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JP3558020B2 - Method of attaching release agent to molding die and molding system - Google Patents
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JP3558020B2 - Method of attaching release agent to molding die and molding system - Google Patents

Method of attaching release agent to molding die and molding system Download PDF

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Publication number
JP3558020B2
JP3558020B2 JP2000231822A JP2000231822A JP3558020B2 JP 3558020 B2 JP3558020 B2 JP 3558020B2 JP 2000231822 A JP2000231822 A JP 2000231822A JP 2000231822 A JP2000231822 A JP 2000231822A JP 3558020 B2 JP3558020 B2 JP 3558020B2
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molding
release agent
nozzle
die
mold
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JP2002036251A (en
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幸一郎 佐藤
光俊 宮崎
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Denso Corp
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Denso Corp
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Priority to JP2000231822A priority Critical patent/JP3558020B2/en
Priority to US09/915,391 priority patent/US6651726B2/en
Priority to DE10137086A priority patent/DE10137086B4/en
Priority to CA002354332A priority patent/CA2354332C/en
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Description

【0001】
【技術分野】
本発明は,各種成形金型に対する離型剤の付着方法及び成形システムに関する。
【0002】
【従来技術】
各種の成形材料を成形金型を用いて成形するにあたり,成形金型の成形キャビティのキャビティ面,成形材料の溶湯が供給される経路となる材料供給路等,成形金型における成形材料と接する材料接触面に対し予め離型剤を塗布し,型開き後の成形品取り出しを容易としている。
従来は,成形金型を完全に開いた状態で,材料接触面を外部に露出させ,固定型及び可動型の材料接触面と対面する場所から離型剤原液を水で希釈したものを直接スプレーで吹きつけることで,離型剤塗布を行なっていた。
【0003】
【解決しようとする課題】
従来方法では,離型剤塗布により,材料接触面に離型剤による潤滑皮膜が形成されると共に成形金型が冷却されてしまう。
成形金型を温調している場合は成形金型が過冷却され,温度回復時間の増加,溶湯の湯まわり性を悪化させ,成形品の外観品質の低下,成形品不良率の増加が生じる。
また,成形金型に過度の熱ストレスを加えることとなるため,金属疲労により成形金型の寿命が短くなる。
【0004】
また,離型剤をむらなく材料接触面に対しスプレーするには相応の時間が必要である。また,離型剤の吹き残りを乾燥させるためのエアブロー作業が必要である。このように,離型剤をスプレーする方法は作業に時間がかかるため,成形のサイクルタイムを長くする要因にもなっている。
さらに,離型剤をスプレーする際に成形金型外への飛散やたれ落ち等が発生し,作業環境の悪化も発生する。
【0005】
本発明は,かかる従来の問題点に鑑みてなされたもので,成形金型の過冷却を防ぎ,成形のサイクルタイムを短縮し,作業環境の悪化を防止できると共に成形金型の寿命を延ばすことができる成形金型への離型剤の付着方法及び成形システムを提供しようとするものである。
【0006】
【課題の解決手段】
請求項1に記載の発明は,成形装置と成形金型とよりなる成形システムにおいて,
上記成形金型は,型締めにより成形キャビティを形成可能に構成された少なくとも固定型と可動型とよりなり,
上記成形キャビティに対し,成形装置から成形材料を供給するよう構成された材料供給用ノズルと対面するノズル受け面が連結されてあり,
上記成形システムを用いて成形材料を成形する際に,上記成形金型において上記成形材料が接する材料接触面に対して離型剤を付着させるにあたり,
上記固定型と上記可動型とを成形品離型可能な間隔未満に対面配置した状態となし,この状態で,上記材料供給用ノズルと上記ノズル受け面との間を経由して上記離型剤を上記材料接触面に対して供給することを特徴とする成形金型への離型剤の付着方法にある。
【0007】
本発明において最も注目すべきことは,固定型と可動型とを成形品離型可能な間隔未満に対面配置して,材料供給用ノズルとノズル受け面との間を経由して離型剤を供給し,材料接触面に離型剤を付着させたことである。
【0008】
次に,本発明の作用につき説明する。
成形品離型可能間隔とは,成形後に型開きして成形品を取りだすことができるもっとも狭い間隔のことで,各成形金型について一意に定まる。
このような状態に固定型と可動型とを配置してやり,離型剤を付着させることで,離型剤を付着させる必要のない固定型及び可動型の分割面等に対する離型剤付着を防止,または低減できる。また,固定型及び可動型の外部への離型剤の飛散を防止,または低減できる。
【0009】
このため,本発明にかかる方法では離型剤が無駄に使われず,離型剤を希釈する水分をなくして原液そのものを使用することができる。または,離型剤を希釈する水分量を従来よりも少なくすることができる。
そのため,成形金型への離型剤付着にともなう温度低下を防止でき,優れた湯まわり性を確保することができる。また,湯まわり性向上から,成形品の外観品質を高め,不良率を減らすことができる。
また,成形金型への過度の熱ストレスを低減できるので,成形金型の寿命を長くすることができる。
【0010】
また,本発明にかかる方法では,成形品離型可能な間隙未満の状態で離型剤を塗布しているため,成形金型外への飛散やたれ落ち等が発生し難く,作業環境の悪化も生じ難い。離型剤付着時に成形金型が大きく開いた状態にないため,離型剤が材料接触面以外に付着し難い。
従って,離型剤付着に要する時間も短くて済み,付着させた離型剤乾燥のためのエアブロー等の所要時間も同様に短くて済む。よって,成形のサイクルタイムを短縮できる。
【0011】
更に,本発明にかかる方法では,離型剤を材料供給用ノズルとノズル受け面との間に生じる隙間から供給する。離型剤はノズル受け面から成形キャビティ内に入ることができる。
材料接触面は成形時に成形材料と接する面であり,上記成形キャビティを取り巻く壁面等で構成される。
従って,上述のごとき経路で離型剤を導入することで,既存の成形金型に大きな改造を施すことなく離型剤の供給経路を確保することができ,導入コストが安価である。
【0012】
以上,本発明によれば,成形金型の過冷却を防ぎ,成形のサイクルタイムを短縮し,作業環境の悪化を防止できると共に成形金型の寿命を延ばすことができる成形金型への離型剤の付着方法を提供することができる。
【0013】
本発明にかかる成形金型への離型剤塗布方法は,マグネシウム合金の成形,樹脂の成形,アルミニウム合金の成形等,各種射出成形,ダイキャスト成形等に対して適用することができる。特に,ホットチャンバダイキャストマシン等による成形に適用することができる。
また,成形金型の構成についても特に種類等選ぶことなく適用できる。固定型,可動型のそれぞれが2つ以上の部分型からなるような場合も本発明を適用できる。
【0014】
また,離型剤の種類も特に選択することなく本発明を適用できる。
例えば,離型剤として油性潤滑剤を用いることができる。
また,離型剤を希釈するに当たり,水以外の溶媒を用いることもできる。
【0015】
また,上記材料接触面とは,成形にあたり成形材料の溶湯が接する部分である。この面には成形品表面を形成する部分(主として成形キャビティの壁面や材料供給ノズルの成形キャビティと面する側の先端等である)の他,特に材料供給路が成形金型に設けてある場合は,ここも含まれる。
図1に示されるような成形金型で,材料供給用ノズルが直接成形キャビティに対面する場合は材料供給路を設けないこともあるが,図4,図5のようにノズル受け面と成形キャビティとの間で溶湯等を通すための通路となる材料供給路を設けることもある。
また,上記溶湯は完全に溶融した状態にある場合,半溶融の状態にある場合とがある。
【0016】
上記離型剤の具体的な付着方法としては,上記材料供給用ノズルと上記ノズル受け面との間に対し離型剤をスプレーで吹きつけて付着させる方法が挙げられる。この場合,単に吹きつけて付着させる方法と,外部から吸引しつつ吹きつけてやる方法とが考えられる。
その他,外部からの吸引のみで離型剤を付着させることもできる。
【0017】
上記ノズル受け面であるが,ノズル収納空間に設けることができる(図1参照)。この場合,材料供給用ノズルがノズル収納空間に進入した状態で成形材料の供給を行なう。
【0018】
次に,請求項2記載の発明のように,上記離型剤を上記材料接触面に付着させる際には,上記材料供給用ノズルと上記ノズル受け面との間に隙間が形成されるように両者を配置し,上記離型剤を供給し,
上記離型剤の付着を終えて上記成形材料を上記成形キャビティに供給する際には,上記材料供給用ノズルと上記ノズル受け面とを当接させ,両者間を閉塞することが好ましい。
これにより,離型剤供給に利用した隙間から成形材料が漏れたり,成形時の成形材料の逆流等が防止できる。
更に,成形材料の漏れや逆流を防ぐ特別な構造を準備する必要がないため,コストを安価とすることができる。
【0019】
次に,請求項3記載の発明のように,上記固定型と上記可動型とを型締めした状態となし,この状態で上記固定型及び上記材料接触面に対し離型剤を付着させることが好ましい。
これにより,確実に成形金型外への飛散やたれ落ちを防止して,作業環境の悪化を防止することができる。更に,確実に離型剤が材料接触面以外の箇所に付着することが防止できる。
また,離型剤の使用料を最小にすることができる。
【0020】
次に,請求項4記載の発明のように,上記成形金型はホットランナ用金型であり,上記材料供給用ノズルはホットランナノズルに対し適用することができる。
ホットランナ用金型,ホットランナノズルを用いたホットランナ成形とは,ノズルを加熱する機構が設けてあり,成形中はノズルは常に加熱された状態にある。そのため,ホットランナ用金型等を用いたホットランナ成形では,余分の成形材料の固化が生じず,成形キャビティに対応した形状の成形体が得られる。
【0021】
次に,請求項5記載の発明のように,上記離型剤は,上記材料供給用ノズルと上記ノズル受け面との間の隙間に対し開口するよう形成した離型剤供給経路より供給することが好ましい。
これにより,成形材料が流通する経路と同じような経路をつたって,材料接触面に対しまんべんなく離型剤を供給することができる。
この離型剤供給経路は,貫通穴として固定型等に設けることもできるが,後述するごとく,成形装置に設けることもできる。
【0022】
上記離型剤供給経路が開口する位置は,材料供給用ノズルとノズル受け面が当接して,両者間を閉塞する位置よりも,成形材料供給に関してより上流側とすることが好ましい。
これにより,材料供給用ノズルとノズル受け面とを閉塞させて,離型剤供給経路からの成形材料の漏れ,逆流等の防止を行なうことができ,離型剤供給経路そのものに成形材料の漏れ防止,逆流防止機構を設ける必要がなくなる。
【0023】
次に,請求項6記載の発明のように,成形装置と成形金型とよりなる成形システムにおいて,
上記成形金型は,型締めにより成形キャビティを形成可能に構成された少なくとも固定型と可動型とよりなり,
上記成形キャビティに対し,成形装置から成形材料を供給するよう構成された材料供給用ノズルと対面するノズル受け面が連結されてあり,
上記成形システムを用いて成形材料を成形する際に,上記成形金型において上記成形材料が接する材料接触面に対して,上記材料供給用ノズルと上記ノズル受け面との間を経由して離型剤を供給し,上記材料接触面に上記離型剤を付着可能に構成された離型剤供給経路を有することを特徴とする成形システムにある。
【0024】
本発明にかかる成形システムでは,離型剤供給経路を用いて離型剤を材料供給用ノズルとノズル受け面との間に生じる隙間から供給し,成形キャビティ内に入ることができる。
【0025】
材料接触面は成形時に成形材料と接する面であり,上記成形キャビティを取り巻く壁面等で構成される。そのため,本発明にかかる成形システムでは,材料接触面以外に対する離型剤付着が生じ難い。
【0026】
従って,本発明にかかる成形システムを用いることで,離型剤が無駄に使われず,離型剤を希釈する水分をなくして原液そのものを使用することができる。または,離型剤を希釈する水分量を従来よりも少なくすることができる。
そのため,成形金型への離型剤付着にともなう温度低下を防止でき,優れた湯まわり性が確保された成形金型を得ることができる。また,湯まわり性向上から,成形品の外観品質を高め,不良率を減らすことができる。
また,成形金型への過度の熱ストレスを低減できるので,成形金型の寿命を長くすることができる。
【0027】
更に,本発明にかかる成形システムでは,成形金型外への飛散やたれ落ち等が発生し難く,作業環境の悪化も生じ難い。
従って,離型剤付着に要する時間も短くて済み,付着させた離型剤乾燥のためのエアブロー等の所要時間も同様に短くて済む。よって,成形のサイクルタイムを短縮できる。
【0028】
以上,本発明によれば,成形金型の過冷却を防ぎ,成形のサイクルタイムを短縮し,作業環境の悪化を防止できると共に成形金型の寿命を延ばすことができる成形システムを提供することができる。
【0029】
また,離型剤供給経路としては,例えば,離型剤で満たしたタンク等と接続された噴射器や注入器,スプレー,射出器等を用いることができる。また,単なる貫通穴,パイプ,管等を離型剤供給経路として,この供給経路に対しなんらかの方法で離型剤を導入してもよい。
その他,詳細は上述の成形金型についての記載と同様である。
【0030】
次に,請求項7記載の発明のように,上記固定型と上記可動型とを成形品離型可能な間隔未満に対面配置した状態に支承可能とする支承機構を有することが好ましい。
本請求項にかかる成形システムは,支承装置にて成形品離型可能な間隙未満となし,この状態で離型剤の付着を行なうよう構成されているため,成形金型外部への離型剤の飛散を防止できる。また,成形金型が大きく開いた状態にないため,離型剤が材料接触面以外に付着し難い。
従って,離型剤付着に要する時間も短くて済み,成形のサイクルタイムを短縮できる。
【0031】
上記支承機構は,成形に伴って行われる成形金型の型締め,型開きにおいて使用される成形金型の駆動機構と兼用させることができる。
また,支承機構や駆動機構としては,油圧式のものの他,電動式のものを使用することができる。
【0032】
また,請求項8記載の発明のように,上記成形装置に対し上記固定型を取付るよう構成された固定型固定板に,上記材料供給用ノズルと上記ノズル受け面との間の隙間に対し開口するよう形成した離型剤供給経路を設けることが好ましい。
これにより,成形キャビティと離型剤供給経路とが連絡可能となり,離型剤供給経路からノズル受け面を経て,成形キャビティ内へという経路で離型剤供給を行なうことができる。
そのため,確実に離型剤を材料接触面以外に付着し難くすることができる。
また,この構造では離型剤供給経路を成形金型外部に設けているため,成形金型として既存のものを用いることができ,特に改造の必要がなく,便利である。
【0033】
また,請求項9記載の発明のように,上記成形装置に上記離型剤供給経路を設けることが好ましい。
成形装置に離型剤供給経路を設けることで,成形金型として従来構造のものを手を加えることなく使用することができる。
また,成形装置に成形金型における固定型を取付る固定型固定板が設けてあるが,この固定型固定板も従来構造のものを使用することができる。
具体的には,材料供給ノズルに離型剤供給経路を一体的に設けることが考えられる。
【0034】
【発明の実施の形態】
実施形態例1
本発明の実施形態例にかかる成形システムと成形システムにおける成形金型への離型剤の付着方法につき,図1〜図3を用いて説明する。
本例の成形システムは,図1に示すごとく,成形装置と成形金型1とよりなる。
上記成形金型1は,型締めにより成形キャビティ10を形成可能に構成された固定型11と可動型12とよりなり,上記固定型11には,成形装置から成形材料を供給するよう構成された材料供給用ノズル31と対面するノズル受け面131が設けてある。
【0035】
そして,上記成形システムは,上記固定型11及び上記可動型12において上記成形材料が接する材料接触面100に対して,上記材料供給用ノズル31と上記ノズル受け面131との間を経由して離型剤を供給し,上記材料接触面100に上記離型剤を付着可能に構成された離型剤供給経路16を有し,上記固定型11と上記可動型12とを成形品離型可能な間隔未満に対面配置した状態に支承可能とする支承機構(図示略)を有する。
【0036】
上記材料接触面100に対して離型剤を付着させるには,上記固定型11と上記可動型12とを成形品離型可能な間隔未満に対面配置した状態となし,この状態で,上記材料供給用ノズル31と上記ノズル受け面131との間を経由して上記離型剤を上記材料接触面100に対して供給する。
【0037】
本例のホットランナ式の成形金型と成形システムについて具体的に説明する。
図1,図3に示すごとく,成形金型1は,型締めにより成形キャビティ10を構成する固定型11と可動型12とよりなると共にホットランナシステム3が設けてある。
上記固定型11には,成形キャビティ10と連通し,成形金型1外部に開口するよう構成されたすりばち状のノズル収納空間13が設けてあり,該ノズル収納空間13の成形キャビティ10側の側面全体がノズル受け面131となっている。
また,上記固定型11には,ノズル収納空間13に対し連通した離型剤供給経路16が設けてある。この離型剤供給経路16は単なる貫通穴より構成されている。
【0038】
本例の符号171,172は固定型11と可動型12とが当接する分割面である。
また,本例の成形金型1の材料接触面100は成形キャビティ10を構成するキャビティ面101,102よりなる。また,本例では特に材料供給用ノズル31の先端面310も材料接触面100の一部となる。
【0039】
本例では,図1に示すごとく,固定型11に設けた離型剤供給経路16に対し加圧した離型剤を噴射するための成形金型1の外部に設けた噴射ノズル291,離型剤タンク29が設けてある。
また,本例において,固定型11と可動型12は型締した図1にかかる状態で,離型剤の付着を行なう。そのため支承機構としては,成形金型1の駆動機構をそのまま利用するため,図1及び図2において,図示を省略した。
【0040】
次に,本例のホットランナシステム3について説明する。
図1に示すごとく,ホットランナシステム3は,図示を略した成形装置本体より成形材料を供給する材料供給路321を有する固定型固定板33,ホットランナマニホルド32,ノズル固定板35が設けてある。
ホットランナマニホルド32における材料供給路321近傍には,該材料供給路321を保温するための熱媒流路320が設けてある。
【0041】
ノズル固定板35には成形材料を成形キャビティ10に噴射する材料供給用ノズル31が設けてあり,またこの材料供給用ノズル31についても熱媒流路320が設けてある。また,ノズル固定板35の固定型11と対面する側の面には凹部350が設けてあり,ここには弾性バネ355がセットされている。また,弾性バネ355と接するように蓋292が材料供給用ノズル31に対し嵌め込まれる。
【0042】
本例にかかる成形金型1を用いた成形体の成形について説明する。
成形のプロセスを時系列に列挙すると,(1)成形金型1の型締め,(2)材料供給用ノズル31前進,(3)溶湯射出,(4)成形キャビティ10の充填完了,(5)溶湯固化,(6)材料供給用ノズル31後退,(7)成形金型1の型開き,(8)成形品取出しである。
上記(1)〜(8)が成形の1サイクルとなる。
【0043】
図1に示すごとく,可動型12と固定型11とを型締めする。
次いで,材料供給用ノズル31をノズル収納空間13に対し挿入する。この時,ノズル収納空間13に設けた離型剤供給経路16を材料供給用ノズル31で塞がないように,また,材料供給用ノズル31とノズル受け面131との間は隙間が形成されるようにする。この挿入により材料供給用ノズル31に設けた蓋292がノズル収納空間13を封止する。
【0044】
この状態で離型剤供給経路16に対し離型剤を噴射ノズル291から噴射する。離型剤は離型剤供給経路16を経て,ノズル収納空間13における材料供給用ノズル31とノズル受け面131との間を経由して,成形キャビティ10に入る。
この噴射により材料接触面100に離型剤の潤滑被膜が形成された。
【0045】
次いで,図2に示すごとく,材料供給用ノズル31をノズル受け面131側へ前進させ,両者を当接させる。この時,弾性バネ355が圧縮されつつ,蓋292はノズル固定板35に設けた凹部350に収納される。
これにより,離型剤供給経路16が成形キャビティ10と分離される。
【0046】
続いて,材料供給用ノズル31から成形材料の溶湯を射出,成形キャビティ10内を必要量の溶湯で充填する。
充填後,成形金型1を冷却し,溶湯を固化させ,材料供給用ノズル31を後退させる。
そして,金型駆動機構により可動型12を固定型11より離脱させ,型開きを行なう。そして,成形品を取出す。
その後,図1に示すごとく,再び型締めをして,次の成形のサイクルに入る。
【0047】
次に本例の作用効果について説明する。
本例では型締めした状態で固定型11と可動型12とを配置してやり,固定型11に設けた離型剤供給経路16から離型剤を材料供給用ノズル31とノズル受け面131との間を経由させて,材料接触面100に対し付着させる。
このため,固定型11及び可動型12の分割面171,172等に対する離型剤付着を防止できる。また,固定型11及び可動型12の外部への離型剤の飛散を防止できる。
【0048】
よって,離型剤を無駄なく使用でき,離型剤を希釈する水分をなくして原液そのものを使用することができる。または,離型剤を希釈する水分量を従来よりも少なくすることができる。
そのため,成形金型1への離型剤付着にともなう温度低下を防止でき,優れた湯まわり性を確保することができる。また,湯まわり性向上から,成形品の外観品質を高め,不良率を減らすことができる。
また,成形金型1の熱ストレスを低減できるため,成形金型を長寿命化することもできる。
【0049】
また,成形金型1外への飛散やたれ落ち等が発生し難く,作業環境の悪化も生じ難い。離型剤付着時に成形金型1が大きく開いた状態にないため,離型剤が材料接触面100以外に付着し難い。よって,離型剤付着に要する時間も短くて済み,付着させた離型剤乾燥のためのエアブロー等の所要時間も同様に短くて済む。よって,成形のサイクルタイムを短縮できる。
【0050】
更に,本例では離型剤を材料供給用ノズル31とノズル受け面131との間に生じる隙間から供給する。これは,固定型11に離型剤用の小さな穴(すなわち離型剤供給経路16である。)を設けることで実現できるため,既存の成形金型に大きな改造を施すことなく離型剤の供給経路を確保することができる。よって,本例にかかる離型剤付着方法は導入コストが安価である。
【0051】
更に,本例では成形キャビティ10に溶湯を導入する際に材料供給用ノズル31が前進することで,離型剤供給経路16を成形キャビティ10と分離できるため,溶湯の逆流等が防止できる上,離型剤供給経路16に別途遮断機構を設ける必要がなく,コストを安価とすることができる。
【0052】
以上,成形金型の過冷却を防ぎ,成形のサイクルタイムを短縮し,作業環境の悪化を防止できると共に成形金型の寿命を延ばすことができる成形金型への離型剤の付着方法を提供することができる。
【0053】
実施形態例2
本例は,成形システムにおいて,固定型固定板や成形装置の側に離型剤供給経路を設けた場合について説明する。
図4に示すごとく,本例の成形システム4は,固定型11と可動型12とからなる成形金型1を利用して成形品を作製する。
上記可動型12は可動型取付板491を介して可動型固定板492に設置され,固定型11に対して進退可能に構成されている。可動型12の駆動機構については図示を省略した。
【0054】
固定型11において,成形キャビティ10と連通する材料供給路321が設けてあるが,この材料供給路321は固定型11に組み込んだスプルーブシュ115により形成される。
固定型11は固定型取付板481を介して固定型固定板482に設置される。
上記スプルーブシュ115は固定型取付板481内にも組み込まれている。上記固定型取付板481側のスプルーブシュ115の材料供給路321にはノズル受け面131が設けてある。
【0055】
また,上記ノズル受け面131を介して材料供給路321と連通するように,上記固定型固定板482にノズル41の収納空間485が設けてある。
なお,符号47はロケートリングである。
また,上記ノズル41の外周には蓋42が設けてあり,ノズル41をノズル収納空間485に挿入することで,ノズル収納空間485が封止されるよう構成されている。
また,固定型11や可動型12を直接,固定型固定板482,可動型固定板492に取付ることもできる。
【0056】
ノズル収納空間485に開口するように離型剤供給経路53が固定型固定板482に設けてある。離型剤供給経路53は噴射ノズルよりなり,この噴射ノズルは配管52を経て離型剤タンク及び制御装置51に接続されている。
制御装置からの信号で離型剤タンクから所定圧力,所定量の離型剤が配管を経由して噴射ノズルからノズル収納空間485に対し供給されるのである。
【0057】
本例にかかる成形システム4の動作について説明する。
固定型11と可動型12とを型締めし,成形キャビティ10を形成する。
ノズル41をノズル収納空間485に対し前進させ,蓋42でノズル収納空間485を封止する。
この状態で,制御装置から指令を出して,離型剤タンク51から所定圧力,所定量の離型剤が配管52を経由して噴射ノズル53からノズル収納空間485,ノズル41と受け面131との隙間を経由して,離型剤を材料供給路321及び成形キャビティ10に供給する。これにより,材料接触面100に対し離型剤の潤滑被膜を形成する。
【0058】
その後,上記ノズル41を更に前進させて,ノズル41とノズル受け面131とを接触させる。これにより離型剤供給経路53は成形キャビティ10や材料供給路321と分離される。次いで,上記ノズル41から成形材料を成形キャビティ10に射出,ここを充填する。
【0059】
その後,成形金型を冷却して,成形材料を固化,ノズル41を後退させると共に成形金型1を型開きして成形品を取出す。
その後,図4に示すごとく,再び型締めをして,次の成形のサイクルに入る。
その他,詳細は実施形態例1と同様であり,また本例についても同様の作用効果を得ることができる。
【0060】
なお,上記離型剤供給路53となる噴射ノズルを,図5に示すごとく,ノズル41と一体的に設けることもできる。
この場合も上記と同様の作用効果を得ることができる。
【図面の簡単な説明】
【図1】実施形態例1における,離型剤供給時の成形システムの要部説明図。
【図2】実施形態例1における,成形材料供給時の成形システムの要部説明図。
【図3】実施形態例1における,成形金型の展開説明図。
【図4】実施形態例2における,固定型固定板に離型剤供給経路を設けた成形システムの説明図。
【図5】実施形態例2における,ノズルに離型剤供給経路を設けた成形システムの説明図。
【符号の説明】
1...成形金型,
10...成形キャビティ,
11...固定型,
12...可動型,
131...ノズル受け面,
16...離型剤供給経路,
100...材料接触面,
4...成形システム,
[0001]
【Technical field】
The present invention relates to a method of attaching a release agent to various molds and a molding system.
[0002]
[Prior art]
When molding various molding materials using a molding die, materials that come into contact with the molding material in the molding die, such as the cavity surface of the molding cavity of the molding die and a material supply path that is a path through which molten metal of the molding material is supplied. A release agent is applied to the contact surface in advance to facilitate removal of the molded product after opening the mold.
Conventionally, with the mold fully open, the material contact surface is exposed to the outside, and the diluted mold release agent diluted with water is directly sprayed from the place facing the material contact surface of the fixed and movable molds. The release agent was applied by spraying.
[0003]
[Problem to be solved]
In the conventional method, a lubricating film made of the release agent is formed on the material contact surface by applying the release agent, and the molding die is cooled.
If the temperature of the molding die is controlled, the molding die will be supercooled, increasing the temperature recovery time, deteriorating the meltability of the molten metal, lowering the appearance quality of the molded product, and increasing the defective product rate .
In addition, since excessive heat stress is applied to the molding die, the life of the molding die is shortened due to metal fatigue.
[0004]
Also, it takes a certain amount of time to spray the release agent evenly on the material contact surface. In addition, an air blow operation for drying the remaining part of the release agent is required. As described above, since the method of spraying the release agent takes a long time for the operation, it also causes a prolongation of the molding cycle time.
Further, when the mold release agent is sprayed, scattering or dripping out of the molding die occurs, and the working environment deteriorates.
[0005]
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and aims to prevent overcooling of a molding die, shorten a molding cycle time, prevent a working environment from deteriorating, and extend the life of the molding die. It is an object of the present invention to provide a method and a molding system for adhering a release agent to a molding die capable of forming.
[0006]
[Means for solving the problem]
According to a first aspect of the present invention, there is provided a molding system including a molding device and a molding die.
The molding die comprises at least a fixed die and a movable die which can form a molding cavity by clamping.
A nozzle receiving surface facing a material supply nozzle configured to supply a molding material from a molding device is connected to the molding cavity,
When molding a molding material using the molding system, in order to attach a release agent to a material contact surface of the molding die that contacts the molding material,
A state in which the fixed mold and the movable mold are disposed so as to face each other less than an interval at which a molded product can be released, and in this state, the release agent passes between the material supply nozzle and the nozzle receiving surface. Is supplied to the material contact surface, the method comprising attaching a release agent to a molding die.
[0007]
The most remarkable point in the present invention is that the fixed mold and the movable mold are arranged to face each other less than the interval at which the molded product can be released, and the release agent is passed between the material supply nozzle and the nozzle receiving surface. That is, the mold release agent was supplied and the release agent was attached to the material contact surface.
[0008]
Next, the operation of the present invention will be described.
The mold product releasable interval is the narrowest interval at which a mold can be opened and a molded product can be taken out after molding, and is uniquely determined for each molding die.
In such a state, the fixed mold and the movable mold are arranged and the mold release agent is adhered, thereby preventing the release agent from adhering to the divided surfaces of the fixed mold and the movable mold that do not need to adhere the mold release agent. Or it can be reduced. In addition, scattering of the release agent to the outside of the fixed type and the movable type can be prevented or reduced.
[0009]
For this reason, in the method according to the present invention, the release agent is not wasted, and the stock solution itself can be used without moisture for diluting the release agent. Alternatively, the amount of water for diluting the release agent can be made smaller than before.
For this reason, it is possible to prevent the temperature from being lowered due to the adhesion of the release agent to the molding die, and it is possible to ensure excellent meltability. In addition, due to the improvement of the molten metal running property, the appearance quality of the molded product can be improved and the defective rate can be reduced.
In addition, since excessive heat stress on the molding die can be reduced, the life of the molding die can be extended.
[0010]
Further, in the method according to the present invention, since the release agent is applied in a state that is smaller than the gap at which the molded product can be released, scattering or dripping out of the molding die hardly occurs, and the working environment deteriorates. Is also unlikely to occur. Since the mold is not in a widely opened state when the release agent is adhered, the release agent is unlikely to adhere to portions other than the material contact surface.
Therefore, the time required for the release agent to adhere can be shortened, and the time required for air blow for drying the adhered release agent can be similarly shortened. Therefore, the molding cycle time can be reduced.
[0011]
Further, in the method according to the present invention, the release agent is supplied from a gap generated between the material supply nozzle and the nozzle receiving surface. The release agent can enter the molding cavity from the nozzle receiving surface.
The material contact surface is a surface that comes into contact with the molding material during molding, and includes a wall surface surrounding the molding cavity.
Therefore, by introducing the release agent through the above-described route, the supply route of the release agent can be secured without making a major modification to the existing molding die, and the introduction cost is low.
[0012]
As described above, according to the present invention, the mold release to the molding die which can prevent the supercooling of the molding die, shorten the molding cycle time, prevent the working environment from deteriorating, and extend the life of the molding die. A method for applying the agent can be provided.
[0013]
The method of applying a release agent to a molding die according to the present invention can be applied to various types of injection molding, die casting, and the like, such as magnesium alloy molding, resin molding, aluminum alloy molding, and the like. In particular, it can be applied to molding by a hot chamber die casting machine or the like.
In addition, the configuration of the molding die can be applied without any particular selection. The present invention can be applied to a case where each of the fixed type and the movable type includes two or more partial types.
[0014]
Further, the present invention can be applied without particularly selecting the kind of the release agent.
For example, an oil-based lubricant can be used as a release agent.
In diluting the release agent, a solvent other than water can be used.
[0015]
Further, the material contact surface is a portion where the molten metal of the molding material comes into contact during molding. In this case, in addition to the part forming the surface of the molded product (mainly the wall surface of the molding cavity or the tip of the material supply nozzle facing the molding cavity), especially when the material supply path is provided in the molding die Is included here.
When the material supply nozzle faces the molding cavity directly in the molding die as shown in FIG. 1, the material supply path may not be provided, but as shown in FIGS. In some cases, a material supply path serving as a path for passing a molten metal or the like may be provided.
The molten metal may be in a completely molten state or a semi-molten state.
[0016]
As a specific method of attaching the release agent, a method of spraying and attaching the release agent to the space between the material supply nozzle and the nozzle receiving surface may be mentioned. In this case, a method of simply spraying and attaching, or a method of spraying while suctioning from the outside can be considered.
In addition, the release agent can be attached only by suction from the outside.
[0017]
The nozzle receiving surface can be provided in the nozzle storage space (see FIG. 1). In this case, the molding material is supplied in a state where the material supply nozzle has entered the nozzle storage space.
[0018]
Next, as in the second aspect of the present invention, when the release agent is attached to the material contact surface, a gap is formed between the material supply nozzle and the nozzle receiving surface. Both are arranged and the above-mentioned release agent is supplied.
When supplying the molding material to the molding cavity after finishing the adhesion of the release agent, it is preferable that the material supply nozzle and the nozzle receiving surface are brought into contact with each other and the space therebetween is closed.
As a result, it is possible to prevent the molding material from leaking from the gap used for supplying the release agent, and prevent the molding material from flowing backward during molding.
Further, since there is no need to prepare a special structure for preventing leakage or backflow of the molding material, the cost can be reduced.
[0019]
Next, as in the third aspect of the present invention, the fixed mold and the movable mold are in a state in which the mold is clamped, and in this state, a release agent is attached to the fixed mold and the material contact surface. preferable.
As a result, it is possible to reliably prevent scattering and dripping out of the molding die, thereby preventing deterioration of the working environment. Further, it is possible to reliably prevent the release agent from adhering to portions other than the material contact surface.
Also, the usage fee of the release agent can be minimized.
[0020]
Next, as in the invention of claim 4, the molding die is a hot runner die, and the material supply nozzle can be applied to a hot runner nozzle.
In hot runner molding using a hot runner mold and a hot runner nozzle, a mechanism for heating the nozzle is provided, and the nozzle is always heated during molding. Therefore, in hot runner molding using a hot runner mold or the like, no excess molding material is solidified, and a molded body having a shape corresponding to the molding cavity can be obtained.
[0021]
Next, as in the invention according to claim 5, the release agent is supplied from a release agent supply path formed so as to open to a gap between the material supply nozzle and the nozzle receiving surface. Is preferred.
Thereby, the release agent can be evenly supplied to the material contact surface through the same route as the route through which the molding material flows.
This release agent supply path can be provided in a fixed mold or the like as a through hole, but can also be provided in a molding device as described later.
[0022]
It is preferable that the position at which the release agent supply path is opened is more upstream with respect to the supply of the molding material than the position at which the material supply nozzle and the nozzle receiving surface are in contact with each other and the space therebetween is closed.
As a result, the material supply nozzle and the nozzle receiving surface are closed to prevent leakage of the molding material from the release agent supply path, backflow, and the like. There is no need to provide a prevention and backflow prevention mechanism.
[0023]
Next, as in the invention according to claim 6, in a molding system including a molding device and a molding die,
The molding die comprises at least a fixed die and a movable die which can form a molding cavity by clamping.
A nozzle receiving surface facing a material supply nozzle configured to supply a molding material from a molding device is connected to the molding cavity,
When the molding material is molded using the molding system, the mold is released from the material contact surface of the molding die that is in contact with the molding material via the material supply nozzle and the nozzle receiving surface. A molding agent having a release agent supply path configured to supply an agent and to adhere the release agent to the material contact surface.
[0024]
In the molding system according to the present invention, the release agent can be supplied from the gap generated between the material supply nozzle and the nozzle receiving surface using the release agent supply path, and can enter the molding cavity.
[0025]
The material contact surface is a surface that comes into contact with the molding material during molding, and includes a wall surface surrounding the molding cavity. For this reason, in the molding system according to the present invention, the release agent is hardly adhered to portions other than the material contact surface.
[0026]
Therefore, by using the molding system according to the present invention, the release agent is not wasted, and the stock solution itself can be used without the water that dilutes the release agent. Alternatively, the amount of water for diluting the release agent can be made smaller than before.
Therefore, it is possible to prevent a decrease in temperature due to the adhesion of the release agent to the molding die, and to obtain a molding die with excellent run-off property. In addition, due to the improvement of the molten metal running property, the appearance quality of the molded product can be improved and the defective rate can be reduced.
In addition, since excessive heat stress on the molding die can be reduced, the life of the molding die can be extended.
[0027]
Further, in the molding system according to the present invention, scattering or dripping out of the molding die hardly occurs, and the working environment is hardly deteriorated.
Therefore, the time required for the release agent to adhere can be shortened, and the time required for air blow for drying the adhered release agent can be similarly shortened. Therefore, the molding cycle time can be reduced.
[0028]
As described above, according to the present invention, it is possible to provide a molding system capable of preventing overcooling of a molding die, shortening a molding cycle time, preventing a working environment from deteriorating, and extending the life of the molding die. it can.
[0029]
As the release agent supply path, for example, an injector, an injector, a spray, an injector, or the like connected to a tank or the like filled with the release agent can be used. Alternatively, a simple through hole, a pipe, a pipe, or the like may be used as a release agent supply path, and the release agent may be introduced into this supply path by any method.
Other details are the same as those described above for the molding die.
[0030]
Next, as in the invention according to claim 7, it is preferable to have a bearing mechanism capable of supporting the fixed mold and the movable mold in a state where the fixed mold and the movable mold face each other less than an interval at which a molded product can be separated.
The molding system according to the present invention is configured such that the clearance is set to be smaller than the gap at which the molded product can be released by the bearing device, and the release agent is attached in this state. Can be prevented from scattering. In addition, since the molding die is not in a widely opened state, the release agent is unlikely to adhere to portions other than the material contact surface.
Accordingly, the time required for attaching the release agent can be shortened, and the cycle time of molding can be shortened.
[0031]
The bearing mechanism can also be used as a drive mechanism of a molding die used in clamping and opening of the molding die performed during molding.
Further, as the bearing mechanism and the driving mechanism, an electric type can be used in addition to a hydraulic type.
[0032]
Further, as in the invention according to claim 8, a fixed die fixing plate configured to mount the fixed die to the molding device is provided with a gap between the material supply nozzle and the nozzle receiving surface. It is preferable to provide a release agent supply path formed to be open.
Thus, the molding cavity and the release agent supply path can communicate with each other, and the release agent can be supplied from the release agent supply path via the nozzle receiving surface and into the molding cavity.
Therefore, it is possible to reliably prevent the release agent from adhering to portions other than the material contact surface.
Further, in this structure, since the release agent supply path is provided outside the molding die, an existing molding die can be used, and there is no particular need for modification, which is convenient.
[0033]
Further, it is preferable that the molding apparatus is provided with the release agent supply path.
By providing a mold release agent supply path in the molding apparatus, a mold having a conventional structure can be used without any modification.
In addition, a fixed die fixing plate for mounting a fixed die in a molding die is provided in the molding apparatus, and the fixed type fixed plate having a conventional structure can also be used.
Specifically, it is conceivable to provide a release agent supply path integrally with the material supply nozzle.
[0034]
BEST MODE FOR CARRYING OUT THE INVENTION
Embodiment 1
A molding system according to an embodiment of the present invention and a method of attaching a release agent to a molding die in the molding system will be described with reference to FIGS.
As shown in FIG. 1, the molding system of this embodiment includes a molding device and a molding die 1.
The molding die 1 is composed of a fixed die 11 and a movable die 12 which can form a molding cavity 10 by clamping, and is configured to supply a molding material to the fixed die 11 from a molding device. A nozzle receiving surface 131 facing the material supply nozzle 31 is provided.
[0035]
Then, the molding system separates the material contact surface 100 of the fixed mold 11 and the movable mold 12 with which the molding material comes into contact via the material supply nozzle 31 and the nozzle receiving surface 131. It has a release agent supply path 16 configured to supply a mold agent and allow the release agent to adhere to the material contact surface 100, and the fixed mold 11 and the movable mold 12 can be separated from a molded product. It has a support mechanism (not shown) that can support in a state where it is arranged to face less than the interval.
[0036]
In order for the release agent to adhere to the material contact surface 100, the fixed die 11 and the movable die 12 must be arranged so as to face each other less than the interval at which the molded product can be released. The release agent is supplied to the material contact surface 100 via a space between the supply nozzle 31 and the nozzle receiving surface 131.
[0037]
The hot runner type molding die and molding system of this example will be specifically described.
As shown in FIGS. 1 and 3, the molding die 1 includes a fixed mold 11 and a movable mold 12 which form a molding cavity 10 by clamping, and a hot runner system 3 is provided.
The stationary die 11 is provided with a horn-shaped nozzle storage space 13 which communicates with the molding cavity 10 and is opened to the outside of the molding die 1, and a side surface of the nozzle storage space 13 on the molding cavity 10 side. The whole is a nozzle receiving surface 131.
The fixed die 11 is provided with a release agent supply path 16 communicating with the nozzle storage space 13. The release agent supply path 16 is constituted by a simple through hole.
[0038]
Reference numerals 171 and 172 in the present example are division surfaces where the fixed mold 11 and the movable mold 12 come into contact with each other.
Further, the material contact surface 100 of the molding die 1 of the present embodiment is formed by cavity surfaces 101 and 102 constituting the molding cavity 10. In this embodiment, the tip surface 310 of the material supply nozzle 31 is also a part of the material contact surface 100.
[0039]
In the present embodiment, as shown in FIG. 1, an injection nozzle 291 provided outside the molding die 1 for injecting a pressurized release agent to the release agent supply path 16 provided in the fixed mold 11, and a release An agent tank 29 is provided.
Further, in this example, the fixed mold 11 and the movable mold 12 adhere to the mold release agent in the state shown in FIG. 1 in which the mold is clamped. Therefore, in order to use the drive mechanism of the molding die 1 as it is, the bearing mechanism is not shown in FIGS. 1 and 2.
[0040]
Next, the hot runner system 3 of the present example will be described.
As shown in FIG. 1, the hot runner system 3 includes a fixed die fixing plate 33 having a material supply path 321 for supplying a molding material from a molding apparatus main body (not shown), a hot runner manifold 32, and a nozzle fixing plate 35. .
In the vicinity of the material supply path 321 in the hot runner manifold 32, a heat medium flow path 320 for keeping the material supply path 321 warm is provided.
[0041]
The nozzle fixing plate 35 is provided with a material supply nozzle 31 for injecting a molding material into the molding cavity 10, and the material supply nozzle 31 is also provided with a heat medium passage 320. In addition, a concave portion 350 is provided on the surface of the nozzle fixing plate 35 facing the fixed die 11, and an elastic spring 355 is set here. Further, the lid 292 is fitted into the material supply nozzle 31 so as to be in contact with the elastic spring 355.
[0042]
The molding of the molded body using the molding die 1 according to the present example will be described.
The molding processes are listed in time series. (1) Clamping of the molding die 1, (2) Advance of the material supply nozzle 31, (3) Injection of molten metal, (4) Completion of filling of the molding cavity 10, (5) Solidification of the molten metal, (6) retreat of the material supply nozzle 31, (7) opening of the molding die 1, and (8) removal of the molded product.
The above (1) to (8) constitute one cycle of molding.
[0043]
As shown in FIG. 1, the movable mold 12 and the fixed mold 11 are clamped.
Next, the material supply nozzle 31 is inserted into the nozzle storage space 13. At this time, a gap is formed between the material supply nozzle 31 and the nozzle receiving surface 131 so as not to block the release agent supply path 16 provided in the nozzle storage space 13 with the material supply nozzle 31. To do. By this insertion, the lid 292 provided on the material supply nozzle 31 seals the nozzle storage space 13.
[0044]
In this state, the release agent is injected from the injection nozzle 291 to the release agent supply path 16. The release agent enters the molding cavity 10 via the release agent supply path 16 and between the material supply nozzle 31 and the nozzle receiving surface 131 in the nozzle storage space 13.
By this injection, a lubricating film of the release agent was formed on the material contact surface 100.
[0045]
Next, as shown in FIG. 2, the material supply nozzle 31 is advanced toward the nozzle receiving surface 131, and the two are brought into contact with each other. At this time, the lid 292 is housed in the recess 350 provided in the nozzle fixing plate 35 while the elastic spring 355 is compressed.
Thereby, the release agent supply path 16 is separated from the molding cavity 10.
[0046]
Subsequently, a molten metal of the molding material is injected from the material supply nozzle 31, and the inside of the molding cavity 10 is filled with a required amount of molten metal.
After filling, the molding die 1 is cooled, the molten metal is solidified, and the material supply nozzle 31 is retracted.
Then, the movable mold 12 is separated from the fixed mold 11 by the mold driving mechanism, and the mold is opened. Then, the molded product is taken out.
Thereafter, as shown in FIG. 1, the mold is clamped again and the next molding cycle is started.
[0047]
Next, the operation and effect of this example will be described.
In this example, the fixed mold 11 and the movable mold 12 are arranged in a state where the mold is clamped, and the release agent is supplied from the release agent supply path 16 provided in the fixed mold 11 between the material supply nozzle 31 and the nozzle receiving surface 131. And is attached to the material contact surface 100.
For this reason, it is possible to prevent the release agent from adhering to the divided surfaces 171 and 172 of the fixed mold 11 and the movable mold 12. Further, it is possible to prevent the release agent from scattering to the outside of the fixed mold 11 and the movable mold 12.
[0048]
Therefore, the release agent can be used without waste, and the stock solution itself can be used without moisture for diluting the release agent. Alternatively, the amount of water for diluting the release agent can be made smaller than before.
For this reason, it is possible to prevent the temperature from dropping due to the adhesion of the release agent to the molding die 1, and it is possible to secure excellent meltability. In addition, due to the improvement of the molten metal running property, the appearance quality of the molded product can be improved and the defective rate can be reduced.
Further, since the thermal stress of the molding die 1 can be reduced, the life of the molding die can be extended.
[0049]
In addition, scattering or dripping out of the molding die 1 is unlikely to occur, and the working environment is unlikely to deteriorate. Since the molding die 1 is not in a greatly opened state when the release agent is attached, the release agent is unlikely to adhere to the part other than the material contact surface 100. Therefore, the time required for applying the release agent can be shortened, and the time required for air blow or the like for drying the attached release agent can be similarly shortened. Therefore, the molding cycle time can be reduced.
[0050]
Further, in this example, the release agent is supplied from a gap generated between the material supply nozzle 31 and the nozzle receiving surface 131. Since this can be realized by providing a small hole for the release agent (that is, the release agent supply path 16) in the fixed mold 11, the release agent can be used without making a large modification to the existing molding die. A supply path can be secured. Therefore, the method of applying the release agent according to the present example has a low introduction cost.
[0051]
Further, in this example, when the material supply nozzle 31 advances when the molten metal is introduced into the molding cavity 10, the release agent supply path 16 can be separated from the molding cavity 10, so that the backflow of the molten metal can be prevented, and the like. There is no need to provide a separate blocking mechanism in the release agent supply path 16, and the cost can be reduced.
[0052]
As described above, there is provided a method of attaching a release agent to a molding die, which prevents overcooling of the molding die, shortens the molding cycle time, prevents the working environment from deteriorating, and extends the life of the molding die. can do.
[0053]
Embodiment 2
In this example, a case where a mold release agent supply path is provided on the side of a fixed mold fixed plate or a molding apparatus in a molding system will be described.
As shown in FIG. 4, the molding system 4 of the present embodiment produces a molded product using a molding die 1 including a fixed die 11 and a movable die 12.
The movable mold 12 is mounted on a movable fixed plate 492 via a movable mounting plate 491, and is configured to be able to advance and retreat with respect to the fixed mold 11. The drive mechanism of the movable mold 12 is not shown.
[0054]
In the fixed mold 11, a material supply path 321 communicating with the molding cavity 10 is provided. The material supply path 321 is formed by the sprue bush 115 incorporated in the fixed mold 11.
The fixed die 11 is mounted on the fixed fixed plate 482 via the fixed mounting plate 481.
The sprue bush 115 is also incorporated in the fixed mounting plate 481. A nozzle receiving surface 131 is provided in the material supply path 321 of the sprue bush 115 on the fixed type mounting plate 481 side.
[0055]
Further, a storage space 485 for the nozzle 41 is provided in the fixed type fixed plate 482 so as to communicate with the material supply path 321 via the nozzle receiving surface 131.
Reference numeral 47 denotes a locate ring.
A lid 42 is provided on the outer periphery of the nozzle 41, and the nozzle storage space 485 is sealed by inserting the nozzle 41 into the nozzle storage space 485.
In addition, the fixed mold 11 and the movable mold 12 can be directly attached to the fixed fixed plate 482 and the movable fixed plate 492.
[0056]
A release agent supply path 53 is provided in the fixed type fixing plate 482 so as to open to the nozzle storage space 485. The release agent supply path 53 includes an injection nozzle, and the injection nozzle is connected to the release agent tank and the control device 51 via a pipe 52.
A predetermined pressure and a predetermined amount of the release agent are supplied from the injection nozzle to the nozzle storage space 485 from the release agent tank via the pipe by a signal from the control device.
[0057]
The operation of the molding system 4 according to the present example will be described.
The fixed mold 11 and the movable mold 12 are clamped to form a molding cavity 10.
The nozzle 41 is advanced with respect to the nozzle storage space 485, and the nozzle storage space 485 is sealed with the lid 42.
In this state, a command is issued from the control device, and a predetermined pressure and a predetermined amount of the release agent are released from the release agent tank 51 through the pipe 52 from the injection nozzle 53 to the nozzle storage space 485, the nozzle 41 and the receiving surface 131. The release agent is supplied to the material supply path 321 and the molding cavity 10 through the gap of (1). Thus, a lubricating film of the release agent is formed on the material contact surface 100.
[0058]
Thereafter, the nozzle 41 is further advanced to bring the nozzle 41 into contact with the nozzle receiving surface 131. Thereby, the release agent supply path 53 is separated from the molding cavity 10 and the material supply path 321. Next, a molding material is injected into the molding cavity 10 from the nozzle 41 and is filled therein.
[0059]
Thereafter, the molding die is cooled to solidify the molding material, the nozzle 41 is retracted, and the molding die 1 is opened to take out the molded product.
Thereafter, as shown in FIG. 4, the mold is closed again, and the next molding cycle is started.
Other details are the same as those of the first embodiment, and the same effects can be obtained also in the present embodiment.
[0060]
The injection nozzle serving as the release agent supply path 53 may be provided integrally with the nozzle 41 as shown in FIG.
In this case, the same operation and effect as described above can be obtained.
[Brief description of the drawings]
FIG. 1 is an explanatory view of a main part of a molding system at the time of supplying a release agent according to a first embodiment.
FIG. 2 is an explanatory view of a main part of a molding system at the time of supplying molding material according to the first embodiment.
FIG. 3 is a development explanatory view of a molding die in the first embodiment.
FIG. 4 is an explanatory view of a molding system according to a second embodiment, in which a release agent supply path is provided in a stationary mold fixing plate.
FIG. 5 is an explanatory diagram of a molding system according to a second embodiment, in which a nozzle is provided with a release agent supply path.
[Explanation of symbols]
1. . . Molding dies,
10. . . Molding cavity,
11. . . Fixed type,
12. . . Movable type,
131. . . Nozzle receiving surface,
16. . . Release agent supply route,
100. . . Material contact surface,
4. . . Molding system,

Claims (9)

成形装置と成形金型とよりなる成形システムにおいて,
上記成形金型は,型締めにより成形キャビティを形成可能に構成された少なくとも固定型と可動型とよりなり,
上記成形キャビティに対し,成形装置から成形材料を供給するよう構成された材料供給用ノズルと対面するノズル受け面が連結されてあり,
上記成形システムを用いて成形材料を成形する際に,上記成形金型において上記成形材料が接する材料接触面に対して離型剤を付着させるにあたり,
上記固定型と上記可動型とを成形品離型可能な間隔未満に対面配置した状態となし,この状態で,上記材料供給用ノズルと上記ノズル受け面との間を経由して上記離型剤を上記材料接触面に対して供給することを特徴とする成形金型への離型剤の付着方法。
In a molding system consisting of a molding device and a molding die,
The molding die comprises at least a fixed die and a movable die which can form a molding cavity by clamping.
A nozzle receiving surface facing a material supply nozzle configured to supply a molding material from a molding device is connected to the molding cavity,
When molding a molding material using the molding system, in order to attach a release agent to a material contact surface of the molding die that contacts the molding material,
A state in which the fixed mold and the movable mold are disposed so as to face each other less than an interval at which a molded product can be released, and in this state, the release agent passes between the material supply nozzle and the nozzle receiving surface. And supplying the mold release agent to the material contact surface.
請求項1において,上記離型剤を上記材料接触面に付着させる際には,上記材料供給用ノズルと上記ノズル受け面との間に隙間が形成されるように両者を配置し,上記離型剤を供給し,
上記離型剤の付着を終えて上記成形材料を上記成形キャビティに供給する際には,上記材料供給用ノズルと上記ノズル受け面とを当接させ,両者間を閉塞することを特徴とする成形金型への離型剤塗布方法。
2. The method according to claim 1, wherein when the release agent is applied to the material contact surface, the release agent is disposed so that a gap is formed between the material supply nozzle and the nozzle receiving surface. Supply the agent,
When the molding material is supplied to the molding cavity after the adhesion of the release agent, the material supply nozzle and the nozzle receiving surface are brought into contact with each other and the space therebetween is closed. A method for applying a release agent to a mold.
請求項1または2において,上記固定型と上記可動型とを型締めした状態となし,この状態で上記材料接触面に対し離型剤を付着させることを特徴とする成形金型への離型剤の付着方法。3. The mold release to a molding die according to claim 1, wherein the fixed mold and the movable mold are in a clamped state, and a mold release agent is attached to the material contact surface in this state. How to apply the agent. 請求項1〜3のいずれか一項において,上記成形金型はホットランナ用金型であり,上記材料供給用ノズルはホットランナノズルであることを特徴とする成形金型への離型剤の付着方法。The mold according to any one of claims 1 to 3, wherein the molding die is a hot runner die, and the material supply nozzle is a hot runner nozzle. Attachment method. 請求項1〜4のいずれか一項において,上記離型剤は,上記材料供給用ノズルと上記ノズル受け面との間の隙間に対し開口するよう形成した離型剤供給経路より供給することを特徴とする成形金型への離型剤の付着方法。5. The method according to claim 1, wherein the release agent is supplied from a release agent supply path formed to open to a gap between the material supply nozzle and the nozzle receiving surface. 6. A characteristic method of attaching a release agent to a molding die. 成形装置と成形金型とよりなる成形システムにおいて,
上記成形金型は,型締めにより成形キャビティを形成可能に構成された少なくとも固定型と可動型とよりなり,
上記成形キャビティに対し,成形装置から成形材料を供給するよう構成された材料供給用ノズルと対面するノズル受け面が連結されてあり,
上記成形システムを用いて成形材料を成形する際に,上記成形金型において上記成形材料が接する材料接触面に対して,上記材料供給用ノズルと上記ノズル受け面との間を経由して離型剤を供給し,上記材料接触面に上記離型剤を付着可能に構成された離型剤供給経路を有することを特徴とする成形システム。
In a molding system consisting of a molding device and a molding die,
The molding die comprises at least a fixed die and a movable die which can form a molding cavity by clamping.
A nozzle receiving surface facing a material supply nozzle configured to supply a molding material from a molding device is connected to the molding cavity,
When the molding material is molded using the molding system, the mold is released from the material contact surface of the molding die that is in contact with the molding material via the material supply nozzle and the nozzle receiving surface. A molding system having a release agent supply path configured to supply an agent and to allow the release agent to adhere to the material contact surface.
請求項6において,上記固定型と上記可動型とを成形品離型可能な間隔未満に対面配置した状態に支承可能とする支承機構を有することを特徴とする成形システム。7. The molding system according to claim 6, further comprising a bearing mechanism capable of supporting the fixed mold and the movable mold in a state in which the fixed mold and the movable mold are arranged to face each other less than an interval at which a molded product can be released. 請求項6または7において,上記成形装置に対し上記固定型を取付るよう構成された固定型固定板に,上記材料供給用ノズルと上記ノズル受け面との間の隙間に対し開口するよう形成した離型剤供給経路を設けることを特徴とする成形システム。8. The fixed die fixing plate according to claim 6 or 7, wherein the fixed die is configured to be attached to the molding device so as to open to a gap between the material supply nozzle and the nozzle receiving surface. A molding system characterized by providing a release agent supply path. 請求項6〜8のいずれか一項において,上記成形装置に,上記離型剤供給経路を設けることを特徴とする成形システム。The molding system according to any one of claims 6 to 8, wherein the molding device is provided with the release agent supply path.
JP2000231822A 2000-07-31 2000-07-31 Method of attaching release agent to molding die and molding system Expired - Lifetime JP3558020B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2000231822A JP3558020B2 (en) 2000-07-31 2000-07-31 Method of attaching release agent to molding die and molding system
US09/915,391 US6651726B2 (en) 2000-07-31 2001-07-27 Method of attaching mold releasing agent to molding die, molding apparatus and molding die
DE10137086A DE10137086B4 (en) 2000-07-31 2001-07-30 A method of applying a mold release agent to a die
CA002354332A CA2354332C (en) 2000-07-31 2001-07-30 Method of attaching mold releasing agent to molding die, molding apparatus and molding die

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