to the maximum.
[0027]
In the present invention, as shown in FIG. 4, it is also possible to prevent a step from occurring between the joining surface 7e and the surface (exposed surface) 18 of the susceptor 2. However, in this case, when the round portion 17A is formed, the thickness of the support member at the round portion 17A becomes very small and irregular. For this reason, stress tends to concentrate near the rounded portion 17A, or it is likely to be a starting point of peeling.
[0028]
The radius of curvature RE of the other radius portions 17 and 17A is preferably 1 mm or more, more preferably 2 mm or more, from the viewpoint of minimizing the stress at the joint portion.
[0029]
The step a is not limited, but is preferably 1 mm or more from the viewpoint of reducing the stress at the joint.
[0030]
In a preferred embodiment, the outer contour 16 of the enlarged diameter portion 7 a extends substantially parallel to the central axis A of the support member 7. Increasing the length b of the outer contour or the outer surface 16 means increasing the thickness of the enlarged diameter portion 7a. And it discovered that the stress in the vicinity of a diameter expansion part decreased further by making b large. In this respect, b is preferably equal to or greater than 2 mm, and more preferably equal to or greater than 5 mm.
[0031]
However, when b is increased, the amount of heat transmitted to the support member 7 and escaping toward the chamber increases, the temperature of the end of the support member on the chamber side increases, and the temperature tends to exceed a specified temperature (for example, 200 ° C.). There is. Therefore, b is particularly preferably 10 mm or less.
[0032]
The material of the susceptor and the support member is not limited, but is preferably ceramics. Ceramics having corrosion resistance to a halogen-based corrosive gas are preferable, and aluminum nitride or dense alumina is particularly preferable, and aluminum nitride ceramics and alumina having a relative density of 95% or more are more preferable.
[0033]
The ceramic susceptor is heated by some kind of heating source, but the heating source is not limited. The susceptor is heated by an external heat source (for example, an infrared lamp), and the susceptor is heated by an internal heat source (for example, a heater embedded in the susceptor). Including both susceptors. Functional components such as a resistance heating element, an electrode for electrostatic chuck, and an electrode for plasma generation can be embedded in the susceptor.
[0034]
The material of the sealing member is not limited, and examples thereof include an O-ring seal and a metal ring seal.
[0035]
【Example】
(Invention Example 1-5)
The mounting structure of the present invention described with reference to FIGS. As the susceptor 2, a disk made of an aluminum nitride sintered body having a diameter of 330 mm and a thickness of 15 mm was used. The support member 7 was formed from a dense aluminum nitride sintered body. The support member 7 and the susceptor 2 were solid-phase bonded as described in JP-A-8-73280. The space between the support member 7 and the chamber 10 was fastened and fixed with screws. The O-ring 12 is made of fluoro rubber.
[0036]
The total length of the support member 7 was 180 mm. The inner diameter of the support member 7 was 38 mm, the thickness of the main body portion 7b was 8 mm, and the thickness of the enlarged diameter portion 7a was 8 mm. The radius of curvature RE of the round portion 17 was 3 mm, the step a was 2 mm, and the length b of the straight portion 16 was 5 mm. Table 1 shows the radius of curvature R of the radius portion 13.
[0037]
In this state, the simulation was performed under the condition that the temperature of the installation surface 2a of the susceptor 2 was heated to about 600 °. In this state, the internal stress of the support member 7 was calculated over the whole, and the maximum stress was obtained. Further, the temperature of the end 7c of the support member 7 on the chamber side was determined.
[0038]
[Table 1]
Figure 0003554555
[0039]
(Comparative Example 1)
The structure of the comparative example shown in FIG. 5 was produced. Basically, it was the same as Example 1 of the present invention, except that round portions 21 and 25, straight portions 22, 24 and 26, and corners 23 and 15 were provided. The radius of curvature R1 of the round portion 21 was 5 mm, and R2 was 3 mm. In the same manner as in Experiment 1, the maximum stress and the temperature of the end 7c on the chamber side of the support member 7 were obtained. As a result, the maximum stress was 3.2 kgf / mm 2 and the temperature of 7c was 180 ° C.
[0040]
(Examples 6 and 7 of the present invention)
In Inventive Example 6, the same structure as in Inventive Example 1 was produced. However, the radius of curvature RE of the round portion 17 was 3 mm, the step a was 2 mm, the length b of the straight portion 16 was 5 mm, and the radius of curvature R of the round portion 13 was 15 mm. As a result, the maximum stress was 2.6 kgf / mm 2 .
[0041]
In Example 7 of the present invention, the straight portion 16 was removed from Example 6 of the present invention. As a result, the maximum stress was 2.7 kgf / mm 2 .
[0042]
(Examples 8 and 9 of the present invention)
A structure similar to that of Inventive Example 1 was produced. However, the height b of the straight portion 16 was changed as shown in Table 2. For each structure, the maximum stress and the temperature of the end 7c were calculated.
[0043]
[Table 2]
Figure 0003554555
[0044]
【The invention's effect】
As described above, according to the present invention, the heat transmitted from the susceptor into the support member can be suppressed, and the stress concentrated on the support member can be reduced even when the susceptor is heated to a high temperature.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view schematically showing an entire mounting structure according to an embodiment of the present invention.
FIG. 2 is an enlarged view of a joining portion between a support member 7 and a susceptor 2 in the structure of FIG.
FIG. 3 is a diagram showing a part of FIG. 2 in a further enlarged manner.
FIG. 4 is a cross-sectional view illustrating a mounting structure according to another embodiment of the present invention.
FIG. 5 is a sectional view showing a mounting structure outside the present invention.
FIG. 6 is a sectional view showing a mounting structure outside the present invention.
[Explanation of symbols]
2 Susceptor 2a Installation surface 2b, 18 Back surface 5 Internal space of chamber 6 Inner space of support member 7, 7A Support member 7a Large diameter portion 7b Body portion 7c Large diameter portion (end on the chamber side) 7d Inner contour of support member (end portion on chamber side) Inside)
7e, 7g Joint surface 7f Outer contour of support member (outer surface)
Reference Signs List 8 cooling mechanism 10 chamber 10a opening 10d inner surface of chamber 13 round portion between main body portion 7b and enlarged diameter portion 7a 14 straight portion between radius portion 13 and enlarged diameter portion 16 outer surface of enlarged diameter portion (outside) 17) Other radius portion 20 Sealing member A Central axis of support member R Radius of curvature of radius portion 13 RE Radius of curvature of radius portions 17, 17A O Center of curvature

Claims (6)

被処理物を加熱するためのサセプター、およびこのサセプターに接合されており、内側空間が設けられている支持部材開口が設けられたチャンバーであって、該支持部材とこのチャンバーが接合されており、その開口支持部材の内側空間と連通しているチャンバー、および、チャンバーの内部空間に対して気密に封止されている支持部材の内側空間、を備えている支持構造であって、前記支持部材が、さらに、筒状の本体部分を規定する第1の壁部と、前記支持部材の前記サセプター側の端部に設けられた拡径部を規定する第2の壁部と、前記支持部材の縦断面の外側輪郭において前記本体部分と前記拡径部との間に一つまたは複数の連続したアール部分とを備えており、前記第2の壁部の外表面の部分が前記第1の壁部の外表面の部分と平行であり、前記第1の壁部の半径方向の厚みが前記第2の壁部の半径方向の厚みより小さく、前記支持部材の内表面が前記支持部材の全長さに亘って均一な内径を有することを特徴とする、サセプターの支持構造。Susceptor for heating an object, and is bonded to the susceptor support member the inner space is provided, a chamber with an opening at this chamber and the support member is joined , a chamber whose opening is communicated with the inner space of the support member, and a support structure is provided with a inner space of the support member are hermetically sealed against the inner space of the chamber, said support A member further defining a first wall defining a tubular main body, a second wall defining an enlarged portion provided at an end of the support member on the susceptor side, and the support member; An outer contour of a longitudinal section of the main body portion and the enlarged diameter portion, one or a plurality of continuous radius portions, and a portion of an outer surface of the second wall portion is the first wall portion. Part of the outer surface of the wall Parallel, the radial thickness of the first wall portion is smaller than the radial thickness of the second wall portion, and the inner surface of the support member has a uniform inner diameter over the entire length of the support member. It characterized Rukoto to Yusuke, the support structure of the susceptor. 前記アール部分の曲率半径が3mm以上、30mm以下であることを特徴とする、請求項1記載の構造。The structure according to claim 1, wherein a radius of curvature of the radius portion is 3 mm or more and 30 mm or less. 前記支持部材の縦断面の外側輪郭において、前記拡径部と前記アール部分との間に、前記支持部材の中心軸に対して交差する方向に延びる真直部分が設けられていることを特徴とする、請求項1または2記載の構造。A straight portion extending in a direction intersecting a central axis of the support member is provided between the enlarged diameter portion and the radius portion in an outer contour of a longitudinal section of the support member. The structure according to claim 1 or 2. 前記支持部材の縦断面の外側輪郭において、前記拡径部と前記サセプターの表面との間に他のアール部分が設けられていることを特徴とする、請求項1−3のいずれか一つの請求項に記載の構造。The other round portion is provided between the enlarged diameter portion and the surface of the susceptor in an outer contour of a vertical cross section of the support member, according to claim 1, wherein: The structure described in the section. 前記他のアール部分の少なくとも一部が前記サセプターに形成されていることを特徴とする、請求項4記載の構造。The structure according to claim 4, wherein at least a part of the other radius portion is formed on the susceptor. 前記サセプターまたは前記支持部材の材質がセラミックスであることを特徴とする、請求項1−のいずれか一つの請求項に記載の構造。The structure according to any one of claims 1 to 5 , wherein a material of the susceptor or the support member is a ceramic.
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US8294069B2 (en) * 2007-03-28 2012-10-23 Ngk Insulators, Ltd. Heating device for heating a wafer
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