JP3556833B2 - Semiconductor package case - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a semiconductor package case, characterized in that mounted on a mounting substrate housing the semiconductor package was re Doresu.
[0002]
[Prior art]
A conventional method for manufacturing a semiconductor package having external connection terminal leads will be described with reference to FIG.
[0003]
In FIG. 7, reference numeral a1 denotes a connecting lead frame. The connecting lead frame a1 is formed by serially connecting the individual lead frames a2 in the longitudinal direction, and the semiconductor element is mounted on the semiconductor element mounting portion. The element and the lead are electrically connected by wire bonding, and are sealed with a molding resin in a molding step a to form a mold sealing portion a3.
[0004]
Next, in a tie bar cutting step b, the tie bar is cut, and at the same time, the connecting portions of the individual lead frames a2 in the connecting lead frame a1 are cut, thereby obtaining the single package b1.
[0005]
In the tie bar cutting step b, a cutting die for tie bar cutting is provided on the upper and lower sides, the connecting lead frame a1 is placed on the upper surface of the lower die, and the upper and lower dies are narrowly pressed to perform cutting.
[0006]
Next, in the lead forming step c, the lead gull wing shape and the like are shaped.
[0007]
In the lead forming step c, the lead forming is performed by disposing the forming mold for lead forming on the upper and lower sides, placing the single package b1 on the upper surface of the lower mold, and narrowing the pressure by the upper and lower molds.
[0008]
Next, in a lead cutting step d, the lead is cut to a predetermined length.
[0009]
In the lead cutting step d, cutting molds for lead cutting are arranged on the upper and lower sides, the single package b1 on which the leads have been shaped is placed on the upper surface of the lower mold, and the upper and lower molds are used to narrow the pressure, thereby reducing the excess. The lead is cut.
[0010]
Then, a process for connecting to the mounting board e1 is performed on the lead end by plating, dipping of solder, or the like, the standard is measured, marked, packed, and shipped.
[0011]
"e" is a side view of an example of mounting on the mounting board e1.
[0012]
[Problems to be solved by the invention]
In such a manufacturing method, a dedicated die must be prepared in each of the tie bar cutting step, the lead forming step, and the lead cutting step, which has been the biggest obstacle to reducing the manufacturing cost.
[0013]
In particular, in recent years, there has been a tendency to produce a large number of products in small quantities, and the ratio of the mold cost to the production cost has been further increased, making it difficult to produce at a price required by the market.
[0014]
[Means for Solving the Problems]
According to the present invention, of the upper mold portion and the lower mold portion for sealing the semiconductor element, the outer peripheral dimension of the upper mold portion is made larger than the outer peripheral dimension of the lower mold portion, and the outer mold portion extends over the peripheral edge of the upper mold portion. A semiconductor package is formed by disposing an end portion of an external lead, which is continuous with the internal lead, at the overhang portion .
[0015]
The semiconductor package case for casing the semiconductor package is constituted by an upper case for casing the upper mold portion and a lower case for casing the lower mold portion, and the upper and lower cases are integrally assembled to house the semiconductor package therein. In addition to the above, the lower case is provided with external connection terminals that are electrically connected to the external leads of the semiconductor package, and can be mounted on the mounting board (B) together with the upper and lower cases via the external connection terminals .
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
The semiconductor package casing in the semiconductor package case of the present invention is a semiconductor package in which the use of a die for processing external leads is avoided and the semiconductor package is a leadless type in order to reduce the manufacturing cost of the semiconductor package.
[0017]
The manufacturing process is as follows.
[0018]
In a semiconductor package, a semiconductor element, a plurality of internal leads, and the semiconductor element and the internal lead are connected by a wire bonding wire, and the semiconductor element, the internal lead, and the wire are integrally hermetically sealed with a molding resin. It is formed.
[0019]
The upper and lower molds used in the molding process are formed with a recess having a substantially rectangular opening so as to form a mold portion, and the recess opening of the upper mold forming the upper mold portion. The size is larger than the opening size of the concave portion of the lower mold that forms the lower mold portion.
[0020]
Accordingly, an overhanging portion is formed at the periphery of the upper mold portion, where the mold portion overhangs from the periphery of the lower mold portion.
[0021]
In the overhanging portion, an external lead continuous with the internal lead is drawn out toward the outer peripheral direction of the mold portion, and the external lead is cut along the outer peripheral edge of the upper mold portion by a lead cut mold. Thereby, the external lead is formed so as to exist only in the overhang portion.
[0022]
In the semiconductor package formed in this manner, the external leads of the semiconductor package cannot be directly joined to the connection terminals of the mounting board due to the thickness of the lower mold portion.
[0023]
Therefore, in the mounting substrate, an insertion hole corresponding to the outer peripheral dimension of the lower mold portion is formed in the mounting substrate, and the lower mold portion of the semiconductor package is fitted in the insertion hole. May be joined to the connection terminals of the mounting board.
[0024]
In particular, in the semiconductor package case of the present invention, an upper case for casing the upper mold portion of the semiconductor package and a lower case for casing the lower mold portion are formed, and the upper and lower cases are integrally assembled to form the inside of the case. The semiconductor package can be stored.
[0025]
In the lower case, an electric connection portion is formed in a portion that comes into contact with the external lead of the semiconductor package, and further, an external connection terminal is formed on a surface of the lower case facing the mounting board, and the electric connection portion is formed. The connection to the external connection terminal is made conductive by the internal wiring.
[0026]
Therefore, when the semiconductor package is mounted on the mounting board via the external connection terminals provided in the lower case, conduction is achieved, and the semiconductor package can be protected from external shocks and the like by the upper and lower cases.
[0027]
【Example】
Embodiments of the present invention will be described in detail with reference to the drawings.
[0028]
As described in connection with the related art, a lead frame type semiconductor package is manufactured by connecting a lead frame a2 in which a single lead frame a2 is connected in series in the longitudinal direction as shown in FIG. The semiconductor element 20 (see FIG. 1) mounted on the semiconductor element mounting portion a1 and the internal lead 40 are electrically connected by the wire 30 of the wire bonding, and in the molding step a, the connection lead frame a1 is molded. This is performed by hermetically sealing with resin.
[0029]
In order to form the mold sealing part a3, the connecting lead frame a1 is placed on the upper surface (not shown) of the lower mold, and the upper mold (not shown) is overlapped with the lower mold. , And press-fit the molten mold resin to form a mold sealing portion a3.
[0030]
In the present invention, in the upper and lower mold dies used when forming the mold sealing portion a3, concave portions having substantially rectangular openings are formed in portions of the connecting lead frame a1 corresponding to the mold sealing portion a3. At the same time, the opening size of the recess formed in the upper mold is made larger than the opening size of the recess formed in the lower mold.
[0031]
Therefore, as shown in FIGS. 1 and 2, the peripheral edge of the upper mold portion 1 extends outward from the peripheral edge of the lower mold portion 2 due to the difference in the opening size of the concave portion provided in the upper and lower molds. The protrusion 3 is formed.
[0032]
In the molding step a, the outer leads 4 continuous with the inner leads 40 are sandwiched by the upper and lower mold dies, so that they are exposed from the mold portion at the overhang portions 3 formed on the peripheral edge of the upper mold portion 1. At the same time, the shape is further drawn in the outer peripheral direction.
[0033]
Thereafter, the external leads 4 are cut along the outer peripheral edge of the upper mold section 1 by a lead cut mold, whereby each unitary semiconductor package A is separated from the connection lead frame a1 and formed on the peripheral edge of the upper mold section 1. The semiconductor package A in which the connection terminal by the external lead 4 exists only in the overhang portion 3 is obtained.
[0034]
However, in the semiconductor package A thus formed, the external leads 4 cannot be directly connected to the mounting board B due to the thickness of the lower mold portion 2.
[0035]
Therefore, as shown in FIG. 3, in the mounting substrate B, an insertion hole C corresponding to the outer peripheral dimension of the lower mold portion 2 is formed in the mounting substrate B, and the semiconductor package A is inserted into the insertion hole C. The external leads 4 of the semiconductor package A may be joined to the connection terminals of the mounting board B by fitting the lower mold portion 2.
[0036]
In particular, in the semiconductor package case of the present invention, first, the upper case 9 for casing the upper mold portion 1 of the semiconductor package A and the lower case 8 for casing the lower mold portion 2 are used, and the upper and lower cases 9 and 8 are integrated. The semiconductor package A is housed in the case assembled in the above.
[0037]
The lower case 8 has an electrical connection portion 6 formed at a portion of the semiconductor package A in contact with the external lead 4, and further has an external connection terminal 7 formed of connection pins on a surface of the lower case 8 facing the mounting board. The external connection terminal 7 and the electrical connection portion 6 are electrically connected by an internal wiring (not shown).
[0038]
Therefore, the conductor package A housed in the case by the upper and lower cases 9 and 8 is mounted on the mounting board B and is electrically conducted by interposing the external connection terminals 7.
[0039]
In the lower case 8, a projection 80 for preventing adhesion is formed at a portion in contact with the bottom surface of the semiconductor package A. Similarly, a projection 90 for preventing adhesion is formed on the upper case 9. The semiconductor package A is held by the lower case 8 and the upper case 9 via the projections 80 and 90.
[0040]
The gaps 11 are formed between the semiconductor package A and the lower case 8 and the upper case 9 by the projections 80 and 90, so that the gaps 11 dissipate the heat generated by the semiconductor element 20 better. Then, the deformation of the semiconductor package A caused by the heat generated by the semiconductor element 20 is absorbed, and the connection between the external lead 4 of the semiconductor package A and the electrical connection portion 6 of the lower case 8 is broken, thereby causing a disconnection. Is prevented.
[0041]
The mounting on the mounting board B is performed via the external connecting terminals 7 which are the external connecting terminals provided in the lower case 8, and the external connecting terminals 7 can be inserted into the mounting board B, and The mounting is performed by forming an insertion hole 10 provided so as to be connectable to the external connection terminal 7 and inserting the external connection terminal 7 into the insertion hole 10.
[0042]
As another embodiment, although not shown, a solder ball may be used as an external connection terminal instead of the external connection terminal 7, or the external connection terminal is formed in a connector shape, and a corresponding connector receiving member is provided. The unit may be provided on the upper surface of the mounting board B, and the mounting form of the lower case 8 on the mounting board B may be arbitrarily selected as necessary.
[0043]
Further, the lower case 8 and the upper case 9 may be formed so as to house a plurality of semiconductor packages A in a vertically stacked state.
[0044]
By using the semiconductor package A as described above, the die required for manufacturing the semiconductor package A can be used as one type for lead cutting, so that the manufacturing cost can be significantly reduced and As shown in FIG. 6, since the tie bar cutting step and the lead forming step can be omitted, the time required for manufacturing can be reduced, and the manufacturing can be performed more efficiently.
[0045]
Further, since the semiconductor package A is housed in the lower case 8 for transportation and use, the semiconductor package A is not damaged by an external impact or the like. By changing only the shape of the external connection terminal 7, an inexpensive and versatile semiconductor package A can be provided.
[0046]
As another embodiment, when the purpose is merely electric conduction between the semiconductor package A and the mounting board B, the storage case is not the lower case 8 and the upper case 9 as shown in FIG. As shown in (1), the external leads 4 of the semiconductor package A and the mounting board B may be connected by using the legs 12 each having a simple rectangular frame shape.
[0047]
Further, in the present embodiment, as a mounting form of the semiconductor package A, which is difficult to directly mount on the mounting board B, a method in which mounting is possible by using a storage case is described. In order to change the external connection mode, the semiconductor package may be housed in a case, and the semiconductor package housed in the case is not limited to the semiconductor package A of the leadless type.
[0051]
【The invention's effect】
According to the present invention, an upper case for casing an upper mold portion of a semiconductor package, and a lower case for casing a lower mold portion, the upper and lower cases are integrally assembled, and the semiconductor package can be housed inside the case. In addition, the lower case is provided with external connection terminals that are electrically connected to the external leads of the semiconductor package, and the upper and lower cases can be mounted on the mounting board via the external connection terminals. The semiconductor package can be prevented from being damaged without impact or the like.
[0052]
Furthermore, by changing only the shape of the external connection terminal of the lower case, it is possible to provide a product corresponding to various mounting forms, so that an inexpensive and highly versatile semiconductor package can be provided.
[Brief description of the drawings]
FIG. 1 is a front view of a semiconductor package used for a semiconductor package case according to the present invention.
FIG. 2 is a bottom view of the semiconductor package.
FIG. 3 is an explanatory view of a mounting mode of the semiconductor package.
FIG. 4 is an explanatory view of a mounting mode using a semiconductor package case of the present invention.
FIG. 5 is an explanatory diagram of another embodiment.
FIG. 6 is an explanatory diagram as engineering.
FIG. 7 is an explanatory view of a conventional manufacturing method.
[Explanation of symbols]
Reference Signs List A Semiconductor package B Mounting board 1 Upper mold part 2 Lower mold part 3 Overhang part 4 External lead 6 Electrical connection part 7 External connection terminal 8 Lower case 80 Projection part 9 Upper case 90 Projection part 10 Insertion hole 11 Void 20 Semiconductor element 30 wire

Claims (1)

The upper mold portion for sealing the semiconductor element (20) (1) and the lower mold part (2) of, than the outer peripheral edge dimension of the lower mold part (2) the outer periphery dimensions of the upper mold portion (1) increase, upper mold portion (1) protruding portion to the peripheral edge to form a (3), disposed end of the inner lead (40) and each successive outer leads to the projecting portion (3) (4) In the semiconductor package case that casings the semiconductor package,
Internal an upper case (9) to the casing upper mold part (1), the lower mold part (2) constituted by a lower case of casing (8), the upper and lower cases (9) (8) integrally assembled upper and lower cases via with a semiconductor package to be accommodated, the lower case (8) provided with external connection terminals (7) which is electrically connected to the semiconductor package external leads (4), the Dogaibu connection terminal (7) to (9) A semiconductor package case characterized in that (8) can be mounted on a mounting board (B) .

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