JP3560064B2 - TAB tape with adhesive - Google Patents

Description

（式中、Ｒ_１ 、Ｒ_２ は、水素または炭素数１〜６の炭化水素基を表す。Ｇは、グリシジル基を表す。ｎは、０〜１００の整数を表す。）
で表されるトリスヒドロキシフェニルメタン型エポキシ樹脂を必須成分として含むことを特徴とするＴＡＢ用接着剤付きテープにより達成される。
【００１０】
本発明において使用される有機絶縁フィルムとしては、ポリイミド、ポリエーテルイミド、芳香族ポリアミドなどからなるいわゆる耐熱性フィルム、ポリエチレンテレフタレートまたはフレキシブルエポキシ／ガラスクロスなどからなる複合材料などが好ましく使用できる。
【００１１】
接着剤の（ａ）成分であるポリアミド樹脂は、酸とジアミンの混合物を熱重合することによって得られるもので、メタノールなどのアルコール類を主要成分とする混合溶剤に溶解可能なものがすべて使用できるが、とりわけ、ポリアミド樹脂の原料の酸成分として炭素数が３６であるジカルボン酸（いわゆる「ダイマー酸」）を含むもの（いわゆる「ダイマー酸系ポリアミド」）が好ましい。ポリアミド樹脂は一般的に吸水率が大きいため絶縁抵抗が低くなる傾向があるが、ダイマー酸を使用することによって、吸水率を小さくし電気絶縁性を高くすることが可能となるためである。
【００１２】
ダイマー酸系ポリアミドは、ダイマー酸とジアミンの等モル混合物を熱重合することによって得ることができる。ジカルボン酸成分としてダイマー酸だけではなく、アゼライン酸、セバシン酸などの他のジカルボン酸を共重合成分として含有していてもかまわない。このときダイマー酸が、酸成分中で７０ｍｏｌ％以上であることがより好ましい。ダイマー酸系ポリアミドの中では、高重合度のものの方が、吸水率が比較的低く、高湿度の雰囲気でも電気絶縁性が高くなりやすいので好ましい。
【００１３】
ジアミン成分としては、ヘキサメチレンジアミン、エチレンジアミン、ピペラジン、ビス（４−アミノシクロヘキシル）メタン、ビス（４−アミノ，１，２−メチルシクロヘキシル）メタンなどがあげられるが、特に好ましいものは、ヘキサメチレンジアミンである。ヘキサメチレンジアミンを主成分としたダイマー酸系ポリアミドは、総合性能において優れた特性を発揮するため特に好ましい。また、ジアミン成分も一種だけではなく、二種以上混合したものも使用することができる。
【００１４】
接着剤の（ｂ）成分であるエポキシ樹脂は、一般式（１）
【化４】

（式中、Ｒ_１ 、Ｒ_２ は、水素または炭素数１〜６の炭化水素基を表す。Ｇは、グリシジル基を表す。ｎは、０〜１００の整数を表す。）
で表されるトリスヒドロキシフェニルメタン型エポキシ樹脂を必須成分として含む。Ｒ_１ 、Ｒ_２ の炭素数としては、多くなるほど構造が剛直となり接着力がでにくくなるため少ないほど好ましく、水素であるときが特に好ましい。かかるトリスヒドロキシフェニルメタン型エポキシ樹脂としては例えば油化シェル製Ｅｐ１０３２Ｓ５０、Ｅｐ１０３２Ｈ６０や日本化薬製ＥＰＰＮ５０１Ｈ、５０２Ｈ等として容易に入手しうる。
【００１５】
また、（ａ）成分のポリアミド樹脂との相溶性を高めるため、一般式（３）
【化５】

（式中、Ｒ_４ 、Ｒ_５ は、フッ素、水素または炭素数１〜６の炭化水素を表す。Ｇは、グリシジル基を表す。ｍは、０〜１００の整数を表す。）
で表されるビスフェノール型エポキシ樹脂を本発明の必須成分であるトリスヒドロキシフェニルメタン型エポキシ樹脂に混合することができる。相溶性は接着剤の透明性に影響し、相溶性が高くなるほど接着剤が透明になるため、ＴＡＢテープ加工時における加工性を向上させる。かかるビスフェノール型エポキシ樹脂と本発明の必須成分であるトリスヒドロキシフェニルメタン型エポキシ樹脂との配合割合としては、トリスヒドロキシフェニルメタン型：ビスフェノール型が２０：８０〜８０：２０が好ましく、より好ましくは、３０：７０〜７０：３０である。かかるビスフェノール型エポキシ樹脂としては、例えば油化シェル製Ｅｐ８２８が使用しうる。
【００１６】
接着剤の（ｃ）成分のフェノール樹脂としては、アルキルフェノール樹脂、パラフェニルフェノール樹脂等のノボラックフェノール樹脂、レゾールフェノール樹脂等、公知のフェノール樹脂があげられる。特に、常温固体の熱硬化型のものが好ましく、これらの中でも、一般式（２）
【化６】

（式中、Ｒ_３ は、水素または炭素数１〜９の炭化水素を表す。）
で表される構造単位を含むものが本発明の目的をより向上させるため特に好ましい。一般式（２）で表される構造単位が多くなるほど熱押圧性が良くなるため、フェノール樹脂中で３５重量％以上含有していることが好ましく、５０重量％以上であることがより好ましい。また、Ｒの炭素数としては、多くなるほどポリアミド樹脂、エポキシ樹脂との相溶性が高くなるが、多くなりすぎると熱押圧性が低下するためＲが４（ブチル基）であるときがさらに好ましい。また、入手のしやすさからｔ−ブチル基であることが特に好ましい。
【００１７】
各々の成分比としては、（ａ）成分のポリアミド樹脂を１００重量部とした場合、（ｂ）成分のエポキシ樹脂は１０〜８０重量部が好ましく、より好ましくは２０〜６０重量部である。エポキシ樹脂が少なすぎると、熱圧着に弱くなりやすい。また、エポキシ樹脂が多すぎると接着力がでにくくなる。（ｃ）成分のフェノール樹脂は５〜７０重量部が好ましく、より好ましくは、１０〜６０重量部である。フェノール樹脂を追加的に含めることにより熱圧着はさらに強くなる。また、フェノール樹脂が多すぎると、熱圧着が弱くなり好ましくない。
【００１８】
上述の各成分を溶媒に溶解することにより、接着剤樹脂混合物溶液を得る。接着剤各成分を溶解する溶媒としては、トルエン、キシレン、クロルベンゼン、ベンジルアルコールなどの芳香族系溶媒とメタノール、エタノール、イソプロピルアルコール、ブチルアルコールなどのアルコール系溶媒との混合溶媒が適している。
【００１９】
また、本発明においては、必要に応じ、接着剤層の上に、保護フィルムが形成される。保護フィルムは防塵あるいは取扱性の目的から使用されるもので、ポリエチレン、ポリプロピレン、ポリエチレンテレフタレート、ポリフェニレンサイファイドなどが好ましく使用される。
【００２０】
ＴＡＢ用接着剤付きテープは、通常、次に示す（１）、（２）のいずれかの方法で作られる。
【００２１】
（１）有機絶縁フィルムに、上記接着剤樹脂混合物溶液を塗布・乾燥する。このとき、乾燥後の膜厚が１０〜２５μｍ程度になるように塗布することが好ましい。また、乾燥条件としては、通常、１００〜２００℃、１〜５分の範囲である。これに必要に応じて、離型性のある保護フィルムを張り合わせ、目的とする幅にスリットする。その幅は通常、３５〜１５８ｍｍ程度である。
【００２２】
（２）保護フィルムとなるべき離型性フィルム上に、上記接着剤樹脂混合物溶液を上記（１）と同様に塗布・乾燥する。該接着剤層上に必要に応じ第２の離型フィルムを張り合わせ、上記（１）と同様に目的とする幅にスリットする。これをあらかじめ目的の幅にスリットされたポリイミドなどの有機絶縁フィルムに、第２の離型フィルムを剥がして接着剤面を張り合わせる。通常、基材である有機絶縁フィルムの幅は、接着剤の幅より広く設定されている。
【００２３】
本発明にかかるＴＡＢ用接着剤付きテープの模式的断面図を図１に示す。有機絶縁フィルム１からなる基材と、その上に接着剤２を介して接着された保護フィルム３からなっている。
【００２４】
ＩＣ搭載用のＴＡＢテープは、上記ＴＡＢ用接着剤付きテープを使用して、概略次の工程を経て造られる。
【００２５】
▲１▼スプロケット穴・デバイス穴などのパンチング工程、
▲２▼保護フィルム除去・銅箔ラミネート工程、
▲３▼接着剤加熱キュア工程、
▲４▼フォトレジスト塗布・パターン露光・現像工程、
▲５▼銅箔パターンエッチング工程、
▲６▼フォトレジスト剥離工程、
▲７▼（必要によりソルダーレジスト塗布工程）、
▲８▼メッキ工程（スズ、半田、金など）。
【００２６】
かくして得られたＴＡＢテープにＩＣが搭載される。
【００２７】
以下に、本発明の作用について説明する。
【００２８】
実施例並びに比較例で詳しく示す通り、例えばＴＡＢテープ用接着剤として提案されている従来のポリアミド樹脂／エポキシ樹脂系およびポリアミド樹脂／エポキシ樹脂／フェノール樹脂（またはポリパラビニルフェノール樹脂）系接着剤では２５ｋｇ／ｃｍ^２ の圧力でＴＡＢテープの導体を押圧した場合、１００〜１２０℃の温度で導体が接着剤中へ埋没するのに対し、本発明の一般式（１）
【化７】

で表されるトリスヒドロキシフェニルメタン型エポキシ樹脂を含むエポキシ樹脂を使用した場合は１６０℃でも埋没が発生しないという劇的な作用が認められるのである。
【００２９】
高温での押圧力により導体の埋没現象が起こらないと同時に、ＴＡＢテープ用接着剤に必要とされる接着性、耐薬品性、電気絶縁性などがバランスよく保持されていなければならないが、本発明の接着剤はこれらの性能についても満足すべきレベルにあることが確認され、ＴＡＢ実装分野において工業的にも非常に重要な役割を果たし得ることがわかった。
【００３０】
【実施例】
以下、実施例により本発明をさらに詳細に説明する。
【００３１】
なお、本実施例における各試験は、次のようにして行なった。
【００３２】

ヘッド圧力を２５ｋｇ、加圧時間を６秒にセットし、ヒータ温度を１０℃きざみで変えながら熱押圧テストを行い、導体が接着剤中へ埋没し始める温度（この温度を「熱変形温度」とする）を測定する。実用的には、熱変形温度が１５０℃以上が好ましく、１８０℃以上であることがより好ましい。
【００３３】
＜接着力測定方法＞
性能検討用ＴＡＢテープ：導体幅 ２００μｍ
測定機：オリエンテック製 引っ張り試験機
導体を９０°方向に速度５０ｍｍ／ｍｉｎでひきはがし、そのときの応力を測定する。一般的には、１．０ｋｇ／ｃｍ以上が必要である。
【００３４】

ＴＡＢテープを１３０℃、８５％、２ａｔｍ、１００Ｖ印加下で短絡するまでの時間を測定する。短絡までの時間としては、１００時間以上が好ましく、５００時間以上が特に好ましい。
【００３５】
実施例１
厚さ７５μｍのポリイミドフィルム（宇部興産製“ユーピレックス”７５Ｓ）に、下記組成物を固形分濃度２０重量％となるようにメタノール／モノクロルベンゼン混合溶液に溶解した後、得られた接着剤溶液を乾燥膜厚が１８μｍとなるように塗布し、エヤオーブンを使用し１００℃で１分、１５０℃で２分乾燥した。
【００３６】
＜接着剤組成＞
ポリアミド樹脂 １００重量部
（Ｕｎｉｃｈｅｍａ社製ナイロン６・３６“ＰＲＩＡＤＩＴ”２０５３、
ダイマー酸とヘキサメチレンジアミンが主成分、重量平均分子量１０万、
１７５℃でのＭＩ値１０ｇｒ／分）
トリスヒドロキシフェニルメタン型エポキシ樹脂 ６０重量部
（油化シェル社製Ｅｐ１０３２Ｓ６０、Ｒ_１ ＝Ｒ_２ ＝水素、ｎ＝０．７）
熱硬化型アルキルフェノール樹脂 ４０重量部
（群栄化学社製ＰＳ２７８０）
４，４´−ジアミノジフェニルメタン ５重量部
上記で得られた接着剤付きポリイミドフィルムに厚さ３５μｍの電解銅箔をロールラミネート法によって張り合わせた。続いてエヤオーブン中で、８０℃×３時間、１００℃×５時間、１５０℃×５時間の条件で加熱処理し、接着剤を硬化させた。
【００３７】
得られたＴＡＢ用接着剤付きテープを用いて、常法により銅箔面にフォトレジスト塗布、パターン露光、現像、銅箔パターンエッチング、フォトレジスト剥離工程を経てクシ型パターンを形成した。さらに浸漬スズメッキ液を用いて０．５μｍ厚みのメッキを施し性能検討用のＴＡＢテープを作成した。
【００３８】
得られたＴＡＢテープについて、熱押圧性、接着力および絶縁性について上述の方法でテストを行った。結果を表１に示す。
【００３９】
実施例２
離型処理を施した厚み２５μｍのポリエチレンテレフタレートフィルムに、実施例１と同じ接着剤溶液を実施例１と同じ方法で塗布、乾燥した。該フィルムの接着面を厚さ１２５μｍのポリイミドフィルム（東レ・デュポン社製“カプトン”５００Ｖ）にロールラミネート方式により１２０℃の温度で張り合わせて、接着剤付きポリイミドフィルムを作成した。これを用いて実施例１と全く同じ方法で性能検討用のＴＡＢテープを作成した。
【００４０】
得られたＴＡＢテープについて、熱押圧性、接着力および絶縁性について上述の方法でテストを行った。結果を表１に示す。
【００４１】
実施例３
接着剤成分が下記の通りである以外は、実施例２と同じ方法で性能検討用ＴＡＢテープを作成した。
【００４２】
＜接着剤組成＞
ポリアミド樹脂 １００重量部
（ヘンケル社製ナイロン“ＭＡＣＲＯＭＥＬＴ”６９０１、
アゼライン酸を約１０モル％共重合成分として含む以外は実施例１のポリ
アミド樹脂と同じ）
トリスヒドロキシフェニルメタン型エポキシ樹脂 ２０重量部
（油化シェル社製Ｅｐ１０３２Ｓ６０）
ビスフェノールＡ型エポキシ樹脂 ２０重量部
（油化シェル社製Ｅｐ８２８）
熱硬化型アルキルフェノール樹脂 ５０重量部
（群栄化学社製ＰＳ２７８０）
得られたＴＡＢテープについて、熱押圧性、接着力および絶縁性について上述の方法でテストを行った。結果を表１に示す。
【００４３】
実施例４
接着剤成分が下記の通りである以外は、実施例２と同じ方法で性能検討用ＴＡＢテープを作成した。
【００４４】
＜接着剤組成＞
ポリアミド樹脂 １００重量部
（ヘンケル社製ナイロン“ＭＡＣＲＯＭＥＬＴ”６９０１）
トリスヒドロキシフェニルメタン型エポキシ樹脂 ２０重量部
（油化シェル社製Ｅｐ１０３２Ｓ６０）
ビスフェノールＡ型エポキシ樹脂 ２０重量部
（油化シェル社製Ｅｐ８２８）
熱可塑型フェノール樹脂 ５０重量部
（群栄化学社製ＰＳＭ４３２６）
４，４´−ジアミノジフェニルメタン ５重量部
得られたＴＡＢテープについて、熱押圧性、接着力および絶縁性について上述の方法でテストを行った。結果を表１に示す。
【００４５】
比較例１
接着剤成分が下記組成のものを用いた以外は実施例１と全く同じ内容の性能検討用ＴＡＢテープを作成した。
【００４６】
＜接着剤組成＞
ポリアミド樹脂 １００重量部
（Ｕｎｉｃｈｅｍａ社製ナイロン６・３６“ＰＲＩＡＤＩＴ”２０５３）
フェノールノボラック型エポキシ樹脂 ６０重量部
（油化シェル社製Ｅｐ１５２）
熱可塑型フェノール樹脂 ４０重量部
（群栄化学社製ＰＳＭ４３２６）
４，４´−ジアミノジフェニルメタン ５重量部
得られたＴＡＢテープについて、熱押圧性、接着力および絶縁性について上述の方法でテストを行った。結果を表１に示す。
【００４７】
比較例２
接着剤成分が下記組成のものを用いた以外は実施例１と全く同じ内容の性能検討用ＴＡＢテープを作成した。
【００４８】
＜接着剤組成＞
ポリアミド樹脂 １００重量部
（Ｕｎｉｃｈｅｍａ社製ナイロン６・３６“ＰＲＩＡＤＩＴ”２０５３）
ビスフェノールＡ型エポキシ樹脂 ６０重量部
（油化シェル社製Ｅｐ８２８）
熱硬化型アルキルフェノール樹脂 ４０重量部
（昭和高分子社製ＣＫＭ１２８２）
２−エチルイミダゾール ５重量部
得られたＴＡＢテープについて、熱押圧性、接着力および絶縁性について上述の方法でテストを行った。結果を表１に示す。
【００４９】
比較例３
接着剤成分が下記組成のものを用いた以外は実施例１と全く同じ内容の性能検討用ＴＡＢテープを作成した。
【００５０】
＜接着剤組成＞
ポリアミド樹脂 １００重量部
（ヘンケル社製ナイロン“ＭＡＣＲＯＭＥＬＴ”６９０１）
フェノールノボラック型エポキシ樹脂 ２０重量部
（油化シェル社製Ｅｐ１５２）
ビスフェノールＡ型エポキシ樹脂 ２０重量部
（油化シェル社製Ｅｐ８２８）
熱可塑型フェノール樹脂 ５０重量部
（群栄化学社製ＰＳＭ４３２６）
得られたＴＡＢテープについて、熱押圧性、接着力および絶縁性について上述の方法でテストを行った。結果を表１に示す。
【００５１】
【表１】

【００５２】
【発明の効果】
本発明にかかるＴＡＢ用接着剤付きテープを原料とするＴＡＢテープは、従来と同様の接着性、絶縁性、耐薬品性を有し、かつドライバーＩＣなどのＩＣをＴＡＢ方式により実装したＴＣＰを液晶表示パネルに熱硬化型異方導電性接着剤により接続する場合や、ＴＡＢ方式により搭載されたＩＣをトランスファ成型方式により樹脂封止する場合などの熱応力に耐えることができるので、導体が接着剤中に埋没することがなく、高品位なものである。
【図面の簡単な説明】
【図１】本発明にかかるＴＡＢ用接着剤付きテープの模式的断面図である。
【図２】ＴＡＢテープの模式的断面図である。
【図３】ＴＡＢテープの導体が接着剤中へ埋没した状態を示す模式的断面図である。
【符号の説明】
１：有機絶縁フィルム
２：接着剤
３：保護フィルム
４：導体[0001]
[Industrial applications]
The present invention relates to a tape with an adhesive used for a tape for mounting a semiconductor integrated circuit (hereinafter, abbreviated as “TAB tape”) called a TAB (tape automated bonding) method.
[0002]
[Prior art]
As shown in FIG. 2, the basic structure of the TAB tape is usually a heat-resistant organic insulating film 1 such as polyimide as a base material, and a polyamide-epoxy mixed system (abbreviated as “polyamide / epoxy system”). “□□□ / △△△ system” means a mixed system of □□□ and △△△) Conductor 4 such as copper foil adhered via thermosetting adhesive 2 such as adhesive Consists of These adhesives are required to have various properties such as adhesion, insulation, and chemical resistance.
[0003]
In order to connect a tape carrier package (hereinafter abbreviated as "TCP") on which a liquid crystal driving IC (hereinafter abbreviated as "driver IC") is mounted to a liquid crystal display panel, usually, thermocompression bonding using an anisotropic conductive adhesive is used. Although the system is adopted, the TAB tape adhesive used in this system needs new performance in addition to the above-mentioned various characteristics. In other words, in order to obtain an electrically and mechanically reliable connection between the outer lead of the TCP and the transparent electrode formed on the glass surface of the liquid crystal display panel, a thermosetting adhesive is used. Therefore, the thermocompression bonding conditions must be strong in temperature, pressure, and time. Conventionally, examples of adhesives for TAB tapes using polyamide / epoxy type, polyamide / epoxy / phenol type, and further using a curing agent are known. In addition, as typical examples of these components, polyamide, nylon, dimer acid polyamide, epoxy resin, bisphenol, phenol novolak, cresol novolak, phenolic resin, polyparavinylphenol, alkylphenol, as a curing agent, Imidazoles, amines and acid anhydrides are known. However, in the TCP using these conventional adhesives, particularly when thermocompression-bonded to a liquid crystal panel using a thermosetting anisotropic conductive adhesive, the conductor of the TAB tape is buried in the adhesive by thermal pressure. There is a problem that serious defects occur. FIG. 3 schematically shows a state in which the conductor 4 is buried in the adhesive 2. In such a state, the original performance expected of the anisotropic conductive adhesive cannot be exhibited at all.
[0004]
Also, in TCP, studies are being made on resin encapsulation by transfer molding from the idea of improving the reliability of ICs or making the package form such as QFP type the same as that of normal wire bonding, but also in this case, Conventional TCP using an adhesive has a problem that the conductor of the TAB tape is buried in the adhesive as shown in FIG. 3 due to heat and pressure during molding, and the original purpose cannot be achieved.
[0005]
The TAB tape is the same in material construction as a flexible printed circuit board (FPC), and a nylon (polyamide) / epoxy adhesive has been known as an adhesive for FPC since ancient times (“Adhesion” Vol. 17, No. 7). Pp31-38 (1973)). It is also well known that polyamide / epoxy (including a curing agent such as phenolic resin and dicyandiamide (DICY)) exhibits excellent performance as an adhesive for TAB tape (Japanese Patent Application Laid-Open No. 53-134365). JP, JP-B-58-30755, JP-B-61-3101), and more recently, a polyamide / epoxy / polyparavinylphenol (including an imidazole-based curing agent) (JP-A-2-15664), A polyamide / epoxy / phenol resin (including an imidazole-based curing agent) (JP-A-2-14347, JP-A-3-217035) and the like have also been proposed.
[0006]
These adhesives are based on the excellent adhesiveness, toughness, and chemical resistance of nylon (polyamide) resin, and are formed by the reaction between the epoxy resin and the active terminal group (—NH ₂ , —COOH) of the polyamide molecular chain. The basic philosophy is to increase the cross-linking density of the epoxy resin itself with an epoxy curing agent such as DICY or imidazole at the same time as forming the cross-linked structure of It has become. It is also well known that phenolic hydroxyl groups in the molecular structure of phenolic resin or polyparavinylphenol act as a curing agent for epoxy resins, forming cured products with excellent heat resistance and electrical insulation. The adhesive for TAB also has the effect of further modifying the properties of the polyamide / epoxy resin or polyamide / epoxy / phenol resin system.
[0007]
However, these conventionally known adhesives cannot withstand the thermocompression bonding condition of the thermosetting anisotropic conductive adhesive or the transfer molding conditions sufficiently, and the conductor is buried in the adhesive and the initial purpose There are drawbacks that cannot be achieved.
[0008]
[Problems to be solved by the invention]
Accordingly, an object of the present invention is to provide a bonding agent for a TAB tape, which has adhesiveness, insulation, chemical resistance, and the like, and to connect a TCP to a liquid crystal panel using a thermosetting anisotropic conductive adhesive. Another object of the present invention is to provide a TAB adhesive tape with high performance that withstands heat pressure such as transfer molding of a TAB IC and does not bury the conductor in the adhesive in the process.
[0009]
[Means for Solving the Problems]
An object of the present invention is to provide a TAB tape with an adhesive having a basic structure in which an organic insulating film and an adhesive layer or an organic insulating film, an adhesive layer and a protective film are laminated in this order, wherein the adhesive layer is , (A) a polyamide resin, (b) an epoxy resin, and (c) a phenol resin as essential components, wherein the epoxy resin has the general formula (1)
Embedded image

(In the formula, R ₁ and R ₂ represent hydrogen or a hydrocarbon group having 1 to 6 carbon atoms. G represents a glycidyl group. N represents an integer of 0 to 100.)
This is achieved by a tape with an adhesive for TAB, comprising a trishydroxyphenylmethane type epoxy resin represented by the following formula as an essential component.
[0010]
As the organic insulating film used in the present invention, a so-called heat-resistant film made of polyimide, polyetherimide, aromatic polyamide, or the like, or a composite material made of polyethylene terephthalate, flexible epoxy / glass cloth, or the like can be preferably used.
[0011]
The polyamide resin as the component (a) of the adhesive is obtained by thermally polymerizing a mixture of an acid and a diamine, and any resin that can be dissolved in a mixed solvent containing alcohols such as methanol as a main component can be used. However, especially those containing a dicarboxylic acid having 36 carbon atoms (so-called “dimer acid”) as an acid component of the raw material of the polyamide resin (so-called “dimer acid-based polyamide”) are preferable. Polyamide resins generally have a high water absorption and tend to have low insulation resistance. However, the use of dimer acid makes it possible to reduce the water absorption and increase the electrical insulation.
[0012]
The dimer acid-based polyamide can be obtained by thermally polymerizing an equimolar mixture of dimer acid and diamine. As the dicarboxylic acid component, not only dimer acid but also other dicarboxylic acids such as azelaic acid and sebacic acid may be contained as copolymer components. At this time, it is more preferable that the dimer acid is 70 mol% or more in the acid component. Among the dimer acid-based polyamides, those having a high degree of polymerization are preferred because they have a relatively low water absorption rate and tend to have high electrical insulation even in a high humidity atmosphere.
[0013]
Examples of the diamine component include hexamethylenediamine, ethylenediamine, piperazine, bis (4-aminocyclohexyl) methane, and bis (4-amino, 1,2-methylcyclohexyl) methane. Particularly preferred is hexamethylenediamine. It is. A dimer acid-based polyamide containing hexamethylenediamine as a main component is particularly preferable because it exhibits excellent characteristics in overall performance. Further, not only one kind of diamine component but also a mixture of two or more kinds can be used.
[0014]
The epoxy resin as the component (b) of the adhesive has the general formula (1)
Embedded image

(In the formula, R ₁ and R ₂ represent hydrogen or a hydrocarbon group having 1 to 6 carbon atoms. G represents a glycidyl group. N represents an integer of 0 to 100.)
As an essential component. As the number of carbon atoms of R ₁ and R ₂ , as the number increases, the structure becomes rigid and the adhesive force is difficult to be reduced, so the number is preferably as small as possible, and hydrogen is particularly preferable. Such a trishydroxyphenylmethane type epoxy resin can be easily obtained as, for example, Ep1032S50 and Ep1032H60 manufactured by Yuka Shell and EPPN501H and 502H manufactured by Nippon Kayaku.
[0015]
Further, in order to enhance the compatibility with the polyamide resin of the component (a), the general formula (3)
Embedded image

(In the formula, R ₄ and R ₅ represent fluorine, hydrogen, or a hydrocarbon having 1 to 6 carbon atoms. G represents a glycidyl group. M represents an integer of 0 to 100.)
Can be mixed with the trishydroxyphenylmethane type epoxy resin which is an essential component of the present invention. Compatibility affects the transparency of the adhesive, and the higher the compatibility, the more transparent the adhesive, thus improving the processability during TAB tape processing. The mixing ratio of the bisphenol-type epoxy resin and the trishydroxyphenylmethane-type epoxy resin, which is an essential component of the present invention, is preferably 20:80 to 80:20, more preferably trishydroxyphenylmethane-type: bisphenol-type. 30:70 to 70:30. As such a bisphenol-type epoxy resin, for example, Ep828 manufactured by Yuka Shell can be used.
[0016]
Examples of the phenol resin as the component (c) of the adhesive include known phenol resins such as a novolak phenol resin such as an alkylphenol resin and a paraphenylphenol resin, and a resol phenol resin. In particular, a room temperature solid thermosetting type is preferable, and among these, the general formula (2)
Embedded image

(In the formula, R ₃ represents hydrogen or a hydrocarbon having 1 to 9 carbon atoms.)
Those containing the structural unit represented by are particularly preferable for further improving the object of the present invention. As the structural unit represented by the general formula (2) increases, the heat-pressing property becomes better. Therefore, the content is preferably 35% by weight or more, more preferably 50% by weight or more in the phenol resin. Further, as the number of carbon atoms of R increases, the compatibility with the polyamide resin and the epoxy resin increases, but when the number of carbon atoms is too large, the heat pressing property is reduced, so that R is more preferably 4 (butyl group). Further, a t-butyl group is particularly preferred from the viewpoint of availability.
[0017]
When each component ratio is 100 parts by weight of the polyamide resin of the component (a), the epoxy resin of the component (b) is preferably from 10 to 80 parts by weight, more preferably from 20 to 60 parts by weight. If the amount of the epoxy resin is too small, it tends to be weak to thermocompression bonding. On the other hand, if the amount of the epoxy resin is too large, it becomes difficult to obtain an adhesive force. The phenol resin of the component (c) is preferably from 5 to 70 parts by weight, more preferably from 10 to 60 parts by weight. Thermocompression bonding is further enhanced by the additional inclusion of a phenolic resin. If the amount of the phenol resin is too large, the thermocompression bonding is weakened, which is not preferable.
[0018]
By dissolving each of the above components in a solvent, an adhesive resin mixture solution is obtained. As a solvent for dissolving each component of the adhesive, a mixed solvent of an aromatic solvent such as toluene, xylene, chlorobenzene and benzyl alcohol and an alcohol solvent such as methanol, ethanol, isopropyl alcohol and butyl alcohol is suitable.
[0019]
In the present invention, a protective film is formed on the adhesive layer as needed. The protective film is used for the purpose of preventing dust or handling, and polyethylene, polypropylene, polyethylene terephthalate, polyphenylene sulfide, and the like are preferably used.
[0020]
A tape with an adhesive for TAB is usually produced by one of the following methods (1) and (2).
[0021]
(1) The above-mentioned adhesive resin mixture solution is applied and dried on an organic insulating film. At this time, it is preferable to apply so that the film thickness after drying is about 10 to 25 μm. The drying conditions are usually in the range of 100 to 200 ° C. for 1 to 5 minutes. If necessary, a protective film having releasability is attached to the film and slit to a desired width. The width is usually about 35 to 158 mm.
[0022]
(2) The adhesive resin mixture solution is applied and dried on a release film to be a protective film in the same manner as in (1). If necessary, a second release film is laminated on the adhesive layer, and slit to a desired width as in the above (1). The second release film is peeled off from an organic insulating film made of polyimide or the like which has been slit to a desired width in advance, and the adhesive surface is bonded. Usually, the width of the organic insulating film as the base material is set wider than the width of the adhesive.
[0023]
FIG. 1 is a schematic cross-sectional view of a tape with an adhesive for TAB according to the present invention. It comprises a substrate made of an organic insulating film 1 and a protective film 3 adhered thereon via an adhesive 2.
[0024]
A TAB tape for mounting an IC is manufactured through the following steps using the tape with an adhesive for TAB.
[0025]
(1) Punching process for sprocket holes, device holes, etc.
(2) Protective film removal and copper foil laminating process
(3) adhesive heating curing process,
(4) Photoresist coating, pattern exposure and development processes,
(5) Copper foil pattern etching process,
(6) Photoresist stripping process,
7) (Solder resist coating process if necessary),
(8) Plating process (tin, solder, gold, etc.).
[0026]
The IC is mounted on the TAB tape thus obtained.
[0027]
Hereinafter, the operation of the present invention will be described.
[0028]
As shown in detail in Examples and Comparative Examples, for example, conventional polyamide resin / epoxy resin-based adhesives and polyamide resin / epoxy resin / phenolic resin (or polyparavinylphenol resin) -based adhesives proposed as adhesives for TAB tapes are used. When the conductor of the TAB tape is pressed at a pressure of 25 kg / cm ² , the conductor is buried in the adhesive at a temperature of 100 to 120 ° C., whereas the general formula (1) of the present invention is used.
Embedded image

When an epoxy resin containing a trishydroxyphenylmethane type epoxy resin represented by the following formula is used, a dramatic effect that burial does not occur even at 160 ° C. is recognized.
[0029]
While the conductor burying phenomenon does not occur due to the pressing force at high temperature, the adhesiveness, chemical resistance, electrical insulation, etc. required for the adhesive for TAB tape must be maintained in a well-balanced manner. It has been confirmed that these adhesives are also at a satisfactory level with respect to their performance, and that they can play a very important role industrially in the TAB mounting field.
[0030]
【Example】
Hereinafter, the present invention will be described in more detail with reference to examples.
[0031]
In addition, each test in this example was performed as follows.
[0032]

A head pressure is set to 25 kg, a pressurizing time is set to 6 seconds, and a heat press test is performed while changing a heater temperature in increments of 10 ° C., and a temperature at which the conductor starts to be buried in the adhesive (this temperature is referred to as a “heat deformation temperature”). Measure). Practically, the heat deformation temperature is preferably 150 ° C. or higher, more preferably 180 ° C. or higher.
[0033]
<Adhesive strength measurement method>
TAB tape for performance study: conductor width 200 μm
Measuring machine: Tensile tester manufactured by Orientec The conductor was peeled off at a speed of 50 mm / min in a 90 ° direction, and the stress at that time was measured. Generally, 1.0 kg / cm or more is required.
[0034]

The time until the TAB tape is short-circuited at 130 ° C., 85%, 2 atm, and 100 V is measured. The time until a short circuit is preferably 100 hours or more, particularly preferably 500 hours or more.
[0035]
Example 1
The following composition was dissolved in a mixed solution of methanol / monochlorobenzene in a 75 μm-thick polyimide film (“UPILEX” 75S manufactured by Ube Industries, Ltd.) to a solid concentration of 20% by weight, and the obtained adhesive solution was dried. It was applied to a thickness of 18 μm and dried at 100 ° C. for 1 minute and at 150 ° C. for 2 minutes using an air oven.
[0036]
<Adhesive composition>
100 parts by weight of polyamide resin (Unichema nylon 6.36 "PRIADIT" 2053,
Dimer acid and hexamethylenediamine as main components, weight average molecular weight 100,000,
(MI value at 175 ° C. 10 gr / min)
60 parts by weight of trishydroxyphenylmethane type epoxy resin (Ep1032S60 manufactured by Yuka Shell Co., Ltd., R ₁ = R ₂ = hydrogen, n = 0.7)
40 parts by weight of thermosetting alkylphenol resin (PS2780 manufactured by Gunei Chemical Co., Ltd.)
5,4′-Diaminodiphenylmethane 5 parts by weight An electrolytic copper foil having a thickness of 35 μm was bonded to the polyimide film with an adhesive obtained above by a roll laminating method. Subsequently, the adhesive was heated in an air oven under the conditions of 80 ° C. × 3 hours, 100 ° C. × 5 hours, and 150 ° C. × 5 hours to cure the adhesive.
[0037]
Using the obtained tape with an adhesive for TAB, a comb-type pattern was formed on the copper foil surface through a photoresist coating, pattern exposure, development, copper foil pattern etching, and photoresist stripping steps by a conventional method. Further, plating was performed with a thickness of 0.5 μm using an immersion tin plating solution to prepare a TAB tape for performance examination.
[0038]
The obtained TAB tape was tested for heat pressing property, adhesive strength and insulating property by the above-mentioned method. Table 1 shows the results.
[0039]
Example 2
The same adhesive solution as in Example 1 was applied to a 25 μm-thick polyethylene terephthalate film that had been subjected to a release treatment, and dried in the same manner as in Example 1. The adhesive surface of the film was adhered to a 125 μm-thick polyimide film (“Kapton” 500 V, manufactured by Du Pont-Toray Co., Ltd.) at a temperature of 120 ° C. by a roll lamination method to prepare a polyimide film with an adhesive. Using this, a TAB tape for performance study was prepared in exactly the same manner as in Example 1.
[0040]
The obtained TAB tape was tested for heat pressing property, adhesive strength and insulating property by the above-mentioned method. Table 1 shows the results.
[0041]
Example 3
A TAB tape for performance study was prepared in the same manner as in Example 2, except that the adhesive components were as follows.
[0042]
<Adhesive composition>
100 parts by weight of polyamide resin (Henkel Nylon “MACROMELT” 6901,
(Same as the polyamide resin of Example 1 except that azelaic acid is contained as a copolymer component of about 10 mol%)
20 parts by weight of trishydroxyphenylmethane type epoxy resin (Ep1032S60 manufactured by Yuka Shell Co., Ltd.)
20 parts by weight of bisphenol A type epoxy resin (Ep828 manufactured by Yuka Shell Co., Ltd.)
50 parts by weight of thermosetting alkylphenol resin (PS2780 manufactured by Gunei Chemical Co., Ltd.)
The obtained TAB tape was tested for heat pressing property, adhesive strength and insulating property by the above-mentioned method. Table 1 shows the results.
[0043]
Example 4
A TAB tape for performance study was prepared in the same manner as in Example 2, except that the adhesive components were as follows.
[0044]
<Adhesive composition>
100 parts by weight of polyamide resin (Nylon “MACROMELT” 6901 manufactured by Henkel)
20 parts by weight of trishydroxyphenylmethane type epoxy resin (Ep1032S60 manufactured by Yuka Shell Co., Ltd.)
20 parts by weight of bisphenol A type epoxy resin (Ep828 manufactured by Yuka Shell Co., Ltd.)
50 parts by weight of thermoplastic phenolic resin (PSM4326 manufactured by Gunei Chemical Co., Ltd.)
4,4'-Diaminodiphenylmethane 5 parts by weight The obtained TAB tape was tested for heat pressing property, adhesive strength and insulating property by the above-mentioned method. Table 1 shows the results.
[0045]
Comparative Example 1
A TAB tape for performance study having exactly the same contents as in Example 1 was prepared except that the adhesive component had the following composition.
[0046]
<Adhesive composition>
100 parts by weight of polyamide resin (Unichema nylon 6.36 "PRIADIT" 2053)
60 parts by weight of phenol novolak type epoxy resin (Ep 152 manufactured by Yuka Shell Co., Ltd.)
40 parts by weight of thermoplastic phenolic resin (PSM4326 manufactured by Gunei Chemical Co., Ltd.)
4,4'-Diaminodiphenylmethane 5 parts by weight The obtained TAB tape was tested for heat pressing property, adhesive strength and insulating property by the above-mentioned method. Table 1 shows the results.
[0047]
Comparative Example 2
A TAB tape for performance study having exactly the same contents as in Example 1 was prepared except that the adhesive component had the following composition.
[0048]
<Adhesive composition>
100 parts by weight of polyamide resin (Unichema nylon 6.36 "PRIADIT" 2053)
Bisphenol A type epoxy resin 60 parts by weight (Ep828 manufactured by Yuka Shell Co., Ltd.)
40 parts by weight of thermosetting type alkylphenol resin (CKM1282 manufactured by Showa Polymer Co., Ltd.)
2-Ethyl imidazole 5 parts by weight The obtained TAB tape was tested for heat pressing property, adhesive strength and insulating property by the above-mentioned method. Table 1 shows the results.
[0049]
Comparative Example 3
A TAB tape for performance study having exactly the same contents as in Example 1 was prepared except that the adhesive component had the following composition.
[0050]
<Adhesive composition>
100 parts by weight of polyamide resin (Nylon "MACROMELT" 6901 manufactured by Henkel)
20 parts by weight of phenol novolak type epoxy resin (Ep 152 manufactured by Yuka Shell Co., Ltd.)
20 parts by weight of bisphenol A epoxy resin (Ep828 manufactured by Yuka Shell Co., Ltd.)
50 parts by weight of thermoplastic phenol resin (PSM4326 manufactured by Gunei Chemical Co., Ltd.)
The obtained TAB tape was tested for heat pressing property, adhesive strength, and insulating property by the above-described method. Table 1 shows the results.
[0051]
[Table 1]

[0052]
【The invention's effect】
The TAB tape made from the TAB adhesive tape according to the present invention has the same adhesiveness, insulation, and chemical resistance as those of the related art, and a TCP in which an IC such as a driver IC is mounted by a TAB method is a liquid crystal. It can withstand thermal stress when it is connected to the display panel with a thermosetting anisotropic conductive adhesive or when the IC mounted by the TAB method is resin-sealed by the transfer molding method. It is of high quality without being buried inside.
[Brief description of the drawings]
FIG. 1 is a schematic sectional view of a tape with an adhesive for TAB according to the present invention.
FIG. 2 is a schematic sectional view of a TAB tape.
FIG. 3 is a schematic sectional view showing a state in which a conductor of a TAB tape is buried in an adhesive.
[Explanation of symbols]
1: organic insulating film 2: adhesive 3: protective film 4: conductor

Claims (4)

In a TAB adhesive tape having a basic structure in which an organic insulating film and an adhesive layer or an organic insulating film, an adhesive layer, and a protective film are laminated in this order, the adhesive layer is composed of (a) a polyamide resin; (B) an epoxy resin and (c) a phenol resin as essential components, wherein the epoxy resin has the general formula (1)

(In the formula, R ₁ and R ₂ represent hydrogen or a hydrocarbon group having 1 to 6 carbon atoms. G represents a glycidyl group. N represents an integer of 0 to 100.)
A tape with an adhesive for TAB, comprising a trishydroxyphenylmethane type epoxy resin represented by the following formula as an essential component. The adhesive tape for TAB according to claim 1, wherein the polyamide resin contains a dicarboxylic acid having 36 carbon atoms as an essential component. The adhesive tape for TAB according to claim 1 or 2, wherein the phenol resin contains a thermosetting phenol resin which is a solid at room temperature as an essential component. The thermosetting phenol resin of solid at room temperature is represented by the general formula (2)

(In the formula, R ₃ represents hydrogen or a hydrocarbon having 1 to 9 carbon atoms.)
The adhesive tape for TAB according to claim 3, comprising a structural unit represented by the following formula:

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