JP3558028B2 - Substrate cutting method and substrate cutting device - Google Patents
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- JP3558028B2 JP3558028B2 JP2000313260A JP2000313260A JP3558028B2 JP 3558028 B2 JP3558028 B2 JP 3558028B2 JP 2000313260 A JP2000313260 A JP 2000313260A JP 2000313260 A JP2000313260 A JP 2000313260A JP 3558028 B2 JP3558028 B2 JP 3558028B2
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Description
【０００１】
【発明の属する技術分野】
この発明は、トランジスタやＬＳＩなどの電子回路が形成された半導体チップを複数実装した基板を複数に切断する装置に関する。
【０００２】
【従来の技術】
トランジスタやＬＳＩなどの電子回路が形成された半導体チップ（以下「チップ」という）のパッケージ形態として、パーケージの外形寸法を小さくするために、チップを直接ガラスエポキシ基板（以下「基板」という）に実装して、そのあとチップ外形とほぼ同じ外形となるように基板を切断して得るＣＳＰ（Ｃｈｉｐ Ｓｉｚｅ Ｐａｃｋａｇｅ）がある。
【０００３】
図２２にＣＳＰの生産工程の一例を示す。はじめに、基板９上に電子回路が形成されたチップ８複数個を整列してはんだ付け実装する。図２２（１）は、複数個のチップ８が基板９上に実装された状態の斜視図である。次に複数個のチップ８を電気的に絶縁し、湿気や外的キズから保護するために、封止樹脂８１をチップを覆うように基板９上に塗布する。
【０００４】
図２２（２）は、複数個のチップ８が実装された基板９上に封止樹脂８１が塗布された状態を示す図である。この際、封止樹脂８１が基板９の側方から流れ出ないように基板９の外形寸法と同じ寸法を内形とする封止樹脂堰止めを利用する。封止樹脂８１は、電気的絶縁、耐湿を考慮して例えばエポキシ系の樹脂が用いられる。封止樹脂８１の硬化後、封止樹脂堰止めを取り外す。
【０００５】
次に複数個のチップ８が個々に分割されるように、封止樹脂８１が上面に形成された基板９を、縦方向および横方向に切断して基板個片９０、９０、…を取り出す。この基板個片９０、９０、…がＣＳＰである（図２２（３））。一般に樹脂は硬化の際収縮するため、封止樹脂硬化工程において、基板９上の封止樹脂８１も収縮する。封止樹脂８１の収縮の際、基板９の上面にのみ収縮する力が作用するため、基板９に反りが生じる場合が多い。
【０００６】
図２２（４）は、封止樹脂硬化工程で基板９に反りが生じた状態を示す図である。一般に、このような基板の切断には、回転式基板カッターを用いる切断手法がとられている。回転式基板カッターを用いた基板切断装置の従来例として特開平１０−４３９８０がある。この公報には、合成樹脂製のフレーム板に多面取りされた半導体素子等を組み込んだ絶縁保護部を有するパッケージを切断するに際し、パッケージを密着状態で受け入れる凹陥部を形成した保持枠部材にフレーム板を載置し、該フレーム板の各パッケージを凹陥部に密嵌すると共に、各パッケージを真空吸引することによってフレーム板を保持枠部材に固定した状態で各パッケージの周縁部をルータカッターで切断してフレーム板からパッケージを分離することを特徴とするパッケージの切断方法が記載されている。
【０００７】
【発明が解決しようとする課題】
しかし、反りを有する基板を特開平１０−４３９８０記載の切断方法で切断すると、基板の反りのために真空吸引部と基板下面の間に隙間が生じ、基板を真空吸引部で吸着するだけの吸引力が確保できない。その結果、基板を縦方向および横方向に切断した直後に、個片となった基板が保持枠部材に載置された状態を保てず、飛散してしまう虞があった。
【０００８】
また、ＣＳＰのような個片の外形が小さい基板では、基板個片を吸引するための吸引部面積が小さくなり、吸引力が低下して基板個片を吸着するだけの吸引力が確保できない。その結果、この場合にも基板切断直後に、個片となった基板が保持枠部材に載置された状態を保てず、飛散してしまう虞があった。
【０００９】
【課題を解決するための手段】
前記課題を解決するため、この発明による基板切断方法は、電子回路が形成された半導体チップが複数個実装された基板を切断して複数の基板個片を得る基板切断方法において、基板を切断する際に基板を載置する基板載置台と、基板載置台の上方に配置され、円盤状の回転刃を備えた基板カッターと、基板カッターが基板を切断するとき基板上の切断ライン近傍を押圧することができ、互いに平行に所定のピッチで並んだ複数の板状の押え歯からなる基板押え部とを備えた基板切断装置を使用し、基板載置台に対し基板を載置する工程と、基板カッターを、基板を切断するように回転刃を回転させかつ上下移動させる工程および基板載置台を基板上の切断ラインが互いに平行になるように所定のピッチで駆動し、位置決めする工程を繰り返すことにより、前記複数の板状の押え歯の並び方向と同一の方向に、基板を所定のピッチで複数回切断する第一の切断工程と、第一の切断工程の後、基板の向きを９０度回転させる工程と、基板押え部で基板が切断されるライン近傍を押圧する工程、基板押え部で基板を押圧しつつ、基板カッターを、基板を切断するように回転刃を回転させかつ上下移動させる工程、および第一の切断工程の切断方向と垂直な方向に、基板載置台を切断ラインが互いに平行になるように所定のピッチで駆動し、位置決めする工程を繰り返すことにより基板を所定のピッチで複数回切断する第二の切断工程とからなる。
【００１０】
この発明の基板切断方法を用いると、基板押え部を用いて基板を切断することにより、基板に反りがあっても、または切断後の基板個片の形状がＣＳＰのように小さくても、基板押え部よって基板が基板載置台に対し押圧される為、切断後の基板個片が基板載置台に対し保持されて、飛散することがない。
【００１１】
またこの発明による基板切断方法は、前記押え歯のピッチに対し、第一の切断工程における切断ピッチが整数倍であるようにすることができる。このようにすると、少なくとも１枚の押え歯が、基板個片１個を押圧するため、切断後の基板個片が基板載置台に対し保持されて、飛散することがない。
【００１２】
またこの発明による基板切断装置では、電子回路が形成された半導体チップが複数個実装された基板を切断して複数の基板個片を得る基板切断装置において、基板を切断ラインが互いに平行になるように所定のピッチで複数回切断する第一の切断装置と、基板を第一の切断装置で切断する方向と垂直な方向に切断する第二の切断装置を有し、第二の切断装置は、基板を載置する基板載置台と、基板載置台の上方に配置され、基板の切断によって得られる基板個片それぞれと当接することができ、互いに平行に所定のピッチで並んだ複数の板状の押え歯からなる基板押え部と、基板押え部が基板の切断されるライン近傍を押圧するように基板押え部を移動させる基板押え部駆動機構と、基板載置台の上方に配置され、円盤状の回転刃を備えた基板カッターと、回転刃が回転しながら基板を切断するように回転刃を回転させかつ上下移動させる回転刃駆動機構と備え、さらに前記第二の切断装置における前記複数の板状の押え歯の並び方向と、前記基板を第二の切断装置で切断する方向とが同一の方向であることを特徴とする。
【００１３】
この装置を用いて基板を切断するときは、まず第一の切断装置で基板を切断ラインが互いに平行になるように所定のピッチで複数回切断する。次に、第一の切断装置で切断した複数の切断ラインの垂直方向が第二の切断装置の切断ラインになるように、第二の切断装置の基板載置台に第一の切断装置で切断した基板を載置し、基板押え部駆動機構を駆動させて、基板押え部で基板の切断されるライン近傍を押圧する。次に回転刃駆動機構を駆動させて回転刃を回転させ、さらに回転刃を徐々に基板に対して下降させて切断ラインに切り込みをいれることにより複数の基板個片を得る。
【００１４】
またこの発明による基板切断装置では、前記押え歯のピッチに対し、第一の切断装置で基板を切断するピッチが整数倍となるようにすることができる。個々の押え歯の幅寸法は、切断後得られる基板個片の切断ライン方向の寸法より小さい寸法が望ましい。すなわち基板個片を１枚または２枚以上の押え歯で押圧するのがよい。このようにすると、すくなくとも１枚の押え歯が、基板個片１個を押圧するため、切断後の基板個片が基板載置台に対し保持されて、飛散することがない。
【００１５】
第二の切断装置では、１ラインだけ切断してもよいし、複数ライン切断してもよい。複数ライン切断するときは、基板押え部による基板切断ライン近傍の押圧と、回転刃による切断と、回転刃の面と垂直方向に回転刃と基板載置台とを基板上の切断ラインが互いに平行になるように所定のピッチで相対的に移動させることとを繰り返す。
【００１６】
第一の切断装置と第二の切断装置を別の装置として設けるのではなく、１つの切断装置をまず第一の切断装置として使用し、次いで同じ装置を第二の切断装置として使用するようにしてもよい。この場合の基板切断装置の基板載置台、基板カッターおよび回転刃駆動機構は、この装置を第一の切断装置として使用するときにも第二の切断装置として使用するときにも使用する。また、基板押え部は、この装置を第一の切断装置として使用するときにも用いることができる。
【００１７】
この発明の基板切断装置を用いると、基板押え部を用いて基板を切断することにより、基板に反りがあっても、または切断後の基板個片の形状がＣＳＰのように小さくても、基板押え部よって基板が基板載置台に対し押圧される為、切断後の基板個片が基板載置台に対し保持されて、飛散することがない。
【００１９】
またこの発明による基板切断装置では、前記押え歯の少なくとも基板と当接する部分の材質が樹脂からなるようにすることができる。押え歯の基板と当接する部分の材質を樹脂にすると、基板にキズがつかない、または樹脂の摩擦性で基板を滑らずに所定の位置を押圧できる効果がある。樹脂は軟質樹脂が望ましい。
【００２０】
またこの発明による基板切断装置では、前記基板押え部が樹脂で形成された１または複数の弾性部材からなるようにすることができる。樹脂は弾性変形する軟質樹脂が望ましい。弾性部材の厚みは、所定の弾性変形量が得られる厚みが必要である。すなわち、反りを有する基板を弾性部材で押圧する場合、まず弾性部材が弾性変形しながら基板を押圧し、基板切断後、弾性部材が弾性変形を復元させて基板個片すべてを基板載置台に対し押圧できるような弾性部材の厚みにする必要がある。このようにすると、切断後の基板個片が基板載置台に対し保持されて、飛散することがない。
【００２１】
またこの発明による基板切断装置では、前記基板押え部が所定のピッチで配置された複数の弾性部材からなり、複数の弾性部材のピッチに対し、第一の切断装置で基板を切断するピッチが整数倍となるようにすることができる。弾性部材が複数部からなり、個々の弾性部材の間に空間がある場合は、弾性部材が一体でなる場合に比べて弾性部材の弾性変形量を大きくすることができる。それは、複数の弾性部材の個々が基板を押圧して弾性変形する時、弾性部材が押圧方向と垂直な空間方向に変形しやすいため、その結果押圧方向の弾性変形量を大きくできるからである。
【００２２】
このようにすると、反りの大きな基板を押圧する場合でも、複数の弾性部材によって切断後の基板個片を基板載置台に対し押圧することができる。また、少なくとも１個の弾性部材が、基板個片１個を押圧するため、切断後の基板個片が基板載置台に対し保持されて、飛散することがない。
【００２３】
またこの発明による基板切断装置では、前記基板押え部を２個以上備え、基板の切断されるラインの両側をそれぞれ基板押え部が押圧することができる。基板の切断ラインの両側をそれぞれ基板押え部で押圧することにより、切断後の基板個片および切断前の基板をともに基板載置台に対し押圧することができる。
【００２４】
またこの発明による基板切断装置では、基板載置台の上方に配置され、基板の外周部と当接して基板を基板載置台に押圧する基板外周押圧部と、基板外周押圧部が基板の外周部を基板載置台に押圧するように基板外周押圧部を移動させる基板外周押圧部駆動機構とをさらに備えるようにすることができる。基板外周押圧部は、第一の切断装置と第二の切断装置のいずれかに備わっていてもよいし、どちらにも備わっていてもよい。
【００２５】
また、第一の切断装置と第二の切断装置を別の装置として設けるのではなく、１つの切断装置をまず第一の切断装置として使用し、次いで同じ装置を第二の切断装置として使用する場合、基板外周押圧部はこの装置を第一の切断装置として使用するときにも第二の切断装置として使用するときにも使用する。この場合に、基板外周押圧部を用いて基板を切断するときは、はじめに基板載置台に基板を載置し、基板外周押圧部駆動機構を駆動させて基板外周押圧部を基板に対して下降させ、基板の外周部を押圧しつつ、基板上の切断ラインが互いに平行になるように所定のピッチで複数回切断する第一の切断を行う。
【００２６】
次に、第一の切断で切断した切断ラインの垂直方向が新たな切断ラインとなるように基板を回転させる。このとき、基板外周押圧部は基板を押圧したまま基板とともに回転する。そして基板押え部を用いつつ第二の切断を行う。
【００２７】
このようにすると、基板の反りが軽減されるため、基板押え部で基板を押圧する力は、基板押え部だけで基板を押圧する力より小さくて済み、基板押え部の設計時における材質の選定および形状設計の自由度が向上する。基板外周押圧部は基板の外周部の一部と当接しても、外周部全域と当接してもよい。なお、基板の外周部は通常はチップが実装されておらず、基板切断後、基板個片として利用する領域ではない。
【００２８】
またこの発明による基板切断装置では、電子回路が形成された半導体チップが複数個実装された基板を切断して複数の基板個片を得る基板切断装置において、基板を切断する際に基板を載置する基板載置台と、基板載置台の上方に配置され、基板の切断によって得られる基板個片それぞれと当接することができ、互いに平行に所定のピッチで並んだ複数の板状の押え歯からなる基板押え部と、基板押え部が基板の切断されるライン近傍を押圧するように基板押え部を移動させる基板押え部駆動機構と、基板載置台の上方に配置され、円盤状の回転刃を備えた基板カッターと、回転刃が回転しながら前記基板を切断するように回転刃を回転させかつ上下移動させる回転刃駆動機構とを備え、さらに前記複数の板状の押え歯の並び方向と、前記基板を切断する方向とが同一方向であることができる。
【００２９】
この発明の基板切断装置を用いると、基板押え部を用いて基板を切断することにより、基板に反りがあっても、または切断後の基板個片の形状がＣＳＰのように小さくても、基板押え部よって基板が基板載置台に対し押圧される為、切断後の基板個片が基板載置台に対し保持されて、飛散することがない。
【００３０】
【発明の実施の形態】
図１はこの発明の一実施例である基板切断装置９９の切断ラインと垂直な面の断面図である。図２は、基板切断装置９９の切断部を上から見た図である。基板切断装置９９は、櫛状基板押え板１、２、櫛状基板押え板１、２を駆動する基板押え板駆動機構９１、９２、回転式基板カッター３、回転式基板カッター３を駆動する回転式基板カッター駆動機構９３、基板載置台５、および基板載置台駆動機構５０を備えている。
【００３１】
櫛状基板押え板１は、複数の押え歯１１、１１、・・・からなる基板押え部１ａと押え歯１１、１１、・・・を保持する押え歯保持部１ｂを備えている。同様に、櫛状基板押え板２は、複数の押え歯２１、２１、・・・からなる基板押え部２ａと押え歯２１、２１、・・・を保持する押え歯保持部２ｂを備えている。基板押え板駆動機構９１は押え歯保持部１ｂに、基板押え板駆動機構９２は押え歯保持部２ｂに連結されており、それぞれ櫛状基板押え板１、２を基板４に対し、上昇、下降させることができる。
【００３２】
回転式基板カッター３は、円盤状刃部３ａ、円盤状刃部３ａの回転軸３ｂを備えている。回転式基板カッター駆動機構９３は、回転軸３ｂに連結されており、円盤状刃部３ａを回転、および基板４に対して上昇、下降、さらに切断ラインにそって移動の各運動をさせることができる。円盤状刃部３ａの材質は、本実施例ではニッケル・ダイアモンド合金である。
【００３３】
基板載置台５には垂直方向に複数の真空吸引孔６が形成されており、基板載置台５の下方には真空吸引孔６に連結された真空吸引機構６１を備えている。また基板載置台５は、回転式基板カッター３の円盤状刃部３ａが基板載置台５に接触しないように凹部５１、５１、・・・を備えている。
【００３４】
基板載置台駆動機構５０は、基板載置台５に連結されており、基板載置台５の垂直方向を軸として回転させることができる。また、基板載置台駆動機構５０には、図示していないリニアモーターとリニアエンコーダーが備わっており、基板を円盤状刃部３ａの面と垂直な方向に所定のピッチで移動させることができる。押え歯１１、１１、・・・と押え歯保持部１ｂとは同一材でプレス成形によって一体に形成する。同様に押え歯２１、２１、・・・と押え歯保持部２ｂとは同一材でプレス成形によって一体に形成する。材質、板厚は、押え歯がばね性を有するように設計する必要があり、本実施例では厚み０．８ｍｍのステンレス板で形成する。
【００３５】
押え歯１１、１１、・・・、および押え歯２１、２１、・・・は、図１に示すように中間部でへの字状に屈曲した構造にする。押え歯１１、１１、・・・、および押え歯２１、２１、・・・のピッチ、および歯幅は、基板４を基板載置台５に対し確実に押圧するため、基板個片４１、４２、４３、４４、４５、４６、・・・のそれぞれを、押え歯１１、１１、・・・、または押え歯２１、２１、・・・の１枚または２枚以上で押圧できるピッチ、歯幅にする。
【００３６】
ここで、反りを有する基板を、歯幅が基板個片４１、４２、４３、４４、４５、４６、・・・の切断方向外形寸法よりも長い押え歯で押圧する場合に生じる不具合について説明する。図３から図１２は、基板個片の寸法と、押え歯の歯幅との関係を説明する図である。
【００３７】
図３は、基板４の短手方向の切断が全て終了した後、長手方向の切断が一部終了した時点の基板４を上方からみた図で、図４はそのＡ部拡大図である。次の工程で切断するラインはＢである。基板個片４１、４２、４３、・・・の短手方向寸法は４．５ｍｍ、長手方向の寸法は５ｍｍである。従って、基板個片４１、４２、４３、・・・の長手方向ピッチは５ｍｍである。ここでは説明を簡単にするため、基板切断時の切断しろは無視できるものとする。
【００３８】
図５は、図４の基板４を本実施例である歯幅が３ｍｍ、ピッチが基板個片の長手方向ピッチと同じ５ｍｍの押え歯１１、１１、１１、・・・および２１、２１、２１、・・・でラインＢ近傍を押圧している状態である。図６は、図５の断面ＣＣである。基板４に反りが生じているため、押え歯１１、１１、１１、・・・によって基板４が押圧されているにもかかわらず、切断後基板個片４４となる基板と基板載置台５との間に隙間が生じている。
【００３９】
図７は、図５において、ラインＢをＤ点からＥ点まで切断したときの状態で、図８は、図７の断面ＣＣである。ラインＢをＤ点からＥ点まで切断すると、基板個片４４が基板の他の部分から分離する。このとき、基板個片４４は押え歯１１と接触しており、基板載置台５に対して押圧されるため飛散することがない。
【００４０】
本発明との対比のため、押え歯一枚で複数の基板個片を押圧したときに生じる不都合について説明する。図９は、図４の基板４を、歯幅１１ｍｍの押え歯一枚で基板個片３個分を押圧している状態である。図１０は、図９の断面ＣＣである。基板４に反りが生じているため、切断後基板個片４４となる基板と基板載置台５との間に隙間が生じている。
【００４１】
図１１は、図９において、ラインＢをＤ点からＥ点まで切断したときの状態で、図１２は、図１１の断面ＣＣである。この状態で、歯幅１１ｍｍの押え歯は、切断後基板個片４５、４６となる基板とは接触するが、基板個片４４とは接触できず基板載置台５に対して押圧することができない。その結果、基板個片４４は飛散してしまう虞がある。
【００４２】
図１に戻って、押え歯１１、１１、・・・、および２１、２１、・・・の基板押圧側端部は軟質樹脂１ｃ、２ｃで覆われている。軟質樹脂１ｃ、２ｃで覆うためには、液状の発泡ウレタン樹脂を押え歯１１、１１、・・・、および２１、２１、・・・の基板押圧側端部に厚み２ｍｍ塗布し、大気中に放置して硬化させればよい。
【００４３】
また、基板押え部が、押え歯に代えて樹脂で形成された弾性部材で形成されている実施例を図１３に示す。図１３は、基板切断装置９９の切断ラインと垂直な面の断面図である。図１４は、図１３の断面ＦＦである。弾性部材付基板押え板１３は弾性部材１３ａおよび弾性部材１３ａを保持する弾性部材保持部１３ｂより形成されており、同様に弾性部材付基板押え板１４は弾性部材１４ａおよび弾性部材１４ａを保持する弾性部材保持部１４ｂより形成されている。
【００４４】
本実施例では、弾性部材１３ａ、１４ａの材質は弾性変形量の大きいウレタン樹脂で形成する。弾性部材保持部１３ｂ、１４ｂは厚み０．８ｍｍのステンレス板で形成する。弾性部材保持部１３ｂ、１４ｂに対して、弾性部材１３ａ、１４ａは接着剤で固定する。
【００４５】
反りが１ｍｍの基板を押圧する場合、ウレタン樹脂で形成された弾性部材の厚みは６ｍｍにする。厚さ６ｍｍのウレタン樹脂で形成された弾性部材は最大２ｍｍ弾性変形するため、反りが１ｍｍの基板を隙間無く押圧することができる。この場合、弾性部材１３ａは基板４の外周部では２ｍｍ弾性変形し、中央部では１ｍｍ弾性変形し、基板外周部および中央部ともに押圧することができる。さらに、基板切断後、弾性部材１３ａは弾性変形を復元して基板個片を基板載置台５に対して押圧するため、基板個片は基板載置台５に保持されて飛散することがない。
【００４６】
図１５は基板４の外周部を基板載置台５に対し押圧する機構で、基板外周押圧板７、基板外周押圧板７を駆動する基板外周押圧板駆動機構７１を備えている。図１５は、基板外周押圧板７を反りを有する基板４の上方に配置した状態で、切断ラインと垂直な面の断面図である。図１６は、基板外周押圧板駆動機構７１を駆動させて基板外周押圧板７で基板４の外周部上面を基板載置台５に対して押圧した状態を切断ラインと垂直な面で切断したときの断面図である。
【００４７】
基板外周押圧板７は、上からみたときロの字状の外形をしており、ロの字部が基板４の外周部上面と当接し、基板４の外周部を基板載置台５に対し押圧する。基板４の反りが大きい場合、基板外周押圧板７によって基板４の外周部上面を基板載置台５に対して押圧する際、基板４の外周部が基板載置台５に対して接するまで押圧すると、基板４に実装されたチップにストレスが生じ、チップに形成されている電子回路が断線する虞が生じる。従って、基板４の反りが大きい場合は、基板４の反りが半分になる程度に基板外周押圧板７によって基板４の外周部上面を基板載置台５に対して押圧するのが望ましい。
【００４８】
次に基板４の切断工程を説明する。図１７、図１８は基板切断工程の説明図で、図１７は基板４を短手方向に切断している図、図１８は基板４を長手方向に切断している図である。なお、櫛状基板押え板１、２の図示は省略した。
【００４９】
図１７、図１８のそれぞれ右図は、基板４が載置された基板載置台５を上から見た図、それぞれ左図は、基板４が載置された基板載置台５を左方から見た図である。
【００５０】
基板４から、外形寸法が、短手方向４．５ｍｍ、長手方向５ｍｍの基板個片４１、４２、４３、４４、４５、４６、・・・を複数とることとする。なお、基板外周部にはチップが実装されておらず、基板個片として利用する領域ではない。
はじめに、図示していない真空吸着機構付基板搬送機構によって基板４を真空吸着し、基板搬送機構を駆動させて基板４を基板載置台５の載置すべき位置まで移動させ、真空吸着を解除して基板４を基板載置台５に載置する。基板４は真空吸引孔６を通して真空吸引機構６１によって吸引され、基板載置台５に吸着される。ただし、基板４に反りが生じている場合は、真空吸引機構６１による基板４の吸着力は弱い。
【００５１】
次に、基板外周押圧板駆動機構７１を駆動させて、はじめに基板４の上方に配置されていた基板外周押圧板７を、基板外周部が基板載置台５に対し押圧されるまで下降させる。次に、回転式基板カッター駆動機構９３を駆動させて、円盤状刃部３ａを、回転軸３ｂを中心に回転させ、その後回転式基板カッター３を基板４の切断ラインに対し徐々に下降させる。円盤状刃部３ａが基板４に切り込みを入れた後、切断ラインにそって回転式基板カッター３を移動させる。なお基板載置台５に凹部５１、５１、・・・があるために、円盤状刃部３ａは基板載置台５に接触することはない。
【００５２】
図１７に示すように、はじめ基板４の右端の切断ラインより短手方向に切断する。すなわち、回転式基板カッター駆動機構９３を駆動して、回転式基板カッター３で基板４の右端切断ラインの一端より切断し始め、回転式基板カッター３を右端切断ラインの他端まで移動させて基板４の右端切断ラインを切断する。
【００５３】
基板外周部には基板外周押圧板７が基板４の外周部を押圧しているため、円盤状刃部３ａが外周部手前まで切断した後、円盤状刃部３ａを上昇させ、円盤状刃部３ａと基板外周押圧板７との接触を回避する。なお、基板外周部から基板個片を取り出すことはないので、基板外周部を切断しなくてもなんら支障はない。
【００５４】
一ラインの加工が終了し、回転式基板カッター駆動機構９３を駆動させて回転式基板カッター３を上昇させた後、その後基板載置台駆動機構５０を駆動させて、回転式基板カッター３の円盤状刃部３ａの下部に次の切断ラインがくるまで基板載置台５を移動させる。上述の工程を繰り返し、基板短手方向の切断をすべて行う。
【００５５】
次に、図１８に示すように基板長手方向の切断をおこなう。はじめに、基板載置台駆動機構５０を駆動させて基板載置台５を９０度回転させる。基板外周押圧板７は基板４の外周部を押圧したまま基板４とともに回転する。次に、基板押え板駆動機構９１、９２を駆動させて、押え歯１１、１１、・・・が基板４の長手方向切断ラインの右端切断ラインの右側近傍を基板載置台５に対し押圧するまで櫛状基板押え板１を下降させ、同様に押え歯２１、２１、・・・が切断ラインの左側近傍を基板載置台５に対し押圧するまで櫛状基板押え板２を下降させる。
【００５６】
次に、回転式基板カッター駆動機構９３を駆動して回転式基板カッター３を基板４の長手方向切断ラインの右端切断ラインに対し徐々に下降させ、円盤状刃部３ａが基板４に切り込みを入れた後、切断ラインにそって回転式基板カッター３を移動させる。右端切断ラインの一端より切断し始め、回転式基板カッター３を右端切断ラインの他端まで移動させて基板４の右端切断ラインを切断する。一ラインの加工が終了したのち、回転式基板カッター駆動機構９３を駆動させて回転式基板カッター３を上昇させる。
【００５７】
つぎに、基板押え板駆動機構９１、９２を駆動させて櫛状基板押え板１、２を上昇させ、その後基板載置台駆動機構５０を駆動させて、回転式基板カッター３の円盤状刃部３ａの下部に次の切断ラインがくるまで基板載置台５を移動させる。
【００５８】
上述の工程を繰り返し、基板長手方向の切断をすべて行う。
基板長手方向の切断が終了した後、回転式基板カッター駆動機構９３を駆動させて回転式基板カッター３を上昇させ、基板押え板駆動機構９１、９２を駆動させて櫛状基板押え板１、２を上昇させ、真空吸引機構６１の吸引を止めて、図示していない基板個片４１、４２、４３、４４、４５、４６、・・・を基板載置台５から取り出す真空吸着機構つき基板個片取り出し機構によって基板個片の上面を真空吸着して、基板個片４１、４２、４３、４４、４５、４６、・・・を取り出す。
【００５９】
なお櫛状基板押え板１、２を用いて基板４を押圧する際、必ずしも切断ラインの両側を共に押圧する必要はなく、基板４の反りが小さいなど基板４の反りの状態によって、切断後に基板個片が得られる側のみを押圧しても良い。
【００６０】
櫛状基板押え板１、２における他の実施の形態として、押え歯１１、１１、・・・、２１、２１、・・・と、押え歯保持部１ｂ、２ｂとは別材料で、かつ別部材で形成してもよい。一実施例として、りん青銅からなる押え歯１１、１１、・・・、２１、２１、・・・を、ステンレスからなる押え歯保持部１ｂ、２ｂに溶接で固定する形態がある。
【００６１】
また、押え歯１１、１１、・・・、２１、２１、・・・における他の実施の形態として、曲率を有する形状、またはストレートな形状で形成する形態がある。図１９は、曲率を有する形状の押え歯１１、１１、・・・、２１、２１、・・・が、基板４を押圧している状態で、切断ラインと垂直な面で切断したときの断面図である。
【００６２】
図２０は、ストレートな形状の押え歯１１、１１、・・・、２１、２１、・・・が、基板４を押圧している状態で、切断ラインと垂直な面で切断したときの断面図である。押え歯１１、１１、・・・をへの字形状、押え歯２１、２１、・・・を曲率を有する形状とするように、押え歯１１、１１、・・・と押え歯２１、２１、・・・の形状を変えても良い。また、押え歯１１、１１、・・・の中で、一部をストレートな形状、他部をへの字形状とするように、押え歯１１、１１、・・・の中で形状を変えても良い。
【００６３】
弾性部材付基板押え板の他の実施例を図２１に示す。図２１は、基板切断装置９９の図１３における断面ＦＦと同一断面である。弾性部材付基板押え板１３は複数の弾性部材１３ａ、１３ａ、・・・および弾性部材１３ａ、１３ａ、・・・を保持する弾性部材保持部１３ｂより形成されており、図示していないが同様に弾性部材付基板押え板１４は弾性部材１４ａ、１４ａ、・・・および弾性部材１４ａ、１４ａ、・・・を保持する弾性部材保持部１４ｂより形成されている。
弾性部材１３ａ、１３ａ、・・・、および１４ａ、１４ａ、・・・の材質は弾性変形量の大きいウレタン樹脂で形成する。弾性部材１３ａ、１３ａ、・・・、および１４ａ、１４ａ、・・・の形状およびピッチは、基板４を基板載置台５に対し確実に押圧するため、基板個片４１、４２、４３、４４、４５、４６・・・のそれぞれを、弾性部材１３ａ、１３ａ、・・・、または１４ａ、１４ａ、・・・の１個または２個以上で押圧できるピッチ、形状にする。
【００６４】
本実施例では、基板個片の短手方向寸法が４．５ｍｍ、長手方向の寸法が５ｍｍとき、一つの弾性部材の形状を直径３ｍｍ、高さ５ｍｍの円柱形状とし、弾性部材のピッチを基板個片の長手方向ピッチと同じ５ｍｍとした。これにより、基板４の長手方向切断において、基板個片４１、４２、４３、４４、４５、４６、・・・のそれぞれを、弾性部材１３ａ、１３ａ、・・・、および１４ａ、１４ａ、・・・が１個ずつ押圧することになる。
【００６５】
なお、本発明は基板が凹状にそっている場合だけでなく、逆方向である凸状に反っている場合でも同様の効果を奏する。
【００６６】
【発明の効果】
この発明によれば、基板押え板を用いて基板を切断することにより、基板に反りがあっても、または切断後の基板個片の形状がＣＳＰのように小さくても、基板押え板によって基板が基板載置台に対し押圧される為、切断後の基板個片が基板載置台に対し保持されて、飛散することがない。
【図面の簡単な説明】
【図１】この発明の一実施例である基板切断装置である。
【図２】基板切断装置の切断部を上からみた図である。
【図３】基板個片の寸法と押え歯の歯幅との関係の説明図で、基板を上からみた図である。
【図４】基板個片の寸法と押え歯の歯幅との関係の説明図で、基板切断部を基板の上からみた図である。
【図５】基板個片の寸法と押え歯の歯幅との関係の説明図で、図４の基板を歯幅３ｍｍ、ピッチ５ｍｍの押え歯で押圧している図である。
【図６】図５の断面ＣＣである。
【図７】基板個片の寸法と押え歯の歯幅との関係の説明図で、図５の状態で、点Ｄから点Ｅまで切断した状態である。
【図８】図７の断面ＣＣである。
【図９】基板個片の寸法と押え歯の歯幅との関係の説明図で、図４の基板を歯幅１１ｍｍの押え歯で押圧している図である。
【図１０】図１０の断面ＣＣである。
【図１１】基板個片の寸法と押え歯の歯幅との関係の説明図で、図９の状態で、点Ｄから点Ｅまで切断した状態である。
【図１２】図１１の断面ＣＣである。
【図１３】弾性部材付基板押え板を用いて基板を基板載置台に対し押圧する基板切断装置である。
【図１４】図１３の断面ＦＦである。
【図１５】基板外周押圧板を用いた基板切断装置である。
【図１６】基板外周押圧板を用いて基板を基板載置台に対し押圧している状態である。
【図１７】基板切断装置を用いた基板切断工程の説明図で、短手方向の切断をおこなっている状態である。
【図１８】基板切断装置を用いた基板切断工程の説明図で、長手方向の切断をおこなっている状態である。
【図１９】曲率を有する形状の押え歯を用いて基板を基板載置台に対し押圧する基板切断装置である。
【図２０】ストレートな形状の押え歯を用いて基板を基板載置台に対し押圧する基板切断装置である。
【図２１】複数の弾性部材を備えた弾性部材付基板押え板を用いて基板を基板載置台に対し押圧する基板切断装置である。
【図２２】ＣＳＰの生産工程の一例を示す図である。
【符号の説明】
１、２ 櫛状基板押え板
１ａ、２ａ 基板押え部
１ｂ、２ｂ 押え歯保持部
１ｃ、２ｃ 軟質樹脂
１１、１１、・・・、２１、２１、・・・ 押え歯
１３、１４ 弾性部材付基板押え板
１３ａ、１４ａ 弾性部材
１３ｂ、１４ｂ 弾性部材保持部
３ 回転式基板カッター
３ａ 円盤状刃部
３ｂ 回転軸
４ 基板
４１、４２、４３、４４、４５、４６・・・ 基板個片
５ 基板載置台
５０ 基板載置台駆動機構
５１、５１、・・・ 凹部
６ 真空吸引孔
６１ 真空吸引機構
７ 基板外周押圧板
７１ 基板外周押圧板駆動機構
８ チップ
８１ 封止樹脂
９ ガラスエポキシ基板
９１、９２ 基板押え板駆動機構
９３ 回転式基板カッター駆動機構
９９ 基板切断装置[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an apparatus for cutting a substrate on which a plurality of semiconductor chips on which electronic circuits such as transistors and LSIs are formed are cut into a plurality.
[0002]
[Prior art]
As a package form of a semiconductor chip (hereinafter, referred to as “chip”) on which electronic circuits such as transistors and LSIs are formed, the chip is directly mounted on a glass epoxy substrate (hereinafter, referred to as “substrate”) in order to reduce the outer dimensions of the package. Then, there is a CSP (Chip Size Package) obtained by cutting the substrate so that the outer shape becomes almost the same as the outer shape of the chip.
[0003]
FIG. 22 shows an example of a CSP production process. First, a plurality of chips 8 each having an electronic circuit formed on a substrate 9 are aligned and soldered. FIG. 22A is a perspective view showing a state where a plurality of chips 8 are mounted on a substrate 9. Next, in order to electrically insulate the plurality of chips 8 and protect them from moisture and external scratches, a sealing resin 81 is applied on the substrate 9 so as to cover the chips.
[0004]
FIG. 22 (2) is a diagram illustrating a state where the sealing resin 81 is applied on the substrate 9 on which the plurality of chips 8 are mounted. At this time, in order to prevent the sealing resin 81 from flowing out from the side of the substrate 9, a sealing resin dam having an inner dimension equal to the outer dimension of the substrate 9 is used. As the sealing resin 81, for example, an epoxy resin is used in consideration of electrical insulation and moisture resistance. After the sealing resin 81 is cured, the sealing resin dam is removed.
[0005]
Next, the substrate 9 on which the sealing resin 81 is formed is cut in the vertical and horizontal directions so that the plurality of chips 8 are individually divided, and the substrate pieces 90 are taken out. The substrate pieces 90, 90,... Are CSPs (FIG. 22C). Generally, the resin shrinks during curing, so that the sealing resin 81 on the substrate 9 also shrinks in the sealing resin curing step. When the sealing resin 81 contracts, a contracting force acts only on the upper surface of the substrate 9, so that the substrate 9 often warps.
[0006]
FIG. 22D is a diagram illustrating a state in which the substrate 9 is warped in the sealing resin curing step. Generally, a cutting method using a rotary substrate cutter is used for cutting such a substrate. As a conventional example of a substrate cutting apparatus using a rotary substrate cutter, there is JP-A-10-43980. This publication discloses that, when cutting a package having an insulating protection portion incorporating a semiconductor element or the like formed on a frame plate made of a synthetic resin into a plurality of frames, a holding frame member having a recess for receiving the package in close contact with the frame plate. Is placed, and each package of the frame plate is closely fitted into the recessed portion, and the peripheral edge of each package is cut by a router cutter in a state where the frame plate is fixed to the holding frame member by vacuum suction of each package. The method for cutting a package, which comprises separating the package from the frame plate, is described.
[0007]
[Problems to be solved by the invention]
However, when a warped substrate is cut by the cutting method described in JP-A-10-43980, a gap is formed between the vacuum suction unit and the lower surface of the substrate due to the warpage of the substrate, and the suction is sufficient to suck the substrate by the vacuum suction unit. The power cannot be secured. As a result, immediately after the substrate is cut in the vertical direction and the horizontal direction, there is a possibility that the individual substrates may not be kept on the holding frame member and may be scattered.
[0008]
In the case of a substrate such as a CSP having a small external shape of a piece, a suction portion area for sucking the substrate piece becomes small, and the suction force is reduced, so that a suction force enough to suck the substrate piece cannot be secured. As a result, also in this case, immediately after cutting the substrate, the individual pieces of the substrate may not be kept in a state of being placed on the holding frame member and may be scattered.
[0009]
[Means for Solving the Problems]
In order to solve the above problems, a substrate cutting method according to the present invention is directed to a substrate cutting method for obtaining a plurality of substrate pieces by cutting a substrate on which a plurality of semiconductor chips on which electronic circuits are formed are mounted. A substrate mounting table on which the substrate is mounted, a substrate cutter disposed above the substrate mounting table and having a disk-shaped rotary blade, and pressing the substrate cutter near a cutting line when the substrate cutter cuts the substrate It is possibleConsists of a plurality of plate-like pressing teeth arranged at a predetermined pitch in parallel with each otherA step of mounting a substrate on a substrate mounting table using a substrate cutting apparatus having a substrate holding portion, a step of rotating a rotary cutter so as to cut the substrate and moving the substrate cutter up and down, and a step of mounting the substrate. By driving the mounting table at a predetermined pitch so that the cutting lines on the substrate are parallel to each other, and repeating the positioning process,In the same direction as the arrangement direction of the plurality of plate-like pressing teeth,A first cutting step of cutting the substrate a plurality of times at a predetermined pitch, a step of rotating the substrate by 90 degrees after the first cutting step, and pressing the vicinity of a line where the substrate is cut by the substrate holding unit. A step of rotating a rotary cutter and moving the substrate cutter up and down so as to cut the substrate while pressing the substrate with the substrate pressing unit, and mounting the substrate in a direction perpendicular to the cutting direction of the first cutting step. A second cutting step is performed in which the mounting table is driven at a predetermined pitch so that the cutting lines are parallel to each other, and the positioning step is repeated to cut the substrate a plurality of times at a predetermined pitch.
[0010]
According to the substrate cutting method of the present invention, even if the substrate is warped or the shape of the substrate piece after cutting is small as in CSP by cutting the substrate using the substrate holding portion, Since the substrate is pressed against the substrate mounting table by the pressing portion, the cut substrate pieces are held on the substrate mounting table and do not scatter.
[0011]
Further, the substrate cutting method according to the present invention includes:SaidThe cutting pitch in the first cutting step may be an integral multiple of the pitch of the presser teeth. This way,SmallSince at least one pressing tooth presses one substrate piece, the cut substrate piece is held on the substrate mounting table and does not scatter.
[0012]
Further, in the substrate cutting apparatus according to the present invention, in the substrate cutting apparatus for obtaining a plurality of substrate pieces by cutting a substrate on which a plurality of semiconductor chips having electronic circuits are mounted, the cutting lines of the substrates are parallel to each other. A first cutting device that cuts a plurality of times at a predetermined pitch, and a second cutting device that cuts the substrate in a direction perpendicular to the direction of cutting with the first cutting device, the second cutting device, The substrate mounting table for mounting the substrate and the substrate mounting table are disposed above the substrate mounting table, and can be in contact with each of the substrate pieces obtained by cutting the substrate.Consists of a plurality of plate-like pressing teeth arranged at a predetermined pitch in parallel with each otherA substrate pressing unit, a substrate pressing unit driving mechanism for moving the substrate pressing unit so as to press the vicinity of the line where the substrate pressing unit is cut, and a disk-shaped rotary blade disposed above the substrate mounting table. Substrate cutter, and a rotary blade drive mechanism for rotating the rotary blade and moving the rotary blade up and down so that the rotary blade cuts the substrate while rotating.Further, a direction in which the plurality of plate-shaped pressing teeth are arranged in the second cutting device and a direction in which the substrate is cut by the second cutting device are the same direction..
[0013]
When cutting a substrate using this apparatus, first, the substrate is cut a plurality of times by a first cutting apparatus at a predetermined pitch so that the cutting lines are parallel to each other. Next, so that the vertical direction of the plurality of cutting lines cut by the first cutting device is the cutting line of the second cutting device, was cut by the first cutting device to the substrate mounting table of the second cutting device. The substrate is placed, and the substrate pressing unit driving mechanism is driven to press the vicinity of the line where the substrate is cut by the substrate pressing unit. Next, the rotary blade driving mechanism is driven to rotate the rotary blade, and further, the rotary blade is gradually lowered with respect to the substrate to cut a cutting line to obtain a plurality of substrate pieces.
[0014]
Further, in the substrate cutting device according to the present invention, the pitch at which the substrate is cut by the first cutting device may be an integral multiple of the pitch of the holding teeth. Desirably, the width dimension of each presser tooth is smaller than the dimension in the cutting line direction of the substrate piece obtained after cutting. That is, it is preferable that the substrate piece is pressed by one or more pressing teeth. In this case, since at least one pressing tooth presses one substrate piece, the cut substrate piece is held on the substrate mounting table and does not scatter.
[0015]
In the second cutting device, only one line may be cut, or a plurality of lines may be cut. When cutting a plurality of lines, pressing near the substrate cutting line by the substrate pressing unit, cutting by the rotary blade, and the rotary blade and the substrate mounting table in a direction perpendicular to the surface of the rotary blade, the cutting lines on the substrate are parallel to each other. The relative movement at a predetermined pitch is repeated.
[0016]
Instead of providing the first and second cutting devices as separate devices, one cutting device is used first as the first cutting device, and then the same device is used as the second cutting device. You may. In this case, the substrate mounting table, the substrate cutter, and the rotary blade drive mechanism of the substrate cutting device are used both when the device is used as the first cutting device and when the device is used as the second cutting device. Further, the substrate holding section can also be used when this apparatus is used as a first cutting apparatus.
[0017]
By using the substrate cutting apparatus of the present invention, the substrate can be cut using the substrate holding portion, so that even if the substrate is warped or the shape of the cut individual piece of the substrate is as small as CSP, Since the substrate is pressed against the substrate mounting table by the pressing portion, the cut substrate pieces are held on the substrate mounting table and do not scatter.
[0019]
Further, in the substrate cutting device according to the present invention, the material of at least a portion of the holding teeth that comes into contact with the substrate can be made of resin. When the material of the portion of the presser teeth that contacts the substrate is made of resin, there is an effect that the substrate is not scratched or a predetermined position can be pressed without slipping on the substrate due to the friction property of the resin. The resin is preferably a soft resin.
[0020]
Further, in the substrate cutting device according to the present invention, the substrate pressing portion may be made of one or a plurality of elastic members formed of resin. The resin is desirably a soft resin that is elastically deformed. The thickness of the elastic member needs to be such that a predetermined amount of elastic deformation can be obtained. That is, when pressing a substrate having a warp with an elastic member, first, the elastic member presses the substrate while elastically deforming, and after cutting the substrate, the elastic member restores the elastic deformation and all the substrate pieces are placed on the substrate mounting table. It is necessary to make the elastic member thick enough to be pressed. In this case, the cut substrate pieces are held on the substrate mounting table and do not scatter.
[0021]
Further, in the substrate cutting device according to the present invention, the substrate pressing portion includes a plurality of elastic members arranged at a predetermined pitch, and a pitch at which the substrate is cut by the first cutting device is an integer with respect to the pitch of the plurality of elastic members. Can be doubled. When the elastic member is composed of a plurality of parts and there is a space between the individual elastic members, the amount of elastic deformation of the elastic member can be increased as compared with the case where the elastic members are integrated. This is because when each of the plurality of elastic members presses the substrate and elastically deforms, the elastic members are easily deformed in a space direction perpendicular to the pressing direction, and as a result, the amount of elastic deformation in the pressing direction can be increased.
[0022]
In this way, even when a substrate with a large warp is pressed, the cut pieces of the substrate can be pressed against the substrate mounting table by the plurality of elastic members. Further, since at least one elastic member presses one substrate piece, the cut substrate piece is held on the substrate mounting table and does not scatter.
[0023]
Further, in the substrate cutting apparatus according to the present invention, two or more substrate pressing portions are provided, and the substrate pressing portions can press both sides of the line where the substrate is cut. By pressing both sides of the cutting line of the substrate with the substrate pressing portions, the substrate piece after the cutting and the substrate before the cutting can both be pressed against the substrate mounting table.
[0024]
Further, in the substrate cutting apparatus according to the present invention, the substrate outer peripheral pressing portion is disposed above the substrate mounting table and contacts the outer peripheral portion of the substrate to press the substrate against the substrate mounting table. The apparatus may further include a substrate outer peripheral pressing portion driving mechanism that moves the substrate outer peripheral pressing portion so as to press the substrate mounting table. The substrate outer peripheral pressing portion may be provided in either the first cutting device or the second cutting device, or may be provided in both.
[0025]
Also, instead of providing the first and second cutting devices as separate devices, one cutting device is used first as the first cutting device, and then the same device is used as the second cutting device. In this case, the substrate outer peripheral pressing portion is used both when the device is used as a first cutting device and when the device is used as a second cutting device. In this case, when cutting the substrate using the substrate outer peripheral pressing portion, first place the substrate on the substrate mounting table, drive the substrate outer peripheral pressing portion driving mechanism to lower the substrate outer peripheral pressing portion with respect to the substrate. Then, a first cutting is performed in which the cutting lines on the substrate are cut a plurality of times at a predetermined pitch so that the cutting lines on the substrate are parallel to each other while pressing the outer peripheral portion of the substrate.
[0026]
Next, the substrate is rotated so that the vertical direction of the cutting line cut by the first cutting becomes a new cutting line. At this time, the substrate outer peripheral pressing portion rotates together with the substrate while pressing the substrate. Then, the second cutting is performed while using the substrate holding portion.
[0027]
In this way, since the warpage of the substrate is reduced, the force of pressing the substrate by the substrate pressing portion is smaller than the force of pressing the substrate only by the substrate pressing portion. Also, the degree of freedom in shape design is improved. The substrate outer peripheral pressing portion may contact a part of the outer peripheral portion of the substrate or may contact the entire outer peripheral portion. Note that a chip is not usually mounted on the outer peripheral portion of the substrate, and is not a region used as a substrate piece after the substrate is cut.
[0028]
Further, in the substrate cutting apparatus according to the present invention, a substrate on which a plurality of semiconductor chips on which electronic circuits are formed is mounted is cut.A substrate in a substrate cutting apparatus for obtaining a plurality of substrate piecesWhen the substrate is placed on the substrate mounting table, the substrate can be placed on the substrate mounting table, and can be in contact with each of the substrate pieces obtained by cutting the substrate.Consists of a plurality of plate-like pressing teeth arranged at a predetermined pitch in parallel with each otherA substrate pressing unit, a substrate pressing unit driving mechanism for moving the substrate pressing unit so as to press the vicinity of the line where the substrate pressing unit is cut, and a disk-shaped rotary blade disposed above the substrate mounting table. Substrate cutter, and a rotary blade drive mechanism for rotating the rotary blade so as to cut the substrate while rotating the rotary blade and moving the rotary blade up and downThe direction in which the plurality of plate-shaped pressing teeth are arranged is the same as the direction in which the substrate is cut.be able to.
[0029]
By using the substrate cutting apparatus of the present invention, the substrate can be cut using the substrate holding portion, so that even if the substrate is warped or the shape of the cut individual piece of the substrate is as small as CSP, Since the substrate is pressed against the substrate mounting table by the pressing portion, the cut substrate pieces are held on the substrate mounting table and do not scatter.
[0030]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a sectional view of a plane perpendicular to a cutting line of a substrate cutting apparatus 99 according to one embodiment of the present invention. FIG. 2 is a diagram illustrating a cutting portion of the substrate cutting device 99 as viewed from above. The substrate cutting device 99 includes comb-shaped substrate pressing plates 1 and 2, substrate pressing plate driving mechanisms 91 and 92 for driving the comb-shaped substrate pressing plates 1 and 2, a rotary substrate cutter 3, and a rotary for driving the rotary substrate cutter 3. A substrate cutter driving mechanism 93, a substrate mounting table 5, and a substrate mounting table driving mechanism 50 are provided.
[0031]
The comb-shaped substrate pressing plate 1 is provided with a substrate pressing portion 1a composed of a plurality of pressing teeth 11, 11,... And a pressing tooth holding portion 1b for holding the pressing teeth 11, 11,. Similarly, the comb-shaped substrate pressing plate 2 includes a substrate pressing portion 2a composed of a plurality of pressing teeth 21, 21,... And a pressing tooth holding portion 2b that holds the pressing teeth 21, 21,. . The board holding plate driving mechanism 91 is connected to the holding teeth holding portion 1b, and the board holding plate driving mechanism 92 is connected to the holding teeth holding portion 2b. Can be done.
[0032]
The rotary substrate cutter 3 includes a disk-shaped blade 3a and a rotating shaft 3b of the disk-shaped blade 3a. The rotary substrate cutter driving mechanism 93 is connected to the rotating shaft 3b, and can rotate the disk-shaped blade portion 3a and move the substrate 4 up, down, and move along the cutting line. it can. The material of the disk-shaped blade portion 3a is a nickel-diamond alloy in this embodiment.
[0033]
A plurality of vacuum suction holes 6 are formed in the substrate mounting table 5 in the vertical direction, and a vacuum suction mechanism 61 connected to the vacuum suction holes 6 is provided below the substrate mounting table 5. The substrate mounting table 5 is provided with concave portions 51, 51,... So that the disk-shaped blade portion 3a of the rotary substrate cutter 3 does not contact the substrate mounting table 5.
[0034]
The substrate mounting table drive mechanism 50 is connected to the substrate mounting table 5 and can be rotated around the vertical direction of the substrate mounting table 5 as an axis. The substrate mounting table drive mechanism 50 includes a linear motor and a linear encoder (not shown), and can move the substrate at a predetermined pitch in a direction perpendicular to the surface of the disk-shaped blade 3a. The presser teeth 11, 11,... And the presser tooth holding portion 1b are integrally formed of the same material by press molding. Similarly, the presser teeth 21, 21,... And the presser tooth holding portion 2b are integrally formed of the same material by press molding. It is necessary to design the material and the plate thickness so that the presser teeth have a spring property. In this embodiment, they are formed of a 0.8 mm thick stainless steel plate.
[0035]
The pressing teeth 11, 11,..., And the pressing teeth 21, 21,... , And the pitch and the tooth width of the holding teeth 21, 21,..., The board pieces 41, 42,. Each of 43, 44, 45, 46,... Has a pitch and a tooth width that can be pressed by one or more of the pressing teeth 11, 11,. I do.
[0036]
Here, a problem that occurs when a warped substrate is pressed by pressing teeth whose tooth width is longer than the outer dimensions of the substrate pieces 41, 42, 43, 44, 45, 46,... In the cutting direction will be described. . FIG. 3 to FIG. 12 are diagrams illustrating the relationship between the dimensions of the substrate piece and the face width of the presser teeth.
[0037]
FIG. 3 is a view of the substrate 4 as viewed from above when the cutting in the longitudinal direction is partially completed after all the cutting in the short direction of the substrate 4 is completed, and FIG. 4 is an enlarged view of a portion A thereof. The line to be cut in the next step is B. Each of the board pieces 41, 42, 43,... Has a lateral dimension of 4.5 mm and a longitudinal dimension of 5 mm. Therefore, the longitudinal pitch of the substrate pieces 41, 42, 43,... Is 5 mm. Here, for the sake of simplicity, it is assumed that the cutting margin at the time of cutting the substrate can be ignored.
[0038]
FIG. 5 is a plan view of the substrate 4 of FIG. 4 in which the tooth width is 3 mm and the pitch is 5 mm which is the same as the longitudinal pitch of the substrate pieces. ,... Are pressing the vicinity of the line B. FIG. 6 is a cross-section CC of FIG. Since the substrate 4 is warped, the substrate 4 that is to be the substrate piece 44 after cutting and the substrate mounting table 5 are in contact with each other even though the substrate 4 is pressed by the holding teeth 11, 11, 11,. There is a gap between them.
[0039]
FIG. 7 is a state in which the line B is cut from a point D to a point E in FIG. 5, and FIG. 8 is a cross section CC of FIG. When line B is cut from point D to point E, substrate piece 44 separates from the rest of the substrate. At this time, the substrate pieces 44 are in contact with the holding teeth 11 and are pressed against the substrate mounting table 5 so that they do not scatter.
[0040]
For comparison with the present invention, a description will be given of an inconvenience that occurs when a plurality of substrate pieces are pressed by a single presser tooth. FIG. 9 shows a state in which the substrate 4 of FIG. 4 is pressed by three pieces of the substrate with one holding tooth having a tooth width of 11 mm. FIG. 10 is a cross section CC of FIG. Since the substrate 4 is warped, a gap is formed between the substrate that becomes the substrate piece 44 after cutting and the substrate mounting table 5.
[0041]
FIG. 11 shows a state where line B is cut from point D to point E in FIG. 9, and FIG. 12 is a cross section CC of FIG. In this state, the holding teeth having a tooth width of 11 mm come into contact with the substrate to be the substrate pieces 45 and 46 after cutting, but cannot contact the substrate piece 44 and cannot be pressed against the substrate mounting table 5. . As a result, the substrate pieces 44 may be scattered.
[0042]
Returning to FIG. 1, the end portions of the pressing teeth 11, 11,..., And 21, 21,... On the substrate pressing side are covered with soft resins 1c, 2c. In order to cover with the soft resins 1c and 2c, a liquid urethane foam resin is applied to the substrate pressing side ends of the holding teeth 11, 11,..., And 21, 21,. What is necessary is just to leave and harden.
[0043]
FIG. 13 shows an embodiment in which the substrate pressing portion is formed of an elastic member formed of resin instead of the pressing teeth. FIG. 13 is a cross-sectional view of a plane perpendicular to a cutting line of the substrate cutting device 99. FIG. 14 is a cross section FF of FIG. The substrate holding plate with elastic member 13 is formed of an elastic member 13a and an elastic member holding portion 13b that holds the elastic member 13a. Similarly, the substrate holding plate with elastic member 14 has elastic members 14a and elastic members that hold the elastic member 14a. It is formed of a member holding portion 14b.
[0044]
In this embodiment, the material of the elastic members 13a and 14a is formed of urethane resin having a large elastic deformation. The elastic member holding portions 13b and 14b are formed of a 0.8 mm thick stainless steel plate. The elastic members 13a and 14a are fixed to the elastic member holding portions 13b and 14b with an adhesive.
[0045]
When a substrate having a warpage of 1 mm is pressed, the thickness of the elastic member formed of urethane resin is set to 6 mm. Since the elastic member formed of a urethane resin having a thickness of 6 mm is elastically deformed by a maximum of 2 mm, the substrate having a warp of 1 mm can be pressed without any gap. In this case, the elastic member 13a is elastically deformed by 2 mm at the outer peripheral portion of the substrate 4 and is elastically deformed by 1 mm at the central portion, and can press both the outer peripheral portion and the central portion of the substrate. Furthermore, after cutting the substrate, the elastic member 13a restores the elastic deformation and presses the substrate piece against the substrate mounting table 5, so that the substrate piece is not held and scattered by the substrate mounting table 5.
[0046]
FIG. 15 shows a mechanism for pressing the outer peripheral portion of the substrate 4 against the substrate mounting table 5. The mechanism includes a substrate outer peripheral pressing plate 7 and a substrate outer peripheral pressing plate driving mechanism 71 for driving the substrate outer peripheral pressing plate 7. FIG. 15 is a cross-sectional view of a plane perpendicular to a cutting line in a state where the substrate outer peripheral pressing plate 7 is arranged above the warped substrate 4. FIG. 16 shows a state in which the substrate outer peripheral pressing plate driving mechanism 71 is driven to press the outer peripheral portion upper surface of the substrate 4 against the substrate mounting table 5 with the substrate outer peripheral pressing plate 7 when cut along a plane perpendicular to the cutting line. It is sectional drawing.
[0047]
The substrate outer peripheral pressing plate 7 has a square-shaped outer shape when viewed from above, and the square-shaped portion contacts the upper surface of the outer peripheral portion of the substrate 4, and presses the outer peripheral portion of the substrate 4 against the substrate mounting table 5. I do. When the warp of the substrate 4 is large, when the upper surface of the outer peripheral portion of the substrate 4 is pressed against the substrate mounting table 5 by the substrate outer peripheral pressing plate 7, the outer peripheral portion of the substrate 4 is pressed until the outer peripheral portion contacts the substrate mounting table 5. Stress is generated in the chip mounted on the substrate 4, and there is a possibility that an electronic circuit formed on the chip is disconnected. Therefore, when the warpage of the substrate 4 is large, it is desirable that the upper surface of the outer peripheral portion of the substrate 4 is pressed against the substrate mounting table 5 by the substrate outer peripheral pressing plate 7 so that the warp of the substrate 4 is reduced to half.
[0048]
Next, the step of cutting the substrate 4 will be described. 17 and 18 are explanatory views of the substrate cutting step. FIG. 17 is a view in which the substrate 4 is cut in the lateral direction, and FIG. 18 is a view in which the substrate 4 is cut in the longitudinal direction. The illustration of the comb-shaped substrate pressing plates 1 and 2 is omitted.
[0049]
17 and 18, the right views are views of the substrate mounting table 5 on which the substrate 4 is mounted, as viewed from above, and the left drawings are respectively left views of the substrate mounting table 5 on which the substrate 4 is mounted. FIG.
[0050]
A plurality of board pieces 41, 42, 43, 44, 45, 46,... Having outer dimensions of 4.5 mm in the transverse direction and 5 mm in the longitudinal direction are taken from the board 4. Note that no chip is mounted on the outer peripheral portion of the substrate, and this is not a region used as a substrate piece.
First, the substrate 4 is vacuum-sucked by a substrate transfer mechanism with a vacuum suction mechanism (not shown), the substrate transfer mechanism is driven to move the substrate 4 to a position where the substrate mounting table 5 is to be mounted, and the vacuum suction is released. Then, the substrate 4 is placed on the substrate placing table 5. The substrate 4 is sucked by the vacuum suction mechanism 61 through the vacuum suction hole 6 and is sucked by the substrate mounting table 5. However, when the substrate 4 is warped, the suction power of the substrate 4 by the vacuum suction mechanism 61 is weak.
[0051]
Next, the substrate outer peripheral pressing plate driving mechanism 71 is driven to lower the substrate outer peripheral pressing plate 7 initially disposed above the substrate 4 until the substrate outer peripheral portion is pressed against the substrate mounting table 5. Next, the rotary substrate cutter driving mechanism 93 is driven to rotate the disk-shaped blade portion 3a about the rotation shaft 3b, and then the rotary substrate cutter 3 is gradually lowered with respect to the cutting line of the substrate 4. After the disk-shaped blade 3a makes a cut in the substrate 4, the rotary substrate cutter 3 is moved along the cutting line. Since the substrate mounting table 5 has the concave portions 51, 51,..., The disk-shaped blade portion 3a does not contact the substrate mounting table 5.
[0052]
As shown in FIG. 17, first, the substrate 4 is cut in a direction shorter than the cutting line on the right end. That is, the rotary substrate cutter driving mechanism 93 is driven to start cutting the substrate 4 at one end of the right end cutting line of the substrate 4 with the rotary substrate cutter 3, and the rotary substrate cutter 3 is moved to the other end of the right end cutting line to move the substrate. 4 cut the right end cutting line.
[0053]
Since the substrate outer peripheral pressing plate 7 presses the outer peripheral portion of the substrate 4 on the outer peripheral portion of the substrate, the disk-shaped blade portion 3a is cut to a position just before the outer peripheral portion, and then the disk-shaped blade portion 3a is lifted up. The contact between the substrate 3a and the substrate outer peripheral pressing plate 7 is avoided. Since the substrate pieces are not taken out from the outer peripheral portion of the substrate, there is no problem even if the outer peripheral portion of the substrate is not cut.
[0054]
After the processing of one line is completed, the rotary substrate cutter driving mechanism 93 is driven to raise the rotary substrate cutter 3, and then the substrate mounting table driving mechanism 50 is driven to rotate the rotary substrate cutter 3 in a disk shape. The substrate mounting table 5 is moved until the next cutting line comes below the blade 3a. The above-described steps are repeated to perform all cutting in the short direction of the substrate.
[0055]
Next, as shown in FIG. 18, the substrate is cut in the longitudinal direction. First, the substrate mounting table driving mechanism 50 is driven to rotate the substrate mounting table 5 by 90 degrees. The substrate outer peripheral pressing plate 7 rotates together with the substrate 4 while pressing the outer peripheral portion of the substrate 4. Next, the substrate pressing plate driving mechanisms 91 and 92 are driven until the pressing teeth 11, 11,... Press the vicinity of the right side of the right end cutting line of the longitudinal cutting line of the substrate 4 against the substrate mounting table 5. The comb-like substrate pressing plate 1 is lowered, and similarly, the comb-like substrate pressing plate 2 is lowered until the pressing teeth 21, 21,... Press the vicinity of the left side of the cutting line against the substrate mounting table 5.
[0056]
Next, the rotary substrate cutter driving mechanism 93 is driven to gradually lower the rotary substrate cutter 3 with respect to the right-end cutting line of the longitudinal cutting line of the substrate 4, and the disc-shaped blade portion 3 a makes a cut in the substrate 4. After that, the rotary substrate cutter 3 is moved along the cutting line. Cutting is started from one end of the right end cutting line, and the rotary substrate cutter 3 is moved to the other end of the right end cutting line to cut the right end cutting line of the substrate 4. After the processing of one line is completed, the rotary substrate cutter driving mechanism 93 is driven to raise the rotary substrate cutter 3.
[0057]
Next, the substrate pressing plate driving mechanisms 91 and 92 are driven to raise the comb-shaped substrate pressing plates 1 and 2, and then the substrate mounting table driving mechanism 50 is driven to drive the disk-shaped blade portion 3a of the rotary substrate cutter 3. The substrate mounting table 5 is moved until the next cutting line comes to the lower part of the table.
[0058]
The above steps are repeated, and all the cutting in the longitudinal direction of the substrate is performed.
After the cutting in the longitudinal direction of the substrate is completed, the rotary substrate cutter driving mechanism 93 is driven to raise the rotary substrate cutter 3 and the substrate pressing plate driving mechanisms 91 and 92 are driven to drive the comb-shaped substrate pressing plates 1 and 2. , The suction of the vacuum suction mechanism 61 is stopped, and the substrate pieces 41, 42, 43, 44, 45, 46,... (Not shown) are taken out from the substrate mounting table 5. The upper surface of the substrate piece is vacuum-sucked by the removal mechanism to take out the substrate pieces 41, 42, 43, 44, 45, 46,.
[0059]
When pressing the substrate 4 by using the comb-shaped substrate pressing plates 1 and 2, it is not always necessary to press both sides of the cutting line together. You may press only the side from which an individual piece is obtained.
[0060]
As another embodiment of the comb-shaped substrate holding plates 1 and 2, the holding teeth 11, 11, ..., 21, 21, ... and the holding teeth holding portions 1b, 2b are made of a different material and different. It may be formed of a member. As an example, there is a form in which the holding teeth 11, 11,..., 21, 21,... Made of phosphor bronze are fixed to the holding teeth holding portions 1b, 2b made of stainless steel by welding.
[0061]
As another embodiment of the pressing teeth 11, 11,..., 21, 21,..., There is a form in which the pressing teeth are formed in a shape having a curvature or a straight shape. FIG. 19 is a cross-sectional view when the pressing teeth 11, 11,..., 21, 21,. FIG.
[0062]
FIG. 20 is a cross-sectional view of a state in which straight pressing teeth 11, 11,..., 21, 21,. It is. , And the holding teeth 21, 21, ..., so that the holding teeth 11, 11, ..., have a U-shape and the holding teeth 21, 21, ... have a curvature. May be changed. Also, the shape is changed in the holding teeth 11, 11,... So that some of the holding teeth 11, 11,. Is also good.
[0063]
FIG. 21 shows another embodiment of the substrate holding plate with an elastic member. FIG. 21 is the same cross section as the cross section FF in FIG. 13 of the substrate cutting device 99. The elastic substrate holding plate 13 is formed of a plurality of elastic members 13a, 13a,... And elastic member holding portions 13b for holding the elastic members 13a, 13a,. The elastic member 14a, 14a,... And the elastic member holding portion 14b that holds the elastic members 14a, 14a,.
The elastic members 13a, 13a, ..., and 14a, 14a, ... are formed of urethane resin having a large elastic deformation amount. The shape and pitch of the elastic members 13a, 13a, ..., and 14a, 14a, ... are such that the substrate pieces 41, 42, 43, 44, , Or each of the elastic members 13a, 13a,..., Or 14a, 14a,.
[0064]
In this embodiment, when the short dimension of the substrate piece is 4.5 mm and the length in the longitudinal direction is 5 mm, the shape of one elastic member is a cylindrical shape having a diameter of 3 mm and a height of 5 mm, and the pitch of the elastic members is set to It was 5 mm, which is the same as the pitch in the longitudinal direction of the individual pieces. Thereby, in the longitudinal cutting of the substrate 4, each of the substrate pieces 41, 42, 43, 44, 45, 46,... Is converted into the elastic members 13a, 13a,. · Will be pressed one by one.
[0065]
The present invention has the same effect not only when the substrate is curved in a concave shape but also when the substrate is warped in a convex shape which is the opposite direction.
[0066]
【The invention's effect】
According to the present invention, by cutting the substrate using the substrate holding plate, even if the substrate is warped or the shape of the cut individual piece of the substrate such as CSP is small, the substrate holding plate can be used. Is pressed against the substrate mounting table, so that the cut substrate pieces are held on the substrate mounting table and do not scatter.
[Brief description of the drawings]
FIG. 1 shows a substrate cutting apparatus according to an embodiment of the present invention.
FIG. 2 is a top view of a cutting section of the substrate cutting apparatus.
FIG. 3 is an explanatory diagram of a relationship between a dimension of a substrate piece and a tooth width of a pressing tooth, and is a diagram when the substrate is viewed from above.
FIG. 4 is an explanatory diagram of the relationship between the dimensions of a substrate piece and the tooth width of a pressing tooth, and is a diagram in which a substrate cutting portion is viewed from above a substrate.
5 is an explanatory diagram of a relationship between dimensions of a substrate piece and a tooth width of a pressing tooth, in which the substrate of FIG. 4 is pressed by pressing teeth having a tooth width of 3 mm and a pitch of 5 mm.
FIG. 6 is a cross section CC of FIG. 5;
FIG. 7 is an explanatory diagram of a relationship between the dimensions of the substrate piece and the tooth width of the presser teeth, in a state of cutting from point D to point E in the state of FIG.
FIG. 8 is a cross section CC of FIG. 7;
FIG. 9 is an explanatory diagram of the relationship between the dimensions of a substrate piece and the tooth width of a pressing tooth, and is a diagram in which the substrate of FIG. 4 is pressed by a pressing tooth having a tooth width of 11 mm.
FIG. 10 is a cross section CC of FIG. 10;
11 is an explanatory diagram of the relationship between the dimensions of the substrate piece and the tooth width of the presser teeth, which is a state cut from a point D to a point E in the state of FIG. 9;
FIG. 12 is a cross section CC of FIG. 11;
FIG. 13 shows a substrate cutting apparatus for pressing a substrate against a substrate mounting table using a substrate holding plate with an elastic member.
14 is a cross section FF of FIG.
FIG. 15 shows a substrate cutting apparatus using a substrate outer peripheral pressing plate.
FIG. 16 illustrates a state in which the substrate is pressed against the substrate mounting table using the substrate outer peripheral pressing plate.
FIG. 17 is an explanatory diagram of a substrate cutting step using the substrate cutting device, in a state where cutting is performed in the short direction.
FIG. 18 is an explanatory view of a substrate cutting step using the substrate cutting apparatus, in a state where cutting in a longitudinal direction is being performed.
FIG. 19 illustrates a substrate cutting apparatus that presses a substrate against a substrate mounting table using a holding tooth having a shape having a curvature.
FIG. 20 shows a substrate cutting apparatus that presses a substrate against a substrate mounting table using straight holding teeth.
FIG. 21 is a diagram illustrating a substrate cutting apparatus that presses a substrate against a substrate mounting table using a substrate holding plate with elastic members provided with a plurality of elastic members.
FIG. 22 is a diagram illustrating an example of a production process of a CSP.
[Explanation of symbols]
1, 2 Comb-shaped substrate holding plate
1a, 2a Board holding part
1b, 2b Holding teeth holding part
1c, 2c soft resin
11, 11,..., 21, 21,.
13, 14 Board holding plate with elastic member
13a, 14a elastic member
13b, 14b elastic member holding portion
3 Rotary board cutter
3a Disc-shaped blade
3b Rotary axis
4 Substrate
41, 42, 43, 44, 45, 46 ... substrate pieces
5 Substrate mounting table
50 Substrate mounting table drive mechanism
51, 51, ... recess
6 Vacuum suction holes
61 Vacuum suction mechanism
7 Board outer peripheral pressing plate
71 Substrate outer periphery pressing plate drive mechanism
8 chips
81 sealing resin
9 Glass epoxy board
91, 92 Substrate holding plate drive mechanism
93 Rotary substrate cutter drive mechanism
99 Substrate cutting device
Claims (11)
前記基板を切断する際に前記基板を載置する基板載置台と、前記基板載置台の上方に配置され、円盤状の回転刃を備えた基板カッターと、前記基板カッターが前記基板を切断するとき基板上の切断ライン近傍を押圧することができ、互いに平行に所定のピッチで並んだ複数の板状の押え歯からなる基板押え部とを備えた基板切断装置を使用し、
前記基板載置台に対し前記基板を載置する工程と、
前記基板カッターを、前記基板を切断するように前記回転刃を回転させかつ上下移動させる工程および前記基板載置台を前記基板上の切断ラインが互いに平行になるように所定のピッチで駆動し、位置決めする工程を繰り返すことにより、前記複数の板状の押え歯の並び方向と同一の方向に、前記基板を前記所定のピッチで複数回切断する第一の切断工程と、
前記第一の切断工程の後、前記基板の向きを９０度回転させる工程と、
前記基板押え部で前記基板が切断されるライン近傍を押圧する工程、前記基板押え部で前記基板を押圧しつつ、前記基板カッターを、前記基板を切断するように前記回転刃を回転させかつ上下移動させる工程、および前記第一の切断工程の切断方向と垂直な方向に、前記基板載置台を切断ラインが互いに平行になるように所定のピッチで駆動し、位置決めする工程を繰り返すことにより前記基板を前記所定のピッチで複数回切断する第二の切断工程と、
からなることを特徴とする基板切断方法。In a substrate cutting method of obtaining a plurality of substrate pieces by cutting a substrate on which a plurality of semiconductor chips on which electronic circuits are formed are mounted,
A substrate mounting table for mounting the substrate when cutting the substrate, a substrate cutter disposed above the substrate mounting table and having a disk-shaped rotary blade, and when the substrate cutter cuts the substrate. It is possible to press the vicinity of the cutting line on the substrate, using a substrate cutting device having a substrate pressing portion composed of a plurality of plate-like pressing teeth arranged at a predetermined pitch in parallel with each other ,
Mounting the substrate on the substrate mounting table,
Rotating the rotary blade so as to cut the substrate and moving the substrate cutter up and down, and driving the substrate mounting table at a predetermined pitch so that cutting lines on the substrate are parallel to each other, and positioning the substrate cutter. A first cutting step of cutting the substrate a plurality of times at the predetermined pitch in the same direction as the arrangement direction of the plurality of plate-like pressing teeth ,
Rotating the substrate by 90 degrees after the first cutting step;
Pressing the vicinity of the line where the substrate is cut by the substrate pressing unit, while pressing the substrate with the substrate pressing unit, the substrate cutter rotates the rotary blade so as to cut the substrate, and moves up and down. The step of moving, and in the direction perpendicular to the cutting direction of the first cutting step, the substrate mounting table is driven at a predetermined pitch so that cutting lines are parallel to each other, and the step of positioning is repeated by repeating the step of positioning. A second cutting step of cutting a plurality of times at the predetermined pitch,
A substrate cutting method characterized by comprising:
前記基板を切断ラインが互いに平行になるように所定のピッチで複数回切断する第一の切断装置と、
前記基板を前記第一の切断装置で切断する方向と垂直な方向に切断する第二の切断装置を有し、
第二の切断装置は、前記基板を載置する基板載置台と、
前記基板載置台の上方に配置され、前記基板の切断によって得られる基板個片それぞれと当接することができ、互いに平行に所定のピッチで並んだ複数の板状の押え歯からなる基板押え部と、
前記基板押え部が前記基板の切断されるライン近傍を押圧するように前記基板押え部を移動させる基板押え部駆動機構と、
前記基板載置台の上方に配置され、円盤状の回転刃を備えた基板カッターと、
前記回転刃が回転しながら前記基板を切断するように前記回転刃を回転させかつ上下移動させる回転刃駆動機構と、
を備え、
さらに前記第二の切断装置における前記複数の板状の押え歯の並び方向と、前記基板を第二の切断装置で切断する方向とが同一の方向であることを特徴とする基板切断装置。In a substrate cutting device that obtains a plurality of substrate pieces by cutting a substrate on which a plurality of semiconductor chips on which electronic circuits are formed are mounted,
A first cutting device that cuts the substrate a plurality of times at a predetermined pitch so that the cutting lines are parallel to each other,
Having a second cutting device to cut the substrate in a direction perpendicular to the direction of cutting in the first cutting device,
A second cutting device, a substrate mounting table for mounting the substrate,
A substrate pressing portion that is disposed above the substrate mounting table and can be in contact with each of the substrate pieces obtained by cutting the substrate, and includes a plurality of plate-like pressing teeth arranged at a predetermined pitch in parallel with each other. ,
A substrate pressing unit driving mechanism that moves the substrate pressing unit so that the substrate pressing unit presses the vicinity of a line where the substrate is cut,
A substrate cutter disposed above the substrate mounting table and provided with a disk-shaped rotary blade,
A rotary blade drive mechanism that rotates the rotary blade and vertically moves so as to cut the substrate while the rotary blade rotates,
Equipped with a,
Further, the direction in which the plurality of plate-shaped pressing teeth are arranged in the second cutting device and the direction in which the substrate is cut by the second cutting device are the same direction .
をさらに備えた請求項３から９のいずれか１項に記載の基板切断装置。Wherein disposed above the substrate mounting table, the substrate outer peripheral pressing portion for pressing the substrate to the substrate table in contact with the outer peripheral portion of the substrate, the substrate outer peripheral pressing portion mounting the substrate to the outer peripheral portion of the substrate A substrate outer peripheral pressing portion driving mechanism for moving the substrate outer peripheral pressing portion so as to press against the mounting table,
The substrate cutting device according to any one of claims 3 to 9 , further comprising:
前記基板を切断する際に前記基板を載置する基板載置台と、
前記基板載置台の上方に配置され、前記基板の切断によって得られる基板個片それぞれと当接することができ、互いに平行に所定のピッチで並んだ複数の板状の押え歯からなる基板押え部と、
前記基板押え部が前記基板の切断されるライン近傍を押圧するように前記基板押え部を移動させる基板押え部駆動機構と、
前記基板載置台の上方に配置され、円盤状の回転刃を備えた基板カッターと、
前記回転刃が回転しながら前記基板を切断するように前記回転刃を回転させかつ上下移動させる回転刃駆動機構と、
を備え、
さらに前記複数の板状の押え歯の並び方向と、前記基板を切断する方向とが同一方向であることを特徴とする基板切断装置。 In a substrate cutting device that obtains a plurality of substrate pieces by cutting a substrate on which a plurality of semiconductor chips on which electronic circuits are formed are mounted,
A substrate mounting table for mounting the substrate when cutting the substrate,
A substrate pressing portion that is disposed above the substrate mounting table and can be in contact with each of the substrate pieces obtained by cutting the substrate, and includes a plurality of plate-like pressing teeth arranged at a predetermined pitch in parallel with each other. ,
A substrate pressing unit driving mechanism that moves the substrate pressing unit so that the substrate pressing unit presses the vicinity of the line where the substrate is cut,
A substrate cutter disposed above the substrate mounting table and provided with a disk-shaped rotary blade,
A rotary blade drive mechanism that rotates the rotary blade and vertically moves so as to cut the substrate while the rotary blade rotates,
With
Further, the substrate cutting apparatus is characterized in that the direction in which the plurality of plate-shaped pressing teeth are arranged is the same as the direction in which the substrate is cut.
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| JP2000313260A JP3558028B2 (en) | 2000-10-13 | 2000-10-13 | Substrate cutting method and substrate cutting device |
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| JP2000313260A JP3558028B2 (en) | 2000-10-13 | 2000-10-13 | Substrate cutting method and substrate cutting device |
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| KR102945869B1 (en) | 2022-07-13 | 2026-03-31 | 삼성전자주식회사 | Wafer cleaving apparatus and wafer cleaving system including the same |
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| JP4663335B2 (en) * | 2004-01-28 | 2011-04-06 | アルプス電気株式会社 | Manufacturing method of electronic circuit unit |
| JP2009117450A (en) * | 2007-11-02 | 2009-05-28 | Rohm Co Ltd | Module and manufacturing method thereof |
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| KR102945869B1 (en) | 2022-07-13 | 2026-03-31 | 삼성전자주식회사 | Wafer cleaving apparatus and wafer cleaving system including the same |
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